Heat dissipation device with adsorbent material immersed in liquid

Abstract

A heat dissipation device for an electronic device cooling system having electronic components includes a housing defining a chamber. The device also includes a first liquid contained in the chamber and having a first boiling temperature. The device also includes an adsorbent material immersed in the first liquid. The device also includes a second liquid adsorbed by the adsorbent material and having a second boiling temperature higher than the first boiling temperature. In response to the first liquid reaching the first boiling temperature, the first liquid evaporates into a first vapor. In response to the second liquid and the adsorbent material reaching a desorption temperature lower than the second boiling temperature, the second liquid is desorbed from the adsorbent material. In response to the second liquid reaching the second boiling temperature, the second liquid evaporates into a second vapor.

Description

Technical Field

[0001] The present disclosure relates generally to electronic device cooling, and more particularly to a heat sink having a plurality of liquids and an adsorbent material immersed in one of the liquids to achieve multi-stage cooling. Background Art

[0002] Electronic devices generate heat as a byproduct in response to receiving electrical current. The amount of heat generated depends on the power, device characteristics, and circuit design. The resistance of the processor, driver circuits, power circuits, and memory contributes to some heat and power losses. To avoid malfunction or circuit failure, electronic devices must operate and remain within a safe operating temperature range. While some circuits can operate without additional cooling, others include mechanisms to dissipate heat.

[0003] Existing heat pipes for electronic devices include an elongated tube containing a single liquid. The tube has a first end that transfers heat from the electronic component to the liquid so that when the temperature of the liquid reaches its boiling temperature, the liquid evaporates into steam. The heat pipe also includes a second end that transfers heat from the steam to the surrounding environment for condensing the steam into liquid when the temperature of the steam drops below the boiling temperature. The heat pipe also includes a wicking material that interconnects the first end and the second end so that the condensed liquid returns from the second end to the first end. Under dry conditions, when all the liquid evaporates into steam, the steam will not move to the second end and cool, and condensate will not form and return to the first end, so that the ability of the heat pipe to cool the electronic component is adversely affected. In addition, existing heat pipes do not provide a warning to notify the user that the temperature of the electronic device is close to or above the maximum safe operating temperature.

[0004] Therefore, while existing heat pipes achieve their intended purpose, a new and improved heat dissipation device for electronic devices is still needed to address these problems. Summary of the invention

[0005] According to several aspects of the present disclosure, a heat sink for an electronic device cooling system is provided, the electronic device cooling system having an electronic component that generates heat in response to receiving an electric current. The heat sink includes a housing that is attached to the electronic component and receives heat from the electronic component. The housing includes a surface that defines a chamber. The heat sink also includes a first liquid contained in the chamber and receiving heat from the housing, the first liquid having a first boiling temperature. The heat sink also includes an adsorbent material immersed in the first liquid. The heat sink also includes a second liquid that is adsorbed by the adsorbent material and has a second boiling temperature that is higher than the first boiling temperature of the first liquid. In response to the first liquid reaching the first boiling temperature, the first liquid evaporates into a first vapor. In response to the second liquid and the adsorbent material reaching a desorption temperature lower than the second boiling temperature, the second liquid is desorbed from the adsorbent material. In response to the second liquid reaching the second boiling temperature, the second liquid evaporates into a second vapor.

[0006] In one aspect, the adsorbent material is configured to desorb at least a portion of the second liquid into the chamber before all of the first liquid evaporates into the first vapor.

[0007] In another aspect, the adsorbent material is configured to desorb at least a portion of the second liquid into the chamber after the first liquid is fully evaporated into the first vapor.

[0008] In another aspect, in response to the adsorbent material being immersed in the first liquid and the density of the first adsorbent material being less than the density of the first liquid, the adsorbent material is spaced apart from the surface of the housing and directly receives heat from the first liquid.

[0009] In another aspect, in response to the first liquid completely evaporating into the first vapor or the density of the first adsorbent material being greater than the density of the first liquid, the adsorbent material is directly supported by the surface of the housing and directly receives heat from the surface of the housing.

