Electronic Devices

Abstract

The present invention discloses an electronic device, comprising a maintenance layer, a plurality of substrates, a plurality of photoelectric units, a plurality of signal layers, a plurality of drive structures and a restraint structure. The substrates are arranged on the contact surface of the maintenance layer, the first end edge of at least one substrate is close to the first end edge of the maintenance layer, and the first side edge of one substrate is close to the second side edge of another substrate. The photoelectric units are arranged on the first surface and / or the second surface of the substrates. The signal layers are arranged on the substrates and electrically connected to the photoelectric units. The drive structures are electrically connected to the substrates and are close to the first end edge and / or the second end edge of the maintenance layer, and are electrically connected to the photoelectric units through the signal layers. The restraint structure restrains the first end edge or the second end edge of the maintenance layer, and at least one of the drive structures is accommodated in the restraint structure.

Description

Technical Field

[0001] The invention relates to an electronic device, in particular to an elastically spliced ​​electronic device. Background Art

[0002] In the manufacture of traditional electronic devices, such as optoelectronic devices, multiple thin film transistors are made on a substrate to form a thin film transistor substrate, and then the thin film transistors are used to drive the corresponding optoelectronic components. Taking light-emitting diode display devices as an example, if there are multiple different product sizes or functions, this method of using thin film transistors to drive light-emitting diodes to emit light must design corresponding thin film processes for each product size or function of the light-emitting diode device, and expensive thin film transistor processes / masks / substrates / materials are required, which is very unfavorable to the changing product needs and is also quite inflexible in application. Summary of the invention

[0003] The purpose of the present invention is to provide an electronic device with simple process, customizable and flexible assembly to produce any size required by customers.

[0004] To achieve the above-mentioned purpose, an electronic device according to the present invention includes a maintenance layer, a plurality of substrates, a plurality of optoelectronic units, a plurality of signal layers, a plurality of drive structures and a restraining structure. The maintenance layer is defined with corresponding first and second end edges, corresponding first and second side edges, and corresponding contact surfaces and non-contact surfaces; the substrates are arranged on the contact surface of the maintenance layer, and each substrate is defined with corresponding first and second end edges, corresponding first and second side edges, and corresponding first and second surfaces; wherein the first end edge of at least one substrate is close to the first end edge of the maintenance layer, and the first side edge of one substrate is close to the second side edge of another substrate; the optoelectronic units are arranged on the first surface and / or the second surface of the substrates, and each optoelectronic unit has an optoelectronic component; the signal layers are arranged on the substrates and electrically connected to the optoelectronic units; the drive structures are electrically connected to the substrates, and the drive structures are close to the first and / or second end edges of the maintenance layer, and are electrically connected to the optoelectronic units through the signal layers; the restraining structure restrains the first end edge or the second end edge of the maintenance layer, and at least one of the drive structures is accommodated in the restraining structure.

[0005] In one embodiment, a first edge of each substrate is proximate to a first edge of the sustaining layer, and a second edge of each substrate is proximate to a second edge of the sustaining layer.

[0006] In one embodiment, the electronic device further defines a plurality of substrate units; wherein each substrate unit is composed of two substrates; in two adjacent substrate units, the first side edge of each substrate of one substrate unit is adjacent to the second side edge of each substrate of another substrate unit; in each substrate unit, the first end edge of one substrate is adjacent to the first end edge of the maintaining layer, wherein the first end edge of another substrate is adjacent to the second end edge of the maintaining layer, and the second end edge of one substrate is adjacent to the second end edge of another substrate.

[0007] In one embodiment, each substrate unit includes two driving structures, which are respectively arranged on two substrates; one of the driving structures is adjacent to the first end edge of one of the substrates, and the other driving structure is adjacent to the first end edge of the other substrate, and one of the two driving structures is accommodated in the restraint structure.

[0008] In one embodiment, each substrate unit is composed of a plurality of substrates whose number is equal to or greater than 2 among these substrates; in two adjacent substrate units, the first side edge of each substrate of one substrate unit is adjacent to the second side edge of each substrate of the other substrate unit; in each substrate unit, the first end edge of one substrate is close to the first end edge of the maintaining layer, and the second end edge of the other substrate is close to the second end edge of the maintaining layer; these driving structures are arranged on these substrate units.

[0009] In one embodiment, each optoelectronic unit further has a carrier and a primary signal layer arranged on the carrier, the optoelectronic component is arranged on the carrier and electrically connected to the secondary signal layer; in each substrate unit, the secondary signal layer of one optoelectronic unit is electrically connected to the signal layers of two adjacent substrates.

