Touch screen sensor integrated with FPC flexible circuit, touch screen and preparation method thereof

Abstract

The invention relates to a touch screen sensor integrated with an FPC flexible circuit, a touch screen and a preparation method thereof. A capacitance driving layer, a first OC layer, a capacitance sensing layer and a second OC layer are sequentially arranged on the surface of a substrate, or a capacitance sensing layer, a first OC layer, a capacitance driving layer and a second OC layer are sequentially arranged on the surface of the substrate. The edge routing of the capacitance sensing layer and the capacitance driving layer is integrated in a binding area and then led to a connection area. The FPC flexible circuit is integrated on the sensor, the production process is simple, and the production efficiency is improved by 1 to 2 times; no ACF attachment process and FPC main pressing process are required, and poor appearance such as pressure bubbles and indentations and poor functions such as broken wires and ACF conductive particle aggregation will occur, and the process yield rate is improved from 95% to 98%; the connection area formed by the metal lead of the sensor does not need a hard FPC, and the soft substrate does not have the problem of fracture. The connection area formed by the sensor lead is directly hot-pressed with a PCB board, and no connector is required, and the metal lead will not fall off due to frequent plugging and unplugging.

Description

Technical Field

[0001] The present invention belongs to the technical field of touch screens, and in particular relates to a touch screen sensor integrated with an FPC flexible circuit, a touch screen and a preparation method thereof. Background Art

[0002] The sensor circuit of a conventional touch screen is composed of a capacitive sensing layer, a substrate, a capacitive driving layer, ACF, FPC, PCB and other materials. Figure 1 and Figure 2 The capacitive sensing layer and the capacitive driving layer are located on both sides of the substrate. The capacitive sensing layer, the substrate, and the capacitive driving layer constitute a sensor. The leads of the capacitive sensing layer and the capacitive driving layer are finally integrated on one side of the substrate to form a binding area. The external FPC gold finger area is bonded to the sensor binding area through ACF. The ACF anisotropic conduction characteristics are used to realize the conduction of the sensor's RX and TX. The FPC plug-in end is then connected using a PCB board or a connector to realize the reception and transmission of IC signals.

[0003] Conventional touch screens have the following problems: (1) The production process is complex, the cost is high, and the production efficiency is low; (2) It requires an ACF attachment process and an FPC pressing process, which can easily cause appearance defects such as bubbles and indentations, as well as functional defects such as broken wires and aggregation of ACF conductive particles; (3) The FPC has a large area and requires frequent bending and plugging during use, which can easily lead to broken circuits within the FPC and metal shedding at the FPC plug-in end, resulting in functional defects and other problems. Summary of the invention

[0004] The present invention provides a touch screen sensor integrated with an FPC flexible circuit, a touch screen and a preparation method thereof, which can simplify the touch screen production process, reduce production costs, improve process yield, and enhance the appearance yield and function yield of the touch screen to solve existing technical problems.

[0005] In order to solve the above technical problems, the touch screen sensor with integrated FPC flexible circuit of the present invention comprises a substrate,

[0006] The surface of the substrate is provided with a capacitor driving layer, a first OC layer, a capacitor sensing layer and a second OC layer in sequence; the substrate is a highly transparent flexible substrate; the capacitor driving layer is a copper conductive layer formed by coating on the surface of the substrate, and edge routing and in-plane metal grids are obtained by a yellow light process of exposure, development and etching for transmitting signals, and the edge routing of the capacitor driving layer is led to the binding area and then to the connection area; the first OC layer is formed by curing a high-transmittance transparent insulating ink printed on the surface of the capacitor driving layer; the capacitor sensing layer is a copper conductive layer formed by coating on the surface of the first OC layer, and edge routing and in-plane metal grids are obtained by a yellow light process of exposure, development and etching for receiving signals, and the edge routing of the capacitor sensing layer is led to the binding area and then to the connection area; the second OC layer is formed by curing a high-transmittance transparent insulating ink printed on the surface of the capacitor sensing layer; the edge routing of the capacitor sensing layer and the capacitor driving layer are integrated in the binding area and then led to the connection area;

