Camera module and electronic device with camera module

Abstract

The present invention provides a camera module and an electronic device with the camera module, wherein the camera module comprises a lens, a photosensitive component, a driving device and a fixing device. The lens is arranged above the photosensitive component along an optical axis direction, wherein the driving device is drivingly connected to the lens, and the lens is driven by the driving device to move along the optical axis direction, wherein the fixing device has a accommodating cavity, and the lens, the photosensitive component and the driving device are placed in the accommodating cavity of the fixing device so that the top of the camera module is located inside the cover plate, wherein the camera module has a working state and a retracted state.

Description

Technical Field

[0001] The present invention relates to the field of imaging, and in particular to a camera module and an electronic device with the camera module. Background Art

[0002] With the rapid development of mobile smart devices, such as mobile phones, iPads or smart watches, they have gradually become daily necessities that almost everyone carries with them at all times. The thinness and miniaturization of electronic devices have become an important indicator for people to choose to buy and use them conveniently in daily life. In particular, with people's picky and high-end demands for the camera function of mobile phones, such as the dual-camera module, pixel size or variable aperture of the camera module of the mobile phone, people are more inclined to choose or use mobile phones with better camera functions and thinner weights to meet the needs of convenient, clear and rich functions in daily photography.

[0003] The overall thickness of electronic devices in the prior art, such as mobile phones, is becoming smaller and smaller with the demand for thinness and lightness. However, in pursuit of high-quality shooting quality, the height of the camera module is getting higher and higher. Therefore, in the mobile terminal devices in the prior art, the camera module protrudes from the back cover, forming a convex platform on the back. This is caused by the trend of thinness and lightness of mobile phones and the trend of improving the quality and function of camera modules. The thinner the mobile phone, the better the user's hand-holding experience. At present, thin and light mobile phones can basically be less than 9mm, or even less than 8mm. At the same time, users also hope that the quality of the camera module will be improved, such as increasing pixels, improving telephoto shooting capabilities, large aperture lenses, adding anti-shake functions, etc., which all lead to a larger size of the camera module, especially a larger height of the camera module. However, the camera module protruding from the back cover of the mobile phone greatly affects the appearance of the mobile phone. When the user puts the mobile phone flat on the table, the mobile phone will be in a tilted and unstable posture, affecting the user's operation. More importantly, the camera module protrudes from the back cover of the mobile phone, which makes the camera module or the protective cover on the outside of the camera module have a great risk of scratching. Bumping or falling can easily cause scratches or cracks, affecting the imaging of the camera module.

[0004] In the prior art mobile phones, in order to avoid collision between the camera module and the back cover, a gap is usually set between the camera module and the glass back cover, which is another reason why the camera module on the back of the mobile phone protrudes from the back cover. In short, the prior art camera module cannot meet the requirements of mobile terminal devices for lightness and thinness while pursuing high-quality shooting quality. Summary of the invention

[0005] A major advantage of the present invention is that it provides a camera module and an electronic device with the camera module, wherein the camera module can be integrally accommodated in a cover plate of the electronic device to prevent the camera module from being exposed, thereby facilitating the protection of the camera module.

[0006] Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module is completely accommodated in a cover plate of the electronic device in a retracted state, which is conducive to the lightness and thinness of the electronic device.

[0007] Another advantage of the present invention is that it provides a camera module and an electronic device with the camera module, wherein the top of the camera module is directly attached to the glass cover plate, and by reducing the height of this part, the gap between the bottom of the module and the cover plate of the electronic device is further reduced.

[0008] Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module eliminates the filter, so that the lens can be moved downward to a greater extent when it is retracted, so that the rear telephoto camera module of the mobile terminal does not protrude from the back cover.

[0009] Another advantage of the present invention is that it provides a camera module and an electronic device with a camera module, wherein the photosensitive component of the camera module moves to achieve optical image stabilization and movement with multiple degrees of freedom, and can also make the motor structure simpler and increase the anti-shake stroke of the camera module, thereby compensating for larger shakes of the camera module.

[0010] Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein after the filter is removed, the camera module adopts a blue glass cover or a coated filter film to replace the function of the filter and avoid stray light.

[0011] Another advantage of the present invention is that it provides a camera module and an electronic device with a camera module, wherein the camera module adopts a chip sinking or chip inverted mounting method to further increase the distance between the lens and the photosensitive chip, make more full use of the height space of the telephoto camera module, and reduce the height of the camera module.

[0012] Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the camera module includes a dustproof structure to prevent dust from entering the photosensitive element of the camera module and affecting the shooting quality.

[0013] Another advantage of the present invention is to provide a camera module and an electronic device with the camera module, wherein the top of the camera module is directly attached to the glass cover, further reducing the gap between the bottom of the module and the glass cover.

[0014] Another advantage of the present invention is that it provides a camera module and an electronic device with the camera module, wherein the camera module is covered on the inner side of a cover plate of the electronic device, and the camera module is protected by the cover plate, which is conducive to simplifying the structure of the camera module and reducing the height and volume of the camera module.

[0015] Another advantage of the present invention is that it provides a camera module and an electronic device with the camera module, wherein the camera module is suitable as a rear zoom camera module, when the camera module is in a non-working state, the height of the camera module is substantially consistent with the thickness of the camera module, and when the camera module is in a working state, the lens of the camera module will extend, so that the distance from the lens to the photosensitive chip meets the requirements of the rear focal length for zoom shooting, thereby ensuring the shooting quality.

[0016] Another advantage of the present invention is that it provides a camera module and an electronic device with the camera module, wherein when the camera module is working, the lens of the camera module is extended so that the distance between the lens and the photosensitive chip meets the requirements of multi-fold zoom shooting, and when not working, the lens of the camera module is retracted so that the camera module is completely accommodated in the terminal, thereby improving the appearance of the terminal.

[0017] Other advantages and features of the present invention will become more apparent from the following detailed description and may be realized by means of the instrumentalities and combinations particularly pointed out in the appended claims.

[0018] According to one aspect of the present invention, a camera module of the present invention that can achieve the aforementioned objects and other objects and advantages is suitable for an electronic device, wherein the electronic device includes a cover plate, including:

[0019] One shot;

[0020] A photosensitive component, wherein the lens is disposed above the photosensitive component along an optical axis direction;

[0021] A driving device, wherein the driving device is drivingly connected to the lens, and the driving device drives the lens to move along the optical axis, so that the camera module switches between a working state and a retracted state, and when the camera module is in the retracted state, the focal plane of the lens is behind the photosensitive component. According to one embodiment of the present invention, the driving device is drivingly connected to the photosensitive component, and the driving device drives the photosensitive component to move in a direction perpendicular to the optical axis and / or in a rotational direction around the optical axis.

