An automated laser welding device

Abstract

The present invention provides an automated laser welding device, comprising an equipment platform, on which a laser head and a tin feeding device capable of moving along an X-axis, a Y-axis, and a Z-axis are provided, on which a winding device, a conveying device, a cutting device, and a traction device are also provided, on which a carrier plate is also provided, on which a first driving shaft and a second driving shaft arranged side by side are provided, the first driving shaft is connected to the carrier plate through a bearing, the second driving shaft is connected to the carrier plate through a double helix pattern, a rotating driving device is also provided on the carrier plate, the second driving shaft is lowered in height along the Z-axis when rotating, a first clamping claw for clamping a shielded wire is provided at the bottom of the first driving shaft and the bottom of the second driving shaft, a cushion seat for raising a circuit board is also provided on the equipment platform, a first soldering pad and a second soldering pad with a through hole are provided on the upper surface of the circuit board, and a lifting rod located below the second soldering pad is also provided on the equipment platform.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board welding, and in particular to an automatic laser welding device. Background Art

[0002] Laser welding is a more precise welding method that mainly uses a high-energy-density laser beam as a heat source. Laser welding is also commonly used when welding components and shielded wires on circuit boards. The laser welding process is heat conduction. The laser radiation heats the surface of the solder foot, causing the solder near the solder foot to contact the surface of the solder foot and melt, and finally adhere to the pad to complete the precision welding.

[0003] If you want to solder a shielded wire that is bypassed from one side on both sides of the circuit board, such as Figure 1 shown. Figure 1 The two ends of the shielding wire (4) are respectively welded to the welding pads on the two sides of the circuit board (16). The existing laser welding equipment usually needs to flip the circuit board after completing the welding on one side and then weld the other side, wherein two workstations are involved before and after the flipping action, so there is a problem of low welding efficiency. Summary of the invention

[0004] The technical problem to be solved by the present invention is how to improve the welding efficiency when the shielding wires on both sides of the circuit board are respectively connected at both ends of the welding, and an automatic laser welding device is provided.

[0005] The technical solution of the present invention is an automated laser welding equipment, including an equipment platform, on which a laser head and a tin feeding device capable of moving along an X-axis, a Y-axis, and a Z-axis are provided, and on which a winding device for winding a shielded wire, a conveying device for conveying a shielded wire, a cutting device for cutting a shielded wire, and a traction device for traction a shielded wire are also provided, the winding device, the conveying device, the cutting device, and the traction device being arranged in sequence along a lead-out path of the shielded wire, the equipment platform is also provided with a carrier plate capable of moving along the Z-axis independently of the laser head and the tin feeding device, the carrier plate is provided with a first drive shaft and a second drive shaft arranged side by side along the lead-out path of the shielded wire, the first drive shaft is connected to the carrier plate via a bearing, the second drive shaft is connected to the carrier plate via a double helix pattern, the carrier plate is also provided with a rotation drive device for driving the first drive shaft and the second drive shaft to rotate 90 degrees toward each other, the second drive shaft is lowered along the Z-axis during rotation, and the first drive shaft is lowered along the Z-axis during rotation. The bottom of the first driving shaft and the bottom of the second driving shaft are both provided with a first clamping jaw for clamping the shielding wire, the equipment platform is also provided with a cushion seat for raising the circuit board, the upper surface of the circuit board is provided with a first soldering pad and a second soldering pad with a through hole, and the equipment platform is also provided with a lifting rod located below the second soldering pad; wherein the traction device pulls out the shielding wire wound up by the winding device, the first clamping jaw b clamps the shielding wire as the carrier plate descends along the Z axis, the cutting device cuts off the shielding wire, and the first clamping jaw b again moves the shielding wire as the carrier plate descends along the Z axis, the rotating drive device drives the first clamping jaw a and the first clamping jaw b to rotate 90 degrees toward each other so that one end of the shielding wire contacts the first soldering pad from the upper surface of the circuit board, and the other end of the shielding wire approaches the second soldering pad from the lower surface of the circuit board, the lifting rod pushes up to make the shielding wire contact the second soldering pad, and the laser head and the tin feeding device move along the X axis to the top of the first soldering pad and the second soldering pad respectively for welding.

