Printed circuit boards for GaN components

Abstract

The present invention provides a printed circuit board for a gallium nitride device, on which a gallium nitride soldering position is formed, and a first and a second gallium nitride components with different packages can be interchangeably soldered to the gallium nitride soldering position; a first / second driving circuit soldering position for soldering a first / second driving circuit of the first / second gallium nitride component, wherein the gallium nitride soldering position comprises: a first gate soldering pad soldered to the gate of the first gallium nitride component and connected to the gate signal terminal of the first driving circuit; a second gate soldering pad soldered to the gate of the second gallium nitride component and connected to the gate signal terminal of the second driving circuit; first and second grounding soldering pads; a first potential point disconnectably connected to the first grounding soldering pad and directly connected to the ground terminal of the first driving circuit; and a second potential point disconnectably connected to the second grounding soldering pad and directly connected to the ground terminal of the second driving circuit.

Description

Technical Field

[0001] The present invention relates to a soldering pattern design of a printed circuit board, and more particularly, to a soldering pattern design of a printed circuit board for a gallium nitride device. Background Art

[0002] Gallium nitride is known as the core material of the third-generation semiconductor. Compared with silicon, gallium nitride has a wider bandgap, which also means that gallium nitride can withstand higher voltages than silicon and has better conductivity. In short, the efficiency of gallium nitride is much higher than that of silicon in the same volume. Therefore, more and more power supply equipment uses gallium nitride components.

[0003] However, in most product designs and manufacturing using GaN components, it is often required that the same component position be adapted to products from different component suppliers to avoid quality or shortage issues with some GaN component suppliers in the future, thereby increasing the flexibility of production and stock preparation. However, different GaN manufacturers use different packages when manufacturing GaN components, so these GaN components with different packages often cannot share the same component position on the circuit board.

[0004] The current conventional practice is to reserve soldering positions for GaN components of different packages on the printed circuit board, or to provide conversion boards corresponding to GaN components of different packages to realize soldering of GaN components to the same soldering position on the printed circuit board via the conversion board. However, due to the increasing miniaturization of current products, the area on the circuit board is very limited, so it is difficult to reserve more than two soldering positions on the printed circuit board. If different adapter boards are used, it will cause difficulties and waste in material preparation, as well as increased costs.

[0005] Therefore, a printed circuit board for gallium nitride components is required, which can be compatible with gallium nitride components with different packaging methods from two different manufacturers, save wiring space, enable the product to be miniaturized, and will not increase the cost of material preparation. Summary of the invention

[0006] The purpose of this paper is to provide a novel printed circuit board circuit wiring design that is compatible with two different GaN components with different packaging methods from different manufacturers, saves wiring space, miniaturizes the product, and does not increase the cost of material preparation.

[0007] In order to achieve the above-mentioned object, the present invention provides a printed circuit board for a gallium nitride device, characterized in that a gallium nitride welding position is formed on the printed circuit board, and a first gallium nitride component and a second gallium nitride component with different packages can be interchangeably welded to the gallium nitride welding position; a first drive circuit welding position, a first drive circuit for the first gallium nitride component is welded to the first drive circuit welding position; and a second drive circuit welding position, a second drive circuit for the second gallium nitride component is welded to the second drive circuit welding position.

[0008] The gallium nitride soldering position of the printed circuit board further includes: a first gate pad, soldered to the gate of the first gallium nitride component and connected to the gate signal terminal of the first driving circuit; a second gate pad, soldered to the gate of the second gallium nitride component and connected to the gate signal terminal of the second driving circuit; a first ground pad; a second ground pad; a first potential point, disconnectably connected to the first ground pad, and the ground terminal of the first driving circuit is directly connected to the first potential point; and a second potential point, disconnectably connected to the second ground pad, and the ground terminal of the second driving circuit is directly connected to the second potential point.

[0009] In the printed circuit board of one or more preferred embodiments of the present invention, the gallium nitride soldering position further includes a drain soldering pad, to which the drain of the first gallium nitride component or the second gallium nitride component is soldered; and a source soldering pad, to which the source of the first gallium nitride component or the second gallium nitride component is soldered.

[0010] In the printed circuit board of one or more preferred embodiments of the present invention, the first potential point and the first ground pad are connected via a resistor, a jumper or a switch, and the second potential point and the second ground pad are connected via a resistor, a jumper or a switch.

