Gold Finger Circuit Board and Its Manufacturing Method

Abstract

The present application provides a gold finger circuit board and a manufacturing method thereof. The above-mentioned manufacturing method of the gold finger circuit board includes performing surface treatment on a copper foil substrate to obtain a first circuit board; performing patterning treatment on the first circuit board to obtain a second circuit board; and performing electroplating treatment on the second circuit board to obtain a gold finger circuit board. The first circuit board is a core board after surface treatment, which facilitates forming a pattern on the first circuit board to obtain a second circuit board, and then electroplating the second circuit board, that is, performing secondary copper plating on the patterned second circuit board, ensuring the accuracy and uniformity of the circuit electroplating on the gold finger circuit board, thereby effectively improving the accuracy of the gold finger circuit.

Description

Technical Field

[0001] The present invention relates to the technical field of gold finger circuit boards, and particularly to a gold finger circuit board and a manufacturing method thereof. Background Art

[0002] With the new round of vigorous development of the electronic communication industry and the emergence of technologies such as big data and 5G communication, the amount of information has exploded exponentially, requiring the computer processing speed to develop towards faster high-performance computers. The information processing and transmission of high bandwidth, high speed, and large capacity have put forward higher requirements for the interconnection bandwidth and density between circuit boards, between boards and backplanes, and between chips within the system, requiring faster signal transmission efficiency and better signal quality. As a result, the circuit board industry has given rise to optoelectronic printed circuit boards compared with traditional circuit boards. In contrast to ordinary printed circuit boards, the device size in its integrated circuit technology is smaller, the chip size is increased, the frequency is increased, and the data flow has increased sharply, and the requirements for size are very strict. Especially, there is a row of gold fingers designed on the optoelectronic board, and the area where they are located runs through the entire length of the optoelectronic printed circuit board.

[0003] However, during assembly, it needs to be bonded with conductive adhesive and flexible board. The alignment accuracy of each gold finger in the traditional gold finger circuit board is poor, and it cannot meet the requirements for some circuit boards with high alignment accuracy, and it is easy to cause the overall function of the circuit board to be poor due to misalignment. Summary of the Invention

[0004] An object of the present invention is to overcome the deficiencies in the prior art and provide a gold finger circuit board and a manufacturing method thereof that can effectively improve the accuracy of the gold finger circuit.

[0005] The object of the present invention is achieved by the following technical solutions:

[0006] A manufacturing method of a gold finger circuit board, the method comprising:

[0007] Performing surface treatment on a copper foil substrate to obtain a first circuit board;

[0008] Performing patterning treatment on the first circuit board to obtain a second circuit board;

[0009] Performing electroplating treatment on the second circuit board to obtain a gold finger circuit board.

[0010] In one embodiment, the performing surface treatment on the copper foil substrate includes: performing fine sandblasting treatment on the copper foil substrate to adjust the surface roughness of the copper foil substrate.

[0011] In one embodiment, the performing fine sandblasting treatment on the copper foil substrate includes: increasing the surface sandblasting air pressure of the copper foil substrate.

[0012] In one embodiment, the fine sandblasting treatment of the copper foil substrate includes: increasing the sandblasting particle size of the surface sandblasting of the copper foil substrate.

[0013] In one embodiment, the patterning treatment of the first circuit board includes: performing a laminating process on the first circuit board at a preset temperature to form a patterned dry film on the first circuit board.

[0014] In one embodiment, the preset temperature is 110°C to 130°C.

[0015] In one embodiment, after performing the laminating process on the first circuit board at the preset temperature to form a patterned dry film on the first circuit board, it further includes: performing a laser exposure treatment on the patterned dry film on the first circuit board to form a corresponding circuit pattern on the patterned dry film.

[0016] In one embodiment, after performing the laser exposure treatment on the patterned dry film on the first circuit board to form a corresponding gold finger circuit pattern on the patterned dry film, it further includes: performing a vacuum etching treatment on the circuit pattern to obtain the second circuit board.

[0017] In one embodiment, the electroplating treatment of the second circuit board to obtain a gold finger circuit board includes: performing vertical continuous electroplating on the circuit pattern on the second circuit board to obtain the gold finger circuit board.

