Display panel repair method, repair device and repair system

Abstract

The embodiments of the present disclosure provide a method, a device and a system for repairing a display panel. The repair device includes: a heating module, including a heating body and a heating probe, the heating probe is connected to the heating body, the heating module is configured to be heated when a heating voltage is applied, and the heating probe is configured to contact a target object and heat the target object; a pickup module, including a pickup body and a pickup probe, the pickup probe is electrically connected to the pickup body, the pickup body is configured to generate an electric charge at the end of the pickup probe when a pickup voltage is applied, and the pickup probe is configured to absorb the target object under the action of the electric charge. Using the repair device to repair the display panel will not damage the light-emitting diode chips in other positions, and the heating energy is much less than the high-energy-density laser energy, and will not cause damage to the substrate, thereby avoiding failure of the display panel, simplifying the repair process, and improving the repair efficiency.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel repair method, repair device, and repair system. Background Art

[0002] Micro LED displays are hailed as the next generation of display technology, boasting advantages such as high efficiency, high brightness, low power consumption, high reliability, and long life. This display technology involves thinning, miniaturizing, and arraying LED structures to sizes ≤50μm. These are then transferred in large quantities onto a substrate, bonded, and packaged to form a micro LED display panel.

[0003] A large number of Micro LEDs are transferred onto a single Micro LED display panel, and current transfer yields cannot reach 100%. Therefore, repairing bad pixels on the display panel is necessary. The existing repair process is complex, requiring almost the entire mass transfer process and equipment, and can easily damage the substrate, causing display panel failure. Summary of the Invention

[0004] The embodiments of the present disclosure provide a display panel repair method, a repair device, and a repair system to solve or alleviate one or more technical problems in the prior art.

[0005] As a first aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a repair device, comprising:

[0006] a heating module comprising a heating body and a heating probe, wherein the heating probe is connected to the heating body, the heating module is configured to be heated when a heating voltage is applied, and the heating probe is configured to contact a target object and heat the target object;

[0007] The pickup module includes a pickup body and a pickup probe. The pickup probe is electrically connected to the pickup body. The pickup body is configured to generate an electric charge at the end of the pickup probe when a pickup voltage is applied. The pickup probe is configured to absorb the target object under the action of the electric charge.

[0008] In some possible implementations, the pickup probe includes a conductive part and a dielectric layer. The conductive part is electrically connected to the pickup body. The dielectric layer is arranged on the end surface of the conductive part away from the pickup body. When the pickup voltage is applied, an electric charge is generated on the surface of the dielectric layer.

[0009] In some possible implementations, the pick-off voltage is applied at a preset frequency.

[0010] In some possible implementations, the thickness of the dielectric layer ranges from 1 μm to 5 μm.

[0011] In some possible implementations,

[0012] The heating module further includes a second wire connected to the heating body, and the second wire is configured to receive a heating voltage to heat the heating module; or

[0013] The heating module further includes a second wire, which is at least wound around the surface of the heating body. When a heating voltage is applied to the second wire, the second wire generates heat and conducts heat to the heating body and the heating probe.

[0014] In some possible implementations, the repair device is used to repair a display panel, the display panel including a base substrate and a plurality of light-emitting diode chips located on one side of the base substrate, the plurality of light-emitting diode chips being bonded to the base substrate, and the target object being the light-emitting diode chips;

[0015] The heating probe is configured to contact a first LED chip or a second LED chip and heat the first LED chip or the second LED chip to debond the first LED chip from the substrate, or to bond the second LED chip to the substrate, wherein the first LED chip corresponds to a bad pixel on the display panel, and the second LED chip is a new LED chip used to repair the bad pixel.

[0016] The pickup probe is configured to attract the first LED chip or the second LED chip under the action of the electric charge.

[0017] In some possible implementations, the repair device also includes a first moving mechanism and a second moving mechanism, the first moving mechanism is connected to the heating module, and the first moving mechanism is configured to drive the heating module to move, and the second moving mechanism is connected to the picking module, and the second moving mechanism is configured to drive the picking module to move.

[0018] As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a method for repairing a display panel, using the repair device of any embodiment of the present disclosure, wherein the display panel includes a base substrate and a plurality of light-emitting diode chips located on one side of the base substrate, wherein the plurality of light-emitting diode chips are bonded to the base substrate, and the method includes:

[0019] Using a pickup module to absorb the second light-emitting diode chip, and placing the second light-emitting diode chip at a target position, where the target position is a position corresponding to the bad pixel on the display panel;

[0020] The heating module is used to heat the second light-emitting diode chip so that the second light-emitting diode chip is bonded to the substrate.

[0021] In some possible implementations, the repair method further includes:

[0022] Using a heating module to heat a first light-emitting diode chip to debond the first light-emitting diode chip from the substrate, the first light-emitting diode chip being the light-emitting diode chip located at a target position;

[0023] A pickup module is used to absorb the first light emitting diode chip and remove the first light emitting diode chip.

