Nozzle device and cooling module

The design of the nozzle device and cooling module enables efficient liquid cooling of electronic components, solving the problem that air cooling cannot meet the high-performance cooling requirements, improving cooling efficiency and reducing costs, and enhancing the convenience and safety of the cooling module.

CN114731772BActive Publication Date: 2026-04-24AISIOTOP GRP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
AISIOTOP GRP CO LTD
Filing Date
2020-11-18
Publication Date
2026-04-24

AI Technical Summary

Technical Problem

Existing technologies struggle to effectively and safely cool electrical/electronic components uniformly, especially as the performance of heat-generating components improves, making air cooling insufficient for adequate cooling.

Method used

By employing a nozzle device and a cooling module, liquid coolant is directly discharged and dispersed onto the surface of electronic components through the nozzle device. Combined with a pump and piping system, it achieves directional cooling of medium- and high-temperature components, and optimizes the distribution and utilization of coolant by utilizing the design of mounting components and radiators.

Benefits of technology

It improves cooling efficiency, reduces coolant consumption, lowers costs and operational complexity, reduces leakage risk, improves the ease of installation and maintenance of the cooling module, and enhances the cooling effect on medium-temperature components.

✦ Generated by Eureka AI based on patent content.

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Abstract

A nozzle device for cooling an electronic component. The nozzle device comprises a nozzle for discharging a liquid coolant and a mount configured to disperse the liquid coolant, the mount being further configured to couple with the electronic component. The nozzle is coupled to the mount such that, in use, the liquid coolant is discharged from the nozzle through the mount and dispersed by the mount.
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Citation Information

Patent Citations

  • Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus

    US20080037221A1

  • Heat Sink, Heat Sink Arrangement and Module for Liquid Immersion Cooling

    WO2019048864A1