Electronic Devices

Abstract

The present disclosure provides an electronic device, comprising a substrate, a plurality of conductive patterns, and an adjustable element. The plurality of conductive patterns are arranged on the substrate. The adjustable element is arranged on at least one conductive pattern among the plurality of conductive patterns and comprises a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad overlap the at least one conductive pattern among the plurality of conductive patterns. The third pad is arranged between the first pad and the second pad.

Description

Technical Field

[0001] The present disclosure relates to an electronic device. Background Art

[0002] Radio Frequency (RF) devices in electronic devices are used to transmit or receive electromagnetic waves, and therefore are an indispensable part of wireless communication technology. How to increase the flexibility of circuit design, increase adjustable RF parameters, or adjust the radiation direction of electromagnetic waves is one of the research and development focuses of researchers in this field. Summary of the invention

[0003] The present disclosure provides an electronic device, which helps to increase the flexibility of circuit design, increase adjustable radio frequency parameters or adjust the transmission direction of electromagnetic waves.

[0004] According to an embodiment of the present disclosure, an electronic device includes a substrate, a plurality of conductive patterns, and an adjustable element. The plurality of conductive patterns are disposed on the substrate. The adjustable element is disposed on at least one conductive pattern among the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad overlap the at least one conductive pattern among the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

[0005] In order to make the above features and advantages of the present disclosure more obvious and understandable, embodiments are given below with reference to the accompanying drawings for detailed description as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figures 1 to 3 They are partial top view schematic diagrams of electronic devices according to the first embodiment to the third embodiment of the present disclosure;

[0007] Figure 4A and Figure 4B are respectively a partial top view and a partial cross-sectional view of an electronic device according to a fourth embodiment of the present disclosure;

[0008] Figure 5A and Figure 5B are respectively a partial top view and a partial cross-sectional view of an electronic device according to a fifth embodiment of the present disclosure;

[0009] Figures 6 to 8 are partial cross-sectional schematic diagrams of electronic devices according to the sixth embodiment to the eighth embodiment of the present disclosure;

[0010] Fig. 9 is a partial cross-sectional schematic diagram of an adjustable element according to an embodiment of the present disclosure;

[0011] Fig.10is a partial top view of an adjustable element according to another embodiment of the present disclosure;

[0012] Fig.11 is a partial cross-sectional schematic diagram of an electronic device according to a ninth embodiment of the present disclosure;

[0013] Figures 12 to 17 are simple circuit diagrams of adjustable elements according to various embodiments of the present disclosure;

[0014] Fig.18 and Fig.19 1 and 2 are partial top view schematic diagrams of tunable elements according to multiple embodiments of the present disclosure. DETAILED DESCRIPTION

[0015] The present disclosure may be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, in order to facilitate the reader's understanding and the simplicity of the drawings, the various drawings in the present disclosure only depict a portion of the electronic device / display device, and certain elements in the drawings are not drawn according to actual scale. In addition, the number and size of each element in the drawings are for illustration only and are not intended to limit the scope of the present disclosure. For example, for clarity, the relative size, thickness and position of each film layer, region or structure may be reduced or enlarged.

[0016] Certain words are used throughout this disclosure and in the claims that follow to refer to specific components. It should be understood by those skilled in the art that electronic equipment manufacturers may refer to the same components by different names. This document does not intend to distinguish between components that have the same function but different names. In the following description and claims, the words "having" and "including" are open-ended words and should therefore be interpreted as meaning "including but not limited to..."

[0017] The directional terms mentioned herein, such as "up", "down", "front", "back", "left", "right", etc., are only with reference to the directions of the accompanying drawings. Therefore, the directional terms used are for illustration and not for limiting the present disclosure. It should be understood that when an element or a film layer is referred to as being disposed "on" or "connected to" another element or film layer, the element or film layer may be directly on or directly connected to the other element or film layer, or there may be an intervening element or film layer between the two (indirect connection). Conversely, when an element or film layer is referred to as being "directly" "on" or "directly connected to" another element or film layer, there may be no intervening element or film layer between the two.

[0018] The terms "approximately", "equal to", "equal", "same", "substantially" or "approximately" mentioned herein generally represent falling within 10% of a given value, or falling within 5%, 3%, 2%, 1% or 0.5% of a given value. In addition, unless otherwise specified, the terms "a given range is from a first value to a second value", "a given value falls within the range from a first value to a second value" all mean that the given range includes the first value, the second value and other values ​​therebetween.

[0019] In some embodiments of the present disclosure, terms such as "connected" and "interconnected" may refer to two structures being in direct contact with each other, or may refer to two structures not being in direct contact with each other, with another structure disposed between the two structures, unless otherwise defined. Terms such as "connected" and "interconnected" may also include situations where both structures are movable or both structures are fixed.

