Chip transfer device and chip transfer method

Abstract

The embodiment of the present invention discloses a chip transfer device and a chip transfer method, wherein the chip transfer device includes a pickup component, a shell, a moving part for driving the shell to move, and a controller for controlling multiple pickup components, the controller can independently control the voltage on and off of the multiple pickup components, the pickup component includes a pickup part, after the pickup component is powered on, the pickup part can adsorb the chip. The controller can independently control multiple pickup components to pick up the chip, so any pickup component can be selected to achieve the selective transfer of chips at any spacing, and the chip transfer effect is better. Compared with the traditional chip transfer device that can only achieve the selective transfer of chips with a fixed spacing, cannot achieve the selective transfer of chips with any spacing, and has a poor chip transfer effect, the chip transfer device in this solution can select any pickup component to achieve the selective transfer of chips with any spacing, and the chip transfer effect is better.

Description

Technical Field

[0001] The present invention relates to the technical field of Micro-LED chip mass transfer, and in particular to a chip transfer device and a chip transfer method. Background Art

[0002] Micro-LED display technology refers to a display technology that uses self-luminous micron-sized LEDs as light-emitting pixel units and assembles them on a drive panel to form a high-density LED array. Due to the small size, high integration and self-luminescence of Micro-LED chips, it has greater advantages in brightness, resolution, contrast, energy consumption, service life, response speed and thermal stability compared to LCD and OLED in terms of display. Due to the small size of Micro-LED, mass transfer technology is required to apply Micro-LED technology to the display field. Mass transfer technology is to transfer dozens or even millions of Micro-LED chips from the carrier substrate to the circuit substrate in batches, accurately and orderly.

[0003] The conventional chip transfer device can only realize the selective transfer of chips with a fixed spacing, but cannot realize the selective transfer of chips with an arbitrary spacing, and the chip transfer effect is poor. Summary of the invention

[0004] One of the purposes of the present invention is to provide a chip transfer device, aiming to solve the problem that only the selective transfer of chips with fixed spacing can be achieved, but the selective transfer of chips with arbitrary spacing cannot be achieved, and the chip transfer effect is poor.

[0005] The second purpose of the present invention is to provide a chip transfer method, which aims to solve the problem that only the selective transfer of chips with fixed spacing can be achieved, and the selective transfer of chips with arbitrary spacing cannot be achieved, and the chip transfer effect is poor.

[0006] In order to solve one of the above problems, the present invention provides a chip transfer device, comprising a plurality of pickup components arranged in an array for picking up chips, a shell for fixing the plurality of the pickup components, a moving part for driving the shell to move, and a controller for controlling the plurality of the pickup components, wherein the controller can independently control the voltage on and off of the plurality of the pickup components, the pickup components include a pickup part, and after the pickup components are powered on, the pickup part can absorb the chip

[0007] To solve the second problem above, the present invention provides a chip transfer method, using the chip transfer device as described above, the method comprising:

[0008] providing a temporary substrate and a receiving substrate;

[0009] operating the controller to apply voltage to a plurality of the pickup assemblies;

[0010] Driving the moving member to move so that the picking member adsorbs the plurality of chips on the temporary substrate onto the receiving substrate;

[0011] operating the controller to apply a reverse voltage to the plurality of pickup components so that the plurality of chips fall onto the receiving substrate;

[0012] The moving part is driven to move, and the controller is operated to cut off the voltage. The implementation of the embodiment of the present invention will have the following beneficial effects:

[0013] The above-mentioned chip transfer device is adopted, including multiple pickup components for picking up chips and arranged in an array, a shell for fixing the multiple pickup components, a moving part for driving the shell to move, and a controller for controlling the multiple pickup components. The controller can independently control the voltage on and off of the multiple pickup components. The pickup components include pickup parts. After the pickup components are powered on, the pickup parts can pick up the chips. Since the controller can independently control the multiple pickup components to pick up chips, any pickup component can be selected to achieve selective transfer of chips at any spacing, and the chip transfer effect is better. Compared with the traditional chip transfer device that can only achieve selective transfer of chips with fixed spacing, cannot achieve selective transfer of chips with arbitrary spacing, and has a poor chip transfer effect, the chip transfer device in this solution can select any pickup component to achieve selective transfer of chips with arbitrary spacing, and the chip transfer effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] in:

[0016] Figure 1 FIG. 4 is a schematic diagram of a chip transfer device according to an embodiment of the present invention.