[0011] In the printed circuit board of one or more preferred embodiments of the present invention, the first potential point and the second potential point are pads or vias.

[0012] In the printed circuit board of one or more preferred embodiments of the present invention, the gate signal terminal of the first driving circuit is directly connected to the first gate pad, and the gate signal terminal of the second driving circuit is directly connected to the second gate pad.

[0013] In the printed circuit board of one or more preferred embodiments of the present invention, the gallium nitride solder joint further includes a third potential point, which is directly connected to the first ground pad and can be disconnected from the first potential point; and a fourth potential point, which is directly connected to the second ground pad and can be disconnected from the second potential point.

[0014] In the printed circuit board of one or more preferred embodiments of the present invention, the first potential point and the third potential point are connected via a resistor, a jumper or a switch, and the second potential point and the fourth potential point are connected via a resistor, a jumper or a switch.

[0015] In the printed circuit board of one or more preferred embodiments of the present invention, the gallium nitride solder joint further includes a fifth potential point, which can be disconnectedly connected to the first gate pad and directly connected to the gate signal terminal of the first driving circuit; and a sixth potential point, which can be disconnectedly connected to the second gate pad and directly connected to the gate signal terminal of the second driving circuit.

[0016] In the printed circuit board of one or more preferred embodiments of the present invention, the fifth potential point and the first gate pad are connected via a resistor, a jumper or a switch, and the sixth potential point and the second gate pad are connected via a resistor, a jumper or a switch.

[0017] In the printed circuit board of one or more preferred embodiments of the present invention, the first gate pad and the first potential point are located on a first side of the gallium nitride soldering position, and the second gate pad and the second potential point are located on a second side of the gallium nitride soldering position, wherein the first side and the second side are the same side or different sides of the gallium nitride soldering position. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to understand in detail the manner in which the above-mentioned features of the present disclosure are achieved, a more detailed description of the present disclosure briefly summarized above may be obtained by reference to the embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below:

[0019] Figure 1 is a schematic diagram of a printed circuit board typically used for a first gallium nitride component.

[0020] Figure 2 is a schematic diagram of a printed circuit board typically used for a second gallium nitride component.

[0021] Figure 3 is a schematic diagram of a printed circuit board for a gallium nitride component according to one embodiment of the present invention.

[0022] Figure 4 is a schematic diagram of a printed circuit board for a gallium nitride device according to another embodiment of the present invention.

[0023] Figure 5 is a schematic diagram of a printed circuit board for a gallium nitride device according to another embodiment of the present invention.

[0024] Figure 6 is a schematic diagram of a printed circuit board for a gallium nitride device according to another embodiment of the present invention.

[0025] Figure 7 is a schematic diagram of a printed circuit board for a gallium nitride device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0026] Various embodiments of the present invention will now be described in detail, one or more examples of which are shown in the accompanying drawings. In the following description of the drawings, the same reference numerals indicate the same components or elements. Only the differences with respect to the various embodiments are described. Each example is provided by way of illustration and is not meant to limit the scope of this invention. In addition, features illustrated or described as part of one embodiment may be used in other embodiments or used in combination with other embodiments to produce another embodiment. The description is intended to include such modifications and variations.

[0027] Figure 1 A wiring design of a printed circuit board (PCB) 100 for a first gallium nitride component having a first package form is shown.

[0028] exist Figure 1 The PCB 100 shown has a soldering position 110 for the first gallium nitride component and a driving circuit soldering position 120 for the driving circuit A, wherein the driving circuit A is used to drive the first gallium nitride component. The soldering position 110 includes 9 solder pads 111-119 and an ink silk screen with a rectangular frame surrounding the 9 solder pads, and the ink silk screen with a rectangular frame is used to mark the position of the first gallium nitride component.

[0029] These pads 111-119 correspond to different pins of the first gallium nitride component. For example, for the first gallium nitride component with the first package form, the drain pin of the first gallium nitride component will be soldered to the pads 111-114, the source pin of the first gallium nitride component will be soldered to the pads 115-117, the ground pin of the first gallium nitride component will be soldered to the pad 118 and connected to the ground terminal of the driving circuit A via the ground wiring 121, and the gate pin of the first gallium nitride component will be soldered to the pad 119 and connected to the gate signal terminal of the driving circuit A via the gate wiring 122.

