Chip operation method, chip rack, chip assembly and processing box

Abstract

The present invention relates to a chip operation method, a chip rack that can be combined with the chip, and a chip assembly and a processing box having the chip rack. The operation method includes at least one of a chip installation step and a chip removal step. The chip includes a first part and a second part that are separated from each other and a flexible circuit board connecting the first part and the second part; the chip rack includes a base plate and a first positioning member and a second positioning member arranged on the base plate, the first positioning member is used to position the first part, and the second positioning member is used to position the second part. The chip rack also includes an avoidance portion arranged on at least one of the first positioning member and the second positioning member, the avoidance portion is used to provide an avoidance space for the chip during the installation and removal of the chip, and the setting of the avoidance portion enables the chip to be quickly combined with the chip rack and also to be quickly disengaged from the chip rack.

Description

Technical Field

[0001] The invention relates to the field of electronic photographic imaging, and in particular to a processing box detachably installed in an electronic photographic imaging device, and a chip frame and a chip assembly used for the processing box. Background Art

[0002] The chip is a common component for communication between the processing box and the imaging device. It stores parameters such as the model and life of the processing box. When the processing box is installed in the imaging device, a communication connection is established between the chip and the imaging device, so that the imaging device can accurately obtain the information of the processing box.

[0003] Currently, in order to improve the working stability of imaging devices or chips, imaging device manufacturers will remotely upgrade the imaging devices from time to time. Accordingly, the chip located on the processing box also needs to be upgraded, otherwise, even the processing box with the chip installed cannot be recognized by the imaging device.

[0004] As the integration degree of integrated circuits becomes higher and higher, the size of existing chips becomes smaller and smaller. Meanwhile, the existing chips are generally fixed on the processing box by gluing. Figure 1 It is a stereoscopic diagram of an existing processing box. The processing box 10 includes a first unit 1 and a second unit 2 that are combined with each other and a chip mounting portion 3 that is formed integrally with the first unit 1 or the second unit 2 . The chip is fixedly mounted on the chip mounting portion 3 .

[0005] When the chip needs to be upgraded, the end user needs to first remove the chip from the chip installation part 3, and then mail the chip to a designated location for professional personnel to perform the upgrade operation using professional equipment. However, smaller chips are not easy to install and remove, and chips fixed by gluing are even more difficult to install and remove. Even if the chip is taken out, the small chip is easy to be lost during transportation and is not easy to be located during the upgrade. Summary of the invention

[0006] In view of this, the present invention provides an operation method for realizing rapid installation and / or removal of a chip, a chip rack, a chip assembly and a processing box, and the specific technical solutions adopted are as follows:

[0007] A chip operation method, wherein the chip is detachably combined with a chip frame, the chip comprises a first part and a second part separated from each other and a flexible circuit board connecting the first part and the second part, the chip frame comprises a bottom plate and a first positioning member and a second positioning member arranged on the bottom plate, at least one of the first positioning member and the second positioning member is provided with an avoidance portion, and the avoidance portion is used to provide an avoidance space for the chip during the installation and removal process of the chip; the operation method comprises at least one of a chip installation step and a chip removal step, wherein the chip installation step comprises:

[0008] Pre-positioning one of the first part and the second part with a positioning member that is not provided with an avoidance portion;

[0009] An operation of positioning the other of the first part and the second part with a positioning member provided with an avoidance portion;

[0010] An operation of completely positioning the pre-positioning portion and the corresponding positioning piece so that the chip is positioned on the chip rack;

[0011] The chip disassembly steps include:

[0012] An operation of releasing the other of the first part and the second part from the positioning member provided with the avoidance portion;

[0013] The chip is removed from the chip frame by releasing the positioning of one of the first part and the second part from the positioning member which is not provided with the avoidance portion.

[0014] The chip rack provided by the present invention is used for positioning a chip, wherein the chip comprises a first part and a second part separated from each other and a flexible circuit board connecting the first part and the second part;

[0015] The chip rack includes a bottom plate and a first positioning member and a second positioning member arranged on the bottom plate, wherein the first positioning member is used to position the first part and the second positioning member is used to position the second part, and is characterized in that:

[0016] The chip rack also includes an avoidance portion arranged on at least one of the first positioning member and the second positioning member, and the avoidance portion is used to provide an avoidance space for the chip during the installation and removal of the chip; along a direction perpendicular to the installation direction and removal direction of the chip, a portion of the space in the chip rack for accommodating the first part and / or the second part is opened through the avoidance portion.

