Integrated circuit packaging structure and method

Abstract

The present invention relates to the technical field of integrated circuit packaging, and more specifically to an integrated circuit packaging structure and method; the integrated circuit packaging structure comprises a drawer, a bent plate arranged on the drawer, and a plurality of slide bars sliding at the bottom of the drawer; it also comprises a plurality of lower holes arranged at the bottom of the drawer, a box for sliding connection with the drawer, and a blocking door hinged on the box; the method for packaging an integrated circuit with the integrated circuit packaging structure comprises the following steps: S1: pulling out the drawer, and placing the integrated circuit upside down in the drawer; S2: pushing the drawer into the box, at which time a rubber block presses the integrated circuit, and then rotating the blocking door; S3: connecting the blocking door to the drawer by bolts, thereby fixing the drawer; S4: stacking a plurality of integrated circuit packaging structures by means of protrusions and grooves on the plurality of integrated circuit packaging structures, so as to realize centralized storage of a plurality of integrated circuits; the stability of the packaged integrated circuits can be ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and more particularly to an integrated circuit packaging structure and method. Background Art

[0002] An integrated circuit is a miniature electronic device or component. Using a certain process, the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit are interconnected and made on a small piece or several small pieces of semiconductor wafers or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function; the electronics industry continues to reduce the size of electronic components and continue to increase the functions of electronic components, which makes the functions and complexity of integrated circuits continue to increase, and also makes the existing structure of integrated circuits more and more complex; therefore, the existing integrated circuits are connected to a large number of diodes, resistors, capacitors and other electronic components, so when packaging the integrated circuit, it is necessary to pay attention to the stable placement of the integrated circuit to avoid the integrated circuit from shaking after packaging due to individual electronic components. Summary of the invention

[0003] To overcome the deficiencies of the prior art, the present invention provides an integrated circuit packaging structure and method, which can ensure the stability of the packaged integrated circuit.

[0004] The technical solution adopted by the present invention to solve its technical problem is:

[0005] An integrated circuit packaging structure comprises a drawer, a bent plate arranged on the drawer, and a plurality of slide bars sliding at the bottom of the drawer, wherein each slide bar is connected to the bottom of the drawer through a tension spring.

[0006] The invention further comprises a plurality of lower holes arranged at the bottom of the drawer, a box for sliding connection with the drawer, and a blocking door hinged on the box and capable of being detachably connected with the drawer.

[0007] Furthermore, the invention also comprises two slideways arranged on both sides of the box, each of which is slidably connected with a slide plate, and the slide plate can be detachably connected to the box.

[0008] A method for packaging an integrated circuit using the above integrated circuit packaging structure, the method comprising the following steps:

[0009] S1: Pull out the drawer and place the integrated circuit upside down in the drawer;

[0010] S2: Push the drawer into the box. The rubber block presses the integrated circuit and then the door is turned.

[0011] S3: Connect the door blocking and the drawer by bolts, so as to fix the drawer;

[0012] S4: stacking multiple integrated circuit packaging structures through protrusions and grooves on the multiple integrated circuit packaging structures, so as to realize centralized storage of multiple integrated circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present invention is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0014] Figure 1 It is a structural schematic diagram of the integrated circuit packaging structure of the present invention;

[0015] Figure 2 A schematic diagram of the structure of the integrated circuit packaging structure in another direction of the present invention;

[0016] Figure 3 It is a structural schematic diagram of the drawer in the present invention;

[0017] Figure 4 It is a schematic diagram of the structure of the side hole in the present invention;

[0018] Figure 5 is a schematic diagram of the structure of the teeth in the present invention;

[0019] Figure 6 It is a structural schematic diagram of the box in the present invention;

[0020] Figure 7 It is a structural schematic diagram of the slide plate in the present invention;

[0021] Figure 8 It is a structural schematic diagram of the transfer frame and gears in the present invention;

[0022] Fig. 9 It is a schematic diagram of the structure of the flat plate and the rubber block in the present invention;

[0023] Fig.10 It is a schematic structural diagram of the middle rod in the present invention. DETAILED DESCRIPTION

