LED lamp radiator, manufacturing method of radiator and LED lamp

Abstract

An LED lamp heat sink includes a top periodic microstructure, a middle film layer and a bottom substrate layer, and a plurality of grooves for heat dissipation by air convection are arranged between the periodic microstructures. The present application has the advantages of small size, light weight, high heat dissipation performance, high integration, and good versatility. It can not only be integrated on most common LED chip drive circuit substrates, but also can realize rapid mass production of products by using an imprinting template, and has a high thermal emissivity in the 8-14 micron atmospheric window.

Description

Technical Field

[0001] The present invention relates to the technical field of radiators, in particular to an LED lamp radiator, and also to a method for manufacturing the LED lamp radiator and an LED lamp containing the LED radiator. Background Art

[0002] With the development of economy and the progress of society, people have put forward higher and higher requirements for the brightness and color saturation of lighting. LED lamps are increasingly appearing in people's lives due to their high brightness and high color saturation. However, LED lamps will generate a lot of heat when in use. If this heat cannot be discharged in time, it will affect the lighting effect of LED lamps and reduce the life of LED lamps. In order to accelerate the transfer of heat, the traditional LED lamp radiator adopts a fin structure, which increases the contact area with the air to enhance the heat convection heat dissipation effect. This type of radiator has the disadvantages of large size and heavy weight, which is not conducive to the development of integrated lamps in the future. With the development of electronic and electrical equipment towards miniaturization and high integration, more stringent requirements are put forward for the volume of LED lamp radiators. Therefore, it is of great practical significance to design an LED lamp radiator with small size, easy integration and good heat dissipation effect. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a LED lamp heat sink which is small in size, easy to integrate and has good heat dissipation effect in view of the deficiencies in the prior art.

[0004] Another technical problem to be solved by the present invention is to provide a method for manufacturing the above-mentioned LED lamp heat sink, and an LED lamp containing the LED heat sink.

[0005] The technical problem to be solved by the present invention is achieved by the following technical solution: The present invention is a LED lamp heat sink, comprising a top periodic microstructure, a middle film layer and a bottom substrate layer, and a plurality of grooves for heat dissipation by air heat convection are arranged between the periodic microstructures.

[0006] The technical problem to be solved by the present invention can be further achieved through the following technical solution. For the LED lamp heat sink described above, the periodic microstructure is a four-fold symmetrical geometric structure.

[0007] The technical problem to be solved by the present invention can be further achieved through the following technical solution. For the above-mentioned LED lamp heat sink, the periodic microstructure is a cubic structure or a cylindrical structure.

[0008] The technical problem to be solved by the present invention can be further achieved by the following technical solution: for the above-mentioned LED lamp heat sink, the material of the periodic microstructure is silicon or germanium.

[0009] The technical problem to be solved by the present invention can be further achieved by the following technical solution: for the above-mentioned LED lamp heat sink, the thickness of the film layer is 0.5-10 microns.

[0010] The technical problem to be solved by the present invention can be further achieved by the following technical solution. For the above-mentioned LED lamp heat sink, the material of the thin film layer is silicon nitride, aluminum oxide or silicon dioxide.

[0011] The technical problem to be solved by the present invention can be further achieved through the following technical solution. For the above-mentioned LED lamp heat sink, the base layer is a silicon wafer.

[0012] The technical problem to be solved by the present invention can be further achieved by the following technical solutions. For the above-mentioned LED lamp heat sink, a method for manufacturing the LED lamp heat sink is provided, and the process is as follows:

[0013] First, a 0.5-10 micron thick film is sputtered on the substrate, then a 2-4 micron thick embossing glue is coated on the film, and a metal mold is placed on top of the embossing glue. Next, a round roller is placed on top of the metal mold for rolling embossing. After the embossing is completed, the metal mold is removed, and a 2-4 micron thick microstructure material is sputtered again. Finally, it is placed in a de-embossing glue solvent, and the LED lamp radiator can be obtained after taking it out and rinsing.