[0018] A gold finger circuit board is prepared by using the gold finger circuit board manufacturing method described in any of the above embodiments.

[0019] Compared with the prior art, the present invention has at least the following advantages:

[0020] The first circuit board is a core board after surface treatment, which is convenient for forming a pattern on the first circuit board to obtain the second circuit board, and then electroplating the second circuit board, that is, performing secondary copper plating on the patterned second circuit board, ensuring the accuracy and uniformity of the circuit electroplating on the gold finger circuit board, thereby effectively improving the accuracy of the gold finger circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 It is a flowchart of the method for manufacturing a gold finger circuit board in an embodiment. Detailed implementation manners

[0023] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the disclosure of the present invention can be understood more thoroughly and comprehensively.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only embodiments.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used herein in the description of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0026] The present invention relates to a method for manufacturing a gold finger circuit board. In one embodiment, the method for manufacturing the gold finger circuit board includes surface-treating a copper foil substrate to obtain a first circuit board; patterning the first circuit board to obtain a second circuit board; and electroplating the second circuit board to obtain a gold finger circuit board. The first circuit board is a core board after surface treatment, which facilitates forming a pattern on the first circuit board to obtain a second circuit board, and then electroplating the second circuit board, that is, performing secondary copper plating on the patterned second circuit board, ensuring the accuracy and uniformity of the circuit electroplating on the gold finger circuit board, thereby effectively improving the accuracy of the gold finger circuit.

[0027] Please refer to Figure 1 , which is a flowchart of the method for manufacturing a gold finger circuit board according to an embodiment of the present invention. The method for manufacturing the gold finger circuit board includes some or all of the following steps.

[0028] S100: Surface-treat a copper foil substrate to obtain a first circuit board.

[0029] In this embodiment, the corresponding area of the copper foil substrate is the core board of the gold finger area of the optoelectronic printed circuit board, that is, the finally formed gold finger circuit is based on the copper foil substrate. Surface treatment of the copper foil substrate is to roughen the surface of the copper foil substrate. For example, physically strike the surface of the copper foil substrate to facilitate the subsequent formation of a corresponding circuit pattern on the copper foil substrate. The first circuit board is the circuit board formed after the copper foil substrate undergoes surface roughening. The first circuit board is a substrate with copper foil, and an uneven surface is formed on the surface of the first circuit board, increasing the surface roughness of the first circuit board and facilitating the subsequent formation of a specified circuit structure on the first circuit board.

[0030] S200: Perform patterning on the first circuit board to obtain a second circuit board.

[0031] In this embodiment, at this time, the surface of the first circuit board is rough. When performing patterning on the first circuit board, a corresponding circuit pattern is formed on the surface of the first circuit board, that is, a specified gold finger circuit structure is formed on the surface of the first circuit board. After the first circuit board undergoes the patterning process, the excess copper foil on the first circuit board is removed, and the remaining copper foil can form the gold finger circuit, enabling the formation of the required gold finger circuit on the first circuit board and facilitating the subsequent electroplating of the remaining copper foil on the first circuit board, that is, facilitating the subsequent electroplating of the copper foil circuit on the second circuit board to achieve the refinement of the gold finger circuit.

[0032] S300: Perform electroplating on the second circuit board to obtain a gold finger circuit board.

[0033] In this embodiment, the copper foil on the second circuit board has a corresponding pattern, that is, the copper foil on the second circuit board forms the initial circuit structure of the gold finger circuit. At this time, performing electroplating on the second circuit board is to perform secondary copper plating on the patterned copper foil circuit and also to perform refined copper plating on the gold finger circuit on the second circuit board, facilitating the adjustment of the accuracy and thickness of the copper foil for the circuit pattern on the second circuit board, improving the accuracy of the gold finger circuit on the second circuit board, and obtaining a gold finger circuit board with high accuracy. Among them, the gold finger copper foils of the gold finger circuit board are arranged in an array.