[0022] According to one embodiment of the present invention, the photosensitive component includes a filter component and a circuit board component, wherein the filter component is located above the circuit board component, and the filter component filters stray light, and the filter component includes a filter holder and a filter installed on the filter holder.

[0023] According to one embodiment of the present invention, it further includes a transmission device, wherein the transmission device is arranged between the driving device and the photosensitive component, wherein the driving device is transmission-connected to the photosensitive component via the transmission device.

[0024] According to one embodiment of the present invention, the photosensitive component includes a circuit board assembly, wherein the circuit board assembly is drivingly connected to the driving device, and the driving device drives the circuit board assembly to move in a specific direction and / or angle.

[0025] According to one embodiment of the present invention, the circuit board assembly further includes a circuit board and a photosensitive chip, wherein the photosensitive chip is disposed on an upper surface of the circuit board.

[0026] According to one embodiment of the present invention, it further includes a transmission device, wherein the transmission device is arranged between the driving device and the photosensitive component, wherein the driving device is transmission-connected to the circuit board of the photosensitive component through the transmission device.

[0027] According to one embodiment of the present invention, the photosensitive component further includes a base, wherein the base is arranged above the circuit board assembly, and the transmission device is transmission-connected to the base of the photosensitive component.

[0028] According to one embodiment of the present invention, the base includes a connecting end and an anti-collision end extending from the connecting end from the outside to the inside, wherein the connecting end is fixedly connected to the transmission device, the anti-collision end is formed above the photosensitive chip, and the anti-collision end corresponds to the lower end of the lens.

[0029] According to one embodiment of the present invention, the photosensitive component further includes at least one buffer unit, wherein the buffer unit is disposed on the upper surface of the base.

[0030] According to one embodiment of the present invention, the photosensitive component further includes a base, which is arranged above the circuit board assembly, wherein the driving device is located on the outside of the base, and the driving device is drivingly connected to the circuit board.

[0031] According to an embodiment of the present invention, the driving device includes an optical zoom motor and an anti-shake motor, wherein the optical zoom motor is driven by the lens, and the anti-shake motor is driven by the circuit board assembly.

[0032] According to one embodiment of the present invention, the circuit board is provided with a groove, wherein the groove is formed on the upper surface of the circuit board, and the photosensitive chip is arranged in the groove of the circuit board.

[0033] According to one embodiment of the present invention, the circuit board has a mounting hole, wherein the photosensitive chip is arranged in the mounting hole of the circuit board.

[0034] According to one embodiment of the present invention, the circuit board assembly further includes a reinforcing plate, wherein the reinforcing plate is attached to the back sides of the circuit board and the photosensitive chip.

[0035] According to one embodiment of the present invention, the circuit board includes a circuit board body and a support arm extending inward from the upper end of the circuit board body, and the circuit board is further provided with a mounting groove, wherein the mounting groove is formed on the inner side of the circuit board body and the support arm of the circuit board, wherein the photosensitive chip is attached to the lower side of the support arm, and the photosensitive chip is supported by the support arm in the mounting groove of the circuit board.

[0036] According to one embodiment of the present invention, the circuit board assembly further includes at least one anti-collision structure, wherein the anti-collision structure is arranged on the circuit board of the circuit board assembly, which is located on the outside of the photosensitive chip, and the height of the anti-collision structure is greater than the height of the photosensitive chip.

[0037] According to one embodiment of the present invention, the base further includes a base body, an anti-collision platform and a dust collection platform arranged on the upper end of the base body, wherein the anti-collision platform is located on the inner side of the dust collection platform, and the anti-collision platform is directly opposite to the lens.

[0038] According to an embodiment of the present invention, the height of the dust collecting platform is lower than the height of the anti-collision platform.

[0039] According to an embodiment of the present invention, a surface of at least one optical lens of the lens is coated with a filter material, wherein the filter material may be a filter film.

[0040] According to one embodiment of the present invention, the circuit board assembly further includes a dust catching mechanism, and the dust catching structure is arranged in the non-photosensitive area of ​​the photosensitive chip.

[0041] According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

[0042] an electronic device body and a cover; and

[0043] At least one camera module as described above, wherein the at least one camera module is arranged on the electronic device body and covered on the inner side of the cover plate.

[0044] According to one embodiment of the present invention, the cover plate includes a cover plate support and at least one filter glass, wherein the filter glass is opposite to the lens of the camera module, and the filter glass is a blue glass.

[0045] According to an embodiment of the present invention, the cover plate further comprises an elastic connecting member, wherein the elastic connecting member connects the cover plate supporting member to the filter glass.

[0046] According to one embodiment of the present invention, the cover is an openable and closable structure, and when the camera module is in a working state, the cover can be driven to be lifted or opened.

[0047] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and the accompanying drawings.

[0048] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 It is an overall schematic diagram of a camera module according to a preferred embodiment of the present invention.

[0050] Figure 2 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention.

[0051] Figure 3 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention.

[0052] Figure 4 It is a partial structural schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows the structure of a buffer portion of the camera module.

[0053] Figure 5 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows a motor structure of the camera module.

[0054] Figure 6 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows the structure of a circuit board of the camera module.

[0055] Figure 7 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows the structure of a circuit board of the camera module.

[0056] Figure 8 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows the structure of a circuit board of the camera module.

[0057] Fig. 9 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows an anti-collision structure of the camera module.

[0058] Fig.10 It is a schematic diagram of the optical components of the camera module according to the above-mentioned preferred embodiment of the invention.

[0059] Fig.11 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows another anti-collision structure of the camera module.

[0060] Fig.12 It is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows the structure of a cover plate.

[0061] Fig.13 1 is an overall schematic diagram of a camera module according to another preferred embodiment of the present invention, which shows a dust collecting structure. DETAILED DESCRIPTION

[0062] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

[0063] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0064] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0065] Referring to the accompanying drawings of the present invention Figure 1As shown, a camera module 100 and an electronic device with the camera module 100 according to a preferred embodiment of the present invention are explained in the following description. The camera module 100 is arranged in an electronic device body of the electronic device and is electrically connected to the electronic device body. The electronic device further includes a cover plate 200, wherein the cover plate 200 has an inner side and an outer side facing away from the inner side, wherein the camera module 100 is located on the inner side of the cover plate 200. The camera module 100 is retained in the electronic device body by the cover plate 200. It is worth mentioning that in this preferred embodiment of the present invention, the cover plate 200 may be but is not limited to a glass cover plate, that is, the cover plate 200 is made of glass, and external light can enter the camera module 100 through the cover plate 200, that is, the camera module 100 can be photographed through the cover plate 200.