[0024] See also Figures 1 to 4 According to the figure, an exemplary working process of clamping the integrated circuit is:

[0025] Because a large number of electronic components such as diodes, resistors, capacitors, etc. are connected to existing integrated circuits, it is necessary to ensure that the integrated circuits are stably placed when packaging the integrated circuits to prevent the integrated circuits from swaying after packaging due to individual electronic components. Therefore, the integrated circuit packaging structure in the present application includes a drawer 01, a bent plate 06 is formed on one end of the drawer 01, and a plurality of slide bars 05 are slidably connected to the bottom of the drawer 01, and each slide bar 05 is connected to the bottom of the drawer 01 through a tension spring; when packaging the integrated circuit, the integrated circuit is inverted so that the electronic components such as diodes, resistors, capacitors, etc. connected to the integrated circuit are exposed to the pins of the circuit board upward, so that the diodes, resistors, capacitors, etc. connected to the integrated circuit are exposed to the pins of the circuit board upward, so that the diodes, resistors, The capacitors and other electronic components are facing downward, and then the integrated circuit is placed in the drawer 01. At this time, according to the shape of the integrated circuit and gravity, the diodes, resistors, capacitors and other electronic components located below press down the corresponding slide bars 05, so that the slide bars 05 without diodes, resistors, capacitors and other electronic components are supported on the circuit board, so that the integrated circuit is stably placed in the drawer 01 by sliding up and down multiple slide bars 05. At the same time, the multiple slide bars 05 are used to limit the diodes, resistors, capacitors and other electronic components in the horizontal direction to avoid the integrated circuit from moving horizontally on the multiple slide bars 05. Finally, according to the structure of the integrated circuit, the integrated circuit is stably placed in the drawer 01 to avoid shaking.

[0026] See also Figures 1 to 4 According to the figure, an exemplary working process of heat dissipation for integrated circuits is:

[0027] The integrated circuit packaging structure in the present application also includes a plurality of side holes 02 arranged on both sides of the drawer 01, and two filter papers 03 are fixedly connected to the inner wall of the drawer 01; when the integrated circuit is packaged after use, it is necessary to ensure good air circulation around the integrated circuit so that the integrated circuit can dissipate heat, so the multiple side holes 02 on both sides of the drawer 01 can allow air to flow, improve the air circulation inside the drawer 01 for heat dissipation, and at the same time, the two filter papers 03 can filter the air from the outside that flows into the drawer 01 through the multiple side holes 02, to prevent dust in the air from entering the large drawer 01 and sticking to the integrated circuit, causing the hidden danger of static electricity, thereby further ensuring the safety of the integrated circuit.

[0028] See also Figures 1 to 7 According to the figure, an exemplary working process for enhancing the heat dissipation effect is:

[0029] The integrated circuit packaging structure in the present application also includes a plurality of lower holes 04 arranged at the bottom of the drawer 01, a box 08 for sliding connection with the drawer 01, and a blocking door 09 hinged on the box 08 and detachably connected to the drawer 01; the drawer 01 can slide into the box 08; when in use, after the integrated circuit is placed in the drawer 01, the drawer 01 can be pushed into the box 08, at which time the plurality of lower holes 04 at the bottom of the drawer 01 can allow outside air to enter, and the hot air generated when the integrated circuit dissipates heat flows upward to drive the air below the drawer 01 to flow upward from the plurality of lower holes 04 to enhance the heat dissipation effect of the integrated circuit; similarly, a filter is attached to the bottom of the drawer 01 to filter the air flowing upward from the plurality of lower holes 04 to prevent dust from entering;

[0030] After the drawer 01 is pushed into the box 08, the blocking door 09 can be rotated, and the blocking door 09 and the drawer 01 can be connected by bolts, so as to fix the drawer 01 and prevent the drawer 01 from falling accidentally.