[0006] As an embodiment, the tin feeding device includes a first mounting frame and a second mounting frame respectively arranged on both sides of the laser head, the first mounting frame is provided with a first tin feeding rod, and the second mounting frame is provided with a second tin feeding rod, the first tin feeding rod and the second tin feeding rod respectively converge the solder wire from both sides of the laser head to the bottom of the laser head.

[0007] As an embodiment, a Y-axis module is provided on the equipment platform, an X-axis module is provided on the Y-axis module, a Z-axis module is provided on the X-axis module, a mounting plate is provided on the Z-axis module, and the laser head and the tin feeding device are arranged on the mounting plate.

[0008] As an embodiment, the conveying device includes a driving wheel located below the shielding wire and a first driven wheel and a second driven wheel located above the shielding wire, and the first driven wheel, the driving wheel, and the second driven wheel are arranged in sequence along the lead-out path of the shielding wire.

[0009] As an embodiment, the cutting device includes a base, the base is provided with a groove, the groove provides a shielded wire to pass through, the cutting device also includes a cutter cylinder located above the base, the action axis of the cutter cylinder is provided with a cutter extending into the groove.

[0010] As an embodiment, the traction device includes a traction electric cylinder arranged on the base of the Y-axis module along the Y-axis, the output end of the traction electric cylinder is connected to a slide seat, and the slide seat is provided with a second clamping claw for clamping the shielding wire.

[0011] As an implementation manner, one side of the X-axis module is connected to a lifting module via a folding plate, and the carrier plate is arranged on the lifting module.

[0012] As an embodiment, the rotary drive device includes gears arranged at the end of the first drive shaft and the end of the second drive shaft, a rack is provided between the two gears, and a propulsion cylinder for driving the rack to move is provided on the carrier plate, and when the rack is pushed, the two gears are driven to rotate simultaneously.

[0013] As an implementation manner, the rack is close to a Y-shape and has tooth surfaces on both sides, and the rack is meshed with the two gears respectively through the tooth surfaces on both sides.

[0014] As an embodiment, the first clamp includes two opposing clamping blocks, the clamping blocks are rotatably connected to a rotating block, and the rotating block is provided with a wire groove for the shielding wire to cooperate with; when the first clamp a and the first clamp b clamp the shielding wire, the shielding wire is embedded in the wire groove, and when the rotation drive device drives the first clamp a and the first clamp b to rotate 90 degrees toward each other, the rotating blocks of the first clamp a and the first clamp b rotate as the first clamp b is lowered, so that one end of the bent shielding wire is located on the upper surface of the circuit board and the other end is located on the lower surface of the circuit board.

[0015] Compared with the prior art, the present invention has the following beneficial effects: the traction device approaches the conveying device in the opposite direction along the lead-out path of the shielded wire, and after reaching the position, the shielded wire end outputted from the conveying device is clamped and returned along the lead-out path, so that the shielded wire can be pulled out. Then the first clamping jaw clamps the shielded wire as the carrier plate descends along the Z axis, and the cutting device cuts off the shielded wire. Then the first clamping jaw moves the shielded wire again as the carrier plate descends along the Z axis. At this time, the height of the shielded wire is the same as the height of the circuit board. Then the rotary drive device drives the two first clamping jaws to rotate 90 degrees toward each other so that one end of the shielded wire contacts the first pad from the upper surface of the circuit board, and the other end of the shielded wire approaches the second pad from the lower surface of the circuit board. Finally, the laser head and the tin feeding device move along the X axis to the top of the first pad and the second pad respectively for welding. When welding the upper end of the shielded wire, the solder melts directly on the first pad, and when welding the lower end of the shielded wire, the solder melts and penetrates through the via hole of the second pad to the bottom to achieve connection. The above technical solution can achieve the beneficial effect of improving the welding efficiency when the shielding wires on both sides of the circuit board are respectively connected at both ends of the welding, because the two ends of the shielding wire can be welded without turning over the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A diagram showing the position relationship between the shielding wire and the circuit board in the background technology;