[0017] Preferably, the chip rack also includes a through portion arranged below the first positioning member and passing through along the chip installation direction, and a portion of the flexible circuit board enters the through portion; the chip rack also includes an elastic arm connected to the base plate, and the elastic arm is used to limit the movement of the chip along the disassembly direction. When observed along the installation direction or disassembly direction of the chip, the entire elastic arm is opposite to the through portion.

[0018] Preferably, the second positioning member includes a first positioning portion and a second positioning portion which are arranged opposite to each other along a direction perpendicular to the installation direction and disassembly direction of the chip, the first positioning portion includes a first limiting plate extending directly or indirectly from the bottom plate, the second positioning portion includes a second limiting plate extending directly or indirectly from the bottom plate, and the avoidance portion is located in at least one of the first limiting plate and the second limiting plate; a first limiting space is formed between the first limiting plate and the bottom plate, and a second limiting space is formed between the second limiting plate and the bottom plate, and along a direction perpendicular to the installation direction and disassembly direction of the chip, the highest point of the first limiting space is farther away from the bottom plate than the highest point of the second limiting space.

[0019] Preferably, along a direction perpendicular to the installation direction and disassembly direction of the chip, the first limiting plate has a first end surface, and the second limiting plate has a second end surface, and an operating space allowing the flexible circuit board to pass through is formed between the first end surface and the second end surface, and when observed along the installation direction or disassembly direction of the chip, the entire first positioning member is located in the operating space; in other words, when observed along the installation direction or disassembly direction of the chip, the first end surface and the second end surface are respectively located on both sides of the first positioning member.

[0020] The chip assembly provided by the present invention comprises a chip and the chip frame as described above, wherein the chip is detachably combined with the chip frame.

[0021] The processing box provided by the present invention comprises a shell and the chip assembly as described above, wherein the chip assembly is detachably combined with the shell.

[0022] The housing is provided with a chip rack mounting portion, the chip rack mounting portion includes a locking portion arranged therein, the chip rack mounting portion is provided with a locked portion combined with the locking portion, and at least one of the locking portion and the locked portion is cantilevered.

[0023] Preferably, the chip rack installation portion further comprises a limiting member for limiting the movement of the chip rack along its installation direction; along a direction perpendicular to the chip rack installation direction, the two limiting members are spaced apart and the first positioning member of the chip rack is clamped by the limiting members. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a three-dimensional schematic diagram of an existing processing box.

[0025] Figure 2 The invention relates to a stereoscopic schematic diagram of a chip assembly in a processing box after being separated from a processing box shell.

[0026] Figure 3A It is a three-dimensional diagram of a chip rack according to the present invention.

[0027] Figure 3B It is a side view of the chip rack observed along the first direction.

[0028] Figure 3C It is a side view of the chip rack observed along the third direction.

[0029] Figure 4 It is a three-dimensional diagram of a chip assembly according to the present invention. DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0031] Figure 1 For the convenience of description, the numbers of the process boxes in the background art will be cited below.

[0032] The process cartridge 10 has a length extending in a first direction / left-right direction, a width extending in a second direction / front-back direction, and a height extending in a third direction / up-down direction. The process cartridge 10 can be installed forwardly in the image forming apparatus along the front-back direction and removed backwardly from the image forming apparatus. Figure 1 As shown, the processing box 10 includes a first unit 1 and a second unit 2 combined with each other and a chip assembly 4 detachably combined with the first unit 1 or the second unit 2, wherein one of the first unit 1 and the second unit 2 is used to store the developer required for the operation of the processing box 10, and the other is used to store waste developer.

[0033] For a process cartridge having a simplified structure, a unit for storing waste developer may be pre-set in the image forming device, or combined with the unit for storing developer as another independent component, in which case the process cartridge 10 may be regarded as comprising only a unit for storing developer, and thus, the process cartridge 10 may be uniformly described as comprising a housing for storing developer and a chip assembly 4 detachably combined with the housing. Along the first direction, the left end and the right end of the process cartridge 10 are respectively used to receive power and driving force from the image forming device, and thus, the left end of the process cartridge 10 may be referred to as a conductive end, and the right end may be referred to as a driving end.

[0034] The following description will be made by taking the example that the chip assembly 4 is detachably installed in the second unit 2 . Figure 2 The invention relates to a stereoscopic schematic diagram of a chip assembly in a processing box after being separated from a processing box shell.

[0035] The processing box 10 / second unit 2 includes a shell 21 and a chip rack mounting portion 22 arranged on the shell 21. The chip assembly 4 is detachably combined with the chip rack mounting portion 22. Generally, along the first direction, the chip rack mounting portion 22 is arranged at one end of the shell 21 to facilitate the installation and disassembly of the chip assembly 4. Preferably, the chip rack mounting portion 22 is arranged at the conductive end, which can reduce the influence of the vibration generated by the driving end when transmitting the driving force on the chip on the one hand, and on the other hand, it is conducive to simplifying the circuit in the imaging device, thereby simplifying the internal structure of the imaging device.