[0066] It is worth mentioning that in this preferred embodiment of the present invention, the electronic device can be but is not limited to a mobile phone, a tablet computer, a smart wearable device, such as a watch, a bracelet, electronic glasses, etc. As an example, in this preferred embodiment of the present invention, the electronic device takes a mobile phone as an example. The camera module 100 is a rear camera in this preferred embodiment of the present invention, that is, the camera module 100 is arranged on the back of the electronic device, and the camera module 100 is covered by the cover plate 200 on the inner side of the cover plate 200. It is worth mentioning that in this preferred embodiment of the present invention, the application scenario of the camera module 100 is only used as an example, not a limitation.

[0067] It is worth mentioning that, in the preferred embodiment of the present invention, the number of the camera module 100 of the electronic device is at least one, that is, the electronic device includes at least one camera module 100, and the at least one camera module 100 is arranged on the back of the electronic device body with a specific position feature, and the at least one camera module 100 can be accommodated on the inner side of the cover plate 200. The camera module 100 can achieve multiple zoom, such as 4x zoom, 5x zoom, or 5-10x zoom, or even more than 10x zoom.

[0068] In detail, the camera module 100 includes a lens 10, a driving device 20, a photosensitive component 30 and a fixing device 40, wherein the fixing device 40 has a accommodating cavity 401, and the lens 10, the driving device 20 and the photosensitive component 30 can be accommodated in the accommodating cavity 401 by the fixing device 40, and the lens 10, the driving device 20 and the photosensitive component 30 inside are protected by the fixing device 40. In this preferred embodiment of the present invention, the lens 10 is drivably connected to the driving device 20, and the driving device 20 drives the lens 10 to move up and down along an optical axis direction of the camera module 100 to achieve optical zoom of the camera module 100.

[0069] The photosensitive component 30 includes a filter component 31 and a circuit board component 32, wherein the filter component 31 is located above the circuit board component 32, and the filter component 31 filters stray light. The filter component 31 includes a filter holder 311 and a filter 312 mounted on the filter holder 311. The circuit board component 32 includes a circuit board 321, a photosensitive chip 322 mounted on the surface of the circuit board 321, and at least one electronic component 323, wherein the electronic component 323 is located outside the photosensitive chip 322. The filter holder 311 further includes a lens holder 3111 and a support portion 3112 extending integrally from the lens holder 3111, wherein the support portion 3112 is formed by extending inward from the lens holder 3111, and the filter 312 is attached to the support portion 3112 of the filter holder 311. Preferably, in this preferred embodiment of the present invention, the driving device 20 is installed on the top surface of the mirror base 3111.

[0070] The circuit board assembly 32 further includes a connector 325 and a flexible board 324 , wherein the connector 325 is electrically connected to the circuit board 324 by the flexible board 324 .

[0071] The photosensitive component 30 is drivably connected to the driving device 20, and the driving device 20 drives the photosensitive component 30 to move in a specific direction or a specific angle, that is, the photosensitive component 30 can be driven by the driving device 20 to achieve optical image stabilization of the camera module 100. The camera module 100 further includes a transmission device 50, wherein the transmission device 50 is arranged between the driving device 20 and the photosensitive component 30, wherein the driving device 20 is drivably connected to the photosensitive component 30 through the transmission device 50. In other words, the driving device 20 drives the photosensitive component 30 to move in a specific direction and / or angle through the transmission device 50. The transmission device 50 is located below the driving device 20 and above the photosensitive component, and the driving device 20 drives the movement of the transmission device 50, whereby the transmission device 50 drives the photosensitive component 30 to move, thereby achieving optical image stabilization. Specifically, the bottom of the transmission device 50 is fixed to the top surface of the lens holder 3111 , wherein the top of the transmission device 50 is drivably connected to the driving device 20 , wherein the transmission device 50 is used to connect the driving device 20 with the photosensitive component 30 .

[0072] Optionally, in other embodiments of the present invention, the transmission device 50 is fixed to the circuit board assembly 32 of the photosensitive assembly 30, that is, the transmission device 50 drives the photosensitive chip 322 of the circuit board assembly 32 to move, so as to increase the reliability of the optical image stabilization of the camera module 100.

[0073] It is worth mentioning that the driving device 20 in this preferred embodiment of the present invention can be but is not limited to a driving motor.

[0074] Optionally, in other embodiments of the present invention, the lens holder 3111 is a package body, the lens holder 3111 is integrally packaged and molded on the circuit board 321, and the electronic component 323 and the gold wire electrically connected to the photosensitive chip 322 are covered by the lens holder 3111 to prevent the electronic component from being damaged. A support portion 3112 extends inwardly from the upper end of the package body to support the filter.

[0075] It is worth mentioning that in this preferred embodiment of the present invention, the camera module 100 is a retractable camera module, that is, the lens 10 of the camera module 100 is driven by the driving device 20 to move up and down along the optical axis direction to achieve the optical zoom of the camera module 100. The camera module 100 has a working state and a contracted state, and the camera module 100 can switch between the working state and the contracted state. When the camera module 100 is in the working state, the lens 10 of the camera module 100 is driven by the driving device 20 to be in an extended state, at which time the distance from the lens 10 to the photosensitive chip 322 meets the shooting requirements (TTL meets the requirements). When the camera module 100 is in the contracted state, the camera module 100 is in a contracted state, at which time the camera module 100 is low in height, so that the camera module 100 can be accommodated inside the cover 200 of the electronic device.

[0076] In detail, the camera module 100 is used as the rear camera module of the electronic device and is installed on the back of the electronic device. When the camera module 100 is in a retracted state, the height and thickness of the camera module 100 are substantially consistent. It is understandable that after the camera module 100 is assembled in the electronic device body of the electronic device, the upper end surface of the camera module 100 is flush with the back of the cover plate 200 of the electronic device, or slightly lower than the back of the cover plate 200. When the camera module 100 is in a working state, the lens 10 of the camera module 100 can be driven by the driving device 20 to extend, thereby adjusting the distance from the lens 10 to the photosensitive chip 322 according to the camera needs, meeting the requirements of zoom shooting for the back focal length, so that the shooting quality can be guaranteed. It is understandable that the height of the camera module 100 can be significantly greater than the thickness of the electronic device. In other words, when the camera module 100 is in the working state, the lens 10 of the camera module 100 can be driven by the driving device 20, and the distance between the lens 10 and the photosensitive chip 322 can be adjusted based on the shooting requirements of the camera module 100, wherein the lens 10 extends outward along the optical axis direction to the outside of the cover plate 200, or the cover plate 200 moves outward synchronously with the lens 10 along the optical axis direction to meet the optical zoom requirements of the camera module 100.

[0077] When the camera module 100 is in the retracted state, the lens 10 of the camera module 100 is driven by the driving device 20 or driven by the cover plate 200 to retract along the optical axis direction to reduce the height or thickness of the camera module 100 in the retracted state. In short, when the camera module 100 is in the retracted state, the lens 10 of the camera module 100 is driven to retract to facilitate the storage of the camera module 100.