[0017] Figure 2 For Figure 1 A bottom view of the chip transfer apparatus is shown.

[0018] Figure 3 For one embodiment, Figure 1 Schematic diagram of the chip transfer apparatus is shown.

[0019] Figure 4 For one embodiment, Figure 1 A schematic diagram of a portion of the chip transfer device is shown.

[0020] Figure 5 For one embodiment, Figure 1 A complete pick-up schematic of the chip transfer apparatus is shown.

[0021] Figure 6 FIG. 4 is a flow chart of a chip transfer method according to an embodiment of the present invention.

[0022] Reference numerals:

[0023] 10-pickup component, 11-pickup member, 13-electrostrictive member, 15-conductive member;

[0024] 20-housing, 21-opening, 231-first outer shell, 233-second outer shell, 25-inner shell;

[0025] 30- moving parts;

[0026] 40-controller;

[0027] 50-temporary substrate;

[0028] 60-Receive the substrate. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0032] like Figure 1 and Figure 2 As shown, the present invention discloses a chip transfer device of one embodiment, including a plurality of pickup components 10 for picking up chips and arranged in an array, a shell 20 for fixing the plurality of pickup components 10, a moving part 30 for driving the shell 20 to move, and a controller 40 for controlling the plurality of pickup components 10. The controller 40 can independently control the voltage on and off of the plurality of pickup components 10. The pickup component 10 includes a pickup component 11. After the pickup component 10 is powered on, the pickup component 11 can adsorb the chip.

[0033] The above-mentioned chip transfer device is adopted, including a plurality of pickup components 10 for picking up chips and arranged in an array, a shell 20 for fixing the plurality of pickup components 10, a moving part 30 for driving the shell 20 to move, and a controller 40 for controlling the plurality of pickup components 10. The controller 40 can independently control the voltage on and off of the plurality of pickup components 10. The pickup component 10 includes a pickup part 11. After the pickup component 10 is powered on, the pickup part 11 can adsorb the chip. Since the controller 40 can independently control the plurality of pickup components 10 to pick up the chip, any pickup component 10 can be selected to realize the selective transfer of chips at any spacing, and the chip transfer effect is better. Compared with the traditional chip transfer device which can only realize the selective transfer of chips at a fixed spacing, but cannot realize the selective transfer of chips at any spacing, and the chip transfer effect is poor, the chip transfer device in this scheme can select any pickup component to realize the selective transfer of chips at any spacing, and the chip transfer effect is better.

[0034] In this embodiment, the pickup component 10 also includes an electrostrictive component 13 connected to the pickup component 11. The pickup component 11 and the electrostrictive component 13 are both arranged in a shell 20. The shell 20 is provided with a plurality of openings 21 connected to the interior of the shell 20. The pickup component 11 is opposite to the opening 21. After the pickup component 10 is energized, the electrostrictive component 13 extends and drives the pickup component 11 to pass through the opening 21, thereby adsorbing the chip.

[0035] Specifically, the pickup assembly 10 also includes an electrostrictive element 13 connected to the pickup element 11. The pickup element 11 and the electrostrictive element 13 are both arranged in a shell 20. The shell 20 is provided with a plurality of openings 21 connected to the interior of the shell 20. The pickup element 11 is directly opposite the opening 21. After the pickup assembly 10 is energized, the electrostrictive element 13 extends and drives the pickup element 11 to pass through the opening 21, thereby adsorbing the chip. The electrostrictive element 13 can enable the pickup element 11 in the shell 20 to pass through the opening 21, thereby adsorbing the chip.

[0036] Preferably, the depth of the opening 21 is 1 mm to 2 mm.

[0037] Specifically, the depth of the opening 21 is 1 mm to 2 mm, and the depth of the opening 21 can be 1 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, 1.7 mm, 1.8 mm, 1.9 mm, or 2 mm, so that the pick-up member 11 can pass through the opening 21 to adsorb the chip.