[0010] In another aspect, the first liquid is water.

[0011] In another aspect, the second liquid is ethylene glycol.

[0012] According to several aspects of the present disclosure, an electronic device cooling system includes an electronic component that generates heat in response to receiving an electric current. The system also includes a heat sink for cooling the electronic component. The heat sink includes a housing that is attached to the electronic component and receives heat from the electronic component, the housing having a surface defining a chamber. The heat sink also includes a first liquid contained in the chamber and receiving heat from the housing, the first liquid having a first boiling temperature. The heat sink also includes a first adsorbent material immersed in the first liquid and a second adsorbent material coated on the surface of the housing. The heat sink also includes a second liquid that is adsorbed by at least one of the first adsorbent material and the second adsorbent material and has a second boiling temperature higher than the first boiling temperature of the first liquid. In response to the first liquid reaching the first boiling temperature, the first liquid evaporates into a first vapor. In response to the second liquid and at least one of the first adsorbent material and the second adsorbent material reaching a desorption temperature, the second liquid desorbs from at least one of the first adsorbent material and the second adsorbent material. The desorption temperature is lower than the second boiling temperature. In response to the second liquid reaching the second boiling temperature, the second liquid evaporates into a second vapor. The heat sink also includes one or more thermocouples attached to at least one of the electronic component and the heat sink. The thermocouples generate a first temperature signal associated with the temperature of the first liquid. The system also includes a controller electrically connected to the thermocouples, and in response to the controller receiving the first temperature signal from the thermocouples, the controller compares the temperature of the first liquid to a first temperature threshold. In response to the controller determining that the temperature of the first liquid is above the first temperature threshold, the controller generates a first warning notification signal. The controller is electrically coupled to the display device, and is used to display a first warning indicating that the first liquid is approaching the first temperature threshold in response to the display device receiving the first warning notification signal from the controller.

[0013] In one aspect, at least one of the first adsorbent material and the second adsorbent material is configured to desorb at least a portion of the second liquid into the chamber before all of the first liquid evaporates into the first vapor.

[0014] In another aspect, at least one of the first adsorbent material and the second adsorbent material is configured to desorb at least a portion of the second liquid into the chamber after the first liquid is fully evaporated into the first vapor.

[0015] In another aspect, in response to the second adsorbent material being immersed in the first liquid and the first adsorbent material having a density less than that of the first liquid, the first adsorbent material is spaced apart from a surface of the housing and receives heat directly from the first liquid and indirectly from the housing.

[0016] In another aspect, in response to the first liquid completely evaporating into the first vapor or the density of the first adsorbent material being greater than the density of the first liquid, the first adsorbent material is directly supported by the surface of the housing and directly receives heat from the surface of the housing.

[0017] In another aspect, the second adsorbent material is coated on a portion of the housing spaced apart from the electronic component such that the second adsorbent material receives heat indirectly from the electronic component. In response to the second liquid and the second adsorbent material reaching a desorption temperature higher than a first boiling temperature of the first liquid, the second liquid is desorbed from the second adsorbent material.

[0018] In another aspect, the thermocouple generates a second temperature signal associated with the temperature of the second liquid. In response to the controller receiving the second temperature signal from the thermocouple, the controller compares the temperature of the second liquid to a second temperature threshold. In response to the controller determining that the temperature of the second liquid is above the second temperature threshold, the controller generates a second warning notification signal. In response to the display device receiving the second warning notification signal from the controller, the display device displays a second warning indicating that the temperature of the second liquid is approaching the second temperature threshold.

[0019] In another aspect, the electronic device cooling system further includes a fan for generating an air flow to cool the housing and the first vapor and the second vapor in the housing.

[0020] In another aspect, a thermocouple includes a first thermocouple attached to an electronic component and generating a first temperature signal and a second thermocouple attached to a heat sink and generating a second temperature signal.