[0036] The chip rack mounting portion 22 includes a support plate 221 extending along the left-right direction and the front-to-back direction. Along the left-to-right direction, an opening 224 is formed on the left side of the support plate 221, and a limiting member 222 is provided on the right side. The chip assembly 4 is installed from the opening 224 to the right side along the left-to-right direction. On the contrary, when the chip assembly 4 is installed from the right side to the left side, the positions of the opening 224 and the limiting member 222 will be interchanged; alternatively, the chip assembly 4 can also be installed along the front-to-back direction. At this time, along the installation direction, an opening 224 is formed upstream of the support plate 221, and a limiting member 222 is provided downstream. In the following, the chip assembly 4 is installed from left to right toward the shell 21.

[0037] The chip assembly 4 includes a chip rack 5 and a chip 6 that are detachably combined. The chip 6 is combined with the chip rack 5 in a card-connected manner along the direction from left to right, and is detached from the chip rack 5 in the direction from right to left. The chip rack 5 is combined with the chip rack mounting portion 22 in a card-connected manner. When the chip 6 needs to be upgraded, the end user can directly release the combination of the chip rack 5 (chip assembly 4) carrying the chip 6 and the shell 21, and mail the chip assembly 4 as a whole. During the mailing process, the chip 6 is supported and protected by the chip rack 5 and is not easily damaged. For the service provider responsible for upgrading the chip 6, the chip rack 5 can be used to position the chip 6, thereby realizing a rapid upgrade of the chip 6, or the chip before the upgrade can be removed from the chip rack 5, and the upgraded chip can be installed on the chip rack 5.

[0038] The chip 6 includes a first substrate 61 and a second substrate 62 separated from each other, a flexible circuit board 66 connecting the first substrate 61 and the second substrate 62, and a contact portion 63, a storage portion 64 and a battery 65 connected to the flexible circuit board 66, wherein the contact portion 63 is opposite to the first substrate 61, the storage portion 64 and the battery 65 are opposite to the second substrate 62, the contact portion 63 is used for electrical contact with the imaging device, the storage portion 64 is used for storing information, and the battery 65 is used for supplying power to the flexible circuit board 66.

[0039] It is understandable that the chip 6 can also be considered to include a first part 6a and a second part 6b separated from each other and an electrical connection part 6c electrically connecting the first part 6a and the second part 6b, wherein the electrical connection part 6c is a part of the flexible circuit board 66, the first part 6a includes a first substrate 61, an electrical contact part 63 and a first circuit board located between the first substrate 61 and the electrical contact part 63, the second part 6b includes a second substrate 62, a second circuit board, a storage part 64 and a battery 65, the second circuit board is covered on a surface of the second substrate 62, the storage part 64 and the battery 65 are both electrically connected to the second circuit board, the first circuit board and the second circuit board are both electrically connected to the electrical connection part 6c, preferably, the first circuit board, the second circuit board and the electrical connection part 6c are formed integrally, and thus, the first circuit board and the second circuit board are also flexible circuit boards.

[0040] Through the flexible circuit board 66, the first substrate 61 and the second substrate 62 can move relative to each other, and the difficulty of installing and removing the chip 6 can be reduced. Figure 2 As shown, the contact portion 63 , the storage portion 64 and the battery 65 are all located on the same side (above) of the flexible circuit board 66 , so the overall structure of the chip 6 can be simplified, and the manufacturing process of the chip 6 can also be simplified.

[0041] Figure 3A is a three-dimensional diagram of a chip rack according to the present invention; Figure 3B is a side view of the chip rack observed along a first direction; Figure 3C is a side view of the chip rack observed along the third direction; Figure 4 It is a three-dimensional diagram of a chip assembly according to the present invention.

[0042] The chip rack 5 includes a base plate 50 and a first positioning member 51 and a second positioning member 52 arranged on the base plate 50. Along the installation direction of the chip 6, the first positioning member 51 is located downstream of the second positioning member 52, and the first part 6a and the second part 6b of the chip 6 are positioned by the first positioning member 51 and the second positioning member 52 respectively. The first positioning member 51 includes a first baffle 511 and a second baffle 512 that are relatively arranged in the front-to-back direction, a supporting portion 513 and a first limiting portion 514 located between the first baffle 511 and the second baffle 512, and a second limiting portion 515 connected to at least one of the first baffle 511 and the second baffle 512. The first part 6a enters between the second limiting portion 515 and the supporting portion 513, the first substrate 61 is positioned in the left-right direction by the first limiting portion 514, the first substrate 61 is positioned in the up-down direction by the second limiting portion 515, and the first substrate 61 is positioned in the front-to-back direction by the first positioning member 51 and the second positioning member 52. Finally, the first part 6a is stably installed in the first positioning member 51, and the electrical contact portion 63 is exposed upward through the space between the first baffle 511 and the second baffle 512.

