A photoelectric detection material testing system based on BGA packaged front-end chips

Abstract

The present invention discloses a photoelectric detection material testing system based on a BGA packaged front-end chip, which belongs to the technical field of photoelectric detection materials and can solve the problem of a large number of designed PCB layers when the system packaging density and the number of pins in the existing BGA package are large. The system includes: a PCB board, on which a plurality of vias are arranged; a photoelectric detection material, arranged on the first surface of the PCB board; the photoelectric detection material constitutes a plurality of independent pixels; each via corresponds to each pixel one by one; a BGA packaged front-end chip, arranged on the second surface of the PCB board, the BGA packaged front-end chip has a plurality of pins, each via corresponds to a pin, and the anode of each pixel is electrically connected to the corresponding pin through the corresponding via; an FPGA development board, used for packaging and transmitting the signal transmitted by the BGA packaged front-end chip; a display screen, used for displaying the signal transmitted by the FPGA development board. The present invention is used for the research and development of new photoelectric detection materials.

Description

Technical Field

[0001] The invention relates to a photoelectric detection material testing system based on a BGA packaged front-end chip, belonging to the technical field of photoelectric detection materials. Background Art

[0002] Photoelectric detection materials are used to capture light intensity information and convert light signals into electrical signals through photon excitation. In practical applications, photoelectric detection materials are widely used in array imaging. For new photoelectric detection materials, especially for the research and development of detection imaging materials, it is necessary to conduct imaging tests on integrated CMOS chips to verify imaging performance such as dark current, consistency, dynamic range, and crosstalk.

[0003] Heterogeneous integration of materials and integrated circuits is a difficult point in material imaging testing. There are many general-purpose front-end chips on the current market, such as TI's DDC264 and AFE0064, which are suitable for signal acquisition of photoelectric detection materials. However, when using existing general-purpose chips, it is often necessary to package the materials into electronic components and realize electrical connection of the above chips on the PCB board through pins. This method is limited by wiring spacing, electromagnetic interference, component pin size, packaging process, etc., and the steps are cumbersome and the processing cycle is long.

[0004] Three-dimensional integrated circuits are considered to have incomparable advantages over two-dimensional integrated circuits. However, three-dimensional integration technology, especially three-dimensional heterogeneous integration technology, requires specially designed and packaged chips. After the steps of chip design, tape-out, window opening, and packaging, the electrical interconnection between materials and integrated circuits can be achieved. These steps have the defects of high cost, high risk, limited process, and non-reusability, which limit the imaging test of new materials. BGA packaging is a chip packaging technology with a large system packaging density and pin count, but considering the lead-out of internal pins and electromagnetic interference problems, the designed PCB board generally has more layers. Summary of the invention

[0005] The present invention provides a photoelectric detection material testing system based on a BGA packaged front-end chip, which can solve the problem of having a large number of designed PCB layers when the system packaging density and the number of pins in the existing BGA package are large.

[0006] The present invention provides a photoelectric detection material testing system based on a BGA packaged front-end chip, the system comprising: a PCB board, on which a plurality of vias are arranged; a photoelectric detection material, arranged on a first surface of the PCB board; the photoelectric detection material constitutes a plurality of independent pixels; each via corresponds to each pixel one by one; a common cathode is also arranged on the PCB board; the cathode of each pixel is electrically connected to the common cathode; a BGA packaged front-end chip, arranged on a second surface of the PCB board opposite to the first surface thereof, the BGA packaged front-end chip having a plurality of pins, each via corresponds to a pin, and the anode of each pixel is electrically connected to the corresponding pin through the corresponding via; an FPGA development board, electrically connected to the BGA packaged front-end chip, for packaging and transmitting signals transmitted by the BGA packaged front-end chip; a display screen, electrically connected to the FPGA development board, for displaying signals transmitted by the FPGA development board.

[0007] Optionally, the plurality of via holes, the plurality of pixels and the plurality of pins are arranged in an array.

[0008] Optionally, the photoelectric detection material is manufactured on the first surface of the PCB board by chemical water bath deposition or spraying.

[0009] Optionally, the PCB board is electrically connected to the FPGA development board via a flat cable.

[0010] Optionally, the BGA packaged front-end chip is soldered on the second surface of the PCB board.

[0011] Optionally, the pins include a signal input port, a signal output port, a power port and a control port; the signal input port corresponds one-to-one to the via array; the PCB board is also provided with a buffer module, a digital-to-analog conversion module and a data stream output port; the buffer module is electrically connected to the signal output port, the digital-to-analog conversion module is electrically connected to the buffer module, the data stream output port is connected to the digital-to-analog conversion module electrode, and the FPGA development board is electrically connected to the data stream output port.