[0021] According to several aspects of the present disclosure, a method for operating an electronic device cooling system is provided, the electronic device cooling system having an electronic component and a heat sink attached to the electronic component. The heat sink includes a housing attached to the electronic component and having a surface defining a chamber. The heat sink also includes a first liquid contained in the chamber and having a first boiling temperature. The heat sink also includes a first adsorbent material immersed in the first liquid. The heat sink also includes a second liquid adsorbed by the first adsorbent material and having a second boiling temperature higher than the first boiling temperature of the first liquid. The heat sink also includes one or more thermocouples and a controller attached to one or more electronic components. The method includes: transferring heat from the electronic component to the first liquid. The method also includes: evaporating the first liquid into a first vapor in response to the first liquid receiving heat from the electronic component and the first liquid reaching the first boiling temperature. The method also includes: desorbing the second liquid from the adsorbent material in response to the second liquid and the first adsorbent material reaching a desorption temperature lower than the second boiling temperature. The method also includes: evaporating the second liquid into a second vapor in response to the second liquid reaching the second boiling temperature.

[0022] In one aspect, the method further comprises the step of desorbing at least a portion of the second liquid into the chamber using the first adsorbent material and the second adsorbent material coated on the housing before all of the first liquid evaporates into the first vapor.

[0023] In another aspect, the method further comprises the steps of: receiving heat directly from the first liquid by the first adsorbent material spaced apart from the housing surface in response to the first adsorbent material being immersed in the first liquid and the density of the first adsorbent material being less than the density of the first liquid. After the first liquid is completely evaporated into the first vapor, at least a portion of the second liquid is desorbed from at least one of the first adsorbent material and the second adsorbent material into the chamber. In response to the first liquid evaporating into the first vapor, the first adsorbent material directly supported by the housing surface receives heat directly from the housing surface.

[0024] In another aspect, the method further comprises the following steps: generating a first temperature signal associated with the temperature of the first liquid using a thermocouple. In response to the controller receiving the first temperature signal from the thermocouple, the controller compares the temperature of the first liquid with a first temperature threshold. In response to the controller determining that the temperature of the first liquid is higher than the first temperature threshold, the controller generates a first warning notification signal. In response to the display device receiving the first warning notification signal from the controller, the display device displays a first warning indicating that the first liquid is approaching the first temperature threshold. The thermocouple generates a second temperature signal associated with the temperature of the second liquid. In response to the controller receiving the second temperature signal from the thermocouple, the controller compares the temperature of the second liquid with a second temperature threshold. In response to the controller determining that the temperature of the second liquid is higher than the second temperature threshold, the controller generates a second warning notification signal. In response to the display device receiving the second warning notification signal from the controller, the display device displays a second warning indicating that the temperature of the second liquid is approaching the second temperature threshold.

[0025] Further areas of applicability will become apparent from the description provided herein.It should be understood that the description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is an exploded perspective view of an example of an electronic device cooling system having an electronic component and a heat sink for cooling the electronic component;

[0027] Figure 2 It was taken along line 2-2 Figure 1 A cross-sectional view of a heat dissipation device in FIG. 1 , showing that the heat dissipation device has a housing defining a chamber, a first liquid contained in the chamber, and an adsorbent material immersed in the first liquid;

[0028] Figure 3 yes Figure 2An enlarged view of the heat sink in circle 3 shows the second liquid adsorbed by the adsorbent material, and the density of the adsorbent material is greater than the density of the first liquid, so that the adsorbent material is directly supported by the shell before the first liquid is completely evaporated into the first vapor;

[0029] Figure 4 It was taken along line 2-2 Figure 1 A cross-sectional view of another example of an electronic device cooling system in FIG. 1 shows a heat sink having a housing defining a chamber, a first liquid contained in the chamber, and an adsorbent material immersed in the first liquid;

[0030] Figure 5 yes Figure 4 An enlarged view of the heat sink in the circle 5 shows the second liquid adsorbed by the adsorbent material, and the adsorbent material is separated from the shell before the first liquid is completely evaporated into the first vapor;

[0031] Figure 6 yes Figure 5 An enlarged view of the heat sink in FIG. 1 shows a second liquid desorbed from an adsorbent material, the adsorbent material being directly supported by the housing after the first liquid is completely evaporated into a first vapor;

[0032] Figure 7 Yes Operation Figure 1 A flow chart of an example of a method for an electronic device cooling system in FIG. DETAILED DESCRIPTION

[0033] The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, or uses.

