A plastic shell structure of an electronic product and a process improvement method

Abstract

The present invention relates to the technical field of electronic products, and discloses a plastic shell structure of an electronic product, including a plastic shell, wherein the number of the plastic shells is two and they are arranged left and right, a card slot is provided on the front of the plastic shell, a heat dissipation hole is provided on the front of the plastic shell and is located on the opposite side of the card slot, and a connecting transverse groove is provided on the opposite side of the two plastic shells. The plastic shell structure of the electronic product and the process improvement method are provided with an annular groove and an installation transverse groove. When protecting the electronic product, the two plastic shells are spliced ​​by using a connecting shaft column and an installation sleeve. During the splicing process, the connecting block on the connecting shaft column enters the interior of the installation sleeve along the installation transverse groove, and then the connecting shaft column is rotated to make the connecting block rotate into the annular groove at different positions for card connection, thereby changing the connection distance between the two plastic shells, facilitating the protection of electronic products of different sizes, and having higher applicability.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic products, and in particular to a plastic shell structure of an electronic product and a process improvement method. Background Art

[0002] Electronic products are products that use electricity as the basis of their work, mainly including: watches, smart phones, telephones, televisions, video players (VCD, SVCD, DVD), video recorders, camcorders, radios, tape recorders, combination speakers, laser turntables (CD), computers, game consoles and mobile communication products, etc. Early products were mainly based on vacuum tubes as components, hence the name electronic products.

[0003] Since electronic products have many internal electronic components and are expensive, they need to be worn with protective shells during use to prevent them from being damaged. However, existing protective shells for electronic products cannot be adjusted during use and have a single applicability. At the same time, the thermal conductivity and toughness of the protective shells for electronic products are poor, and the service life is short, which greatly limits the use of the protective shells for electronic products. Therefore, a plastic shell structure and process improvement method for electronic products are proposed to solve the above-mentioned problems. Summary of the invention

[0004] 1. Technical issues to be solved

[0005] In view of the deficiencies in the prior art, the present invention provides a plastic shell structure and process improvement method for an electronic product, which has the advantages of good thermal conductivity, strong toughness and adjustability, etc., and solves the problem that the existing electronic product protective shell cannot be adjusted during use and has a single applicability. At the same time, the electronic product protective shell has poor thermal conductivity and toughness, and has a short service life, which greatly limits the use of the electronic product protective shell.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purposes of good thermal conductivity, strong toughness and adjustability, the present invention provides the following technical solutions: a plastic shell structure of an electronic product, comprising a plastic shell, the number of which is two and arranged left and right, a card slot is provided on the front of the plastic shell, a heat dissipation hole is provided on the front of the plastic shell on the opposite side of the card slot, a connecting transverse groove is provided on the opposite sides of the two plastic shells, a heat sink is fixedly installed between the front and rear side walls in the groove of the connecting transverse groove, a rotating bearing is fixedly installed on the right side of the heat sink on the left side, the right side of the rotating bearing is rotatably connected to a connecting shaft column with one end extending between the two plastic shells, and connecting blocks are fixedly installed on the front and rear sides of the connecting shaft column, a connecting plate is fixedly installed on the left side of the heat sink on the right side, and a mounting sleeve with one end extending between the right plastic shell and the connecting shaft column is fixedly installed on the left side of the connecting plate, a mounting transverse groove is provided on the front and rear sides of the inner wall of the mounting sleeve, and an annular groove connected to the mounting transverse groove is provided on the inner wall of the mounting sleeve.

[0008] Preferably, the number of the heat dissipation holes on a single side is not less than ten and they are arranged at equal distances in the longitudinal direction.

[0009] Preferably, the number of the connecting transverse grooves on a single side is two, and the two connecting transverse grooves on a single side are respectively located at the upper and lower ends of the card slot.

[0010] Preferably, the positions of the connecting transverse grooves on the left and right sides correspond to each other and are symmetrically distributed up and down.

[0011] Preferably, the number of the annular grooves is not less than four and they are distributed equidistantly in the transverse direction.

[0012] Preferably, the distance between the upper and lower sides of the connecting block is equal to the distance between the upper and lower side walls of the installation transverse groove.

[0013] Preferably, the distance between the left and right sides of the connecting block is equal to the distance between the left and right side walls in the annular groove.

[0014] Preferably, the interior of the mounting sleeve is hollow, and the left side of the inner wall of the mounting sleeve is an opening.

[0015] A process improvement method for a plastic housing structure of an electronic product comprises the following steps:

[0016] 1) preheating polycarbonate, glass fiber and nano-alumina in a ratio of 7:2:1;

[0017] 2) mixing the raw materials preheated in step 2) uniformly and continuing to heat to between 200-300 degrees Celsius and maintaining for 10 minutes;

[0018] 3) injection molding the raw material obtained in step 2) to obtain a plastic shell and forming a card slot, a heat dissipation hole and a connecting transverse groove on the surface of the plastic shell;

[0019] 4) The heat sink, rotating bearing, connecting shaft column, connecting block, connecting plate and mounting sleeve are sequentially assembled in the connecting transverse groove, and an upper annular groove and a mounting transverse groove are opened on the inner wall of the mounting sleeve to finally obtain the plastic shell structure of the above electronic product.