[0043] Back to Figure 2 As shown, there are two limiting members 222 in the chip rack mounting portion 22, and the two limiting members 222 are spaced apart in the front-to-back direction to form a clamping space 223 therebetween. When the chip rack 5 is installed, the first positioning member 51 enters the clamping space 223, and the first baffle plate 511 and the second baffle plate 512 abut against one limiting member 222 respectively. Thus, the first positioning member 51 is positioned in the shell 21, and the position of the first part 6a positioned in the first positioning member 51 in the shell 21 is also determined.

[0044] like Figure 3A As shown, the second positioning member 52 includes a first positioning portion 52a and a second positioning portion 52b that are arranged opposite to each other in the front-to-back direction, and the first positioning portion 52a and the second positioning portion 52b respectively position the front and rear ends of the second portion 6b at least in the up-down direction and the front-to-back direction, wherein the first positioning portion 52a includes a first side wall 54 extending from the bottom plate 50 and a first limiting plate 521 extending from the first side wall 54, and a first limiting space 525 is formed between the first limiting plate 521 and the bottom plate 50, and the second positioning portion 52b includes a first limiting plate 521 ... bottom plate 50. A second side wall 55 extending from the base plate 50 and a second limiting plate 522 extending from the second side wall 55, a second limiting space 526 is formed between the second limiting plate 522 and the base plate 50, and optionally, the first limiting plate 521 and the second limiting plate 522 can also extend directly from the base plate 50 respectively; when the chip 6 is installed to the chip rack 5, a part of the second part 6b enters the first limiting space 525, and the other part enters the second limiting space 526, and the first side wall 54 and the second side wall 55 are arranged relatively to each other in the front-to-back direction.

[0045] Furthermore, the second positioning member 52 also includes an elastic arm 527 connected to the bottom plate 50, and the elastic arm 527 limits the second portion 6b along the left and right directions. When the chip 6 is installed, only the second substrate 62 may enter the first limiting space 525 and the second limiting space 526, or at least one of the storage unit 64 and the battery 65 may enter the limiting space 525 / 526 together with the second substrate 62, that is, a part of the second substrate 62 enters one limiting space, and another part of the second substrate 62 enters another limiting space together with the storage unit 64, or a part of the second substrate 62 enters one limiting space, and another part of the second substrate 62 enters another limiting space together with the battery 65, or a part of the second substrate 62 enters one limiting space together with the storage unit 64, and another part of the second substrate 62 enters another limiting space together with the battery.

[0046] like Figure 3BAs shown, preferably, a portion of the second substrate 62 enters the second limiting space 526, and the other portion of the second substrate 62 together with the battery 65 enters the first limiting space 525. Along the up and down direction, the top / highest point of the first limiting space 525 is farther away from the bottom plate 50 than the top / highest point of the second limiting space 526. The first limiting plate 521 limits the battery 65 from above the battery 65, and the second limiting plate 522 limits the second substrate 62 from above the second substrate 62. Accordingly, the first limiting plate 521 is higher than the second limiting plate 522. That is to say, the first positioning portion 52a and the second positioning portion 52b are staggered in the up and down directions. This design can not only ensure that the installation direction and installation position of the chip 6 are correct, but also provide greater friction when the operator takes out the chip 6 by hand, so that the chip 6 can be quickly taken out.

[0047] The first limiting plate 521 and the second limiting plate 522 are both plate-shaped members extending in the front-to-back direction and the left-to-right direction. In the front-to-back direction, the first limiting plate 521 and the second limiting plate 522 extend toward each other. Figure 3B and Figure 3C As shown, along the left-right direction, the first limiting plate 521 has a first end surface 521a, the second limiting plate 522 has a second end surface 522a, and an operation space 57 is provided between the first end surface 521a and the second end surface 522a, and the operation space 57 is used to allow the electrical connection portion 6c to pass through. When viewed in a direction perpendicular to the front-back direction, the first limiting plate 521 and the second limiting plate 522 do not overlap, as shown in FIG. Figure 3C As shown, along the left-right direction, the operation space 57 is located between the first end surface 521a and the second end surface 522a. When the operator takes out the chip 6 by hand, the operator's fingers can be accommodated by the operation space 57, thereby accelerating the removal speed of the chip 6.