[0034] In the above embodiments, the first circuit board is a core board after surface treatment, which is convenient for forming a pattern on the first circuit board to obtain the second circuit board. Then, electroplating is performed on the second circuit board, that is, secondary copper plating is performed on the patterned second circuit board, ensuring the accuracy and uniformity of the circuit electroplating on the gold finger circuit board, thereby effectively improving the accuracy of the gold finger circuit. In another embodiment, the gold finger circuit is a part of the circuit on a whole circuit board. For example, on a printed circuit board, in addition to the gold finger circuit on the edge, there are other communication or control circuits at other positions. Among them, different processing methods are used for different circuits to obtain the required circuits.

[0035] In one of the embodiments, the surface treatment of the copper foil substrate includes: performing fine sandblasting on the copper foil substrate to adjust the surface roughness of the copper foil substrate. In this embodiment, the surface treatment of the copper foil substrate includes performing surface roughening treatment on the copper foil substrate. For example, the surface treatment of the copper foil substrate includes performing fine sandblasting on the copper foil substrate. The fine sandblasting is to sandblast the surface of the copper foil substrate. Among them, by adjusting the sandblasting parameters in the fine sandblasting, the surface roughness of the copper foil substrate is adjusted, that is, the concave and convex degree of the surface of the copper foil substrate is adjusted.

[0036] Further, the fine sandblasting of the copper foil substrate includes: increasing the air pressure of the surface sandblasting of the copper foil substrate. In this embodiment, the fine sandblasting of the copper foil substrate is to roughen the copper foil surface by physical impact. When the spraying material impacts the copper foil surface to remove part of the copper, multiple depressions appear on the surface of the copper foil substrate, which can effectively improve the surface roughness of the copper foil substrate. The surface sandblasting air pressure, as a sandblasting parameter in the fine sandblasting, can effectively change the surface structure of the copper foil substrate, that is, by adjusting the surface sandblasting air pressure, the surface depression condition of the copper foil substrate is changed. For example, by increasing the surface sandblasting air pressure of the copper foil substrate, the surface depression degree of the copper foil substrate is increased, so that the surface depression depth and diameter of the copper foil substrate are increased, thereby increasing the surface roughness of the copper foil substrate, and further increasing the surface roughness of the first circuit board, which is convenient for subsequent patterning of the first circuit board.

[0037] Furthermore, the fine sandblasting treatment of the copper foil substrate includes: increasing the sandblasting particle size of the surface sandblasting of the copper foil substrate. In this embodiment, the fine sandblasting treatment of the copper foil substrate coarsens the surface of the copper foil by physical impact. When the spraying material impacts the surface of the copper foil to remove part of the copper, multiple depressions appear on the surface of the copper foil substrate, which can effectively improve the surface roughness of the copper foil substrate. The surface sandblasting air pressure, as a sandblasting parameter in the fine sandblasting treatment, can effectively change the surface structure of the copper foil substrate, that is, by adjusting the sandblasting particle size to change the surface depression condition of the copper foil substrate. For example, by increasing the sandblasting particle size of the copper foil substrate, the surface depression degree of the copper foil substrate is increased, so that the surface depression depth and diameter of the copper foil substrate are increased, thereby increasing the surface roughness of the copper foil substrate, and further increasing the surface roughness of the first circuit board, which is convenient for subsequent patterning of the first circuit board.

[0038] In one embodiment, the patterning treatment of the first circuit board includes: performing a film pressing treatment on the first circuit board at a preset temperature to form a pattern dry film on the first circuit board. In this embodiment, the first circuit board is a core board with surface roughening. The surface of the first circuit board has a certain number and specified depth of depressions, so that the surface of the first circuit board forms an uneven structure, thereby making the surface of the first circuit board rough enough. In this way, after the first circuit board with a specified roughness, at the preset temperature, the dry film is pressed onto the first circuit board, that is, the dry film is pressed onto the roughened surface of the first circuit board. By virtue of the surface roughness of the first circuit board, it is convenient to attach the dry film to the first circuit board. For example, a 25-μm-thick dry film is pressed onto the roughened surface of the first circuit board to form the pattern dry film, which is convenient for subsequent patterning of the copper foil on the first circuit board according to the pattern dry film, so as to facilitate the production of a circuit structure with a specified pattern by means of the pattern dry film.

