Electronic device with its thermal insulation module

Abstract

Embodiments of the present application relate to an electronic device and a heat insulation module. The electronic device includes a housing, a sensing module, and a heat insulation module. The sensing module includes a circuit board and a sensing unit and a heating unit disposed on the circuit board. The heating unit is configured to heat the sensing unit. The heat insulation module is housed in the housing and includes a housing assembly and a heat insulation filler. The sensing module is housed in the housing assembly. The heat insulation filler is disposed between the circuit board of the sensing module and an inner wall surface of the housing assembly and contacts and covers the heating unit.

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic device, in particular to an electronic device with a sensing module and an adiabatic module thereof. BACKGROUND

[0002] The so-called infrared thermal imager can extract the infrared thermal radiation of the measured object, and convert it into temperature to display the temperature distribution of the measured object in the form of image, so as to achieve remote, harmless, instant and continuous temperature monitoring in a certain wide temperature range.

[0003] In recent years, with the improvement of manufacturing technology and the reduction of cost of infrared thermal imagers, infrared thermal imagers with high image quality and low cost have gradually entered the consumer market, such as hospitals or long-term care centers, which need visual temperature monitoring. In recent years, due to the spread of various epidemics around the world, more and more public places have begun to install infrared thermal imagers to monitor the body temperature of the public.

[0004] Generally speaking, the operation of the infrared thermal imager needs to heat the internal sensing unit to a certain temperature. However, in the current infrared thermal imaging products on the market, the packaging shell for packaging the camera is a hard shell. However, there will inevitably be a gap between the hard shell and the heating unit used to heat the sensing unit due to manufacturing and assembly tolerances and other factors. This gap will cause heat convection around the heating unit, resulting in that the sensing unit needs to spend at least about 15-30 minutes to reach the required operating temperature after power-on, and some even need to preheat for up to an hour. Not only is the temperature response slow, but also it is quite energy-consuming, causing inconvenience in daily use. SUMMARY

[0005] Therefore, one of the purposes of the present application is to provide an electronic device and an adiabatic module to solve the above problems.

[0006] According to an embodiment of the present application, an electronic device is disclosed, comprising a housing, a sensing module and an adiabatic module. The sensing module comprises a circuit board and a sensing unit and a heating unit disposed on the circuit board. The heating unit is used to heat the sensing unit. The adiabatic module is housed in the housing and comprises a shell assembly and a thermal insulation filler. The sensing module is housed in the shell assembly. The thermal insulation filler is between the circuit board of the sensing module and the inner wall surface of the shell assembly, and contacts and covers the heating unit.

[0007] According to an embodiment of the present application, an adiabatic module is disclosed, comprising a shell assembly and a thermal insulation filler. The shell assembly is adapted to house a sensing module. The thermal insulation filler is adapted to be between a circuit board of the sensing module and an inner wall surface of the shell assembly, and contacts and covers a heating unit on the circuit board.

[0008] According to the electronic device and the heat insulation module disclosed in the foregoing embodiments of the present application, the inner wall surface of the heat insulation module and the heating unit of the sensing module are in contact and cover the heating unit of the sensing module, so that no air gap is formed between the heating unit and the heat insulation module, and the heat energy used by the heating unit to heat the sensing unit is not dissipated by heat convection, but is effectively concentrated on the heating sensing unit, so that the preheating time can be effectively shortened to five minutes.

[0009] Compared with the infrared thermal imaging products on the market, the infrared thermal imaging device using the heat insulation module of the present embodiment has a fast temperature response, saves electric energy, and improves the convenience of frequent use.

[0010] The above description of the present application and the following description of the embodiments are used to demonstrate and explain the spirit and principles of the present application, and provide further explanation of the claims of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0011] Fig. 1 It is a perspective view of an electronic device according to an embodiment of the present application.

[0012] Fig. 2 It is an exploded view of an electronic device according to an embodiment of the present application.

[0013] Fig. 3 It is a partial enlarged view of an electronic device according to an embodiment of the present application.

