LED bracket, side light-emitting device, light-emitting device and manufacturing method thereof

Abstract

The present application provides an LED bracket, a side-light-emitting device, a light-emitting device and a manufacturing method thereof, wherein the LED bracket includes a substrate and a packaging body, wherein the packaging body is arranged on the substrate, two cup-shaped cavities arranged side by side penetrate the packaging body, the substrate closes the openings on one side of the two cup-shaped cavities, the two cup-shaped cavities are separated by a first blocking part, each cup-shaped cavity is provided with a second blocking part at a position opposite to the first blocking part, a connecting part connects the first blocking part and the second blocking part, and the height of the second blocking part is lower than the height of the first blocking part and the connecting part, by making the LED bracket meet the above structure, it is beneficial to improve its light-emitting angle and avoid glue overflow during the packaging process.

Description

Technical Field

[0001] The present application belongs to the field of LED technology, and in particular relates to an LED bracket, a side-light-emitting device, a light-emitting component and a manufacturing method thereof. Background Art

[0002] Top-emitting LED (TOP-LED) products are SMD LEDs, whose LED chips are fixed on the substrate of the bracket. Due to structural limitations, they can usually only emit light from one side.

[0003] In order to increase its luminous angle, a common implementation method is to use a bracket made of transparent material, but the light decay of the bracket made of transparent material is accelerated at high temperature and is only suitable for low-power products; if a convex cup structure LED is used to make it emit light at a wide angle, glue overflow is likely to occur during the glue packaging process, and the convex cup has limited effect on expanding the luminous angle of the light.

[0004] Therefore, how to improve the light-emitting angle of the light-emitting product and avoid glue overflow during the packaging process has become an urgent problem to be solved in the development of existing TOP-LED product technology. Summary of the invention

[0005] The purpose of the present application is to provide an LED bracket, a side-light-emitting device, a light-emitting device and a manufacturing method thereof, so as to solve the problems in the prior art that the light-emitting products have a small light-emitting angle and overflow glue during the packaging process.

[0006] To achieve the purpose of this application, this application provides the following technical solutions:

[0007] In the first aspect, the present application provides an LED bracket, comprising a substrate and a packaging body; the packaging body is arranged on the substrate, two cup-shaped cavities arranged side by side penetrate the packaging body, the substrate closes the openings on one side of the two cup-shaped cavities, the two cup-shaped cavities are separated by a first blocking part, each of the cup-shaped cavities is provided with a second blocking part at a position opposite to the first blocking part, and a connecting part connects the first blocking part and the second blocking part; with one side of the cup-shaped cavity closed by the substrate as a reference, the height of the second blocking part is lower than the heights of the first blocking part and the connecting part.

[0008] In one embodiment, the side wall of the cup-shaped cavity is inclined relative to the substrate, the cup-shaped cavity forms a flared shape from the substrate, and the inclination of the side wall at the first blocking portion is greater than the inclination of the side wall at the second blocking portion.

[0009] In one embodiment, the side wall of the cup-shaped cavity is at least partially concave.

[0010] In the second aspect, the present application also provides a light-emitting device, comprising an LED chip, a packaging glue, and an LED bracket described in any embodiment of the first aspect, wherein the LED chip is accommodated in the cup-shaped cavity and connected to the substrate, the packaging glue is applied in the cup-shaped cavity to cover the LED chip, and the first blocking part, the second blocking part and the connecting part are used to limit the flow range of the packaging glue.

[0011] In one embodiment, based on the side of the cup-shaped cavity closed by the substrate, the height of the second blocking portion is higher than the height of the LED chip.

[0012] In one embodiment, a protrusion is provided inside the cup-shaped cavity, and the protrusion is located between the LED chip and the first blocking portion; a Zener diode is provided on the surface of the substrate, and the Zener diode is accommodated in the cup-shaped cavity and located between the protrusion and the first blocking portion.

[0013] In a third aspect, the present application further provides a side-light emitting device, comprising a side panel and a light-emitting device as described in any embodiment of the second aspect, wherein a plurality of the light-emitting devices are arranged side by side on the side panel, and the second blocking portions of the plurality of the light-emitting devices are adjacent.

[0014] In a fourth aspect, the present application also provides a method for manufacturing a light-emitting device, comprising:

[0015] A substrate is provided, a packaging body is arranged on the substrate, a cup-shaped cavity is formed through the packaging body, the substrate closes an opening on one side of the cup-shaped cavity, two cup-shaped cavities form a cup-shaped cavity group, two cup-shaped cavities of a cup-shaped cavity group are arranged side by side and separated by a first blocking part, each cup-shaped cavity is provided with a second blocking part at a position opposite to the first blocking part, a connecting part connects the first blocking part and the second blocking part, and the height of the second blocking part is lower than the height of the first blocking part and the connecting part based on the side of the cup-shaped cavity closed by the substrate; an LED chip is accommodated in the cup-shaped cavity and conductively connected to the substrate; a packaging glue is applied in the cup-shaped cavity to cover the LED chip, and the packaging glue is baked to form.

[0016] In one embodiment, the manufacturing method further comprises: before applying the packaging glue, spraying a silicone adhesive on the inner surface of the cup-shaped cavity and the surface of the second blocking portion facing away from the substrate.