[0017] Figure 2 A first structural schematic diagram of an automated laser welding device provided in an embodiment of the present invention;

[0018] Figure 3 A schematic diagram of the structure of a rotary drive device provided in an embodiment of the present invention;

[0019] Figure 4 A diagram showing the positional relationship between the shielding wire and the circuit board provided in an embodiment of the present invention;

[0020] Figure 5 A schematic diagram of the position of a lifting rod provided in an embodiment of the present invention;

[0021] Figure 6 A schematic structural diagram of a tin delivery device provided in an embodiment of the present invention;

[0022] Figure 7 A schematic diagram of the structure of a conveying device and a cutting device provided in an embodiment of the present invention;

[0023] Figure 8 A second structural schematic diagram of the automated laser welding equipment provided by an embodiment of the present invention;

[0024] Fig. 9 A positional relationship diagram of two first clamping jaws provided in an embodiment of the present invention.

[0025] In the figure: 1. Equipment platform; 2. Laser head; 3. Tin feeding device; 31. First mounting frame; 32. Second mounting frame; 33. First tin feeding rod; 34. Second tin feeding rod; 4. Shielding wire; 5. Winding device; 6. Conveying device; 7. Cutting device; 71. Base; 72. Slot; 73. Cutting cylinder; 74. Cutter; 8. Traction device; 81. Traction electric cylinder; 82. Sliding seat; 83. Second clamping jaw; 9. Carrier plate; 10. First drive shaft; 11. Second drive shaft; 12. Bearing; 13. Double helix pattern; 14. Rotation drive device ; 141. gear; 142. rack; 143. thrust cylinder; 144. tooth surface; 15. first clamp; 151. clamp block; 152. rotating block; 153. wire groove; 154. first clamp a; 155. first clamp b; 16. circuit board; 17. seat; 18. first solder pad; 19. second solder pad; 20. lifting rod; 21. Y-axis module; 22. X-axis module; 23. Z-axis module; 24. mounting plate; 25. driving wheel; 26. first driven wheel; 27. second driven wheel; 28. folding plate; 29. ​​lifting module. DETAILED DESCRIPTION

[0026] The above and other embodiments and advantages of the present invention are described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments.

[0027] In one embodiment, Figure 2-5 shown.

[0028] The automated laser welding equipment provided in this embodiment includes an equipment platform 1, on which a laser head 2 and a tin feeding device 3 that can move along the X-axis, the Y-axis, and the Z-axis are provided. The equipment platform 1 is also provided with a winding device 5 for winding up the shielded wire 4, a conveying device 6 for conveying the shielded wire 4, a cutting device 7 for cutting the shielded wire 4, and a traction device 8 for traction the shielded wire 4. The winding device 5, the conveying device 6, the cutting device 7, and the traction device 8 are arranged in sequence along the lead-out path of the shielded wire 4. The table 1 is also provided with a carrier plate 9 which can move along the Z axis independently of the laser head 2 and the tin feeding device 3. The carrier plate 9 is provided with a first driving shaft 10 and a second driving shaft 11 arranged side by side along the lead-out path of the shielding wire 4. The first driving shaft 10 is connected to the carrier plate 9 through a bearing 12, and the second driving shaft 11 is connected to the carrier plate 9 through a double helical pattern 13. The carrier plate 9 is also provided with a rotation driving device 14 for driving the first driving shaft 10 and the second driving shaft 11 to rotate 90 degrees toward each other. When the second driving shaft 11 rotates, the height of the first driving shaft 10 decreases along the Z axis, and the first driving shaft 11 decreases along the Z axis. The bottom of the driving shaft 10 and the bottom of the second driving shaft 11 are both provided with a first clamping jaw 15 for clamping the shielding wire 4, and the equipment platform 1 is also provided with a cushion seat 17 for raising the circuit board 16, and the upper surface of the circuit board 16 is provided with a first soldering pad 18 and a second soldering pad 19 with a through hole, and the equipment platform 1 is also provided with a lifting rod 20 located below the second soldering pad 19; wherein, the traction device 8 pulls out the shielding wire 4 wound up on the winding device 5, and the first clamping jaw b155 clamps the shielding wire 4 as the carrier plate 9 descends along the Z axis, and the cutting device 7 cuts off the shielding wire 4, The first clamp b155 again moves the shielding wire 4 as the carrier plate 9 descends along the Z axis, and the rotation drive device 14 drives the first clamp a154 and the first clamp b155 to rotate 90 degrees toward each other so that one end of the shielding wire 4 contacts the first soldering pad 18 from the upper surface of the circuit board 16, and the other end of the shielding wire 4 approaches the second soldering pad 19 from the lower surface of the circuit board 16. The lifting rod 20 pushes up to make the shielding wire 4 contact the second soldering pad 19, and the laser head 2 and the tin feeding device 3 move along the X axis to the top of the first soldering pad 18 and the second soldering pad 19 respectively for welding.