[0014] The technical problem to be solved by the present invention can be further achieved by the following technical solutions. For the manufacturing method of the LED lamp heat sink described above, the manufacturing method of the metal mold is as follows: first, a photoresist is coated on a flat glass, then laser direct writing lithography and development are performed, and then a silver mirror reaction is performed to attach a thin film silver layer with a thickness of 20-100 nanometers to the photoresist structure, and then it is placed in a metal electroforming tank for metal deposition, and finally, the flat glass is taken out and the electroformed metal mold is peeled off.

[0015] The technical problem to be solved by the present invention can also be further achieved through the following technical solutions. For the LED lamp heat sink mentioned above, an LED lamp includes an optical lens, an LED lamp chip, an LED chip circuit substrate and the LED lamp heat sink, and the LED chip circuit substrate is fixedly connected to the base layer by a thermal conductive adhesive.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. The radiator provided in this application has the advantages of small size and light weight;

[0018] 2. The heat sink provided in this application utilizes a heat dissipation mechanism combining heat convection and heat radiation, and has excellent heat dissipation performance;

[0019] 3. The radiator provided in this application is highly integrable;

[0020] 4. The heat sink provided in this application is universal and can be integrated on most common LED chip driver circuit substrates;

[0021] 5. The heat sink provided in this application can realize rapid mass production of products by using a stamping template. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of the LED lamp heat sink of the present invention;

[0023] Figure 2 A schematic diagram of a periodic microstructure of the present invention;

[0024] Figure 3 Another structural schematic diagram of the periodic microstructure of the present invention;

[0025] Figure 4 It is a structural schematic diagram of the LED lamp of the present invention;

[0026] Figure 5 It is a schematic diagram of the manufacturing process of the metal mold of the present invention;

[0027] Figure 6 It is a schematic diagram of the manufacturing process of the LED lamp heat sink of the present invention;

[0028] Figure 7 This is a thermal emissivity diagram of the LED lamp heat sink of the present invention in the atmospheric window of 8-14 microns. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Reference Figures 1 to 7 , a heat sink for an LED lamp, comprising a periodic microstructure at a top layer, a thin film layer in the middle, and a substrate layer at a bottom;

[0031] The periodic microstructure is a four-fold symmetric geometric structure, such as Figure 2 As shown, the periodic microstructure is a cubic structure with a length, width, and height ranging from 2 to 4 microns, such as Figure 3 As shown, the periodic microstructure is a cylindrical structure with a height range of 2-4 μm and a diameter range of 2-4 μm;

[0032] The periodic microstructure set on the top layer has a unique structure and high thermal radiation rate, and a number of grooves are set between the periodic microstructures for heat dissipation by air convection, further improving the heat dissipation efficiency;

[0033] Preferably, the material of the periodic microstructure is silicon or germanium;

[0034] The thickness of the thin film layer is 0.5-10 microns, and the material of the thin film layer is silicon nitride, aluminum oxide or silicon dioxide;

[0035] The base layer is a silicon wafer.

[0036] A method for manufacturing an LED lamp heat sink, firstly using a method combining laser direct writing lithography and electroforming to prepare a metal mold, then using an imprinting process to copy the microstructure on the metal mold onto the heat sink, thereby manufacturing the heat sink;

[0037] The process is as follows:

[0038] First, a 0.5-10 micron thick film is sputtered on the substrate, then a 2-4 micron thick embossing glue is coated on the film, and a metal mold is placed on the embossing glue. Next, a round roller is placed on the metal mold for rolling embossing. After the embossing is completed, the metal mold is removed, and a 2-4 micron thick microstructure material is sputtered. Finally, the film is placed in a de-embossing glue solvent, and the LED lamp heat sink is obtained after being taken out and rinsed.

[0039] The method for making a metal mold is as follows: first, apply photoresist on a flat glass, then perform laser direct writing lithography and development, then perform a silver mirror reaction to attach a 20-100 nanometer thick thin film silver layer to the photoresist structure, then place it in a metal electroforming tank for metal deposition, and finally, take out the flat glass and peel off the electroformed metal mold.

[0040] An LED lamp, comprising an optical lens, an LED lamp chip, an LED chip circuit substrate and an LED lamp radiator, wherein the LED chip circuit substrate is fixedly connected to a base layer of the LED lamp radiator through a thermally conductive adhesive;

[0041] Preferably, the thermally conductive adhesive uses silicone grease to facilitate better heat conduction to ensure the heat dissipation effect of the LED lamp.

