Method for manufacturing circuit board, circuit board and storage medium

Abstract

The present application relates to a method for manufacturing a circuit board, a circuit board and a storage medium. The method comprises: providing a substrate, setting at least one first area and at least one second area on the substrate; the first area is used to set a gold finger of the circuit board, and the second area is used to set a circuit layer of the circuit board; setting the gold finger on the first area, and setting the circuit layer on the second area; taking the substrate or a solder mask to be set on the substrate as a processing target; acquiring a corresponding processing strategy according to the processing target, and processing the processing target according to the processing strategy, so that the contact area between the gold finger and the solder mask to be set is within a preset area; achieving the effect that when the gold finger and the ejector pin of the female connector of the female connector are offset, the gold finger can also contact the ejector pin of the female connector.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a method for manufacturing a circuit board, a circuit board, and a storage medium. Background Art

[0002] Printed Circuit Board (PCB) is a common electronic component. In traditional technology, corresponding male connectors are provided on the circuit boards to achieve the connection between various circuit boards. However, such connection method is cumbersome and requires high space. Therefore, printed circuit boards are connected using gold fingers, which are a row of square pads arranged at equal intervals. When the gold fingers of the circuit board are inserted into the slots of the female connector, the gold fingers contact the corresponding pins of the female connector to achieve conduction. Therefore, using gold fingers instead of male connectors has become a trend in circuit board manufacturing.

[0003] In circuit board design, using gold fingers instead of male connectors is not only convenient for operation but also cost-saving. However, due to the tolerances in PCB production and manufacturing in related technologies, and the tolerances of the female connector itself, when the gold fingers of the PCB contact the slot of the female connector or the female socket of the female connector, the gold fingers and the female connector pins (springs) of the female connector will be offset, and the offset will lead to poor contact. Therefore, how to avoid the poor contact caused by the offset of the gold fingers of the circuit board and the female connector has become an urgent problem to be solved. Summary of the invention

[0004] The present application provides a method for manufacturing a circuit board, a circuit board and a storage medium to solve the problem in the related art that poor contact is caused by misalignment between the gold fingers of the circuit board and the female connector.

[0005] In a first aspect, the present application provides a method for manufacturing a circuit board, the method comprising: providing a substrate, setting at least one first area and at least one second area on the substrate; the first area is used to set the gold finger of the circuit board, and the second area is used to set the circuit layer of the circuit board; setting the gold finger on the first area, and setting the circuit layer on the second area; taking the substrate or the solder mask to be set on the substrate as a processing target; obtaining a corresponding processing strategy according to the processing target, and processing the processing target according to the processing strategy so that the contact area between the gold finger and the solder mask to be set is within a preset area; setting the solder mask to be set on the substrate to obtain a circuit board.

[0006] Optionally, obtaining a corresponding processing strategy according to the processing target includes: when the processing target is the solder mask layer to be set, determining a position of a first area on the substrate; and performing window processing on the solder mask layer to be set according to the determined position.

[0007] Optionally, obtaining a corresponding processing strategy according to the processing target includes: when the processing target is the substrate, obtaining a gap area between the gold fingers set in the first area; determining a position corresponding to the gap area on the substrate as a processing position; and performing fixed depth processing on the processing position to increase the depth of the gap area.

[0008] Optionally, performing a depth-fixing process on the processing position includes: determining a thickness of the substrate, determining a depth-fixing design shape according to the thickness of the substrate; and performing a depth-fixing process on the processing position according to the depth-fixing design shape.

[0009] Optionally, setting the circuit layer on the second area includes: setting the first area as a prohibited wiring area, wherein the prohibited wiring area is used to prohibit wiring in the first area when wiring the substrate; and wiring the substrate to set the circuit layer in the second area.

[0010] Optionally, setting the gold finger on the first area includes: setting a metal layer, a dry film layer and a patterned layer in the first area of ​​the substrate in sequence; exposing the dry film layer through the patterned layer to etch the dry film layer; etching the metal layer according to the etched dry film layer, and using the etched metal layer as the gold finger.

[0011] Optionally, providing the solder mask layer on the substrate includes: printing green oil on the substrate and providing a patterned layer on the green oil; etching the green oil according to the patterned layer, and using the etched green oil as the solder mask layer.