[0034] An exemplary electronic device cooling system includes a heat sink having an adsorbent material to separate and recombine two or more liquids for cooling one or more electronic components. Although the detailed examples described below are for heat sinks having two liquids with dual active thermal zones for providing operating temperatures, other examples may include more than two liquids to provide any operating temperature range. More specifically, as described in the detailed examples below, the heat sink includes a first liquid contained in a housing, an adsorbent material immersed in the first liquid, and a second liquid adsorbed by the adsorbent material. When the first liquid is completely evaporated into a first vapor, the second liquid can be desorbed from the adsorbent material to prevent a dry state, so that the second liquid prevents related cooling interruptions that may damage the electronic components. In other words, when the first liquid has completely evaporated, the second liquid can be used as a buffer liquid or a backup liquid. The first liquid and the second liquid provide a dual active thermal zone (or a certain operating temperature range), and the heat sink removes heat from the electronic components in the dual active thermal zone. The operating temperature range can be between the lowest freezing point of the two liquids and the highest boiling point of the two liquids. Within this operating temperature range, the two liquids receive heat from the electronic components, thereby increasing the temperature of the two liquids.

[0035] The electronics cooling system may be an open loop passive system having a gravity fed closed ended steam chamber or conduit having a first closed end adjacent to the electronic components and a second closed end adjacent to the cooling fan. However, it is contemplated that other examples of the system may be closed loop active systems including a steam chamber or conduit forming a loop with a pump that pumps condensate through the loop to return to the electronic components.

[0036] The adsorbent material may be disposed in any suitable position relative to the electronic component and may form a layer of the adsorbent material having any suitable thickness to adjust the heat sink to provide a relevant percentage of each liquid for cooling the electronic component. Although only one liquid is adsorbed by and desorbed from the adsorbent material described below, the adsorbent material may initially store any number of different liquids. The liquids may have relative boiling temperatures that differ from one another and may be desorbed from the adsorbent material at relative desorption temperatures. Furthermore, although the examples of the first liquid and the second liquid described below are two different liquids having two different boiling temperatures, it is contemplated that the first liquid and the second liquid may be the same liquid having the same boiling temperature.

[0037] See also Figure 1 and Figure 2An example of an electronic device cooling system 100 includes an electronic component 102 that generates heat in response to a current flowing therethrough. The electronic component may be a processor, a driver circuit, a power supply circuit, a memory, or any other electronic component that generates heat in response to the electronic component 102 receiving a current.

[0038] like Figure 2 and Figure 3 As best shown, the system 100 also includes a heat sink 104 for cooling the electronic components 102. In this non-limiting example, the heat sink 104 can be a vapor chamber or a heat pipe for a passive open-loop electronic device cooling system. The heat sink 104 includes a housing 106 having an inner surface 108 defining a chamber 110, the housing 106 having a first end 112 and a second end 114 ( Figure 2 ). It is contemplated that other examples of the device could be a vapor chamber or heat pipe for a closed loop active system having a pump that pumps condensate through a loop back to the electronic components.

[0039] The heat sink 104 also includes a first liquid 116 contained within the chamber 110 of the housing 106 and receiving heat from the housing 106, the first liquid 116 having a first boiling temperature. In response to the first liquid 116 reaching the first boiling temperature, the first liquid evaporates into a first vapor 118. In this example, the first liquid 116 is water having a freezing temperature of 32 degrees Fahrenheit and a boiling temperature of 212 degrees Fahrenheit at standard sea level pressure. However, it is contemplated that the first liquid can be other liquids having relevant freezing and boiling temperatures.