[0020] In addition, the term "electrically connected" may include any direct or indirect electrical connection means. For example, "direct electrical connection" may mean that two elements are directly in contact and electrically connected, or that the two elements are connected in series through one or more conductive elements; "indirect electrical connection" may mean that the two elements are separated from each other, and there is no other conductive element between the two elements to connect the two elements in series.

[0021] In the following embodiments, the same or similar elements will use the same or similar reference numerals, and their redundant description will be omitted. In addition, the features in different embodiments can be mixed and matched as long as they do not violate the spirit of the invention or conflict with each other, and simple equivalent changes and modifications made in accordance with this specification or claims are still within the scope of this disclosure. In addition, the terms "first", "second", etc. mentioned in this specification or claims are only used to name different elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements, nor are they used to limit the manufacturing order or setting order of the elements.

[0022] The electronic device disclosed herein may include a display device, a backlight device, a radio frequency device, a sensing device or a splicing device, but is not limited thereto. The electronic device may be a bendable or flexible electronic device. The display device may be a non-self-luminous display device or a self-luminous display device. The radio frequency device may include a frequency selective surface (FSS), an electromagnetic band gap (EBG) structure, a radio frequency filter (RF-Filter), a polarizer, a resonator or an antenna, etc. The antenna may be a liquid crystal antenna or a non-liquid crystal antenna. The sensing device may be a sensing device for sensing capacitance, light, heat or ultrasound, but is not limited thereto. The splicing device may be, for example, a display splicing device or a radio frequency splicing device, but is not limited thereto. It should be noted that the electronic device may be any combination of the aforementioned arrangements, but is not limited thereto. The following will use a radio frequency device as an electronic device to illustrate the contents of the present disclosure, but the present disclosure is not limited thereto.

[0023] Figures 1 to 3 They are partial top view schematic diagrams of electronic devices according to the first embodiment to the third embodiment of the present disclosure.

[0024] Please refer to Figure 1 , the electronic device 1 may include a substrate 10, a plurality of conductive patterns 11 and an adjustable element 12. The plurality of conductive patterns 11 are disposed on the substrate 10. The adjustable element 12 is disposed on at least one conductive pattern 11 among the plurality of conductive patterns 11 and includes a first pad P1, a second pad P2 and a third pad P3. The first pad P1, the second pad P2 and the third pad P3 are separated from each other. The first pad P1 and the second pad P2 overlap the at least one conductive pattern 11 among the plurality of conductive patterns 11. The third pad P3 is disposed between the first pad P1 and the second pad P2.

[0025] Specifically, the substrate 10 can be used to carry components. In some embodiments, the substrate 10 can also be used as a waveguide structure for transmitting electromagnetic waves, but the invention is not limited thereto. In other embodiments, the waveguide structure can be replaced by a transmission line or free space. The substrate 10 can be a hard substrate or a flexible substrate. For example, the material of the substrate 10 can include glass, a polymer film (such as a polyimide film), a printed circuit board, or a combination thereof, but the invention is not limited thereto.

[0026] The plurality of conductive patterns 11 may be used to provide electrical signals to the corresponding one or more adjustable elements 12. In some embodiments, the plurality of conductive patterns 11 may be further used to limit the output area of ​​the electromagnetic waves transmitted under the plurality of conductive patterns 11, for example, the electromagnetic waves may be output from the area not covered by the plurality of conductive patterns 11. For example, the material of the plurality of conductive patterns 11 may include copper, aluminum, silver, gold, any material with high conductivity, or a combination thereof, but is not limited thereto.

[0027] Figure 1 Twelve conductive patterns 11 are schematically shown. The top view shape of each conductive pattern 11 is, for example, a square. The twelve conductive patterns 11 are arranged in an array in the first direction D1 and the second direction D2. The first direction D1 and the second direction D2 intersect each other and are both perpendicular to the thickness direction (such as the third direction D3) of the substrate 10. The first direction D1 and the second direction D2 may be perpendicular to each other, but are not limited thereto. There is a gap G between any two adjacent conductive patterns 11 in the first direction D1 or the second direction D2.

[0028] Each adjustable element 12 may be arranged to cross a corresponding gap G. For example, the extension direction of the adjustable element 12 (such as the arrangement direction of the first pad P1, the second pad P2, and the third pad P3) intersects with the extension direction of the gap G. In some embodiments, the extension direction of the adjustable element 12 may be perpendicular to the extension direction of the gap G, but is not limited thereto.