[0010] In one embodiment, these driving structures are respectively arranged on these substrates; in each substrate unit, each driving structure is connected to the first end edge or the second end edge of the corresponding substrate and extends to overlap to another adjacent substrate; or, each driving structure is connected to and perpendicular to the first end edge or the second end edge of the corresponding substrate; or, each driving structure is connected to the first end edge or the second end edge of the corresponding substrate and folded back to the corresponding substrate along an angle.

[0011] In one embodiment, each optoelectronic unit further has a carrier and a primary signal layer disposed on the carrier, and the optoelectronic component is disposed on the carrier and electrically connected to the secondary signal layer.

[0012] In one embodiment, each carrier board is a flexible board.

[0013] In one embodiment, the electronic device further includes a plurality of active components disposed on the substrates or the carriers, and the active components are electrically connected to the optoelectronic components of the optoelectronic units respectively.

[0014] In one embodiment, each optoelectronic unit has a plurality of optoelectronic components.

[0015] In one embodiment, each substrate is a flexible board.

[0016] In one embodiment, each driving structure includes a thin film transistor or a silicon chip.

[0017] In one embodiment, the maintenance layer is a glass substrate, a flexible substrate, or a protective film.

[0018] In one embodiment, an optoelectronic component is located between each substrate and the sustaining layer.

[0019] In one embodiment, the restraint structure is a support seat having a receiving groove, and the second end edge of the maintaining layer is inserted into the receiving groove.

[0020] In one embodiment, the restraint structure is a rolling bar having a receiving groove, and the first end edge of the maintenance layer is positioned in the receiving groove.

[0021] In one embodiment, each substrate defines a width W and a length L, the number of these substrates arranged along the first side edge to the second side edge of the maintenance layer is N, the number of these substrates arranged along the first end edge to the second end edge of the maintenance layer is M, ML:NW=9:16.

[0022] As mentioned above, in the electronic device of the present invention, by designing the configuration, connection and relative relationship of the components such as the maintenance layer, multiple substrates, multiple optoelectronic units, multiple signal layers, multiple drive structures and restraint structures, the present invention can be customized according to the needs of the user, so as to flexibly splice an electronic device of any size required by the customer. The process of the electronic device of the present invention is quite simple, and it has flexibility in application and can be applied to various product requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1A and Figure 1B The figures are respectively a combined schematic diagram and an exploded schematic diagram of an electronic device according to an embodiment of the present invention.

[0024] Figure 1C for Figure 1A Schematic diagram of a front view of an electronic device.

[0025] Figure 2 and Figure 3 They are front view schematic diagrams of electronic devices according to different embodiments of the present invention.

[0026] FIG. 4A to FIG. 4C Schematic diagrams of the configuration of substrates and corresponding driving structures according to different embodiments of the present invention.

[0027] Figure 5Aand Figure 5B They are front schematic views of an electronic device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0028] The electronic devices according to some embodiments of the present invention will be described below with reference to the relevant drawings, wherein the same components will be described with the same reference symbols.

[0029] Figure 1A and Figure 1B 1 and 2 are respectively a combined schematic diagram and an exploded schematic diagram of an electronic device according to an embodiment of the present invention, and Figure 1C for Figure 1A Schematic diagram of a front view of an electronic device.

[0030] like Figures 1A to 1C As shown, the electronic device 1 of this embodiment includes a maintenance layer 11 , a plurality of substrates 12 , a plurality of photoelectric units 13 , a plurality of signal layers (not shown), a plurality of driving structures 15 and a restraining structure 16 .

[0031] The maintenance layer 11 is defined with corresponding first end edge E1 and second end edge E2, corresponding first side edge S1 and second side edge S2, and corresponding contact surface T1 and non-contact surface T2. In the present embodiment, the first end edge E1 of the maintenance layer 11 is its upper edge, the second end edge E2 is its lower edge, the first side edge S1 is its left edge, the second side edge S2 is its right edge, the contact surface T1 is the surface facing the substrate 12 and connected to the substrate 12, and the non-contact surface T2 is the surface of the maintenance layer 11 away from the substrate 12.

