Wafer-level optical lens and manufacturing method thereof

Abstract

The present invention discloses a wafer-level optical lens and a manufacturing method thereof. The wafer-level optical lens comprises a first lens and a second lens; the first lens and the second lens are stacked; a support column is arranged on the bottom surface of the first lens, and a support column is arranged on the upper surface of the second lens, and the support column of the first lens and the support column of the second lens are plugged and matched through grooves and bosses. By arranging a support column between the first lens and the second lens, and arranging bosses and grooves on the support columns of the first lens and the second lens for positioning, the first lens and the second lens can be easily aligned during the manufacturing process, and by adopting a wafer-level lens assembly, the lens size is reduced, so that product miniaturization can be achieved, which greatly improves production efficiency and reduces production costs.

Description

Technical Field

[0001] The present invention belongs to the technical field of optical lenses, and in particular to a wafer-level optical lens and a manufacturing method thereof. Background Art

[0002] With the development of camera technology, more and more terminal devices use lens modules, and the market demand for miniaturized lens modules is increasing day by day. Traditional lenses are mostly injection molded, which is difficult to miniaturize and has high costs; wafer-level optical lens technology has become an important technology for miniaturized lens modules. Summary of the invention

[0003] In order to solve the problems existing in the prior art, the present invention provides a wafer-level optical lens and a manufacturing method thereof, which enables product miniaturization, improves production efficiency and reduces production costs.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] A wafer-level optical lens comprises a first lens and a second lens;

[0006] The first lens and the second lens are stacked;

[0007] A support column is arranged on the bottom surface of the first lens, and a support column is arranged on the upper surface of the second lens. The support column of the first lens and the support column of the second lens are plugged and matched with each other through a groove and a boss.

[0008] Preferably, the first lens comprises a first glass and a surface adhesive; the surface adhesive is arranged on the upper and lower surfaces of the first glass to form a microlens.

[0009] The second lens includes a second glass and a surface adhesive; the surface adhesive is arranged on the upper and lower surfaces of the first glass to form a microlens.

[0010] Preferably, a boss is provided on the support column of the first lens, and a groove is provided on the support column of the second lens, and the boss is plug-fitted with the groove.

[0011] Preferably, black films are provided on the outer sides of the first lens and the second lens.

[0012] Preferably, the support column between the first lens and the second lens is fixed by fixing glue.

[0013] Preferably, a shell is provided on the outer sides of the first lens and the second lens.

[0014] Preferably, shell threads are provided on the side walls of the shell.

[0015] Preferably, the shell is made of plastic.

[0016] A method for manufacturing a wafer-level optical lens comprises the following steps:

[0017] Step 1, placing the second lens on the stage, with the boss of the supporting column of the second lens facing upward;

[0018] Step 2, applying fixing glue on the boss of the support column of the second lens;

[0019] Step 3, using a suction nozzle to suck the first lens, with the groove of the support column on the lower surface of the first lens facing downward;

[0020] Step 4, after aligning the groove of the support column of the first lens and the boss of the support column of the second lens, the support column of the first lens and the support column of the second lens are bonded together by fixing glue to form a single wafer-level optical lens.

[0021] A method for manufacturing a wafer-level optical lens comprises the following steps:

[0022] Step 1, placing a second lens wafer on a stage, with the boss of the supporting column of the second lens in the second lens wafer facing upward;

[0023] Step 2, applying fixing glue on the boss of the support column of the second lens in the second lens wafer;

[0024] Step 3, using a suction nozzle to suck the first lens wafer, with the groove of the support column on the lower surface of the first lens in the first lens wafer facing downward;

[0025] Step 4, after aligning the first lens wafer and the second lens wafer, the groove of the support column of the first lens and the boss position of the support column of the second lens correspond to each other, the support column of the first lens and the support column of the second lens are bonded by fixing glue, and the first lens wafer and the second lens wafer form a whole;

[0026] Step 5, cutting along the cutting paths on the first lens wafer and the second lens wafer to form a single wafer-level optical lens.

[0027] Compared with the prior art, the present invention has the following beneficial technical effects:

[0028] The present invention provides a wafer-level optical lens. A support column is arranged between a first lens and a second lens. A boss and a groove are arranged on the support columns of the first lens and the second lens for positioning, respectively, so that the first lens and the second lens can be easily aligned during the manufacturing process. By adopting a wafer-level lens assembly, the lens size is reduced, so that product miniaturization can be achieved. The first lens and the second lens are formed by semiconductor imprinting technology, and two process methods, chip to chip or wafer to wafer, are adopted, which greatly improves production efficiency and reduces production costs.