[0030] Figure 2 The wiring design of the PCB 200 for the second gallium nitride component with the second packaging form is shown, wherein the second packaging form is different from the above combination Figure 1 A first packaging form of a first gallium nitride component is discussed.

[0031] exist Figure 2The PCB 200 shown has a soldering position 210 for the second gallium nitride component and a driving circuit soldering position 220 for the driving circuit B, wherein the driving circuit B is used to drive the second gallium nitride component. The soldering position 210 includes four solder pads 211-214 and an ink silk screen with a rectangular frame surrounding the four solder pads, and the ink silk screen with a rectangular frame is used to mark the position of the second gallium nitride component.

[0032] These pads 211-214 correspond to different pins of the first gallium nitride component. For example, for the second gallium nitride component with the second package form, the drain pin of the second gallium nitride component will be soldered to the pad 211, the source pin of the second gallium nitride component will be soldered to the pad 212, the ground pin of the second gallium nitride component will be soldered to the pad 213 and connected to the ground terminal of the driving circuit B via the ground wiring 221, and the gate pin of the second gallium nitride component will be soldered to the pad 214 and connected to the gate signal terminal of the driving circuit B via the gate wiring 222.

[0033] Combination Figure 1 and Figure 2 It can be seen that for the first gallium nitride component with the first package and the second gallium nitride component with the second package, although the positions of the drain and source pins for soldering the first and second gallium nitride components on the PCB are substantially the same, the positions of the ground and gate pins of the first gallium nitride component are completely different from those of the second gallium nitride component, and therefore the second gallium nitride component cannot be soldered to the PCB. Figure 1 The PCB 100 shown, or the first gallium nitride component is soldered to Figure 2 PCB 200 is shown. Therefore, GaN components with different packages from different manufacturers cannot share a PCB with the same wiring design.

[0034] Figure 3 A schematic diagram of a PCB 300 for a gallium nitride component according to one embodiment of the present invention is shown.

[0035] exist Figure 3 The PCB 300 shown is formed with a soldering position 310 for a gallium nitride component, a driver circuit soldering position 320 for a driver circuit A, and a driver circuit soldering position 330 for a driver circuit B. For the soldering position 310, for example, the soldering position 310 is compatible with the first gallium nitride component having the first package form and the second gallium nitride component both having the second package form as discussed above. That is, the first gallium nitride component and the second gallium nitride component can be soldered to the soldering position 310 interchangeably, the driver circuit A can be used to drive the first gallium nitride component, and the driver circuit B can be used to drive the second gallium nitride component.

[0036] The welding position 310 includes six welding pads 311 - 316 and an ink silk screen with a rectangular frame surrounding the six welding pads. The ink silk screen with the rectangular frame is used to mark the position of the gallium nitride component.

[0037] The pad 311 corresponds to the position of the drain pin of the first or second gallium nitride component, so when the first or second gallium nitride component is soldered to the PCB 300, the drain pin of the first or second gallium nitride component is soldered to the pad 311. The pad 312 corresponds to the position of the source pin of the first or second gallium nitride component, so when the first or second gallium nitride component is soldered to the PCB 300, the source pin of the first or second gallium nitride component is soldered to the pad 312. Since the positions of the drain pin and the source pin of the first and second gallium nitride components are substantially the same, the pads 311 and 312 in the soldering position 310 can be shared by the first and second gallium nitride components.

[0038] A first potential point TR1 and a second potential point TR2 are further formed on the PCB 300. The gate signal terminal of the driving circuit A is connected to the pad 313 via the gate wiring 322, and the ground terminal of the driving circuit A is connected to the first potential point TR1 via the ground wiring 321. The gate signal terminal of the driving circuit B is connected to the pad 316 via the gate wiring 332, and the ground terminal of the driving circuit B is connected to the second potential point TR2 via the ground wiring 331. The first potential point TR1 is associated with the pad 314 and can be disconnected from the pad 314; the second potential point TR2 is associated with the pad 315 and can be disconnected from the pad 315, as shown in FIG. Figure 3 As shown by the dotted line in . In some embodiments, the first potential point TR1 and the pad 314 can be connected through a resistor (e.g., a 0-100 ohm chip resistor or a 0-100 ohm plug-in resistor), a jumper or a switch, and similarly, the second potential point TR2 and the pad 315 can also be connected through a resistor, a jumper or a switch. Therefore, when it is necessary to connect the first potential point TR1 and the pad 314, the connection between the pad 314 and the ground terminal of the drive circuit A can be achieved by using a resistor, a jumper or a switch, and when it is necessary to connect the second potential point TR2 and the pad 315, the connection between the pad 315 and the ground terminal of the drive circuit B can be achieved by using a resistor, a jumper or a switch.

