A structure for enhancing the bending rigidity of a satellite waveguide switch

Abstract

This invention relates to a structure for enhancing the bending stiffness of a satellite waveguide switch. The waveguide switch includes a drive housing, a drive motor, an RF housing, an RF shaft, and a switch flange. The drive motor rotor is fixedly connected to the RF shaft and is installed inside the drive housing. The RF shaft is installed inside the RF housing. A switch flange is located outside the RF housing for connecting the waveguide. A gap exists between the RF housing and the switch flange. The invention is characterized by N reinforcing plates, where N is greater than 1. These reinforcing plates are bonded between the RF housing and the switch flange using an adhesive layer. The N reinforcing plates, together with the RF housing and the switch flange, form a closed stress loop. This invention achieves a closed-loop stress transmission while maintaining the original assembly accuracy requirements of the product, thus realizing a harmonious balance between minimal additional deformation and high stiffness enhancement.

Description

Technical Field

[0001] The present invention provides a flexible, reliable and effective stiffness enhancement structure for precision instruments and equipment, realizes the organic unity of small additional deformation and high stiffness enhancement, can be used to make up for the structural stiffness of the under-designed product later, and has significant economic benefits. The present invention belongs to the field of mechanical engineering technology. Background Art

[0002] Waveguide switches are key components of satellite payloads and are mainly used for loop backup of amplifiers in satellite transponder subsystems to improve satellite reliability. The working principle of a typical waveguide switch is: after receiving the command signal, the drive motor provides a torque to drive the motor rotor and the RF shaft to rotate toward the target state. After reaching the position, the locking magnet provides a locking torque to keep the switch in the working state and complete the RF channel switching.

[0003] In order to ensure good RF performance of the switch, the gap between the inner cavity of the RF shell and the rotor needs to be controlled at the order of tens of microns. At the same time, under the pressure of reducing the weight of the spacecraft, the miniaturization and lightweight design of waveguide switches continues to advance. The switch faces a complex mechanical environment in actual use on the satellite. Due to the combined effects of factors such as complex waveguide layout, diverse switch connections, mechanical and thermal coupling, assembly deviation, and process deviation, there is a potential risk of switch rotation jamming due to excessive deformation of the RF shell. Once the waveguide switch is stuck, the additional deformation of the remedial measures is required to be below the micron level. Traditional stiffness enhancement methods inevitably introduce large stresses and deformations, which often lead to remedial failures. In 2019, my country's communication satellite model introduced a new generation of sequential command miniaturized WR75 waveguide R switches from abroad, and batch jamming problems occurred. The model project team invested huge manpower and material resources to solve the problem.

[0004] Traditional stiffness enhancement methods have the following disadvantages:

[0005] (1) The additional weight is costly;

[0006] (2) The size of the additional structure is limited;

[0007] (3) The additional assembly has large deformation;

[0008] (4) The manufacturing and assembly process deviations of the additional structures are difficult to meet the requirements of precision instruments and equipment, making the implementation of the plan difficult and prone to recurrence. Summary of the invention

[0009] The technical problem solved by the present invention is: to overcome the shortcomings of the prior art and the shortcomings of traditional stiffness increasing methods, to provide a simple, reliable and effective satellite waveguide switch bending stiffness enhancement structure, to achieve the organic unity of small additional deformation and high stiffness enhancement, and to provide later remediation for products with insufficient structural stiffness design.

[0010] The technical solution of the present invention is: a satellite waveguide switch bending stiffness enhancement structure, the waveguide switch includes a drive housing, a drive motor, a radio frequency housing, a radio frequency shaft and a switch flange, the drive motor rotor is fixedly connected to the radio frequency shaft, the drive motor is installed in the drive housing, the radio frequency shaft is installed in the radio frequency housing, and a switch flange is provided outside the radio frequency housing for connecting the waveguide; there is a gap between the radio frequency housing and the switch flange, and it is characterized in that it includes N reinforcement sheets, N is greater than 1, the reinforcement sheets are bonded between the radio frequency housing and the switch flange through an adhesive layer, and the N reinforcement sheets, the radio frequency housing, and the switch flange together form a closed stress ring.