[0017] In one embodiment, the preparation method further comprises: in one of the cup-shaped cavities, sequentially dotting from one of the cup-shaped cavities to another of the cup-shaped cavities, and the dotting positions are spaced a distance from the corresponding second blocking portion.

[0018] In one embodiment, the manufacturing method further includes: forming more than two cup-shaped cavity groups arranged in an array on the packaging body, adjacent cup-shaped cavity groups being connected by the second blocking portion; in the more than two cup-shaped cavity groups, applying glue from the first blocking portion corresponding to one cup-shaped cavity group to the first blocking portion corresponding to another adjacent cup-shaped cavity group, and the starting position and the end position of the glue application are both spaced apart from the corresponding first blocking portion; after the packaging glue is baked and cured, it is cut to form a single cup-shaped cavity group.

[0019] The packaging body is arranged on a substrate, and two cup-shaped cavities arranged side by side penetrate the packaging body. The substrate closes the openings on one side of the two cup-shaped cavities to provide an accommodating space for the injection of packaging glue, wherein the two cup-shaped cavities are separated by a first blocking part, and each cup-shaped cavity is provided with a second blocking part at a position opposite to the first blocking part, and the connecting part connects the first blocking part and the second blocking part; with one side of the cup-shaped cavity opening closed by the substrate as a reference, the height of the second blocking part is lower than the heights of the first blocking part and the connecting part. Therefore, when the packaging glue is injected into the two cup-shaped cavities, the packaging glue contacts the side walls of the cup-shaped cavities, wherein the packaging glue contacts the side walls of the first blocking part and the connecting part with a higher height, which is beneficial to increase the bonding force between the packaging glue and the LED bracket and reduce the overflow of the packaging glue. It is particularly suitable for making the packaging glue into a convex cup structure that can expand the luminous angle; at the same time, due to the lower height of the second blocking part, the LED chip has a larger luminous emission angle at the second blocking part, and partially overlaps with the luminous area of ​​the LED chip in the adjacent LED bracket, thereby filling the gap between adjacent LED brackets, avoiding the problem of dark shadows between lamp beads, and solving the problem of small luminous angle of the luminous product and overflow of glue during the packaging process. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 is a top view of the structure of an LED bracket of an embodiment;

[0022] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure at AA in FIG.

[0023] Figure 3 yes Figure 1 Schematic diagram of the cross-sectional structure at BB in FIG.

[0024] Figure 4 is a top view of the structure of a light emitting device of an embodiment;

[0025] Figure 5 is a top view of the structure of a light emitting device according to another embodiment;

[0026] Figure 6 yes Figure 4 Schematic diagram of the cross-sectional structure at CC in the middle;

[0027] Figure 7 yes Figure 5 Schematic diagram of the cross-sectional structure at DD in the middle;

[0028] Figure 8 yes Figure 5 Schematic diagram of the arrangement of the light emitting devices;

[0029] Fig. 9 It is a schematic structural diagram of a side-light emitting device according to an embodiment.

[0030] Description of reference numerals:

[0031] 11-substrate, 111-pin, 12-package body, 121-first blocking portion, 122-second blocking portion, 123-connecting portion, 13-cup-shaped cavity, 14-protrusion;

[0032] 20-LED chip, 30-packaging glue, 40-side panel, 50-light-emitting device. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] The present application embodiment provides an LED bracket, see Figure 1 , Figure 2 and Figure 3 , including a substrate 11 and a package body 12, wherein the package body 12 is arranged on the substrate 11, and the material of the substrate 11 includes but is not limited to metal and ceramic, mostly a mixed material, to achieve the functions of conduction and heat dissipation, and the substrate 11 is provided with positive and negative conductive substrates, and the positive and negative conductive substrates are electrically connected to the positive and negative pins 111, and conduct electricity through the positive and negative pins 111.

[0035] The material of the package body 12 includes but is not limited to polyphthalamide, poly(1-4-cyclohexane dimethanol terephthalate), epoxy resin molding compound, etc. Optionally, the main body of the package body 12 is located on the upper surface of the substrate 11, and part of the package body 12 is arranged on the side of the substrate 11 connected to the upper surface of the substrate 11, and the package body 12 is embedded in and / or surrounds the side of the substrate 11 to provide insulation.

[0036] Two cup-shaped cavities 13 arranged side by side penetrate the package body 12, and the substrate 11 closes the openings on one side of the two cup-shaped cavities 13 to form a bowl-shaped accommodating cavity with a single-side opening, which is used to accommodate the LED chip 20 and the packaging glue 30, etc. The sizes and shapes of the two cup-shaped cavities 13 can be the same or different. Optionally, the cup-shaped cavity 13 is a semi-ellipsoidal cavity or an inverted cavity. The cross-sectional shape of the cup-shaped cavity 13 close to the substrate 11 can be the same or different from the cross-sectional shape of the cup-shaped cavity 13 facing away from the substrate 11. Optionally, the cross-sectional shape of the cup-shaped cavity 13 facing away from the substrate 11 is a rectangle, a circle, or a rectangle with chamfered corners.

[0037] Preferably, the two cup-shaped cavities 13 have the same shape and size, and the cross-sectional area of ​​the cup-shaped cavity 13 facing away from the substrate 11 is not less than the cross-sectional area of ​​the cup-shaped cavity 13 close to the substrate 11, so as to facilitate the injection of the packaging glue 30 and increase the light-emitting angle of the light-emitting product.