[0012] Optionally, the FPGA development board includes a control signal module, a serial-to-parallel conversion module, a dual-port RAM module, an HDMI module and an HDMI output port; the control signal module is electrically connected to the digital signal output port of the PCB board, the serial-to-parallel conversion module is electrically connected to the data stream output port, the dual-port RAM module is electrically connected to the serial-to-parallel conversion module, the HDMI module is electrically connected to the dual-port RAM module, and the HDMI output port is electrically connected to the HDMI module; the display screen is electrically connected to the HDMI output port.

[0013] Optionally, the FPGA development board is also used to perform image optimization processing on the signal transmitted by the BGA packaged front-end chip.

[0014] Optionally, the FPGA development board is also used to highlight abnormal points in the signal transmitted by the BGA packaged front-end chip.

[0015] Optionally, the BGA packaged front-end chip is a DDC264 chip.

[0016] The beneficial effects that the present invention can produce include:

[0017] The photoelectric detection material testing system based on the BGA packaged front-end chip provided by the present invention utilizes the position characteristics of the pins of the BGA packaged front-end chip, and is connected to the pixel array array of the photoelectric detection material through a via array to realize the three-dimensional heterogeneous integration of the material-integrated circuit, which reduces the difficulty of the electrical connection between the material and the integrated circuit, and reduces the difficulty of wiring the integrated circuit on the PCB board; the material imaging is realized by processing and converting through analog circuits and digital circuits, and displaying on a display screen. The test system is suitable for the research and development of new photoelectric detection materials, and realizes the visual display of its imaging performance, and has the advantages of low cost, intuitive result display, low processing difficulty, short processing cycle, and high reusability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a test system provided by an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of system connection provided by an embodiment of the present invention;

[0020] Figure 3 A schematic diagram of electrical connections of a BGA packaged front-end chip provided in an embodiment of the present invention;

[0021] Figure 4 A schematic diagram of an FPGA development board module provided in an embodiment of the present invention.

[0022] List of parts and reference numerals:

[0023] 11. PCB board; 12. Photoelectric detection material; 13. FPGA development board; 14. Display screen; 15. BGA packaged front-end chip; 16. Pins; 17. Vias; 18. Common cathode. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0025] In the present invention, the terms "first", "second", etc. (if any) in the present invention and the drawings are used to distinguish similar objects but not necessarily to describe a specific order or sequence.

[0026] In order to realize imaging under low-cost conditions and perform performance testing on photoelectric detection materials, an embodiment of the present invention provides a photoelectric detection material testing system based on a BGA packaged front-end chip, such as Figures 1 to 4 As shown, the system includes: a PCB board 11, on which a plurality of vias 17 are arranged; a photoelectric detection material 12, which is arranged on the first surface of the PCB board 11; the photoelectric detection material 12 constitutes a plurality of independent pixels; each via 17 corresponds to each pixel one by one; a common cathode 18 is also arranged on the PCB board 11; the cathode of each pixel is electrically connected to the common cathode 18; a BGA packaged front-end chip 15, which is arranged on the second surface of the PCB board 11 opposite to the first surface thereof, the BGA packaged front-end chip 15 has a plurality of pins 16, each via 17 corresponds to a pin 16, and the anode of each pixel is electrically connected to the corresponding pin 16 through the corresponding via 17; an FPGA development board 13, which is electrically connected to the BGA packaged front-end chip 15, and is used to package and transmit the signal transmitted by the BGA packaged front-end chip 15; a display screen 14, which is electrically connected to the FPGA development board 13, and is used to display the signal transmitted by the FPGA development board 13.

[0027] In the embodiment of the present invention, the plurality of vias 17 , the plurality of pixels and the plurality of pins 16 are arranged in an array.

[0028] The photoelectric detection material 12 constitutes a mutually independent pixel array, and the anode of each pixel corresponds to the via hole 17 array one by one, and is electrically connected through heterogeneous integration. The cathode of the photoelectric detection material 12 is electrically connected to the common cathode 18 through a connecting wire.

[0029] In practical applications, the FPGA development board 13 can also be used to perform image optimization processing on the signal transmitted by the BGA packaged front-end chip 15; or it can also be used to perform abnormal point highlighting processing on the signal transmitted by the BGA packaged front-end chip 15.

[0030] In the embodiment of the present invention, the photoelectric detection material 12 can be manufactured on the first surface of the PCB board 11 by chemical water bath deposition or spraying.