[0029] Figure 1 Seventeen adjustable elements 12 are schematically shown. The top view shape of each adjustable element 12 is, for example, a rectangle. The first pad P1 and the second pad P2 of each adjustable element 12 may overlap the two conductive patterns 11 located on both sides of the gap G, respectively, and the first pad P1 and the second pad P2 may be electrically connected to the two conductive patterns 11, respectively. In some embodiments, the electronic device 1 may further include a signal line 13. The signal line 13 is disposed on the substrate 10 and is electrically connected to the third pad P3 of the adjustable element 12 to provide an electrical signal to the third pad P3 of the adjustable element 12. The materials of the first pad P1, the second pad P2, and the third pad P3 of the adjustable element 12 may include nickel-gold, nickel-palladium-gold, silver, gold, nickel, tin, organic solderability preservative (OSP), other conductive materials, or a combination thereof, but are not limited thereto. The material of the signal line 13 may include copper, aluminum, silver, gold, any material with high conductivity, or a combination thereof, but is not limited thereto.

[0030] by Figure 1For example, the conductive pattern 11-1 and the conductive pattern 11-2 of the twelve conductive patterns 11 are arranged in the first direction D1. The adjustable element 12-1 is arranged to cross the gap G between the conductive pattern 11-1 and the conductive pattern 11-2, wherein the first pad P1, the second pad P2 and the third pad P3 of the adjustable element 12-1 overlap the conductive pattern 11-1, the conductive pattern 11-2 and the signal line 13 in the third direction D3, and the first pad P1, the second pad P2 and the third pad P3 are electrically connected to the conductive pattern 11-1, the conductive pattern 11-2 and the signal line 13 respectively.

[0031] It should be understood that the shapes, quantities, arrangements and relative relationships of the conductive pattern 11, the adjustable element 12 and the signal line 13 in the electronic device 1 can be changed according to actual needs and are not limited to the above. Figure 1 In addition, in some embodiments, the electronic device 1 may include a defective ground structure (DGS), but is not limited thereto.

[0032] The tunable element 12 may include a capacitor, a resistor, an inductor, a diode, a transistor, a micro-electromechanical system, or a combination thereof. The relevant parameters of the tunable element can be modulated by a signal applied to the tunable element. The relevant parameters may include dielectric constant, area, width of the semiconductor depletion region, height of the metal plate, etc., but are not limited thereto. In some embodiments, the tunable element 12 may be packaged as a tunable component using technologies such as panel level package (PLP), wafer level package (WLP), or fan-out wafer level package (FOWLP). In some embodiments, the tunable element 12 may be bonded to the corresponding one or more conductive patterns 11 and / or signal lines 13 by direct bonding, micro-bonding, or flip-chip bonding.

[0033] In the present embodiment, the adjustable element 12 may include a variable capacitor. The variable capacitor may be formed by a liquid crystal device, a varactor diode or a micro electro mechanical system (MEMS), etc., but is not limited thereto. By changing the voltage applied to the variable capacitor through the conductive pattern 11 and the signal line 13, the equivalent capacitance in the radio frequency circuit can be controlled, so that the phase and amplitude of the electromagnetic wave change accordingly, thereby controlling the direction of the electromagnetic wave or improving the directivity of the radio frequency device. The design of the three pads (including the first pad P1, the second pad P2 and the third pad P3) of the adjustable element 12 helps to increase the flexibility of the circuit design, increase the adjustable radio frequency parameters (such as radiation intensity, resonant frequency or phase, etc.) or adjust the transmission direction of the electromagnetic wave.

[0034] by Figure 1 For example, the first pad P1 and the second pad P2 of each adjustable element 12 may be at the same potential or grounded, and the third pad P3 may have a higher potential than the first pad P1 and the second pad P2, and the capacitance value of the adjustable element 12 can be controlled by changing the potential of the third pad P3. Figure 1 In the embodiment, a plurality of conductive patterns 11 may be commonly applied with a ground voltage, and seventeen third pads P3 of seventeen adjustable elements 12 may be respectively applied with seventeen DC voltages. In other words, the seventeen adjustable elements 12 may have seventeen voltage degrees of freedom. Each adjustable element 12 may be independently controlled. Therefore, the adjustable range (such as scanning angle, number of beams, etc.) of the electronic device 1 may be larger. In other embodiments, more than one DC voltage may be applied to a plurality of conductive patterns 11 (for example, different DC voltages may be applied to the conductive pattern 11-1 and the conductive pattern 11-2), and a plurality of DC voltages may be applied to a plurality of third pads P3 of a plurality of adjustable elements 12.

[0035] In some embodiments, the plurality of conductive patterns 11 and the plurality of signal lines 13 may be in different layers. In other embodiments, the plurality of conductive patterns 11 and the plurality of signal lines 13 may be in the same layer.

[0036] In some embodiments, the plurality of signal lines 13 may be arranged in a dispersed manner to reduce the influence of the low-frequency variable capacitance voltage control circuit loop on the radio frequency characteristics of the conductive pattern 11. In some embodiments, the total width of the plurality of adjacently arranged signal lines 13 may be less than one tenth of the radio frequency wavelength, or the line width of each signal line 13 may be less than one fifth of the width of the gap G between two adjacent conductive patterns 11, to reduce the influence of the stray capacitance between the signal line 13 and the conductive pattern 11.