[0039] The pads 313 and 314 correspond to the gate pin and the ground pin of the first gallium nitride component, respectively. Therefore, when the first gallium nitride component needs to be soldered to the PCB 300, the gate pin and the ground pin of the first gallium nitride component are soldered to the pads 313 and 314, respectively. The pads 316 and 315 correspond to the gate pin and the ground pin of the second gallium nitride component, respectively. Therefore, when the second gallium nitride component needs to be soldered to the PCB 300, the gate pin and the ground pin of the second gallium nitride component are soldered to the pads 315 and 316, respectively.

[0040] The following describes the compatibility between the PCB 300 and the first and second gallium nitride components.

[0041] When the first gallium nitride component needs to be soldered to the PCB 300, the first gallium nitride component is soldered to the soldering position 310 and the driving circuit A for driving the first gallium nitride component is soldered to the soldering position 320, and the soldering position 330 is left empty. At this time, the drain and source pins of the first gallium nitride component are soldered to the pads 311 and 312 respectively; the gate pin of the first gallium nitride component is soldered to the pad 313, thereby connecting to the gate signal terminal of the driving circuit A via the gate wiring 322; the ground pin of the first gallium nitride component is soldered to the pad 314, and the pad 314 is connected to the first potential point TR1 through a resistor, a jumper or a switch, thereby connecting to the ground terminal of the driving circuit A via the ground wiring 321. At this time, although the first gallium nitride component with the first package form also has a source pin at the position corresponding to the pads 315 and 316 and the source pin of the first gallium nitride component is also soldered to the pads 315 and 316, since the soldering position 330 is left empty and the pad 315 and the second potential point TR2 are disconnected, even if the source pin of the first gallium nitride component is soldered to the pads 315 and 316, it will not cause any impact on the first gallium nitride component. Therefore, after the first gallium nitride component and the driving circuit A are soldered to the PCB 300, the circuit can work normally.

[0042] Similarly, when the second gallium nitride component needs to be soldered to the PCB 300, the second gallium nitride component is soldered to the soldering position 310 and the driving circuit B for driving the second gallium nitride component is soldered to the soldering position 330, and the soldering position 320 is left empty. At this time, the drain and source pins of the second gallium nitride component are soldered to the pads 311 and 312 respectively; the gate pin of the second gallium nitride component is soldered to the pad 316, thereby connecting to the gate signal terminal of the driving circuit B via the gate wiring 332; the ground pin of the second gallium nitride component is soldered to the pad 315, and the pad 315 is connected to the second potential point TR2 through a resistor, a jumper or a switch, thereby connecting to the ground terminal of the driving circuit B via the ground wiring 331. At this time, although the second gallium nitride component with the second package form also has source pins at the positions corresponding to the pads 313 and 314 and the source pins of the second gallium nitride component are also soldered to the pads 313 and 314, since the soldering position 320 is left empty and the pad 314 is disconnected from the first potential point TR1, even if the source pins of the second gallium nitride component are soldered to the pads 313 and 314, it will not cause any impact on the second gallium nitride component. Therefore, after the second gallium nitride component and the driving circuit B are soldered to the PCB 300, the circuit can work normally.

[0043] Therefore, the PCB 300 having the welding positions 310-330 and the first and second potential points TR1 and TR2 can be compatible with the above two different packaging forms of the GaN components, as long as the positions of the drain and source pins of the GaN components of different packaging forms are roughly the same. In this way, the PCB 300 can be compatible with the GaN components of different packaging forms by only setting one welding position, without reserving different welding positions for different GaN components, or adapting the GaN components and the PCB through an adapter plate. The PCB 300 designed in this way saves wiring space, enables the product to be miniaturized, and does not increase the cost of material preparation.

