Resin supply method, method for manufacturing resin molded product, and resin molding device

Abstract

The present invention provides a resin supply method, a method for manufacturing a resin molded product, and a resin molding device, wherein the resin supply method can properly supply resin by properly replacing a material box. A resin supply method comprises: a first resin supply step, supplying liquid resin contained in a first material box to the supply object, the remaining amount of which is less than the target supply amount required to supply the resin once to the supply object; a material box replacement step, after the first resin supply step, replacing the first material box with a second material box after pre-spraying; and a second resin supply step, after the material box replacement step, supplying liquid resin contained in the second material box to the supply object.

Description

Technical Field

[0001] The present invention relates to a resin supply method, a method for manufacturing a resin molded product, and a resin molding device technology. Background Art

[0002] Patent document 1 discloses a liquid resin supply device that supplies liquid resin to a workpiece on which a semiconductor chip is held on a carrier. In the liquid resin supply device, a syringe supply unit that holds a replacement syringe is provided on a distribution unit that ejects and supplies the liquid resin filled in a syringe to the workpiece. When the remaining amount of liquid resin in the syringe becomes low, the distribution unit can receive a replacement syringe from the syringe supply unit and eject and supply a specified amount of liquid resin to the workpiece held at the liquid ejection position.

[0003] [Prior art literature]

[0004] [Patent Document]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2012-126075 Summary of the invention

[0006] [Problems to be solved by the invention]

[0007] However, Patent Document 1 does not describe a specific method for replacing a syringe and continuing to supply resin when the remaining amount of the syringe is exhausted during the resin supply to a workpiece. That is, at present, no specific technology for replacing the syringe to supply resin in such a case has been proposed.

[0008] The present invention has been made in view of the above-mentioned situation, and an object of the present invention is to provide a resin supply method, a method for manufacturing a resin molded product, and a resin molding device that can appropriately supply resin by appropriately replacing a cartridge.

[0009] [Technical means to solve the problem]

[0010] The problem to be solved by the present invention is as described above. In order to solve the problem, the resin supply method of the present invention includes: a first resin supply step, supplying liquid resin contained in a first material box, whose remainder is less than a target supply amount required to supply resin once to the supply object, to the supply object; a material box replacement step, after the first resin supply step, replacing the first material box with a second material box after pre-spraying; and a second resin supply step, after the material box replacement step, supplying liquid resin contained in the second material box to the supply object.

[0011] Furthermore, a method for producing a resin molded product according to the present invention is a method for producing a resin molded product using a liquid resin supplied by the resin supplying method.

[0012] In addition, the resin molding device of the present invention includes: a molding mold, including an upper mold and a lower mold facing the upper mold; a clamping mechanism, which clamps the molding mold; and a liquid resin supply mechanism, which supplies liquid resin used in the molding mold, the liquid resin supply mechanism supplies liquid resin contained in a first material box, the remainder of which is less than the target supply amount required to supply the resin once to the supply object, to the supply object, replaces the first material box with a second material box after pre-spraying, and supplies the liquid resin contained in the second material box to the supply object.

[0013] [Effects of the Invention]

[0014] According to the present invention, the resin supply can be appropriately performed by appropriately replacing the cartridge. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic plan view showing the overall structure of a resin molding apparatus according to one embodiment of the present invention.

[0016] Figure 2 (a) is a side view showing a schematic structure of a part of the resin supply module. Figure 2 (b) is a side view showing the state of detection by the resin surface detection sensor.

[0017] Figure 3 This is a side view showing a schematic structure of a resin molded module.

[0018] Figure 4 It is a schematic plan view showing the state of supplying resin by the liquid resin ejection mechanism.

[0019] Figure 5 This is a flowchart of a resin supply method according to one embodiment of the present invention.

[0020] Figure 6 Yes means Figure 5 The subsequent flowchart.

[0021] Figure 7 This is a side view showing the filling operation performed by the liquid resin ejection mechanism.

[0022] [Explanation of Symbols]

[0023] 1: Resin molding device

[0024] 5: Base plate before forming

[0025] 6: Formed substrate

[0026] 10: Release film cutting module

[0027] 11: Roll release film (release film)