[0040] The heat sink 104 also includes a first adsorbent material 120 immersed in the first liquid 116. The first adsorbent material 120 is suspended in the first liquid 116 and can move relative to the housing 106, so that the electronic component 102 transfers heat directly to the housing 106, which in turn transfers heat directly to the first liquid 116, which in turn transfers heat to the first adsorbent material 120. In this example, the density of the first adsorbent material 120 is greater than the density of the first liquid, so that the first adsorbent material 120 is immersed below the top surface of the first liquid 116 and supported by the bottom wall 106a of the housing 106. However, in other examples, the density of the first adsorbent material can be less than the density of the first liquid. The first adsorbent material is selected from zeolite, silica gel and metal organic framework. However, in other examples, the first adsorbent material can include other suitable materials for desorbing and adsorbing liquids.

[0041] The heat sink 104 also includes a second adsorbent material 122 coated on the side wall 106b of the housing 106. In this example, the second adsorbent material 122 is coated on a portion of the housing 106 that is spaced apart from the electronic component 102, so that the second adsorbent material 122 indirectly receives heat from the electronic component 102 via the bottom wall 106a and the side wall 106b of the housing 106. It is contemplated that the adsorbent material can be coated on any portion of the inner surface. The adsorbent material is selected from zeolite, silica gel, and metal organic framework. However, in other examples, the adsorbent material may include other suitable materials for desorbing and adsorbing the second liquid.

[0042] The heat sink 104 also includes a second liquid 124 that is adsorbed by at least one of the first adsorbent material 118 and the second adsorbent material 120 and has a second boiling temperature that is higher than the first boiling temperature of the first liquid 116. In response to the second liquid 124 and the second adsorbent material 122 reaching the desorption temperature, the second liquid 124 is desorbed from the second adsorbent material 122. In this example, the desorption temperature is higher than the first boiling temperature of the first liquid 116. However, in other examples, the desorption temperature may be lower than the first boiling temperature of the first liquid. In addition, in response to the second liquid 124 reaching the second boiling temperature, the second liquid 124 evaporates into a second vapor 126. In this example, the second liquid 124 is ethylene glycol having a freezing temperature of 8.78 degrees Fahrenheit and a boiling temperature of 386.6 degrees Fahrenheit at standard sea level pressure. However, it is contemplated that the second liquid may be other liquids having associated freezing and boiling temperatures. Furthermore, it is contemplated that the heat sink may include any number of adsorbent materials arranged in other configurations to separate and recombine any number of liquids before all other liquids evaporate.

[0043] In operation, the first adsorbent material 120 and the second adsorbent material 122 desorb at least a portion of the second liquid 124 into the chamber 110 before the first liquid 120 is completely evaporated into the first vapor 126, so that the boiling temperature of the resulting mixture can depend on the concentration of the mixture, as illustrated by the values ​​in the following table.

[0044]

[0045]

[0046] The concentration or weight percentage of the solution can be controlled by at least one of the following ways: using predetermined liquids with relevant boiling points, placing the adsorbent material containing these liquids at a predetermined position relative to the electronic component, and forming the adsorbent material into an adsorbent material layer with a predetermined thickness. In another example, the first adsorbent material 120 and the second adsorbent material 122 are configured to desorb the second liquid 124 into the chamber 110 after the first liquid 116 is completely evaporated into the first vapor 118.

[0047] See again Figure 1 , the system 100 also includes one or more thermocouples 128 attached to at least one of the electronic component 102 and the heat sink 104. The thermocouple 128 generates a first temperature signal associated with the temperature of the first liquid 116 and a second temperature signal associated with the temperature of the second liquid 124. More specifically, in this example, the thermocouple 128 includes a first thermocouple 130, which is attached to the electronic component 102 and generates a first temperature signal. The thermocouple 128 also includes a second thermocouple 132, which is attached to the heat sink 104 and generates a second temperature signal. In other examples, the system includes a single thermocouple that is disposed in a chamber of the housing or at any other location and is attached to any portion of the heat sink or the electronic component.