[0039] In another embodiment, the preset temperature is 110°C to 130°C. In this embodiment, the first circuit board is a core board with roughened surface. There are a certain number and specified depth of depressions on the surface of the first circuit board, making the surface of the first circuit board form an uneven structure, so that the surface of the first circuit board is rough enough. Thus, after the first circuit board with specified roughness, at a temperature of 110°C to 130°C, the dry film is laminated on the first circuit board, that is, the dry film is laminated on the roughened surface of the first circuit board. With the help of the surface roughness of the first circuit board and the lamination effect of high temperature and high pressure, it is convenient to laminate the dry film on the first circuit board. For example, at a temperature of 120°C, a dry film with a thickness of 25μm is laminated on the roughened surface of the first circuit board to form the patterned dry film, which is convenient for subsequent patterning of the copper foil on the first circuit board according to the patterned dry film, and thus convenient to make a circuit structure with a specified pattern by means of the patterned dry film. In other embodiments, the parameters in the patterning process, in addition to the preset temperature, also include the humidity and pressure when the dry film is laminated on the first circuit board, which are adjusted according to the actual needs of the circuit board, and can effectively improve the lamination flatness of the dry film on the first circuit board, that is, can improve the difference degree of film marks at different positions. For example, the difference of film marks at different positions can be controlled to be less than or equal to 2mm to ensure the complete resolution and adhesion of the subsequent formed gold finger circuit.

[0040] Further, after laminating the first circuit board at the preset temperature to form a patterned dry film on the first circuit board, it further includes: performing laser exposure treatment on the patterned dry film on the first circuit board to form a corresponding circuit pattern on the patterned dry film. In this embodiment, after laminating the first circuit board, a layer of patterned dry film is formed on the first circuit board. The patterned dry film is used as a photoresist for making the gold finger circuit. By performing laser exposure treatment on the patterned dry film on the first circuit board, it is convenient to irradiate the patterned dry film with laser, so as to facilitate laser patterning of the patterned dry film. The pattern formed on the patterned dry film is that the laser exposure machine retrieves the pattern data in the database and completes the graphic transfer through laser, that is, irradiates at the specified position on the patterned dry film. Thus, after laser exposure of some areas of the patterned dry film, the components of the patterned dry film are polarized. For example, the areas of the patterned dry film that have been laser exposed can be removed by the developer, and the remaining areas can form the corresponding gold finger circuit.

[0041] Further, the dry film of the pattern on the first circuit board is subjected to laser exposure treatment to form a corresponding gold finger circuit pattern on the dry film of the pattern. After that, the following steps are further included: performing vacuum etching treatment on the circuit pattern to obtain the second circuit board. In this embodiment, the dry film of the pattern has been exposed to laser light, that is, the polarity of the irradiated area of the dry film of the pattern changes. Under a vacuum state, the dry film of the pattern is etched. For example, the dry film that has undergone exposure polymerization reaction on the dry film of the pattern undergoes a saponification reaction with the developer, so that this part of the dry film is dissolved by the developer, exposing the copper foil that needs to form the gold finger, and the other copper foils are removed by etching, facilitating the formation of the required gold finger circuit on the first circuit board, and thus facilitating the formation of the required second circuit board.

[0042] In one embodiment, the electroplating treatment of the second circuit board to obtain a gold finger circuit board includes: performing vertical continuous electroplating on the circuit pattern on the second circuit board to obtain the gold finger circuit board. In this embodiment, the copper foil circuit on the second circuit board is a gold finger circuit, and moreover, at this time, the gold finger circuit on the second circuit board is used as the initial circuit and there are still certain differences from the standard circuit. In order to effectively improve the accuracy of the gold finger circuit, performing vertical continuous electroplating on the circuit pattern on the second circuit board is to finely electroplate the initial gold finger circuit on the second circuit board, and also to adjust the accuracy and copper thickness of the initial gold finger circuit on the second circuit board, so as to improve the accuracy and copper thickness uniformity of the circuit formed on the second circuit board, facilitating the production of a high-precision gold finger circuit board.