[0028] 12: Release film

[0029] 13: Membrane mounting table

[0030] 14: Membrane holder

[0031] 20: Resin supply module

[0032] 21: Resin delivery mechanism

[0033] 22: Membrane recovery mechanism

[0034] 23: Liquid resin ejection mechanism

[0035] 23a: Motor

[0036] 23b: Rod

[0037] 23c: Mobile mechanism

[0038] 23d: Resin surface detection sensor

[0039] 23e: Rod position detection sensor

[0040] 24: Membrane adsorption station

[0041] 25: Meter

[0042] 26: Material box setting part

[0043] 30: Resin molding module

[0044] 31: Forming die

[0045] 32: Lower die

[0046] 32a: Side member

[0047] 32b: Bottom component

[0048] 33: Chamber

[0049] 34: Upper mold

[0050] 35: Clamping mechanism

[0051] 40: Conveying module

[0052] 41: Substrate loader

[0053] 42: Adsorption Hand

[0054] 43: Adsorption hand moving mechanism

[0055] 45: Pre-molding substrate storage section

[0056] 46: Post-molding substrate storage section

[0057] 70: Liquid resin

[0058] C: Material box

[0059] C1: Old material box

[0060] C2: New material box

[0061] CTR: Control Department

[0062] N: Nozzle

[0063] S101~S112: Steps

[0064] U: Container

[0065] X, Y, Z, θ: direction DETAILED DESCRIPTION

[0066] The embodiments of the present invention are described in detail with reference to the accompanying drawings. The same reference numerals are used for the same or corresponding parts in the drawings, and the description thereof will not be repeated. In the present application document, the term "liquid" of liquid resin means that the liquid resin is in liquid form at room temperature and has fluidity. In addition, in the following description, two directions orthogonal to each other on the horizontal plane are defined as the X direction and the Y direction, respectively, the vertical direction is defined as the Z direction, and the rotation direction centered on a rotation axis parallel to the Z direction is defined as the θ direction for description (refer to Figure 1 ).

[0067] <Overall Structure of Resin Molding Device 1>

[0068] Reference Figure 1 to Figure 3 The structure of the resin molding apparatus 1 according to the present embodiment will be described. Figure 1 The resin molding apparatus 1 shown is a resin molding apparatus 1 that performs resin molding by a compression molding method.

[0069] like Figure 1 As shown, the resin forming device 1 of the embodiment includes a release film cutting module 10, a resin supply module 20, a resin forming module 30 and a conveying module 40 from the right side of the figure. Each module is separated independently, but can be mutually attached and detached relative to the adjacent modules and can be increased or decreased. For example, it can be set to a structure in which two or three resin forming modules 30 are arranged between the resin supply module 20 and the conveying module 40.

[0070] like Figure 1As shown, the release film cutting module 10 mainly includes a roll release film 11, a film mounting table 13, and a film clamp 14. The long strip of release film is pulled out from the roll release film 11 by the film clamp 14, and a part of it is arranged to cover the film mounting table 13. By cutting it into a circle with a cutter, a circular release film 12 can be made. The film mounting table 13 can move in the X direction, the Y direction, and the Z direction, and can move between the release film cutting module 10 and the resin supply module 20. In addition, the shape of the release film 12 is not particularly limited to a circular shape, for example, it can also be a rectangular shape.

[0071] like Figure 1 As shown, the resin supply module 20 mainly includes a resin conveying mechanism 21, a film recovery mechanism 22, a liquid resin ejection mechanism 23, a film adsorption platform 24, and a control unit CTR. The resin conveying mechanism 21 and the film recovery mechanism 22 are integrally formed and can move between the release film cutting module 10 and the resin forming module 30 described later. The resin conveying mechanism 21 can convey the release film 12 supplied with the liquid resin 70 to the forming mold 31 described later. The film recovery mechanism 22 can recover the used release film 12 from the forming mold 31. Figure 2 (a) and Figure 2 As shown in (b), the liquid resin ejection mechanism 23 can supply the liquid resin 70 from the nozzle N to the release film 12. The film adsorption table 24 can adsorb and hold the cut release film 12. A meter 25 is included below the film adsorption table 24, and the meter 25 can measure the weight of the liquid resin 70 ejected onto the release film 12. The control unit CTR can control the operation of each part of the liquid resin ejection mechanism 23.

[0072] The liquid resin ejection mechanism 23 can eject the liquid resin 70 contained in the material box C. Specifically, the liquid resin ejection mechanism 23 can hold the material box C in a state where the nozzle N is facing downward. The liquid resin ejection mechanism 23 uses a rod 23b that can be raised and lowered by the driving force from the motor 23a to squeeze out the liquid resin 70 contained in the material box C from the top, thereby ejecting the liquid resin 70 downward from the nozzle N. The liquid resin ejection mechanism 23 can be moved in the horizontal direction (X direction and Y direction) and the vertical direction (Z direction) by the moving mechanism 23c. The liquid resin ejection mechanism 23 can eject the liquid resin 70 to any position, or move while ejecting the liquid resin 70, by combining the drive of the rod 23b with the movement of the moving mechanism 23c. Furthermore, the liquid resin ejection mechanism 23 and the rod 23b of the present embodiment are respectively one embodiment of the liquid resin supply mechanism and the supply member of the present invention.

[0073] In addition, the liquid resin ejection mechanism 23 is provided with a resin surface detection sensor 23 d and a rod position detection sensor 23 e as sensors for detecting the remaining amount of the liquid resin 70 stored in the cartridge C.