[0037] Please refer to Figure 2The electronic device 1A includes a substrate 10, a plurality of conductive patterns 11, a plurality of adjustable elements 12, and a plurality of signal lines 13. Figure 1 The main differences of the electronic device 1 are the shapes, quantities, arrangements and relative relationships of the plurality of conductive patterns 11 , the plurality of adjustable elements 12 and the plurality of signal lines 13 .

[0038] In addition, in the electronic device 1A, the adjustable element 12-2 crosses the gap G between the conductive pattern 11-3 and the conductive pattern 11-4 adjacent to each other in the first direction D1, and the first pad P1 and the second pad P2 of the adjustable element 12-2 are electrically connected to the conductive pattern 11-3 and the conductive pattern 11-4, respectively. The adjustable element 12-3 crosses the gap G between the conductive pattern 11-4 and the conductive pattern 11-5 adjacent to each other in the first direction D1, and the first pad P1 and the second pad P2 of the adjustable element 12-3 are electrically connected to the conductive pattern 11-4 and the conductive pattern 11-5, respectively. The conductive pattern 11-4 has an opening AP, wherein the adjustable element 12-4 is configured to cross the opening AP, and the first pad P1 and the second pad P2 of the adjustable element 12-4 are electrically connected to the conductive pattern 11-4 on both sides of the opening AP.

[0039] Please refer to Figure 3 The electronic device 1B includes a substrate 10, a plurality of conductive patterns 11, a plurality of adjustable elements 12, and a plurality of signal lines 13. Figure 1 The main difference between the electronic device 1 and the electronic device 1B lies in the shapes, quantities, arrangement methods, and relative arrangement relationships of the plurality of conductive patterns 11, the plurality of adjustable elements 12, and the plurality of signal lines 13. Specifically, in the electronic device 1B, the top view shape of each conductive pattern 11 is, for example, a rectangle, each adjustable element 12 is arranged to cross the gap G between two adjacent conductive patterns 11, and the number of the plurality of adjustable elements 12 is, for example, less than the number of the plurality of conductive patterns 11.

[0040] Figure 4A and Figure 4B 1 and 2 are partial top view and partial cross-sectional view of an electronic device according to a fourth embodiment of the present disclosure. In order to clearly show the relative arrangement relationship of some components and / or film layers, Figure 4A Some elements and / or layers of the electronic device are omitted. Figure 4A For the section along the midline A-A', please refer to Figure 4B .

[0041] Please refer to Figure 4A and Figure 4B , the electronic device 1C and Figure 1The main differences of the electronic device 1 are described as follows. The electronic device 1C further includes a first soldering member 14, a second soldering member 15 and a third soldering member 16, wherein the first pad P1, the second pad P2 and the third pad P3 are directly electrically connected to two adjacent conductive patterns 11 and the signal line 13 through the first soldering member 14, the second soldering member 15 and the third soldering member 16 respectively. Figure 4B As shown, the first pad P1, the second pad P2 and the third pad P3 are connected to the pad P4 and the pad P5 on the two adjacent conductive patterns 11 and the pad P6 on the signal line 13 through the first solder 14, the second solder 15 and the third solder 16 respectively. In other words, the adjustable element 12 is directly electrically connected to the two adjacent conductive patterns 11 and the signal line 13. The materials of the first solder 14, the second solder 15 and the third solder 16 may include solder balls, copper pillars, other suitable metals or metal alloys, but are not limited thereto. The materials of the pads P4, P5 and P6 may include nickel-gold, nickel-palladium-gold, silver, gold, nickel, tin, organic solderability films, other conductive materials or combinations thereof, but are not limited thereto.

[0042] In some embodiments, the electronic device 1C may further include an isolation layer 17. The isolation layer 17 is disposed on the substrate 10 and may cover the plurality of conductive patterns 11 and the plurality of signal lines 13. For example, the material of the isolation layer 17 may include silicon nitride (SiNx), silicon oxide (SiOx), silicon oxynitride (SiOxNy), epoxy resin, acrylic, solder resist, silicon material, bismaleimide, polyimide, or a combination thereof, but is not limited thereto.

[0043] In some embodiments, the electronic device 1C may further include a transmission line 18. The transmission line 18 is disposed on the substrate 10, and the substrate 10 is, for example, located between the transmission line 18 and the plurality of conductive patterns 11. In other words, the transmission line 18 and the plurality of conductive patterns 11 are disposed on opposite sides of the substrate 10, respectively.

[0044] In this embodiment, electromagnetic waves can be transmitted through the transmission line 18, the plurality of conductive patterns 11 can be connected to a ground voltage, and electromagnetic waves in a specific frequency range can be passed through and electromagnetic waves in other frequency ranges can be filtered by controlling a DC signal applied to the signal line 13. For example, the electromagnetic waves in the specific frequency range can be radio frequency, millimeter wave, terahertz (THz), infrared light, or visible light, but are not limited thereto.