[0043] It can be understood that for a multi-layer gold finger circuit board, that is, a gold finger circuit board with inner layer circuits, a certain number of drill holes are still required. For these drill holes, the drill bit of the drilling machine needs to remove a certain amount of copper foil. Among them, there will be a situation where the rigid friction time between the drill bit and the copper foil is relatively long. After processing a certain number of multi-layer gold finger circuit boards, the drill bit is replaced to ensure that all the drill holes on the multi-layer gold finger circuit board meet the requirements to the greatest extent. However, in such a way of replacing the drill bit, the service life of the drill bit will be wasted, that is, the drill bit will be replaced before it is scrapped, resulting in an increase in the drilling cost of the multi-layer gold finger circuit board.

[0044] In order to improve the effective utilization rate of the drill bit, after the electroplating treatment of the second circuit board to obtain a gold finger circuit board, the following steps are further included:

[0045] Obtain the pressure sensing value of the gold finger circuit board;

[0046] Detect whether the pressure sensing value is greater than the preset sensing value;

[0047] When the pressure sensing value is greater than the preset sensing value, perform an increment update process on the pressure sensing count to increment the pressure sensing count by 1;

[0048] Detect whether the pressure sensing count is greater than or equal to a preset count;

[0049] When the pressure sensing count is greater than or equal to the preset count, send a first alarm signal to the drilling monitoring system.

[0050] In this embodiment, the pressure sensing value is the real-time extrusion force generated when the multi-layer gold finger circuit board is on the drilling platform. The pressure sensing value is the extrusion force on the drilling platform when the multi-layer gold finger circuit board interacts with the drill bit. For example, the pressure sensing value includes the gravity of the multi-layer gold finger circuit board and the drilling pressure of the drill bit on the multi-layer gold finger circuit board. The preset sensing value is the sum of the drilling pressure when the drill bit drills the copper foil on the multi-layer gold finger circuit board and the gravity of the multi-layer gold finger circuit board. At this time, the extrusion force generated when the drill bit is in direct contact with the copper foil metal is significantly greater than the extrusion force during drilling on the resin layer. According to this characteristic, the pressure sensing value is compared with the preset sensing value to facilitate determining whether the drill bit is in contact with the copper foil layer of the multi-layer gold finger circuit board during the drilling process. The pressure sensing value being greater than the preset sensing value indicates that the sensed extrusion force is relatively large at this time, that is, it indicates that the drill bit is drilling on the copper foil at this time, which also means that the drill bit is in contact with the copper foil in the multi-layer gold finger circuit board at this time. At this time, perform an increment update process on the pressure sensing count, so that the count value of the pressure sensing count increases, that is, the pressure sensing count increases once. The pressure sensing count is the accumulation of the number of times the drill bit contacts the copper foil, so as to facilitate real-time monitoring of the number of times the drill bit drills on the copper foil. The preset count is the maximum actual drilling collision times of the drill bit. The pressure sensing count being greater than or equal to the preset count indicates that the cumulative number of times the drill bit contacts the copper foil is about to reach the limit. If it continues to be used later, it will result in unqualified drilling. At this time, the drilling monitoring system sends a first alarm signal to facilitate timely replacement of the drill bit, that is, the drill bit exits the drilling and is replaced at this time, thereby effectively improving the effective utilization rate of the drill bit and reducing the waste of the drill bit's usage time. Among them, the thickness of each layer of copper foil of the multi-layer gold finger circuit board is the same. The pressure sensing count is incremented by 1 only once when a single layer of copper foil is drilled through, that is, when the pressure sensing value is first greater than the preset sensing value, an operation of incrementing the pressure sensing count by 1 is performed, that is, when the pressure sensing value undergoes an increase jump, the pressure sensing count is incremented by 1.