[0038] Specifically, the two cup-shaped cavities 13 are separated by a first blocking portion 121, and each cup-shaped cavity 13 is provided with a second blocking portion 122 at a position opposite to the first blocking portion 121, and the connecting portion 123 connects the first blocking portion 121 and the second blocking portion 122, that is, the first blocking portion 121, the connecting portion 123, the second blocking portion 122 and the substrate 11 together enclose a cup-shaped cavity 13, and with one side of the substrate 11 closing the cup-shaped cavity 13 as a reference, the height of the second blocking portion 122 is lower than the heights of the first blocking portion 121 and the connecting portion 123. Optionally, taking one side of the cup-shaped cavity 13 closed by the substrate 11 as a reference, the heights of the first blocking portion 121 and the connecting portion 123 are the same, and both are higher than the height of the second blocking portion 122; or taking one side of the cup-shaped cavity 13 closed by the substrate 11 as a reference, the first blocking portion 121 is higher than the height of the second blocking portion 122, the connecting portion 123 smoothly connects the first blocking portion 121 and the second blocking portion 122, the height of the connecting portion 123 varies, and is located between the heights of the first blocking portion 121 and the second blocking portion 122; or taking one side of the cup-shaped cavity 13 closed by the substrate 11 as a reference, the first blocking portion 121 is higher than the height of the second blocking portion 122, the height of the connecting portion 123 is constant, and the height of the connecting portion 123 is located between the heights of the first blocking portion 121 and the second blocking portion 122.

[0039] The packaging body 12 is arranged on the substrate 11, and two cup-shaped cavities 13 arranged side by side penetrate the packaging body 12. The substrate 11 closes the openings on one side of the two cup-shaped cavities 13 to provide an accommodating space for the injection of the packaging glue 30, wherein the two cup-shaped cavities 13 are separated by a first blocking portion 121, and each cup-shaped cavity 13 is provided with a second blocking portion 122 at a position opposite to the first blocking portion 121, and a connecting portion 123 connects the first blocking portion 121 and the second blocking portion 122; taking one side of the cup-shaped cavity 13 closed by the substrate 11 as a reference, the height of the second blocking portion 122 is lower than the heights of the first blocking portion 121 and the connecting portion 123. Therefore, when the encapsulation glue 30 is injected into the two cup-shaped cavities 13, the encapsulation glue 30 contacts the side walls of the cup-shaped cavities 13, wherein the encapsulation glue 30 contacts the side walls of the first blocking portion 121 and the connecting portion 123 with a relatively high height, which is beneficial to increase the bonding force between the encapsulation glue 30 and the LED bracket, increase the capacity of the cup-shaped cavity 13 for the encapsulation glue 30, and reduce the overflow of the encapsulation glue 30, which is particularly suitable for making the encapsulation glue 30 into a convex cup structure that can expand the luminous angle. At the same time, due to the lower height of the second blocking portion 122, the LED chip 20 has a larger luminous emission angle at the second blocking portion 122, and partially overlaps with the luminous area of ​​the LED chip 20 in the adjacent LED bracket, which fills the gap between adjacent LED brackets with light, avoids the problem of dark shadows between lamp beads, and solves the problem of small luminous angle of luminous products and overflow of glue during packaging.

[0040] In one implementation, see Figure 1 , Figure 2 and Figure 3 The first blocking portion 121 and the connecting portion 123 are an integrated structure, and optionally, the first blocking portion 121 and the connecting portion 123 have the same height. Optionally, the first blocking portion 121, the second blocking portion 122 and the connecting portion 123 are an integrated structure, and based on the side of the substrate 11 that closes the cup-shaped cavity 13, the first blocking portion 121 and the connecting portion 123 have the same height, and the connecting portion 123 and the second blocking portion 122 are connected by an inclined slope, which is conducive to avoiding the overflow of the packaging glue 30 at the second blocking portion 122.

[0041] By making the first blocking part 121 and the connecting part 123 an integrated structure, it is beneficial to simplify the processing and manufacturing of the first blocking part 121 and the connecting part 123, increase the supporting strength of the first blocking part 121 and the connecting part 123, make the combination of the first blocking part 121 and the connecting part 123 with the substrate 11 more stable, and not easily separated due to external force. At the same time, it also avoids the packaging glue 30 entering the gap between the first blocking part 121 and the connecting part 123 when injecting the packaging glue 30 into the cup-shaped cavity 13, affecting the appearance of the product or affecting the luminous effect.

[0042] In one implementation, see Figure 1The direction from the second blocking portion 122 to the first blocking portion 121 is the length direction, and the two cup-shaped cavities 13 are arranged side by side along the length direction, that is, the second blocking portions 122 of the two cup-shaped cavities 13 are arranged side by side.

[0043] By taking the direction from the second blocking portion 122 to the first blocking portion 121 as the length direction, the two cup-shaped cavities 13 are arranged side by side along the length direction, which is beneficial to increase the light-emitting angle and reduce the side width of the LED bracket perpendicular to the length direction.