[0045] Figure 5A and Figure 5B1 and 2 are partial top view and partial cross-sectional view of an electronic device according to the fifth embodiment of the present disclosure. In order to clearly show the relative arrangement relationship of some components and / or film layers, Figure 5A Some elements and / or layers of the electronic device are omitted. Figure 5A For the section along the midline B-B', please refer to Figure 5B .

[0046] Please refer to Figure 5A and Figure 5B , the electronic device 1D and Figure 4A and Figure 4B The main differences of the electronic device 1C are as follows. In the electronic device 1D, the plurality of conductive patterns 11 can be used as transmission lines, for example, and the electronic device 1D may not include Figure 4A and Figure 4B The transmission line 18 in FIG.

[0047] In the present embodiment, electromagnetic waves can be transmitted through a plurality of conductive patterns 11, and the plurality of conductive patterns 11 can be connected to a DC reverse voltage. In the case where the adjustable element 12 is a variable capacitance element formed by a liquid crystal device, the plurality of conductive patterns 11 can be connected to a low-frequency AC signal. In addition, the electronic device 1D may further include a conductive layer 19. The conductive layer 19 is disposed on the substrate 10, and the substrate 10 is located between the conductive layer 19 and the plurality of conductive patterns 11. The conductive layer 19 is connected to a ground voltage, for example. By controlling the DC reverse voltage or the low-frequency AC signal applied to the plurality of conductive patterns 11, electromagnetic waves in a specific frequency range can be passed through and electromagnetic waves in other frequency ranges can be filtered.

[0048] Figures 6 to 8 They are partial cross-sectional schematic diagrams of electronic devices according to the sixth embodiment to the eighth embodiment of the present disclosure.

[0049] Please refer to Figure 6 , the electronic device 1E and Figure 5A and Figure 5B The main differences of the electronic device 1D are described as follows. In the electronic device 1E, the electromagnetic wave W from the excitation source S can be transmitted to the electronic device 1E through the free space. The transmission medium between the excitation source S and the electronic device 1E can be, for example, air, but is not limited to this. By changing the voltage applied to the adjustable element 12 through the conductive pattern 11 and the signal line 13, the equivalent capacitance in the radio frequency circuit can be controlled, so that the phase and amplitude of the electromagnetic wave change accordingly, thereby controlling the direction of the electromagnetic wave or improving the directivity of the radio frequency device.

[0050] Please refer to Figure 7 , electronic device 1F and Figure 6The main differences of the electronic device 1E are described as follows. The electronic device 1F further includes a conductive pattern PT1 and a conductive pattern PT2. The conductive pattern PT1 and the conductive pattern PT2 are arranged on a plurality of conductive patterns 11, and the conductive pattern PT1, the conductive pattern PT2 and the plurality of conductive patterns 11 are separated from each other by an isolation layer 17. The pad P4 and the pad P5 are respectively arranged on the conductive pattern PT1 and the conductive pattern PT2. The material of the conductive pattern PT1 and the conductive pattern PT2 may include copper, aluminum, silver, gold, any material with high conductivity or a combination thereof, but is not limited thereto.

[0051] In some embodiments, the voltages applied to the conductive pattern PT1, the conductive pattern PT2, and the signal line 13 may be different. In some embodiments, the conductive pattern PT1, the conductive pattern PT2, and the signal line 13 may have different sizes. In some embodiments, the conductive pattern PT1, the conductive pattern PT2, and the signal line 13 may overlap or not overlap the conductive pattern 11 in the third direction D3. In some embodiments, the plurality of conductive patterns 11 may be a first conductive layer, and the conductive pattern PT1, the conductive pattern PT2, and the signal line 13 may be a second conductive layer, and the first conductive layer and the second conductive layer are separated by an isolation layer 17. In an embodiment in which the conductive pattern PT1, the conductive pattern PT2, and the signal line 13 are all the second conductive layer, the conductive pattern PT1, the conductive pattern PT2, and the signal line 13 may have the same material and may be formed by the same patterning process. In some other embodiments, the conductive pattern PT1, the conductive pattern PT2, and the signal line 13 may be different layers and may be formed by different processes.

[0052] Please refer to Figure 8 , electronic device 1G and Figure 6 The main differences of the electronic device 1E are described as follows. In the electronic device 1G, the adjustable element 12G, for example, includes a plurality of varactors, such as a varactor 12G1 and a varactor 12G2. The varactor 12G1 includes a first pad P1 and a third pad P3, wherein the first pad P1 is directly electrically connected to a pad P4 disposed on the conductive pattern 11-6 through a first soldering member 14, and the third pad P3 is directly electrically connected to a pad P6 disposed on the signal line 13 through a third soldering member 16. The varactor 12G2 includes a second pad P2 and a fourth pad P4, wherein the second pad P2 is directly electrically connected to a pad P5 disposed on the conductive pattern 11-7 through a second soldering member 15, and the fourth pad P4 is directly electrically connected to a pad P6' disposed on the signal line 13 through a fourth soldering member 16'.