[0012] Optionally, after the solder mask to be set is set on the substrate, the method further includes: performing surface treatment on the circuit board, wherein the surface treatment is used to perform an anti-oxidation operation on the metal on the surface of the circuit board.

[0013] In a second aspect, the present application provides a circuit board, which is manufactured using the circuit board manufacturing method as described in any of the above items, and the circuit board includes: a substrate, the substrate including a first area and a second area; a gold finger is arranged on the first area, and a circuit layer is arranged on the second area; and a solder mask is arranged on at least the circuit layer.

[0014] In a third aspect, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps of the method for manufacturing a circuit board as described in any one of the embodiments of the first aspect are implemented, and the method for manufacturing a circuit board includes: providing a substrate, setting at least one first area and at least one second area on the substrate; the first area is used to set the gold finger of the circuit board, and the second area is used to set the circuit layer of the circuit board; setting the gold finger on the first area, and setting the circuit layer on the second area; taking the substrate or the solder mask to be set on the substrate as a processing target; obtaining a corresponding processing strategy according to the processing target, and processing the processing target according to the processing strategy so that the contact area between the gold finger and the solder mask to be set is within a preset area; setting the solder mask to be set on the substrate to obtain a circuit board.

[0015] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0016] The method provided by the embodiment of the present application includes: providing a substrate, setting at least one first area and at least one second area on the substrate; the first area is used to set the gold finger of the circuit board, and the second area is used to set the circuit layer of the circuit board; setting the gold finger on the first area, and setting the circuit layer on the second area; taking the substrate or the solder mask to be set on the substrate as a processing target; obtaining a corresponding processing strategy according to the processing target, and processing the processing target according to the processing strategy, so that the contact area between the gold finger and the solder mask to be set is within a preset area; thereby avoiding the problem that when the gold finger in the first area is offset from the ejector pin of the busbar connector, the solder mask lifts up the ejector pin of the busbar connector, so that the gold finger cannot contact the ejector pin of the female connector, resulting in poor contact, and achieving the effect that when the gold finger and the ejector pin of the female connector are offset, the gold finger can also contact the ejector pin of the female connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Figure 1A schematic diagram of a process flow of a method for manufacturing a circuit board provided in the first embodiment of the present application;

[0020] Figure 2 A basic schematic diagram of a front view of a circuit board provided in the first embodiment of the present application;

[0021] Figure 3 A basic schematic diagram of an optional circuit board cross-sectional view provided for the first embodiment of the present application;

[0022] Figure 4 A basic schematic diagram of another optional circuit board cross-sectional view provided for the first embodiment of the present application;

[0023] Figure 5 A basic schematic diagram of an optional circuit board cross-sectional view provided for the second embodiment of the present application;

[0024] Figure 6 A schematic diagram of the structure of a computer product provided in the third embodiment of the present application;

[0025] Description of reference numerals:

[0026] 1. First area; 2. Second area; 3. Gold finger; 4. Substrate; 5. Solder mask; 111. Processor; 112. Communication interface; 113. Computer-readable storage medium; 114. Communication bus. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0028] First embodiment

[0029] Figure 1 A basic flow chart of a method for manufacturing a circuit board provided in an embodiment of the present application, such as Figure 1 As shown, the method for manufacturing the circuit board includes but is not limited to:

[0030] S101, providing a substrate, and disposing at least one first region and at least one second region on the substrate;

[0031] It should be understood that the first area 1 is used to set the gold finger 3 of the circuit board, and the second area 2 is used to set the circuit layer of the circuit board. The substrate 4 is a rigid substrate 4 or a flexible substrate 4. Specifically, the material of the substrate 4 includes at least one of the following: FR-1 phenolic cotton paper; FR-2─phenolic cotton paper; FR-3─cotton paper, epoxy resin; FR-4─glass cloth (Woven glass), epoxy resin; FR-5──glass cloth, epoxy resin; FR-6──frosted glass, polyester; G-10──glass cloth, epoxy resin; CEM-1──cotton paper, epoxy resin (flame retardant); CEM-2──cotton paper, epoxy resin (non-flame retardant); CEM-3──glass cloth, epoxy resin; CEM-4──glass cloth, epoxy resin; CEM-5──glass cloth, polyester; AIN──aluminum nitride; This embodiment does not limit the material of the substrate 4, and it can be flexibly selected by relevant personnel according to actual needs.