[0044] In one implementation, see Figure 1 , the direction from the second blocking portion 122 to the first blocking portion 121 is the length direction, and the length of the first blocking portion 121 is less than the length of the second blocking portion 122. The direction perpendicular to the length direction is the width direction. Preferably, the first blocking portion 121 and the second blocking portion 122 have a certain length, and the connecting portion 123 has a certain width, so that the side wall of the cup-shaped cavity 13 and the side wall of the packaging body 12 facing away from the side wall have a certain distance, providing a certain buffer space for the packaging glue 30 to avoid glue overflow.

[0045] By making the side wall of the cup-shaped cavity 13 have a certain distance from the side wall of the package body 12 facing away from the side wall, it is helpful to provide a certain buffer space for the packaging glue 30 to avoid glue overflow. Since the height of the second blocking part 122 is lower than the height of the first blocking part 121, although the lower height of the second blocking part 122 increases the luminous angle, it also increases the probability of glue overflow here. Taking the direction from the second blocking part 122 to the first blocking part 121 as the length direction, the length of the first blocking part 121 is smaller than the length of the second blocking part 122, which not only makes the second blocking part 122 have a longer length to provide sufficient buffer space for the packaging glue 30 to avoid glue overflow, but also makes the first blocking part 121 have a shorter length, avoiding the problem of too far interval between the two cup-shaped cavities 13, resulting in poor luminous effect between the two cup-shaped cavities 13. Because the first blocking part 121 has a higher height, the luminous angle is smaller than the second blocking part 122, which solves the problem of small luminous angle of the luminous product and glue overflow during packaging.

[0046] In one implementation, see Figure 1 , Figure 2 and Figure 3 , the side wall of the cup-shaped cavity 13 is inclined relative to the substrate 11, and the cup-shaped cavity 13 forms a flared shape from the substrate 11, and the inclination degree of the side wall at the first blocking portion 121 is greater than the inclination degree of the side wall at the second blocking portion 122. Of course, the side wall of the cup-shaped cavity 13 may also be inclined relative to the substrate 11 at the connecting portion 123, and the inclination degree of the side wall at the connecting portion 123 is greater than the inclination degree of the side wall at the second blocking portion 122, and the inclination degree of the side wall at the connecting portion 123 and the inclination degree of the side wall at the first blocking portion 121 may be the same or different.

[0047] Optionally, the side walls of the cup-shaped cavity 13 are straight slopes at the first blocking portion 121 , the second blocking portion 122 and the connecting portion 123 , wherein the slope at the second blocking portion 122 is the gentlest, followed by the slope at the first blocking portion 121 , and the slope at the connecting portion 123 is the steepest, nearly perpendicular to the substrate 11 .

[0048] Optionally, the side walls of the cup-shaped cavity 13 are curved surfaces that are concave toward the substrate 11 at the first blocking portion 121, the second blocking portion 122 and the connecting portion 123. An angle is formed between the inclined surface formed by connecting the two ends of the curved surface and the substrate 11 that closes the cup-shaped cavity 13. The angle also satisfies that the angle at the second blocking portion 122 is greater than the angle at the first blocking portion 121 and the connecting portion 123, so that the curved surface at the second blocking portion 122 is the smoothest, the curved surface at the first blocking portion 121 is the second, and the curved surface at the connecting portion 123 is the steepest.

[0049] By inclining the side wall of the cup-shaped cavity 13 relative to the substrate 11, the cup-shaped cavity 13 forms a flared shape from the substrate 11, and the inclination of the side wall at the first blocking portion 121 is greater than the inclination of the side wall at the second blocking portion 122, so that the side wall of the cup-shaped cavity 13 has a gentler slope at the second blocking portion 122. When the amount of glue injection increases, the packaging glue 30 will gradually move to the upper surface of the second blocking portion 122, which is less likely to overflow than the case with a steeper slope, and can effectively avoid overflow of glue at the second blocking portion 122. At the same time, the gentler slope makes it easier for light to be reflected, thereby increasing the luminous angle; the side wall of the cup-shaped cavity 13 has a steeper slope at the first blocking portion 121 and the connecting portion 123, which is beneficial to increase the capacity of the cup-shaped cavity 13 for the packaging glue 30, avoid overflow of the packaging glue 30, and solve the problem of a small luminous angle of the luminous product and overflow of glue during the packaging process.

[0050] In one implementation, see Figure 1 , Figure 2 and Figure 3 At least part of the side wall of the cup-shaped cavity 13 is a concave surface, and the concave surface is concave toward the substrate 11. Preferably, the side walls of the cup-shaped cavity 13 are all concave surfaces.

[0051] By making the side wall of the cup-shaped cavity 13 at least partially concave, it can accommodate more packaging glue 30 than the inclined surface, which is beneficial to avoid overflow of the packaging glue 30. At the same time, the concave structure is also beneficial to increase the light-emitting angle, making the light-emitting effect more outstanding, and solving the problem of small light-emitting angle of the light-emitting product and overflow of glue during the packaging process.

[0052] In addition, based on the above LED bracket, the present application also provides a light emitting device 50, see Figure 4 , Figure 5 , Figure 6 and Figure 7 , comprising an LED chip 20, a packaging glue 30 and an LED bracket as described in any of the above embodiments. The LED chip 20 is accommodated in the cup-shaped cavity 13 and connected to the substrate 11. The packaging glue 30 is applied in the cup-shaped cavity 13 to cover the LED chip 20. The first blocking portion 121, the second blocking portion 122 and the connecting portion 123 are used to limit the flow range of the packaging glue 30.