[0074] Figure 2 The resin surface detection sensor 23d shown in (b) can detect the distance from the top of the material box C held by the liquid resin ejection mechanism 23 to the upper end surface of the liquid resin 70 contained in the material box C. As the resin surface detection sensor 23d, various distance sensors such as optical, ultrasonic, and radio wave sensors can be used. Based on the distance to the upper end surface of the liquid resin 70 (the position of the upper end surface) detected by the resin surface detection sensor 23d, the cross-sectional area of ​​the material box C, and the specific gravity of the liquid resin 70, the amount (remaining amount) of the liquid resin 70 contained in the material box C can be calculated.

[0075] in addition, Figure 2 The rod position detection sensor 23e shown in (a) can detect the position of the rod 23b. As the rod position detection sensor 23e, various position sensors such as potentiometer type, optical type, and magnetic type can be used. Based on the initial resin remaining amount detected by the resin surface detection sensor 23d and the position of the rod 23b detected by the rod position detection sensor 23e, the amount (remaining amount) of the liquid resin 70 contained in the material box C can be calculated.

[0076] In the present embodiment, the remaining amount of the liquid resin 70 (initial remaining amount of resin) contained in the cartridge C (i.e., the new cartridge C) before the liquid resin 70 is squeezed out by the rod 23b is detected by the resin surface detection sensor 23d. In addition, in the present embodiment, the remaining amount of the liquid resin 70 contained in the cartridge C after the liquid resin 70 starts to be squeezed out by the rod 23b is detected by the rod position detection sensor 23e.

[0077] like Figure 1 and Figure 3As shown, the resin molding module 30 mainly includes a molding die 31 and a clamping mechanism 35. The molding die 31 includes an upper die 34 and a lower die 32 facing the upper die 34. The lower die 32 includes a side member 32a constituting the side of the cavity 33 and a bottom member 32b constituting the bottom of the cavity 33. The cavity 33 in the shape of a recess for accommodating the liquid resin 70 is formed by the side member 32a and the bottom member 32b. In addition, the side member 32a and the bottom member 32b include an adsorption groove (not shown) for adsorbing the release film 12. The release film 12 supplied with the liquid resin 70 is transported to the molding die 31 by the resin transport mechanism 21 from the resin supply module 20, and is arranged on the cavity 33 of the lower die 32. In the resin molding module 30, the molding die 31 is clamped by the clamping mechanism 35, so that the pre-molding substrate 5 carrying the chip as the molding object is subjected to resin molding, and the post-molding substrate 6 in which the chip is sealed with resin can be formed. Examples of the substrate include semiconductor substrates such as silicon wafers, lead frames, printed wiring substrates, metal substrates, resin substrates, glass substrates, ceramic substrates, etc. In addition, the substrate may also be a carrier for fan-out wafer level packaging (FOWLP) and fan-out panel level packaging (FOPLP). Furthermore, it may be a substrate with wiring or a substrate without wiring.

[0078] like Figure 1 As shown, the conveying module 40 mainly includes a substrate loader 41, a suction hand 42, a suction hand moving mechanism 43, a pre-molding substrate storage section 45, and a post-molding substrate storage section 46. The substrate loader 41 can hold the substrate and move it between the resin molding module 30 and the conveying module 40. The suction hand 42 is equipped with the suction hand moving mechanism 43, and the suction hand moving mechanism 43 can move the suction hand 42 in the X direction, the Y direction, and the Z direction and rotate in the θ direction. Regarding rotation, the suction hand 42 can be rotated in the horizontal direction or in the vertical direction and reversed. The suction hand 42 can suction and hold the pre-molding substrate 5 stored in the pre-molding substrate storage section 45, and can be transported to the substrate loader 41 using the suction hand moving mechanism 43. In addition, the suction hand 42 can suction and hold the post-molding substrate 6 held by the substrate loader 41, and can be stored in the post-molding substrate storage section 46 using the suction hand moving mechanism 43.

[0079] <Method for manufacturing resin molded product using resin molding apparatus 1>

[0080] Next, refer to Figure 1 to Figure 4An example of a method for manufacturing a resin molded product according to the present embodiment using the resin molding apparatus 1 according to the present embodiment will be described. In the present embodiment, a circular wafer is used as a substrate for mounting chips, but the substrate is not particularly limited to the wafer and may be rectangular.

[0081] First, if Figure 1 As shown, the suction hand 42 is inserted under the pre-molding substrate 5 on which the chip stored in the pre-molding substrate storage section 45 is mounted, and after the pre-molding substrate 5 is suctioned, the pre-molding substrate 5 is taken out from the pre-molding substrate storage section 45. Here, the pre-molding substrate 5 is taken out from the pre-molding substrate storage section 45 with the chip mounting side as the upper side.

[0082] Next, the substrate adsorbed on the adsorption hand 42 is turned over so that the chip mounting side of the substrate is on the lower side. Then, the adsorption hand 42 is moved by the adsorption hand moving mechanism 43 so that the chip mounting surface of the substrate adsorbed on the adsorption hand 42 is on the lower side, and the pre-molding substrate 5 is transferred to the substrate loader 41.