[0029] Furthermore, by applying a black film on the outer sides of the first lens and the second lens, stray light interference can be prevented.

[0030] Furthermore, by providing shell screw threads on the side walls of the shell, installation and disassembly of the wafer-level optical lens is facilitated. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a schematic structural diagram of a wafer-level optical lens according to an embodiment of the present invention;

[0032] Figure 2 Another structural schematic diagram of a wafer-level optical lens according to an embodiment of the present invention;

[0033] Figure 3 Another structural schematic diagram of a wafer-level optical lens according to an embodiment of the present invention;

[0034] Figure 4 This is a schematic structural diagram of a first lens wafer according to an embodiment of the present invention;

[0035] Figure 5 is a schematic structural diagram of a second lens wafer according to an embodiment of the present invention;

[0036] Figure 6 It is a schematic structural diagram of a chip to chip bonding process according to an embodiment of the present invention;

[0037] Figure 7 It is a schematic structural diagram of a wafer to wafer bonding process according to an embodiment of the present invention;

[0038] Figure 8 It is a schematic structural diagram of the alignment of the wafer to wafer bonding process according to an embodiment of the present invention;

[0039] Fig. 9 It is a structural schematic diagram of another wafer to wafer bonding process alignment according to an embodiment of the present invention;

[0040] Fig.10It is a structural schematic diagram of another wafer to wafer bonding process alignment according to an embodiment of the present invention;

[0041] Fig.11 It is a structural schematic diagram of another wafer to wafer bonding process alignment according to an embodiment of the present invention;

[0042] Fig.12 It is a structural schematic diagram of another wafer to wafer bonding process alignment according to an embodiment of the present invention;

[0043] In the accompanying drawings: 1 is the first lens; 2 is the second lens; 3 is the fixing glue; 4 is the black film; 5 is the first glass; 6 is the second glass; 7 is the surface glue; 8 is the support column; 9 is the shell; 10 is the cutting path; 11 is the shell screw thread; 12 is the first lens wafer; 13 is the second lens wafer; 14 is the suction nozzle; 15 is the stage. DETAILED DESCRIPTION

[0044] The present invention is further described in detail below in conjunction with specific embodiments, which are intended to explain the present invention rather than to limit it.

[0045] Example

[0046] The present invention provides a wafer-level optical lens, comprising a first lens 1 and a second lens 2; the first lens 1 and the second lens 2 are stacked; a support column 8 is arranged on the bottom surface of the first lens 1, and a support column 8 is arranged on the upper surface of the second lens 2, and the support column 8 of the first lens 1 and the support column 8 of the second lens 2 are plugged into each other through grooves and bosses.

[0047] The present invention provides a wafer-level optical lens and a manufacturing method thereof, so that product miniaturization can be achieved; in addition, semiconductor imprinting technology is used between lenses, and two process modes, chip to chip or wafer to wafer, are used, which greatly improves production efficiency and reduces production costs.

[0048] like Figure 1 As shown, the present invention provides a wafer-level optical lens, comprising a first lens 1 and a second lens 2. The first lens 1 comprises a first glass 5 and a surface adhesive 7; the surface adhesive 7 is applied to the upper surface of the first glass 5, and a transparent protrusion is formed on the upper surface of the first glass 5 by embossing; the surface adhesive 7 is applied to the lower surface of the first glass 5, and a transparent protrusion is formed on the lower surface of the first glass 5 by embossing, and the first glass 5 and the surface adhesive 7 on the upper and lower surfaces are processed to form a microlens.

[0049] The second lens 2 includes a second glass 6 and a surface adhesive 7; the surface adhesive 7 is applied to the upper surface of the second glass 6, and a transparent protrusion is formed on the upper surface of the second glass 6 through embossing; the surface adhesive 7 is applied to the lower surface of the second glass 6, and a transparent protrusion is formed on the lower surface of the second glass 6 through embossing, so that the second glass 6 and the surface adhesive 7 on the upper and lower surfaces are processed into a microlens.