[0078] In short, the camera module 100 has two working modes. When the camera module 100 is in operation, the lens 10 of the camera module 100 is driven to extend outward along the optical axis direction, so that the distance between the lens 10 and the photosensitive chip 322 meets the requirements of multi-zoom shooting. When the camera module 100 is in a retracted state, the lens of the camera module 100 is retracted, so that the camera module 100 is completely accommodated inside the cover plate 200 of the electronic device, thereby improving the aesthetics of the terminal (the back is flat and not abrupt). In the retracted state, the focal plane of the lens 10 is behind the photosensitive component 30. Specifically, in the retracted state, the focal plane of the lens 10 is behind the photosensitive chip 322, that is, the photosensitive chip 322 is facing away from the lens. Alternatively, in the retracted state, the focal plane of the lens 10 is behind the photosensitive surface of the photosensitive chip 322. The photosensitive surface of the photosensitive chip 322 refers to the area of ​​the photosensitive chip 322 used to receive lens light for imaging, and the photosensitive surface is located on the side of the photosensitive chip 322 close to the lens 10.

[0079] It is worth mentioning that in this preferred embodiment of the present invention, when the camera module 100 is in the retracted state, the rear telephoto camera module (the camera module 100) of the electronic device does not protrude from the back cover, and the top of the camera module 100 of this preferred embodiment of the present invention is directly attached to the cover plate 200 of the electronic device. Reducing the height of this part is conducive to further reducing the gap between the top of the camera module 100 and the cover plate 200.

[0080] It is worth mentioning that the cover plate 200 of the electronic device can also be selected to be openable and closable, that is, when the camera module 100 is in the working state, the cover plate 200 is driven by another driving mechanism to be lifted, or driven by the lens 10 of the camera module 100, it moves along the direction of movement of the lens 10. The camera module 100 drives the lens 10 through the driving device 20 to achieve optical zoom, and at this time, the lens 10 is in an extended state. When the camera module 100 is in a non-working state, the cover plate 20 is driven by another driving mechanism to be pressed down. Since the top of the camera module 100 is directly attached to the cover plate 200, the pressing process of the cover plate 200 can directly drive the lens 10 to move to the bottom position. When the camera module 100 changes from a contracted state to a working state, the cover plate 200 is driven by another driving mechanism to be lifted, and at this time, the lens 10 returns to the middle position of the camera module 100 and works under the drive of the driving device 20. The bottommost position refers to the lowest position that the lens can move downward to after being retracted.

[0081] Those skilled in the art can understand that, when performing optical zoom, the driving device 20 drives the lens 10 of the camera module 100 to extend outward along the optical axis direction, so that the distance between the lens 10 and the photosensitive component 30 meets the requirements of multi-fold zoom shooting. When not in operation, the lens 10 of the camera module is retracted so that the camera module 100 is completely accommodated in the cover 200 of the electronic device.

[0082] Referring to the accompanying drawings of the present invention Figure 2 As shown, a camera module 100 and an electronic device with the camera module 100 according to another preferred embodiment of the present invention are explained in the following description. The difference from the first preferred embodiment is the structure of the camera module 100.

[0083] The camera module 100 includes a lens 10, a driving device 20, a photosensitive component 30 and a fixing device 40, wherein the fixing device 40 has a accommodating cavity 401, and the lens 10, the driving device 20 and the photosensitive component 30 can be accommodated in the accommodating cavity 401 by the fixing device 40, and the lens 10, the driving device 20 and the photosensitive component 30 inside are protected by the fixing device 40.

[0084] Similar to the above-mentioned preferred embodiment, the driving device 20 can drive the lens 10 and / or the photosensitive component 30 to move to achieve optical image stabilization and optical zoom. The driving device 20 can be various motors, for example, an SMA motor, a piezoelectric motor, a MEMS motor, a stepper motor or a voice coil motor. The driving device 20 drives the lens 10 to extend and retract to achieve optical zoom, and the driving device 20 drives the circuit board assembly 30 to move to achieve optical image stabilization.

[0085] When performing optical zoom, the driving device 20 drives the lens 10 of the camera module 100 to extend, so that the distance between the lens 10 and the photosensitive component 30 meets the requirements of multiple zoom shooting. When not working, the lens of the camera module 100 is retracted, so that the camera module 100 is completely accommodated inside the cover 200 of the electronic device. It is worth mentioning that, unlike the first preferred embodiment mentioned above, in this preferred embodiment of the present invention, the photosensitive component 30 of the camera module 100 is no longer provided with a filter, that is, no larger space is required between the lens 10 and the photosensitive component 30 to accommodate the filter. In the retracted state, the distance between the lens 10 of the camera module 100 and the photosensitive component 30 can be closer, so that the lens 10 can be moved downward to a greater extent when it is retracted, so that the rear camera module 100 of the electronic device does not protrude from the back cover, and after the lens 10 is retracted, the total height of the camera module 100 is further reduced. Furthermore, in this embodiment, when in the retracted state, the lens 10 does not need to reserve a distance from the cover plate 200 of the electronic device after it is retracted, that is, the top of the camera module 100 is directly attached to the inner side of the cover plate 200, which further reduces the gap between the top of the camera module 100 and the cover plate 200, which is conducive to further reducing the height of the camera module 100.

[0086] Correspondingly, the photosensitive component 30 includes a circuit board component 32, wherein the circuit board component 32 is transmission-connected to the driving device 20, and the driving device 20 drives the circuit board component 32 to move in a specific direction and / or angle. The circuit board component 32 further includes a circuit board 321, a photosensitive chip 322, at least one electronic component 323, a soft board 324, and a connector 325, wherein the photosensitive chip 322 is arranged on an upper surface of the circuit board 321. Preferably, the photosensitive chip 322 can be connected to the circuit board 321 by gold wire. The electronic component 323 is arranged on the circuit board 321 and is arranged around the photosensitive chip 322. One end of the soft board 324 is electrically connected to the circuit board 321, and the other end is electrically connected to the connector 325, and is connected to the external mainboard of the electronic device through the connector 321. The soft board 324 is a flexible FPC, which can prevent the circuit board 321 from bending and breaking.

[0087] When performing optical image stabilization, the driving device 20 can drive the photosensitive component 30 to rotate in a direction perpendicular to the optical axis and / or around the optical axis to move to achieve optical image stabilization, so as to achieve movement with multiple degrees of freedom. Therefore, the structure of the driving device is simpler and the anti-shake stroke of the camera module 100 is improved, so that the larger shake of the camera module 100 can be compensated. The camera module 100 further includes a transmission device 50, wherein the transmission device 50 is arranged between the driving device 20 and the photosensitive component 30, wherein the driving device 20 is connected to the photosensitive component 30 by transmission through the transmission device 50. In other words, the driving device 20 drives the photosensitive component 30 to move in a specific direction and / or angle through the transmission device 50. The transmission device 50 is fixed to the circuit board 321 of the circuit board assembly 32, that is, the transmission device 50 drives the circuit board 321 and the photosensitive chip 322 to move, so as to increase the reliability of the optical image stabilization of the camera module 100.