[0014] The reference signs are explained as follows:

[0015] 1 electronic device

[0016] 10 outer shell

[0017] 20 heat insulation module

[0018] 40 mainboard

[0019] 41 first side

[0020] 42 second side

[0021] 50 wire harness

[0022] 51 first end

[0023] 52 second end

[0024] 110 cover part

[0025] 130 Base Plate

[0026] 210 First Shell

[0027] 211 Plate Body

[0028] 213 Set-up Department

[0029] 200 Housing Assembly

[0030] 230 Second shell

[0031] 231 Abutment Board

[0032] 233 Side wall section

[0033] 250 thermal insulation filler

[0034] 2111 Zhou Yuan

[0035] 2113 First interlocking structure

[0036] 2311 Inner wall surface

[0037] 2331 Second interlocking structure

[0038] H heating unit

[0039] M metal layer

[0040] S-shaped cable routing

[0041] SM sensing module

[0042] SU sensing unit

[0043] P circuit board Detailed Implementation

[0044] The following detailed description of the features and advantages of the present invention will be provided by way of implementation. The content of this description is sufficient to enable any person skilled in the art to understand the technical content of the present invention and to implement it accordingly, but it is not intended to limit the scope of the present invention in any way.

[0045] The following embodiments will be described with reference to the accompanying drawings. For the sake of clarity, some conventionally used structures and components may be shown in a simplified schematic manner in the drawings. Furthermore, some features in the drawings may be slightly enlarged or their scale or size may be altered to facilitate understanding and viewing of the technical features of the present invention, but this is not intended to limit the invention. Additionally, for ease of viewing, some structural lines in some drawings may be indicated by dashed lines.

[0046] Moreover, the terms "terminal", "part", "portion", "region", "place", etc. can be used in the following description to describe particular elements and structures or particular technical features on or between them, but these elements and structures are not limited by these terms. The terms such as "substantially", "about", and "generally" can also be used in the following description to describe the amount of reasonable or acceptable deviation that can exist in the modified situation or event, but still achieve the desired results.

[0047] In addition, the term "at least one" can be used in the following description to describe the number of elements referred to, but unless otherwise explicitly stated, it should not be limited to the case where the number is "only one". The term "and / or" can also be used in the following description, which should be understood to include any combination of the listed items and one or more.

[0048] First, please refer to Figs. 1-3 An embodiment of the present application proposes an electronic device 1, which can be but is not limited to an infrared thermal imaging device, and which can obtain power by a built-in battery or by connecting an external power source, etc. In general, the electronic device 1 can include a housing 10 and a heat insulation module 20, which can be accommodated in the housing 10 and used to package or accommodate a sensing module SM, so that the sensing module SM is thermally insulated from the surrounding air. The sensing module SM can be but is not limited to an infrared camera, which has a sensing unit SU inside for sensing function and a heating unit H that can be powered to heat the sensing unit SU to a specific operating temperature required by the application, but the present application is not limited by the type and design of the sensing module SM and its predetermined operating temperature.

[0049] Specifically, in this embodiment, the housing 10 can be the appearance of the electronic device 1, which includes a cover portion 110 and a bottom plate portion 130, for example. The cover portion 110 is recessed inward on one side, which can be used to accommodate the aforementioned heat insulation module 20, and the cover portion 110 is provided with a through hole (not numbered) to expose the lens of the sensing module SM. The bottom plate portion 130 can be assembled and fixed to one side of the cover portion 110 by any suitable means such as screws (not numbered) to close and cover the heat insulation module 20 inside the cover portion 110. In an embodiment, when the bottom plate portion 130 is assembled and positioned on the cover portion 110, the cover portion 110 and the bottom plate portion 130 can clamp the heat insulation module 20 therebetween to further stabilize the position of the heat insulation module 20. At this point, it should be noted that the present application is not limited by the material, size, appearance design and assembly method of the cover portion 110 and the bottom plate portion 130, as long as the aforementioned requirements can be met.

[0050] In addition, in the present embodiment, the electronic device 1 can further include a main board 40. The main board 40 is accommodated in the outer housing 10, and is, for example, interposed between the thermal insulation module 20 and the bottom plate portion 130 of the outer housing 10, and can have, but is not limited to, electronic components such as a circuit, a connector, a microprocessor, and the like (all not shown) required for implementing various functions of the electronic device 1, driving the sensing module SM, and obtaining power, but the present application is not limited thereto. Here, the main board 40 is defined to have a first side 41 and a second side 42 opposite to each other, the first side 41 being a portion of the main board 40 facing the thermal insulation module 20 or the cover portion 110 of the outer housing 10, and the second side 42 being a portion of the main board 40 facing away from the thermal insulation module 20 or facing the bottom plate portion 130 of the outer housing 10.