[0083] At this time, the release film 12 is being cut in the release film cutting module 10. The roll release film 11 is pulled out onto the film mounting table 13 by the film clamper 14 and cut by a cutter (not shown) to form a circular release film 12.

[0084] The film placement table 13 holding the release film 12 by suction moves to the front of the resin delivery mechanism 21. The resin delivery mechanism 21 moves to the top of the film placement table 13, receives the release film 12, and delivers it to the film adsorption table 24 of the resin supply module 20. The resin delivery mechanism 21 is in a state where the release film 12 is located above the film adsorption table 24. After receiving the release film 12 from the resin delivery mechanism 21, the film adsorption table 24 holds the release film 12 by suction.

[0085] After the mold release film 12 is adsorbed and held on the film adsorption stage 24, the liquid resin ejection mechanism 23 ejects the liquid resin 70 onto the mold release film 12. Figure 4 As shown in FIG. 1 , the liquid resin ejection mechanism 23 ejects the liquid resin 70 while moving in the horizontal direction (X direction and Y direction) along a predetermined path. In the present embodiment, the liquid resin ejection mechanism 23 moves along a spiral path to supply the liquid resin 70 onto the release film 12 in a spiral shape. The weight of the liquid resin 70 supplied onto the release film 12 is given by Figure 2 (a) and Figure 2 The measuring device 25 shown in (b) is used for measuring. The release film 12 of this embodiment is one embodiment of the supply object of the present invention. In addition, the method of supplying the liquid resin 70 by the liquid resin ejection mechanism 23 will be described in detail below.

[0086] The release film 12 supplied with the target supply amount (target weight) of the liquid resin 70 is transported to the molding die 31. The release film 12 is transported between the upper mold 34 and the lower mold 32 of the resin molding module 30 by the resin transport mechanism 21. Furthermore, before the release film 12 is arranged on the molding die 31, the substrate loader 41 holding the pre-molding substrate 5 is moved between the upper mold 34 and the lower mold 32, and the pre-molding substrate 5 is arranged on the upper mold 34 in such a way that the chip mounting side is on the lower side.

[0087] like Figure 3 As shown, the release film 12 delivered between the upper mold 34 and the lower mold 32 by the resin delivery mechanism 21 is arranged in the cavity 33 including the side member 32a and the bottom member 32b of the lower mold 32. After the release film 12 is arranged in the cavity 33, the release film 12 is adsorbed by the adsorption grooves (not shown) of the side member 32a and the bottom member 32b.

[0088] like Figure 3 As shown, after the release film 12 is held by the cavity 33 by adsorption, the molding die 31 conveying the release film 12 is closed to perform resin molding. Specifically, the lower mold 32 is raised by the clamping mechanism 35. As a result, the upper mold 34 and the lower mold 32 are close to each other and closed, and the chip mounted on the lower surface of the pre-molding substrate 5 is immersed in the liquid resin 70 in the cavity 33. In this state, the liquid resin 70 is heated and hardened, thereby the pre-molding substrate 5 can be resin molded, so that the molded substrate 6 with the chip sealed by the resin can be manufactured. After the resin molding, the lower mold 32 is lowered by the clamping mechanism 35. As a result, the upper mold 34 and the lower mold 32 are separated from each other and the mold is opened.

[0089] After molding, the substrate 6 is taken out from the upper mold 34 by the substrate loader 41 and held with the chip mounting side as the lower side. Then, the substrate loader 41 moves from the resin molding module 30 to the conveying module 40. Here, the release film 12 remaining in the cavity 33 is recovered by the film recovery mechanism 22 and discarded into the useless film material box (not shown).

[0090] After the formed substrate 6 held on the substrate loader 41 is transported to the transport module 40, the formed substrate 6 is held by the suction hand 42 with the chip mounting side as the lower side. Thereafter, the formed substrate 6 adsorbed on the suction hand 42 is reversed so that the chip mounting side of the formed substrate 6 is the upper side, and the suction hand 42 is moved by the suction hand moving mechanism 43. Then, the suction hand 42 accommodates the formed substrate 6 in the formed substrate storage section 46 with the chip mounting side as the upper side.

[0091] <Resin supply method using liquid resin ejection mechanism 23>

[0092] Hereinafter, a method of supplying the liquid resin 70 using the liquid resin discharge mechanism 23 (resin supply method) will be described in detail.