[0032] A plurality of substrates 12 are arranged on the contact surface T1 of the maintenance layer 11. Each substrate 12 is defined with a corresponding first end edge E3 and a second end edge E4, a corresponding first side edge S3 and a second side edge S4, and a corresponding first surface T3 and a second surface T4. In this embodiment, the first end edge E3 of each substrate 12 is the upper edge of the substrate 12, the second end edge E4 of each substrate 12 is the lower edge of the substrate 12, the first side edge S3 of each substrate 12 is the left edge of the substrate 12, and the second side edge S4 of each substrate 12 is the right edge of the substrate 12. Therefore, the first end edge E3 of each substrate 12 corresponds to the first end edge E1 of the maintenance layer 11, and the second end edge E4 of each substrate 12 corresponds to the second end edge E2 of the maintenance layer 11. In addition, the first surface T3 of each substrate 12 of the present embodiment is the surface of the substrate 12 facing the maintenance layer 11, and the second surface T4 of each substrate 12 is the surface of the substrate 12 away from the maintenance layer 11, but this is not limited to it. In different embodiments, the first surface T3 of each substrate 12 may be the surface of the substrate 12 away from the maintenance layer 11, and the second surface T4 of each substrate 12 may be the surface of the substrate 12 facing the maintenance layer 11.

[0033] The first end edge E3 of at least one substrate 12 is close to the first end edge E1 of the maintenance layer 11, and the first side edge S3 of one of the substrates 12 is close to the second side edge S4 of another substrate 12. In this embodiment, each substrate 12 is a long strip substrate, wherein the first end edge E3 of each substrate 12 is close to the first end edge E1 of the maintenance layer 11, and the second end edge E4 of each substrate 12 is close to the second end edge E2 of the maintenance layer 11, and in addition, the side edges of these substrates 12 are also connected to each other. Here, the side edges of these substrates 12 are connected to each other, which means that the second side edge S4 of a substrate 12 is connected to the first side edge S3 of the substrate on the right side, and at the same time, the first side edge S3 of the substrate 12 is connected to the second side edge S4 of the substrate on the left side, so that these substrates 12 are closely spliced ​​to each other laterally to form a large substrate, so that they can be flexibly spliced ​​into any size desired by the user. It is worth mentioning that in the electronic device 1 of this embodiment, the electrical properties of two substrates 12 adjacent to each other laterally may not be connected.

[0034] In some embodiments, the maintenance layer 11 and / or each substrate 12 may be a rigid substrate, a flexible substrate, or a combination thereof (e.g., a flexible substrate is superimposed on a rigid substrate). The rigid substrate is, for example, but not limited to, a glass substrate, and the flexible substrate is, for example, but not limited to, a polyimide (PI) substrate. In some embodiments, the maintenance layer 11 may also be a protective film or other functional film layer applied to these substrates 12, without limitation. The maintenance layer 11 of the electronic device 1 of this embodiment is a glass substrate, and each substrate 12 is, for example, a PI substrate.

[0035] These photoelectric units 13 are arranged on the first surface T3 and / or the second surface T4 of these substrates 12, that is, these photoelectric units 13 are arranged on at least one of the first surface T3 and the second surface T4 of each substrate 12, wherein each photoelectric unit 13 has at least one photoelectric component (may be one or more, not shown). In this embodiment, a plurality of (for example but not limited to 8) photoelectric units 13 are arranged on the first surface T3 of each substrate 12 facing the maintenance layer 11 as an example. Since the photoelectric components of each photoelectric unit 13 of this embodiment are located between each substrate 12 and the maintenance layer 11, and the photoelectric components emit light toward the maintenance layer 11, the non-contact surface T2 of the maintenance layer 11 can be the display surface of the electronic device 1.

[0036] Specifically, the photovoltaic units 13 (photovoltaic components) of this embodiment are disposed between the substrates 12 and the maintenance layer 11. Therefore, in addition to being a supporting substrate (hard board) for the photovoltaic units 13 and the substrates 12, the maintenance layer 11 can also be used as a protective cover plate (e.g., a front cover plate) to protect the photovoltaic units 13, thereby preventing foreign matter from invading and destroying their characteristics. In different embodiments, the photovoltaic units 13 can also be arranged on the second surfaces T4 of the substrates 12, or the photovoltaic units 13 can be arranged on two opposite surfaces (the first surface T3 and the second surface T4) of the substrates 12 at the same time, and the present invention is not limited thereto. When these photoelectric units 13 are arranged on the first surface T3 or the second surface T4 of these substrates 12, the electronic device 1 can be a single-sided photoelectric device; when these photoelectric units 13 are arranged on the first surface T3 or the second surface T4 of these substrates 12, the electronic device 1 can be a double-sided photoelectric device by adjusting the light-emitting direction of the photoelectric components; when these photoelectric units 13 are arranged on the first surface T3 and the second surface T4 of these substrates 12, the electronic device 1 can be a double-sided photoelectric device.