[0051] In the present embodiment, the thermal insulation module 20 can be a portion of the electronic device 1 for packaging or accommodating the sensing module SM, and can include a housing assembly 200 and a thermal insulation filler 250. The housing assembly 200 can include a first housing member 210 and a second housing member 230. The first housing member 210 and the second housing member 230 cooperatively form an accommodation space (not labeled) for accommodating the aforementioned sensing module SM, the second housing member 230 can be sleeved on a side of the first housing member 210 to enclose and cover the sensing module SM inside the first housing member 210, and the thermal insulation filler 250 is interposed between the sensing module SM and the second housing member 230.

[0052] In detail, the first housing member 210 can include a plate body portion 211 and a sleeving portion 213, the sleeving portion 213 has a shape matched with that of the sensing module SM, and is adapted to accommodate at least a portion of the sensing module SM, the plate body portion 211 extends radially away from the sleeving portion 213 from around the sleeving portion 213, and the periphery of the plate body portion 211 has a peripheral edge 2111 extending toward the second housing member 230. In the present embodiment, the first housing member 210 can be, but is not limited to, a single-piece structure integrally formed, and can be made of, for example, rubber or silicone having elastic deformation properties and high weather resistance.

[0053] The second shell member 230 can include an abutting plate portion 231 and a side wall portion 233. The abutting plate portion 231 is a relatively flat portion of the second shell member 230 for abutting against the sensing module SM, and the side wall portion 233 extends from around the abutting plate portion 231 towards the first shell member 210. The side wall portion 233 cooperates with the abutting plate portion 231 to define a shape that substantially matches or is slightly larger than the contour of the plate body portion 211 of the first shell member 210, and is in interference fit with the peripheral edge 2111 of the plate body portion 211 to improve the assembly reliability between the first shell member 210 and the second shell member 230. In other words, the volume enclosed by the second shell member 230 is larger than the volume enclosed by the first shell member 210, so that the first shell member 210 can be fitted into the second shell member 230, and the plate body portion 211 of the first shell member 210 can be in close fit with the side wall portion 233 of the second shell member 230.

[0054] In the present embodiment, the second shell member 230 can be, but is not limited to, a single-piece structure formed integrally, but has different properties from the first shell member 210. Specifically, the second shell member 230 is composed of a suitable material having a higher hardness than the first shell member 210, such as a plastic material such as thermoplastic polyurethane (TPU). In this configuration, the first shell member 210 has a higher coefficient of elasticity or deformation capacity than the second shell member 230. Such a difference in material helps to perform or improve the interference fit of the first shell member 210 into the second shell member 230 or the second shell member 230 onto the first shell member 210, not only facilitating assembly, but also ensuring that the sensing module is tightly covered. However, it should be noted that as long as the hardness of the second shell member is greater than that of the first shell member, the materials of the two can be appropriately selected according to actual needs, and the present application is not limited by the difference in hardness or the actual material selected.

[0055] In addition, as shown, the peripheral edge 2111 of the first shell member 210 is formed with at least one first engagement structure 2113, such as a groove recessed towards the accommodation space from the peripheral edge 2111. Correspondingly, the side wall portion 233 of the second shell member 230 is formed with at least one second engagement structure 2331 recessed towards the accommodation space, which substantially matches the first engagement structure 2113 in shape, to further ensure the position of the first shell member 210 when the second shell member 230 is fitted onto the first shell member 210, and also helps to position the first shell member 210 and the second shell member 230 during assembly. However, as long as the assembly of the first shell member and the second shell member meets the requirements, other embodiments of the heat insulation module can also omit the aforementioned first engagement structure and second engagement structure.

[0056] The heat insulation filler 250 can be, but is not limited to, a material with suitable properties such as heat insulation, electrical insulation, and elastic deformation, and is arranged on the inner wall surface 2311 of the abutting plate portion 231 of the second casing member 230 to press against the sensing module SM on the first casing member 210 when the second casing member 230 is assembled to the first casing member 210, and to fill the gap between the sensing module SM and the second casing member 230.