[0020] (III) Beneficial effects

[0021] Compared with the prior art, the present invention provides a plastic housing structure and process improvement method for electronic products, which has the following beneficial effects:

[0022] 1. The plastic shell structure and process improvement method of the electronic product are provided with an annular groove and a mounting transverse groove. When protecting the electronic product, two plastic shells are spliced ​​by using a connecting shaft column and a mounting sleeve. During the splicing process, the connecting card block on the connecting shaft column enters the interior of the mounting sleeve along the mounting transverse groove, and then the connecting shaft column is rotated to make the connecting card block turn into annular grooves at different positions for clamping, thereby changing the connection distance between the two plastic shells, making it convenient to protect electronic products of different sizes, and having higher applicability.

[0023] 2. The plastic shell structure and process improvement method of the electronic product can greatly improve the thermal conductivity and bending toughness of polycarbonate by mixing glass fiber and nano-oxide with polycarbonate, preheating them, fully mixing them and then heating them, which is conducive to timely dispersing the heat generated during the use of electronic products. The improvement of bending toughness is conducive to increasing the service life of the plastic shell of the electronic product and is conducive to the promotion and use of the plastic shell of the electronic product. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the structure of a plastic shell of an electronic product proposed by the present invention;

[0025] Figure 2 A plastic shell structure of an electronic product proposed by the present invention Figure 1 Enlarged view of point A in the middle.

[0026] In the figure: 1 plastic shell, 2 card slot, 3 heat dissipation hole, 4 connecting transverse groove, 5 heat sink, 6 rotating bearing, 7 connecting shaft column, 8 connecting card block, 9 connecting plate, 10 mounting sleeve, 11 annular groove, 12 mounting transverse groove. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1-2 A plastic shell structure of an electronic product, comprising a plastic shell 1, wherein the number of the plastic shells 1 is two and they are arranged in a left-right manner, a card slot 2 is provided on the front of the plastic shell 1, a heat dissipation hole 3 is provided on the back side of the card slot 2, the number of the heat dissipation holes 3 on a single side is not less than ten and they are arranged at equal distances in the longitudinal direction, a connecting transverse groove 4 is provided on the opposite side of the two plastic shells 1, the number of the connecting transverse grooves 4 on a single side is two, the two connecting transverse grooves 4 on a single side are respectively located at the upper and lower ends of the card slot 2, the positions of the connecting transverse grooves 4 on the left and right sides correspond to each other and are symmetrically distributed in the upper and lower directions, a heat sink 5 is fixedly installed between the front and rear side walls in the groove of the connecting transverse groove 4, a rotating bearing 6 is fixedly installed on the right side of the left heat sink 5, and the right side of the rotating bearing 6 is rotatably connected to a connecting shaft column 7 extending to between the two plastic shells 1, and connecting blocks 8 are fixedly installed on the front and rear sides of the connecting shaft column 7, a connecting plate 9 is fixedly installed on the left side of the right heat sink 5, and the left side of the connecting plate 9 is fixedly installed with an end extending to between the right plastic shell 1 and the connecting shaft column 7. The installation sleeve 10 is provided in the middle, the interior of the installation sleeve 10 is hollow, the left side of the inner wall of the installation sleeve 10 is open, the front and rear sides of the inner wall of the installation sleeve 10 are provided with installation transverse grooves 12, the inner wall of the installation sleeve 10 is provided with an annular groove 11 connected with the installation transverse groove 12, the number of the annular grooves 11 is not less than four and is distributed at equal distances in the horizontal direction, the distance between the upper and lower sides of the connecting block 8 is equal to the distance between the upper and lower side walls in the installation transverse groove 12, the distance between the left and right sides of the connecting block 8 is equal to the distance between the left and right side walls in the annular groove 11, when protecting the electronic products, the two plastic shells 1 are spliced ​​by using the connecting shaft column 7 and the installation sleeve 10, during the splicing process, the connecting block 8 on the connecting shaft column 7 enters the interior of the installation sleeve 10 along the installation transverse groove 12, and then the connecting shaft column 7 is rotated to make the connecting block 8 turn into the annular groove 11 at different positions for clamping, so that the connection distance between the two plastic shells 1 can be changed, which is convenient for protecting electronic products of different sizes and has higher applicability.

[0029] A process improvement method for a plastic housing structure of an electronic product comprises the following steps:

[0030] 1) preheating polycarbonate, glass fiber and nano-alumina in a ratio of 7:2:1;

[0031] 2) mixing the raw materials preheated in step 2) uniformly and continuing to heat to between 200-300 degrees Celsius and maintaining for 10 minutes;

[0032] 3) injection molding the raw material obtained in step 2) to obtain a plastic housing 1 and forming a card slot 2, a heat dissipation hole 3 and a connecting transverse groove 4 on the surface of the plastic housing 1;

[0033] 4) The heat sink 5, the rotating bearing 6, the connecting shaft column 7, the connecting block 8, the connecting plate 9 and the mounting sleeve 10 are sequentially assembled in the connecting transverse groove 4, and an upper annular groove 11 and a mounting transverse groove 12 are opened on the inner wall of the mounting sleeve 10, and finally the plastic shell structure of the above-mentioned electronic product is obtained.