[0011] Preferably, the reinforcement sheet is an integrated reinforcement sheet or a split reinforcement sheet.

[0012] Preferably, the thickness H of the reinforcement sheet and the optimized thickness h of the glue layer are determined by the following steps:

[0013] S1. Establish a finite element physical model of the waveguide switch component level, including a waveguide switch, a standard straight waveguide, and N reinforcement sheets. One end of the standard straight waveguide is a fixed end connected to the switch flange of the waveguide switch, and the other end of the standard straight waveguide is a free end. The N reinforcement sheets are bonded between the RF housing and the switch flange through an adhesive layer.

[0014] S2. Determine the optimal thickness H of the reinforcement sheet. The specific determination method is:

[0015] A standard external mechanical stress P is applied to the free end of the standard straight waveguide in the waveguide switch component-level finite element physical model, and the stiffness enhancement effect under different reinforcement sheet thicknesses is analyzed through finite element statics simulation. When the stiffness enhancement effect G is greater than or equal to the stiffness enhancement effect threshold, the minimum thickness value is selected as the optimal thickness H of the reinforcement sheet;

[0016] S3. Determine the optimal thickness h of the adhesive layer, specifically:

[0017] Under the condition of given glue layer thickness, external mechanical stress P is applied to the free end of the standard straight waveguide of the waveguide switch component-level finite element physical model. The glue layer stress margin S corresponding to different glue layer thicknesses within the preset range is obtained through finite element statics simulation analysis method. The thickness corresponding to the maximum value of the glue layer stress margin S is taken as the optimized glue layer thickness h.

[0018] S4. According to the optimal thickness H of the reinforcement sheet determined in step S2 and the optimal thickness h of the adhesive layer determined in step S3, the additional deformation δ caused by the adhesive curing stress is determined, specifically:

[0019] A preset uniformly distributed shrinkage stress is applied to the contact surface between the free end and the adhesive layer of the standard straight waveguide of the waveguide switch component-level finite element physical model, and the corresponding additional structural deformation δ is obtained through finite element statics simulation;

[0020] S5. Based on the reinforcement sheet optimized thickness H determined in step S2 and the adhesive layer optimized thickness h determined in step S3, an actual reinforcement sheet bonding deviation Δ is introduced, and through finite element statics simulation, the adhesive layer stress margin S' and the stiffness enhancement effect G' after the actual reinforcement sheet bonding deviation Δ is introduced are obtained;

[0021] S6, judging whether the stress margin S' and the stiffness enhancement effect G' of the adhesive layer after the actual reinforcement sheet bonding deviation Δ are introduced meet the corresponding preset requirements. If both meet the preset requirements or the thickness of the reinforcement sheet exceeds the preset threshold, proceed to step S7; otherwise, increase the thickness of the reinforcement sheet, correct the waveguide switch component-level finite element physical model, and repeat steps S3 to S6;

[0022] S7. Conduct ground tests on the bending stiffness of the product before and after reinforcement to verify the effectiveness of the reinforcement scheme. If the reinforcement effect meets the preset requirements or the thickness of the reinforcement sheet exceeds the preset threshold, the test is terminated. Otherwise, the thickness of the reinforcement sheet is increased, the finite element physical model at the waveguide switch component level is corrected, and steps S3 to S7 are repeated.

[0023] Preferably, the waveguide switch in the waveguide switch component-level finite element physical model in step S1 comprises at least three parts: a switch base, a radio frequency housing, and a drive housing. The material properties of these three parts are the same as the actual material properties, and the boundary condition is that the switch base is fixed by mounting screw holes.

[0024] Preferably, the standard external mechanical stress P is 1N.