[0048] The system 100 also includes a controller 134 electrically connected to the thermocouple 128. In response to the controller 134 receiving a first temperature signal from the thermocouple 128, the controller 134 compares the temperature of the first liquid 120 to a first temperature threshold. In this example, the first temperature threshold is a first boiling temperature of the first liquid, such as 212 degrees Fahrenheit associated with water. In response to the controller 134 determining that the temperature of the first liquid 120 is above the first temperature threshold, the controller 134 generates a first warning notification signal. In response to the controller 134 receiving a second temperature signal from the thermocouple 128, the controller 134 compares the temperature of the second liquid 124 to a second temperature threshold. Continuing with the previous example, the second temperature threshold is a second boiling temperature of the second liquid 124, such as 387 degrees Fahrenheit associated with ethylene glycol. In response to the controller 134 determining that the temperature of the second liquid 124 is above the second temperature threshold, the controller 134 generates a second warning notification signal.

[0049] The controller 134 is also electrically coupled to the display device 136 for displaying a first warning indicating that the first liquid 120 is approaching a first temperature threshold in response to the display device 136 receiving a first warning notification signal from the controller 134. In response to the display device 136 receiving a second warning notification signal from the controller 134, the display device 136 also displays a second warning indicating that the temperature of the second liquid 124 is approaching a second temperature threshold.

[0050] The system 100 also includes a fan 138 disposed between the second end 116 of the housing 106 and the heat sink 117 ( Figure 2 ) to generate airflow above the housing 106 to dissipate heat.

[0051] See also Figure 4 and Figure 5 , another example of heat sink 204 is similar to Figure 2 and Figure 3 The heat sink 104 in FIG. 1 is a heat sink 104 and includes like components identified by like reference numerals increased by 100. Figure 3 The density of the first adsorbent material 120 in the housing 206 is greater than that of the first liquid 116, so that the first adsorbent material 120 is immersed below the top surface of the first liquid 116, while the density of the first adsorbent material 220 is less than that of the first liquid 216, so that the first adsorbent material 220 has sufficient buoyancy to float to the top surface of the first liquid 216. For this reason, in response to the first adsorbent material 220 being immersed in the first liquid 216, the first adsorbent material 220 is spaced apart from the bottom wall 206a of the housing 206 and receives heat directly from the first liquid 216 and indirectly from the housing 206. More specifically, the electronic component transfers heat to the housing 206, which in turn transfers heat to the first liquid 216, which in turn transfers heat to the first adsorbent material 220 and the second liquid 224 adsorbed therein.

[0052] See now Figure 6 In response to the first liquid 216 evaporating into the first vapor 218 , the first adsorbent material 220 is directly supported by the surface 208 of the housing 206 and receives heat directly from the surface 208 of the housing 206 .

[0053] See also Figure 7 , provides an operation Figure 2 Method 300 of system 100 in FIG. Method 300 begins at step 302, where electronic component 102 generates heat in response to receiving current. More specifically, in this example ( Figures 1 to 3 ), the electronic component 102 transfers heat to the bottom wall 106a of the housing 106, which in turn transfers heat to the first liquid 116, and the first liquid 116 transfers heat to the first adsorbent material 120 and the first liquid 116 adsorbed therein. In addition, the density of the first adsorbent material 120 is greater than the density of the first liquid 116, so that the first adsorbent material 120 is immersed below the top surface of the first liquid 116 and is directly supported by the bottom wall 106a of the housing 106. Therefore, a portion of the heat is directly transferred from the housing 106 to the portion of the first adsorbent material 120 directly supported by the bottom wall 106a of the housing 106.

[0054] In another instance ( Figures 4 to 6), the density of the first adsorbent material 220 is less than the density of the first liquid 216, so that the first adsorbent material 220 floats to the top surface of the first liquid 216 and is separated from the shell 206 before the first liquid 216 is completely evaporated into the first vapor 218 ( Figure 5 ). All heat is transferred from the shell 206 to the first liquid 216, which in turn transfers the heat to the first adsorbent material 220. It is contemplated that the position of the second adsorbent layer on the shell, the thickness of the second adsorbent layer, the density of the first adsorbent layer, and all other structures forming a heat path to the adsorbent layer and the liquid adsorbed therein can be adjusted to control the flow rate of heat to the adsorbent layer and the liquid.