[0048] Continue as Figure 3C As shown, along the left-right direction, a straight line L1 and a straight line L2 are respectively made through the first end face 521a and the second end face 522a, and the straight line L1 and the straight line L2 are parallel to each other, and the first positioning member 51 is entirely located between the straight line L1 and the straight line L2, that is, along the front-back direction, the first end face 521a and the second end face 522a are respectively located on both sides of the first positioning member 51, and the extension size of the first limiting plate 521 does not exceed the first baffle 511, and the extension size of the second limiting plate 522 does not exceed the second baffle 512. In this way, when the chip rack 5 is produced using the mold, the mold can move to the right and separate from the manufactured chip rack 5, that is, the chip rack 5 can be formed in one step, which is beneficial to improving the production speed of the chip rack 5.

[0049] Further, such as Figure 3AAs shown, the chip rack 5 further includes a through portion 516 disposed below the first positioning member 51 and penetrating in the left-right direction. Figure 3B As shown, when viewed along the front-to-back direction, the entire elastic arm 527 is opposite to the through portion 516 , that is, the entire elastic arm 527 is located within the range of the through portion 516 . Similarly, this design is conducive to the rapid separation of the mold and the chip frame 5 .

[0050] like Figure 4 As shown, when the chip 6 is mounted to the chip rack 5, the electrical connection portion 6c / flexible circuit board 66 between the first portion 6a and the second portion 6b is bent, and a portion of the electrical connection portion 6c / flexible circuit board 66 enters the through portion 516. Therefore, the through portion 516 can provide a bending space for the electrical connection portion 6c / flexible circuit board 66. On the one hand, along the left and right directions, the chip 6 with a larger overall size can be accommodated by the chip rack 5 with a smaller overall size. On the other hand, the bent electrical connection portion 6c / flexible circuit board 66 accumulates elastic potential energy. When the chip 6 needs to be removed, as long as the restriction of the elastic arm 527 on the second substrate 62 is cancelled, the second portion 6b can be pushed to the left under the elastic force released by the electrical connection portion 6c / flexible circuit board 66, thereby making it easier to remove the chip 6.

[0051] like Figure 3B As shown, the first side wall 54 and the second side wall 55 are arranged to be inclined relative to the up and down directions. Figure 2 As shown, the chip rack mounting portion 22 also includes guide plates 226 located on the left and right sides of the support plate 221, respectively. The guide plates 226 are configured to be inclined relative to the up and down directions, and have an inclination angle substantially the same as that of the first side wall 54 and the second side wall 55. Specifically, the first side wall 54, the second side wall 55 and the guide plate 226 are configured such that, from bottom to top, the distance between the first side wall 54 and the second side wall 55 in the front-to-back direction gradually decreases, and the distance between the two guide plates 226 in the front-to-back direction also gradually decreases. During the installation process of the chip rack 5 toward the chip rack mounting portion 22, the movement path of the chip rack 5 is determined, and at the same time, the chip rack 5 will not separate upward from the shell 21.

[0052] Further, such as Figure 3A As shown, the chip rack 5 also includes a locked portion 53 disposed therein. Figure 2As shown, the chip rack mounting portion 22 also includes a locking portion 225 arranged therein. Preferably, at least one of the locking portion 225 and the locked portion 53 is configured to be elastically deformable. For example, at least one of the locking portion 225 and the locked portion 53 is cantilevered. During the installation process of the chip rack 5, at least one of the locking portion 225 and the locked portion 53 is elastically deformed. When the chip rack 5 reaches a predetermined installation position, the locking portion 225 and the locked portion 53 abut against each other. When the chip rack 5 needs to be removed from the housing 21 / chip rack mounting portion 22, at least one of the locking portion 225 and the locked portion 53 is forced to be elastically deformed.

[0053] Furthermore, if Figure 3A and Figure 3C As shown, the chip rack 5 also includes a first notch 523 arranged adjacent to the first limiting plate 521 and a second notch 524 arranged adjacent to the second limiting plate 522. Along the installation direction of the chip 6 (from left to right), the first notch 523 is located upstream of the first limiting plate 521, and a portion of the first limiting space 525 is opened upward through the first notch 523. The second notch 524 is located upstream of the second limiting plate 522, and a portion of the second limiting space 526 is opened upward through the second notch 524. That is, the first notch 523 is farther away from the first positioning member 51 than the first limiting plate 521, and the second notch 524 is farther away from the first positioning member 51 than the second limiting plate 522. The setting of the first notch 523 and the second notch 524 will make the operation of the chip 6 more convenient, and the operation includes at least one of the installation step and the disassembly step of the chip 6, which is explained below.