[0029] In this embodiment, the laser head 2 and the tin feeding device 3 can move along the X-axis, the Y-axis, and the Z-axis, as in conventional laser welding equipment. In order to solve the technical problem of how to improve the welding efficiency when the shielding wire 4 on both sides of the circuit board 16 is connected at both ends of the welding, in this embodiment, the two ends of the shielding wire 4 can be welded without flipping the circuit board 16. The specific implementation method is that the traction device 8 approaches the conveying device 6 in the opposite direction of the lead-out path of the shielding wire 4, and after reaching the position, the end of the shielding wire 4 output from the conveying device 6 is clamped and returned along the lead-out path, so that the shielding wire 4 can be pulled out. Then, the first clamp 15 descends along the Z axis with the carrier 9 to clamp the shielding wire 4, and the cutting device 7 cuts off the shielding wire 4. Then, the first clamp 15 descends along the Z axis with the carrier 9 again to transfer the shielding wire 4. At this time, the height of the shielding wire 4 is the same as the height of the circuit board 16. Then, the rotary drive device 14 drives the two first clamps 15 to rotate 90 degrees toward each other so that one end of the shielding wire 4 contacts the first soldering pad 18 from the upper surface of the circuit board 16, and the other end of the shielding wire 4 approaches the second soldering pad 19 from the lower surface of the circuit board 16. Because the rotary drive device 14 drives the corresponding first clamp 15 connected through the bearing 12 to rotate only in a plane, and drives the corresponding first clamp 15 connected through the double spiral pattern 13 to synchronously complete the descent during rotation, so that one end of the bent shielding wire 4 can be located on the upper surface of the circuit board 16, and the other end can be located on the lower surface of the circuit board 16. Then, the shielding wire 4 is pushed up by the lifting rod 20 to contact the second pad 19, and finally the laser head 2 and the tin feeding device 3 are moved along the X-axis to the top of the first pad 18 and the second pad 19 for welding. When welding the upper end of the shielding wire 4, the solder is directly melted on the first pad 18, and when welding the lower end of the shielding wire 4, the solder melts and penetrates through the via hole of the second pad 19 to achieve connection. Through the above technical solution, the beneficial effect that can be achieved is that the welding efficiency is improved when the shielding wires 4 on both sides of the circuit board 16 are connected at both ends, because the two ends of the shielding wire 4 can be welded without flipping the circuit board 16.

[0030] In one embodiment, Figure 6 shown.

[0031] The automated laser welding equipment provided in this embodiment comprises a tin feeding device 3 including a first mounting frame 31 and a second mounting frame 32 respectively arranged on both sides of the laser head 2, a first tin feeding rod 33 is arranged on the first mounting frame 31, and a second tin feeding rod 34 is arranged on the second mounting frame 32. The first tin feeding rod 33 and the second tin feeding rod 34 respectively converge the solder wire from both sides of the laser head 2 to the bottom of the laser head 2.

[0032] In this embodiment, bidirectional solder feeding is adopted, that is, the solder wires of the first solder feeding rod 33 and the second solder feeding rod 34 on both sides of the laser head 2 are gathered under the laser head 2. Under the irradiation of the laser head 2, the solder wires on both sides are melted to achieve welding. Compared with unilateral solder feeding, bidirectional solder feeding can make the solder more uniform.