[0024] In some possible implementations, using a heating module to heat the first LED chip / the second LED chip includes:

[0025] Controlling the heating module to move to a target position and applying a heating voltage to the heating module;

[0026] The heating module is controlled to contact the first LED chip / the second LED chip to heat the first LED chip / the second LED chip.

[0027] In some possible implementations, using a pickup module to absorb the first LED chip / the second LED chip includes:

[0028] Controlling the pickup module to move to the location of the first light-emitting diode chip / the second light-emitting diode chip, and applying a pickup voltage to the pickup module so that an electric charge is generated at the end of the pickup probe of the pickup module;

[0029] The pickup module is controlled to contact the first LED chip / the second LED chip, so that the pickup probe absorbs the first LED chip / the second LED chip under the action of the electric charge.

[0030] In some possible implementations, the repair method further includes:

[0031] Light up the display panel;

[0032] The target position is determined according to the lighting status of the display panel.

[0033] As a third aspect of an embodiment of the present disclosure, an embodiment of the present disclosure provides a repair system for repairing a display panel. The repair system includes the repair device in any embodiment of the present disclosure, and also includes a detection device. The detection device is used to light up the display panel and determine the target position according to the lighting state of the display panel.

[0034] When using the repair device of the disclosed embodiment to repair a display panel, the heating module and pickup module only contact the LED chip at the location of the defective pixel, avoiding contact with LED chips elsewhere, thereby preventing damage to the LED chips elsewhere. Furthermore, the heating energy is significantly less than that of a high-energy-density laser, preventing damage to the substrate and preventing display panel failure. Furthermore, the repair process is simple and allows for targeted repair of defective pixels, improving repair efficiency and the display panel repair yield.

[0035] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present disclosure will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the present disclosure and should not be regarded as limiting the scope of the present disclosure.

[0037] Figure 1 is a structural diagram of a display panel;

[0038] Figure 2 This is a schematic structural diagram of a repair device in one embodiment of the present disclosure;

[0039] Figure 3 This is a schematic diagram of a pickup voltage applied to a pickup body in one embodiment of the present disclosure;

[0040] Figure 4 A schematic diagram of a waveform of voltage applied to a pickup module;

[0041] Figure 5 Schematic diagram of the electrostatic attraction generated by the dielectric layer;

[0042] Figure 6 This is a structural diagram of a picking module in a repair device according to another embodiment of the present disclosure;

[0043] Figure 7 This is a schematic structural diagram of a heating module in a repair device according to another embodiment of the present disclosure;

[0044] Figure 8 This is a schematic diagram of a repair process flow of a display panel according to an embodiment of the present disclosure;

[0045] Figure 9a A schematic diagram of a debonding process during a repair process of a display panel according to an embodiment;

[0046] Figure 9b is a schematic diagram of removing a first light-emitting diode chip during a repair process of a display panel according to an embodiment;

[0047] Figure 9c is a schematic diagram of placing a second light-emitting diode chip at a target position during a repair process of a display panel according to an embodiment;

[0048] Figure 9d FIG1 is a schematic diagram of bonding a second light-emitting diode chip to a base substrate during a repair process of a display panel according to an embodiment.

[0049] Description of reference numerals:

[0050] 10. Base substrate; 20. LED chip; 21. First LED chip; 22. Second LED chip; 30. Heating module; 31. Heating body; 32. Heating probe; 33. Second wire; 34. Second shell; 40. Suction module; 41. Suction body; 42. Suction probe; 421. Conductor; 422. Dielectric layer; 43. First wire; 44. First shell. DETAILED DESCRIPTION

[0051] In the following, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure, and different embodiments may be combined in any manner without conflict. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0052] Figure 1 Schematic diagram of the structure of a display panel. Figure 1 As shown, the display panel can be a Micro LED display panel, including a base substrate 10 and a plurality of light-emitting diode chips 20 located on one side of the base substrate 10 , and each light-emitting diode chip 20 is bonded to the base substrate 10 .

[0053] During the preparation of the display panel, a transfer process can be used to transfer a large number of light-emitting diode chips 20 to the base substrate 10. The metal pads of the light-emitting diode chip 20 and the pads on the base substrate 10 are usually made of two metals. The metal pads of the light-emitting diode chip 20 and the pads on the base substrate 10 are bonded to each other by metal bonding, so that the light-emitting diode chip 20 and the base substrate 10 are combined together. Metal bonding includes metal eutectic alloy bonding, transient liquid phase bonding, etc. After metal bonding, the display panel needs to be lit for inspection, and the yield is judged by the number of dead points (light-emitting diode chips that are not lit).

[0054] LED chip lighting failure can be categorized as either regional or non-regional. Regional failure occurs when all LED chips within a region fail to light. This failure is typically caused by issues with the substrate circuitry or a serious problem during the previous process transfer. In this case, repair is not necessary; the process needs to be addressed.

[0055] Non-regional defects are manifested as sporadic defective LED chips when lighting. The causes of such defects include missing LED chips, offset of the LED chips resulting in inability to connect with the substrate, damage to the LED chips themselves or ineffective bonding, etc.