[0054] In the case where the notch 523 / 524 is not provided, the chip 6 can still be installed on the chip rack 5, but the operator needs to align the first part 6a and the second part 6b of the chip 6 with the first positioning member 51 and the second positioning member 52 respectively at the same time. Specifically, the first substrate 61 located in the first part 6a needs to be aligned with the space between the second limiting portion 515 and the supporting portion 513, and the second substrate 62 located in the second part 6b needs to be aligned with the first limiting space 525 and the second limiting space 526 at the same time, and the electrical connection portion 6c needs to enter the operation space 57. Finally, the first part 6a and the second part 6b are positioned by the first positioning member 51 and the second positioning member 52 respectively. When the chip 6 needs to be taken out, contrary to the above installation process, the operator needs to release the positioning of the first part 6a and the second part 6b with the first positioning member 51 and the second positioning member 52 respectively, so as to release the restriction of the chip rack 5 on the chip 6, thereby separating the chip 6 from the chip rack 5.

[0055] For the chip rack 5 provided with the notch 523 / 524, when installing the chip 6, the operator can first align the first part 6a with the first positioning member 51, and insert at least a part of the first part 6a into / install it on the first positioning member 51, and then press the second part 6b from the notch 523 / 524 into the first limiting space 525 and the second limiting space 526; the second part 6b will move to the right (such as when the first part 6a is inserted into / installed into the first positioning member 51) as at least a part of the first part 6a is inserted into / installed on the first positioning member 51. Figure 4 As shown), for the chip rack 5 without the notch 523 / 524, the first limit plate 521 and the second limit plate 522 will block the downward movement of the second part 6b, resulting in the second part 6b being unable to be positioned by the second positioning member 52; therefore, the notch 523 / 524 can also be regarded as an avoidance portion, which is used to provide an avoidance space for the second part 6b during the installation of the chip 6. The operator can first insert at least a part of the first part 6a into / install it on the first positioning member 51 to pre-position the chip 6, and then install the second part 6b on the second positioning member 6b through the avoidance portion 523 / 524. At the same time, the elastic arm 527 abuts against the second part 6b in the direction opposite to the installation direction of the chip 6, thereby finally achieving rapid installation of the chip 6.

[0056] On the contrary, when the chip 6 needs to be taken out from the chip rack 5 with the notch 523 / 524, the restriction of the elastic arm 527 on the second part 6b is first released, and the second part 6b is pushed to the left under the elastic force of the electrical connection part 6c, and the second part 6b is disengaged from the first limiting space 525 and the second limiting space 526 and is no longer restricted by the first limiting plate 521 and the second limiting plate 522. At this time, the second part 6b is opposite to the notch 523 / 524 in the up and down directions. Therefore, the operator can pick up the second part 6b and then pull the chip 6, so that the first part 6a is disengaged from the first positioning member 51, and finally the chip 6 is quickly removed.

[0057] It is understandable that, in a chip rack 5 without a notch 523 / 524, when the chip 6 needs to be taken out, it is also necessary to simultaneously release the first positioning member 51 from the first part 6a and the second positioning member 52 from the second part 6b. In a chip rack 5 with a notch 523 / 524, when the chip 6 needs to be taken out, the second positioning member 52 from the second part 6b can be released first, and then the first positioning member 51 from the first part 6a can be released.

[0058] It can be seen that in the chip rack 5 provided with the notches 523 / 524, the difficulty of operation is reduced whether installing or removing the chip 6. Accordingly, the installation speed and removal speed of the chip 6 will be greatly improved, especially for chips with a smaller overall size than human fingers, the improvement effect of the installation speed and removal speed will be more obvious.

[0059] Based on the above-mentioned inventive concept, the notch 523 / 524 can also be set in the first positioning member 51. For example, along the installation direction of the chip 6 (from left to right), the notch 523 / 524 is respectively located upstream of the two second limiting portions 515. At this time, when the chip 6 is installed, the second part 6b can be pre-positioned to the second positioning member 52 first, and then the first part 6a can be inserted into / installed on the first positioning member 51. For the first part 6a, the notch 523 / 524 can be regarded as an avoidance portion, which is used to provide an avoidance space during the installation of the first part 6a; when the chip 6 needs to be removed, the first part 6a is first released from the first positioning member 51, and then the chip 6 is pushed in the direction opposite to the installation direction to release the second part 6b from the second positioning member 52, which can also achieve quick installation and quick removal of the chip 6.