[0057] In particular, the sensing module SM can include a circuit board P, and the heating unit H for heating the sensing unit SU is arranged on the surface of the circuit board P facing the second casing member 230. Due to the material properties of the heat insulation filler 250, when the second casing member 230 is assembled to the first casing member 210, the heat insulation filler 250 can be deformed by the pressing of the heating unit H on the sensing module SM, thereby filling the space between the heating unit H and the circuit board P, and further completely covering the heating unit H of the sensing module SM so that there is no air gap around the surface of the heating unit H. In other words, the heat insulation filler 250 can be filled between the circuit board P of the sensing module SM and the inner wall surface 2311 of the casing assembly 200 to directly contact and cover the circuit board P, the heating unit H thereon, and the inner wall surface 2311 of the casing assembly 200 of the sensing module SM, thereby ensuring that there is no air gap around the surface area of the heating unit H protruding from the circuit board P. It can be understood that the thickness of the heat insulation filler 250 when not deformed is at least sufficient to fill the gap between the heating unit H and the circuit board P when it is pressed by the heating unit H.

[0058] In this case, the heating unit H for heating the sensing unit SU to a predetermined operating temperature will not have heat convection with the surrounding environment during the heating process, i.e., the thermal energy of the heating unit H will not be lost due to air convection, so the heating unit H can effectively provide heat to the sensing unit SU in a short time to raise the sensing unit SU to the required temperature. According to experimental analysis results, the elimination of the air gap between the heating unit of the sensing module and the casing by the heat insulation module of the present embodiment can effectively shorten the preheating time to five minutes. Compared with the infrared thermal imaging products on the market, which need to take 15 to 30 minutes or more to reach the required operating temperature due to the heat convection gap during the heating process of the heating unit, the infrared thermal imaging device using the heat insulation module of the present embodiment has fast temperature response, not only saving electric energy, but also improving the convenience of frequent use.

[0059] In addition, because the soft thermal insulation filler 250 is interposed between the sensing module SM and the inner wall surface of the housing assembly 200 (e.g., the inner wall surface 2311 of the abutting plate portion 231 of the second shell member 230), the second shell member 230 can normally provide a pre-tightening pressure to the sensing module SM via the thermal insulation filler 250, and the sealing effect of the thermal insulation filler 250 on the heating unit H can be further ensured.

[0060] In addition, it is further noted that, in order to electrically connect the main board 40 to the sensing module SM in the thermal insulation module 20, in the present embodiment, the electronic device 1 can further include a wire 50 that can enter the interior of the thermal insulation module 20 from outside the thermal insulation module 20 via a wire slot S, so that a first end 51 and a second end 52 opposite to each other of the wire 50 can be electrically connected to the second side 42 of the main board 40 and a side of the circuit board P of the sensing module SM facing the thermal insulation filler 250, respectively. The wire slot S can be an elongated hole formed on one of the abutting plate portion 231 and the side wall portion 233 of the second shell member 230 or at the connection between the abutting plate portion 231 and the side wall portion 233, and is adapted to allow the wire 50 to pass through. As shown, at least a portion of the wire 50 is interposed between the second shell member 230 and the thermal insulation filler 250 in the thermal insulation module 20.

[0061] In addition, in an embodiment, the electronic device 1 can further include a metal layer M interposed between the thermal insulation filler 250 and the abutting plate portion 231 of the second shell member 230 and positioned corresponding to the sensing module SM. The metal layer M can be made of any suitable electromagnetic interference (EMI) material, thereby helping to achieve an electromagnetic shielding effect on the sensing module SM, but the metal layer M can be selected, and the present application is not limited thereto.

[0062] According to the electronic device and the thermal insulation module disclosed in the foregoing embodiments of the present application, because the soft thermal insulation filler is interposed between the inner wall surface of the housing assembly of the thermal insulation module (e.g., the inner wall surface of the abutting plate portion of the second shell member) and the sensing module, the air gap between the heating unit for preheating the sensing unit and the circuit board of the sensing module can be filled, so that the heat energy for warming the sensing unit cannot be dissipated by heat convection, but can be effectively concentrated on the sensing unit, thereby effectively shortening the preheating time to within five minutes.

[0063] Compared with the infrared thermal imaging products on the market, which need to take 15 minutes to 1 hour to reach the required operating temperature due to the heat convection caused by the inevitable gap between the hard shell and the heating unit during the heating process, the infrared thermal imaging device using the thermal insulation module of the present embodiment has a fast temperature response, saves electric energy, and improves the convenience of frequent use.

[0064] And, due to the soft characteristic of the heat insulation filler, the second shell member can normally provide a pre-tightening pressure to the sensing module via the heat insulation filler, and can better ensure the sealing and heat insulation effect on the heating unit.