[0007] Alternatively, a capacitive sensing layer, a first OC layer, a capacitive driving layer and a second OC layer are sequentially provided on the surface of the substrate; the substrate is a highly transparent flexible substrate; the capacitive sensing layer is a copper conductive layer formed by coating on the surface of the substrate, and edge routing and an in-plane metal grid are obtained by a yellow light process of exposure, development and etching for receiving signals, and the edge routing of the capacitive sensing layer is led to a binding area and then to a connection area; the first OC layer is formed by curing a high-transmittance transparent insulating ink printed on the surface of the capacitive sensing layer; the capacitive driving layer is a copper conductive layer formed by coating on the surface of the first OC layer, and edge routing and an in-plane metal grid are obtained by a yellow light process of exposure, development and etching for transmitting signals, and the edge routing of the capacitive driving layer is led to a binding area and then to a connection area; the second OC layer is formed by curing a high-transmittance transparent insulating ink printed on the surface of the capacitive driving layer; the edge routing of the capacitive sensing layer and the capacitive driving layer are integrated in the binding area and then led to the connection area.

[0008] Furthermore, the substrate is one of PET, COP, TAC, PI and PC. The highly transparent substrate is used to carry the capacitive sensing layer and the capacitive driving layer, and these flexible substrates have excellent bending and folding properties.

[0009] Furthermore, the thickness of the substrate is 38 μm to 125 μm.

[0010] Furthermore, the thickness of the capacitive driving layer and the capacitive sensing layer are both 1 μm.

[0011] Furthermore, the components of the high-transmittance transparent insulating ink of the first OC layer and the second OC layer mainly include a resin mixture such as PMMA, polyol and acrylic acid.

[0012] The present invention also provides a touch screen with integrated FPC flexible circuit, comprising the aforementioned touch screen sensor with integrated FPC flexible circuit, and also comprising a PCB, wherein a PIN port of the PCB is hot-pressed together with a connection area formed by a capacitive sensing layer and a capacitive driving layer to conduct the circuit of the touch screen and realize electrical functions.

[0013] The present invention also provides a method for preparing a touch screen with an integrated FPC flexible circuit, comprising the following steps:

[0014] S1: a copper metal layer is evaporated on the surface of the substrate, and an in-plane metal grid and edge wiring are obtained by exposure, development, and etching to form a capacitor driving layer. The edge wiring of the capacitor driving layer is led to the binding area and then to the connection area;

[0015] S2: Printing high-transmittance transparent insulating ink on the surface of the capacitor driving layer using a screen printer, and forming a first OC layer after curing;

[0016] S3: a copper metal layer is evaporated on the surface of the first OC layer, and an in-plane metal grid and edge wiring are obtained through exposure, development, and etching to form a capacitive sensing layer. The edge wiring of the capacitive sensing layer is led to the binding area and then to the connection area;

[0017] S4: Printing high-transmittance transparent insulating ink on the surface of the capacitive sensing layer using a screen printer, and forming a second OC layer after curing;

[0018] S5: After punching the shape, the touch screen sesnor with integrated FPC flexible circuit is formed;

[0019] S6: hot pressing the connection area of ​​the PIN port of the PCB and the touch screen sesnor integrated with the FPC flexible circuit obtained in step S5 to achieve electrical functional conduction.

[0020] The present invention also provides another method for preparing a touch screen integrated with an FPC flexible circuit, comprising the following steps:

[0021] S1: a copper metal layer is evaporated on the surface of the substrate, and an in-plane metal grid and edge wiring are obtained by exposure, development, and etching to form a capacitive sensing layer. The edge wiring of the capacitive sensing layer is led to the binding area and then to the connection area;

[0022] S2: Printing high-transmittance transparent insulating ink on the surface of the capacitive sensing layer using a screen printer, and forming a first OC layer after curing;

[0023] S3: a copper metal layer is evaporated on the surface of the first OC layer, and an in-plane metal grid and edge wiring are obtained through exposure, development, and etching to form a capacitor driving layer. The edge wiring of the capacitor driving layer is led to the binding area and then to the connection area;

[0024] S4: Printing high-transmittance transparent insulating ink on the surface of the capacitor driving layer using a screen printer, and forming a second OC layer after curing;

[0025] S5: After punching the shape, the touch screen sesnor with integrated FPC flexible circuit is formed;

[0026] S6: hot pressing the connection area of ​​the PIN port of the PCB and the touch screen sesnor integrated with the FPC flexible circuit obtained in step S5 to achieve electrical functional conduction.