[0044] According to embodiments, which may be combined with any other embodiments described herein, the first and second potential points TR1 , TR2 in the PCB 300 may be pads or vias.

[0045] Figure 4 is a schematic diagram of a PCB for a gallium nitride component according to another embodiment of the present invention. Figure 4 The PCB shown with Figure 3 Similar, except that Figure 4The illustrated PCB 300 is further formed with a third potential point TR3 and a fourth potential point TR4. The third potential point TR3 is connected to the pad 314 and the fourth potential point TR4 is connected to the pad 315. The third potential point TR3 is associated with the first potential point TR1, that is, the third potential point TR3 is disconnectably connected to the first potential point TR1 (for example, through a resistor, a jumper or a switch). The fourth potential point TR4 is associated with the second potential point TR2, that is, the fourth potential point TR4 is disconnectably connected to the second potential point TR2 (for example, through a resistor, a jumper or a switch).

[0046] Therefore, when the first gallium nitride component and the driving circuit A are soldered to the PCB 300, the third potential point TR3 is connected to the first potential point TR1 through a resistor, a jumper or a switch so that the ground pin of the first gallium nitride component is connected to the ground end of the driving circuit A; when the second gallium nitride component and the driving circuit B are soldered to the PCB 300, the fourth potential point TR4 is connected to the second potential point TR2 through a resistor, a jumper or a switch so that the ground pin of the second gallium nitride component is connected to the ground end of the driving circuit B.

[0047] According to an embodiment, which can be combined with any other embodiment described herein, similar to the first and second potential points TR1 , TR2 , the third and fourth potential points TR3 , TR4 may also be pads or vias.

[0048] Figure 5 is a schematic diagram of a PCB for a gallium nitride component according to another embodiment of the present invention. Figure 5 The PCB shown with Figure 3 Similar, except that Figure 5 The first potential point TR1 and the second potential point TR2 of the PCB 300 are connected to a common ground instead of the ground terminal of the driving circuit A or the driving circuit B.

[0049] In fact, Figure 3 In the embodiment, even if the first potential point TR1 and the second potential point TR2 are connected to the ground terminal of the driving circuit A or the driving circuit B respectively, they are further connected to the common ground. Therefore, even if the welding position 330 is left empty when welding the first gallium nitride component, or the welding position 320 is left empty when welding the second gallium nitride component, it is necessary to ensure that the peripheral circuit connected to the pads 315-316 does not affect the operation of the first gallium nitride component through the disconnectable ground connection relationship between the first potential point TR1 and the pad 314 and the disconnectable ground connection relationship between the second potential point TR2 and the pad 315, and ensure that the peripheral circuit connected to the pads 313-314 does not affect the operation of the second gallium nitride component.

[0050] Figure 6is a schematic diagram of a PCB for a gallium nitride component according to another embodiment of the present invention. Figure 6 The PCB shown with Figure 3 The PCB 300 is similar, except that the PCB 300 further has a fifth potential point TR5 and a sixth potential point TR6. The fifth potential point TR5 is connected to the gate signal terminal of the driving circuit A via the gate wiring 322, and the fifth potential point TR5 is disconnectably connected to the pad 313 (for example, through a resistor, a jumper or a switch). The sixth potential point TR6 is connected to the gate signal terminal of the driving circuit B via the gate wiring 332, and the sixth potential point TR6 is disconnectably connected to the pad 316 (for example, through a resistor, a jumper or a switch). Therefore, when the first gallium nitride component is soldered to the PCB 300, the pad 315 and the second potential point TR2, as well as the pad 316 and the sixth potential point TR6 can be disconnected to ensure that the peripheral circuit connected to the pads 315-316 does not affect the operation of the first gallium nitride component; when the second gallium nitride component is soldered to the PCB 300, the pad 314 and the first potential point TR1, as well as the pad 313 and the fifth potential point TR5 can be disconnected to ensure that the peripheral circuit connected to the pads 313-314 does not affect the operation of the second gallium nitride component.