[0050] A support column 8 is provided on the lower surface of the first lens 1, and a groove is provided on the support column 8 of the first lens 1. A support column 8 is provided on the upper surface of the second lens 2, and a boss is provided on the support column 8 of the second lens 2. The groove and the boss are plugged together, and both the groove and the boss are arc-shaped structures. The first lens 1 and the second lens 2 are positioned, and the connection between the groove and the boss is coated with a fixing glue 3. The fixing glue 3 fixes the support column 8 of the first lens 1 and the support column 8 of the second lens 2, so that the first lens 1 and the second lens 2 are attached together. A black film 4 is applied on the outer side walls of the first lens 1 and the second lens 2 to prevent stray light interference.

[0051] like Figure 2 As shown, another structural schematic diagram of the wafer-level optical lens of the present invention includes a first lens 1, a second lens 2 and a housing 9.

[0052] The first lens 1 includes a first glass 5 and a surface adhesive 7; the surface adhesive 7 is applied to the upper surface of the first glass 5, and a transparent protrusion is formed on the upper surface of the first glass 5 through embossing; the surface adhesive 7 is applied to the lower surface of the first glass 5, and a transparent protrusion is formed on the lower surface of the first glass 5 through embossing, and the first glass 5 and the surface adhesive 7 on the upper and lower surfaces are processed to form a microlens.

[0053] The second lens 2 includes a second glass 6 and a surface adhesive 7; the surface adhesive 7 is applied to the upper surface of the second glass 6, and a transparent protrusion is formed on the upper surface of the second glass 6 through embossing; the surface adhesive 7 is applied to the lower surface of the second glass 6, and a transparent protrusion is formed on the lower surface of the second glass 6 through embossing, so that the second glass 6 and the surface adhesive 7 on the upper and lower surfaces are processed into a microlens.

[0054] A support column 8 is provided on the lower surface of the first lens 1, and a groove is provided on the support column 8 of the first lens 1. A support column 8 is provided on the upper surface of the second lens 2, and a boss is provided on the support column 8 of the second lens 2. The groove and the boss are plugged together, and both the groove and the boss are arc-shaped structures. The first lens 1 and the second lens 2 are positioned, and the connection between the groove and the boss is coated with a fixing glue 3. The fixing glue 3 fixes the support column 8 of the first lens 1 and the support column 8 of the second lens 2, so that the first lens 1 and the second lens 2 are attached together. The first lens 1 and the second lens 2 are nested inside the outer shell 9, and the connection between the first lens 1 and the second lens 2 and the outer shell 9 is provided with a fixing glue 3, which fixes the first lens 1, the second lens 2 and the outer shell 9 to form a wafer-level optical lens. The material of the outer shell 9 can be plastic.

[0055] like Figure 3 As shown, another structural schematic diagram of the wafer-level optical lens of the present invention includes a first lens 1, a second lens 2, a housing 9 and a housing screw thread 11.

[0056] The first lens 1 includes a first glass 5 and a surface adhesive 7; the surface adhesive 7 is applied to the upper surface of the first glass 5, and a transparent protrusion is formed on the upper surface of the first glass 5 through embossing; the surface adhesive 7 is applied to the lower surface of the first glass 5, and a transparent protrusion is formed on the lower surface of the first glass 5 through embossing, and the first glass 5 and the surface adhesive 7 on the upper and lower surfaces are processed to form a microlens.

[0057] The second lens 2 includes a second glass 6 and a surface adhesive 7; the surface adhesive 7 is applied to the upper surface of the second glass 6, and a transparent protrusion is formed on the upper surface of the second glass 6 through embossing; the surface adhesive 7 is applied to the lower surface of the second glass 6, and a transparent protrusion is formed on the lower surface of the second glass 6 through embossing, so that the second glass 6 and the surface adhesive 7 on the upper and lower surfaces are processed into a microlens.

[0058] A support column 8 is provided on the lower surface of the first lens 1, and a groove is provided on the support column 8 of the first lens 1. A support column 8 is provided on the upper surface of the second lens 2, and a boss is provided on the support column 8 of the second lens 2. The groove and the boss are plugged together, and both the groove and the boss are arc-shaped structures. The first lens 1 and the second lens 2 are positioned. The connection between the groove and the boss is coated with a fixing glue 3. The fixing glue 3 fixes the support column 8 of the first lens 1 and the support column 8 of the second lens 2, so that the first lens 1 and the second lens 2 are attached together. The first lens 1 and the second lens 2 are nested inside the shell 9. The connection between the first lens 1 and the second lens 2 and the shell 9 is provided with a fixing glue 3. The first lens 1, the second lens 2 and the shell 9 are fixed to form a wafer-level optical lens. The side wall of the shell 9 is provided with a shell screw 11. The shell screw 11 facilitates the module assembly of the single combination product formed by the first lens 1 and the second lens 2.