[0038] Preferably, the distance between adjacent pickup components 10 is 5 μm to 20 μm.

[0039] Specifically, the spacing between adjacent pickup components 10 is 5μm to 20μm, and the spacing between adjacent pickup components 10 can be 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, 11μm, 12μm, 13μm, 14μm, 15μm, 16μm, 17μm, 18μm, 19μm, 20μm, so that the pickup components 10 do not affect each other.

[0040] Preferably, the pickup member 11 is deformable, and a plurality of pickup members 11 are respectively covered on the opening 21. When the pickup assembly 10 is energized, the electrostrictive member 13 stretches and squeezes the pickup member 11, so that the pickup member 11 is deformed and passes through the opening 21, thereby adsorbing the chip.

[0041] Specifically, the picking piece 11 is deformable, and multiple picking pieces 11 are respectively covered on the opening 21. After the picking assembly 10 is energized, the electrostrictive piece 13 stretches and squeezes the picking piece 11, so that the picking piece 11 is deformed and passes through the opening 21, and then adsorbs the chip. It is convenient to squeeze the picking piece 11 through the extension of the electrostrictive piece 13, so that the picking piece 11 is deformed and passes through the opening 21, and then adsorbs the chip.

[0042] Preferably, the pickup assembly 10 further includes a conductive member 15 disposed in the housing 20, and the pickup member 11, the electrostrictive member 13 and the conductive member 15 are connected in sequence.

[0043] Specifically, the pickup component 10 also includes a conductive member 15 disposed in the shell 20. The pickup component 11, the electrostrictive member 13 and the conductive member 15 are connected in sequence. The pickup component 11 and the conductive member 15 are electrically connected to the two ends of the controller 40 respectively, so that the controller 40 can control the voltage on and off of the pickup component 10.

[0044] Preferably, the thickness of the pickup member 11 is 50 μm to 100 μm.

[0045] Specifically, the thickness of the picking piece 11 is 50μm to 100μm, and the thickness of the picking piece 11 can be 50μm, 55μm, 60μm, 65μm, 70μm, 75μm, 80μm, 85μm, 90μm, 95μm, or 100μm. If the thickness of the picking piece 11 is too small, it is easy to break during extrusion. If the thickness of the picking piece 11 is too large, the deformation effect during extrusion is not good.

[0046] Preferably, the picking member 11 , the conductive member 15 and the opening 21 are all circular, square or triangular.

[0047] Preferably, the material of the electrostrictive element 13 is polyvinylidene fluoride or polyvinylidene fluoride-trifluoroethylene.

[0048] Specifically, the material of the electrostrictive element 13 is polyvinylidene fluoride or polyvinylidene fluoride-trifluoroethylene, so that the length of the electrostrictive element 13 changes when electricity is supplied.

[0049] Preferably, the pickup member 11 is a first electrode plate, and the conductive member 15 is a second electrode plate.

[0050] Specifically, the pickup member 11 is a first electrode plate, and the conductive member 15 is a second electrode plate, so that the pickup member 11 and the conductive member 15 are conveniently electrically connected to both ends of the controller 40 .

[0051] Preferably, the shell 20 includes an insulating outer shell and a conductive inner shell 25, the inner shell 25 is arranged inside the outer shell, the outer shell is connected to the moving part 30, the opening 21 passes through the outer shell and the inner shell 25, the picking component 10 is arranged in the inner shell 25, the picking part 11 is connected to the inner shell 25, and the inner shell 25 is electrically connected to the controller 40.

[0052] Specifically, the shell 20 includes an insulating outer shell and a conductive inner shell 25, the inner shell 25 is arranged in the outer shell, the outer shell is connected to the moving part 30, the opening 21 passes through the outer shell and the inner shell 25, the picking component 10 is arranged in the inner shell 25, the picking part 11 is connected to the inner shell 25, the inner shell 25 is electrically connected to the controller 40, and the picking part 11 can be electrically connected to the controller 40 through the inner shell 25.