[0051] According to an embodiment that can be combined with any other embodiment described herein, similar to the first and second potential points TR1, TR2, the fifth and sixth potential points TR5, TR6 can also be pads or vias. And according to an embodiment that can be combined with any other embodiment described herein, Figure 6 The illustrated PCB 300 may be further formed with an additional potential point connected to the pad 313 and disconnectably connected to the fifth potential point TR5 , and an additional potential point connected to the pad 316 and disconnectably connected to the sixth potential point TR6 .

[0052] Figure 7 is a schematic diagram of a PCB for a gallium nitride component according to another embodiment of the present invention. Figure 7 The PCB shown with Figure 3 The difference is that the pads 313-314 and the pads 315-316 of the PCB 300 are respectively located on different sides of the welding position 310, and the first potential point TR1 associated with the pad 314 and the second potential point TR2 associated with the pad 315 are also arranged on different sides of the welding position 310. Therefore, as long as the positions of the source and drain pins of the gallium nitride components in different package forms are substantially the same, by arranging pads for welding the gate pin and the ground pin of the gallium nitride component on different sides of the welding position 310, the PCB 300 can be compatible with gallium nitride components with various gate pin and ground pin positions.

[0053] While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope and such scope is determined by the claims that follow.

Claims

1. A printed circuit board for a gallium nitride device, characterized in that: The printed circuit board is formed with: a gallium nitride soldering site, to which a first gallium nitride component and a second gallium nitride component having different packages can be interchangeably soldered; a first driving circuit welding position, used for welding the first driving circuit of the first gallium nitride component to the first driving circuit welding position; and A second driving circuit welding position is used for welding the second driving circuit of the second gallium nitride component to the second driving circuit welding position, The gallium nitride solder joint comprises: A first gate pad, welded to the gate of the first gallium nitride component and connected to a gate signal terminal of the first driving circuit; A second gate pad, welded to the gate of the second gallium nitride component and connected to a gate signal terminal of the second driving circuit; a first ground pad; a second ground pad; a first potential point, disconnectably connected to the first ground pad, and a ground terminal of the first drive circuit is directly connected to the first potential point; and The second potential point is disconnectably connected to the second ground pad, and the ground terminal of the second driving circuit is directly connected to the second potential point.

2. The printed circuit board according to claim 1, characterized in that: The gallium nitride welding position further comprises: a drain pad, to which the drain of the first gallium nitride component or the second gallium nitride component is soldered; and A source pad, to which the source of the first gallium nitride component or the second gallium nitride component is soldered.

3. The printed circuit board according to claim 1, characterized in that: The first potential point and the first ground pad are connected via a resistor, a jumper or a switch, and the second potential point and the second ground pad are connected via a resistor, a jumper or a switch.

4. The printed circuit board according to claim 1, characterized in that: The first potential point and the second potential point are pads or vias.

5. The printed circuit board according to claim 1, characterized in that: A gate signal terminal of the first driving circuit is directly connected to the first gate pad, and a gate signal terminal of the second driving circuit is directly connected to the second gate pad.

6. The printed circuit board according to claim 1, characterized in that: The gallium nitride welding position further comprises: a third potential point, directly connected to the first ground pad and disconnectably connected to the first potential point; and The fourth potential point is directly connected to the second ground pad and is disconnectably connected to the second potential point.

7. The printed circuit board according to claim 6, characterized in that: The first potential point and the third potential point are connected via a resistor, a jumper or a switch, and the second potential point and the fourth potential point are connected via a resistor, a jumper or a switch.

8. The printed circuit board according to claim 1 or 6, characterized in that: The gallium nitride welding position further comprises: a fifth potential point, which is disconnectably connected to the first gate pad and directly connected to a gate signal terminal of the first driving circuit; and The sixth potential point is disconnectably connected to the second gate pad and directly connected to the gate signal terminal of the second driving circuit.

9. The printed circuit board according to claim 8, characterized in that: The fifth potential point and the first gate pad are connected via a resistor, a jumper or a switch, and the sixth potential point and the second gate pad are connected via a resistor, a jumper or a switch.

10. The printed circuit board according to claim 1, characterized in that: The first gate pad and the first potential point are located on a first side of the gallium nitride soldering site, and the second gate pad and the second potential point are located on a second side of the gallium nitride soldering site, wherein the first side and the second side are the same side or different sides of the gallium nitride soldering site.

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