[0059] like Figure 4 As shown, there are a plurality of first lenses 1 on a first lens wafer 12 , and a cutting path 10 is provided between adjacent first lenses 1 . The first lens wafer 12 is cut along the cutting path 10 to form a single first lens 1 .

[0060] like Figure 5 As shown, there are a plurality of second lenses 2 on the second lens wafer 13 , a cutting path 10 is provided between adjacent second lenses 2 , and cutting is performed along the cutting path 10 on the first lens wafer 12 to form a single second lens 2 .

[0061] like Figure 6 As shown, the present invention provides a method for manufacturing a wafer-level optical lens, comprising the following steps:

[0062] Step 1, placing the second lens 2 on the stage 15, with the boss of the support column 8 of the second lens 2 facing upward;

[0063] Step 2, applying fixing glue 3 on the boss of the support column 8 of the second lens 2;

[0064] Step 3, using the suction nozzle 14 to suck the first lens 1, with the groove of the support column 8 on the lower surface of the first lens 1 facing downward;

[0065] Step 4, after aligning the groove of the support column 8 of the first lens 1 and the boss of the support column 8 of the second lens 2, the support column 8 of the first lens 1 and the support column 8 of the second lens 2 are bonded together by fixing glue 3 to form a single wafer-level optical lens.

[0066] like Figure 7 As shown, a method for manufacturing a wafer-level optical lens of the present invention uses a first lens wafer 12 and a second lens wafer 13, and includes the following steps:

[0067] Step 1, placing the second lens wafer 13 on the stage 15, with the boss of the support column 8 of the second lens 2 in the second lens wafer 13 facing upward;

[0068] Step 2, applying fixing glue 3 on the boss of the support column 8 of the second lens 2 in the second lens wafer 13;

[0069] Step 3, using the suction nozzle 14 to suck the first lens wafer 12, with the groove of the support column 8 on the lower surface of the first lens 1 in the first lens wafer 12 facing downward;

[0070] Step 4, after aligning the first lens wafer 12 and the second lens wafer 13, the groove of the support column 8 of the first lens 1 and the boss position of the support column 8 of the second lens 2 correspond to each other, the support column 8 of the first lens 1 and the support column 8 of the second lens 2 are bonded by the fixing glue 3, and the first lens wafer 12 and the second lens wafer 13 form a whole;

[0071] Step 5, cutting is performed along the cutting paths 10 on the first lens wafer 12 and the second lens wafer 13 to form a single wafer-level optical lens.

[0072] like Figures 8 to 12 , which is a schematic diagram of different structures for alignment of wafer to wafer bonding process, different structures are designed for the grooves and bosses on the support pillars 8 to meet the high precision requirement of wafer to wafer alignment.

[0073] like Figure 8 As shown, the groove of the support column 8 of the second lens 2 on the second lens wafer 13 is arranged in an arc shape with the cutting road 10 as the center, and the cross-sections of the groove and the boss of the support column 8 are both nipple-shaped. Figure 8 In the embodiment, the limit compression thickness of the fixing glue 3 is h, and a gap is left at the lowest point between the groove on the supporting column 8 and the boss.

[0074] like Fig. 9 As shown, Fig. 9 In the embodiment, the limit compression thickness of the fixing glue 3 is h1, h1 ≥ h, and there is no gap between the lowest point of the groove on the support column 8 and the boss;

[0075] like Fig.10 As shown, the grooves of the support pillars 8 of the second lens 2 on the second lens wafer 13 are arranged in a straight line with the cutting path 10 as the center. Fig.10 In the embodiment, the limit compression thickness of the fixing glue 3 is h2, h2 ≥ h, and the lowest point gap between the groove on the support column 8 and the boss is determined by the structural design;

[0076] like Fig.11 As shown, Fig.11In the figure, the ultimate compression thickness of the fixing glue 3 is h3, h3=h, and the lowest point gap between the groove on the support column 8 and the boss is determined by the ultimate compression thickness of the fixing glue 3;

[0077] like Fig.12 As shown, Fig.12 In the embodiment, the limit compression thickness of the fixing glue 3 is h4, h4≥h, and there is no gap at the lowest point between the groove on the support column 8 and the boss.