[0051] Further, in the case where there are differences in the thickness of the layer copper foils in a multi-layer gold finger circuit board, if the pressure-sensitive counting is still used, counting errors are likely to occur, which can easily lead to a lag in the replacement of the drill bit, and further lead to a decrease in the yield rate of drilling. To further increase the qualified probability of drilling, after detecting whether the pressure-sensitive count is greater than or equal to a preset count, the following steps are further included:

[0052] When the pressure-sensitive count is less than the preset count, obtain multiple adjacent pressurization times and decompression times of the pressure sensing value;

[0053] Perform time difference processing on the multiple pressurization times and the multiple decompression times to obtain the pressurization duration;

[0054] Detect whether the pressurization duration is greater than or equal to a first preset duration;

[0055] When the pressurization duration is greater than or equal to the first preset duration, send a second alarm signal to the drilling monitoring system.

[0056] In this embodiment, the fact that the pressure-sensitive count is less than the preset count indicates that the cumulative drilling times of the drill bit and the copper foil have not reached the limit times at this time, that is, it indicates that the drill bit still has the possibility of continued use. And obtaining multiple adjacent pressurization times and decompression times of the pressure sensing value is to collect the time when the drill bit starts to contact the copper foil and the time when it breaks away from the contact, so as to facilitate obtaining the drilling duration of the drill bit on the copper foil, that is, the pressurization duration. Among them, for the adjacent pressurization time and the decompression time, the decompression time is later than the pressurization time to facilitate determining the pressurization duration. The first preset duration is the maximum duration for the drill bit to contact the copper foil. The fact that the pressurization duration is greater than or equal to the first preset duration indicates that the available life of the current drill bit has reached the limit. If it continues to be used later, it will lead to unqualified drilling. At this time, the drilling monitoring system sends a second alarm signal to facilitate timely stopping the operation of the drill bit, that is, the drill bit stops drilling and exits the drilling at this time, thereby effectively improving the effective utilization rate of the drill bit and reducing the waste of the use duration of the drill bit. Moreover, it can also be applied to multi-layer gold finger circuit boards with different copper foil thicknesses.

[0057] Furthermore, the use duration of the drill bit is not only related to the extrusion duration between the drill bit and the copper foil, but also restricted by the frictional contact heat between the drill bit and the copper foil. A large amount of heat accumulates on the drill bit, which will also cause metal fatigue of the drill bit and easily lead to premature wear of the drill bit due to excessive heat. To reduce the impact on the drilling quality, after detecting whether the pressurization duration is greater than or equal to the first preset duration, the following steps are further included:

[0058] When the supercharging duration is less than the first preset duration, obtain the single-hole temperature of the finger PCB.

[0059] Detect whether the single-hole temperature is greater than the preset drilling temperature.

[0060] When the single-hole temperature is greater than the preset drilling temperature, obtain the temperature holding duration of the single-hole temperature, and obtain the average temperature holding time of each temperature holding duration.

[0061] Detect whether the average temperature holding time is greater than the second preset duration.

[0062] When the average temperature holding time is greater than the second preset duration, send a third alarm signal to the drilling monitoring system.

[0063] In this embodiment, the single-hole temperature is the copper foil temperature on the finger PCB when the drill bit drills. After the drill bit comes into frictional contact with the copper foil, the heat is absorbed by the drill bit and the copper foil respectively. And with the help of the high thermal conductivity of the copper foil, the temperature change on the finger PCB can be detected relatively quickly, so as to facilitate quickly determining the drilling duration of the drill bit in a high-temperature situation. The preset drilling temperature is the demarcation temperature when the drill bit contacts the copper foil. Higher than this temperature will weaken the service life of the drill bit. The single-hole temperature being greater than the preset drilling temperature indicates that the friction between the drill bit and the copper foil is too intense at this time, that is, the temperature on the drill bit is relatively high at this time, which also indicates that the drill bit is in a high-temperature drilling environment at this time. At this time, calculating the average value of each temperature holding duration, that is, the average temperature holding time, is convenient for determining the average duration of the drill bit in high-temperature drilling. The average temperature holding time being greater than the second preset duration indicates that the current duration of the drill bit in high-temperature drilling is too long, that is, it indicates that the service duration of the drill bit has reached the limit. At this time, send a third alarm signal to the drilling monitoring system to stop the drill bit from continuing to drill, reducing the situation where the drilled holes are unqualified.