[0037] In some embodiments, the ratio of the lateral width of the substrate 12 to the lateral width of the photoelectric unit 13 may be equal to or greater than 1; and the ratio of the lateral width of the sustaining layer 11 to the lateral width of the substrate 12 may also be equal to or greater than 1. Figure 1C Each substrate 12 may be defined as having a width W and a length L. The number of these substrates 12 arranged along the first side edge S1 to the second side edge S2 of the maintenance layer 11 is N, and the number of these substrates 12 arranged along the first end edge E1 to the second end edge E2 of the maintenance layer 11 is M. In some embodiments, ML:NW=9:16. Figure 1C For example, the above-mentioned "width" can be the lateral (horizontal) width, and the "length" can be the vertical (vertical) length. It can be understood from the above-mentioned disclosure that ML:NW=9:16 is just an example, and the electronic device 1 proposed in this embodiment can be customized to achieve the required size ratio through elastic splicing. In other words, the process of the electronic device 1 of the present invention is quite simple, and it can be customized according to the needs of the user to flexibly splice any size required by the customer.

[0038] In some embodiments, the layout shape of the aforementioned photoelectric units 13 may be, for example, a rectangle, a strip, a polygon (such as a quadrilateral), a circle, an ellipse or an irregular shape; or, the layout of these photoelectric units 13 may be in an array, which is not limited here. In addition, the photoelectric components of each photoelectric unit 13 are self-luminous components, such as but not limited to light-emitting diode chips (LED chips), milli-light-emitting diode chips (miniLED chips), micro-light-emitting diode chips (microLED chips) or their packages, or light-emitting chips or packages with unlimited sizes of millimeters, micrometers or below. Here, the millimeter-level package may include a micrometer-level chip, or the micrometer-level package includes a nanometer-level chip. The aforementioned chip may be a grain of a horizontal electrode, a flip-chip electrode, or a vertical electrode, and is electrically connected to the circuit layer arranged on the substrate 12 by wire bonding or flip chip bonding. The aforementioned package is not limited to a package with active components or a passive package without active components. The active components are, for example but not limited to, thin film transistors (TFT) or silicon integrated circuits (Silicon IC).

[0039] These signal layers are arranged on these substrates 12 and electrically connected to these optoelectronic units 13. In some embodiments, these signal layers can be arranged on the first surface T3 or the second surface T4 of these substrates 12, or the signal layers can be arranged on the first surface T3 and the second surface T4 at the same time, or these signal layers can also be arranged inside these substrates 12, depending on the design requirements. The present invention is not limited, as long as these signal layers are arranged on these substrates 12 and electrically connected to these optoelectronic units 13. In some embodiments, each substrate 12 can be provided with a corresponding signal layer, which is not limited to an active matrix (AM) signal layer or a passive matrix (PM) signal layer.

[0040] The driving structures 15 are electrically connected to the substrates 12. The driving structures 15 may be adjacent to the first edge E1 and / or the second edge E2 of the sustaining layer 11, that is, the driving structures 15 may be adjacent to at least one of the first edge E1 and the second edge E2 of the first edge E1 of the sustaining layer 11, and may be electrically connected to the photoelectric units 13 through the signal layers, and may further drive the photoelectric units 13 through the signal layers. The driving structures 15 may include driving components (e.g., TFTs), units, chips (driving ICs), and / or circuits (not shown) that drive the photoelectric units 13, thereby driving the photoelectric components on the substrates 12 to emit light; the driving components, units, chips, and / or circuits include, but are not limited to, silicon integrated circuits, and the manner in which the driving structures 15 are electrically connected to the substrates 12 is not limited. In some embodiments, each driving structure 15 may include at least one thin film transistor (TFT) or a silicon chip. In some embodiments, the number of driving structures 15 may correspond to the number of substrates 12 (i.e., one driving structure 15 drives all the photoelectric units 13 on one substrate 12), so that each driving structure 15 drives the photoelectric components on each substrate 12; or, one driving structure 15 may drive part of the photoelectric units 13 on one substrate 12; or, one driving structure 15 may drive the photoelectric units 13 on multiple substrates 12, which is not limited by the present invention. In some embodiments, each driving structure 15 may include other thin film components or circuits in addition to thin film transistors, such as thin film resistors, capacitors, or insulating film layers.