[0088] like Figure 3As shown, in another optional embodiment of the present invention, the photosensitive component 30 of the camera module 100 further includes a base 33, wherein the base 33 is arranged above the circuit board assembly 32. The transmission device 50 is transmission-connected to the base 33 of the photosensitive component 30, because the transmission device 50 drives the base 33 to move. Preferably, in this preferred embodiment of the present invention, the base 33 is a package and is formed on the upper surface of the circuit board assembly 32, and the base 33 can cover electronic components and gold wires to avoid damage to electronic components or gold wires. The base 33 can also provide a smoother upper surface to improve the flatness of the entire camera module. Preferably, the lower end of the base 33 covers the non-photosensitive area of ​​the photosensitive chip 322. The base 33 includes a connection end 331 and an anti-collision end 332 extending from the connection end 331 from the outside to the inside, wherein the connection end 331 is fixedly connected to the transmission device 50, the anti-collision end 332 is formed above the photosensitive chip 322, and the anti-collision end 332 corresponds to the lower end of the lens 10, and when the lens 10 moves downward, the anti-collision end 332 prevents the lens 10 from colliding with the photosensitive chip 322. In other words, the base 33 can serve as an anti-collision structure to prevent the lens 10 from directly colliding with the photosensitive chip 322 during the downward movement, thereby damaging the photosensitive chip 322.

[0089] It is worth mentioning that the base 33 of this preferred embodiment of the present invention can also be applied to Figure 1 In the camera module of the preferred embodiment, in other words, the base 33 can also be arranged on the circuit board assembly 30 with the filter assembly 31 .

[0090] like Figure 4 As shown, the photosensitive component 30 of the camera module 100 further includes at least one buffer unit 34, wherein the buffer unit 34 is disposed on the upper surface of the base 33, and the buffer unit 34 is directly opposite to the lower end of the lens holder 10, and when the lens 10 moves downward in a retracted manner, the buffer unit 34 buffers the impact of the lens 10 on the base 33. Preferably, in this preferred embodiment of the present invention, the buffer unit 34 is implemented as a soft glue, or an elastic material, or a flexible material, and the lens 10 may collide with the base 33 when in a retracted state, thereby avoiding the generation of debris during collision or friction. The buffer unit 34 and the base 33 of this preferred embodiment of the present invention can also be applied to Figure 2 In the camera module of the preferred embodiment, debris is prevented from falling onto the chip surface and affecting imaging.

[0091] Preferably, when the lens 10 is in the retracted state, the lower surface of the lens 10 contacts the upper surface of the base 33, that is, the lens 10 retracts to the bottommost position, further reducing the height between the base of the camera module 100 and the cover 200 of the electronic device.

[0092] And when the buffer unit 34 and the base 33 in this embodiment are applied Figure 2 In the camera module of the preferred embodiment, that is, no larger space is required between the lens 10 and the photosensitive component 30 to accommodate the filter. Therefore, in the retracted state, the distance between the lens 10 of the camera module 100 and the photosensitive component 30 can be closer, so that the lens 10 can move downward to a greater extent when retracted, so that the camera module 100 of the electronic device does not protrude from the back cover.

[0093] It is worth mentioning that the buffer unit 34 and the base 33 of this preferred embodiment of the present invention can also be applied to Figure 1 In the camera module of the preferred embodiment, in other words, the base 33 and the buffer unit 34 can also be arranged on the circuit board assembly 30 with the filter assembly 31 .

[0094] Referring to the accompanying drawings of the present invention Figure 5 As shown, another optional embodiment of the camera module 100 is shown. Different from the above preferred embodiment, in this preferred embodiment of the present invention, the driving device 20 of the camera module is connected to the circuit board assembly 32 in a transmission manner, and the driving device 20 drives the circuit board assembly 32 to move to achieve optical image stabilization. The driving device 20 is located on the outside of the base 33, or the driving device 20 and the base 33 are arranged at intervals from each other. In short, in this preferred embodiment of the present invention, the driving device 20 drives the circuit board assembly 32 to move based on a control instruction. It is worth mentioning that in this preferred embodiment of the present invention, the base 33 can only wrap the gold wire and electronic components, that is, the edge portion of the circuit board 321 is not wrapped by the base 33, wherein the driving device 20 is arranged at the edge of the circuit board 321, and the base 33 is located on the inner side of the edge of the circuit board 321.

[0095] The driving device 20 includes an optical zoom motor 21 and an anti-shake motor 22, wherein the optical zoom motor 21 is transmitted to the lens 10, and the lens 10 is driven by the optical zoom motor 21 to move, so as to achieve the optical zoom of the camera module 100, and the anti-shake motor 22 is transmitted to the circuit board assembly 32, and the circuit board assembly 32 is driven by the anti-shake motor 22 to move, so as to achieve the optical image stabilization of the camera module 100.

[0096] In detail, in this preferred embodiment of the present invention, the optical zoom motor 21 is located above the anti-shake motor 22, wherein the anti-shake motor 22 is transmission-connected to the circuit board assembly 32 via a transmission device 50, and the anti-shake motor 22 drives the transmission device 50 to move, thereby the transmission device 50 drives the circuit board assembly 32 to move in a specific direction and angle.

[0097] The driving device 20 further includes a circuit connection unit 23, wherein the circuit connection unit 23 electrically connects the optical zoom motor 21 to the circuit board 321 of the circuit board assembly 32, and / or electrically connects the anti-shake motor 22 to the circuit board 321 of the circuit board assembly 32. Preferably, in this preferred embodiment of the present invention, the circuit connection unit 23 is implemented as a flexible circuit board, wherein the circuit connection unit 23 is disposed in the transmission device 50. It is worth mentioning that the optical zoom motor 21 and the anti-shake motor 22 can be connected by a motor pin.

[0098] It is worth mentioning that the optical zoom motor 21 and the anti-shake motor 22 of the preferred embodiment of the present invention can also be applied to Figure 2 In the camera module of the preferred embodiment, the filter is eliminated so that the lens 10 can be retracted and moved downward in the retracted state, thereby fully utilizing the length space of the camera module 100. After the distance between the lens 10 and the photosensitive component 30 is reduced, the camera module 100 of the electronic device does not protrude from the cover 200.

[0099] It is worth mentioning that the optical zoom motor 21 and the anti-shake motor 22 of the preferred embodiment of the present invention can also be applied to Figure 1 In the camera module of the preferred embodiment.