[0053] In some embodiments, the varactor diode 12G1 and the varactor diode 12G2 may be packaged together using panel level packaging, wafer level packaging, or fan-out wafer level packaging. In other embodiments, the varactor diode 12G1 and the varactor diode 12G2 may also be replaced with variable capacitors formed by liquid crystal devices or micro-electromechanical systems, but are not limited thereto.

[0054] In some embodiments, the adjustable element 12G may be a package of any combination of capacitors, resistors, inductors, diodes, transistors, etc., but is not limited thereto. For example, the adjustable element 12G may be a package including capacitors and transistors (not shown).

[0055] Fig. 9 is a partial cross-sectional diagram of an adjustable element according to an embodiment of the present disclosure. Fig. 9 , the adjustable element 12H may have more than three pads, such as a first pad P1, a second pad P2, and a third pad P3. In addition, the adjustable element 12H may be manufactured by a semiconductor process (such as an ion doping process). For example, the adjustable element 12H may have a first doping region DP1, a second doping region DP2, and a third doping region DP3, wherein the second doping region DP2 is disposed between the first doping region DP1 and the third doping region DP3. The third pad P3, for example, contacts the first doping region DP1, and the first pad P1 and the second pad P2, for example, contact the third doping region DP3.

[0056] The first doping region DP1 and the second doping region DP2 are, for example, first-type doping regions, and the third doping region DP3 is, for example, a second-type doping region. + For example, the first doping region DP1 and the second doping region DP2 are N-type doping regions, and the first doping region DP1 is a heavily doped region; the third doping region DP3 is a P-type doping region, but is not limited thereto. In other embodiments, the adjustable element may also be 2N + 1P, in this architecture, the first doping region DP1 is, for example, a P-type doping region; the second doping region DP2 and the third doping region DP3 are, for example, N-type doping regions, and the third doping region DP3 is, for example, a heavily doped region, but is not limited thereto.

[0057] In other embodiments, the adjustable element may also be 3P1N + (not shown), 3N + 1P (not shown) or 4P1N + (Please refer to Fig.10 ) and other architectures. Fig.10 is a partial top view of an adjustable element according to another embodiment of the present disclosure. Fig.10The adjustable element 12I may have, for example, a first doping region DP1, four second doping regions DP2, and four third doping regions DP3, wherein a second doping region DP2 is disposed between each third doping region DP3 and the first doping region DP1. In addition to the first pad P1, the second pad P2, and the third pad P3, the adjustable element 12I may also include a fourth pad P4' and a fifth pad P5', wherein the first pad P1, the second pad P2, the fourth pad P4', and the fifth pad P5' are disposed on the four third doping regions DP3, respectively.

[0058] Fig.11 is a partial cross-sectional diagram of an electronic device according to the ninth embodiment of the present disclosure. Fig.11 , the electronic device 1H and Figure 7 The main differences of the electronic device 1F are described as follows: In the electronic device 1H, the conductive pattern PT2 connects the pad P5 and the corresponding conductive pattern 11, so that the pad P5 is directly electrically connected to the corresponding conductive pattern 11 through the conductive pattern PT2, but the present invention is not limited thereto.

[0059] It should be understood that the connection methods of the pads of the adjustable element 12 (such as pad P1, pad P2 and pad P3) and the surrounding conductive patterns (such as conductive pattern PT1, conductive pattern PT2, conductive pattern 11) or signal lines (such as signal line 13) can have different combinations. In some embodiments, the three pads do not have to be connected to the conductive pattern or signal line, and each pad can have an independent connection object and / or method. For example, the three pads may not be connected to any conductive pattern or signal line; or, the three pads may be connected only to the conductive pattern; or, the three pads may be connected only to the signal line; or, the three pads may be connected to the conductive pattern and the signal line.

[0060] In addition, the adjustable element disclosed in the present invention may be composed of different types of adjustable or non-adjustable elements (such as resistors, inductors, capacitors, thin film transistors, μLEDs, diodes, etc.). Figures 12 to 17 4 are simple circuit diagrams of adjustable elements according to various embodiments of the present disclosure.

[0061] In some embodiments, Fig.12 As shown, the adjustable element 12J may include two variable capacitors, wherein the pad P1 and the pad P3 are respectively connected to opposite ends of one of the variable capacitors, and the pad P3 and the pad P2 are respectively connected to opposite ends of the other variable capacitor.