[0056] Currently, the transfer yield cannot reach 100%. Therefore, a display panel prepared using the transfer process may have bad pixels. For non-regional bad pixels, the bad pixels on the display panel need to be repaired.

[0057] In related art, a high-energy-density laser is used to remove the LED chip at the defective pixel location. A new LED chip is then transferred to the defective pixel location through single-point transfer or selective transfer. The new LED chip is then bonded to the substrate 10 using a bonding process to repair the defective pixel. This repair process requires a mass transfer process and equipment, making it complex. Furthermore, the high-energy-density laser can easily damage the substrate, causing display panel failure.

[0058] Figure 2 This is a schematic diagram of the structure of a repair device in one embodiment of the present disclosure. Figure 2 FIG. 4 shows only the structural diagram of the heating module 30 and the picking module 40 of the repair device. Figure 2 As shown, the repair device may include a heating module 30 and a pickup module 40. The heating module 30 includes a heating body 31 and a heating probe 32, the heating probe 32 being connected to the heating body 31. The heating module 30 is configured to be heated when a heating voltage is applied, and the heating probe 32 is configured to contact and heat the target object. The pickup module 40 includes a pickup body 41 and a pickup probe 42, the pickup probe 42 being electrically connected to the pickup body 41. The pickup body 41 is configured to generate an electric charge at the end of the pickup probe 42 when a pickup voltage is applied, and the pickup probe 42 is configured to attract the target object under the action of the electric charge.

[0059] It should be noted that after the picking module 40 moves the target object to the corresponding position, it stops applying the picking voltage to the picking body 41 . As the charge decreases, the picking module 40 can release the target object.

[0060] In the disclosed embodiments, the connection method between the heating probe 32 and the heating body 31 is not limited, as long as the heating body 31 can transfer heat to the heating probe 32 so that the heating probe 32 can heat the target object when in contact with the target object. For example, the heating probe 32 and the heating body 31 can be integrally formed, or connected to the heating body 31 via a component with a good thermal conductivity coefficient.

[0061] In the embodiment of the present disclosure, the pickup probe 42 and the pickup body 41 can be an integral structure, or the pickup probe 42 and the pickup body 41 can be electrically connected through a conductor such as a wire, so that after the pickup voltage is applied to the pickup body 41, the end of the pickup probe 42 can generate an electric charge.

[0062] The repair device of the embodiment of the present disclosure can be used to repair a display panel. The display panel may include a base substrate 10 and a plurality of light emitting diode chips 20 located on one side of the base substrate 10. Figure 1 As shown, each LED chip 20 is bonded to the substrate 10, and the LED chip can be a target object. For example, the first LED chip can be the LED chip corresponding to the bad pixel on the display panel, and the second LED chip is a new LED chip used to repair the bad pixel. The heating probe 32 is configured to contact the first LED chip or the second LED chip and heat the first LED chip or the second LED chip to debond the first LED chip from the substrate, or to bond the second LED chip to the substrate. The pickup probe 42 is configured to absorb the first LED chip or the second LED chip under the action of an electric charge.

[0063] When repairing a display panel using the repair device of the disclosed embodiment, the heating module 30 can be used to heat the first LED chip to debond it from the substrate; the pickup module 40 can be used to absorb and remove the first LED chip; the pickup module 40 can be used to absorb and place the second LED chip at a target location corresponding to the first LED chip; and the heating module 30 can be used to heat the second LED chip to bond it to the substrate. This allows the repair of a defective LED chip.

[0064] When using the repair device of the disclosed embodiment to repair a display panel, the heating module 30 and the pickup module 40 only contact the LED chip at the location of the defective pixel and avoid contacting the LED chips at other locations, thereby preventing damage to the LED chips at other locations. Furthermore, the heating energy is significantly less than the energy of a high-energy-density laser, preventing damage to the substrate and thus preventing display panel failure. Furthermore, the repair process is simple and allows for targeted repair of defective pixels, improving repair efficiency and the display panel repair yield.

[0065] For example, the light-emitting diode chip in the embodiment of the present disclosure may be a sub-millimeter light-emitting diode (Mini Light Emitting Diode, referred to as Mini LED) chip, or may be a micro light-emitting diode (Micro Light Emitting Diode, referred to as Micro LED) chip.

[0066] In one embodiment, Figure 2 As shown, the pickup probe 42 may include a conductive portion 421 and a dielectric layer 422. The conductive portion 421 is electrically connected to the pickup body 41. The dielectric layer 422 is disposed on the end surface of the conductive portion 421 away from the pickup body 41. When a pickup voltage is applied to the pickup body 41, a charge is generated on the surface of the dielectric layer 422. When the pickup module 40 is used to pick up a target object, the dielectric layer 422 contacts the surface of the target object. Under the action of the charge, the dielectric layer 422 generates an attractive force towards the target object, thereby attracting the target object.

[0067] The pickup probe 42 is configured to include a conductive portion 421 and a dielectric layer 422 , so that a pickup voltage is applied to the conductive portion 421 and the pickup body 41 at the same time, which can generate more charges in the dielectric layer 422 and improve the attraction of the dielectric layer 422 to the target object.