[0033] In one embodiment, Figure 2 shown.

[0034] The automated laser welding equipment provided in this embodiment has a Y-axis module 21 on its equipment platform 1, an X-axis module 22 on the Y-axis module 21, a Z-axis module 23 on the X-axis module 22, a mounting plate 24 on the Z-axis module 23, and a laser head 2 and a tin feeding device 3 are arranged on the mounting plate 24.

[0035] In this embodiment, the Y-axis module 21 , the X-axis module 22 , and the Z-axis module 23 are provided to enable the laser head 2 and the solder feeding device 3 to move along the X-axis, the Y-axis, and the Z-axis.

[0036] In one embodiment, Figure 7 shown.

[0037] The automated laser welding equipment provided in this embodiment has a conveying device 6 including a driving wheel 25 located below the shielding wire 4 and a first driven wheel 26 and a second driven wheel 27 located above the shielding wire 4. The first driven wheel 26, the driving wheel 25, and the second driven wheel 27 are arranged in sequence along the lead-out path of the shielding wire 4.

[0038] In this embodiment, the driving wheel 25 is connected to a driving motor, and the first driven wheel 26 and the second driven wheel 27 are used to engage with the driving wheel 25 to clamp the shielded wire 4, and then send out the shielded wire 4 under the action of the driving wheel 25.

[0039] In one embodiment, Figure 7 shown.

[0040] The automated laser welding equipment provided in this embodiment comprises a cutting device 7 including a base 71, on which a slot 72 is provided for the shielding wire 4 to pass through. The cutting device 7 also comprises a cut-off cylinder 73 located above the base 71, on the action axis of which a cutter 74 extending into the slot 72 is provided.

[0041] In this embodiment, the shielding wire 4 can be cut off by the cutting device 7 . The shielding wire 4 extends out from the slot 72 . Under the action of the cutting cylinder 73 , the cutter 74 is pressed down to cut off the shielding wire 4 .

[0042] In one embodiment, Figure 8 shown.

[0043] The automated laser welding equipment provided in this embodiment has a traction device 8 including a traction electric cylinder 81 arranged on the base of the Y-axis module 21 along the Y-axis, and the output end of the traction electric cylinder 81 is connected to a slide 82, on which a second clamp 83 for clamping the shielding wire 4 is provided.

[0044] In this embodiment, under the drive of the traction electric cylinder 81, the second clamping claw 83 can be brought close to the conveying device 6 to clamp the end of the output shielded wire 4 and pull out the shielded wire 4 along the lead-out path.

[0045] In one embodiment, Figure 8 shown.

[0046] In the automated laser welding equipment provided in this embodiment, one side of the X-axis module 22 is connected to a lifting module 29 via a folding plate 28 , and the carrier plate 9 is disposed on the lifting module 29 .

[0047] In this embodiment, a connection structure between the X-axis module 22 and the lifting module 29 is provided. When the X-axis module 22 moves along the Y-axis, the lifting module 29 also moves along the Y-axis.

[0048] In one embodiment, Figure 3 shown.

[0049] The automated laser welding equipment provided in this embodiment has a rotation drive device 14 which includes a gear 141 disposed at the end of the first drive shaft 10 and the end of the second drive shaft 11, a rack 142 is disposed between the two gears 141, and a propulsion cylinder 143 for driving the rack 142 to move is disposed on the carrier plate 9. When the rack 142 is propulsed, the two gears 141 are driven to rotate simultaneously.

[0050] In this embodiment, the propulsion cylinder 143 drives the two gears 141 to rotate simultaneously. If one of the gears rotates clockwise, the other one rotates counterclockwise.

[0051] In one embodiment, Figure 3 shown.

[0052] In the automated laser welding equipment provided in this embodiment, the rack 142 is close to a Y-shape and has tooth surfaces 144 on both sides. The rack 142 is meshed with the two gears 141 through the tooth surfaces 144 on both sides.

[0053] In the present embodiment, a specific structure of the rack 142 is provided, but the rack 142 is certainly not limited to the structure close to the Y-shape.

[0054] In one embodiment, Fig. 9 shown.