[0100] like Figure 6 As shown, according to another aspect of the present invention, the present invention further provides another optional implementation of a circuit board assembly 32. The circuit board assembly 32 adopts a photosensitive chip sinking or chip flipping method to further reduce the distance between the lens 10 and the photosensitive assembly 30, and to make the lens 10 shrink and move downward as much as possible in the retracted state.

[0101] In detail, the circuit board assembly 32 includes a circuit board 321, a photosensitive chip 322 disposed on the circuit board 321, at least one electronic component 323, a flexible board 324, and a connector 325, wherein the flexible board 324 electrically connects the circuit board 321 to the connector 325. The circuit board 321 is provided with a groove 3210, wherein the groove 3210 is formed on the upper surface of the circuit board 321, and the photosensitive chip 322 is disposed in the groove 3210 of the circuit board 321. Since the photosensitive chip 322 is sunk into the circuit board, the length space for the lens 10 to shrink and move downward can be further increased, and the lens 10 can be prevented from directly contacting the photosensitive chip 322, causing damage to the photosensitive chip 322.

[0102] The circuit board 321 has a circuit board upper surface 3212 and a circuit board lower surface 3213, wherein the groove 3210 is formed on the circuit board upper surface 3212 of the circuit board 321. Preferably, the thickness of the photosensitive chip 322 is not higher than the depth of the groove 3210 of the circuit board 321. In other words, in this preferred embodiment of the present invention, the upper end surface of the photosensitive chip 322 does not exceed the circuit board upper surface 3212 of the circuit board 321.

[0103] It is worth mentioning that the structure of the circuit board assembly 32 of the preferred embodiment of the present invention can also be applied to Figure 1 In the camera module of the preferred embodiment.

[0104] like Figure 7 As shown, according to another aspect of the present invention, the present invention further provides another optional embodiment of a circuit board assembly 32. The circuit board assembly 32 includes a circuit board 321, a photosensitive chip 322 disposed on the circuit board 321, at least one electronic component 323, a flexible board 324, and a connector 325, wherein the flexible board 324 electrically connects the circuit board 321 to the connector 325. The circuit board 321 has a mounting hole 3211, wherein the mounting hole 3211 passes through the circuit board upper surface 3212 and the circuit board lower surface 3213 of the circuit board 321, wherein the photosensitive chip 322 is disposed in the mounting hole 3211 of the circuit board 321.

[0105] The circuit board assembly 32 further includes a reinforcing plate 326, wherein the reinforcing plate 326 is disposed on the lower side of the circuit board 321, and the photosensitive chip 322 is supported by the reinforcing plate 321. Preferably, the reinforcing plate 326 is attached to the back of the circuit board 321 and the photosensitive chip 322, and the reinforcing plate 326 is used to strengthen the strength of the circuit board 321 and support the photosensitive chip 322. The reinforcing plate 326 can be but is not limited to metal materials such as steel plates, copper plates, aluminum plates, or non-metallic materials such as graphene. It is worth mentioning that in this preferred embodiment of the present invention, the reinforcing plate 326 also has a heat dissipation function, and the heat generated by the photosensitive chip 322 during operation can be conducted through the reinforcing plate 326 to avoid damage to the module structure caused by the heating of the camera module 100 during operation.

[0106] It is worth mentioning that the structure of the circuit board assembly 32 of the preferred embodiment of the present invention can also be applied to Figure 1 In the camera module of the preferred embodiment.

[0107] like Figure 8 As shown, according to another aspect of the present invention, the present invention further provides another optional embodiment of a circuit board assembly 32. The circuit board assembly 32 includes a circuit board 321, a photosensitive chip 322 disposed on the circuit board 321, at least one electronic component 323, a flexible board 324, and a connector 325, wherein the flexible board 324 electrically connects the circuit board 321 to the connector 325. Different from the above preferred embodiment, in this preferred embodiment of the present invention, the photosensitive chip 322 is reversely attached to the circuit board 321.

[0108] In detail, the circuit board 321 includes a circuit board body 3214 and a support arm 3215 extending inward from the upper end of the circuit board body 3214, wherein the photosensitive chip 322 is supported below the support arm 3215. The circuit board 321 is further provided with a mounting groove 3216, wherein the mounting groove 3216 is formed on the inner side of the circuit board body 3214 and the support arm 3215 of the circuit board 321, and the mounting groove 3216 penetrates the circuit board upper surface 3212 and the circuit board lower surface 3213 of the circuit board 321, wherein the photosensitive chip 322 is attached to the lower side of the support arm 3215, and the photosensitive chip 322 is supported by the support arm 3215 in the mounting groove 3216 of the circuit board 321. It can be understood that in this way, the photosensitive chip 322 is attached upside down to the circuit board 321. The height space of the camera module 100 can be more fully utilized.

[0109] It is worth mentioning that the structure of the circuit board assembly 32 of the preferred embodiment of the present invention can also be applied to Figure 2 In the camera module of the preferred embodiment, the filter is eliminated so that the lens 10 can be retracted and moved downward in the retracted state, thereby fully utilizing the length space of the camera module 100. After the distance between the lens 10 and the photosensitive component 30 is reduced, the camera module 100 of the electronic device does not protrude from the cover 200.

[0110] It is worth mentioning that the structure of the circuit board assembly 32 of the preferred embodiment of the present invention can also be applied to Figure 1 In the camera module of the preferred embodiment.

[0111] like Fig. 9 and Fig.10 As shown, according to another aspect of the present invention, the present invention further provides another optional embodiment of a circuit board assembly 32. The circuit board assembly 32 further includes at least one anti-collision structure 327, wherein the anti-collision structure 327 is arranged on the circuit board 321 of the circuit board assembly 32, and is located on the outer side of the photosensitive chip 322. The anti-collision structure 327 protrudes upward from the circuit board 321, wherein the height of the anti-collision structure 327 is greater than the height of the photosensitive chip 322, and the anti-collision structure 327 is directly opposite to the lens 10. When the lens 10 moves downward, the anti-collision structure 327 blocks the lens 10 to prevent the lens 10 from colliding with the photosensitive chip 322.

[0112] It is worth mentioning that since the camera module 100 of this preferred embodiment of the present invention cancels the filter, the lens 10 may hit the photosensitive chip 30 during the process of shrinking and moving downward in the retracted state, thereby causing the photosensitive chip 30. The anti-collision structure 327 can be an elastic protruding structure, and the height of the anti-collision structure 327 is greater than the height of the photosensitive chip 322, thereby avoiding impact on the photosensitive chip. It is worth mentioning that the anti-collision structure 327 can be set on the upper surface of the circuit board 321, and can also be set in the non-photosensitive area of ​​the photosensitive chip 322.