[0053] Specifically, a single LED bracket includes two cup-shaped cavities 13, each of which is provided with an LED chip 20. Preferably, the LED chip 20 is accommodated in the center of the cup-shaped cavity 13, wherein the bottom of the cup-shaped cavity 13 is coated with solder paste, and the LED chip 20 is placed on the solder paste and connected to the substrate 11 through the solder paste. The positive and negative electrodes of the LED chip 20 are respectively connected to the positive and negative conductive substrates of the substrate 11 through the solder paste to form a path. The packaging glue 30 is coated in the two cup-shaped cavities 13. The packaging glue 30 has a high refractive index and high light transmittance, and is used to cover the LED chip 20 to increase the luminous flux of the LED chip 20 and improve its durability. With one side of the substrate 11 closing the cup-shaped cavity 13 as a reference, the first blocking portion 121 and the connecting portion 123 are higher in height than the second blocking portion 122, which is used to limit the flow range of the packaging glue 30 and avoid glue overflow during the packaging process; the height of the second blocking portion 122 is lower, which avoids blocking the light and is conducive to expanding the light-emitting angle.

[0054] A light-emitting device 50 is provided, comprising an LED chip 20, a packaging glue 30 and an LED bracket as described in any of the above-mentioned embodiments, so that the LED chip 20 is accommodated in a cup-shaped cavity 13 and connected to a substrate 11, the packaging glue 30 is coated in the cup-shaped cavity 13 to cover the LED chip 20, and the first blocking portion 121, the second blocking portion 122 and the connecting portion 123 are used to limit the flow range of the packaging glue 30, which is beneficial for the packaging glue 30 to contact the side wall of the cup-shaped cavity 13 when the packaging glue 30 is injected into the two cup-shaped cavities 13, wherein the packaging glue 30 contacts the side wall of the first blocking portion 121 and the connecting portion 123 with a higher height, which is beneficial for increasing the bonding force between the packaging glue 30 and the LED bracket, increasing the capacity of the cup-shaped cavity 13 for the packaging glue 30, and reducing the overflow of the packaging glue 30, and is particularly suitable for making the packaging glue 30 into a convex cup structure that can expand the light-emitting angle. At the same time, since the height of the second blocking part 122 is relatively low, the LED chip 20 has a larger light emission angle at the second blocking part 122, and partially overlaps with the light emitting area of ​​the LED chip 20 in the adjacent LED bracket, thereby filling the gap between adjacent LED brackets, avoiding the problem of dark shadows between lamp beads, and solving the problem of small light emitting angle of the light-emitting product and glue overflow during the packaging process.

[0055] In one implementation, see Figure 6 or Figure 7 , taking the side of the cup-shaped cavity 13 closed by the substrate 11 as a reference, the height of the second blocking portion 122 is higher than the height of the LED chip 20 .

[0056] By making the height of the LED chip 20 lower than the height of the second blocking part 122, since the height of the second blocking part 122 is lower than the heights of the first blocking part 121 and the connecting part 123, it is beneficial to ensure that the packaging glue 30 completely covers the LED chip 20. The packaging glue 30 has a high refractive index and high light transmittance. When the LED chip 20 is completely covered, it is beneficial to the luminous flux of the LED chip 20 and improve its durability.

[0057] In one implementation, see Figure 6 and Figure 7 The surface of the substrate 11 is provided with a protrusion 14, which is accommodated in the cup-shaped cavity 13 and is located between the LED chip 20 and the first blocking portion 121. After the LED chip 20 is fixed by solder paste, a filler is sprayed around the LED chip 20, and the composition of the filler includes but is not limited to titanium dioxide.

[0058] By providing the protrusion 14 on the surface of the substrate 11 , the protrusion 14 is accommodated in the cup-shaped cavity 13 and located between the LED chip 20 and the first blocking portion 121 , which is beneficial to limiting the flow range of the filler.

[0059] In one implementation, see Figure 6 and Figure 7 , a voltage regulator diode is provided on the surface of the substrate 11, and the current of the voltage regulator diode can vary in a wide range, but the voltage remains basically unchanged, so as to achieve the function of voltage regulation. The voltage regulator diode is accommodated in the cup-shaped cavity 13 and is located between the protrusion 14 and the first blocking portion 121. Optionally, a voltage regulator diode is provided in each of the two cup-shaped cavities 13, and the voltage regulator diode is connected to the substrate 11 through a gold wire.

[0060] By arranging a Zener diode on the surface of the substrate 11, the Zener diode is accommodated in the cup-shaped cavity 13 and is located between the protrusion 14 and the first blocking portion 121, which is beneficial to electrically connect the Zener diode to the substrate 11, thereby achieving the function of stabilizing the voltage of the light-emitting device 50. At the same time, the protrusion 14 can limit the flow range of the filler, so that the Zener diode is located between the protrusion 14 and the first blocking portion 121, which is beneficial to avoid the filler burying the Zener diode and thus affecting its performance.

[0061] In addition, based on the above-mentioned light emitting device 50, the present application also provides a side light emitting device, see Figure 4 , Figure 5 and Fig. 9, including a side plate 40 and the light emitting device 50 described in any of the above embodiments, a plurality of light emitting devices 50 are arranged side by side and spaced apart on the side plate 40, and the second blocking portions 122 of the plurality of light emitting devices 50 are adjacent.