[0025] Preferably, the stiffness enhancement effect is:

[0026] G=α0 / α 增强 -1

[0027] Among them, α0 is the characteristic deformation before stiffness enhancement, α 增强 Characteristic deformation after stiffness enhancement.

[0028] Preferably, the preset adhesive layer thickness is in the range of 0.05 to 0.2 mm.

[0029] Preferably, the calculation formula of the adhesive layer stress margin S is:

[0030] S=τ0 / τ-1

[0031] Among them, τ0 is the allowable shear stress of the adhesive layer, and τ is the maximum shear stress of the adhesive layer.

[0032] Preferably, the preset stiffness enhancement effect threshold is greater than 3.

[0033] Preferably, the specific method of step S5 is:

[0034] S5.1. Considering the actual reinforcement sheet bonding deviation, N reinforcement sheets are randomly given a maximum position deviation or a maximum tilt deviation in the waveguide switch component-level finite element physical model; the reinforcement sheet bonding deviation includes a position deviation and a tilt deviation;

[0035] S5.2. Given the optimal thickness H of the reinforcement sheet and the optimal thickness h of the adhesive layer, apply an external mechanical stress P to the free end of the standard straight waveguide;

[0036] S5.3. Through finite element statics simulation, the stress margin S' and stiffness enhancement effect G' after introducing the actual reinforcement sheet bonding deviation Δ are obtained.

[0037] The beneficial effects of the present invention compared with the prior art are:

[0038] (1) The present invention proposes a stiffness enhancement structure based on the product's own configuration, and the stress transmission is a closed loop, while ensuring the original assembly accuracy requirements of the product, thereby achieving an organic unity of small additional deformation and high stiffness enhancement;

[0039] (2) The present invention proposes a stiffness enhancement structure based on a reinforcing sheet and a structural adhesive. Compared with the traditional stiffness enhancement method, it has high flexibility, simple implementation, and has promotion value;

[0040] (3) The present invention proposes a multi-parameter optimization method for the stiffness enhancement structure, and takes into account the actual process deviation, quantitatively analyzes the stiffness enhancement effect and the safety margin of the adhesive layer stress, and can quickly determine the optimal configuration of the weight cost and the stiffness enhancement effect;

[0041] (4) The present invention proposes a split design concept for the reinforcement plate, which further overcomes the limitation of operation in a narrow space. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a flow chart of the technical solution in an embodiment of the present invention;

[0043] Figure 2 It is an integrated trapezoidal reinforcement sheet according to an embodiment of the present invention;

[0044] Figure 3 This is a schematic diagram of the installation position of the reinforcement sheet according to an embodiment of the present invention;

[0045] Figure 4 This is an exploded view of a split trapezoidal reinforcement sheet according to an embodiment of the present invention;

[0046] Figure 5 is an unreinforced waveguide switch according to an embodiment of the present invention;

[0047] Figure 6 The waveguide switch after the reinforcing sheet is bonded to the embodiment of the present invention;

[0048] Figure 7 This is the worst stress condition of the embodiment of the present invention. DETAILED DESCRIPTION

[0049] The present invention will be further described below in conjunction with the embodiments.

[0050] The present invention provides a structure for enhancing the bending stiffness of a satellite waveguide switch. The waveguide switch includes a driving housing, a driving motor, a radio frequency housing, a radio frequency shaft and a switch flange. The driving motor rotor is fixedly connected to the radio frequency shaft. The driving motor is installed in the driving housing, the radio frequency shaft is installed in the radio frequency housing, and a switch flange is provided outside the radio frequency housing for connecting the waveguide. There is a gap between the radio frequency housing and the switch flange. The area where the waveguide switch needs to enhance its stiffness is the radio frequency housing area near the root of its flange. Under the action of external stress, the radio frequency housing in this area is easily deformed, causing the internal rotor to be stuck. The enhanced structure includes N reinforcement sheets, N is greater than 1, and the reinforcement sheets are bonded between the radio frequency housing and the switch flange through an adhesive layer. The N reinforcement sheets, the radio frequency housing and the switch flange form a closed stress ring together. The present invention designs the reinforcement sheet based on the configuration characteristics of the waveguide switch itself. The reinforcement sheet needs to form a closed stress transfer ring between the flange and the radio frequency housing, so it can be designed as a trapezoidal reinforcement sheet with a certain thickness H, and bonded between the flange and the radio frequency housing through structural adhesive. The N trapezoidal reinforcement sheets can form a closed stress transfer ring.