[0078] In summary, the present invention provides a wafer-level optical lens and a manufacturing method thereof, which enables product miniaturization; in addition, semiconductor imprinting technology is used between lenses, and two process methods, chip to chip or wafer to wafer, are used, which greatly improves production efficiency and reduces production costs.

Claims

1. A wafer-level optical lens, characterized in that: It comprises a first lens (1) and a second lens (2); The first lens (1) and the second lens (2) are stacked; A support column (8) is provided on the bottom surface of the first lens (1), and a support column (8) is provided on the upper surface of the second lens (2); the support column (8) of the first lens (1) and the support column (8) of the second lens (2) are plugged into each other via a groove and a boss; The first lens (1) comprises a first glass (5) and a surface adhesive (7); the surface adhesive (7) is arranged on the upper and lower surfaces of the first glass (5) to form a microlens; The second lens (2) comprises a second glass (6) and a surface adhesive (7); the surface adhesive (7) is arranged on the upper and lower surfaces of the first glass (5) to form a microlens; The support column (8) between the first lens (1) and the second lens (2) is fixed by means of a fixing glue (3); The groove of the support column (8) of the second lens (2) on the second lens wafer (13) is arranged in an arc shape with the cutting path (10) as the center, the cross-sections of the groove and the boss of the support column (8) are both nipple-shaped, the limit compression thickness of the fixing glue (3) is h, and a gap is left at the lowest point between the groove and the boss on the support column (8).

2. The wafer-level optical lens according to claim 1, characterized in that: A boss is provided on the support column (8) of the first lens (1), and a groove is provided on the support column (8) of the second lens (2), and the boss is plug-fitted into the groove.

3. The wafer-level optical lens according to claim 1, characterized in that: The outer sides of the first lens (1) and the second lens (2) are both provided with a black film (4).

4. The wafer-level optical lens according to claim 1, characterized in that: A shell (9) is provided on the outer sides of the first lens (1) and the second lens (2).

5. The wafer-level optical lens according to claim 4, characterized in that: A shell thread (11) is provided on the side wall of the shell (9).

6. The wafer-level optical lens according to claim 4, characterized in that: The housing (9) is made of plastic.

7. A method for manufacturing a wafer-level optical lens, characterized in that: Based on the wafer-level optical lens described in claim 1, The following steps are included: Step 1, placing the second lens (2) on the stage (15), with the boss of the support column (8) of the second lens (2) facing upwards; Step 2, applying fixing glue (3) on the boss of the support column (8) of the second lens (2); Step 3, using a suction nozzle (14) to suck the first lens (1), with the groove of the support column (8) on the lower surface of the first lens (1) facing downwards; Step 4, after aligning the groove of the support column (8) of the first lens (1) and the boss of the support column (8) of the second lens (2), the support column (8) of the first lens (1) and the support column (8) of the second lens (2) are bonded together by means of a fixing glue (3) to form a single wafer-level optical lens.

8. A method for manufacturing a wafer-level optical lens, based on the wafer-level optical lens according to claim 1, characterized in that: The following steps are included: Step 1, placing a second lens wafer (13) on a stage (15), with the boss of the support column (8) of the second lens (2) in the second lens wafer (13) facing upwards; Step 2, applying fixing glue (3) on the boss of the support column (8) of the second lens (2) in the second lens wafer (13); Step 3, using a suction nozzle (14) to suck the first lens wafer (12), with the groove of the support column (8) on the lower surface of the first lens (1) in the first lens wafer (12) facing downwards; Step 4, after aligning the first lens wafer (12) and the second lens wafer (13), the groove of the support column (8) of the first lens (1) and the boss position of the support column (8) of the second lens (2) correspond to each other, the support column (8) of the first lens (1) and the support column (8) of the second lens (2) are bonded together by fixing glue (3), and the first lens wafer (12) and the second lens wafer (13) form a whole; Step 5, cutting along the cutting paths (10) on the first lens wafer (12) and the second lens wafer (13) to form a single wafer-level optical lens.

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