[0055] The automated laser welding equipment provided in this embodiment comprises a first clamp 15 including two opposite clamping blocks 151, on which a rotating block 152 is rotatably connected, and on which a wire groove 153 for the shielding wire 4 to cooperate is opened; when the first clamp a154 and the first clamp b155 clamp the shielding wire 4, the shielding wire 4 is embedded in the wire groove 153; when the rotary drive device 14 drives the first clamp a154 and the first clamp b155 to rotate 90 degrees toward each other, the rotating blocks 152 of the first clamp a154 and the first clamp b155 rotate as the first clamp b155 is lowered, so that one end of the bent shielding wire 4 is located on the upper surface of the circuit board 16 and the other end is located on the lower surface of the circuit board 16.

[0056] In this embodiment, when the first clamp a154 and the first clamp b155 clamp the shielded wire 4, the shielded wire 4 is embedded in the wire groove 153. When the rotary drive device 14 drives the first clamp a154 and the first clamp b155 to rotate 90 degrees toward each other, the first clamp a154 (the first clamp provided with the bearing 12) rotates horizontally, and the first clamp b155 (the first clamp provided with the double helical pattern 13) rotates and descends at the same time. Then, the rotating block 152 of the first clamp a154 provided with the bearing 12 and the rotating block 152 of the first clamp b155 provided with the double helical pattern 13 rotate in opposite directions, so that one end of the shielded wire 4 deflects upward and the other end deflects downward, thereby achieving the beneficial effect of making one end of the bent shielded wire 4 located on the upper surface of the circuit board 16 and the other end located on the lower surface of the circuit board 16.

[0057] The specific implementation methods described above further describe the invention purpose, technical solutions, and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the protection scope of the present invention. It is particularly pointed out that for those skilled in the art, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An automated laser welding device, characterized in that: The invention comprises an equipment platform (1), wherein the equipment platform (1) is provided with a laser head (2) and a tin feeding device (3) which can move along an X-axis, a Y-axis, and a Z-axis, and the equipment platform (1) is also provided with a winding device (5) for winding up a shielded wire (4), a conveying device (6) for conveying the shielded wire (4), a cutting device (7) for cutting the shielded wire (4), and a traction device (8) for traction the shielded wire (4), wherein the winding device (5), the conveying device (6), the cutting device (7), and the traction device (8) are arranged in sequence along the lead-out path of the shielded wire (4), and the equipment platform (1) is also provided with a carrier plate (9) which can move along the Z-axis independently of the laser head (2) and the tin feeding device (3), and the carrier plate (9) is provided with a first drive shaft (10) and a second drive shaft (11) which are arranged side by side along the lead-out path of the shielded wire (4), and the shielded wire (4) is provided with a first drive shaft (10) and a second drive shaft (11) which are arranged side by side along the lead-out path of the shielded wire (4). The first drive shaft (10) is connected to the carrier plate (9) via a bearing (12), and the second drive shaft (11) is connected to the carrier plate (9) via a double helical pattern (13). The carrier plate (9) is also provided with a rotation drive device (14) for driving the first drive shaft (10) and the second drive shaft (11) to rotate 90 degrees toward each other. The second drive shaft (11) is lowered along the Z axis during rotation. The bottom of the first drive shaft (10) and the bottom of the second drive shaft (11) are both provided with a first clamping claw (15) for clamping the shielding wire (4). The equipment platform (1) is also provided with a cushion seat (17) for raising the circuit board (16). The upper surface of the circuit board (16) is provided with a first soldering pad (18) and a second soldering pad (19) with a through hole. The equipment platform (1) is also provided with a lifting rod (20) located below the second soldering pad (19). The traction device (8) pulls out the shielded wire (4) wound on the winding device (5), the first clamping jaw b (155) clamps the shielded wire (4) as the carrier plate (9) descends along the Z axis, the cutting device (7) cuts off the shielded wire (4), the first clamping jaw b (155) again descends along the Z axis as the carrier plate (9) transfers the shielded wire (4), and the rotation drive device (14) drives the first clamping jaw a (154) and the first clamping jaw b (155) to rotate toward each other. The shielding wire (4) is rotated 90 degrees so that one end of the shielding wire (4) contacts the first soldering pad (18) from the upper surface of the circuit board (16), and the other end of the shielding wire (4) approaches the second soldering pad (19) from the lower surface of the circuit board (16); the lifting rod (20) is pushed up to make the shielding wire (4) contact the second soldering pad (19); the laser head (2) and the tin feeding device (3) are respectively moved along the X-axis to the top of the first soldering pad (18) and the second soldering pad (19) for welding.