[0062] In some embodiments, Fig.13 As shown, the adjustable element 12K may include a variable capacitor and a variable inductor, wherein the pad P1 and the pad P3 are respectively connected to two opposite ends of the variable capacitor, and the pad P3 and the pad P2 are respectively connected to two opposite ends of the variable inductor.

[0063] In some embodiments, Fig.14 As shown, the adjustable element 12L may include a variable capacitor and a variable resistor, wherein the pad P1 and the pad P3 are respectively connected to two opposite ends of the variable capacitor, and the pad P3 and the pad P2 are respectively connected to two opposite ends of the variable resistor.

[0064] In some embodiments, Fig.15 As shown, the adjustable element 12M may include two variable inductors, wherein the pad P1 and the pad P3 are respectively connected to two opposite ends of one of the variable inductors, and the pad P3 and the pad P2 are respectively connected to two opposite ends of the other variable inductor.

[0065] In some embodiments, Fig.16 As shown, the adjustable element 12N may include a thin film transistor and a variable capacitor, wherein the pad P1 and the pad P3 are respectively connected to the drain and the gate of the thin film transistor, and the source of the thin film transistor and the pad P2 are respectively connected to the opposite ends of the variable capacitor. In other embodiments, the pad P1 and the pad P3 of the adjustable element 12N may be respectively connected to the source and the gate of the thin film transistor, and the drain of the thin film transistor and the pad P2 may be respectively connected to the opposite ends of the variable capacitor.

[0066] In some embodiments, Fig.17 As shown, the adjustable element 12O may include a capacitor, a variable capacitor connected in series with the capacitor, and an inductor connected in parallel with the variable capacitor, wherein pads P1 and P3 are respectively connected to opposite ends of the variable capacitor, and pads P3 and P2 are respectively connected to opposite ends of the capacitor.

[0067] In some embodiments, although not shown, the adjustable element may include a capacitor and a variable capacitor, wherein the pad P1 and the pad P3 may be connected to opposite ends of the variable capacitor, respectively, and the pad P3 and the pad P2 may be connected to opposite ends of the capacitor, respectively. In some embodiments, although not shown, the adjustable element may include a resistor, an inductor, and a variable capacitor, wherein one end of the resistor, one end of the inductor, and one end of the variable capacitor are connected together, and the other end of the resistor, the other end of the inductor, and the other end of the variable capacitor may be connected to the pad P1, the pad P2, and the pad P3, respectively.

[0068] In some embodiments, a combination of different types of adjustable or non-adjustable elements (such as resistors, inductors, capacitors, thin film transistors, μLEDs, diodes, etc.) can be an integrated circuit chip or a package, and the endpoints of the adjustable or non-adjustable elements can be connected to pads or electrically connected, but are not limited to this. For example, when the adjustable element includes two variable capacitors and is an integrated circuit chip, the endpoints of the variable capacitors can be connected to pads, and the pads of the adjustable element can be conductive bumps connecting the integrated circuit chip to a metal pattern or a signal line. In addition, when the adjustable element includes two variable capacitors and the two variable capacitors are packaged into a package, the endpoints of the variable capacitors can be connected to pads or electrically connected, and the pads of the adjustable element can be conductive bumps connecting the package to a metal pattern or a signal line.

[0069] Fig.18 and Fig.19 They are partial top views of adjustable elements according to multiple embodiments of the present disclosure. Fig.18 and Fig.19 In the figure, the signal line 13 is omitted. In some embodiments, the electrical signal can be transmitted to the adjustable element 12 through a conductive pattern (such as the conductive pattern 11); or, the electrical signal can be transmitted to the adjustable element 12 through a signal line 13 (not shown); or, part of the electrical signal can be transmitted to the adjustable element 12 through a conductive pattern (such as the conductive pattern 11), and part of the electrical signal can be transmitted to the adjustable element 12 through a signal line 13 (not shown). The adjustable element 12 is thereby driven or the characteristics of the signal (such as light intensity, polarization, direction of electromagnetic waves, waveform or radio frequency characteristics, etc.) are changed. Specifically, the electrical length of an object is defined as the physical length / wavelength. Therefore, at different wavelengths, even if the spacing of the conductive pattern 11 is the same, the electrical length will be different. Through signal modulation of the signal line (not shown), the characteristics of radio frequencies of different wavelengths will also be different.

[0070] Fig.18 and Fig.19 Two combinations of connection modes between three pads (such as pad P1 , pad P2 and pad P3 ) of the tunable element 12 and surrounding conductive patterns (such as conductive pattern 11 ) or signal lines 13 (not shown) are shown.