[0051] The reinforcement sheet is an integrated reinforcement sheet or a split reinforcement sheet.

[0052] The present invention adopts a stiffness enhancement structure design based on the product's own configuration, combined with a reinforcement sheet and a structural adhesive, so that the stress transfer is a closed loop, while ensuring the original assembly accuracy requirements of the product; through multi-parameter optimization of the stiffness enhancement structure and taking into account the actual process deviation, the stiffness enhancement effect and the safety margin of the adhesive layer stress are quantitatively analyzed to achieve the optimal configuration of weight cost and stiffness enhancement effect.

[0053] Preferably, the thickness H of the reinforcement sheet and the optimized thickness h of the glue layer in the above-mentioned satellite waveguide switch bending stiffness enhancement structure are determined by the following steps:

[0054] S1. Establish a finite element physical model of the waveguide switch component level, including a waveguide switch, a standard straight waveguide, and N reinforcement sheets. One end of the standard straight waveguide is a fixed end connected to the switch flange of the waveguide switch, and the other end of the standard straight waveguide is a free end. The N reinforcement sheets are bonded between the RF housing and the switch flange through an adhesive layer.

[0055] The waveguide switch in the waveguide switch component-level finite element physical model includes at least three parts: a switch base, a radio frequency housing, and a drive housing. The material properties of these three parts are the same as the actual material properties, and the boundary condition is that the switch base is fixed with screw holes. The standard straight waveguide is a standard straight waveguide with a specification of 100 mm. Preferably, the reinforcement sheet is a trapezoidal reinforcement sheet.

[0056] S2. Determine the optimal thickness H of the reinforcement sheet.

[0057] If the thickness of the reinforcement sheet is too large, the weight cost will increase; if the thickness of the reinforcement sheet is too small, the stiffness enhancement effect will be reduced and the bonding process will be difficult. The pros and cons of the two need to be weighed. The specific determination method for this step is:

[0058] Under the condition of given glue layer thickness, standard external mechanical stress P is applied to the free end of the standard straight waveguide in the waveguide switch component-level finite element physical model, and the stiffness enhancement effect under different reinforcement sheet thicknesses is analyzed by finite element static simulation. When the stiffness enhancement effect G is greater than or equal to the stiffness enhancement effect threshold, the minimum thickness value is selected as the reinforcement sheet optimized thickness H; the standard external mechanical stress P is 1N. The given glue layer thickness can be 0.1mm.

[0059] The stiffness enhancement effect G is characterized by the following formula:

[0060] G=α0 / α 增强 -1

[0061] Among them, α0 is the characteristic deformation before stiffness enhancement, α 增强 Characteristic deformation after stiffness enhancement.

[0062] Preferably, a structural statics method can be used to apply a standard external mechanical stress P to the free end of the waveguide in a waveguide switch component-level finite element physical model without a trapezoidal reinforcement sheet, and obtain a characteristic deformation α0 (i.e., the maximum radial deformation of the RF housing) of the waveguide switch before stiffness enhancement;

[0063] Preferably, the preset stiffness enhancement effect threshold is greater than 3.

[0064] S3. Determine the optimal thickness h of the adhesive layer, specifically:

[0065] An external mechanical stress P is applied to the free end of the standard straight waveguide of the waveguide switch component-level finite element physical model. Through the finite element statics simulation analysis method, the glue layer stress margin S corresponding to different glue layer thicknesses within a preset range (the general process state is 0.05-0.2mm, and the thickness optimization step is 0.02mm) is obtained. The thickness corresponding to the maximum value of the glue layer stress margin S is taken as the optimized glue layer thickness h; the preset glue layer thickness range is 0.05 to 0.2mm.