[0062] By arranging a plurality of light-emitting devices 50 side by side and at intervals on the side panel 40, and by having the second blocking portions 122 of the plurality of light-emitting devices 50 adjacent to each other, it is advantageous to design a smaller short side dimension of the side-emitting device, thereby reducing the overall thickness of the side-emitting device. At the same time, different second blocking portions 122 are adjacent to each other, which is also advantageous for the LED chip 20 to have a larger light-emitting angle at the second blocking portion 122, so that the light-emitting areas of adjacent light-emitting devices 50 partially overlap, and the gaps between the light-emitting devices 50 are filled with light, thereby avoiding the problem of dark shadows between the light-emitting devices 50, and enabling the light-emitting devices 50 to emit light uniformly even when there are a large number of them.

[0063] In addition, based on the above-mentioned light emitting device 50, the present application also provides a method for manufacturing the light emitting device 50, see Figure 1 , Figure 4 , Figure 5 , Figure 6 and Figure 7 ,include:

[0064] A substrate 11 is provided, a package body 12 is arranged on the substrate 11, a cup-shaped cavity 13 is formed through the package body 12, the substrate 11 closes an opening on one side of the cup-shaped cavity 13, two cup-shaped cavities 13 form a cup-shaped cavity group, two cup-shaped cavities 13 of a cup-shaped cavity group are arranged side by side and separated by a first blocking portion 121, each cup-shaped cavity 13 is provided with a second blocking portion 122 at a position opposite to the first blocking portion 121, a connecting portion 123 connects the first blocking portion 121 and the second blocking portion 122, and the height of the second blocking portion 122 is lower than the height of the first blocking portion 121 and the connecting portion 123, with one side of the cup-shaped cavity 13 closed by the substrate 11 as a reference;

[0065] The LED chip 20 is placed in the cup-shaped cavity 13 and is electrically connected to the substrate 11;

[0066] The packaging glue 30 is applied in the cup cavity 13 to cover the LED chip 20 , and the packaging glue 30 is baked and cured.

[0067] Specifically, the sizes of the two cup-shaped cavities 13 can be the same or different. Preferably, the two cup-shaped cavities 13 have the same shape and size, and the shape of the cup-shaped cavities 13 is a rectangular groove, and the short sides of the two cup-shaped cavities 13 are side by side.

[0068] The LED chip 20 is a face-up structure or a flip-chip structure LED chip 20. Preferably, the LED chip 20 is a flip-chip LED chip 20, and is connected to the substrate 11 through solder paste, so that the positive and negative electrodes of the LED chip 20 are respectively connected to the positive and negative conductive substrates of the substrate 11 through the solder paste to form a path.

[0069] The material of the packaging glue 30 includes, but is not limited to, epoxy resin, silicone resin, acrylic resin, or polycarbonate.

[0070] By setting two side-by-side cup-shaped cavities 13, the two cup-shaped cavities 13 are separated by the first blocking portion 121, and each cup-shaped cavity 13 is provided with a second blocking portion 122 at a position relative to the first blocking portion 121, and a connecting portion 123 connects the first blocking portion 121 and the second blocking portion 122; based on the side of the cup-shaped cavity 13 closed by the substrate 11, the height of the second blocking portion 122 is lower than the height of the first blocking portion 121 and the connecting portion 123. Therefore, when the encapsulation glue 30 is injected into the two cup-shaped cavities 13, the encapsulation glue 30 contacts the side wall of the cup-shaped cavity 13, wherein the encapsulation glue 30 contacts the side wall of the first blocking portion 121 and the connecting portion 123 with a higher height, which is beneficial to increase the bonding force between the encapsulation glue 30 and the LED bracket, increase the amount of the cup-shaped cavity 13 to accommodate the encapsulation glue 30, and reduce the overflow of the encapsulation glue 30, and is particularly suitable for making the encapsulation glue 30 into a convex cup structure that can expand the light-emitting angle. At the same time, since the height of the second blocking part 122 is relatively low, the LED chip 20 has a larger light emission angle at the second blocking part 122, and partially overlaps with the light emitting area of ​​the LED chip 20 in the adjacent LED bracket, thereby filling the gap between adjacent LED brackets, avoiding the problem of dark shadows between lamp beads, and solving the problem of small light emitting angle of the light-emitting product and glue overflow during the packaging process.

[0071] In one implementation, see Figure 1 , Figure 4 , Figure 5 , Figure 6 and Figure 7Before applying the encapsulation glue 30 to the cup-shaped cavity 13, first spray the silicone binder on the inner surface of the cup-shaped cavity 13 and the surface of the second blocking portion 122 facing away from the substrate 11. Specifically, after the LED chip 20 is fixed with solder paste, the filler is sprayed around the LED chip 20, and the filler is centrifuged and baked so that it is evenly coated around the LED chip 20 and is located within the range enclosed by the first blocking portion 121, the connecting portion 123 and the protrusion 14; then use a spray device to spray the silicone binder on the surface of the filler and the second blocking portion 122. The main components of the silicone binder are silicone and ethyl acetate. The surface of the LED bracket after spraying the silicone binder has a large surface tension. After the surface tension of the LED bracket increases, the flow resistance to the encapsulation glue 30 increases. At the same time, a glue with a higher viscosity is selected as the encapsulation glue 30 to further reduce its fluidity during the coating process.