[0041] In this embodiment, each driving structure 15 is disposed correspondingly at the second edge E2 of each substrate 12 adjacent to the maintenance layer 11, but the present invention is not limited thereto. In different embodiments, each driving structure 15 may also be disposed correspondingly at the first edge E1 of each substrate 12 adjacent to the maintenance layer 11 (e.g. Figure 5B ); or, part of the driving structure 15 may be disposed correspondingly at the first edge E1 of each substrate 12 adjacent to the maintenance layer 11, and part of the driving structure 15 may be disposed correspondingly at the second edge E2 of each substrate 12 adjacent to the maintenance layer 11 (eg Figure 2 ); or alternatively, each driving structure 15 may include another substrate (such as a soft board or a hard board) correspondingly arranged on each substrate 12 electrically connected, and the present invention is not limited thereto.

[0042] The restraint structure 16 restrains the first end edge E1 or the second end edge E2 of the maintenance layer 11, and at least one of these driving structures 15 is accommodated in the restraint structure 16. The restraint structure 16 can be a supporting structure or a storage structure for the maintenance layer 11, these substrates 12, these signal layers and these driving structures 15. The restraint structure 16 of this embodiment is taken as an example that the second end edge E2 of the maintenance layer 11 is restrained, and these driving structures 15 are all accommodated in the restraint structure 16. The number of restraint structures 16 can be multiple, respectively restraining the first end edge E1 and the second end edge E2 of the maintenance layer 11, and the multiple restraint structures 16 located at the first end edge E1 and the second end edge E2 of the maintenance layer 11 can be the same or different structures. The restraint structure 16 of this embodiment is a support seat with a receiving groove 161, and the second end edge E2 of the maintenance layer 11 is inserted into the receiving groove 161.

[0043] Please refer to Figure 2 and Figure 3 As shown, they are front views of electronic devices according to different embodiments of the present invention. Figure 2 and Figure 3 The restraining structure of the electronic device is not shown.

[0044] like Figure 2 As shown, the electronic device 1a of this embodiment is substantially the same as the electronic device 1 of the previous embodiment in terms of component composition and connection relationship of each component. The difference is that the electronic device 1a of this embodiment further defines a plurality of substrate units 12a, each substrate unit 12a is composed of two substrates 12; and in two adjacent substrate units 12a, the first side edge S3 of each substrate 12 of one substrate unit 12a is adjacent to the second side edge S4 of each substrate 12 of the other substrate unit 12a. In this embodiment, each substrate unit 12a is formed by splicing two substrates 12 in a vertical direction, and in two adjacent substrate units 12a, for example, the first side edge S3 of each substrate 12 of the right substrate unit 12a is adjacent to the second side edge S4 of each substrate 12 of the left substrate unit 12a. In other words, in addition to splicing the two substrates 12 of each substrate unit 12a in a vertical direction, the substrates 12 of these substrate units 12a are also spliced ​​in a horizontal direction (lateral direction).

[0045] In addition, in each substrate unit 12a, the first end edge E3 of one substrate 12 is close to the first end edge E1 of the supporting layer 11, the first end edge E3 of another substrate 12 is close to the second end edge E2 of the supporting layer 11, and the second end edge E4 of one substrate 12 is close to the second end edge E4 of the other substrate 12. Specifically, in the present embodiment, the first end edge E3 of the upper substrate 12 of each substrate unit 12a is close to the first end edge E1 of the supporting layer 11, the first end edge E3 of the lower substrate 12 of each substrate unit 12a is close to the second end edge E2 of the supporting layer 11, and in the same substrate unit 12a, the second end edge E4 of the upper substrate 12 is close to the second end edge E4 of the lower substrate 12.

[0046] In addition, each substrate unit 12a of the present embodiment includes two driving structures 15, which are respectively arranged on the substrates 12 of the substrate unit 12a, and each driving structure 15 drives the optoelectronic components correspondingly arranged on each substrate 12. In addition, in each substrate unit 12a, one of the driving structures 15 (e.g., the driving structure 15 on the upper side) is adjacent to the first end edge E3 of one of the substrates 12 (e.g., the upper substrate 12), and the other driving structure 15 (e.g., the driving structure 15 on the lower side) is adjacent to the first end edge E3 of the other substrate 12 (e.g., the lower substrate 12), and at least one of the two driving structures 15 (e.g., the driving structure 15 on the lower side) is accommodated in the restraint structure ( Figure 2 Not shown, for reference Figure 1A or Figure 1C ).