[0042] Taking the periodic microstructure selection cube as an example, a specific description is given, the period is set to 6 microns, the length and width are 3 microns, the height is 3 microns, and the material is selected as silicon;

[0043] The thickness of the film is set to 3 microns, and the material is selected as silicon nitride;

[0044] The substrate is a commercial p-type silicon wafer with a thickness of 500 μm;

[0045] The specific production process of the radiator is divided into two processes:

[0046] The first process is the production of metal molds:

[0047] The first step is to place the flat glass in ultrapure water for ultrasonic cleaning;

[0048] The second step is to apply 4 micron thick photoresist on the glass, and then use a laser direct writing lithography machine to perform patterning, followed by development with a 0.5-millionth sodium hydroxide solution to obtain periodic photoresist cubes;

[0049] In the third step, a 50-nanometer silver film is attached to the glass with microstructures using the silver mirror reaction;

[0050] The fourth step is to place the flat glass in a nickel electroplating solution for electroforming, thereby producing a metal nickel mold;

[0051] The fifth step is to place the flat glass in a degumming solution for cleaning, and then place the metal nickel mold of the glass in ultrapure water for ultrasonic cleaning;

[0052] The second process is the production of the radiator:

[0053] The first step is to grow a 3-micron-thick silicon nitride film on a 500-micron-thick p-type silicon substrate using a low-pressure chemical vapor deposition method;

[0054] The second step is to apply 4 micron thick imprint glue on the silicon nitride film;

[0055] The third step is to use a nickel metal mold for rolling embossing to transfer the microstructure to the embossing adhesive, and then use low-pressure chemical vapor deposition to grow a 3-micron-thick silicon film;

[0056] The fourth step is to remove the embossing glue, place the heat sink in ultrapure water for ultrasonic cleaning to remove the residual glue, and obtain a clean heat sink;

[0057] The heat sink produced has high thermal emissivity in the 8-14 micron atmospheric window. Figure 7 shown.

Claims

1. A LED lamp heat sink, characterized in that: It includes a top periodic microstructure, a middle film layer and a bottom substrate layer, and a plurality of grooves for heat dissipation by air convection are arranged between the periodic microstructures; The manufacturing method of the LED lamp heat sink is as follows: First, a 0.5-10 micron thick film is sputtered on the substrate, then a 2-4 micron thick embossing glue is coated on the film, and a metal mold is placed on the embossing glue. Next, a round roller is placed on the metal mold for rolling embossing. After the embossing is completed, the metal mold is removed, and a 2-4 micron thick microstructure material is sputtered. Finally, the film is placed in a de-embossing glue solvent, and the LED lamp heat sink is obtained after being taken out and rinsed. The method for making a metal mold is as follows: first, apply photoresist on a flat glass, then perform laser direct writing lithography and development, then perform a silver mirror reaction to attach a 20-100 nanometer thick thin film silver layer to the photoresist structure, then place it in a metal electroforming tank for metal deposition, and finally, take out the flat glass and peel off the electroformed metal mold.

2. The LED lamp heat sink according to claim 1, characterized in that: The periodic microstructure is a four-fold symmetric geometric structure.

3. The LED lamp heat sink according to claim 2, characterized in that: The periodic microstructure is a cubic structure or a cylindrical structure.

4. The LED lamp heat sink according to claim 1 or 2, characterized in that: The material of the periodic microstructure is silicon or germanium.

5. The LED lamp heat sink according to claim 1, characterized in that: The thickness of the film layer is 0.5-10 microns.

6. The LED lamp heat sink according to claim 1 or 5, characterized in that: The material of the film layer is silicon nitride, aluminum oxide or silicon dioxide.

7. The LED lamp heat sink according to claim 1, characterized in that: The base layer is a silicon wafer.

8. An LED lamp, characterized in that: The LED lamp comprises an optical lens, an LED lamp chip, an LED chip circuit substrate and the LED lamp heat sink according to any one of claims 1 to 7, wherein the LED chip circuit substrate is fixedly connected to the base layer by a thermally conductive adhesive.

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