[0027] Furthermore, the main components of the high-transmittance transparent insulating ink in steps S2 and S4 mainly include a resin mixture of PMMA, polyol, acrylic acid, etc., and the curing method is UV curing or baking or IR type thermal curing. The transmittance of the first OC layer and the second OC layer is 99%.

[0028] Furthermore, the thickness of the capacitive sensing layer and the capacitive driving layer are both 1 μm, the thickness of the first OC layer and the second OC layer are both 1 μm, and the substrate is a PET substrate, and the thickness of the substrate is 50 μm.

[0029] The touch screen sensor and touch screen with integrated FPC flexible circuit do not need to be bound to FPC. The FPC flexible circuit is integrated on the sensor, which has the following advantages compared with conventional touch screens:

[0030] (1) The production process is simple, the cost is low, and the production efficiency is increased by 1 to 2 times;

[0031] (2) No ACF, no FPC, no ACF attachment process and FPC pressing process are required. There will be no appearance defects such as pressing bubbles and indentations, and no functional defects such as broken wires and ACF conductive particle aggregation. The process yield is increased from 95% to 98%;

[0032] (3) The connection area formed by the sensor metal lead does not require a hard FPC, and the soft substrate will not have problems such as breakage. The connection area formed by the sensor lead is directly hot-pressed with the PCB board, and no connector is required, so there will be no frequent plugging and unplugging, which will not cause the metal lead to fall off. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The specific implementation of the present invention will be further explained below in conjunction with the accompanying drawings.

[0034] Figure 1 This is a schematic diagram of the sensor circuit of a conventional touch screen;

[0035] Figure 2 This is a schematic diagram of the sensor structure of a conventional touch screen;

[0036] Figure 3 It is a schematic diagram of the sensor circuit of the touch screen of the present invention;

[0037] Figure 4a This is a schematic diagram of the structure of a touch screen sensor in Embodiment 1 of the present invention;

[0038] Figure 4b This is a schematic diagram of the touch screen sensor structure in Example 2 of the present invention;

[0039] Figure 5 This is a schematic diagram of the edge routing of a conventional capacitive sensing layer;

[0040] Figure 6 This is a schematic diagram of the edge wiring of the capacitive sensing layer of the present invention;

[0041] Figure 7 This is a schematic diagram of the edge routing of the conventional capacitor drive layer;

[0042] Figure 8 This is a schematic diagram of the edge wiring of the capacitor driving layer of the present invention;

[0043] Fig. 9 This is a schematic diagram of the binding area and FPC of a conventional touch screen;

[0044] Fig.10 It is a schematic diagram of the connection area without FPC of the present invention. DETAILED DESCRIPTION

[0045] Example 1

[0046] Combination Figure 3 , Figure 4a , Figure 6 , Figure 8 and Fig.10The touch screen sensor with integrated FPC flexible circuit of this embodiment comprises a substrate 1, on the surface of which a capacitive driving layer 2, a first OC layer 31, a capacitive sensing layer 4 and a second OC layer 32 are sequentially arranged; the substrate 1 is a highly transparent flexible substrate; the capacitive driving layer 2 is a copper conductive layer formed by coating on the surface of the substrate 1, and an edge wiring and an in-plane metal grid are obtained by a yellow light process of exposure, development and etching for transmitting signals, and the edge wiring of the capacitive driving layer 2 is led to a binding area 5 and then to a connection area 6; the first OC layer 31 is printed on the capacitive sensing layer 4 and the capacitive sensing layer 4 ... The high-transmittance transparent insulating ink on the surface of the driving layer 2 is formed by curing; the capacitive sensing layer 4 is a copper conductive layer formed by plating on the surface of the first OC layer 31, and the edge routing and the in-plane metal grid are obtained by a yellow light process of exposure, development, and etching, which are used to receive signals. The edge routing of the capacitive sensing layer 4 is led to the binding area 5 and then to the connection area 6; the second OC layer 32 is formed by curing the high-transmittance transparent insulating ink printed on the surface of the capacitive sensing layer 4; the edge routing of the capacitive sensing layer 4 and the capacitive driving layer 2 is integrated in the binding area 5 and then led to the connection area 6.

[0047] In this embodiment, the substrate 1 is preferably one of PET, COP, TAC, PI and PC. The highly transparent substrate 1 is used to carry the capacitive sensing layer 4 and the capacitive driving layer 2. These flexible substrates have excellent bending and folding properties. In this embodiment, the substrate 1 is a PET substrate.