[0093] exist Figure 5 In step S101 shown in FIG. 1 , the control unit CTR detects the amount of the liquid resin 70 contained in the cartridge C held by the liquid resin ejection mechanism 23. Specifically, the control unit CTR can detect the amount of the liquid resin 70 in the cartridge C using the resin surface detection sensor 23d or the rod position detection sensor 23e. At this time, if the liquid resin ejection mechanism 23 has just held a new cartridge C (before the rod 23b is placed on the cartridge C), the control unit CTR detects the amount of the liquid resin 70 using the resin surface detection sensor 23d (refer to FIG. 1 ). Figure 2 (b)). In addition, if the liquid resin ejection mechanism 23 is in a state where the cartridge C is being used (the rod 23b is placed on the cartridge C), the control unit CTR detects the amount of the liquid resin 70 using the rod position detection sensor 23e (refer to Figure 2 (a)).

[0094] After performing the process of step S101, the control unit CTR shifts to the process of step S102.

[0095] In step S102, the control unit CTR determines whether the amount (remaining amount) of the liquid resin 70 in the cartridge C detected in step S101 is greater than the target supply amount required for supplying one resin to the release film 12. In the present embodiment, the target supply amount is the amount of liquid resin 70 to be supplied to one release film 12, and is the amount of liquid resin 70 required for one resin molding by the resin molding module 30.

[0096] When the control unit CTR determines that the amount (remaining amount) of the liquid resin 70 in the cartridge C is greater than the target supply amount (YES in step S102), the process proceeds to step S106. On the other hand, when the control unit CTR determines that the amount (remaining amount) of the liquid resin 70 in the cartridge C is less than (short of) the target supply amount (NO in step S102), the process proceeds to step S103.

[0097] In step S103, the control unit CTR temporarily replaces the cartridge C (for convenience, this cartridge C is also referred to as "old cartridge C1") held in the liquid resin ejection mechanism 23 with a new cartridge C (for convenience, this cartridge C is also referred to as "new cartridge C2"), and the new cartridge C2 for replacement is, for example, pre-arranged on the cartridge setting portion 26 near the film adsorption stage 24 (see Figure 1). The control unit CTR places the old cartridge C1 on the cartridge setting unit 26, and holds the new cartridge C2 on the liquid resin ejection mechanism 23 instead. The old cartridge C1 and the new cartridge C2 are one embodiment of the first cartridge and the second cartridge of the present invention, respectively.

[0098] After performing the process of step S103, the control unit CTR moves to the process of step S104.

[0099] In step S104, the control unit CTR fills the nozzle N of the new cartridge C2 with liquid resin 70. Figure 7 As shown, the control unit CTR uses an appropriate conveying device to place the container U on the film adsorption table 24. Then, the driving rod 23b is driven to press the liquid resin 70 contained in the new material box C2 downward, and a small amount of liquid resin 70 is sprayed from the nozzle N to the container U below (preliminary spray). In this way, the liquid resin 70 can be filled into the front end (nozzle N) of the new material box C2.

[0100] In addition, in step S104, the control unit CTR confirms whether the liquid resin 70 is ejected normally by the liquid resin ejection mechanism 23. Specifically, the control unit CTR ejects a predetermined amount of liquid resin 70 from the new cartridge C2. In addition, the control unit CTR measures the weight of the ejected liquid resin 70 using the meter 25. The control unit CTR compares the predetermined amount with the actually measured weight to confirm (action confirmation and accuracy confirmation) whether the liquid resin 70 is ejected normally from the liquid resin ejection mechanism 23.

[0101] Furthermore, when an abnormality is found through the above-mentioned confirmation, the control unit CTR may notify the user of the abnormality by using appropriate means (for example, by displaying on a screen or by sound notification).

[0102] After performing the process of step S104, the control unit CTR moves to the process of step S105.

[0103] In step S105 , the control unit CTR replaces the new cartridge C2 held in the liquid resin ejection mechanism 23 with the old cartridge C1 . That is, the control unit CTR holds the new cartridge C2 that has been pre-injected in the cartridge setting unit 26 and holds the old cartridge C1 in the liquid resin ejection mechanism 23 instead.

[0104] After performing the process of step S105 , the control unit CTR proceeds to the process of step S106 .

[0105] In step S106, the control unit CTR starts supplying the liquid resin 70 to the release film 12 using the liquid resin ejection mechanism 23 (resin spraying). Figure 4As shown, the control unit CTR moves the liquid resin ejection mechanism 23 in the horizontal direction (X direction and Y direction) to eject the liquid resin 70 , and supplies the liquid resin 70 in a spiral shape onto the release film 12 .

[0106] Here, when the process shifts to step S106 through the processing of steps S103 to S105, the control unit CTR supplies resin from the old cartridge C1 in a state where the new cartridge C2 is prepared (preliminary injection) in advance.

[0107] After performing the process of step S106 , the control unit CTR moves to the process of step S107 .

[0108] exist Figure 6 In step S107 shown in FIG. 1 , the control unit CTR uses the rod position detection sensor 23e to determine whether the rod 23b of the liquid resin ejection mechanism 23 has reached the lowest position (end position) relative to the cartridge C. The so-called end position is the lowest position of the rod 23b in the movable range relative to the cartridge C. That is, the state in which the rod 23b has reached the end position refers to the state in which the liquid resin 70 is ejected from the cartridge C as much as possible. The end position is arbitrarily set in advance. In addition, the end position can also be appropriately changed according to the type of cartridge C.

