Chuck device for cleaning equipment and cleaning equipment

Abstract

The present invention discloses a chuck device of a cleaning device and a cleaning device, wherein the chuck device comprises a chuck body (100) and a plurality of clamping members (200); the chuck body (100) is provided with a mounting hole; the plurality of clamping members (200) are movably arranged on the chuck body (100), and each of the clamping members (200) can move relative to the chuck body (100) to clamp a wafer during a cleaning process; the clamping member (200) comprises a conductive plastic part (210) and a metal body part (220), a portion of the metal body part (220) is covered with the conductive plastic part (210), and at least a portion of the conductive plastic part (210) extends out of the chuck body (100) through the mounting hole, and is used to clamp or release the wafer. The above scheme can solve the problem of poor cleaning performance of the cleaning device.

Description

Technical Field

[0001] The present invention relates to the technical field of cleaning semiconductor chips, and in particular to a chuck device of cleaning equipment and the cleaning equipment. Background Art

[0002] During the wafer processing, impurities will adhere to the surface of the wafer. The impurities attached to the surface of the wafer are easy to contaminate semiconductor process equipment and transmission mechanisms during subsequent processing. Therefore, in order to avoid contaminating semiconductor process equipment and transmission mechanisms, the surface of the wafer needs to be cleaned.

[0003] In the related art, the cleaning equipment is provided with a chuck device for clamping the wafer during the cleaning process. The chuck device includes a chuck and a plurality of clamping members, and the plurality of clamping members can move relative to the chuck to clamp the wafer during the cleaning process. The cleaning equipment usually uses a mixed solution of HF and HNO3 to clean the wafer, so the clamping member is usually made of a material that is relatively inert to corrosive chemicals. For example, plastic materials with good corrosion resistance such as polyvinylidene fluoride (PVDF), polyetheretherketone (PEEK) or polytetrafluoroethylene (PTFE) are made. However, the resistance of plastic materials is extremely high, so the electrical conductivity is poor, so it is easy to cause the accumulation of static charge. The static charge on the clamping member accumulates too much, causing the accumulation of pollutants on the wafer surface, which is not easy to clean, so the cleaning performance of the cleaning equipment is poor. Summary of the invention

[0004] The invention discloses a chuck device of cleaning equipment and the cleaning equipment, so as to solve the problem that the cleaning performance of the cleaning equipment is poor.

[0005] In order to solve the above problems, the present invention adopts the following technical solutions:

[0006] A chuck device of a cleaning device, comprising a chuck body and a plurality of clamping members;

[0007] A chuck body, wherein the chuck body is provided with a mounting hole;

[0008] A plurality of clamping members, wherein the plurality of clamping members are movably disposed on the chuck body, and each of the clamping members can move relative to the chuck body to clamp the wafer during the cleaning process;

[0009] The clamping member includes a conductive plastic part and a metal main body part, the conductive plastic part is partially sleeved on the metal main body part, and at least a part of the conductive plastic part extends out of the chuck body through the mounting hole for clamping or releasing the wafer.

[0010] A cleaning device comprises the above-mentioned chuck device.

[0011] The technical solution adopted by the present invention can achieve the following beneficial effects:

[0012] In the chuck device disclosed in the present invention, the clamping piece includes a conductive plastic part and a metal main body part, a part of the metal main body part is covered with the conductive plastic part, and a part of the conductive plastic part extends out of the chuck through the mounting hole. The clamping piece in the present application adopts a conductive plastic and metal combination structure, and both the conductive plastic part and the metal main body part have good conductivity, so the static charge is transferred to the metal main body part through the conductive plastic part, and then discharged by the metal main body part, thereby preventing the static charge from excessively accumulating on the clamping piece, thereby reducing the risk of damage to the circuit structure on the wafer, and improving the safety and reliability of the cleaning equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0014] Figure 1 A schematic diagram of the structure of a chuck device disclosed in an embodiment of the present invention;

[0015] Figure 2 for Figure 1 A partial cross-sectional view of

[0016] Figure 3 A cross-sectional view of some components of a chuck device disclosed in an embodiment of the present invention;

[0017] Figure 4 for Figure 3 A partial enlarged view of

[0018] Figure 5 A schematic structural diagram of a clamping member of a chuck assembly disclosed in an embodiment of the present invention;

[0019] Figure 6 A cross-sectional view of a clamping member of a chuck assembly disclosed in an embodiment of the present invention;

[0020] Figure 7 and Figure 8 A schematic diagram of the structure of a driving mechanism of a chuck assembly disclosed in an embodiment of the present invention;

[0021] Fig. 9 It is a structural schematic diagram of a rotary connector of a chuck assembly disclosed in an embodiment of the present invention;

[0022] Fig.10 A top view of the first bearing seat of the chuck assembly disclosed in an embodiment of the present invention.