[0072] By spraying silicone binder in the cup-shaped cavity 13 before applying the encapsulation glue 30, it is helpful to increase the surface tension of the LED bracket surface, so that the flow resistance of the encapsulation glue 30 in the cup-shaped cavity 13 is increased. After being injected into the cup-shaped cavity 13, it will not flow quickly and overflow the LED bracket, causing overflow of glue. It can also increase the bonding strength between the top surface of the LED bracket and the encapsulation glue 30. At the same time, spraying silicone binder on the surface of the second blocking part 122 is helpful to avoid overflow of the encapsulation glue 30 at the second blocking part 122. Combined with the lower height structure of the second blocking part 122, it is helpful to increase the light-emitting angle of the light-emitting device 50, and further solve the problem of small light-emitting angle of the light-emitting product and overflow of glue during the packaging process.

[0073] In one implementation, see Figure 4 and Figure 6 In a cup cavity group, the coating is sequentially performed from one cup cavity 13 to another cup cavity 13, and the coating positions are all located at the LED chip 20, and the coating positions are spaced apart from the corresponding second blocking portion 122, and the coating positions are also spaced apart from the first blocking portion 121, so as to prevent the packaging glue 30 from flowing to the side of the first blocking portion 121 facing away from the substrate 11.

[0074] Specifically, when applying the encapsulation glue 30, the glue is applied in units of a cup-shaped cavity group, and the starting point of the glue application is located at the LED chip 20 in a single cup-shaped cavity 13. The single cup-shaped cavity 13 includes a second blocking portion 122. The starting point of the glue application is spaced apart from the second blocking portion 122 to prevent the encapsulation glue 30 from overflowing at the second blocking portion 122. The glue application method is spot coating to fully fill the interior of the cup-shaped cavity 13 and cover the LED chip 20. At the same time, the spot coating method is also conducive to forming a convex encapsulation glue 30 structure, which is conducive to preventing the encapsulation glue 30 from flowing to the side of the first blocking portion 121 and the second blocking portion 122 facing away from the substrate 11, thereby preventing the encapsulation glue 30 from overflowing. Preferably, the LED chip 20 is located at the center of the cup-shaped cavity 13, that is, the spot coating position is located within the central range of the cup-shaped cavity 13, so as to provide space for the encapsulation glue 30 to diffuse and flow around. This spot coating method will naturally form a convex encapsulation glue 30 structure, so that the flow of the encapsulation glue 30 at the second blocking portion 122 is restricted, thereby reducing the situation of glue overflow.

[0075] By sequentially applying dots from one cup cavity 13 to another cup cavity 13 in a cup cavity group, the dot coating positions are all located at the LED chip 20, and the dot coating positions are all spaced apart from the corresponding second blocking portion 122. This helps provide space in the cup cavity 13 for the encapsulation glue 30 to diffuse and flow around, so that the encapsulation glue 30 naturally fills the cup cavity 13 and is subject to flow resistance at the second blocking portion 122. This is not only conducive to forming a convex cup structure with a better appearance, but also helps to avoid glue overflow during the packaging process, solving the problem of a small light-emitting angle of the light-emitting product and glue overflow during the packaging process.

[0076] In one implementation, see Figure 5 , Figure 7 and Figure 8 , more than two cup-shaped cavity groups arranged in an array are formed on the packaging body 12, and adjacent cup-shaped cavity groups are connected by a second blocking portion 122; in the two or more cup-shaped cavity groups, glue is applied from the first blocking portion 121 corresponding to one cup-shaped cavity group to the first blocking portion 121 corresponding to another adjacent cup-shaped cavity group, and the starting position and the end position of the glue application are both spaced apart from the corresponding first blocking portion 121; after the packaging glue 30 is baked and cured, it is cut to form a single cup-shaped cavity group.

[0077] Specifically, in a plurality of cup-shaped cavity groups arranged in an array, the second blocking portions 122 in different cup-shaped cavities 13 are connected, that is, the plurality of cup-shaped cavity groups maintain an array arrangement in which the long sides and the short sides are parallel to each other.

[0078] The encapsulation glue 30 is applied to the cup-shaped cavity 13 by means of scribing, and the scribing range is two adjacent cup-shaped cavities 13 in two adjacent cup-shaped cavity groups, that is, the range of one scribing and gluing only includes two cup-shaped cavities 13, and the starting position and the end position of the scribing are both located at the LED chip 20 in the cup-shaped cavity 13, and are both spaced apart from the corresponding first blocking portions 121 in different cup-shaped cavities 13. In this gluing method, the encapsulation glue 30 is not applied to the side of the first blocking portion 121 facing away from the substrate 11, but is applied to the side of the second blocking portion 122 facing away from the substrate 11, so that two adjacent cup-shaped cavity groups are connected by the encapsulation glue 30 at the adjacent second blocking portions 122. Therefore, in this coating method, after the encapsulation glue 30 is baked and cured to form a single cup-shaped cavity group, the cutting position is as follows: Figure 8 This coating method will naturally form a packaging glue 30 structure with a slight concave in the middle and slight convex on both sides after cutting.