[0109] If the control unit CTR determines that the rod 23b has reached the end position of the cartridge C (Yes in step S107), the process proceeds to step S108. On the other hand, if the control unit CTR determines that the rod 23b has not reached the end position of the cartridge C (No in step S107), the process proceeds to step S111.

[0110] In step S108, the control unit CTR temporarily stops the supply of the liquid resin 70 (resin spraying) to the release film 12 by the liquid resin ejection mechanism 23. Specifically, the control unit CTR stops the movement of the liquid resin ejection mechanism 23 in the horizontal direction (X direction and Y direction) and stops the ejection of the liquid resin 70 (the descent of the rod 23b). At this time, the control unit CTR stores the position where the liquid resin ejection mechanism 23 stops using the coordinates in the horizontal direction (the coordinates in the X direction and the Y direction).

[0111] After stopping the discharge of the liquid resin 70 , the control unit CTR reciprocates the cartridge C in the vertical direction a plurality of times (liquid shutoff operation). Thus, the liquid resin 70 attached to the cartridge C (nozzle N) can be dropped onto the release film 12 .

[0112] After performing the process of step S108, the control unit CTR moves to the process of step S109.

[0113] In step S109 , the control unit CTR replaces the old cartridge C1 held in the liquid resin ejection mechanism 23 with the new cartridge C2 in which the nozzle N has been filled (preliminary ejection) in step S104 .

[0114] After performing the process of step S109, the control unit CTR moves to the process of step S110.

[0115] In step S110, the control unit CTR restarts the supply of the liquid resin 70 by the liquid resin ejection mechanism 23 from the position (temporarily stopped position) stored in step S108. Specifically, the control unit CTR moves the liquid resin ejection mechanism 23 holding the new cartridge C2 to the position temporarily stopped in step S108. The control unit CTR moves the liquid resin ejection mechanism 23 in the horizontal direction along the spiral path again from this position, and ejects the liquid resin 70. That is, in the present embodiment, the position (stop position) at which the supply of the liquid resin 70 is stopped in step S108 is the same as the position (start position) at which the supply of the liquid resin 70 is restarted in step S110.

[0116] By restarting the resin supply from the same position (start position) as the stop position along the spiral path in this manner, it is possible to prevent the liquid resin 70 from being repeatedly supplied on the same path, thereby achieving uniformity of the liquid resin 70 .

[0117] Furthermore, in step S110, it is not necessary to restart the discharge of the liquid resin 70 from the stop position in step S108. For example, a position slightly offset from the stop position (for example, slightly downstream along the spiral path) may be used as the start position, and the discharge of the liquid resin 70 may be restarted from the start position. In this way, it is possible to prevent the liquid resin 70 from being repeatedly supplied at the stop position, and thus the liquid resin 70 on the release film 12 can be more effectively uniformed.

[0118] After performing the process of step S110 , the control unit CTR proceeds to the process of step S111 .

[0119] In step S111, the control unit CTR uses the meter 25 to determine whether the weight of the liquid resin 70 sprayed onto the release film 12 has reached the target supply amount. When the control unit CTR determines that the weight of the liquid resin 70 has reached the target supply amount (yes in step S111), the process moves to step S112. On the other hand, when the control unit CTR determines that the weight of the liquid resin 70 has not reached the target supply amount (no in step S111), the process moves to step S107 again, and the process after step S107 is repeated until the weight of the liquid resin 70 reaches the target supply amount.

[0120] In step S112, the control unit CTR stops and ends the supply of the liquid resin 70 to the release film 12 by the liquid resin ejection mechanism 23 (resin spraying). In addition, the control unit CTR performs the liquid shutoff operation of the cartridge C, similarly to step S108. At this point in time, the liquid resin 70 remaining in the cartridge C held by the liquid resin ejection mechanism 23 is used to supply the liquid resin 70 to the next release film 12.

[0121] The release film 12 supplied with the target supply amount of the liquid resin 70 in this manner is conveyed to the molding die 31 as described above, and resin molding is performed.

[0122] In this way, when the remaining amount of liquid resin 70 in the old material box C1 is less than the target supply amount (No in step S102), the filling action of the new material box C2 is performed in advance (step S104), and the liquid resin 70 is started to be sprayed from the old material box C1 (step S106). Then, at the time point when the remaining amount of the old material box C1 is used up (Yes in step S107), the resin supply is temporarily stopped (step S108), and the new material box C2 is replaced (step S109). By replacing the material box C in the middle of a resin supply (resin supply to a release film 12) in this way, the liquid resin 70 in the old material box C1 whose remaining amount is less than the target supply amount can be used up as much as possible without discarding it, thereby reducing the manufacturing cost. In addition, by replacing it with a new material box C2 that has been pre-sprayed in advance, the replacement time can be shortened, so that the resin supply can be quickly restarted. Therefore, it is possible to suppress the state of the liquid resin 70 supplied to the release film 12 from changing with the passage of time when the release film 12 is replaced, and thus appropriate resin supply can be performed.

