Coaxial line and method for manufacturing the same

Abstract

The embodiment of the present invention provides a coaxial line and a manufacturing method of the coaxial line, wherein the coaxial line includes an inner conductor and an insulating medium, a copper foil, an outer conductor and a sheath sequentially coated on the inner conductor from the inside to the outside, and an organic soldering film is formed on the surface of the copper foil. Thus, the organic soldering film can maintain the flatness of the copper foil surface and prevent the copper foil surface from being oxidized, thereby enhancing the corrosion resistance of the copper foil and ensuring the reliability of the coaxial line signal transmission.

Description

Technical Field

[0001] The present invention relates to the technical field of transmission lines, and in particular to a coaxial line and a manufacturing method of the coaxial line. Background Art

[0002] Coaxial cable is a common signal transmission line, in which the outer conductor can not only conduct low-level signals through the transmission loop, but also play a shielding role. In order to improve the shielding performance of the outer conductor, a layer of copper foil is usually added between the outer conductor and the insulating medium to reduce the loss of the signal when it is transmitted in the coaxial cable. The copper foil used in the existing coaxial cable is not corrosion-resistant, which affects the reliability of signal transmission. Summary of the invention

[0003] In view of this, an object of the present invention is to provide a coaxial line and a method for manufacturing the coaxial line, which enhances the corrosion resistance of the copper foil by improving the structure of the copper foil.

[0004] In a first aspect, an embodiment of the present invention provides a coaxial line, the coaxial line comprising:

[0005] Inner conductor;

[0006] An insulating medium, coated on the outer circumference of the inner conductor;

[0007] A copper foil is coated on the outer peripheral side of the insulating medium, and at least one layer of organic solderability film is formed on the surface of the copper foil;

[0008] an outer conductor, coated on the outer peripheral side of the copper foil; and

[0009] The sheath is covered on the outer circumference of the outer conductor.

[0010] Furthermore, the inner conductor includes copper wire or copper-clad aluminum wire.

[0011] Furthermore, the inner conductor includes a silver-plated soft copper wire or a tin-plated soft copper wire.

[0012] Furthermore, the outer conductor is configured as a composite structure of a braided mesh and a longitudinally wrapped aluminum-plastic composite tape.

[0013] Furthermore, the braided mesh is made of silver-plated soft copper wire or tin-plated soft copper wire.

[0014] Furthermore, the copper foil includes pure copper foil or composite copper foil.

[0015] Furthermore, the composite copper foil includes a copper foil layer located on the inner side and a composite film layer located on the outer side.

[0016] Furthermore, the insulating medium is made of high-density plastic material;

[0017] The high-density plastic material contains a flame retardant and an anti-aging agent.

[0018] Further, the sheath is made of thermoplastic plastic material;

[0019] The thermoplastic plastic material contains a flame retardant and an anti-aging agent.

[0020] Furthermore, the thickness of the organic solderability protection film is 0.25-0.6 micrometers.

[0021] In a second aspect, an embodiment of the present invention further provides a method for manufacturing a coaxial line, the manufacturing method comprising:

[0022] Providing an inner conductor and covering the outer circumference of the inner conductor with an insulating medium;

[0023] Prepare organic flux;

[0024] Providing a copper foil, and using the organic solder preservative to perform surface treatment on the copper foil, so as to form an organic solder preservative film on the surface of the copper foil;

[0025] Coating the copper foil having the organic solder-protective film on the outer peripheral side of the insulating medium;

[0026] Covering an outer conductor on the outer peripheral side of the copper foil having the organic solderability film;

[0027] A sheath is coated on the outer circumference of the outer conductor.

[0028] Furthermore, using the organic solder preservative to perform surface treatment on the copper foil comprises:

[0029] The organic solder preservative covers the surface of the copper foil.

[0030] Further, covering the surface of the copper foil with the organic solder preservative comprises:

[0031] The copper foil is immersed in the organic soldering agent.

[0032] Further, covering the surface of the copper foil with the organic solder preservative comprises:

[0033] The organic soldering agent is evenly sprayed onto the surface of the copper foil.

[0034] Further, covering the surface of the copper foil with the organic solder preservative comprises:

[0035] The organic soldering agent is evenly applied to the surface of the copper foil.

[0036] Further, providing the copper foil includes:

[0037] The surface of the copper foil is degreased and micro-etched, and then cleaned with deionized water.