[0048] In this embodiment, the thickness of the substrate 1 is preferably 38 μm to 125 μm. In this embodiment, the thickness of the substrate 1 is 50 μm.

[0049] Preferably, in this embodiment, the thickness of the capacitive driving layer 2 and the capacitive sensing layer 4 are both 1 μm.

[0050] In this embodiment, preferably, the components of the high-transmittance transparent insulating ink of the first OC layer 31 and the second OC layer 32 mainly include a resin mixture such as PMMA, polyol and acrylic acid. The transmittance of the first OC layer 31 and the second OC layer 32 is as high as 99%, which has no effect on the appearance of the entire touch screen. The curing method can be UV curing, baking or IR type thermal curing, and the thickness is about 1um, which can well protect the capacitive sensing layer 4 and the capacitive driving layer 2 from corrosion, and at the same time can improve the overall transmittance. Generally speaking, the transmittance can be increased by about 1% after printing the first OC layer 31 and the second OC layer 32.

[0051] The present embodiment also provides a touch screen with integrated FPC flexible circuit, including the aforementioned touch screen sensor with integrated FPC flexible circuit, and also including PCB, wherein the PIN port of the PCB is hot pressed together with the connection area 6 formed by the capacitive sensing layer 4 and the capacitive driving layer 2 to conduct the circuit of the touch screen and realize the electrical function.

[0052] The method for preparing a touch screen with integrated FPC flexible circuit of this embodiment comprises the following steps:

[0053] S1: a copper metal layer is evaporated on the surface of the substrate 1, and an in-plane metal grid and edge wiring are obtained by exposure, development, and etching to form a capacitive driving layer 2. The edge wiring of the capacitive driving layer 2 is led to the binding area 5 and then to the connection area 6;

[0054] S2: Printing high-transmittance transparent insulating ink on the surface of the capacitor driving layer 2 using a screen printer, and forming a first OC layer 31 after curing;

[0055] S3: a copper metal layer is evaporated on the surface of the first OC layer 31, and an in-plane metal grid and edge wiring are obtained by exposure, development and etching to form a capacitive sensing layer 4. The edge wiring of the capacitive sensing layer 4 is led to the binding area 5 and then to the connection area 6;

[0056] S4: Printing a high-transmittance transparent insulating ink on the surface of the capacitive sensing layer 4 using a screen printer, and forming a second OC layer 32 after curing;

[0057] S5: After punching the shape, the touch screen sesnor with integrated FPC flexible circuit is formed;

[0058] S6: hot pressing the PIN port of the PCB and the connection area 6 of the touch screen sesnor integrated with the FPC flexible circuit obtained in step S5 to achieve electrical functional conduction.

[0059] Preferably, in this embodiment, the main components of the high-transmittance transparent insulating ink in steps S2 and S4 mainly include a resin mixture such as PMMA, polyol, acrylic acid, etc., and the curing method is UV curing or baking or IR type thermal curing. The transmittance of the first OC layer 31 and the second OC layer 32 is 99%.

[0060] Preferably, in this embodiment, the thickness of the capacitive sensing layer 4 and the capacitive driving layer 2 are both 1 μm, the thickness of the first OC layer 31 and the second OC layer 32 are both 1 μm, the substrate 1 is a PET substrate, and the thickness of the substrate 1 is 50 μm.

[0061] Combination Figure 5 and Figure 7The edge wiring of the capacitive sensing layer of a conventional touch screen will be led to the binding area, which is used to connect the gold finger area of ​​the FPC PIN end when binding the FPC. The edge wiring of the capacitive driving layer of a conventional touch screen will be led to the binding area, which is used to connect the gold finger area of ​​the FPC PIN end when binding the FPC.

[0062] Combination Figure 6 and Figure 8 The edge wiring of the capacitive sensing layer 4 of the touch screen sensor of this embodiment will be led to the binding area 5 and then to the original FPC position, that is, the connection area 6, and the internal circuit of the FPC is integrated on the sensor to form a capacitive sensing layer 4 with FPC function, without the need for FPC, ACF bonding and FPC binding; the edge wiring of the capacitive driving layer 2 of the touch screen sensor of this embodiment will be led to the binding area 5 and then to the original FPC position, that is, the connection area 6, and the internal circuit of the FPC is integrated on the sensor to form a capacitive driving layer 2 with FPC function, without the need for FPC, ACF bonding and FPC binding.