[0065] In addition, the first shell member of the heat insulation module has a lower material hardness or a higher elastic coefficient than the second shell member, which helps to perform or improve the interference fit of inserting the first shell member into the second shell member or sleeving the second shell member on the first shell member, which not only facilitates assembly, but also ensures that the sensing module can be tightly covered.

[0066] Although the present application is disclosed with the above-mentioned embodiments, it is not intended to limit the present application. Any modification and improvement made without departing from the spirit and scope of the present application shall fall within the scope of the patent protection of the present application. For the scope of protection of the present application, please refer to the appended claims.

Claims

1. An electronic device, characterized in that, Include: An outer shell; A sensing module includes a circuit board and a sensing unit and a heating unit disposed on the circuit board, wherein the heating unit is used to heat the sensing unit; and A thermal insulation module is housed within the housing, comprising a housing assembly and a thermal insulation filler, wherein the sensing module is housed within the housing assembly, and the thermal insulation filler is located between the circuit board of the sensing module and an inner wall surface of the housing assembly, contacting and covering the heating unit; The heat insulation filler is deformed by the compression of the heating unit, thereby filling the space between the heating unit and the circuit board and completely covering the heating unit, so that there are no air gaps around the surface of the heating unit. The thickness of the heat insulation filler when it is not deformed is at least sufficient to fill the gap between the heating unit and the circuit board when it is compressed by the heating unit.

2. The electronic device as claimed in claim 1, characterized in that, The thermal insulation filler contacts the surface of the circuit board and the inner wall surface of the housing assembly.

3. The electronic device as claimed in claim 1, characterized in that, The thermal insulation filler is electrically insulating.

4. The electronic device as claimed in claim 1, characterized in that, The housing assembly includes a first housing member and a second housing member assembled together, the first housing member and the second housing member together forming an accommodating space suitable for accommodating the heat insulation filler and the sensing module, the material hardness of the first housing member being less than that of the second housing member.

5. The electronic device as claimed in claim 4, characterized in that, The first shell and the second shell are interference fit.

6. The electronic device as claimed in claim 1, characterized in that, The sensing module is an infrared camera.

7. The electronic device as claimed in claim 1, characterized in that, It also includes a motherboard and a ribbon cable. The motherboard is located outside the housing assembly. The housing assembly has a ribbon cable through-slot. The ribbon cable passes through the ribbon cable through-slot and is electrically connected to the sensing module and the motherboard. At least a portion of the ribbon cable is located between the heat insulation filler and the inner wall surface of the housing assembly.

8. The electronic device as claimed in claim 1, characterized in that, The insulation module also includes a metal layer between the insulation filler and the inner wall surface of the housing assembly, and corresponding to the sensing module.

9. A thermal insulation module, characterized in that, Include: A housing assembly suitable for accommodating a sensing module; and A thermal insulation filler is suitable for being located between a circuit board of the sensing module and an inner wall surface of the housing assembly, contacting and covering a heating unit on the circuit board; The heat insulation filler is deformed by the compression of the heating unit, thereby filling the space between the heating unit and the circuit board and completely covering the heating unit, so that there are no air gaps around the surface of the heating unit. The thickness of the heat insulation filler when it is not deformed is at least sufficient to fill the gap between the heating unit and the circuit board when it is compressed by the heating unit.

10. The thermal insulation module as described in claim 9, characterized in that, The thermal insulation filler is adapted to contact the surface of the circuit board of the sensing module and the inner wall surface of the housing assembly.

11. The thermal insulation module as described in claim 9, characterized in that, The thermal insulation filler is electrically insulating.

12. The thermal insulation module as described in claim 9, characterized in that, The housing assembly includes a first housing member and a second housing member assembled together, the first housing member and the second housing member together forming an accommodating space suitable for accommodating the heat insulation filler and the sensing module, the material hardness of the first housing member being less than that of the second housing member.

13. The thermal insulation module as described in claim 12, characterized in that, The first shell and the second shell are interference fit.

14. The thermal insulation module as described in claim 9, characterized in that, The housing assembly is provided with a cable pass-through groove, which is suitable for a cable to pass through to the space between the thermal insulation filler and the inner wall surface of the housing assembly.

15. The thermal insulation module as described in claim 9, characterized in that, It also includes a metal layer between the thermal insulation filler and the inner wall surface of the housing assembly, and is adapted to correspond to the sensing module.

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