[0060] In summary, the notch 523 / 524 can be set in the first positioning member 51, or in the second positioning member 52, or in both the first positioning member 51 and the second positioning member 52, that is, at least one of the first positioning member 51 and the second positioning member 52 is provided with a notch (avoidance portion) 523 / 524, and during the installation and removal of the chip 6, the notch 523 / 524 is used to provide an avoidance space for the chip 6 to improve the installation speed and removal speed of the chip 6; specifically, during the installation of the chip 6, one of the first part 6a and the second part 6b of the chip 6 is pre-positioned / pre-combined, and then the other of the first part 6a and the second part 6b is positioned / pre-combined through the notch 523 / 524, and finally, the chip 6 is completely installed on the chip rack 5, and during the removal of the chip 6, the other of the first part 6a and the second part 6b is first released from the positioning / combination, and then one of the first part 6a and the second part 6b is released from the positioning / combination, and finally, the combination of the chip 6 and the chip rack 5 is released.

[0061] It can be seen that when one of the first positioning member 51 and the second positioning member 52 is provided with a notch (avoidance portion) 523 / 524, during the installation of the chip 6, the pre-positioning portion of the chip 6 that needs to be combined with the positioning member without the notch is first pre-positioned / pre-combined, and then the positioning portion of the chip 6 that needs to be combined with the positioning member with the notch is positioned through the notch, and then the pre-positioning portion and the corresponding positioning member are completely positioned, and finally the chip 6 is installed / positioned on the chip frame 5; during the disassembly of the chip 6, the positioning portion of the chip 6 combined with the positioning member with the notch is first released, and then the pre-positioning portion of the chip 6 combined with the positioning member without the notch is released, and finally the chip 6 is separated from the chip frame 5. When the first positioning member 51 and the second positioning member 52 are both provided with notches (avoidance portions) 523 / 524, according to the above technical idea, any one of the first part 6a and the second part 6b of the chip 6 can be regarded as a pre-positioning portion, and the other will be regarded as a positioning portion. For the chip rack 5, the positioning member used for combining with the pre-positioning portion can be regarded as provided with notches (avoidance portions) 523 / 524, and the positioning member used for combining with the positioning portion can be regarded as not provided with notches (avoidance portions) 523 / 524.

[0062] Furthermore, one of the notches 523 / 524 can be omitted, that is, the chip rack 5 is only provided with one notch (avoidance portion). During the installation and removal of the chip 6, the electrical connection portion 6c has the flexibility, so that the chip 6 can also be quickly installed and removed.

[0063] It should be understood that although the chip rack without the notch 523 / 524 described above is not conducive to the rapid installation and removal of the chip 6, it still does not affect other functions of the chip rack recorded in the present application, such as the rapid connection and disconnection between the chip rack and the shell 21. When the chip 6 needs to be upgraded, the chip rack with the chip 6 installed is disassembled and transported as a whole. During transportation, the chip 6 can be protected by the chip rack. At the same time, the chip 6 is supported and positioned by the chip rack for easy upgrading. In the case where the chip 6 needs to be removed from the chip rack, the chip rack without the notch 523 / 524 is still an option.

[0064] As described above, the chip 6 involved in the present invention is installed to the chip rack 5 in a snap-fit ​​manner. At the same time, the chip rack 5 is installed to the processing box shell 21 in a snap-fit ​​manner. When the chip 6 needs to be upgraded, the terminal user needs to remove the chip rack 5 from the shell 21, and then send the chip rack 5 with the chip 6 installed together, without having to remove the chip 6 from the chip rack 5. This not only reduces the operating difficulty of the terminal user, but also allows the chip 6 to be protected by the chip rack 5, and the chip 6 is not easy to lose; for professionals who perform chip 6 upgrade operations, when the chip 6 does not need to be replaced, the chip 6 can be directly supported and positioned by the chip rack 5. When the chip 6 needs to be replaced, the snap-fitted chip 6 can also be easily removed, and the new chip 6 can also be easily installed; optionally, for terminal users who do not need to remove the chip rack 5 from the shell 21, the chip 6 can also be directly removed from the chip rack 5, and the upgraded chip 6 can be installed on the chip rack 5 again. During this process, the chip rack 5 still remains in a state of being combined with the shell 21.