[0123] As described above, the resin supply method of this embodiment includes:

[0124] The first resin supply step (step S106) supplies the liquid resin 70 contained in the old cartridge C1 (first cartridge) to the release film 12 (supply object) with a remaining amount less than the target supply amount required for supplying the resin once.

[0125] a material box replacement step (step S109), after the first resin supply step, replacing the old material box C1 with a new material box C2 (second material box) after pre-spraying; and

[0126] In the second resin supplying step (step S110 ), after the cartridge replacing step, the liquid resin 70 contained in the new cartridge C2 is supplied to the release film 12 .

[0127] With such a configuration, resin supply can be appropriately performed by appropriately replacing the cartridge C. In addition, the liquid resin 70 in the old cartridge C1 can be used as much as possible, and the amount of liquid resin 70 discarded can be reduced (reducing manufacturing costs).

[0128] In the second resin supplying step (step S110 ), supply of the liquid resin 70 is started from a start position determined based on the stop position when supply of the liquid resin 70 from the old cartridge C1 is stopped in the first resin supplying step (step S106 ).

[0129] This configuration makes it possible to make the liquid resin 70 supplied to the release film 12 uniform. That is, by setting an appropriate position as the start position based on the stop position, for example, the liquid resin 70 can be prevented from being supplied to overlapping positions, thereby making the liquid resin 70 uniform.

[0130] In addition, the stop position and the start position are defined using coordinates in two directions (X direction and Y direction) that are orthogonal to each other on a horizontal plane.

[0131] By configuring in this way, the stop position and the start position can be easily managed. That is, since the stop position can be managed using simple coordinates in two directions, the position can be easily managed.

[0132] In the first resin supply step (step S106 ), supply of the liquid resin 70 from the old cartridge C1 is stopped based on the position of the rod 23 b (supply member) that squeezes and supplies the liquid resin 70 contained in the old cartridge C1 .

[0133] This configuration makes it easy to detect the remaining amount of liquid resin 70 when supply of liquid resin 70 is stopped. That is, by using the rod position detection sensor 23e to detect the position of the rod 23b, the remaining amount of liquid resin 70 contained in the old cartridge C1 which is difficult to see from the outside can be easily detected.

[0134] In addition, the resin supply method of the present embodiment further includes a resin remaining amount measuring step (step S101 ) before the first resin supply step (step S106 ), measuring the remaining amount of the liquid resin 70 contained in the old cartridge C1 .

[0135] By configuring in this way, the remaining amount of the old cartridge C1 can be known in advance, thereby knowing the necessity of replacing the old cartridge C2 with the new cartridge C2, and further knowing the necessity of the filling action (preliminary spraying). Thus, the filling action (step S104, etc.) can be omitted when replacement is not necessary, thereby simplifying the operation process.

[0136] In the resin remaining amount measuring step (step S101 ), the remaining amount of the liquid resin 70 contained in the old cartridge C1 can be measured based on the position of the rod 23 b (supply member) that squeezes and supplies the liquid resin 70 contained in the old cartridge C1 .

[0137] With such a configuration, the remaining amount of the liquid resin 70 can be easily detected.

[0138] In addition, the resin supply method of the present embodiment further includes a pre-spraying step (step S103 to step S105) after the resin remainder measuring step (step S101) and before the first resin supplying step (step S106), wherein the old material box C1 installed on the liquid resin spraying mechanism 23 (liquid resin supplying mechanism) that supplies liquid resin to the release film 12 is replaced with the new material box C2, the new material box C2 is pre-sprayed using the liquid resin spraying mechanism 23, and the new material box C2 installed on the liquid resin spraying mechanism 23 is replaced with the old material box C1 again.

[0139] This configuration can simplify the device. That is, the liquid resin ejection mechanism 23 that supplies the liquid resin 70 can be used for preliminary ejection, so there is no need to prepare a separate mechanism for preliminary ejection, thereby simplifying the device.

[0140] In addition, in the preliminary spraying step (steps S103 to S105 ), it is confirmed whether the liquid resin 70 contained in the new cartridge C2 subjected to the preliminary spraying can be normally supplied from the liquid resin spraying mechanism 23 .

[0141] This configuration allows the liquid resin ejection mechanism 23 to be checked for operation together with the preliminary ejection. In particular, in this embodiment, the weighing device 25 for weighing the weight of the liquid resin 70 supplied to the release film 12 can be used to check for operation, thereby improving the efficiency of the operation process.

[0142] The method for manufacturing a resin molded product according to the present embodiment is a method for manufacturing a resin molded product using the liquid resin 70 supplied by the above-described resin supplying method.