[0032] S102, setting the gold finger on the first area, and setting a circuit layer on the second area;

[0033] It can be understood that the first area 1 and the second area 2 are independent areas respectively, that is, there is no overlapping area between the first area 1 and the second area 2.

[0034] S103, taking the substrate or the solder mask to be provided on the substrate as a processing target;

[0035] It can be understood that, in some examples, only the substrate 4 can be used as a processing target; in other examples, only the solder mask 5 to be set can be used as a processing target.

[0036] S104, acquiring a corresponding processing strategy according to the processing target, and processing the processing target according to the processing strategy, so that the contact area between the gold finger and the solder mask to be set is within a preset area;

[0037] It should be understood that there is a corresponding relationship between the processing target and the processing strategy, and different processing targets correspond to different processing strategies. The processing strategies corresponding to the processing targets will be described in detail later and will not be repeated here. The solder mask 5 to be set in the first area 1 is set between the gaps of the gold fingers 3. Therefore, the contact area between the gold fingers 3 and the solder mask 5 to be set is essentially the contact area between the side surfaces of the gold fingers 3 and the solder mask 5. The preset area will not exceed the area of ​​the side surfaces of the gold fingers 3. Preferably, the preset area has a value range of 0 to three quarters of the side surface area of ​​the gold fingers 3.

[0038] S105, disposing the solder mask to be disposed on the substrate to obtain a circuit board.

[0039] It should be understood that the solder mask 5 to be set will be set on the substrate 4 only after the processing target is processed according to the processing strategy, so that the contact area between the gold finger 3 in the first area 1 and the set solder mask 5 is within the preset area.

[0040] In some examples of the present embodiment, the processing strategy corresponding to the processing target is obtained according to the processing target, including: when the processing target is the solder mask 5 to be set, determining the position of the first area 1 on the substrate 4; and performing window processing on the solder mask 5 to be set according to the determined position. That is, the processing strategy corresponding to the solder mask 5 to be set is: performing window processing; specifically, the solder mask 5 to be set is set according to the shape of the substrate 4, that is, the shape of the solder mask 5 to be set corresponds to the shape of the substrate 4, therefore, when the position of the first area 1 on the substrate 4 is determined, the position of the first area 1 on the solder mask 5 to be set can be determined, and the solder mask 5 to be set is performed with a window according to the determined position, so that the solder mask 5 to be set will not be set on the first area 1, and then after the solder mask 5 to be set is set on the substrate 4, there is no solder mask 5 in the first area 1, and the contact area between the solder mask 5 and the gold finger 3 is 0, and then the contact area between the gold finger 3 and the solder mask 5 to be set is within the preset area, such as Figure 2 As shown, Figure 2 The front view of the solder mask 5 to be set on the substrate 4 is shown. Figure 3 As shown, Figure 3 The figure shows a cross-sectional view of the solder mask 5 to be set on the substrate 4, wherein due to the window design, the solder mask 5 is not present in the first area 1, thereby preventing the solder mask 5 from lifting up the busbar connector pin when the gold finger 3 in the first area 1 is misaligned with the busbar connector pin, making it impossible for the gold finger 3 to contact with the female connector pin, resulting in poor contact. The effect is achieved that when the gold finger 3 and the female connector pin of the female connector are misaligned, the gold finger 3 can also contact with the female connector pin.

[0041] In some examples of this embodiment, the obtaining of the corresponding processing strategy according to the processing target includes: when the processing target is the substrate 4, obtaining the gap area between the gold fingers 3 set in the first area 1; determining the position corresponding to the gap area on the substrate 4 as the processing position; performing a depth determination process on the processing position to increase the depth of the gap area, wherein the depth determination process is to perform a groove process on the gap area to increase the depth of the gap area. Specifically, as Figure 4As shown, there is a gap area between the two gold fingers 3. Because the gold fingers 3 are set on the substrate 4, the position of the gap area on the substrate 4 can be determined by the positions of the two gold fingers 3, and the determined position is used as the processing position. Then, the processing position is subjected to a depth determination process, thereby increasing the depth of the gap area. Due to the increase in the depth position of the two gap areas, after the solder mask 5 to be set is set on the substrate 4, the contact area of ​​the solder mask 5 set in the first area 1 is smaller than the area of ​​the side surface of the gold finger 3, thereby making the contact area between the gold finger 3 and the solder mask 5 to be set within the preset area, thereby avoiding the problem that when the gold finger 3 in the first area 1 is offset from the ejector pin of the busbar connector, the solder mask 5 lifts up the ejector pin of the busbar connector, making it impossible for the gold finger 3 to contact the ejector pin of the female connector, resulting in poor contact, and achieving the effect that when the gold finger 3 and the ejector pin of the female connector are offset, the gold finger 3 can also contact the ejector pin of the female connector.