[0031] See also Figures 1 to 7 According to the figure, an exemplary working process for ensuring continuous heat dissipation of the integrated circuit is:

[0032] The integrated circuit packaging structure in the present application also includes two slides 10 arranged on both sides of the box 08, and a slide plate 11 is slidably connected to each slide 10, and the slide plate 11 can be detachably connected to the box 08; after the drawer 01 is pushed into the box 08, the slide plate 11 can be pulled so that the slide plate 11 opens the side of the box 08 to ensure the continued flow of air; thereby maintaining the heat dissipation effect after the integrated circuit is packaged; after the heat dissipation is completed, the slide plate 11 is pushed back, and the slide plate 11 is detachably connected to the box 08 by bolts, thereby sealing the integrated circuit in the box 08 after the heat dissipation is completed.

[0033] See also Figures 1 to 9 According to the figure, an exemplary working process of sealing the integrated circuit is:

[0034] The integrated circuit packaging structure in the present application also includes a card slot 12 arranged on the box 08, a rotating frame 13 rotating on the box 08, and a flat plate 15 detachably connected to the rotating frame 13, a sealing strip is arranged between the rotating frame 13 and the flat plate 15, and a sealing gasket is arranged around the card slot 12; after the drawer 01 is pushed into the box 08, the rotating frame 13 can be rotated down so that the rotating frame 13 enters the card slot 12, so that the rotating frame 13 drives the flat plate 15 to rotate, so that the rotating frame 13 and the flat plate 15 cover the upper part of the box 08 to achieve sealing, so that the integrated circuit can be sealed in the box 08.

[0035] See also Figures 1 to 8 According to the figure, an exemplary working process for opening the rotating frame 13 is as follows:

[0036] The integrated circuit packaging structure of the present application also includes two gears 14 arranged on both sides of the rotating frame 13, and a plurality of teeth 07 arranged on the drawer 01, and each gear 14 is meshed with the corresponding plurality of teeth 07; before packaging the integrated circuit, the rotating frame 13 is in a vertical state, and when the drawer 01 is pushed into the box 08, the gears 14 can be driven to rotate by the plurality of teeth 07 of the drawer 01, so that the gears 14 drive the rotating frame 13 to rotate downward into the card slot 12, so that the upper part of the box 08 is covered, and at this time, after the drawer 01 is fixed, the rotating frame 13 cannot be opened as long as the drawer 01 does not move, thereby further ensuring the safety of the integrated circuit;

[0037] At the same time, in order to facilitate opening of the rotating frame 13, when the drawer 01 moves outward in the box 08, the rotating frame 13 is driven to rotate by the plurality of teeth 07, so that the rotating frame 13 is automatically opened.

[0038] See also Figures 1 to 9 According to the figure, an exemplary working process of compacting the integrated circuit is:

[0039] The flat plate 15 is provided with a buckle, and the rubber block 16 can be connected to the buckle through a slot, so that the rubber block 16 can be quickly disassembled for replacement. Then, when the rotating frame 13 rotates, the rubber block 16 on the flat plate 15 can be rotated down to press on the pins of the diodes, resistors, capacitors and other electronic components connected to the integrated circuit that are exposed on the circuit board, so that the rubber block 16 uses its own elasticity to press the pins of the diodes, resistors, capacitors and other electronic components that are exposed on the circuit board, thereby cooperating with the support of multiple slide bars 05 to clamp the integrated circuit in the drawer 01, preventing the integrated circuit from shaking up and down, and further ensuring the stability of the integrated circuit.

[0040] See also Figures 1 to 10 According to the figure, an exemplary working process of centrally storing multiple integrated circuits is:

[0041] The integrated circuit packaging structure of the present application further includes a rotating sleeve 18 fixed on the box 08, a middle rod 17 rotating in the rotating sleeve 18, and protrusions 19 and grooves 20 respectively arranged at both ends of the middle rod 17; after a plurality of integrated circuits are respectively packaged into a plurality of integrated circuit packaging structures, the grooves 20 on the middle rod 17 in the upper integrated circuit packaging structure can be clamped on the protrusions 19 on the middle rod 17 in the lower integrated circuit packaging structure, thereby realizing stacking of the plurality of integrated circuit packaging structures and centralized storage of the plurality of integrated circuits;

[0042] At the same time, when taking out one of the integrated circuits separately, it is only necessary to move the box 08 to drive the rotating sleeve 18 to rotate on the corresponding middle rod 17, so that one of the integrated circuit packaging structures is rotated outside the range of the stacked multiple integrated circuit packaging structures, and then the integrated circuit can be taken out, while the other multiple integrated circuit packaging structures remain stacked in their original state.