[0038] Further, the organic flux is prepared to include:

[0039] Provide stock solution;

[0040] Calculating the concentration of the active ingredient in the stock solution;

[0041] The concentration of the active ingredient in the stock solution is adjusted to 41.2%-52.4% to obtain the organic soldering agent.

[0042] Further, measuring the concentration of the active ingredient in the stock solution includes:

[0043] Detecting the absorbance of the stock solution by an optical instrument;

[0044] The concentration of the active ingredient in the stock solution is calculated according to the absorbance of the stock solution.

[0045] Furthermore, the preparation of the organic flux further comprises:

[0046] When the concentration of the active ingredient in the organic flux is greater than 52.4%, adding pure water; and

[0047] When the concentration of the active ingredient in the organic solder preservative is less than 47.4%, the concentrated solution is added.

[0048] Furthermore, the preparation of the organic flux further comprises:

[0049] Detecting the pH value of the organic flux;

[0050] The pH value of the organic flux is adjusted to 2.6-3.5.

[0051] Furthermore, the preparation of the organic flux further comprises:

[0052] Performing surface treatment on the test piece using the organic solder preservative;

[0053] The thickness of the solder preservation film formed on the surface of the test piece is measured.

[0054] Further, measuring the thickness of the solder protection film formed on the surface of the test piece includes:

[0055] Treating the test piece with the solder-preserving film formed on the surface with 5% hydrochloric acid;

[0056] Taking out the treated test piece, and detecting the absorbance of the remaining solution by an optical instrument;

[0057] The thickness of the solder-preserving film formed on the surface of the test piece is calculated according to the absorbance of the remaining solution.

[0058] The embodiment of the present invention provides a coaxial line and a manufacturing method of the coaxial line, wherein the coaxial line includes an inner conductor and an insulating medium, a copper foil, an outer conductor and a sheath sequentially coated on the inner conductor from the inside to the outside, and an organic soldering film is formed on the surface of the copper foil. Thus, the organic soldering film can maintain the flatness of the copper foil surface and prevent the copper foil surface from being oxidized, thereby enhancing the corrosion resistance of the copper foil and ensuring the reliability of the coaxial line signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0059] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0060] Figure 1 is a cross-sectional schematic diagram of a coaxial line provided by an embodiment of the present invention;

[0061] Figure 2 is a schematic cross-sectional view of a pure copper foil provided by an embodiment of the present invention;

[0062] Figure 3 is a schematic cross-sectional view of a composite copper foil provided by an embodiment of the present invention;

[0063] Figure 4 It is a schematic flow chart of a method for manufacturing a coaxial line provided by an embodiment of the present invention;

[0064] Figure 5 It is a schematic diagram of a process for preparing an organic flux according to an embodiment of the present invention;

[0065] Figure 6 It is a schematic diagram of a process for measuring the concentration of an active ingredient in a stock solution provided by an embodiment of the present invention;

[0066] Figure 7 It is a schematic diagram of a process for measuring the thickness of a solder preservation film formed on the surface of a test piece provided by an embodiment of the present invention;

[0067] Figure 8 The present invention provides a schematic diagram of a process of providing a copper foil and performing surface treatment on the copper foil using an organic solder preservative, as provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0068] The present invention is described below based on embodiments, but the present invention is not limited to these embodiments. In the detailed description of the present invention below, some specific details are described in detail. It is possible for a person skilled in the art to fully understand the present invention without the description of these details. In order to avoid confusing the essence of the present invention, known methods, processes, flows, components and circuits are not described in detail.

[0069] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0070] Unless the context clearly requires otherwise, words such as “include”, “including” and the like in the specification should be interpreted as including rather than being exclusive or exhaustive; that is, as meaning “including but not limited to”.

[0071] In the description of the present invention, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0072] Figure 1 is a cross-sectional schematic diagram of a coaxial line provided by an embodiment of the present invention, such as Figure 1 As shown, the coaxial line includes, from the inside to the outside, an inner conductor 1, an insulating medium 2 coated on the outer peripheral side of the inner conductor 1, a copper foil 3 coated on the outer peripheral side of the insulating medium 2, an outer conductor 4 coated on the outer peripheral side of the copper foil 3, and a sheath 5 coated on the outer peripheral side of the outer conductor 4. Among them, an organic soldering film a is formed on the surface of the copper foil 3, which achieves the effect of maintaining the surface flatness of the copper foil 3 and preventing the surface of the copper foil 3 from being oxidized. The corrosion resistance of the copper foil 3 is enhanced by the organic soldering film a, thereby ensuring the reliability of the coaxial line signal transmission. In one embodiment, the thickness of the organic soldering film a is 0.25-0.6 microns, so that it achieves an excellent protection effect on the copper foil 3. As an optional embodiment, the thickness of the organic soldering film a is 0.4 microns, and the organic soldering film a of this thickness has the best protection effect on the copper foil 3.