[0068] Exemplarily, the material of the pickup body 41 and the conductive part 421 can both be metal, having a certain hardness and good conductivity. The material of the pickup body 41 and the conductive part 421 can be the same. The material of the pickup body 41 and the conductive part 421 can be copper or a copper alloy. The outer surface of the pickup body 41 and the conductive part 421 can be provided with an anti-oxidation coating.

[0069] Exemplarily, the material of the dielectric layer 422 can be a high dielectric constant material. The material of the dielectric layer 422 can include one or more of hafnium oxide, hafnium oxynitride, hafnium silicate, zirconium oxide, zirconium silicate, tantalum oxide, barium strontium titanate, barium titanate, strontium titanate, yttrium oxide, aluminum oxide, a polymer-based composite material, or two or more thereof. The material of the dielectric layer 422 is set to a high dielectric constant material. When the pickup voltage is applied to the pickup body 41, a certain amount of charge can be accumulated on the outer surface of the dielectric layer 422. The accumulated charge can generate an electrostatic attraction to the target object to attract the target object. Here, there is no restriction on the specific material of the dielectric layer, as long as the function of the dielectric layer can be achieved.

[0070] Figure 3 FIG. 4 is a schematic diagram of an embodiment of the present disclosure after applying a pickup voltage to the pickup body. For example, the pickup voltage can be a positive voltage. When a positive voltage is applied to the pickup body 41, as shown in FIG. Figure 3 As shown, the conductive portion 421 of the pickup probe 42 generates positive charges, and the dielectric layer 422 generates negative charges.

[0071] The value of the pickup voltage can be set as needed, as long as it is ensured that after the pickup voltage is applied to the pickup body 41 , the electrostatic attraction generated by the dielectric layer 422 on the target object is greater than the gravity of the target object.

[0072] It should be noted that the dielectric layer 422 has a critical point for withstanding electrostatic breakdown. During the process of picking up a target object using the pickup module 40, the pickup voltage can be kept constant so that the pickup probe 42 can generate a stable electrostatic attraction force toward the target object. To prevent the dielectric layer 422 from being broken down by electrostatic discharge, the static electricity generated by the dielectric layer 422 when a positive voltage is applied to the pickup body 41 should not cause breakdown of the dielectric layer 422.

[0073] Figure 4 Schematic diagram of the waveform of the voltage applied to the pickup module. In one embodiment, in order to ensure that the electrostatic attraction generated by the dielectric layer 422 on the target object is greater than the gravity of the target object and does not cause the dielectric layer 422 to be electrostatically broken down, a preset pickup voltage can be applied at a preset frequency. Figure 4 As shown, the period of applying the pickup voltage V1 can be T0, and the duration of applying the pickup voltage V1 can be T1. That is, within one period T0, the pickup voltage V1 is applied to the pickup body 41 for a duration of T1, and the duration of stopping applying the pickup voltage V1 to the pickup body 41 is T2 (T2=T0-T1).

[0074] A pickup voltage is applied to the pickup body 41 at a preset frequency. When the pickup voltage is applied, charges accumulate on the dielectric layer 422, generating an electrostatic attraction force greater than the gravity of the target object. When the pickup voltage is stopped, the charges on the dielectric layer 422 can be prevented from continuing to accumulate, thereby preventing the dielectric layer 422 from being broken down by static electricity.

[0075] Figure 5 Schematic diagram of the electrostatic attraction generated by the dielectric layer. Figure 4 and Figure 5 As shown, from t1 to t2, the pickup voltage V1 is applied to the pickup body 41, and from t2 to t3, the application of the pickup voltage V1 is stopped. At t1, the pickup voltage V1 is applied to the pickup body 41. From t1 to t2, as the time of applying the pickup voltage V1 increases, the static charge accumulated on the dielectric layer 422 gradually increases, and the electrostatic attraction generated by the dielectric layer 422 gradually increases. At t2, the application of the pickup voltage to the pickup body 41 is stopped, and the electrostatic attraction at t2 reaches a maximum value. From t2 to t3, as the time of stopping the application of the pickup voltage V1 increases, the static charge accumulated on the dielectric layer 422 is lost, the amount of static charge gradually decreases, and the electrostatic attraction generated by the dielectric layer 422 gradually decreases. At t3, the pickup voltage is applied to the pickup body 41, and the electrostatic attraction at t3 is a minimum value.

[0076] By controlling the duration T1 of applying the pickup voltage V1, the amount of static charge accumulated on the dielectric layer 422 can be controlled to prevent the dielectric layer 422 from being broken down by static electricity; by controlling the duration T2 of stopping applying the pickup voltage V1, the minimum value of the electrostatic attraction generated by the dielectric layer 422 can be controlled to prevent the minimum value of the electrostatic attraction from being less than the gravity of the target object, thereby preventing the target object from falling off the pickup module during the repair process.