[0055] At step 304 , in response to the first liquid 120 receiving heat from the electronic component 102 and the first liquid 120 reaching a first boiling temperature, the first liquid 120 evaporates into the first vapor 126 .

[0056] At step 306 , the first thermocouple 130 generates a first temperature signal associated with the temperature of the first liquid.

[0057] In step 308, in response to the controller receiving the first temperature signal from the first thermocouple 130, the controller 134 compares the temperature of the first liquid 120 to a first temperature threshold. In this example, the first temperature threshold is the first boiling temperature of the first liquid. However, it is contemplated that the first temperature threshold may be higher or lower than the first boiling temperature. For example, to provide additional warning that the first liquid 120 is drying out, the first temperature threshold may be a temperature lower than the first boiling temperature of the first liquid 120. If the temperature of the first liquid 120 is lower than the first temperature threshold, the method repeats step 308. If the temperature of the first liquid 120 is higher than the first temperature threshold, the method 300 proceeds to step 310.

[0058] At step 310 , in response to the controller 134 determining that the temperature of the first liquid 120 is above a first temperature threshold, the controller 134 generates a first warning notification signal.

[0059] At step 312 , in response to the display device receiving the first warning notification signal from the controller 134 , the display device 136 displays a first warning indicating that the first liquid 120 is approaching a first temperature threshold.

[0060] In step 314, in response to the second liquid 124 and the first adsorbent material 120 and the second adsorbent material 122 reaching the desorption temperature, at least a portion of the second liquid 124 is desorbed from at least one of the first adsorbent material 120 and the second adsorbent material 122 and released into the chamber 110. The desorption temperature is lower than the second boiling temperature. In one example, the desorption temperature is also lower than the first boiling temperature of the first liquid 116, which is lower than the second boiling temperature of the second liquid 124, such that at least a portion of the second liquid 124 is desorbed from the first adsorbent material 120 and the second adsorbent material 122 before the first liquid 116 is completely evaporated into the first vapor 118. In another example, the desorption temperature is higher than the first boiling temperature of the first liquid 116 and lower than the second boiling temperature of the second liquid 124, such that at least a portion of the second liquid 124 is desorbed from the first adsorbent material 120 and the second adsorbent material 122 after the first liquid 116 is completely evaporated into the first vapor 118.

[0061] At step 316 , in response to the second liquid 124 receiving heat from the electronic component and the second liquid 124 reaching the second boiling temperature, the second liquid 124 evaporates into the second vapor 128 .

[0062] At step 318 , the second thermocouple 132 generates a second temperature signal associated with the temperature of the second liquid 124 .

[0063] In step 320, in response to the controller 134 receiving the second temperature signal from the second thermocouple 132, the controller 134 compares the temperature of the second liquid 124 to a second temperature threshold. In this example, the second temperature threshold is the second boiling temperature. However, it is contemplated that the second temperature threshold may be higher or lower than the second boiling temperature. For example, in order to provide additional warning that the second liquid 124 is dry, the second temperature threshold may be lower than the second boiling temperature of the second liquid 124. If the temperature of the second liquid 124 is lower than the second temperature threshold, the method 300 repeats step 320. If the temperature of the second liquid 124 is higher than the second temperature threshold, the method proceeds to step 322.

[0064] At step 322 , in response to the controller 134 determining that the temperature of the second liquid 124 is above the second temperature threshold, the controller 134 generates a second warning notification signal.

[0065] At step 324 , in response to the display device receiving the second warning notification signal from the controller 134 , the display device 136 displays a second warning indicating that the temperature of the second liquid is approaching the second temperature threshold.