[0143] With such a configuration, the resin can be appropriately supplied by appropriately replacing the cartridge C.

[0144] In addition, the resin molding device 1 of the present embodiment includes:

[0145] The forming die 31 includes an upper die 34 and a lower die 32 facing the upper die 34;

[0146] A mold clamping mechanism 35 for clamping the forming mold 31; and

[0147] The liquid resin ejection mechanism 23 (liquid resin supply mechanism) supplies the liquid resin 70 used in the molding die 31.

[0148] The liquid resin ejection mechanism 23 supplies the liquid resin 70 contained in the old material box C1 (first material box) to the release film 12, the remainder of which is less than the target supply amount required for supplying the resin once to the release film 12 (supply object), and replaces the old material box C1 with a new material box C2 (second material box) after pre-spraying, and supplies the liquid resin 70 contained in the new material box C2 to the release film 12.

[0149] With such a configuration, resin supply can be appropriately performed by appropriately replacing the cartridge C. In addition, the liquid resin 70 in the old cartridge C1 can be used as much as possible, and the amount of liquid resin 70 discarded can be reduced (reducing manufacturing costs).

[0150] Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments described above, and appropriate changes can be made within the scope of the technical concept of the invention described in the claims.

[0151] For example, in this embodiment, the example in which the liquid resin ejection mechanism 23 supplies the liquid resin 70 while moving in a spiral shape is shown, but the present invention is not limited to this, and the moving path of the liquid resin ejection mechanism 23 can be arbitrarily changed. In addition, the liquid resin 70 can be supplied to a point on the release film 12 without moving the liquid resin ejection mechanism 23.

[0152] In addition, in this embodiment, a structure in which the amount of liquid resin 70 in the material box C is detected using the resin surface detection sensor 23d and the rod position detection sensor 23e is illustrated, but the present invention is not limited to this, and the amount of liquid resin 70 in the material box C can be detected by any method such as a weight sensor.

[0153] In addition, in the present embodiment, the structure includes the film mounting table 13 and the film adsorption table 24, but the film mounting table 13 and the film adsorption table 24 may be used together, and only the film adsorption table 24 may be formed. In this case, the film adsorption table 24 can move in the X direction, the Y direction, and the Z direction, and can move between the mold release film cutting module 10 and the resin supply module 20. The film adsorption table 24 with the mold release film 12 is moved to the lower part of the resin discharge part of the resin supply module 20, and in this state, the liquid resin 70 is discharged onto the mold release film 12.

Claims

1. A resin supply method, comprising: A first resin supplying step of supplying the liquid resin contained in the first material box to the supply object, the remaining amount of which is less than the target supply amount required for supplying the resin once to the supply object; a material box replacement step, after the first resin supply step, replacing the first material box with a second material box after pre-spraying; and a second resin supplying step, after the cartridge replacing step, supplying the liquid resin contained in the second cartridge to the supply object; Before the first resin supplying step, the method further includes a resin remaining amount measuring step of measuring the remaining amount of the liquid resin contained in the first material box; After the resin remainder measuring step and before the first resin supplying step, a pre-spraying step is also included, in which the first material box installed on the liquid resin supply mechanism for supplying liquid resin to the supply object is replaced with the second material box, the second material box is pre-sprayed using the liquid resin supply mechanism, and the second material box installed on the liquid resin supply mechanism is replaced with the first material box again.

2. The resin supply method according to claim 1, wherein In the second resin supplying step, supply of the liquid resin is started from a start position determined based on a stop position when supply of the liquid resin from the first cartridge is stopped in the first resin supplying step.

3. The resin supply method according to claim 2, wherein The stop position and the start position are defined using coordinates in two directions orthogonal to each other on a horizontal plane.

4. The resin supply method according to any one of claims 1 to 3, wherein In the first resin supplying step, supply of the liquid resin from the first cartridge is stopped based on a position of a supply member that squeezes out and supplies the liquid resin contained in the first cartridge.

5. The resin supply method according to claim 1, wherein In the resin remaining amount measuring step, the remaining amount of the liquid resin contained in the first cartridge may be measured based on the position of a supply member that squeezes out and supplies the liquid resin contained in the first cartridge.

6. The resin supply method according to claim 1, wherein In the preliminary spraying step, it is confirmed whether the liquid resin contained in the second cartridge subjected to the preliminary spraying can be normally supplied from the liquid resin supply mechanism.

7. A method for producing a resin molded product, wherein: A resin molded product is produced using a liquid resin supplied by the resin supply method according to any one of claims 1 to 6.

8. A resin molding device comprising: A forming die, comprising an upper die and a lower die facing the upper die; A mold clamping mechanism for clamping the forming mold; as well as a liquid resin supply mechanism for supplying liquid resin for use in the molding die; The liquid resin supply mechanism includes a control unit configured to control the liquid resin supply mechanism to execute the resin supply method according to claim 1 .

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