[0063] Combination Fig. 9 The leads formed by the capacitive sensing layer and the capacitive driving layer of conventional touch screens are integrated in the binding area. The FPC gold finger end needs to be pressed together with the binding area through ACF. After the ACF is pressed, the conductive particles are broken to connect the FPC gold finger end with the binding area to achieve electrical function. Then the FPC plug-in end is connected to the PCB board through plug-in to achieve connectivity. The ACF lamination process and the FPC pressing process are complex and have low production efficiency. They are prone to poor appearance such as bubbles and indentations, as well as poor functions such as broken wires and aggregation of ACF conductive particles. Frequent plugging and unplugging of the PCB can easily cause the metal at the FPC plug-in end to fall off, resulting in poor electrical properties.

[0064] Combination Fig.10 In this embodiment, the touch screen sensor and touch screen with integrated FPC flexible circuit do not need to be bound to FPC. The leads formed by the capacitive sensing layer 4 and the capacitive driving layer 2 of the touch screen sensor are integrated in the binding area 5 and then led to the original FPC position. Since the leads of the capacitive sensing layer 4 and the capacitive driving layer 2 are extended to the original FPC position to form the connection area 6, an integrated sensor without FPC but with FPC function is realized. The connection area 6 of the integrated sensor is hot pressed through the PCB, and there is no need to repeatedly plug and unplug the connector on the PCB to achieve electrical function conduction. This integrated sensor does not require ACF and FPC, does not require a connector, does not require an ACF attachment process and an FPC pressing process, has a simple process technology, high production efficiency, will not allow the appearance of poor pressure bubbles, indentations and other poor functions and broken wires, ACF conductive particle aggregation and other poor functions, and does not require frequent plugging and unplugging of the PCB to cause metal shedding.

[0065] Example 2

[0066] Combination Figure 3 , Figure 4b , Figure 6 , Figure 8 and Fig.10 The touch screen sensor with integrated FPC flexible circuit of this embodiment comprises a substrate 1, on the surface of which a capacitive sensing layer 4, a first OC layer 31, a capacitive driving layer 2 and a second OC layer 32 are sequentially arranged; the substrate 1 is a highly transparent flexible substrate; the capacitive sensing layer 4 is a copper conductive layer formed by plating on the surface of the substrate 1, and an edge wiring and an in-plane metal grid are obtained by a yellow light process of exposure, development and etching for receiving signals, and the edge wiring of the capacitive sensing layer 4 is led to a binding area 5 and then to a connection area 6; the first OC layer 31 is printed on the capacitive sensing layer 4, and the capacitive sensing layer 4 is a copper conductive layer formed by plating on the surface of the substrate 1, and the edge wiring and the ..., and the edge wiring of the capacitive sensing layer 4 is led to a binding area 5 and then to a connection area 6; the first OC layer 31 is printed on the capacitive sensing layer 4, and the capacitive sensing layer 4 is a copper conductive layer formed by plating on the The high-transmittance transparent insulating ink on the surface of the sensing layer 4 is formed by curing; the capacitive driving layer 2 is a copper conductive layer formed by plating on the surface of the first OC layer 31, and the edge routing and the in-plane metal grid are obtained by a yellow light process of exposure, development, and etching, which are used to transmit signals. The edge routing of the capacitive driving layer 2 is led to the binding area 5 and then to the connection area 6; the second OC layer 32 is formed by curing the high-transmittance transparent insulating ink printed on the surface of the capacitive driving layer 2; the edge routing of the capacitive sensing layer 4 and the capacitive driving layer 2 is integrated in the binding area 5 and then led to the connection area 6.

[0067] In this embodiment, the substrate 1 is preferably one of PET, COP, TAC, PI and PC. The highly transparent substrate 1 is used to carry the capacitive sensing layer 4 and the capacitive driving layer 2. These flexible substrates have excellent bending and folding properties. In this embodiment, the substrate 1 is a PET substrate.

[0068] In this embodiment, the thickness of the substrate 1 is preferably 38 μm to 125 μm. In this embodiment, the thickness of the substrate 1 is 50 μm.