[0064] In one of the embodiments, the present application further provides a finger PCB, which is prepared by using the finger PCB manufacturing method described in any of the above embodiments. In this embodiment, the finger PCB manufacturing method includes performing surface treatment on a copper foil substrate to obtain a first PCB; performing patterning treatment on the first PCB to obtain a second PCB; and performing electroplating treatment on the second PCB to obtain a finger PCB. The first PCB is the core board after surface treatment, which is convenient for forming a pattern on the first PCB to obtain the second PCB. Then, electroplating the second PCB is to perform secondary copper plating on the patterned second PCB, ensuring the accuracy and uniformity of the circuit electroplating on the finger PCB, thereby effectively improving the accuracy of the finger circuit.

[0065] The above-described embodiments merely represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A method for manufacturing a gold finger circuit board, characterized in that, Including: Performing surface treatment on a copper foil substrate to obtain a first circuit board; Performing patterning treatment on the first circuit board to obtain a second circuit board; Performing electroplating treatment on the second circuit board to obtain a gold finger circuit board; Wherein, after performing electroplating treatment on the second circuit board to obtain a gold finger circuit board, the following steps are further included: Obtaining the pressure sensing value of the gold finger circuit board; Detecting whether the pressure sensing value is greater than a preset sensing value; When the pressure sensing value is greater than the preset sensing value, performing an increment update process on the pressure sensing count to increment the pressure sensing count by 1; Detecting whether the pressure sensing count is greater than or equal to a preset count; When the pressure sensing count is greater than or equal to the preset count, sending a first alarm signal to the drilling monitoring system; After detecting whether the pressure sensing count is greater than or equal to the preset count, the following steps are further included: When the pressure sensing count is less than the preset count, obtaining multiple adjacent pressure increasing times and pressure decreasing times of the pressure sensing value; Performing time difference processing on the multiple pressure increasing times and the multiple pressure decreasing times to obtain the pressure increasing duration; Detecting whether the pressure increasing duration is greater than or equal to a first preset duration; When the pressure increasing duration is greater than or equal to the first preset duration, sending a second alarm signal to the drilling monitoring system.

2. The method for manufacturing a gold finger circuit board according to claim 1, characterized in that, The performing surface treatment on the copper foil substrate includes: Performing fine sandblasting treatment on the copper foil substrate to adjust the surface roughness of the copper foil substrate.

3. The method for manufacturing a gold finger circuit board according to claim 2, wherein The performing fine sandblasting treatment on the copper foil substrate includes: Increasing the surface sandblasting air pressure of the copper foil substrate.

4. The method for manufacturing a gold finger circuit board according to claim 2, wherein The performing fine sandblasting treatment on the copper foil substrate includes: Increasing the sandblasting particle size of the surface sandblasting of the copper foil substrate.

5. The method for manufacturing a gold finger circuit board according to claim 1, wherein The performing patterning treatment on the first circuit board includes: Performing pressure film treatment on the first circuit board at a preset temperature to form a pattern dry film on the first circuit board.

6. The method for manufacturing a gold finger circuit board according to claim 5, wherein The preset temperature is 110°C to 130°C.

7. The method for manufacturing a gold finger circuit board according to claim 5, wherein After performing pressure film treatment on the first circuit board at a preset temperature to form a pattern dry film on the first circuit board, the following is further included: Performing laser exposure treatment on the pattern dry film on the first circuit board to form a corresponding circuit pattern on the pattern dry film.

8. The method for manufacturing a gold finger circuit board according to claim 7, wherein After performing laser exposure treatment on the pattern dry film on the first circuit board to form a corresponding gold finger circuit pattern on the pattern dry film, the following is further included: Performing vacuum etching treatment on the circuit pattern to obtain the second circuit board.

9. The method for manufacturing a gold finger circuit board according to claim 1, characterized in that, The performing electroplating treatment on the second circuit board to obtain a gold finger circuit board includes: Performing vertical continuous electroplating on the circuit pattern on the second circuit board to obtain the gold finger circuit board.

10. A gold finger circuit board, characterized in that, Prepared by using the method for manufacturing a gold finger circuit board according to any one of claims 1 to 9.

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