[0073] Furthermore, the main material of the inner conductor 1 is copper, and the inner conductor 1 conducts the high level through the transmission loop. In one embodiment, the inner conductor 1 includes copper wire or copper-clad aluminum wire. It should be noted that copper wire and copper-clad aluminum wire are usually used in small cables. Copper wire has the advantages of high strength, low resistance and long service life, and copper-clad aluminum wire has the advantages of low cost and easy maintenance.

[0074] As an optional embodiment, the inner conductor 1 includes a silver-plated soft copper wire or a tin-plated soft copper wire, which has excellent conductivity, corrosion resistance, and oxidation resistance compared to a bare copper wire, and helps to extend the service life of the coaxial cable.

[0075] In one embodiment, the insulating medium 2 is made of a high-density plastic material (e.g., HDPE, PP, etc.) to improve the anti-interference performance and prevent water and oxygen from corroding the inner conductor 1. Furthermore, the high-density plastic material also contains additives such as flame retardants and anti-aging agents. It should be noted that the flame retardant is a non-halogen flame retardant (including one or more of aluminum hydroxide, magnesium hydroxide, aluminum hydroxyoxalate, red phosphorus, borate, antimony oxide and anhydrous magnesium carbonate), which has the advantages of small addition amount, high flame retardant efficiency, low smoke, low toxicity, etc.

[0076] It should be noted that the copper foil 3 in this embodiment includes a pure copper foil 31 or a composite copper foil 32. Figure 2-3 As shown. Among them, a layer of organic solder-protective film a is formed on both sides of the copper surface of the pure copper foil 31. In one embodiment, the composite copper foil 32 includes a copper foil layer 321 located on the inner side and a composite film layer 322 located on the outer side, and a layer of organic solder-protective film a is formed on the surface of the copper foil layer 321. The composite copper foil 32 can improve the comprehensive performance of the copper foil 3 by adding a layer of composite film.

[0077] In this embodiment, the composite film layer 322 may be, but is not limited to, a PET film. When the composite film layer is a PET film, it may be further bonded to one side of the copper foil layer 321 by means of adhesive bonding. Since the organic solder-protecting film has the effects of corrosion resistance and oxidation resistance, the PET film may be provided to reduce radiation loss and reduce interference from the outside. In other embodiments, the composite film layer 322 may be, but is not limited to, a fluorinated ethylene propylene film layer or a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer film layer or a polytetrafluoroethylene film layer or an ethylene and tetrafluoroethylene copolymer film layer. In this embodiment, the composite film layer 322 is mainly a fluoroplastic film layer, and the fluoroplastic film layer is a soft plastic layer with good temperature resistance, thereby improving structural stability.

[0078] In one embodiment, the outer conductor 4 is configured as a braided mesh and an aluminum-plastic composite tape longitudinally wrapped structure, which has the advantages of good flexibility, light weight, and reliable joints. The outer conductor 4 can not only conduct low levels through the transmission loop, but also play a shielding role. In this embodiment, the outer conductor 4 can effectively improve the shielding performance by adopting a reasonable composite structure. As an optional embodiment, the braided mesh is made of silver-plated soft copper wire or tin-plated soft copper wire, which has excellent conductivity, corrosion resistance, and oxidation resistance compared to bare copper wire, which helps to extend the service life of the coaxial line.

[0079] In one embodiment, the sheath 5 is made of a thermoplastic plastic material (such as PE, PP, etc.) to protect the wire body. Furthermore, the thermoplastic plastic material also contains additives such as flame retardants and anti-aging agents. It should be noted that the flame retardant is a non-halogen flame retardant (including one or more of aluminum hydroxide, magnesium hydroxide, hydroxy aluminum oxalate, red phosphorus, borate, antimony oxide and anhydrous magnesium carbonate), which has the advantages of small addition amount, high flame retardant efficiency, low smoke, low toxicity, etc.