[0069] Preferably, in this embodiment, the thickness of the capacitive driving layer 2 and the capacitive sensing layer 4 are both 1 μm.

[0070] In this embodiment, preferably, the components of the high-transmittance transparent insulating ink of the first OC layer 31 and the second OC layer 32 mainly include a resin mixture such as PMMA, polyol and acrylic acid. The transmittance of the first OC layer 31 and the second OC layer 32 is as high as 99%, which has no effect on the appearance of the entire touch screen. The curing method can be UV curing, baking or IR type thermal curing, and the thickness is about 1um, which can well protect the capacitive sensing layer 4 and the capacitive driving layer 2 from corrosion, and at the same time can improve the overall transmittance. Generally speaking, the transmittance can be increased by about 1% after printing the first OC layer 31 and the second OC layer 32.

[0071] The present embodiment also provides a touch screen with integrated FPC flexible circuit, including the aforementioned touch screen sensor with integrated FPC flexible circuit, and also including PCB, wherein the PIN port of the PCB is hot pressed together with the connection area 6 formed by the capacitive sensing layer 4 and the capacitive driving layer 2 to conduct the circuit of the touch screen and realize the electrical function.

[0072] The method for preparing a touch screen with integrated FPC flexible circuit of this embodiment comprises the following steps:

[0073] S1: a copper metal layer is evaporated on the surface of the substrate 1, and an in-plane metal grid and edge wiring are obtained by exposure, development and etching to form a capacitive sensing layer 4. The edge wiring of the capacitive sensing layer 4 is led to the binding area 5 and then to the connection area 6;

[0074] S2: Printing high-transmittance transparent insulating ink on the surface of the capacitive sensing layer 4 using a screen printer, and forming a first OC layer 31 after curing;

[0075] S3: a copper metal layer is evaporated on the surface of the first OC layer 31, and an in-plane metal grid and edge wiring are obtained by exposure, development and etching to form a capacitor driving layer 2. The edge wiring of the capacitor driving layer 2 is led to the binding area 5 and then to the connection area 6;

[0076] S4: Printing a high-transmittance transparent insulating ink on the surface of the capacitor driving layer 2 by a screen printer, and forming a second OC layer 32 after curing;

[0077] S5: After punching the shape, the touch screen sesnor with integrated FPC flexible circuit is formed;

[0078] S6: hot pressing the PIN port of the PCB and the connection area 6 of the touch screen sesnor integrated with the FPC flexible circuit obtained in step S5 to achieve electrical functional conduction.

[0079] Preferably, in this embodiment, the main components of the high-transmittance transparent insulating ink in steps S2 and S4 mainly include a resin mixture such as PMMA, polyol, acrylic acid, etc., and the curing method is UV curing or baking or IR type thermal curing. The transmittance of the first OC layer 31 and the second OC layer 32 is 99%.

[0080] Preferably, in this embodiment, the thickness of the capacitive sensing layer 4 and the capacitive driving layer 2 are both 1 μm, the thickness of the first OC layer 31 and the second OC layer 32 are both 1 μm, the substrate 1 is a PET substrate, and the thickness of the substrate 1 is 50 μm.

[0081] Combination Figure 5 and Figure 7The edge wiring of the capacitive sensing layer of a conventional touch screen will be led to the binding area, which is used to connect the gold finger area of ​​the FPC PIN end when binding the FPC. The edge wiring of the capacitive driving layer of a conventional touch screen will be led to the binding area, which is used to connect the gold finger area of ​​the FPC PIN end when binding the FPC.

[0082] Combination Figure 6 and Figure 8 The edge wiring of the capacitive sensing layer 4 of the touch screen sensor of this embodiment will be led to the binding area 5 and then to the original FPC position, that is, the connection area 6, and the internal circuit of the FPC is integrated on the sensor to form a capacitive sensing layer 4 with FPC function, without the need for FPC, ACF bonding and FPC binding; the edge wiring of the capacitive driving layer 2 of the touch screen sensor of this embodiment will be led to the binding area 5 and then to the original FPC position, that is, the connection area 6, and the internal circuit of the FPC is integrated on the sensor to form a capacitive driving layer 2 with FPC function, without the need for FPC, ACF bonding and FPC binding.