[0066] The calculation formula of the adhesive layer stress margin S is:

[0067] S=τ0 / τ-1

[0068] Among them, τ0 is the allowable shear stress of the adhesive layer, and τ is the maximum shear stress of the adhesive layer.

[0069] S4. According to the optimal thickness H of the reinforcement sheet determined in step S2 and the optimal thickness h of the adhesive layer determined in step S3, the additional deformation δ caused by the adhesive curing stress is determined, specifically:

[0070] A preset uniformly distributed shrinkage stress is applied to the contact surface between the free end and the adhesive layer of the standard straight waveguide of the waveguide switch component-level finite element physical model, and the corresponding additional structural deformation δ is obtained through finite element statics simulation;

[0071] S5. Based on the reinforcement sheet optimized thickness H determined in step S2 and the adhesive layer optimized thickness h determined in step S3, an actual reinforcement sheet bonding deviation Δ is introduced, and through finite element statics simulation, the adhesive layer stress margin S' and the stiffness enhancement effect G' after the actual reinforcement sheet bonding deviation Δ is introduced are obtained;

[0072] S5.1. Considering the actual reinforcement sheet bonding deviation, N reinforcement sheets are randomly given a maximum position deviation or a maximum tilt deviation in the waveguide switch component-level finite element physical model; the reinforcement sheet bonding deviation includes position deviation and tilt deviation; (e.g., position deviation range ±1mm, tilt deviation range ±3°)

[0073] S5.2. Given the optimal thickness H of the reinforcement sheet and the optimal thickness h of the adhesive layer, apply an external mechanical stress P to the free end of the standard straight waveguide;

[0074] S5.3. Through finite element statics simulation, the stress margin S' and stiffness enhancement effect G' after introducing the actual reinforcement sheet bonding deviation Δ are obtained.

[0075] S6, judging whether the stress margin S' and the stiffness enhancement effect G' of the adhesive layer after the actual reinforcement sheet bonding deviation Δ are introduced meet the corresponding preset requirements. If both meet the preset requirements or the thickness of the reinforcement sheet exceeds the preset threshold, proceed to step S7; otherwise, increase the thickness of the reinforcement sheet, correct the waveguide switch component-level finite element physical model, and repeat steps S3 to S6;

[0076] S7. Conduct ground tests on the bending stiffness of the product before and after reinforcement to verify the effectiveness of the reinforcement scheme. If the reinforcement effect meets the preset requirements or the thickness of the reinforcement sheet exceeds the preset threshold, the test is terminated. Otherwise, the thickness of the reinforcement sheet is increased, the finite element physical model at the waveguide switch component level is corrected, and steps S3 to S7 are repeated.

[0077] Example:

[0078] Some details of the technical solution of the present invention are further described below in conjunction with the accompanying drawings.

[0079] In a specific embodiment of the present invention, a satellite waveguide switch is taken as an example, and a reinforcement sheet is designed based on the configuration characteristics of the waveguide switch itself. The area of ​​the waveguide switch that needs to have its rigidity enhanced is the RF housing area near the root of its flange. Under the action of external stress, the RF housing in this area is easily deformed, causing the internal rotor to get stuck. The reinforcement sheet needs to form a closed stress transfer ring between the switch flange and the RF housing, so it can be designed as a trapezoidal reinforcement sheet with a certain thickness H, and bonded between the flange and the RF housing by structural adhesive. A closed stress transfer ring can be formed by N trapezoidal reinforcement sheets.

[0080] Reinforcement sheet design Figures 2 to 4 shown. Figure 2 It is an integrated trapezoidal reinforcement sheet. Figure 3 It is a split trapezoidal reinforcement sheet. Figure 4 This is an exploded view of the split trapezoidal reinforcement sheet.