[0053] Preferably, the outer shell includes a first outer shell 231 connected to the moving member 30 and a second outer shell 233 for accommodating the inner shell 25 , and the opening 21 passes through the second outer shell 233 .

[0054] Preferably, the housing is a plastic housing or an insulating metal housing.

[0055] Specifically, the shell is a plastic shell or an insulating metal shell, and the plastic shell or the insulating metal shell has good insulation.

[0056] Preferably, the moving member 30 can move up, down, left, and right.

[0057] Specifically, the moving member 30 can move up, down, left, and right, thereby driving the housing 20 to move up, down, left, and right, thereby achieving chip transfer.

[0058] Figure 3 Shown are schematic diagrams of a chip transfer device, respectively illustrating the principle of partial picking up of the chip transfer device and the principle of complete picking up of the chip transfer device.

[0059] The selective pick and place operation process is as follows Figure 4 As shown, a micro-LED chip array with a weakened structure is provided, including a temporary substrate and a chip, the chip is suspended and connected to the temporary substrate through a silicon oxide cantilever beam (or other easily broken materials), and a receiving substrate that can receive the micro-LED chip, the micro-LED chip array and the substrate are both placed with the front side facing up, the chip transfer device is aligned with the micro-LED chip array, and the controller 40 of the chip transfer device outputs instructions to selectively control the expansion and contraction of the pickup component 10 and the generation of electrostatic force, then the corresponding electrostrictive member 13 is deformed together with the pickup member 11, and extends out of the housing opening 21, the electrostatic force transfer head moves downward, and the protruding part of the pickup member 11 is connected to the electrostatic force transfer head. The micro-LED chip is touched and the cantilever beam fixing the chip is broken. The moving part 30 is lifted to complete the picking operation of the micro-LED chip. The chip transfer device moves to the top of the receiving substrate and completes the alignment operation on the receiving substrate. The chip transfer device moves down, and the micro-LED chip contacts and bonds with the receiving substrate. At this time, the controller 40 applies a voltage in the opposite direction to the picking component 10. Due to the principle of electrostatic induction, the picking component 10 is separated from the chip, and at this time the electrostrictive component 13 together with the picking component 11 slowly retracts into the shell 20. The moving part 30 is lifted and the voltage is cut off. The electrostrictive component 13 returns to its initial shape to complete the placement operation, thereby realizing the entire selective mass transfer process.

[0060] The operation process of the whole transfer process is as follows Figure 5As shown, the chip transfer device is aligned with the micro-LED chip array, and the controller 40 of the chip transfer device outputs an instruction to apply voltage to all the pickup components 10, so that all the electrostrictive members 13 are deformed and extend out of the housing 20 with the pickup member 11, and the moving member 30 moves down, and the pickup member 11 contacts the micro-LED chip, breaking the cantilever beam that fixes the chip, and the moving member 30 is lifted to complete the pickup operation of the micro-LED chip, and the chip transfer device moves to the top of the receiving substrate and completes the alignment operation on the receiving substrate, and the chip transfer device moves down, and the micro-LED chip contacts and bonds with the receiving substrate. At this time, the controller 40 applies a voltage in the opposite direction to all the pickup components 10. Due to the principle of electrostatic induction, all the pickup components 10 are separated from the chip, and at this time, the electrostrictive member 13 and the pickup member 11 slowly retract into the housing 20, and the moving member 30 is lifted and the voltage is cut off, and the electrostrictive member 13 restores the initial shape to complete the placement operation, thereby realizing the entire selective mass transfer process.

[0061] like Figure 6 As shown, the present invention also discloses a chip transfer method according to an embodiment of the present invention. The chip transfer method adopts the chip transfer device as described above, and the method comprises:

[0062] S10, providing a temporary substrate 50 and a receiving substrate 60;

[0063] S20, operating the controller 40 to apply voltage to the plurality of pickup components 10;

[0064] S30, driving the moving member 30 to move so that the picking member 11 adsorbs the multiple chips on the temporary substrate 50 to the top of the receiving substrate 60;

[0065] S40, operating the controller 40 to apply a reverse voltage to the plurality of pickup components 10, so that the plurality of chips fall onto the receiving substrate 60;

[0066] S50, driving the moving member 30 to move, and operating the controller 40 to cut off the voltage.