[0034] In summary, the plastic shell structure and process improvement method of the electronic product, by setting the annular groove 11 and the installation transverse groove 12, when protecting the electronic product, the two plastic shells 1 are spliced ​​by using the connecting shaft column 7 and the installation sleeve 10. During the splicing process, the connecting block 8 on the connecting shaft column 7 enters the interior of the installation sleeve 10 along the installation transverse groove 12, and then the connecting shaft column 7 is rotated to make the connecting block 8 turn into the annular groove 11 at different positions for clamping, so that the connection distance between the two plastic shells 1 can be changed, which is convenient for protecting electronic products of different sizes, and has higher applicability. By mixing glass fiber and nano-oxide with polycarbonate, preheating them, fully mixing them and then heating them, the thermal conductivity and bending toughness of polycarbonate can be greatly improved, which is conducive to timely dispersing the heat generated during the use of electronic products. The improvement of bending toughness is conducive to increasing the service life of plastic shells of electronic products, which is conducive to the promotion and use of plastic shells of electronic products, and solves the problem that the existing electronic product protective shells cannot be adjusted during use and have a single applicability. At the same time, the thermal conductivity and toughness of the electronic product protective shells are poor, and the service life is short, which greatly limits the use of electronic product protective shells.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A plastic shell structure of an electronic product, comprising two plastic shells (1), wherein the number of the plastic shells (1) is two and the plastic shells (1) are arranged on the left and right, and the characteristics are: The front of the plastic shell (1) is provided with a slot (2), the front of the plastic shell (1) is provided with a heat dissipation hole (3) located on the opposite side of the slot (2), the two opposite sides of the two plastic shells (1) are provided with a connecting transverse groove (4), a heat sink (5) is fixedly installed between the front and rear side walls of the groove of the connecting transverse groove (4), a rotating bearing (6) is fixedly installed on the right side of the left heat sink (5), the right side of the rotating bearing (6) is rotatably connected to a connecting shaft column (7) with one end extending between the two plastic shells (1), the front and rear sides of the connecting shaft column (7) are fixedly installed with a connecting block (8), and the left side of the right heat sink (5) is fixedly installed A connecting plate (9) is provided, and a mounting sleeve (10) is fixedly installed on the left side of the connecting plate (9) with one end extending to between the right plastic shell (1) and the connecting shaft column (7). The inner wall of the mounting sleeve (10) is provided with mounting transverse grooves (12) on both the front and rear sides, and the inner wall of the mounting sleeve (10) is provided with an annular groove (11) connected with the mounting transverse groove (12). The number of the heat dissipation holes (3) on one side is not less than ten and is arranged at equal distances in the longitudinal direction. The number of the connecting transverse grooves (4) on one side is two. The two connecting transverse grooves (4) on one side are respectively located at the upper and lower ends of the card slot (2). The positions of the connecting transverse grooves (4) on the left and right sides correspond to each other and are symmetrically distributed up and down.

2. The plastic housing structure of an electronic product according to claim 1, characterized in that: The number of the annular grooves (11) is no less than four and they are distributed at equal distances in the transverse direction.

3. The plastic housing structure of an electronic product according to claim 1, characterized in that: The distance between the upper and lower sides of the connecting block (8) is equal to the distance between the upper and lower side walls of the mounting transverse groove (12).

4. The plastic housing structure of an electronic product according to claim 1, characterized in that: The distance between the left and right sides of the connecting block (8) is equal to the distance between the left and right side walls of the annular groove (11).

5. The plastic housing structure of an electronic product according to claim 1, characterized in that: The interior of the installation sleeve (10) is hollow, and the left side of the inner wall of the installation sleeve (10) is an opening.

6. A process improvement method for the plastic housing structure of an electronic product as claimed in claim 1, characterized in that: The following steps are involved: 1) preheating polycarbonate, glass fiber and nano-alumina in a ratio of 7:2:1; 2) mixing the raw materials preheated in step 1) uniformly and continuing to heat to between 200-300 degrees Celsius and maintaining for 10 minutes; 3) injection molding the raw material obtained in step 2) to obtain a plastic housing (1) and forming a card slot (2), a heat dissipation hole (3) and a connecting transverse groove (4) on the surface of the plastic housing (1); 4) The heat sink (5), the rotating bearing (6), the connecting shaft column (7), the connecting block (8), the connecting plate (9) and the mounting sleeve (10) are sequentially assembled in the connecting transverse groove (4), and an upper annular groove (11) and a mounting transverse groove (12) are formed on the inner wall of the mounting sleeve (10), thereby finally obtaining the plastic shell structure of the electronic product.

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