[0077] In this embodiment, the durations of T1 and T2 can be set as needed, as long as the dielectric layer is not broken down by static electricity and the electrostatic attraction of the dielectric layer is greater than the gravity of the target object.

[0078] In one embodiment, Figure 2As shown, the thickness of the dielectric layer 422 can range from 1 μm to 5 μm (including endpoint values). Exemplarily, the thickness of the dielectric layer 422 can be any value between 1 μm and 5 μm. For example, the thickness of the dielectric layer 422 can be 1 μm, 2 μm, 3 μm, 4 μm or 5 μm. When the thickness of the dielectric layer 422 is less than 1 μm, the dielectric layer 422 is too thin and easily wears out, reducing the life of the pickup module; when the thickness of the dielectric layer 422 is greater than 5 μm, the dielectric layer 422 is too thick, which reduces the electrostatic attraction of the dielectric layer 422 to the target object. Setting the thickness of the dielectric layer 422 to 1 μm to 5 μm can not only extend the service life of the pickup module, but also ensure the electrostatic attraction of the dielectric layer 422 to the target object.

[0079] The specific value of the thickness of the dielectric layer 422 can be determined according to the material of the dielectric layer, the gravity of the target object, the value of the pickup voltage, and the duration of T1.

[0080] Exemplarily, the dielectric layer 422 may include a stacked hafnium oxide layer and a silicon nitride layer, the thickness of the hafnium oxide layer may be 2 μm, the thickness of the silicon nitride layer may be 50 nm, the voltage applied to the pickup body is 70 V AC, and the target object may be a Micro LED chip with a diameter of 10 μm.

[0081] In one embodiment, Figure 2 and Figure 1 As shown, the pickup body 41 may be a columnar body, and the conductive portion 421 of the pickup probe 42 may be a cone-shaped body, and the size of the conductive portion 421 gradually decreases in the direction away from the pickup body 41. For example, the dimension X1 of the end of the pickup probe 42 away from the pickup body 41 may be greater than or equal to 10 μm and less than or equal to (Y0+Y1+Y2), where Y0 is the dimension of the target object in a direction parallel to the substrate, Y1 is the dimension of the target object in a direction parallel to the substrate and the object on one side, and Y2 is the dimension of the target object in a direction parallel to the substrate and the object on the other side. Thus, when the end of the pickup probe 42 contacts the surface of the target object, it will not touch or damage surrounding objects.

[0082] In one embodiment, Figure 2 As shown, the pickup module 40 may further include a first wire 43 connected to the pickup body 41 and configured to receive the pickup voltage. The pickup module 40 may further include a first housing 44 disposed on the pickup body 41. For example, the first housing 44 may be fixedly connected to the pickup body 41. The connection between the first wire 43 and the pickup body 41 is located within the first housing 44. The first housing 44 may protect the connection between the first wire 43 and the pickup body 41.

[0083] Figure 6 FIG. 1 is a schematic diagram of the structure of a pickup module in a repair device according to another embodiment of the present disclosure. Figure 6 As shown, the first housing 44 is disposed on the pickup probe 42, and the first housing 44 extends from the pickup probe 42 toward the pickup body 41. The connection between the first wire 43 and the pickup body 41 is located within the first housing 44. For example, the first housing 44 can be fixedly connected to the pickup probe 42, and the pickup body 41 is located within the first housing 44.

[0084] In one embodiment, Figure 2 As shown, the heating module 30 may further include a second wire 33, which may be connected to the heating body 31. The second wire 33 is configured to receive a heating voltage, so that the heating body 31 receives the heating voltage to heat the heating module 30. For example, the heating probe 32 may be integral with the heating body 31, and the heating probe 32 and the heating body 31 may be made of a material that is a good electrical conductor. When the second wire 33 is applied with a heating voltage, the heating body 31 and the heating probe 32 are also applied with a heating voltage, so that the heating probe 32 generates heat. When the heating probe 32 contacts the target object, the heat is transferred to the target object, heating the target object. For example, the target object is a first light-emitting diode chip. When the heating probe 32 heats the first light-emitting diode chip, the high heat debonds the metal pad of the first light-emitting diode chip from the pad of the substrate.

[0085] In one embodiment, Figure 2 As shown, the heating module 30 may further include a second housing 34, which is disposed on the heating body 31. For example, the second housing 34 is fixedly connected to the heating body 31. The connection between the second wire 33 and the heating body 31 is located within the second housing 34. The second housing 34 can protect the connection between the second wire 33 and the heating body 31.

[0086] Figure 7 FIG. 1 is a schematic diagram of the structure of a heating module in a repair device according to another embodiment of the present disclosure. Figure 7 As shown, the heating module 30 further includes a second wire 33, which can be a wire for heating. The second wire 33 is wound around at least the surface of the heating body 31. When a heating voltage is applied to the second wire 33, it generates heat and conducts heat to the heating body 31 and the heating probe 32.

[0087] In one embodiment, Figure 7As shown, the heating module 30 may further include a second housing 34 , which is disposed on the heating probe 32 , and the second wire 33 wound around the heating module 30 is located within the second housing 34 . The second housing 34 may protect the second wire 33 .