[0081] Figure 5 For unreinforced waveguide switches. Figure 6 To bond the waveguide switch behind the reinforcement sheet, a single switch uses N=8 integrated reinforcement sheets. Use appropriate structural adhesive (such as high temperature resistant J-133 structural adhesive) to stick the integrated trapezoidal reinforcement sheet to the gap between the four flanges and the RF housing to form a closed stress transfer loop. Multi-switch will lead to limited operating space, and split reinforcement sheets can be used for bonding reinforcement. This assembly process does not require disassembly of the multi-switch components, overcomes the operating limitations of a small space, and achieves reinforcement when the product is not under stress.

[0082] The design method flow of the optimized thickness H of the reinforcement sheet and the optimized thickness h of the adhesive layer of the satellite waveguide switch bending stiffness enhancement structure is as follows: Figure 1 As shown, the following steps are included:

[0083] Step 1: Use commercial modeling software to build the geometric model of the waveguide switch, 100mm standard straight waveguide, reinforcement sheet and adhesive layer. The waveguide switch geometric model must include at least three parts: base, RF housing and driver housing. Import the above geometric model into commercial finite element software and assemble it to form a finite element physical model of the waveguide switch component level. The material properties of the finite element physical model are the same as the actual material properties of each component, and the boundary condition is the switch base installation screw hole fixation.

[0084] Step 2: Using the structural statics method, without the trapezoidal reinforcement sheet, apply the standard external mechanical stress P to the free end of the waveguide in the waveguide switch component-level finite element physical model to obtain the characteristic deformation α0 (i.e., the maximum radial deformation of the RF housing) before the waveguide switch stiffness is enhanced. P = 1N, and the application direction satisfies the following: Figure 7The worst stress case is shown. Under the worst stress case, the radial deformation direction at the same position of the RF housing caused by the external loads on the adjacent waveguide free ports is the same.

[0085] Step 3: Introduce a reinforcement sheet into the finite element physical model at the waveguide switch component level and optimize the thickness H of the reinforcement sheet: if the thickness of the reinforcement sheet is too large, the weight cost will increase; if the thickness of the reinforcement sheet is too small, the stiffness enhancement effect will decrease and the bonding process will be difficult. Given a glue layer thickness of 0.1mm, apply a standard external mechanical stress P to the free end of the waveguide; the thickness of the reinforcement sheet varies from 2mm to 5mm, with a step of 0.05mm; analyze the stiffness enhancement effect under different thicknesses of the reinforcement sheet through finite element statics simulation;

[0086] Define the stiffness enhancement effect as G = α0 / α 增强 -1, where α0 is the characteristic deformation before stiffness enhancement (such as radial deformation of the waveguide switch housing), α 增强 It is the characteristic deformation after stiffness enhancement. When the stiffness enhancement effect G reaches a certain threshold (such as 3 or above), the optimal thickness H of the reinforcement sheet is determined (to achieve the predetermined enhancement target at the smallest possible weight cost);

[0087] Step 4: Introduce the reinforcement sheet into the finite element physical model at the waveguide switch component level and optimize the adhesive layer thickness h: The main dangerous mode of the adhesive layer is shear failure. The shear strength of the structural adhesive is greatly affected by temperature. Considering the worst case, the shear strength of the structural adhesive under the condition of the upper limit of the product operating temperature +10°C is selected as the allowable shear stress τ0. Given the optimized thickness H of the reinforcement sheet (step 4), apply the standard external mechanical stress P to the free end of the waveguide;

[0088] The thickness of the adhesive layer changes from 0.05mm to 0.2mm, with a step of 0.02mm. The corresponding maximum shear stress τ of the adhesive layer is obtained through finite element statics simulation;

[0089] The stress margin of the adhesive layer is defined as S = τ0 / τ-1, where τ0 is the allowable shear stress of the adhesive layer and τ is the maximum shear stress of the adhesive layer. The adhesive layer thickness corresponding to the maximum adhesive layer stress margin is the optimized adhesive layer thickness h;