[0113] like Fig.10 The anti-collision structure 327 is arranged at the four corners of the circuit board 321, or is arranged at two opposite sides of the circuit board 321, or the anti-collision structure 327 forms a ring structure, wherein the photosensitive chip 322 is arranged inside the anti-collision structure 327. Therefore, in this preferred embodiment of the present invention, the specific type and shape of the anti-collision structure 327 are not limited in this application.

[0114] like Fig.11 As shown, according to another aspect of the present invention, the present invention further provides another optional implementation of a base 33. In this preferred embodiment of the present invention, the base 33 can be used as an anti-collision structure, that is, when the lens 10 reaches the top surface of the base 33 after retraction, it is blocked by the base 33 to prevent the lower end of the lens 10 from contacting the photosensitive chip 322.

[0115] The base 33 further includes a base body 331, an anti-collision platform 332 and a dust-catching platform 333 disposed at the upper end of the base body 331, wherein the anti-collision platform 332 is located on the inner side of the dust-catching platform 333, and the anti-collision platform 332 is directly opposite to the lens 10. When in the retracted state, the lens 10 retracts downward, wherein the anti-collision platform 332 of the base 33 blocks the downward movement of the lens 10 to protect the photosensitive chip 322. The dust-catching platform 333 is located at the periphery of the anti-collision platform 332, and the dust-catching platform 333 captures dust to avoid affecting the imaging of the photosensitive chip 322. It is worth mentioning that the plane of the dust-catching platform 333 is lower than the plane of the anti-collision platform 332, wherein the dust-catching platform 333 is provided with dust-catching glue, whereby the dust-catching glue absorbs dust entering the camera module and debris generated by motor friction or external dust entering the module through the motor gap.

[0116] Preferably, the height of the dust-catching platform 333 is lower than that of the anti-collision platform 332, so as to prevent the lens 10 from contacting the dust-catching glue in the dust-catching platform 333. Optionally, in other optional embodiments of the present invention, the height of the dust-catching platform 333 is substantially higher than that of the anti-collision platform 332, wherein the dust-catching platform 333 is located outside the projection of the lens 10 in the vertical direction, that is, when the lens 10 moves along the optical axis, it will not collide with the dust-catching platform 333. Preferably, the cross section of the dust-catching platform 333 can be a trapezoidal structure, that is, the side wall of the dust-catching platform 333 is an inclined side wall, that is, the opening of the dust-catching platform 333 gradually increases from bottom to top, so that the dust-catching platform 333 has a larger contact area with debris or external dust, and the dust-catching effect is better. In other optional embodiments of the present invention, the dust-catching platform 333 adopts a setting mode in which the upper and lower openings are of the same size, that is, the side wall of the dust-catching platform 333 is a vertical or nearly vertical side wall, which is not limited in this application.

[0117] It is worth mentioning that the structure of the base 33 of this preferred embodiment of the present invention can also be applied to Figure 1 In the camera module of the preferred embodiment.

[0118] like Fig.12As shown, according to another aspect of the present invention, another electronic device of the present invention is explained in the following description. The camera module 100 is arranged in the electronic device. In this preferred embodiment of the present invention, the camera module 100 is not provided with a filter, so that when the camera module 100 is not working, the lens 10 is retracted, and when the lens 10 is retracted, the camera module 100 of the electronic device does not protrude from the cover plate 200.

[0119] In this preferred embodiment of the present invention, the cover plate 200 includes a cover plate support 210 and at least one filter glass 220, wherein the filter glass 220 is directly opposite to the lens 10 of the camera module 100, wherein when the external light passes through the filter glass 220, the light of a part of the wavelength band is filtered out, and the light of another part of the wavelength band is allowed to pass through. In short, in this preferred embodiment of the present invention, the filter glass 220 has the function of filtering the external stray light to reduce the imaging image of the camera module 100 caused by the external stray light. Preferably, in this preferred embodiment of the present invention, the filter glass 220 is implemented as a blue glass, and the filtering function of the blue glass is used to prevent stray light from entering the lens.

[0120] The cover plate 200 further includes an elastic connector 230, wherein the elastic connector 230 connects the cover plate support 210 to the filter glass 220. It is worth mentioning that the elastic connector 230 of the cover plate 200 has an elastic supporting function, can support the filter glass, and allows the filter glass 220 to protrude from the cover plate support 210 of the cover plate 200.

[0121] When the camera module 100 is working, the lens 10 drives the filter glass 220 of the cover plate 200 to move and extend together. At this time, the elastic structure 230 is in a stretched state, and the filter glass 220 of the cover plate 200 moves together with the lens 10 and can protrude from the cover plate support 210 of the electronic device. When the camera module 100 is not working, the lens 10 retracts, and the cover plate 200 returns to the initial state under the pulling force of the elastic structure 230. At this time, the cover plate 200 retracts together with the lens 10, and the camera module 100 of the electronic device does not protrude from the cover plate support 210. The elastic structure 230 can be made of rubber, glass glue, hot melt glue and other materials, which are not limited in this application.

[0122] Optionally, in another optional embodiment of the present invention, the surface of at least one optical lens of the lens 10 is coated with a material capable of absorbing stray light, and after the light enters the lens, it passes through the lens coated with the filter material to filter out the unwanted stray light, thereby achieving the effect of filtering the stray light. The filter material may be a filter film, which refers to a film layer that attenuates light intensity or changes spectral components, and its main purpose is to reduce or increase color temperature, change wavelength, block unwanted light, change color, etc.

[0123] Optionally, the surface of the photosensitive chip 322 is coated with a material having a stray light absorption function to achieve the effect of filtering stray light. Specifically, the surface of the photosensitive chip 322 is coated with a layer of material having a stray light absorption function, so that when stray light passes through the lens and enters the photosensitive chip 322, it can be absorbed by the light-absorbing material on the surface of the photosensitive chip 322, thereby filtering out the unwanted stray light and achieving the effect of filtering stray light.

[0124] Preferably, the lens end face of the camera module 100 is attached to the inner side face of the cover plate 200, and the lens 10 and the inner side face of the cover plate 200 are bonded by glue to avoid generation of debris due to friction between the end face of the lens 10 and the cover plate 200.

[0125] Optionally, in other optional embodiments of the present invention, the cover plate 200 is an openable and closable structure, that is, when the camera module 100 is in working state, the cover plate 200 is driven by another driving mechanism to be lifted or opened. Optionally, the cover plate 200 can also be driven in the horizontal direction to open and close, so as to reduce the driving force required for the camera module 100 to drive the lens 10. Specifically, when the camera module 100 is working, the cover plate 200 is driven by another driving mechanism to be lifted, and the lens 10 protrudes from the glass cover plate 200. When the camera module 100 is not working, the cover plate 200 is pressed down by another driving mechanism, and since the lens 10 is in contact with the cover plate 200, the cover plate 200 presses the lens 10 to move it to the bottommost position. Fig.13 As shown, referring to another aspect of the present invention, the present invention further provides another optional embodiment of a circuit board assembly 32. The circuit board assembly 32 further includes a dust catching mechanism 328, wherein the dust catching mechanism 328 is used to catch movable particles such as dust and debris, thereby preventing particles such as dust and debris from smearing images on the telephoto camera module.