[0088] Exemplarily, the material of the heating body 31 and the heating probe 32 can be metal. For example, the material of the heating body 31 and the heating probe 32 can be metal with certain hardness, high melting point and high resistivity, such as metal tungsten or tungsten alloy.

[0089] In one embodiment, Figure 2 and Figure 1 As shown, the heating body 31 can be a columnar body, the heating probe 32 can be a cone-shaped body, and the size X2 of the heating probe 32 gradually decreases in the direction away from the heating body 31. For example, the size X2 of the end of the heating probe 32 away from the heating body 31 can be greater than or equal to 10μm and less than or equal to (Y0+Y1+Y2), where Y0 is the size of the target object in the direction parallel to the substrate, Y1 is the size of the target object and the object on one side in the direction parallel to the substrate, and Y2 is the size of the target object and the object on the other side in the direction parallel to the substrate. Therefore, when the end of the heating probe 32 contacts the surface of the target object, it will not touch or damage the surrounding objects.

[0090] For example, when the target object is a light emitting diode chip, the temperature of the heating probe 32 greater than or equal to 250° C. can meet the heating requirement. For example, the temperature of the heating probe 32 can be 300° C.

[0091] Exemplarily, the metal combination used for the metal pad of the LED chip and the pad on the substrate can be In / Au (indium / gold), Sn / Cu (tin / copper), Sn / Ag / Cu (tin / silver / copper), etc., so that when the temperature of the heating probe 32 is greater than or equal to 250°C, the heating probe 32 contacts the LED chip, and the metal solder between the metal pad of the LED chip and the pad on the substrate can be melted, thereby releasing the bond between the LED chip and the substrate.

[0092] In one embodiment, the repair device may further include a first moving mechanism and a second moving mechanism. The first moving mechanism may be connected to the heating module and configured to move the heating module. For example, the first moving mechanism may move the heating module to a target location where a target object is located to heat the target object. After heating is completed, the first moving mechanism may move the heating module to another location.

[0093] The second moving mechanism can be connected to the picking module and configured to move the picking module. For example, the second moving mechanism can move the picking module to a location where a target object is located so that the target object can be picked up. After the picking module picks up the target object, the second moving mechanism can move the picking module to another location.

[0094] In other embodiments, the heating module and the picking module can be combined as a combination, and the combination can adopt a set of moving mechanisms to increase the repair speed.

[0095] The present disclosure also provides a method for repairing a display panel, using the repair device of any of the above embodiments. The display panel includes a base substrate and a plurality of light-emitting diode chips located on one side of the base substrate, wherein the plurality of light-emitting diode chips are bonded to the base substrate. The method for repairing the display panel includes:

[0096] S11: using a pickup module to pick up the second LED chip and placing the second LED chip at a target position, where the target position is a position corresponding to the bad pixel on the display panel;

[0097] S12: heating the second LED chip using a heating module to bond the second LED chip to the substrate.

[0098] In one embodiment, the display panel repair method may further include: S13: using a heating module to heat the first LED chip to debond the first LED chip from the substrate, the first LED chip being the LED chip located at the target position; S14: using a pickup module to absorb the first LED chip and remove the first LED chip.

[0099] It should be noted that the first LED chip may be a LED chip corresponding to a bad pixel in the display panel, and the second LED chip may be a LED chip used to replace the first LED chip.

[0100] The reasons for non-regional failure in the poor lighting of LED chips include missing LED chips, deviation of LED chips resulting in inability to connect with the substrate, damage to the LED chips themselves or ineffective bonding, etc.

[0101] For defects caused by missing parts, the display panel can be repaired using steps S11 and S12.

[0102] For a defective pixel where a first LED chip exists and cannot be illuminated, steps S13 and S14 can be used to remove the first LED chip. In this case, the defective pixel location becomes the location corresponding to the missing first LED chip. Then, steps S11 and S12 are used again to repair the display panel.

[0103] In one embodiment, using a heating module to heat the first LED chip / the second LED chip may include: controlling the heating module to move to a target position and applying a heating voltage to the heating module; controlling the heating module to contact the first LED chip / the second LED chip to heat the first LED chip / the second LED chip.

[0104] In one embodiment, using a pickup module to absorb the first LED chip / the second LED chip may include: controlling the pickup module to move to the position of the first LED chip / the second LED chip, and applying a pickup voltage to the pickup module so that an electric charge is generated at the end of the pickup probe of the pickup module; controlling the pickup module to contact the first LED chip / the second LED chip so that the pickup probe absorbs the first LED chip / the second LED chip under the action of the electric charge.

[0105] In one embodiment, the display panel repair method further includes: lighting the display panel; and determining the target position according to the lighting state of the display panel.

[0106] After a large number of LED chips are transferred to a substrate using a transfer process, a lighting test is performed on the resulting display panel. During the lighting test, locations with poor lighting are called bad pixels, and the locations of the bad pixels can be determined as target locations.