[0047] In addition, if Figure 3As shown, the electronic device 1b of this embodiment is substantially the same as the electronic device of the previous embodiment in terms of its component composition and connection relationship of each component. The difference is that each substrate unit 12b of the electronic device 1b of this embodiment is composed of a plurality of substrates 12 of which the number is equal to or greater than 2. Here, each substrate unit 12b is formed by splicing three substrates 12 in a vertical direction, and a plurality of photoelectric units 13 are arranged on the second surface T4 of these substrates 12 of each substrate unit 12b away from the maintenance layer 11. In addition, among two adjacent substrate units 12b, the first side edge S3 of each substrate 12 of one substrate unit 12b is adjacent to the second side edge S4 of each substrate 12 of the other substrate unit 12b. Here, for example, the first side edge S3 of each substrate 12 of the substrate unit 12b on the left is adjacent to the second side edge S4 of each substrate 12 of the substrate unit 12b on the right. In addition, in each substrate unit 12b, the first end edge E3 of one substrate 12 is close to the first end edge E1 of the sustaining layer 11, and the second end edge E4 of another substrate 12 is close to the second end edge E2 of the sustaining layer 11, and the driving structures 15 are arranged on the substrate units 12b. Here, in each substrate unit 12b of the present embodiment, the first end edge E3 of the uppermost substrate 12 is close to the first end edge E1 of the sustaining layer 11, and the second end edge E4 of the lowermost substrate 12 is close to the second end edge E2 of the sustaining layer 11, and the driving structures 15 are correspondingly arranged on the side of each substrate unit 12b close to the second end edge E2 of the sustaining layer 11. Here, one driving structure 15 drives the photoelectric units 13 of the corresponding substrate unit 12b.

[0048] In addition, in each substrate unit 12b, a plurality (for example, 5 in this embodiment) of photoelectric units 13 are arranged on the substrates 12 spliced ​​in the vertical direction, and one of the photoelectric units 13 is connected across two adjacent substrates 12. Here, two photoelectric units 13 are respectively connected across two adjacent substrates 12 as an example. In addition, in addition to having a plurality (for example, but not limited to 3) of photoelectric components 131 in each photoelectric unit 13 of the substrate unit 12b, each photoelectric unit 13 further has a carrier 132 and a primary signal layer 133 arranged on the carrier 132. These photoelectric components 131 are arranged on the carrier 132 and are electrically connected to the secondary signal layer 133. Therefore, the signal driving the photoelectric component 131 can be transmitted to the photoelectric component 131 through the secondary signal layer 133. In addition, in each substrate unit 12b, the secondary signal layer 133 of one of the photoelectric units 13 is electrically connected to the signal layers 14 of the two adjacent substrates 12. Thus, the signals output by the driving structure 15 to drive the corresponding optoelectronic units 13 can be transmitted to the optoelectronic components 131 through the corresponding signal layers 14 on the substrates 12 and the sub-signal layers 133 on the carriers 132 to drive the optoelectronic components 131 to emit light. In some embodiments, each carrier 132 can be a flexible board. Of course, in different embodiments, each carrier 132 can also be a rigid board. It can be understood that the optoelectronic components 131 in the optoelectronic units 13 of various embodiments of the present invention can be directly disposed on the corresponding substrate 12, or can be electrically connected to the corresponding substrate 12 through the carrier 132, without limitation.

[0049] In this embodiment, the number of the photoelectric units 13 in each substrate unit 12b is 5, and the number of the photoelectric components 131 in each photoelectric unit 13 is 3, but this is not limiting. In different embodiments, the number of the photoelectric units 13 may be less than or greater than 5, and the number of the photoelectric components 131 may be less than or greater than 3. In addition, among the 5 photoelectric units 13, two photoelectric units 13 are respectively connected across two adjacent substrates 12 in the vertical direction.

[0050] In some embodiments, the electronic device 1 may further include a plurality of active components (not shown), which may be arranged on the substrates 12 of the substrate unit 12b or the carriers 132, without limitation. The active components may be electrically connected to the optoelectronic components 131 of the optoelectronic units 13, respectively, so as to drive the optoelectronic components 131 of the optoelectronic units 13, respectively, through the active components. Here, the active components are, for example, but not limited to, thin film transistors (TFT) or silicon integrated circuits (Silicon IC).

[0051] FIG. 4A to FIG. 4CThe following are schematic diagrams of the configuration of substrates and corresponding driving structures according to different embodiments of the present invention. These driving structures 15 can be arranged on these substrates 12 respectively, for example, one driving structure 15 drives one substrate 12. In this way, the driving signal of the driving structure 15 can be prevented from being poorly driven due to the voltage drop caused by too many spliced ​​substrates 12 of each substrate unit.