[0080] The coaxial line provided in this embodiment includes an inner conductor 1, and an insulating medium 2, a copper foil 3, an outer conductor 4 and a sheath 5 sequentially coated on the inner conductor 1 from the inside to the outside, and an organic solder-protecting film a is formed on the surface of the copper foil 3. Thus, the organic solder-protecting film a can maintain the flatness of the surface of the copper foil 3, and can prevent the surface of the copper foil 3 from being oxidized, thereby enhancing the corrosion resistance of the copper foil 3 and ensuring the reliability of the coaxial line signal transmission.

[0081] Figure 4 FIG. 1 is a flow chart of a method for manufacturing a coaxial line provided by an embodiment of the present invention. Figure 4 As shown, the manufacturing method of the coaxial line includes the following steps:

[0082] S1. Provide an inner conductor and coat an insulating medium on the outer peripheral side of the inner conductor. The main material of the inner conductor is copper. In one embodiment, the inner conductor includes copper wire or copper-clad aluminum wire. It should be noted that copper wire and copper-clad aluminum wire are usually used in small cables. Copper wire has the advantages of high strength, low resistance and long service life, and copper-clad aluminum wire has the advantages of low cost and easy maintenance. As an optional embodiment, the inner conductor includes silver-plated soft copper wire or tin-plated soft copper wire, which has excellent conductivity, corrosion resistance and oxidation resistance compared with bare copper wire, which helps to extend the service life of the coaxial cable.

[0083] In one embodiment, the insulating medium is made of a high-density plastic material (e.g., HDPE, PP, etc.) to improve anti-interference performance and prevent water and oxygen from corroding the inner conductor. Furthermore, the high-density plastic material also contains additives such as flame retardants and anti-aging agents. It should be noted that the flame retardant is a non-halogen flame retardant (including one or more of aluminum hydroxide, magnesium hydroxide, hydroxy aluminum oxalate, red phosphorus, borate, antimony oxide and anhydrous magnesium carbonate), which has the advantages of small addition amount, high flame retardant efficiency, low smoke, low toxicity, etc.

[0084] S2. Prepare the organic flux preservative. In order to maintain the best effect of the organic flux preservative, the organic flux preservative needs to be prepared so that the content of the active ingredient, the pH value, etc. are controlled within the effective range.

[0085] S3. Provide copper foil, and use an organic soldering agent to surface treat the copper foil so that an organic soldering film is formed on the surface of the copper foil. It should be noted that the organic soldering agent can react with the metallic copper on the surface of the copper foil to form an organic metal bond, thereby thickening under the action of organic compounds to form a qualified organic soldering film. The organic soldering film can prevent copper from being oxidized, thereby enhancing the corrosion resistance of the copper foil. Among them, the copper foil can be a pure copper foil or a composite copper foil. The composite copper foil includes a copper foil layer and a composite film layer, and the composite copper foil can improve the comprehensive performance of the copper foil by adding a layer of composite film. Therefore, by using an organic soldering agent to surface treat the pure copper foil, a layer of organic soldering film can be formed on both sides of the pure copper foil. Similarly, by using an organic soldering agent to surface treat the composite copper foil, a layer of organic soldering film can be formed on the surface of one side of the copper foil layer.

[0086] S4, coating the outer peripheral side of the insulating medium with a copper foil having an organic solder-protecting film. It should be noted that when the copper foil is a composite copper foil, in order to make the manufactured coaxial line have excellent comprehensive performance, the copper foil layer of the composite copper foil faces inward, that is, the composite film layer faces outward.

[0087] S5. Wrap the outer conductor on the outer peripheral side of the copper foil with organic solder-protecting film. The outer conductor is configured as a composite structure of a braided mesh and an aluminum-plastic composite tape longitudinally wrapped, which has the advantages of good flexibility, light weight, and reliable joints. The outer conductor can effectively improve the shielding performance by adopting a reasonable composite structure. As an optional implementation, the braided mesh is made of silver-plated soft copper wire or tin-plated soft copper wire, which has excellent conductivity, corrosion resistance, and oxidation resistance compared to bare copper wire, and helps to extend the service life of the coaxial line.

[0088] S6. Cover the outer circumference of the outer conductor with a sheath. The sheath is made of a thermoplastic plastic material (such as PE, PP, etc.) to protect the wire body. Furthermore, the thermoplastic plastic material also contains additives such as flame retardants and anti-aging agents. It should be noted that the flame retardant is a non-halogen flame retardant (including one or more of aluminum hydroxide, magnesium hydroxide, aluminum hydroxy oxalate, red phosphorus, borate, antimony oxide and anhydrous magnesium carbonate), which has the advantages of small addition amount, high flame retardant efficiency, low smoke and low toxicity.