[0107] The following describes in detail the repair process of a display panel using a repair device, taking a non-regional defect where a first LED chip exists at the location of a bad pixel but fails to light up as an example. In this case, the first LED chip appears normal and is bonded to the substrate. Figure 8 This is a schematic diagram of a repair process flow of a display panel in an embodiment of the present disclosure, with reference to Figure 8 , the repair process is as follows:

[0108] The heating module 30 is controlled to move to the target position, and a heating voltage is applied to the heating module 30, so that the heating module 30 is heated to generate heat; the heating module 30 is controlled to contact the top surface of the first light-emitting diode chip at the target position, and the heating module 30 transfers heat to the first light-emitting diode chip 21, heating the first light-emitting diode chip 21, so that the solder bonding the metal pad of the first light-emitting diode chip 21 to the pad on the substrate is melted, and debonding is performed, such as Figure 9a As shown, Figure 9a This is a schematic diagram illustrating the debonding process during the repair of a display panel according to one embodiment. It should be noted that the order of controlling the movement of the heating module 30 and applying the heating voltage to the heating module 30 can be adjusted as needed, as long as the heating voltage is applied to the heating module 30 before it contacts the first LED chip at the target location. This allows the temperature of the heating module 30 to reach the required debonding temperature when it contacts the first LED chip, thereby improving the repair speed.

[0109] The picking module 40 is controlled to move to the position where the first light-emitting diode chip is located, and a picking voltage is applied to the picking module 40 so that the end of the picking probe 42 of the picking module 40 generates a charge; the picking module 40 is controlled to contact the top surface of the first light-emitting diode chip 21; the picking probe 42 generates an electrostatic attraction under the action of the charge, and the picking module 40 absorbs the first light-emitting diode chip through the electrostatic attraction and removes the first light-emitting diode chip. Figure 9b As shown, and after being placed in a discarded location, the power is turned off and the electrostatic attraction disappears. Figure 9b This is a schematic diagram illustrating the removal of a first LED chip during the repair process of a display panel according to one embodiment. It should be noted that the order of controlling the movement of the suction module 40 and applying the suction voltage to the pickup module 40 can be adjusted as needed, as long as the pickup voltage is applied to the pickup module 40 before the pickup module 40 contacts the first LED chip. This ensures that when the pickup module 40 contacts the first LED chip, the electrostatic attraction force is sufficient to attract the first LED chip, further improving the repair speed.

[0110] The picking module 40 is controlled to move to the position where the second LED chip is located, and a picking voltage is applied to the picking module 40 so that the end of the picking probe 42 of the picking module 40 generates a charge; the picking module 40 is controlled to contact the top surface of the second LED chip 22; the picking probe 42 generates an electrostatic attraction under the action of the charge, and the picking module 40 absorbs the second LED chip 22 through the electrostatic attraction and places the second LED chip 22 at the target position, as shown in FIG. Figure 9c As shown, Figure 9cThis is a schematic diagram illustrating placing a second LED chip at a target location during the repair process of a display panel according to one embodiment. It should be noted that the order of controlling the movement of the pickup module 40 and applying the pickup voltage to the pickup module 40 can be customized, as long as the pickup voltage is applied to the pickup module 40 before the pickup module 40 contacts the second LED chip. This ensures that when the pickup module 40 contacts the second LED chip, the electrostatic attraction force is sufficient to attract the second LED chip, further improving the repair process.

[0111] The heating module 30 is controlled to move to the target position, and a heating voltage is applied to the heating module 30, so that the heating module 30 is heated to generate heat; the heating module 30 is controlled to contact the top surface of the second light-emitting diode chip 22 at the target position; and the heat is transferred to the second light-emitting diode chip 22, heating the second light-emitting diode chip 22, so that the metal pad of the second light-emitting diode chip 22 is bonded to the solder eutectic on the pad on the substrate, and metal bonding is performed, such as Figure 9d As shown, Figure 9d This is a schematic diagram illustrating bonding a second LED chip to a base substrate during the repair process of a display panel according to one embodiment. After bonding is completed, the second LED chip is bonded to the base substrate. It should be noted that the order of controlling the movement of the heating module 30 and applying the heating voltage to the heating module 30 can be set as needed, as long as the heating voltage is applied to the heating module 30 before the heating module 30 contacts the second LED chip at the target position. This allows the temperature of the heating module 30 to reach the required bonding temperature when it contacts the second LED chip, thereby improving the repair speed.

[0112] For example, the second light-emitting diode chip can be placed at the target position by stamp transfer or selective transfer.

[0113] The embodiments of the present disclosure also provide a repair system for repairing a display panel. The repair system may include the repair device of any embodiment of the present disclosure, and may also include a detection device, which is connected to the repair device. The detection device is used to light up the display panel and determine the target position based on the lighting state of the display panel. Exemplarily, the target position may be the position corresponding to the bad pixel of the display panel. After the detection device determines the target position, the detection device sends the target position information to the repair device, and the repair device determines the target position based on the target position information, and uses the repair method of the embodiments of the present disclosure to repair the target position.

[0114] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present disclosure.