[0052] In some embodiments, in each substrate unit, each driving structure 15 is connected to the first end edge E3 or the second end edge E4 of the corresponding substrate 12, and extends to overlap another adjacent substrate 12. Figure 4A As shown, each driving structure 15 of this embodiment is connected to the second edge E4 of the corresponding substrate 12 and extends to overlap the second surface T4 of another adjacent substrate 12 . At this time, the sustaining layer 11 can be located on the first surface T3 of these substrates 12 .

[0053] In some embodiments, if each driving structure 15 includes a rigid substrate, each driving structure 15 may be connected to and perpendicular to the first end edge E3 or the second end edge E4 of the corresponding substrate 12. Figure 4B As shown, each driving structure 15 of this embodiment is connected to and perpendicular to the second end edge E4 of the corresponding substrate 12 as an example. In this case, the sustaining layer 11 may be located on the first surface T3 of these substrates 12 .

[0054] In some embodiments, if each driving structure 15 includes a flexible substrate, each driving structure 15 is connected to the first edge E3 or the second edge E4 of the corresponding substrate 12 and is folded back to the corresponding substrate 12 at an angle. Figure 4C As shown, each driving structure 15 of this embodiment is connected to the second end edge E4 of the corresponding substrate 12 and folded back on the corresponding substrate 12 along an angle (such as 90 degrees). At this time, the maintenance layer 11 can be located on the first surface T3 of these substrates 12.

[0055] It is understood that the various driving structures 15 herein may extend from the first surface T3 or the second surface T4 of the corresponding substrate 12, and are not limited thereto. FIG. 4A to FIG. 4C For example, the sustaining layer 11 may also be located on the second surface T4 of the substrates 12 . The sustaining layer 11 may have openings corresponding to the drive structures 15 for accommodating or passing through. In this case, the non-contact surface of the sustaining layer 11 may be the display surface or non-display surface of the electronic device 1 .

[0056] also, Figure 5A and Figure 5B They are front views of an electronic device according to another embodiment of the present invention. Figure 5AAs shown, the electronic device 1c of this embodiment is substantially the same as the electronic device 1 of the aforementioned embodiment in terms of its component composition and connection relationship of each component. The difference is that the restraint structure 16a of the electronic device 1c of this embodiment is a rolling bar having a receiving groove 162, and the first end edge E1 of the maintenance layer 11 can be positioned to the receiving groove 162. Here, when the maintenance layer 11 is a soft board or a protective film, and the substrate 12, the photoelectric unit 13 and the driving structure 15 also include a soft board, the maintenance layer 11, the substrate 12, the photoelectric unit 13 and the driving structure 15 can be rolled up from the second end edge E2 of the maintenance layer 11 toward the receiving groove 162 and stored in the receiving groove 162 like a rolling curtain, thereby occupying a smaller space and being convenient for users to collect.

[0057] In addition, if Figure 5B As shown, the driving structure 15 of this embodiment is disposed close to the first end edge E1 of the maintaining layer 11, so that the driving structure 15 can be normally retracted into the rolling bar. It can be understood that a single restraining structure is used to restrain the first end edge E1 or the second end edge E2 of the maintaining layer 11. In some embodiments, different types of restraining structures (for example, the first end edge E1 is a support seat, and the second end edge E2 is a rolling bar) or the same type of restraining structures (for example, both the first end edge E1 and the second end edge E2 are rolling bars) can be implemented simultaneously on the first end edge E1 and the second end edge E2 of the maintaining layer 11.

[0058] In summary, in the electronic device of the present invention, by designing the configuration, connection and relative relationship of the components such as the maintenance layer, multiple substrates, multiple optoelectronic units, multiple signal layers, multiple drive structures and restraint structures, the present invention can be customized according to the needs of the user, so as to flexibly splice an electronic device of any size required by the customer. The process of the electronic device of the present invention is quite simple, and it has flexibility in application and can be applied to various product requirements.

[0059] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made thereto without departing from the spirit and scope of the present invention shall be included in the appended claims.