[0089] Figure 5 1 is a schematic diagram of a process for preparing an organic flux according to an embodiment of the present invention, such as Figure 5 As shown, step S2 includes:

[0090] S21. Provide a stock solution. It should be noted that the stock solution contains organic film-forming substances, including imidazole compounds. Among them, the imidazole compounds can be imidazole, alkyl imidazole, benzimidazole or alkylbenzimidazole and its derivatives. The stock solution needs to avoid mixing with water containing sodium, magnesium, potassium, calcium and their metal ions, as well as acids, alkalis or halogens, and needs to avoid being placed in a place exposed to direct sunlight and a high temperature and humid environment to ensure that the stock solution can be formulated into a qualified organic solder paste.

[0091] S22, measuring the concentration of the active ingredient in the stock solution. It should be noted that in order to control the content of the active ingredient in the prepared organic flux within an effective range, the concentration of the active ingredient in the stock solution needs to be measured so that subsequent adjustments can be made according to the concentration of the active ingredient in the stock solution.

[0092] S23, adjusting the concentration of the active ingredient in the stock solution to 41.2%-52.4% to obtain an organic soldering agent. It is easy to understand that the content of the active ingredient in the prepared organic soldering agent is 41.2%-52.4%, and within this range, the organic soldering agent can achieve an excellent film-forming effect. As an optional embodiment, adjusting the concentration of the active ingredient in the stock solution to 50% can enable the prepared organic soldering agent to achieve the best film-forming effect. It should be noted that the prepared organic soldering agent needs to be contained in plastic products such as PE.

[0093] Figure 6 : is a schematic diagram of a process for measuring the concentration of an active ingredient in a stock solution provided by an embodiment of the present invention, such as Figure 6 As shown, step S22 includes:

[0094] S221. Detect the absorbance of the stock solution by an optical instrument. The absorbance refers to the difference between the incident light intensity (I0) before the light passes through the solution and the transmitted light intensity (I t ) ratio (i.e. I0 / I t )'s base 10 logarithm (lg(I0 / I t )). It should be noted that, in the present embodiment, the optical instrument is a spectrophotometer, also known as a spectrometer, which measures the absorption spectrum of the solution by ultraviolet light, visible light, infrared light and laser, so as to perform qualitative and quantitative analysis on the solution by the absorption spectrum.

[0095] As an optional embodiment, the optical instrument is a UV-visible spectrophotometer. When testing, 1 ml of the stock solution is diluted to 250 ml for subsequent test calculations. After the UV-visible spectrophotometer is preheated, the test wavelength is adjusted to 270 nanometers and then zeroed with pure water. The diluted stock solution is placed in the test, and the transmittance (i.e., I t / I0) or absorbance.

[0096] S222. Calculate the concentration of the active ingredient in the stock solution based on the absorbance of the stock solution. It should be noted that according to the Lambert-Beer law, when a beam of parallel monochromatic light is vertically irradiated onto a uniform, non-scattering colored sample solution, the absorbance of the solution is directly proportional to the optical path (i.e., the thickness of the solution layer) and the concentration of the solution. That is, A=lg(1 / T)=Kbc. Among them, A is the absorbance, T is the transmittance, K is the proportional constant, b is the solution thickness, and c is the solution concentration. Among them, the K value is related to the properties of the solution and the wavelength of the incident light. Therefore, the concentration of the active ingredient in the stock solution can be calculated based on the measured absorbance.

[0097] In one embodiment, step S2 further includes:

[0098] S24. When the concentration of active ingredients in the organic flux is greater than 52.4%, pure water is added. It is easy to understand that during the preparation, storage or use process, the concentration of active ingredients in the organic flux will increase due to water evaporation and other reasons. When the concentration increases to more than 52.4%, it will affect the film-forming effect, and pure water needs to be added to reduce the concentration to ensure the best film-forming effect.

[0099] S25. When the concentration of the active ingredient in the organic soldering agent is less than 47.4%, add the concentrate. It is easy to understand that the concentration of the active ingredient in the organic soldering agent will decrease due to consumption. When the concentration is reduced to less than 47.4%, the concentration can be increased by adding the concentrate to ensure the best film-forming effect. It should be noted that when the concentration of the active ingredient is less than 41.2%, the organic soldering agent has been seriously contaminated or the effect has been seriously affected, and it can be redeployed.