[0083] Combination Fig. 9 The leads formed by the capacitive sensing layer and the capacitive driving layer of conventional touch screens are integrated in the binding area. The FPC gold finger end needs to be pressed together with the binding area through ACF. After the ACF is pressed, the conductive particles are broken to connect the FPC gold finger end with the binding area to achieve electrical function. Then the FPC plug-in end is connected to the PCB board through plug-in to achieve connectivity. The ACF lamination process and the FPC pressing process are complex and have low production efficiency. They are prone to poor appearance such as bubbles and indentations, as well as poor functions such as broken wires and aggregation of ACF conductive particles. Frequent plugging and unplugging of the PCB can easily cause the metal at the FPC plug-in end to fall off, resulting in poor electrical properties.

[0084] Combination Fig.10 In this embodiment, the touch screen sensor and touch screen with integrated FPC flexible circuit do not need to be bound to FPC. The leads formed by the capacitive sensing layer 4 and the capacitive driving layer 2 of the touch screen sensor are integrated in the binding area 5 and then led to the original FPC position. Since the leads of the capacitive sensing layer 4 and the capacitive driving layer 2 are extended to the original FPC position to form the connection area 6, an integrated sensor without FPC but with FPC function is realized. The connection area 6 of the integrated sensor is hot pressed through the PCB, and there is no need to repeatedly plug and unplug the connector on the PCB to achieve electrical function conduction. This integrated sensor does not require ACF and FPC, does not require a connector, does not require an ACF attachment process and an FPC pressing process, has a simple process technology, high production efficiency, will not allow the appearance of poor pressure bubbles, indentations and other poor functions and broken wires, ACF conductive particle aggregation and other poor functions, and does not require frequent plugging and unplugging of the PCB to cause metal shedding.

[0085] Many specific details are described in the above description to facilitate a full understanding of the present invention. However, the above description is only a preferred embodiment of the present invention. The present invention can be implemented in many other ways different from those described herein, so the present invention is not limited to the specific implementation disclosed above. At the same time, any person familiar with the art can make many possible changes and modifications to the technical solution of the present invention using the methods and technical contents disclosed above without departing from the scope of the technical solution of the present invention, or modify it into an equivalent embodiment of equivalent changes. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A touch screen sensor with integrated FPC flexible circuit, characterized in that: comprising a substrate (1), The surface of the substrate (1) is provided with a capacitor driving layer (2), a first OC layer (31), a capacitor sensing layer (4) and a second OC layer (32) in sequence; the substrate (1) is a highly transparent flexible substrate; the capacitor driving layer (2) is a copper conductive layer formed by coating on the surface of the substrate (1), and edge wiring and an in-plane metal grid are obtained through a yellow light process of exposure, development and etching, which are used to transmit signals; the first OC layer (31) is formed by curing a high-transmittance transparent insulating ink printed on the surface of the capacitor driving layer (2); the capacitor sensing layer (4) is a copper conductive layer formed by coating on the surface of the first OC layer (31), and edge wiring and an in-plane metal grid are obtained through a yellow light process of exposure, development and etching, which are used to receive signals; the second OC layer (32) is formed by curing a high-transmittance transparent insulating ink printed on the surface of the capacitor sensing layer (4); the edge wiring of the capacitor sensing layer (4) and the capacitor driving layer (2) are integrated in a binding area (5) and then led to a connection area (6); Alternatively, the surface of the substrate (1) is provided with a capacitive sensing layer (4), a first OC layer (31), a capacitive driving layer (2) and a second OC layer (32) in sequence; the substrate (1) is a highly transparent flexible substrate; the capacitive sensing layer (4) is a copper conductive layer formed by coating on the surface of the substrate (1), and edge wiring and an in-plane metal grid are obtained by a yellow light process of exposure, development and etching, and are used to receive signals; the first OC layer (31) is formed by printing a high-transmittance transparent insulating ink on the surface of the capacitive sensing layer (4) and curing it; the capacitive driving layer (2) is a copper conductive layer formed by coating on the surface of the first OC layer (31), and edge wiring and an in-plane metal grid are obtained by a yellow light process of exposure, development and etching, and are used to transmit signals; the second OC layer (32) is formed by printing a high-transmittance transparent insulating ink on the surface of the capacitive driving layer (2) and curing it; the edge wiring of the capacitive sensing layer (4) and the capacitive driving layer (2) are integrated in a binding area (5) and then led to a connection area (6).