[0067] In one embodiment, the plurality of pick-up components 10 are all the pick-up components 10 in the chip transfer device, and the chip can be completely picked up at this time. Figure 5 shown.

[0068] In another embodiment, the plurality of pick-up components 10 are any plurality of pick-up components 10 in a chip transfer device, and any part of the chip can be picked up at this time, such as the attached Figure 4 shown.

[0069] With the above chip transfer method, since the controller 40 can independently control multiple pickup components 10 to pick up chips, any pickup component 10 can be selected to achieve selective transfer of chips with any spacing, and the chip transfer effect is better. Compared with the traditional chip transfer method that can only achieve selective transfer of chips with fixed spacing, but cannot achieve selective transfer of chips with any spacing, and the chip transfer effect is poor, the chip transfer method in this solution can select any pickup component to achieve selective transfer of chips with any spacing, and the chip transfer effect is better.

[0070] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A chip transfer device, characterized in that: The device comprises a plurality of pickup components arranged in an array for picking up chips, a shell for fixing the plurality of pickup components, a moving part for driving the shell to move, and a controller for controlling the plurality of pickup components, wherein the controller can independently control the voltage on and off of the plurality of pickup components, the pickup component comprises a pickup part, and after the pickup component is powered on, the pickup part can adsorb the chip; The pickup assembly further comprises an electrostrictive member connected to the pickup member, the pickup member and the electrostrictive member are both arranged in the housing, the housing is provided with a plurality of openings communicating with the interior of the housing, the pickup member faces the openings, and when the pickup assembly is powered on, the electrostrictive member stretches and drives the pickup member to pass through the openings, thereby adsorbing the chip; The shell includes an insulating outer shell and a conductive inner shell, the inner shell is arranged in the outer shell, the outer shell is connected to the moving part, the opening passes through the outer shell and the inner shell, the pickup component is arranged in the inner shell, the pickup part is connected to the inner shell, and the inner shell is electrically connected to the controller.

2. The chip transfer device according to claim 1, characterized in that: The pickup member is deformable, and a plurality of the pickup members are respectively covered on the openings. When the pickup assembly is energized, the electrostrictive member stretches and squeezes the pickup member, so that the pickup member is deformed and passes through the opening, thereby adsorbing the chip.

3. The chip transfer device according to claim 2, characterized in that: The pickup assembly also includes a conductive member arranged in the shell, and the pickup member, the electrostrictive member and the conductive member are connected in sequence.

4. The chip transfer device according to claim 3, characterized in that: The pickup member has a thickness of 50 μm to 100 μm.

5. The chip transfer device according to claim 3, characterized in that: The pickup member, the conductive member and the opening are all circular, square or triangular.

6. The chip transfer device according to claim 3, characterized in that: The material of the electrostrictive element is polyvinylidene fluoride or polyvinylidene fluoride-trifluoroethylene.

7. The chip transfer device according to claim 3, characterized in that: The pickup member is a first electrode plate, and the conductive member is a second electrode plate.

8. The chip transfer device according to claim 1, characterized in that: The housing comprises a first housing connected to the moving member and a second housing for accommodating the inner housing, and the opening passes through the second housing; The shell is a plastic shell or an insulating metal shell; The moving part can move up, down, left and right.

9. A chip transfer method, characterized in that: Using the chip transfer device according to any one of claims 1 to 8, the method comprises: providing a temporary substrate and a receiving substrate; operating the controller to apply voltage to a plurality of the pickup assemblies; Driving the moving member to move so that the picking member adsorbs the plurality of chips on the temporary substrate onto the receiving substrate; operating the controller to apply a reverse voltage to the plurality of pickup components so that the plurality of chips fall onto the receiving substrate; The moving member is driven to move, and the controller is operated to cut off the voltage.

10. The chip transfer method according to claim 9, characterized in that: The plurality of pick-up components are all the pick-up components in the chip transfer device.

11. The chip transfer method according to claim 10, characterized in that: The plurality of pick-up components are any plurality of pick-up components in the chip transfer device.

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