[0100] It should be noted that the pH value of the organic flux also has a decisive influence on the film-forming effect. In one embodiment, step S2 further includes:

[0101] S26, detecting the pH value of the organic flux preservative. As an optional implementation, the pH value of the organic flux preservative may be measured using an instrument such as a pH meter.

[0102] S27, adjust the pH value of the organic soldering agent to 2.6-3.5. It is easy to understand that when the detected pH value is less than 2.6 or greater than 3.5, the film-forming effect will be seriously affected. Therefore, the pH value of the organic soldering agent can be adjusted to 2.6-3.5 by adding a regulating agent. It should be noted that when the pH is 3, the film-forming effect of the organic soldering agent is the best.

[0103] In one embodiment, step S2 further includes:

[0104] S28, using an organic soldering agent to perform surface treatment on the test piece. In this embodiment, the test piece is a standard bare copper plate. Specifically, after the test piece has undergone steps such as degreasing, microetching, and cleaning, it is immersed in an organic soldering agent to form a film, so as to subsequently observe the film-forming effect and measure the film thickness.

[0105] S29. Calculate the thickness of the solder film formed on the surface of the test piece. It should be noted that if the film-forming effect of the test piece is not good or the film thickness does not meet the requirements, it means that the prepared organic soldering agent is unqualified and needs to be re-prepared; if the film-forming effect of the test piece is good and the film thickness meets the requirements, the prepared organic soldering agent can be used to form a film on the copper foil that needs surface treatment. Specifically, if the thickness of the solder film is 0.25-0.6 microns, it means that the organic soldering agent is qualified.

[0106] Figure 7 1 is a schematic diagram of a process for measuring the thickness of a solder mask formed on a surface of a test piece provided by an embodiment of the present invention, such as Figure 7 As shown, step S29 includes:

[0107] S291, treating the test piece with a solder-preserving film formed on the surface with 5% hydrochloric acid. As an optional implementation, first put the test piece with a solder-preserving film formed on the surface into a clean beaker, then put a certain amount of 5% hydrochloric acid and gently shake the beaker for a certain period of time, and finally take out the treated test piece to measure the remaining solution.

[0108] S292, take out the treated test piece, and detect the absorbance of the remaining solution by an optical instrument. As an optional embodiment, the optical instrument is a UV-visible spectrophotometer. When performing the test, the UV-visible spectrophotometer is preheated and the test wavelength is adjusted to 270 nanometers, and then zeroed with 5% hydrochloric acid. The remaining solution is placed in the instrument for detection, and the transmittance or absorbance can be read.

[0109] S293. Calculate the thickness of the solder film formed on the surface of the test piece according to the absorbance of the remaining solution. It should be noted that the thickness of the solder film is proportional to the absorbance of the remaining solution. Specifically, h = C × A'. Among them, h is the thickness of the solder film, C is the film thickness coefficient, and A' is the absorbance of the remaining solution. It should be further noted that the film thickness coefficient C is inversely proportional to the absorbance A of the original solution mentioned above.

[0110] It should be noted that when the calculated film thickness does not meet the requirements, that is, the film thickness is less than 0.25 microns or greater than 0.6 microns, the organic flux preservative needs to be adjusted or readjusted. As an optional implementation, when the measured results show that the film thickness is low, the film thickness can be increased by extending the processing time, increasing the temperature of the organic flux preservative, increasing the pH value of the organic flux preservative, or increasing the concentration.

[0111] As an optional implementation, a comparison reagent with qualified concentration and pH value can be prepared by the method described above, and then the film thickness test can be performed using the comparison reagent using the test piece. If the test is qualified, an organic flux preservative for treating copper foil can be prepared under the same conditions and according to the same steps and parameters, so as to avoid contamination of the organic flux preservative when using the test piece for testing.

[0112] Figure 8 1 is a schematic diagram of a process of providing a copper foil and using an organic solder preservative to perform surface treatment on the copper foil, as provided in an embodiment of the present invention. Figure 8 As shown, the providing of copper foil in step S3 includes:

[0113] S31. After degreasing and microetching the surface of the copper foil, it is washed with deionized water. Degreasing can remove copper surface oxides and contaminants such as fingerprints and grease to obtain a clean copper surface and avoid uneven film thickness. In addition, microetching can form a relatively rough copper surface for film formation, and the thickness of microetching directly affects the film formation rate. Using deionized water to wash the copper foil can avoid contamination of the organic soldering agent, especially to avoid sulfate ions mixed in the microetching agent, thereby ensuring that the organic soldering agent continues to perform surface treatment on other copper foils. Thus, the clean copper foil after treatment can be subjected to subsequent film formation treatment.