Claims

1. An integrated circuit packaging structure, characterized in that: It comprises a drawer (01), a bent plate (06) arranged on the drawer (01), and a plurality of slide bars (05) sliding at the bottom of the drawer (01), each slide bar (05) being connected to the bottom of the drawer (01) via a tension spring; It also includes a plurality of side holes (02) arranged on both sides of the drawer (01), and two filter papers (03) fixed on the inner wall of the drawer (01); It also includes a plurality of lower holes (04) arranged at the bottom of the drawer (01), a box (08) for sliding connection with the drawer (01), and a blocking door (09) hinged on the box (08) and capable of being detachably connected to the drawer (01); A filter is attached to the bottom of the drawer (01); It also includes two slideways (10) arranged on both sides of the box (08), each of the slideways (10) being slidably connected to a slide plate (11), and the slide plate (11) can be detachably connected to the box (08); It also includes a card slot (12) arranged on the box (08), a rotating frame (13) rotating on the box (08), and a plate (15) detachably connected to the rotating frame (13); It also includes two gears (14) arranged on both sides of the rotating frame (13), and a plurality of teeth (07) arranged on the drawer (01), each gear (14) meshing with the corresponding plurality of teeth (07); The flat plate (15) is provided with a buckle, and the rubber block (16) can be connected to the buckle through a slot; It also includes a rotating sleeve (18) fixed on the box (08), a middle rod (17) rotating in the rotating sleeve (18), and a protrusion (19) and a groove (20) respectively arranged at both ends of the middle rod (17); After the plurality of integrated circuits are respectively packaged into the plurality of integrated circuit packaging structures, the groove (20) on the middle rod (17) in the upper integrated circuit packaging structure can be clamped on the protrusion (19) on the middle rod (17) in the lower integrated circuit packaging structure, so that the plurality of integrated circuit packaging structures are stacked; at the same time, when taking out one of the integrated circuits separately, the box (08) is moved to drive the rotating sleeve (18) to rotate on the corresponding middle rod (17), so that one of the integrated circuit packaging structures is rotated outside the range of the stacked plurality of integrated circuit packaging structures; When packaging the integrated circuit, the integrated circuit is turned upside down so that the pins of the electronic components connected to the integrated circuit are exposed on the circuit board and face upward, and the electronic components connected to the integrated circuit are faced downward, and then the integrated circuit is placed in the drawer (01). At this time, according to the shape of the integrated circuit and gravity, the electronic components located at the bottom press down the corresponding slide bars (05), so that the slide bars (05) without corresponding electronic components are supported on the circuit board, so that the integrated circuit is stably placed in the drawer (01) by sliding up and down the multiple slide bars (05), and at the same time, the multiple slide bars (05) are used to restrict the electronic components in the horizontal direction to prevent the integrated circuit from moving horizontally on the multiple slide bars (05). According to the structure of the integrated circuit, the integrated circuit is stably placed in the drawer (01) to avoid shaking.

2. The method for packaging an integrated circuit according to the integrated circuit packaging structure of claim 1, characterized in that: The method comprises the following steps: S1: Pull out the drawer (01), and place the integrated circuit upside down in the drawer (01); S2: Push the drawer (01) into the box (08), at which point the rubber block (16) presses the integrated circuit, and then the blocking door (09) is rotated; S3: Connecting the door blocking (09) to the drawer (01) by means of bolts, thereby completing the fixing of the drawer (01); S4: stacking the multiple integrated circuit packaging structures through the protrusions (19) and the grooves (20) on the multiple integrated circuit packaging structures, thereby realizing centralized storage of the multiple integrated circuits.

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