[0079] By forming more than two cup-shaped cavity groups arranged in an array on the packaging body 12, adjacent cup-shaped cavity groups are connected by a second blocking portion 122; in the two or more cup-shaped cavity groups, glue is applied from the first blocking portion 121 corresponding to one cup-shaped cavity group to the first blocking portion 121 corresponding to another adjacent cup-shaped cavity group, and the starting position and the end position of the glue application are both spaced apart from the corresponding first blocking portion 121; after the packaging glue 30 is baked and cured, it is cut to form a single cup-shaped cavity group, which is beneficial to ensure that the packaging glue 30 completely covers the LED chip 20 while retaining the advantage of the second blocking portion 122 structure in expanding the light-emitting angle, avoiding the overflow of the packaging glue 30 at the second blocking portion 122, and solving the problem of the small light-emitting angle of the light-emitting product and the overflow of glue during the packaging process; after the packaging glue 30 is baked and cured, it is cut along the second blocking portion 122 of the adjacent cup-shaped cavity group, which is beneficial to simplify the glue application step of the light-emitting device 50 and batch process the production of multiple light-emitting devices 50.

[0080] What is disclosed above is only a preferred embodiment of the present application, and it certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiment and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. An LED bracket, characterized in that: including a substrate and a package; The package body is arranged on the substrate, two cup-shaped cavities arranged side by side penetrate the package body, the substrate closes the openings on one side of the two cup-shaped cavities, the two cup-shaped cavities are separated by a first blocking portion, each of the cup-shaped cavities is provided with a second blocking portion at a position opposite to the first blocking portion, and the connecting portion connects the first blocking portion and the second blocking portion; Taking the side of the cup-shaped cavity closed by the substrate as a reference, the height of the second blocking portion is lower than the heights of the first blocking portion and the connecting portion.

2. The LED bracket according to claim 1, characterized in that: The side wall of the cup-shaped cavity is inclined relative to the substrate, the cup-shaped cavity forms a flared shape from the substrate, and the inclination degree of the side wall at the first blocking portion is greater than the inclination degree of the side wall at the second blocking portion.

3. The LED bracket according to claim 1, characterized in that: The side wall of the cup-shaped cavity is at least partially concave.

4. A light emitting device, characterized in that: It comprises an LED chip, a packaging adhesive and an LED bracket as claimed in any one of claims 1 to 3; The LED chip is accommodated in the cup-shaped cavity and connected to the substrate. The packaging glue is applied in the cup-shaped cavity to cover the LED chip. The first blocking part, the second blocking part and the connecting part are used to limit the flow range of the packaging glue.

5. The light emitting device according to claim 4, characterized in that: Taking the side of the cup-shaped cavity closed by the substrate as a reference, the height of the second blocking portion is higher than the height of the LED chip.

6. The light emitting device according to claim 4, characterized in that: A protrusion is provided inside the cup-shaped cavity, and the protrusion is located between the LED chip and the first blocking portion; A voltage regulator diode is disposed on the surface of the substrate. The voltage regulator diode is accommodated in the cup-shaped cavity and is located between the protrusion and the first blocking portion.

7. A side-light emitting device, characterized in that: A light emitting device comprising a side plate and any one of claims 4 to 6, wherein a plurality of the light emitting devices are arranged side by side and spaced apart on the side plate; The second blocking parts of the plurality of light emitting devices are adjacent to each other.

8. A method for manufacturing a light emitting device, characterized in that: include: A substrate is provided, a package body is arranged on the substrate, a cup-shaped cavity is formed through the package body, the substrate closes an opening on one side of the cup-shaped cavity, two cup-shaped cavities form a cup-shaped cavity group, two cup-shaped cavities of a cup-shaped cavity group are arranged side by side and separated by a first blocking part, each cup-shaped cavity is provided with a second blocking part at a position opposite to the first blocking part, a connecting part connects the first blocking part and the second blocking part, and the height of the second blocking part is lower than the height of the first blocking part and the connecting part, with the side of the cup-shaped cavity closed by the substrate as a reference; The LED chip is placed in the cup-shaped cavity and is electrically connected to the substrate; The packaging glue is applied in the cup cavity to cover the LED chip, and the packaging glue is baked and cured to form a shape.

9. The method for manufacturing a light emitting device according to claim 8, characterized in that: The manufacturing method further comprises: Before applying the packaging glue, a silicone adhesive is first sprayed on the inner surface of the cup-shaped cavity and the surface of the second blocking portion facing away from the substrate.

10. The method for manufacturing a light emitting device according to claim 8, wherein: The manufacturing method further comprises: In one of the cup-shaped cavities, the coating is applied in dots from one of the cup-shaped cavities to another of the cup-shaped cavities in sequence, and the coating positions are spaced apart from the corresponding second blocking portion.

11. The method for manufacturing a light emitting device according to claim 8, wherein: The manufacturing method further comprises: Forming more than two cup-shaped cavity groups arranged in an array on the packaging body, and adjacent cup-shaped cavity groups are connected by the second blocking portion; In two or more cup-shaped cavity groups, glue is applied from the first blocking portion corresponding to one cup-shaped cavity group to the first blocking portion corresponding to another adjacent cup-shaped cavity group, and both the starting position and the end position of glue application are spaced apart from the corresponding first blocking portion; After the packaging glue is baked and cured, it is cut to form individual cup cavity groups.

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