[0031] The PCB board 11 can be electrically connected to the FPGA development board 13 via a flat cable.

[0032] Furthermore, the BGA packaged front-end chip 15 is soldered on the second surface of the PCB board 11 .

[0033] In practical applications, the BGA packaged front-end chip 15 may be a 64-channel analog front-end chip DDC264.

[0034] The array pin 16 corresponding to the analog front-end chip DDC264 described in the embodiment of the present invention includes several types of ports, including a signal input port, a signal output port, a power port and a control port; the signal input port corresponds one-to-one to the array of vias 17; a buffer module, a digital-to-analog conversion module and a data stream output port are also provided on the PCB board 11; the buffer module is electrically connected to the signal output port, the digital-to-analog conversion module is electrically connected to the buffer module, the data stream output port is connected to the digital-to-analog conversion module electrode, and the FPGA development board 13 is electrically connected to the data stream output port.

[0035] Since the analog front-end chip DDC264 integrates the buffer module and the ADC module internally, it is unnecessary to set the buffer module and the ADC module on the PCB board 11. In this embodiment, it is also unnecessary to electrically interconnect the analog front-end chip, the buffer circuit, and the ADC module externally. The ADC module described in the embodiment of the present invention is connected to the digital signal output port of the PCB board 11, which means that the digital signal output port of the analog front-end chip DDC264 in the embodiment of the present invention is connected to the digital signal output port of the PCB board 11.

[0036] Figure 2 A schematic diagram of a system connection provided by an embodiment of the present invention is shown. Specifically, the photoelectric detection material 12 and the BGA packaged front-end chip 15 realize three-dimensional heterogeneous integration of materials and integrated circuits. The specific implementation method can be chemical bath deposition (CBD) or spraying, and they are indirectly connected through an array of vias 17; the BGA packaged front-end chip 15 is electrically connected to the PCB board 11 by welding; the PCB board 11 is connected to the FPGA development board 13 through a flat cable; the FPGA development board 13 is connected to the display screen 14 through an HDMI cable.

[0037] Through the three-dimensional heterogeneous integration of materials and integrated circuits, the difficulty of electrical connection between materials and integrated circuits is reduced, and the difficulty of wiring the integrated circuits on the PCB board 11 is reduced. Figure 3 As shown, an embodiment of the present invention provides an electrical connection schematic diagram of a BGA packaged chip.

[0038] Specifically, the array pins 16 of the analog front-end chip DDC264 described in the embodiment of the present invention include several types of ports, including a signal input port, a signal output port, a power port, and a control port.

[0039] Specifically, the material signal IN port shown belongs to the signal input port, with a total of 64 pins 16, each corresponding to an independent channel of a different pixel signal, and interconnection with the material pixel array is achieved through three-dimensional heterogeneous integration, and the electrical connection of the center pin 16 can be achieved without designing a multi-layer PCB; DOUT belongs to the signal output port, which is wired downward; the AGND, QGND, DGND, AVDD, DVDD, and VREF ports shown belong to power ports, and ports with the same name are interconnected and wired out, among which the AGND, QGND, and DGND shown are all ground levels, but in order to reduce interference, they are wired out in the form of three networks; the CLK, CLK_C, CONV, DCLK, DIN, DLID, DIN_C, and RST ports shown belong to control ports, which are wired out separately.

[0040] like Figure 4 As shown, the FPGA in the embodiment of the present invention includes a control signal module, a serial-to-parallel conversion module, a dual-port RAM module, an HDMI module and an HDMI output port; the control signal module is electrically connected to the digital signal output port of the PCB board 11, the serial-to-parallel conversion module is electrically connected to the data stream output port, the dual-port RAM module is electrically connected to the serial-to-parallel conversion module, the HDMI module is electrically connected to the dual-port RAM module, and the HDMI output port is electrically connected to the HDMI module; the display screen 14 is electrically connected to the HDMI output port.

[0041] Specifically, the serial-to-parallel conversion module can realize serial-to-parallel conversion of the data stream output from the data stream output port; the dual-port RAM module works under ping-pong operation to improve the throughput, and the data stream of the serial-to-parallel conversion module is stored according to the actual address. The meaning is that since the channel sequence of the analog front-end chip DDC264 is different from the sequence of the 12-pixel array of the photoelectric detection material, when a RAM write operation is performed, the write address is adjusted so that the screen scanning sequence is the same as the imaging sequence of the pixel array. At the same time, the dual-port RAM reads another full RAM, and performs ping-pong switching again after it is full, thereby improving the throughput; the HDMI module reads the RAM, processes it, and outputs it from the HDMI output port.