[0066] The description of the present disclosure is merely exemplary in nature, and changes that do not depart from the general meaning of the present disclosure are included within the scope of the present disclosure. These changes should not be regarded as departing from the spirit and scope of the present disclosure.

Claims

1. A heat sink for an electronic device cooling system having an electronic component that generates heat in response to receiving an electric current, the heat sink comprising: a housing attached to the electronic component and receiving heat from the electronic component, the housing having a surface defining a chamber; a first liquid contained in the chamber of the housing and receiving heat from the housing, the first liquid having a first boiling temperature; an adsorbent material immersed in the first liquid; as well as a second liquid adsorbed by the adsorbent material and having a second boiling temperature higher than the first boiling temperature of the first liquid; wherein, in response to the first liquid reaching the first boiling temperature, the first liquid evaporates into a first vapor; and wherein, in response to the second liquid and the adsorbent material reaching a desorption temperature below the second boiling temperature, the second liquid is desorbed from the adsorbent material, and in response to the second liquid reaching the second boiling temperature, the second liquid evaporates into a second vapor. 2 . The heat sink of claim 1 , wherein the adsorbent material is configured to desorb at least a portion of the second liquid into the chamber before the first liquid is completely evaporated into the first vapor. 3 . The heat dissipation device of claim 1 , wherein the adsorbent material is configured to desorb at least a portion of the second liquid into the chamber after the first liquid is completely evaporated into the first vapor. 4 . The heat dissipation device according to claim 3 , wherein in response to the adsorption material being immersed in the first liquid, the adsorption material is spaced apart from a surface of the housing and receives heat directly from the first liquid and indirectly from the housing. 5 . The heat sink of claim 4 , wherein in response to the first liquid evaporating into the first vapor, the adsorbent material is directly supported by a surface of the housing and directly receives heat from the surface of the housing. The heat dissipation device according to claim 5 , wherein the first liquid is water. The heat dissipation device according to claim 6 , wherein the second liquid is ethylene glycol.

8. An electronic device cooling system, comprising: an electronic component that generates heat in response to receiving an electrical current; A heat sink, used to cool the electronic components, the heat sink comprising: a housing attached to the electronic component and receiving heat from the electronic component, the housing having a surface defining a chamber; a first liquid contained in the chamber of the housing and receiving heat from the housing, the first liquid having a first boiling temperature; a first adsorbent material immersed in the first liquid; A second adsorption material coated on the surface of the shell; and a second liquid adsorbed by at least one of the first adsorbent material and the second adsorbent material and having a second boiling temperature higher than the first boiling temperature of the first liquid; wherein, in response to the first liquid reaching the first boiling temperature, the first liquid evaporates into a first vapor; wherein, in response to the second liquid reaching a desorption temperature below the second boiling temperature and further in response to at least one of the first adsorbent material and the second adsorbent material reaching a desorption temperature below the second boiling temperature, the second liquid is desorbed from at least one of the first adsorbent material and the second adsorbent material, and in response to the second liquid reaching the second boiling temperature, the second liquid evaporates into a second vapor; at least one thermocouple attached to at least one of the electronic component and the heat sink, the at least one thermocouple generating a first temperature signal associated with a temperature of the first liquid; and a controller electrically connected to the at least one thermocouple, the controller comparing the temperature of the first liquid to a first temperature threshold in response to the controller receiving the first temperature signal from the at least one thermocouple, and the controller generating a first warning notification signal in response to the controller determining that the temperature of the first liquid is above the first temperature threshold; The controller is electrically coupled to a display device, and the display device is configured to display a first warning indicating that the first liquid is approaching the first temperature threshold in response to the display device receiving the first warning notification signal from the controller.

9. The electronic device cooling system of claim 8, wherein at least one of the first adsorbent material and the second adsorbent material is configured to desorb at least a portion of the second liquid into the chamber before all of the first liquid evaporates into the first vapor.

10. The electronic device cooling system of claim 8, wherein at least one of the first adsorbent material and the second adsorbent material is configured to desorb at least a portion of the second liquid into the chamber after all of the first liquid evaporates into the first vapor.

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