2. The automated laser welding equipment according to claim 1, characterized in that: The tin feeding device (3) comprises a first mounting frame (31) and a second mounting frame (32) respectively arranged on both sides of the laser head (2); the first mounting frame (31) is provided with a first tin feeding rod (33); the second mounting frame (32) is provided with a second tin feeding rod (34); the first tin feeding rod (33) and the second tin feeding rod (34) respectively converge the solder wire from both sides of the laser head (2) to the bottom of the laser head (2).

3. The automated laser welding equipment according to claim 1, characterized in that: The equipment platform (1) is provided with a Y-axis module (21), the Y-axis module (21) is provided with an X-axis module (22), the X-axis module (22) is provided with a Z-axis module (23), the Z-axis module (23) is provided with a mounting plate (24), and the laser head (2) and the tin feeding device (3) are arranged on the mounting plate (24).

4. The automated laser welding equipment according to claim 1, characterized in that: The conveying device (6) comprises a driving wheel (25) located below the shielded wire (4) and a first driven wheel (26) and a second driven wheel (27) located above the shielded wire (4); the first driven wheel (26), the driving wheel (25), and the second driven wheel (27) are arranged in sequence along a lead-out path of the shielded wire (4).

5. The automated laser welding equipment according to claim 1, characterized in that: The cutting device (7) comprises a base (71), the base (71) is provided with a slot (72), the slot (72) allows the shielding wire (4) to pass through, and the cutting device (7) also comprises a cut-off cylinder (73) located above the base (71), the action axis of the cut-off cylinder (73) is provided with a cutter (74) extending into the slot (72).

6. The automated laser welding equipment according to claim 3, characterized in that: The traction device (8) comprises a traction electric cylinder (81) arranged on a base of the Y-axis module (21) along the Y-axis, the output end of the traction electric cylinder (81) is connected to a slide seat (82), and the slide seat (82) is provided with a second clamping claw (83) for clamping the shielded wire (4).

7. The automated laser welding equipment according to claim 3, characterized in that: One side of the X-axis module (22) is connected to a lifting module (29) via a folding plate (28), and the carrier plate (9) is arranged on the lifting module (29).

8. The automated laser welding equipment according to claim 3, characterized in that: The rotary drive device (14) comprises a gear (141) arranged at the end of the first drive shaft (10) and the end of the second drive shaft (11); a rack (142) is arranged between the two gears (141); a propulsion cylinder (143) for driving the rack (142) to move is arranged on the carrier plate (9); when the rack (142) is propulsed, the two gears (141) are driven to rotate simultaneously.

9. The automated laser welding equipment according to claim 8, characterized in that: The rack (142) is Y-shaped and has tooth surfaces (144) on both sides. The rack (142) is respectively meshed with the two gears (141) through the tooth surfaces (144) on both sides.

10. The automated laser welding equipment according to claim 1, characterized in that: The first clamping jaw (15) comprises two opposite clamping blocks (151), the clamping block (151) is rotatably connected to a rotating block (152), and the rotating block (152) is provided with a wire groove (153) for the shielding wire (4) to cooperate with; when the first clamping jaw a (154) and the first clamping jaw b (155) clamp the shielding wire (4), the shielding wire (4) is embedded in the wire groove (153); when the rotating driving device (14) drives the first clamping jaw a (154) and the first clamping jaw b (155) to rotate 90 degrees towards each other, the rotating blocks (152) of the first clamping jaw a (154) and the first clamping jaw b (155) rotate as the first clamping jaw b (155) is lowered, so that one end of the bent shielding wire (4) is located on the upper surface of the circuit board (16) and the other end is located on the lower surface of the circuit board (16).

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