[0042] In some examples of this embodiment, the depth setting process is performed on the processing position, including: determining the thickness of the substrate 4, determining the depth setting design shape according to the thickness of the substrate 4; performing the depth setting process on the processing position according to the depth setting design shape. It should be understood that this embodiment does not limit the depth setting design shape. For example, the depth setting design shape includes but is not limited to: triangle, rectangle, trapezoid, etc.; in some examples, different shapes correspond to different thicknesses of the substrate 4. For example, within the first thickness range value, the depth setting design shape is determined to be a triangle, and within the second thickness range value, the depth setting design shape is determined to be a rectangle; the specific correspondence between the thickness and the depth setting design shape can be flexibly set by relevant personnel.

[0043] It should be understood that the thickness h of the fixed depth treatment is sufficient to accommodate part of the solder mask 5, and the value range of the thickness h of the fixed depth treatment is: 0.08mm-0.2mm. Preferably, Figure 4 As shown, the thickness h of the depth setting treatment is 0.1 mm.

[0044] In some examples of the present embodiment, the setting of the circuit layer on the second area 2 includes: setting the first area 1 as a prohibited wiring area, the prohibited wiring area is used to prohibit wiring in the first area 1 when wiring the substrate 4; wiring the substrate 4 to set the circuit layer in the second area 2; it should be understood that when making the circuit layer, in order to operate on the entire substrate 4, therefore, when making the circuit layer, it is first necessary to open a window for the first area 1 as a whole, and perform route keep out in the first area 1, and then set the first area 1 as a prohibited wiring area, the prohibited wiring area is used to prohibit wiring in the first area 1 when wiring the substrate 4, because the first area 1 performs route keep out, therefore, when wiring (copper plating) the substrate 4, no wiring will be performed in the first area 1, and wiring will only be completed in the second area 2, and the circuit layer has been set in the second area 2.

[0045] In some examples of the present embodiment, the setting of the gold finger 3 on the first area 1 includes: sequentially setting a metal layer, a dry film layer, and a patterned layer on the first area 1 of the substrate 4; exposing the dry film layer through the patterned layer to etch the dry film layer; etching the metal layer according to the etched dry film layer, and using the etched metal layer as the gold finger 3. Specifically, firstly, a metal layer, a dry film layer, and a patterned layer are sequentially set on the substrate 4, and then the dry film layer is exposed through the patterned layer to etch the dry film layer, and the etched dry film layer is obtained after development, wherein the etched dry film layer is used to protect the metal layer, and then the metal layer is etched to obtain an etched metal layer, and the etched metal layer is used as the gold finger 3, and then the film is stripped to remove the etched dry film layer.

[0046] It should be understood that this embodiment does not limit the method for making the gold finger 3, and this embodiment does not limit the material of the gold finger 3. The method for making the gold finger 3 and the material of the gold finger 3 can be flexibly set by relevant personnel. Preferably, the material of the gold finger 3 is copper.

[0047] In some examples of the present embodiment, the solder mask 5 is provided on the substrate 4, including: printing green oil on the substrate 4, and providing a patterned layer on the green oil; etching the green oil according to the patterned layer, and using the etched green oil as the solder mask 5. Specifically, the substrate 4 is provided with a wiring layer, that is, a copper layer. Therefore, when printing green oil on the substrate 4, the green oil is printed on the copper layer. If the green oil is printed in the first area 1, since the copper layer is not provided in the first area 1, the green oil is provided in the gap area between the gold fingers 3 and contacts the substrate 4. After the green oil is printed, low-temperature copper curing, exposure, plate development, UV curing, character printing, and high-temperature copper curing are performed in sequence, and the etching and curing of the green oil are completed, and the etched and cured green oil is used as the solder mask 5.

[0048] In some examples of this embodiment, after the solder mask 5 to be set is set on the substrate 4, the method further includes: performing surface treatment on the circuit board, the surface treatment is used to perform an anti-oxidation operation on the metal on the surface of the circuit board to protect the surface of the substrate 4 from oxidation, specifically, the surface treatment includes but is not limited to: electroplating, oil spraying, painting, passivation, and film protection.