Claims

1. An electronic device, include: A maintenance layer, defined with corresponding first end edges and second end edges, corresponding first side edges and second side edges, and corresponding contact surfaces and non-contact surfaces; A plurality of substrates are arranged on the contact surface of the maintenance layer, each of the substrates is defined with a corresponding first end edge and a second end edge, a corresponding first side edge and a second side edge, and a corresponding first surface and a second surface; wherein the first end edge of at least one of the substrates is close to the first end edge of the maintenance layer, and the first side edge of one of the substrates is close to the second side edge of another substrate; A plurality of photoelectric units are arranged on the first surface and / or the second surface of the substrate, each of the photoelectric units having a photoelectric component; A plurality of signal layers are arranged on the substrate and electrically connected to the optoelectronic unit; a plurality of driving structures electrically connected to the substrate, the driving structures being adjacent to the first end edge and / or the second end edge of the sustaining layer and electrically connected to the optoelectronic unit through the signal layer; and A restraining structure restrains the first end edge or the second end edge of the maintaining layer, and at least one of the driving structures is accommodated in the restraining structure. 2 . The electronic device according to claim 1 , wherein the first end edge of each of the substrates is adjacent to the first end edge of the sustaining layer, and the second end edge of each of the substrates is adjacent to the second end edge of the sustaining layer.

3. The electronic device according to claim 1, further defining a plurality of substrate units; in, Each of the substrate units is composed of two of the substrates; in two adjacent substrate units, the first side edges of each of the substrates in one of the substrate units are adjacent to the second side edges of each of the substrates in the other substrate unit; in each of the substrate units, the first end edge of one of the substrates is close to the first end edge of the maintenance layer, the first end edge of the other substrate is close to the second end edge of the maintenance layer, and the second end edge of one of the substrates is adjacent to the second end edge of the other substrate.

4. The electronic device according to claim 3, wherein each of the substrate units comprises two of the driving structures, and the two driving structures are respectively arranged on the two substrates; one of the driving structures is adjacent to the first end edge of one of the substrates, and the other driving structure is adjacent to the first end edge of the other substrate, and one of the two driving structures is accommodated in the restraint structure.

5. The electronic device according to claim 1, further defining a plurality of substrate units; in, Each of the substrate units is composed of a plurality of the substrates, the number of which is equal to or greater than 2; in two adjacent substrate units, the first side edge of each of the substrates in one of the substrate units is adjacent to the second side edge of each of the substrates in the other substrate unit; in each of the substrate units, the first end edge of one of the substrates is close to the first end edge of the maintenance layer, and the second end edge of the other substrate is close to the second end edge of the maintenance layer; the driving structure is arranged on the substrate unit.

6. The electronic device according to claim 5, wherein each of the optoelectronic units further has a carrier and a primary signal layer arranged on the carrier, the optoelectronic component is arranged on the carrier and electrically connected to the secondary signal layer; in each of the substrate units, the secondary signal layer of one of the optoelectronic units is electrically connected to the signal layers of two adjacent substrates.

7. The electronic device according to claim 5, wherein the driving structures are respectively arranged on the substrates; in each of the substrate units, each of the driving structures is connected to the first end edge or the second end edge of the corresponding substrate, and extends to overlap to another adjacent substrate; or, each of the driving structures is connected to and perpendicular to the first end edge or the second end edge of the corresponding substrate; or, each of the driving structures is connected to the first end edge or the second end edge of the corresponding substrate, and folded back to the corresponding substrate along an angle. 8 . The electronic device according to claim 1 , wherein each of the optoelectronic units further comprises a carrier and a primary signal layer disposed on the carrier, and the optoelectronic components are disposed on the carrier and electrically connected to the secondary signal layer. 9 . The electronic device according to claim 6 , wherein each of the carrier boards is a flexible board.

10. The electronic device according to claim 6 or 8, further comprising: include: A plurality of active components are arranged on the substrate or the carrier, and the active components are electrically connected to the optoelectronic components of the optoelectronic unit respectively. 11 . The electronic device according to claim 1 , wherein each of the optoelectronic units has a plurality of optoelectronic components.

12. The electronic device according to claim 1, wherein each of the substrates is a flexible board.

13. The electronic device according to claim 1, wherein each of the driving structures comprises a thin film transistor or a silicon chip. The electronic device according to claim 1 , wherein the maintenance layer is a glass substrate, a flexible substrate, or a protective film.

15. The electronic device of claim 1, wherein the optoelectronic components are located between each of the substrates and the sustaining layer. 16 . The electronic device according to claim 1 , wherein the restraining structure is a support base having a receiving groove, and the second end edge of the maintaining layer is inserted into the receiving groove. 17 . The electronic device according to claim 1 , wherein the restraining structure is a rolling bar having a receiving groove, and the first end edge of the maintaining layer is positioned at the receiving groove.

18. The electronic device according to claim 1, wherein each of the substrates is defined by a width W and a length L, the number of the substrates arranged from the first side edge to the second side edge of the maintenance layer is N, the number of the substrates arranged from the first end edge to the second end edge of the maintenance layer is M, and ML:NW=9:16.

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