[0114] In one embodiment, the surface treatment of the copper foil using an organic solder preservative in step S3 includes:

[0115] S32, covering the surface of the copper foil with an organic soldering agent. It is easy to understand that by covering the surface of the copper foil with an organic soldering agent, the entire surface of the copper foil can be covered with the formed organic soldering film, thereby maintaining the flatness of the copper surface and providing all-round protection for the copper foil.

[0116] In one embodiment, step S32 includes immersing the copper foil in an organic soldering agent. It should be noted that the immersion method can ensure that the organic soldering agent is in full contact with the copper foil and fully reacts, so that a qualified organic soldering film can be formed on the surface of the copper foil to effectively protect the copper foil. It should be noted that other methods can also be used to cover the organic soldering agent on the surface of the copper foil. For example, the organic soldering agent can be evenly sprayed on the surface of the copper foil, or the organic soldering agent can be evenly applied to the surface of the copper foil.

[0117] As an optional embodiment, when a spraying process is used, the organic solder preservative is sprayed in the form of an oil vapor mist, so that a single or multiple layers of organic solder preservative films can be formed in a certain proportion on a long-sized film at a specific location on the surface of the copper foil, thereby providing the manufacturer with process flexibility and protection effects. As another optional embodiment, when a coating process is used, inkjet printing, screen printing, gravure printing, offset printing, flexographic printing, slit coating, die coating, blade coating or wire rod coating can be used for coating. In this way, a single or multiple layers of organic solder preservative films can also be formed in a certain proportion on a long-sized film at a specific location on the surface of the copper foil, and the densification of the organic solder preservative film can be greatly promoted, so that a densely filled and strong organic solder preservative film can be obtained.

[0118] The manufacturing method of the coaxial line provided in this embodiment treats the surface of the copper foil by using a prepared organic soldering agent, so that an organic soldering film can be formed on the surface of the copper foil. The coaxial line manufactured in this way can reduce the loss and improve the shielding performance through the copper foil, and the organic soldering film on the surface of the copper foil can maintain the flatness of the copper foil surface and prevent the copper foil surface from being oxidized, thereby enhancing the corrosion resistance of the copper foil and ensuring the reliability of the coaxial line signal transmission.

[0119] The embodiment of the present invention provides a coaxial line and a manufacturing method of the coaxial line, wherein the coaxial line includes an inner conductor and an insulating medium, a copper foil, an outer conductor and a sheath sequentially coated on the inner conductor from the inside to the outside, and an organic soldering film is formed on the surface of the copper foil. Thus, the organic soldering film can maintain the flatness of the copper foil surface and prevent the copper foil surface from being oxidized, thereby enhancing the corrosion resistance of the copper foil and ensuring the reliability of the coaxial line signal transmission.

[0120] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A coaxial line, characterized in that: The coaxial line comprises: Inner conductor; An insulating medium, coated on the outer circumference of the inner conductor; Copper foil, coated on the outer peripheral side of the insulating medium, the copper foil includes pure copper foil or composite copper foil, both sides of the pure copper foil are formed with organic solder-protective films, the composite copper foil includes a copper foil layer located on the inner side and a composite film layer located on the outer side, the composite film layer is a PET film or a fluoroplastic film layer, the surface of the copper foil layer is formed with an organic solder-protective film, and the thickness of the organic solder-protective film is 0.25 micrometers to 0.6 micrometers; an outer conductor, coated on the outer peripheral side of the copper foil; and The sheath is covered on the outer circumference of the outer conductor.

2. The coaxial line according to claim 1, characterized in that: The inner conductor includes a copper wire or a copper-clad aluminum wire.

3. The coaxial line according to claim 2, characterized in that: The inner conductor comprises a silver-plated soft copper wire or a tin-plated soft copper wire.

4. The coaxial line according to claim 1, characterized in that: The outer conductor is configured as a composite structure of a braided mesh and an aluminum-plastic composite tape longitudinally wrapped.

5. The coaxial line according to claim 4, characterized in that: The braided mesh is made of silver-plated soft copper wire or tin-plated soft copper wire.

6. The coaxial line according to any one of claims 1 to 5, characterized in that: The insulating medium is made of high-density plastic material; The high-density plastic material contains a flame retardant and an anti-aging agent.