2. The touch screen sensor with integrated FPC flexible circuit according to claim 1, characterized in that: The substrate (1) is one of PET, COP, TAC, PI and PC.

3. The touch screen sensor with integrated FPC flexible circuit according to claim 1, characterized in that: The thickness of the substrate (1) is 38 μm to 125 μm.

4. The touch screen sensor with integrated FPC flexible circuit according to claim 1, characterized in that: The thickness of the capacitive driving layer (2) and the capacitive sensing layer (4) are both 1 μm.

5. The touch screen sensor with integrated FPC flexible circuit according to claim 1, characterized in that: The components of the high-transmittance transparent insulating ink of the first OC layer (31) and the second OC layer (32) include a resin mixture of PMMA, polyol and acrylic acid.

6. A touch screen with integrated FPC flexible circuit, characterized in that: A touch screen sensor with an integrated FPC flexible circuit as claimed in any one of claims 1 to 5, further comprising a PCB, wherein a PIN port of the PCB is heat-pressed together with a connection area (6) formed by a capacitive sensing layer (4) and a capacitive driving layer (2) to conduct the circuit of the touch screen and realize electrical functions.

7. A method for preparing a touch screen with integrated FPC flexible circuit, characterized in that: The steps include: S1: a copper metal layer is evaporated on the surface of the substrate (1), and an in-plane metal grid and edge wiring are obtained by exposure, development, and etching to form a capacitor driving layer (2). The edge wiring of the capacitor driving layer (2) is led to the binding area (5) and then to the connection area (6); S2: Printing a transparent insulating ink with high transmittance on the surface of the capacitor driving layer (2) using a screen printer, and forming a first OC layer (31) after curing; S3: a copper metal layer is evaporated on the surface of the first OC layer (31), and an in-plane metal grid and edge wiring are obtained through exposure, development, and etching to form a capacitive sensing layer (4), and the edge wiring of the capacitive sensing layer (4) is led to the binding area (5) and then to the connection area (6); S4: Printing a transparent insulating ink with high transmittance on the surface of the capacitive sensing layer (4) using a screen printer, and forming a second OC layer (32) after curing; S5: After punching the shape, the touch screen sesnor with integrated FPC flexible circuit is formed; S6: hot pressing the PIN port of the PCB and the connection area (6) of the touch screen sesnor integrated with the FPC flexible circuit obtained in step S5 to achieve electrical functional conduction.

8. A method for preparing a touch screen with integrated FPC flexible circuit, characterized in that: The steps include: S1: a copper metal layer is evaporated on the surface of the substrate (1), and an in-plane metal grid and edge wiring are obtained by exposure, development, and etching to form a capacitive sensing layer (4), and the edge wiring of the capacitive sensing layer (4) is led to the binding area (5) and then to the connection area (6); S2: Printing a transparent insulating ink with high transmittance on the surface of the capacitive sensing layer (4) using a screen printer, and forming a first OC layer (31) after curing; S3: a copper metal layer is evaporated on the surface of the first OC layer (31), and an in-plane metal grid and edge wiring are obtained through exposure, development, and etching to form a capacitor driving layer (2), and the edge wiring of the capacitor driving layer (2) is led to the binding area (5) and then to the connection area (6); S4: Printing a transparent insulating ink with high transmittance on the surface of the capacitor driving layer (2) using a screen printer, and forming a second OC layer (32) after curing; S5: After punching the shape, the touch screen sesnor with integrated FPC flexible circuit is formed; S6: hot pressing the PIN port of the PCB and the connection area (6) of the touch screen sesnor integrated with the FPC flexible circuit obtained in step S5 to achieve electrical functional conduction.

9. The method for preparing a touch screen with integrated FPC flexible circuit according to claim 7 or 8, characterized in that: The high-transmittance transparent insulating ink in steps S2 and S4 mainly comprises a resin mixture of PMMA, polyol and acrylic acid, and is cured by UV curing, baking or IR type thermal curing. The transmittance of the first OC layer (31) and the second OC layer (32) is 99%.

10. The method for preparing a touch screen with integrated FPC flexible circuit according to claim 7 or 8, characterized in that: The thickness of the capacitive sensing layer (4) and the capacitive driving layer (2) are both 1 μm, the thickness of the first OC layer (31) and the second OC layer (32) are both 1 μm, the substrate (1) is a PET substrate, and the thickness of the substrate (1) is 50 μm.

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