[0049] The method for manufacturing the circuit board provided in this embodiment includes: providing a substrate, setting at least one first area and at least one second area on the substrate; the first area is used to set the gold finger of the circuit board, and the second area is used to set the circuit layer of the circuit board; setting the gold finger on the first area, and setting the circuit layer on the second area; taking the substrate or the solder mask 5 to be set on the substrate as a processing target; obtaining a corresponding processing strategy according to the processing target, and processing the processing target according to the processing strategy, so that the contact area between the gold finger and the solder mask 5 to be set is within a preset area; thereby avoiding the problem that when the gold finger in the first area is offset from the busbar connector pin, the solder mask 5 lifts up the busbar connector pin, so that the gold finger cannot contact the female connector pin, resulting in poor contact, and the effect of being able to contact the female connector pin when the gold finger and the female connector pin of the female connector are offset is achieved.

[0050] Second embodiment

[0051] Based on the same concept, this embodiment provides a circuit board, which is manufactured by the manufacturing method of the circuit board described in any of the above examples, and the circuit board comprises: a substrate, the substrate comprises a first area and a second area; a gold finger is arranged on the first area, and a circuit layer is arranged on the second area; and at least a solder mask is arranged on the circuit layer;

[0052] In some examples, when the processing target is the solder mask 5 to be set, the position of the first area 1 on the substrate 4 substrate 44 is determined; the solder mask 5 to be set is subjected to a windowing process according to the determined position. After the solder mask 5 is set, the solder mask 5 will not be set in the first area 1. Therefore, the cross-sectional view of the first area 1 in the above embodiment Figure 3 shown.

[0053] In some examples, when the processing target is the substrate 4 substrate 44, the gap area between the gold fingers 3 set in the first area 1 is obtained; the position corresponding to the gap area is determined on the substrate 4 substrate 44 as the processing position; the depth determination process is performed on the processing position to increase the depth of the gap area. There is a gap area between two gold fingers 3. Because the gold fingers 3 are set on the substrate 4 substrate 44, the position of the gap area on the substrate 4 substrate 44 can be determined by the positions of the two gold fingers 3, and the determined position is used as the processing position, and then the depth determination process is performed on the processing position, thereby increasing the depth of the gap area. Due to the increase in the depth position of the two gap areas, after the solder mask 5 to be set is set on the substrate 4 substrate 44, the contact area of ​​the solder mask 5 set in the first area 1 is smaller than the area of ​​the side of the gold finger 3, thereby making the contact area between the gold finger 3 and the solder mask 5 to be set within the preset area, such as Figure 5 As shown, the problem of poor contact caused by the solder resist 5 lifting up the ejector pin of the busbar connector when the gold finger 3 in the first area 1 is misaligned with the ejector pin of the busbar connector, making it impossible for the gold finger 3 to contact with the ejector pin of the female connector, is avoided. The effect of the gold finger 3 being able to contact with the ejector pin of the female connector when the gold finger 3 is misaligned with the ejector pin of the female connector is achieved.

[0054] Third embodiment

[0055] The present application embodiment also provides a computer-readable storage medium 113, such as Figure 6 As shown, the computer-readable storage medium 113 is applied to a computer product, and the computer product includes: a processor 111, a communication interface 112, and a communication bus 114, wherein the processor 111, the communication interface 112, and the computer-readable storage medium 113 communicate with each other through the communication bus 114, and the computer-readable storage medium 113 stores a computer program thereon, and when the computer program is executed by the processor, the steps of the method for manufacturing a circuit board provided in any of the aforementioned method embodiments are implemented, and the method for manufacturing a circuit board includes:

[0056] A substrate is provided, and at least one first area and at least one second area are arranged on the substrate; the first area is used to arrange gold fingers of a circuit board, and the second area is used to arrange a circuit layer of the circuit board;

[0057] Arranging the gold finger on the first area, and arranging a circuit layer on the second area;

[0058] The substrate or the solder mask to be provided on the substrate is used as a processing target;

[0059] Acquire a corresponding processing strategy according to the processing target, and process the processing target according to the processing strategy so that the contact area between the gold finger and the solder mask to be set is within a preset area;

[0060] The solder mask to be set is arranged on the substrate to obtain a circuit board.