[0042] In an embodiment of the present invention, the test system performs an imaging process of one frame, including: the photoelectric detection material 12 realizes the capture of light intensity information, and realizes the conversion of optical signals into electrical signals through photon excitation, and each pixel transmits the electrical signal to each signal input port of the BGA package front-end chip 15 through its corresponding via 17 array, completes its own photocurrent integration in different channels, and after amplification and impedance matching through the buffer module, it is converted into a data stream through the ADC module, input into the FPGA development board 13 for signal processing, and finally displayed on the screen.

[0043] The photoelectric detection material 12 testing system based on the BGA packaged front-end chip 15 provided by the present invention utilizes the position characteristics of the pins 16 of the BGA packaged front-end chip 15, and is connected to the pixel array array of the photoelectric detection material 12 through the via 17 array, so as to realize the three-dimensional heterogeneous integration of the material-integrated circuit, thereby reducing the difficulty of electrical connection between the material and the integrated circuit, and reducing the difficulty of wiring the integrated circuit on the PCB board 11; the material imaging is realized by processing and converting through analog circuits and digital circuits, and displaying using the display screen 14. The test system is suitable for the research and development of new photoelectric detection materials 12, and realizes the visual display of their imaging performance, and has the advantages of low cost, intuitive result display, low processing difficulty, short processing cycle, and high reusability.

[0044] The above are only a few embodiments of the present application and do not constitute any form of limitation to the present application. Although the present application is disclosed as above with preferred embodiments, it is not intended to limit the present application. Any technician familiar with the profession, without departing from the scope of the technical solution of the present application, using the technical content disclosed above to make slight changes or modifications are equivalent to equivalent implementation cases and fall within the scope of the technical solution.

Claims

1. A photoelectric detection material testing system based on BGA packaged front-end chips, characterized in that: The system comprises: A PCB board having a plurality of via holes disposed thereon; The photoelectric detection material is arranged on the first surface of the PCB board; the photoelectric detection material constitutes a plurality of independent pixels; each via hole corresponds to each pixel one by one; a common cathode is also arranged on the PCB board; the cathode of each pixel is electrically connected to the common cathode; A BGA packaged front-end chip is arranged on a second surface of the PCB board opposite to the first surface thereof, the BGA packaged front-end chip having a plurality of pins, each via hole corresponding to a pin, and the anode of each pixel is electrically connected to the corresponding pin through the corresponding via hole; An FPGA development board is electrically connected to the BGA packaged front-end chip and is used to package and transmit signals transmitted by the BGA packaged front-end chip; A display screen is electrically connected to the FPGA development board and is used for displaying the signals transmitted by the FPGA development board.

2. The system according to claim 1, characterized in that The plurality of via holes, the plurality of pixels and the plurality of pins are arranged in an array.

3. The system according to claim 1, characterized in that The photoelectric detection material is manufactured on the first surface of the PCB board by chemical water bath deposition or spraying.

4. The system according to claim 1, characterized in that The PCB board is electrically connected to the FPGA development board via a flat cable.

5. The system according to claim 1, characterized in that The BGA packaged front-end chip is soldered on the second surface of the PCB board.

6. The system according to claim 1 or 2, characterized in that: The pins include a signal input port, a signal output port, a power port and a control port; the signal input ports correspond one to one with the via array; The PCB board is also provided with a buffer module, a digital-to-analog conversion module and a data stream output port; the buffer module is electrically connected to the signal output port, the digital-to-analog conversion module is electrically connected to the buffer module, the data stream output port is connected to the digital-to-analog conversion module electrode, and the FPGA development board is electrically connected to the data stream output port.

7. The system according to claim 6, characterized in that The FPGA development board includes a control signal module, a serial-to-parallel conversion module, a dual-port RAM module, an HDMI module and an HDMI output port; The control signal module is electrically connected to the digital signal output port of the PCB board, the serial-to-parallel conversion module is electrically connected to the data stream output port, the dual-port RAM module is electrically connected to the serial-to-parallel conversion module, the HDMI module is electrically connected to the dual-port RAM module, the HDMI output port is electrically connected to the HDMI module; the display screen is electrically connected to the HDMI output port.

8. The system according to claim 1, characterized in that The FPGA development board is also used to perform image optimization processing on the signal transmitted by the BGA packaged front-end chip.

9. The system according to claim 1, characterized in that The FPGA development board is also used to highlight abnormal points of the signal transmitted by the BGA packaged front-end chip.

10. The system according to claim 1, characterized in that The BGA packaged front-end chip is a DDC264 chip.

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