7. The coaxial line according to any one of claims 1 to 5, characterized in that: The sheath is made of thermoplastic plastic material; The thermoplastic plastic material contains a flame retardant and an anti-aging agent.

8. A method for manufacturing a coaxial line, characterized in that: The manufacturing method comprises: Providing an inner conductor and covering the outer circumference of the inner conductor with an insulating medium; An organic flux preservative is prepared, wherein the concentration of the active ingredient of the organic flux preservative is 41.2%-52.4%, and the pH value of the organic flux preservative is 2.6-3.5; Providing a copper foil, and using the organic soldering agent to perform surface treatment on the copper foil, so that an organic soldering film with a thickness of 0.25 micrometers to 0.6 micrometers is formed on the surface of the copper foil; Coating the copper foil having the organic solder-protective film on the outer peripheral side of the insulating medium; Covering an outer conductor on the outer peripheral side of the copper foil having the organic solderability film; Covering a sheath on the outer circumference of the outer conductor; Wherein, the copper foil is pure copper foil, and the surface treatment of the copper foil using the organic solder preservative comprises: The pure copper foil is surface treated by using an organic soldering agent to form an organic soldering film with a thickness of 0.25 micrometers to 0.6 micrometers on both sides of the pure copper foil; Alternatively, the copper foil is a composite copper foil, the composite copper foil comprises a copper foil layer located on the inner side and a composite film layer located on the outer side, the composite film layer is a PET film or a fluoroplastic film layer, and the surface treatment of the copper foil using the organic solder preservative comprises: The composite copper foil is surface treated with an organic solder preservative to form an organic solder preservative film with a thickness of 0.25 micrometers to 0.6 micrometers on the surface of one side of the copper foil layer.

9. The method for manufacturing a coaxial line according to claim 8, characterized in that: The surface treatment of the copper foil using the organic solder preservative comprises: The organic solder preservative covers the surface of the copper foil.

10. The method for manufacturing a coaxial line according to claim 9, characterized in that: Covering the surface of the copper foil with the organic solder preservative comprises: The copper foil is immersed in the organic soldering agent.

11. The method for manufacturing a coaxial line according to claim 9, characterized in that: Covering the surface of the copper foil with the organic solder preservative comprises: The organic soldering agent is evenly sprayed onto the surface of the copper foil.

12. The method for manufacturing a coaxial line according to claim 9, characterized in that: Covering the surface of the copper foil with the organic solder preservative comprises: The organic soldering agent is evenly applied to the surface of the copper foil.

13. The method for manufacturing a coaxial line according to claim 8, characterized in that: Copper foil provided includes: The surface of the copper foil is degreased and micro-etched, and then cleaned with deionized water.

14. The method for manufacturing a coaxial line according to claim 8, characterized in that: The organic flux prepared includes: Provide stock solution; Calculating the concentration of the active ingredient in the stock solution; The concentration of the active ingredient in the stock solution is adjusted to 41.2%-52.4% to obtain the organic soldering agent.

15. The method for manufacturing a coaxial line according to claim 14, characterized in that: Measuring the concentration of the active ingredient in the stock solution includes: Detecting the absorbance of the stock solution by an optical instrument; The concentration of the active ingredient in the stock solution is calculated according to the absorbance of the stock solution.

16. The method for manufacturing a coaxial line according to claim 14, characterized in that: The organic flux preparation also includes: When the concentration of the active ingredient in the organic flux is greater than 52.4%, adding pure water; and When the concentration of the active ingredient in the organic solder preservative is less than 47.4%, the concentrated solution is added.

17. The method for manufacturing a coaxial line according to claim 14, characterized in that: The organic flux preparation also includes: Detecting the pH value of the organic flux; The pH value of the organic flux is adjusted to 2.6-3.

5.

18. The method for manufacturing a coaxial line according to claim 14, characterized in that: The organic flux preparation also includes: Performing surface treatment on the test piece using the organic solder preservative; The thickness of the solder preservation film formed on the surface of the test piece is measured.

19. The method for manufacturing a coaxial line according to claim 18, characterized in that: Measuring the thickness of the solder protection film formed on the surface of the test piece includes: Treating the test piece with the solder-preserving film formed on the surface with 5% hydrochloric acid; Taking out the treated test piece, and detecting the absorbance of the remaining solution by an optical instrument; The thickness of the solder-preserving film formed on the surface of the test piece is calculated according to the absorbance of the remaining solution.

Images