Claims

1. A chip operation method, wherein the chip is detachably combined with a chip frame, the chip comprises a first part and a second part separated from each other and a flexible circuit board connecting the first part and the second part, the chip frame comprises a bottom plate and a first positioning member and a second positioning member arranged on the bottom plate, characterized in that: The first positioning member has a space for accommodating the first part, and the second positioning member has a space for accommodating the second part; At least one of the first positioning member and the second positioning member is provided with an escape portion, and the escape portion is used to provide an escape space for the chip during the installation and removal process of the chip; Along the chip installation direction, a part of the space for accommodating the first part and / or a part of the space for accommodating the second part is opened upward through the avoidance portion; The operation method includes at least one of a chip installation step and a chip removal step, wherein the chip installation step includes: pre-positioning one of the first part and the second part with a positioning member that is not provided with an avoidance portion; An operation of positioning the other of the first part and the second part with a positioning member provided with an avoidance portion; An operation of completely positioning the pre-positioning portion and the corresponding positioning piece so that the chip is positioned on the chip rack; The chip disassembly steps include: An operation of releasing the other of the first part and the second part from the positioning member provided with the avoidance portion; The chip is removed from the chip frame by releasing the positioning of one of the first part and the second part from the positioning member which is not provided with the avoidance portion.

2. A chip frame, used to position a chip, wherein the chip includes a first part and a second part separated from each other and a flexible circuit board connecting the first part and the second part; The chip rack includes a bottom plate and a first positioning member and a second positioning member arranged on the bottom plate, wherein the first positioning member is used to position the first part and the second positioning member is used to position the second part, and is characterized in that: The first positioning member has a space for accommodating the first part, and the second positioning member has a space for accommodating the second part; The chip rack further comprises an avoidance portion provided on at least one of the first positioning member and the second positioning member, wherein the avoidance portion is used to provide an avoidance space for the chip during the installation and removal process of the chip; Along the mounting direction of the chip, a portion of the space for accommodating the first part and / or a portion of the space for accommodating the second part is opened upward through the avoidance portion.

3. The chip rack according to claim 2, characterized in that: Along a direction perpendicular to the mounting direction and the disassembly direction of the chip, a part of the space in the chip rack for accommodating the first part and / or the second part is opened by the avoidance portion.

4. The chip rack according to claim 2 or 3, characterized in that: The chip frame also includes a through portion which is arranged below the first positioning member and penetrates along the chip mounting direction, and a part of the flexible circuit board enters the through portion.

5. The chip rack according to claim 4, characterized in that: The chip rack also includes an elastic arm connected to the bottom plate, and the elastic arm is used to limit the movement of the chip along the disassembly direction. When observed along the installation direction or disassembly direction of the chip, the entire elastic arm is opposite to the through portion.

6. The chip rack according to claim 2 or 3, characterized in that: The second positioning member includes a first positioning portion and a second positioning portion which are arranged opposite to each other in a direction perpendicular to the installation direction and the disassembly direction of the chip, the first positioning portion includes a first limiting plate extending directly or indirectly from the base plate, the second positioning portion includes a second limiting plate extending directly or indirectly from the base plate, and the avoidance portion is located in at least one of the first limiting plate and the second limiting plate.

7. The chip rack according to claim 6, characterized in that: A first limiting space is formed between the first limiting plate and the base plate, and a second limiting space is formed between the second limiting plate and the base plate. Along a direction perpendicular to the installation and removal directions of the chip, the highest point of the first limiting space is farther away from the base plate than the highest point of the second limiting space.

8. The chip rack according to claim 2 or 3, characterized in that: Along the direction perpendicular to the installation direction and the removal direction of the chip, the first limiting plate has a first end surface, the second limiting plate has a second end surface, and an operating space for allowing the flexible circuit board to pass through is formed between the first end surface and the second end surface.

9. The chip rack according to claim 8, characterized in that: When viewed along the chip installation direction or chip removal direction, the entire first positioning member is located in the operation space.

10. The chip rack according to claim 8, characterized in that: When viewed along the installation direction or the removal direction of the chip, the first end surface and the second end surface are respectively located on two sides of the first positioning member.

11. A chip assembly, characterized in that The chip assembly comprises a chip and a chip frame as claimed in any one of claims 2 to 10, wherein the chip is detachably combined with the chip frame.

12. A process cartridge, characterized in that: The process cartridge comprises a housing and the chip assembly as claimed in claim 11, wherein the chip assembly is detachably combined with the housing.

13. The process cartridge according to claim 12, wherein: The housing is provided with a chip rack mounting portion, the chip rack mounting portion includes a locking portion arranged therein, the chip rack mounting portion is provided with a locked portion combined with the locking portion, and at least one of the locking portion and the locked portion is cantilevered.

14. The process cartridge according to claim 13, wherein: The chip rack installation part also includes a limiting member for limiting the movement of the chip rack along its installation direction.

15. The process cartridge according to claim 14, wherein: Along a direction perpendicular to the installation direction of the chip frame, the two limiting members are distributed at intervals, and the first positioning member of the chip frame is clamped by the limiting members.

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