[0090] Step 5. The waveguide switch component-level finite element physical model introduces a reinforcement sheet to analyze the additional deformation δ caused by the bonding curing stress: given the optimized thickness H of the reinforcement sheet (step 3) and the optimized thickness h of the glue layer (step 4), the bonding curing stress (uniformly distributed shrinkage stress) is applied to the contact surface between the flange, the RF housing and the glue layer. For example, the bonding curing stress of J-133 is about 0.1 MPa. The corresponding additional deformation δ (maximum radial displacement of the RF housing) is obtained through finite element statics simulation, which is generally sub-micron level, indicating that the additional deformation introduced by this reinforcement method is extremely small;

[0091] Step six, introduce the reinforcement sheet into the waveguide switch component-level finite element physical model, and analyze the influence of the actual bonding deviation Δ. Given the optimized thickness H of the reinforcement sheet (step three) and the optimized thickness h of the adhesive layer (step four), randomly introduce the maximum bonding deviation (position deviation range ±1mm, tilt deviation range ±3°) to each reinforcement sheet in the waveguide switch component-level finite element physical model, and apply the standard external mechanical stress P to the free end of the waveguide; obtain the worst-case stress margin S' and stiffness enhancement effect G' through finite element statics simulation; determine whether the two meet the requirements (such as S' greater than 1, G' greater than 3); if not, increase the thickness of the reinforcement sheet, modify the waveguide switch component-level finite element physical model, and repeat steps three to six;

[0092] Step 7. After determining that step 6 meets the requirements, conduct a ground test on the flexural stiffness of the product before and after reinforcement to verify the effectiveness of the reinforcement scheme. If the reinforcement effect meets the preset requirements or the thickness of the reinforcement sheet exceeds the preset threshold, then end; otherwise, increase the thickness of the reinforcement sheet, correct the finite element physical model at the waveguide switch component level, and repeat steps 3 to 7.

[0093] The present invention can be specifically implemented according to the above steps by performing structural statics analysis on commercial finite element software such as ABAQUS and ANSYS.

[0094] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solution of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solution of the present invention shall fall within the protection scope of the technical solution of the present invention.