[0071] In some embodiments, the three pads of the adjustable element 12 do not all have to be connected to the conductive pattern. In addition, the three pads can be connected to the same conductive pattern 11 or different conductive patterns 11. Fig.18 As shown, two of the three pads may be connected to one conductive pattern 11, and the remaining one of the three pads may be connected to another conductive pattern 11; or, the three pads may be connected to three different conductive patterns 11 respectively; or, two of the three pads may be connected to two adjacent conductive patterns 11, and the remaining one of the three pads may be connected to a signal line not shown. Fig.19 As shown in the dotted line frame, two of the three pads may be connected to two adjacent conductive patterns 11 , and the remaining one of the three pads may not be connected to the conductive pattern 11 .

[0072] When the adjustable element 12 is composed of a resistor or an inductor, the adjustable element 12 does not necessarily have to modulate the signal characteristics by bridging different conductive patterns 11. Fig.19 As shown in the dotted box, the three pads can be connected to the same conductive pattern 11, and the three pads can be electrically connected to the signal line not shown. In summary, in the embodiments disclosed herein, the design of the three pads of the adjustable element helps to increase the flexibility of the circuit design, increase the adjustable RF parameters (such as radiation intensity, resonant frequency or phase, etc.) or adjust the transmission direction of the electromagnetic wave. In some embodiments, the adjustable element may include a variable capacitor. By changing the voltage applied to the variable capacitor, the equivalent capacitance in the RF circuit can be controlled, so that the phase and amplitude of the electromagnetic wave change accordingly, thereby controlling the direction of the electromagnetic wave or improving the directivity of the RF device.

[0073] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still combine or modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein by equivalents. However, these combinations, modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure.

[0074] Although the embodiments and advantages of the present disclosure have been disclosed as above, it should be understood that any person skilled in the art can make changes, substitutions and modifications without departing from the spirit and scope of the present disclosure, and the features between the embodiments can be arbitrarily mixed and replaced to form other new embodiments. In addition, the scope of protection of the present disclosure is not limited to the processes, machines, manufacturing, material compositions, devices, methods and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the current or future developed processes, machines, manufacturing, material compositions, devices, methods and steps from the disclosure of the present disclosure, as long as they can implement substantially the same functions or obtain substantially the same results in the embodiments described herein, they can all be used according to the present disclosure. Therefore, the scope of protection of the present disclosure includes the above-mentioned processes, machines, manufacturing, material compositions, devices, methods and steps. In addition, each claim constitutes a separate embodiment, and the scope of protection of the present disclosure also includes the combination of each claim and embodiment. The scope of protection of the present disclosure shall be determined by the attached claims.

Claims

1. An electronic device, characterized in that: include: substrate; A plurality of conductive patterns are arranged on the substrate; as well as The adjustable element is disposed on at least one of the plurality of conductive patterns and includes a first pad, a second pad and a third pad. The first pad, the second pad and the third pad are separated from each other, the first pad and the second pad overlap the at least one conductive pattern among the plurality of conductive patterns, and the third pad is disposed between the first pad and the second pad. The first pad, the second pad and the third pad are located on a side of the adjustable element facing the substrate, and the adjustable element includes one or more variable capacitors, one or more variable inductors, one or more variable resistors or a combination of at least two of the above. The first pad and the third pad are respectively electrically connected to the opposite ends of one of the variable capacitors or the variable inductors, and the third pad and the second pad are respectively electrically connected to the opposite ends of another variable capacitor, the variable inductor or the variable resistor.

2. The electronic device according to claim 1, characterized in that: The first pad and the second pad are electrically connected to a conductive pattern among the plurality of conductive patterns.

3. The electronic device according to claim 2, characterized in that: The one conductive pattern has an opening, and the adjustable element is arranged to cross the opening.

4. The electronic device according to claim 2, characterized in that: Also includes: A first soldering piece and a second soldering piece, wherein the first pad and the second pad are directly and electrically connected to the one conductive pattern through the first soldering piece and the second soldering piece respectively.

5. The electronic device according to claim 1, characterized in that: The first pad is electrically connected to one of the plurality of conductive patterns, and the second pad is electrically connected to another conductive pattern of the plurality of conductive patterns.

6. The electronic device according to claim 5, characterized in that: A gap is provided between the one conductive pattern and the other conductive pattern, and the adjustable element is arranged to cross the gap.

7. The electronic device according to claim 5, characterized in that: Also includes: A first soldering piece and a second soldering piece, wherein the first pad is directly electrically connected to the one conductive pattern through the first soldering piece, and the second pad is directly electrically connected to the other conductive pattern through the second soldering piece.

8. The electronic device according to claim 1, characterized in that: Also includes: The transmission line is arranged on the substrate, and the substrate is located between the transmission line and the plurality of conductive patterns.

9. The electronic device according to claim 1, characterized in that: The plurality of conductive patterns serve as transmission lines.

10. The electronic device according to claim 9, characterized in that: Also includes: The conductive layer is disposed on the substrate, and the substrate is located between the conductive layer and the plurality of conductive patterns.

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