[0126] The dust-catching structure 328 is disposed in the non-photosensitive area of ​​the photosensitive chip 322, and can absorb dust, debris and other particles while avoiding affecting the imaging of the photosensitive area of ​​the photosensitive chip 322, so as to prevent dust, debris and other particles from falling on the photosensitive area of ​​the photosensitive chip 322, and avoid generating stains when the camera module 100 is imaging. Preferably, the dust-catching structure 328 is configured as a sticky annular structure, wherein the photosensitive area of ​​the photosensitive chip is surrounded by the dust-catching structure 328.

[0127] Optionally, the dust collecting structure 328 is disposed on the surface of the electronic component 323, or is disposed on the inner side of the transmission device 50, that is, the side facing the photosensitive chip 322, and the present application does not make any limitation. It is worth mentioning that the structure of the dust collecting structure 328 of this preferred embodiment of the present invention can also be applied to Figure 1 In the camera module of the preferred embodiment.

[0128] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. An electronic device, characterized in that: An electronic device body, a cover plate, and at least one camera module, wherein the at least one camera module is disposed on the electronic device body and covered on the inner side of the cover plate, and the camera module comprises: One shot; A photosensitive component, wherein the lens is disposed above the photosensitive component along an optical axis direction; a driving device, wherein the driving device is drivingly connected to the lens, and the driving device drives the lens to move along the optical axis, so that the camera module is switched between a working state and a retracted state, and when the camera module is in the retracted state, the focal plane of the lens is behind the photosensitive surface of the photosensitive component; The cover plate includes a cover plate support, a filter glass and an elastic connector, wherein the filter glass is opposite to the lens of the camera module, and the elastic connector connects the cover plate support and the filter glass. When the camera module is working, the lens drives the filter glass to move out together; when the camera module is not working, the lens retracts, and the cover plate returns to an initial state under the pulling force of the elastic connector, wherein the top of the camera module is directly attached to the inner side of the cover plate to reduce the gap between the top of the camera module and the cover plate.

2. The electronic device according to claim 1, wherein the driving device is drivingly connected to the photosensitive component, and the driving device drives the photosensitive component to move in a direction perpendicular to the optical axis and / or rotate around the optical axis.

3. An electronic device according to claim 2, wherein the photosensitive component includes a filter component and a circuit board component, wherein the filter component is located above the circuit board component, and the filter component filters stray light, and the filter component includes a filter holder and a filter mounted on the filter holder.

4. The electronic device according to claim 2 further comprises a transmission device, wherein the transmission device is arranged between the driving device and the photosensitive component, and wherein the driving device is transmission-connected to the photosensitive component through the transmission device.

5. An electronic device according to claim 2, wherein the photosensitive component includes a circuit board assembly, wherein the circuit board assembly is transmission-connected to the driving device, and the driving device drives the circuit board assembly to move in a specific direction and / or angle. 6 . The electronic device according to claim 5 , wherein the circuit board assembly further comprises a circuit board and a photosensitive chip, wherein the photosensitive chip is disposed on an upper surface of the circuit board.

7. The electronic device according to claim 6 further comprises a transmission device, wherein the transmission device is arranged between the driving device and the photosensitive component, wherein the driving device is transmission-connected to the circuit board of the photosensitive component through the transmission device.

8. The electronic device according to claim 7, wherein the photosensitive component further comprises a base, wherein the base is disposed above the circuit board component, and the transmission device is transmission-connected to the base of the photosensitive component.

9. An electronic device according to claim 8, wherein the base includes a connecting end and an anti-collision end extending from the outside to the inside from the connecting end, wherein the connecting end is fixedly connected to the transmission device, the anti-collision end is formed above the photosensitive chip, and the anti-collision end corresponds to the lower end of the lens. 10 . The electronic device according to claim 8 , wherein the photosensitive component further comprises at least one buffer unit, wherein the buffer unit is disposed on the upper surface of the base.

11. An electronic device according to claim 6, wherein the photosensitive component further comprises a base, the base is arranged above the circuit board assembly, wherein the driving device is located on the outside of the base, and the driving device is transmission-connected to the circuit board.

12. The electronic device according to claim 11, wherein the driving device comprises an optical zoom motor and an anti-shake motor, wherein the optical zoom motor drives the lens, and the anti-shake motor drives the circuit board assembly.

13. The electronic device according to claim 6, wherein the circuit board is provided with a groove, wherein the groove is formed on the upper surface of the circuit board, and the photosensitive chip is arranged in the groove of the circuit board.

14. The electronic device according to claim 6, wherein the circuit board has a mounting hole, wherein the photosensitive chip is disposed in the mounting hole of the circuit board.

15. The electronic device according to claim 14, wherein the circuit board assembly further comprises a reinforcing plate, wherein the reinforcing plate is attached to the back sides of the circuit board and the photosensitive chip.

16. An electronic device according to claim 6, wherein the circuit board comprises a circuit board body and a support arm extending inward from the upper end of the circuit board body, and the circuit board is further provided with a mounting groove, wherein the mounting groove is formed on the inner side of the circuit board body and the support arm of the circuit board, wherein the photosensitive chip is attached to the lower side of the support arm, and the photosensitive chip is supported by the support arm in the mounting groove of the circuit board.

17. An electronic device according to claim 6, wherein the circuit board assembly further includes at least one anti-collision structure, wherein the anti-collision structure is arranged on the circuit board of the circuit board assembly, which is located on the outside of the photosensitive chip, and the height of the anti-collision structure is greater than the height of the photosensitive chip.

18. An electronic device according to claim 8, wherein the base further comprises a base body, an anti-collision platform and a dust collecting platform arranged on the upper end of the base body, wherein the anti-collision platform is located on the inner side of the dust collecting platform, and the anti-collision platform is directly opposite to the lens.

19. The electronic device according to claim 18, wherein a height of the dust-collecting platform is lower than a height of the anti-collision platform.

20. The electronic device according to any one of claims 3 to 7 and 17, wherein a surface of at least one optical lens of the lens is coated with a filter material, wherein the filter material is a filter film.

21. The electronic device according to claim 6, wherein the circuit board assembly further comprises a dust catching structure, wherein the dust catching structure is disposed in a non-photosensitive area of ​​the photosensitive chip.

22. The electronic device according to claim 1, wherein the filter glass is a blue glass.

Images