Claims

1. A structure for enhancing the bending stiffness of a satellite waveguide switch, the waveguide switch comprising a drive housing, a drive motor, a radio frequency housing, a radio frequency shaft and a switch flange, wherein the drive motor rotor is fixedly connected to the radio frequency shaft, the drive motor is installed in the drive housing, the radio frequency shaft is installed in the radio frequency housing, and a switch flange is provided outside the radio frequency housing for connecting the waveguide; there is a gap between the radio frequency housing and the switch flange, characterized in that It includes N reinforcement sheets, N is greater than 1, the reinforcement sheets are bonded between the radio frequency housing and the switch flange through an adhesive layer, and the N reinforcement sheets, the radio frequency housing, and the switch flange together form a closed stress ring; The thickness H of the reinforcement sheet and the optimal thickness h of the adhesive layer are determined by the following steps: S1. Establish a finite element physical model of the waveguide switch component level, including a waveguide switch, a standard straight waveguide, and N reinforcement sheets. One end of the standard straight waveguide is a fixed end connected to the switch flange of the waveguide switch, and the other end of the standard straight waveguide is a free end. The N reinforcement sheets are bonded between the RF housing and the switch flange through an adhesive layer. S2. Determine the optimal thickness H of the reinforcement sheet. The specific determination method is: A standard external mechanical stress P is applied to the free end of the standard straight waveguide in the waveguide switch component-level finite element physical model, and the stiffness enhancement effect under different reinforcement sheet thicknesses is analyzed through finite element statics simulation. When the stiffness enhancement effect G is greater than or equal to the stiffness enhancement effect threshold, the minimum thickness value is selected as the optimal thickness H of the reinforcement sheet; S3. Determine the optimal thickness h of the adhesive layer, specifically: Under the condition of given glue layer thickness, external mechanical stress P is applied to the free end of the standard straight waveguide of the waveguide switch component-level finite element physical model. The stress margin of the glue layer corresponding to different glue layer thicknesses within the preset range is obtained through finite element statics simulation analysis method. , take the stress margin of the adhesive layer The thickness corresponding to the maximum value is taken as the optimized thickness h of the adhesive layer; S4, determining the additional deformation caused by the bonding curing stress according to the optimal thickness H of the reinforcement sheet determined in step S2 and the optimal thickness h of the adhesive layer determined in step S3 , specifically: A preset uniformly distributed shrinkage stress is applied to the contact surface between the free end and the adhesive layer of the standard straight waveguide of the waveguide switch component finite element physical model, and the corresponding additional structural deformation is obtained through finite element statics simulation. ; S5, introducing the actual reinforcement sheet bonding deviation based on the reinforcement sheet optimized thickness H determined in step S2 and the glue layer optimized thickness h determined in step S3 , through finite element statics simulation, the actual reinforcement sheet bonding deviation is introduced The subsequent adhesive layer stress margin S' and stiffness enhancement effect G'; S6. Determine the actual reinforcement sheet bonding deviation After that, whether the stress margin S' of the adhesive layer and the stiffness enhancement effect G' both meet the corresponding preset requirements, if both meet the preset requirements or the thickness of the reinforcement sheet exceeds the preset threshold, then proceed to step S7, otherwise, increase the thickness of the reinforcement sheet, correct the waveguide switch component-level finite element physical model, and repeat steps S3 to S6; S7, conduct a ground test on the bending stiffness of the product before and after reinforcement to verify the effect of the reinforcement scheme. If the reinforcement effect meets the preset requirements or the thickness of the reinforcement sheet exceeds the preset threshold, the process ends; otherwise, increase the thickness of the reinforcement sheet, modify the finite element physical model of the waveguide switch component level, and repeat steps S3 to S7; The stiffness enhancement effect is: in, For stiffness enhancement, the front characteristic deformation is Characteristic deformation after stiffness enhancement; The adhesive layer stress margin The calculation formula is: in, is the allowable shear stress of the adhesive layer, is the maximum shear stress of the adhesive layer.

2. A satellite waveguide switch bending stiffness enhancement structure according to claim 1, characterized in that The reinforcement sheet is an integrated reinforcement sheet or a split reinforcement sheet.

3. A satellite waveguide switch bending stiffness enhancement structure according to claim 1, characterized in that The waveguide switch in the waveguide switch component-level finite element physical model in step S1 includes at least three parts: a switch base, a radio frequency housing, and a drive housing. The material properties of these three parts are the same as the actual material properties, and the boundary condition is that the switch base is fixed by the mounting screw holes.

4. A satellite waveguide switch bending stiffness enhancement structure according to claim 1, characterized in that The standard external mechanical stress P is 1N.

5. A satellite waveguide switch bending stiffness enhancement structure according to claim 1, characterized in that The preset adhesive layer thickness ranges from 0.05 to 0.2 mm.

6. A satellite waveguide switch bending stiffness enhancement structure according to claim 1, characterized in that The preset stiffness enhancement effect threshold is 3 or more.

7. A satellite waveguide switch bending stiffness enhancement structure according to claim 1, characterized in that The specific method of step S5 is: Considering the actual reinforcement sheet bonding deviation, N reinforcement sheets are randomly given a maximum position deviation or a maximum tilt deviation in the waveguide switch component-level finite element physical model; the reinforcement sheet bonding deviation includes a position deviation and a tilt deviation; Given the optimal thickness H of the reinforcement sheet and the optimal thickness h of the adhesive layer, an external mechanical stress P is applied to the free end of the standard straight waveguide; Through finite element statics simulation, the actual reinforcement sheet bonding deviation is introduced. The subsequent stress margin S' and stiffness enhancement effect G'.

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