[0115] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of such features. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0116] In this disclosure, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections, electrical connections, or communication; direct connections or indirect connections through an intermediate medium; and internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on specific circumstances.

[0117] In the present disclosure, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0118] The disclosure above provides many different embodiments or examples for implementing different structures of the present disclosure. In order to simplify the present disclosure, the components and settings of specific examples are described above. Of course, these are merely examples and are not intended to limit the present disclosure. In addition, the present disclosure may repeat reference numbers and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0119] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any person skilled in the art can easily conceive of various modifications or substitutions within the technical scope disclosed in this disclosure, and such modifications or substitutions should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A repair device, characterized in that: include: a heating module, comprising a heating body and a heating probe, wherein the heating probe is connected to the heating body, the heating module is configured to be heated when a heating voltage is applied, and the heating probe is configured to contact a target object and heat the target object; The pickup module includes a pickup body and a pickup probe, wherein the pickup probe is electrically connected to the pickup body. The pickup body is configured to generate an electric charge at the end of the pickup probe when a preset pickup voltage in an intermittent state is applied, and the pickup probe is configured to absorb the target object under the action of the electric charge.

2. The repair device according to claim 1, characterized in that The pickup probe includes a conductive part and a dielectric layer. The conductive part is electrically connected to the pickup body. The dielectric layer is arranged on the end surface of the conductive part away from the pickup body. When the pickup voltage is applied, the charge is generated on the surface of the dielectric layer.

3. The repair device according to claim 2, characterized in that The pick-off voltage is applied at a predetermined frequency.

4. The repair device according to claim 2, characterized in that The thickness of the dielectric layer is in the range of 1 μm to 5 μm.

5. The repair device according to any one of claims 1 to 4, characterized in that: The heating module further includes a second wire connected to the heating body, and the second wire is configured to receive a heating voltage to heat the heating module; or The heating module further includes a second wire, which is wound around at least the surface of the heating body. When a heating voltage is applied to the second wire, the second wire generates heat and conducts heat to the heating body and the heating probe.

6. The repair device according to claim 1, characterized in that Used to repair a display panel, the display panel comprising a base substrate and a plurality of light-emitting diode chips located on one side of the base substrate, the plurality of light-emitting diode chips being bonded to the base substrate, and the target object being the light-emitting diode chips; The heating probe is configured to contact a first LED chip or a second LED chip and heat the first LED chip or the second LED chip to debond the first LED chip from the base substrate, or to bond the second LED chip to the base substrate, wherein the first LED chip is a LED chip corresponding to a bad pixel on the display panel, and the second LED chip is a new LED chip used to repair the bad pixel; The pickup probe is configured to attract the first LED chip or the second LED chip under the action of the charge.

7. The repair device according to claim 1, characterized in that It also includes a first moving mechanism and a second moving mechanism, the first moving mechanism is connected to the heating module, and the first moving mechanism is configured to drive the heating module to move, the second moving mechanism is connected to the picking module, and the second moving mechanism is configured to drive the picking module to move.

8. A method for repairing a display panel, characterized in that: Using the repair device according to any one of claims 1 to 7, the display panel includes a base substrate and a plurality of light-emitting diode chips located on one side of the base substrate, the plurality of light-emitting diode chips are bonded to the base substrate, and the method includes: Using a pickup module to absorb the second light-emitting diode chip, and placing the second light-emitting diode chip at a target position, where the target position is a position corresponding to the bad pixel on the display panel; A heating module is used to heat the second light-emitting diode chip so that the second light-emitting diode chip is bonded to the base substrate.

9. The repair method according to claim 8, characterized in that: Also includes: Using a heating module to heat a first light-emitting diode chip to debond the first light-emitting diode chip from the base substrate, the first light-emitting diode chip being the light-emitting diode chip located at the target position; A pickup module is used to absorb the first light-emitting diode chip and remove the first light-emitting diode chip.

10. The repair method according to claim 9, characterized in that: Using a heating module to heat the first light-emitting diode chip / the second light-emitting diode chip includes: controlling the heating module to move to the target position and applying a heating voltage to the heating module; The heating module is controlled to contact the first LED chip / the second LED chip to heat the first LED chip / the second LED chip.

11. The repair method according to claim 9, characterized in that: Adopting a pickup module to absorb the first light-emitting diode chip / the second light-emitting diode chip includes: Controlling the pickup module to move to the location of the first light-emitting diode chip / the second light-emitting diode chip, and applying a pickup voltage to the pickup module so that an end of the pickup probe of the pickup module generates an electric charge; The pickup module is controlled to contact the first LED chip / the second LED chip, so that the pickup probe absorbs the first LED chip / the second LED chip under the action of the charge.

12. The repair method according to any one of claims 8 to 11, characterized in that: Also includes: lighting up the display panel; The target position is determined according to the lighting state of the display panel.

13. A repair system, characterized in that: Used to repair a display panel, the repair system includes the repair device according to any one of claims 1 to 7, and also includes a detection device, the detection device is used to light up the display panel and determine the target position according to the lighting state of the display panel.

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