[0061] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0062] The foregoing is merely a specific embodiment of the present invention, which enables those skilled in the art to understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for manufacturing a circuit board, characterized in that: The method for manufacturing the circuit board comprises: A substrate is provided, and at least one first area and at least one second area are arranged on the substrate; the first area is used to arrange gold fingers of a circuit board, and the second area is used to arrange a circuit layer of the circuit board; Arranging the gold finger on the first area, and arranging a circuit layer on the second area; The substrate or the solder mask to be provided on the substrate is used as a processing target; Acquire a corresponding processing strategy according to the processing target, and process the processing target according to the processing strategy so that the contact area between the gold finger and the solder mask to be set is within a preset area; Arranging the solder mask to be arranged on the substrate to obtain a circuit board; The obtaining a corresponding processing strategy according to the processing target includes: When the processing target is the solder mask to be set, determining the position of the first area on the substrate; The solder mask to be set is subjected to window opening processing according to the determined position.

2. The method for manufacturing a circuit board according to claim 1, characterized in that: The obtaining a corresponding processing strategy according to the processing target includes: When the processing target is the substrate, obtaining a gap area between the gold fingers set in the first area; Determining a position corresponding to the gap region on the substrate as a processing position; A depth determination process is performed on the processing position to increase the depth of the gap region.

3. The method for manufacturing a circuit board according to claim 2, characterized in that: The performing depth determination processing on the processing position includes: Determining the thickness of the substrate, and determining a fixed depth design shape according to the thickness of the substrate; A depth setting process is performed on the processing position according to the depth setting design shape.

4. The method for manufacturing a circuit board according to any one of claims 1 to 3, characterized in that: The step of providing a circuit layer on the second area includes: Setting the first area as a prohibited wiring area, wherein the prohibited wiring area is used to prohibit wiring in the first area when wiring is performed on the substrate; The substrate is wired to provide the circuit layer in the second area.

5. The method for manufacturing a circuit board according to any one of claims 1 to 3, characterized in that: The step of setting the golden finger on the first area includes: sequentially disposing a metal layer, a dry film layer and a patterned layer in the first area of ​​the substrate; performing an exposure process on the dry film layer through the patterned layer to etch the dry film layer; The metal layer is etched according to the dry film layer after etching, and the metal layer after etching is used as the gold finger.

6. The method for manufacturing a circuit board according to any one of claims 1 to 3, characterized in that: The step of providing the solder mask on the substrate comprises: Printing green oil on the substrate, and providing a patterned layer on the green oil; The green oil is etched according to the patterned layer, and the etched green oil is used as the solder mask.

7. The method for manufacturing a circuit board according to any one of claims 1 to 3, characterized in that: After the solder mask to be set is set on the substrate, the method further includes: The circuit board is subjected to surface treatment, wherein the surface treatment is used to perform an anti-oxidation operation on the metal on the surface of the circuit board.

8. A circuit board, characterized in that: The circuit board is manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 7, and the circuit board comprises: A substrate, comprising a first area and a second area; A gold finger is arranged on the first area, and a circuit layer is arranged on the second area; And a solder mask layer is provided on at least the circuit layer.

9. A computer-readable storage medium having a computer program stored thereon, the computer-readable storage medium being applied to a computer product, the computer product comprising: A processor, a communication interface and a communication bus, wherein the processor, the communication interface and the computer-readable storage medium communicate with each other through the communication bus, wherein when the computer program is executed by the processor, the steps of the method for manufacturing a circuit board according to any one of claims 1 to 7 are implemented, and the method for manufacturing a circuit board comprises: A substrate is provided, and at least one first area and at least one second area are arranged on the substrate; the first area is used to arrange gold fingers of a circuit board, and the second area is used to arrange a circuit layer of the circuit board; Arranging the gold finger on the first area, and arranging a circuit layer on the second area; The substrate or the solder mask to be provided on the substrate is used as a processing target; Acquire a corresponding processing strategy according to the processing target, and process the processing target according to the processing strategy so that the contact area between the gold finger and the solder mask to be set is within a preset area; Arranging the solder mask to be arranged on the substrate to obtain a circuit board; Wherein, obtaining a corresponding processing strategy according to the processing target includes: When the processing target is the solder mask to be set, determining the position of the first area on the substrate; The solder mask to be set is subjected to window opening processing according to the determined position.

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