[0023] Description of reference numerals:

[0024] 100-chuck body, 101-ventilation channel, 101a-first channel, 101b-second channel, 110-chuck cover, 120-chuck base, 130-chuck base, 200-clamping part, 210-conductive plastic part, 211-thimble, 212-first connecting shaft, 220-metal main body, 221-second connecting shaft, 222-gear, 310-driving source, 311-rotating part, 312-support Support shaft, 3121-gas channel, 320-rotating connection, 321-conical positioning part, 322-connecting flange, 410-nozzle, 411-second jet hole, 412-first jet hole, 420-conductive block, 430-elastic member, 440-first threaded member, 450-first bearing seat, 451-first threaded hole, 452-positioning hole, 460-first bearing, 470-drive disk, 480-second bearing. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] The technical solutions disclosed in various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0027] like Figures 1 to 10 As shown, an embodiment of the present invention discloses a chuck device of a cleaning device, the chuck device is used to clamp a wafer when the cleaning device cleans the wafer. The disclosed chuck device includes a chuck body 100 and a clamping member 200.

[0028] The chuck body 100 is the main component of the chuck device, which is used to carry the wafer and provide a mounting base for other components of the chuck device. The chuck body 100 is provided with a mounting hole.

[0029] There are multiple clamping members 200, and multiple clamping members 200 are movably arranged on the chuck body 100. Each clamping member 200 can move relative to the chuck body 100 to clamp the wafer during the cleaning process. Specifically, each clamping member 200 can move relative to the chuck body 100 between a first position and a second position. When multiple clamping members 200 are all in the first position, multiple clamping members 200 can clamp the wafer together. The clamping structure formed by multiple clamping members 200 is closed, so that the wafer is in a clamping state. When multiple clamping members 200 are in the second position, multiple clamping members 200 have no clamping force on the wafer. Multiple clamping members 200 surround a limiting space, and the limiting space is used to limit the wafer. At this time, multiple clamping members 200 move to a position where there is no holding force on the wafer. The clamping structure formed by multiple clamping members 200 is opened.

[0030] The clamping member 200 includes a conductive plastic part 210 and a metal main body part 220. The conductive plastic part 210 is partially mounted on the metal main body part 220, and at least part of the conductive plastic part 210 extends out of the chuck through the mounting hole. At this time, the conductive plastic part 210 is located outside the metal main body part 220, so the conductive plastic part is exposed to the chuck body 100. Therefore, when the multiple clamping members 200 clamp the wafer, the conductive plastic part 210 is in direct contact with the wafer.

[0031] In the embodiment disclosed in the present application, the clamping member 200 adopts a combination structure of conductive plastic and metal, and the conductive plastic part 210 and the metal main body part 220 both have good conductivity. Therefore, static charge is transferred to the metal main body part 220 through the conductive plastic part 210, and then discharged by the metal main body part 220, thereby preventing static charge from excessively accumulating on the clamping member 200, so that contaminants on the surface of the wafer are not easily accumulated, thereby making it easier to clean the contaminants on the surface of the wafer, thereby improving the cleaning performance of the cleaning equipment.

[0032] In addition, avoiding excessive accumulation of static charge on the clamping member 200 can also reduce the risk of damage to the circuit structure on the wafer, thereby improving the safety and reliability of the cleaning equipment.

[0033] In addition, the clamping member 200 in the present application adopts a structure combining metal and conductive plastic, so its strength is greatly improved compared to the clamping part made of only plastic material in the related art. Therefore, the clamping member 200 in the present application achieves a great improvement in both conductivity and strength compared to the clamping member 200 in the related art.

[0034] In another optional embodiment, the resistivity of the conductive plastic portion 210 may be less than 10 4Ω·m (ohm*meter). In this solution, the resistivity of the conductive plastic part 210 is relatively small, so the conductive plastic part 210 has better conductive performance, so that the conductive plastic part 210 has better conductive performance, and thus the clamping member 200 has better conductive performance, so as to further improve the conductive performance of the clamping member 200.

[0035] Optionally, the conductive plastic part 210 can be made of conductive carbon-injected plastic. Therefore, the conductive plastic part 210 in the present application can be made of conductive carbon-injected polyvinylidene fluoride (PVDF-EL), conductive carbon-injected polyetheretherketone (PEEK-EL) or conductive carbon-injected polytetrafluoroethylene (PTFE-EL). Since the cleaning fluid used in the cleaning equipment is usually highly corrosive, it is necessary to select a plastic that is inert to the corrosive cleaning fluid. The resistivity of the conductive carbon-injected plastic is <10 4 Ω·m. The metal main body 220 can be made of iron, aluminum, copper, etc., and the resistivity of the metal main body 220 can be <10 -7 Ω·m.

[0036] In the above embodiment, the closer the metal body 220 is to the wafer, the easier it is for the charges on the wafer to be conducted to the metal body 220 . Therefore, the longer the length of the metal body 220 extending into the conductive plastic part 210 is, the smaller the thickness of the conductive plastic part 210 is, and the better the conductive performance of the clamp 200 is.

[0037] The chuck device disclosed in the present application may further include a driving mechanism, which is connected to the chuck body 100 and the plurality of clamping members 200, and can drive the chuck body 100 to rotate, and is connected to one end of the metal body part 220 located inside the chuck body 100, and can drive the plurality of clamping members 200 to move. At this time, the static charge of the clamping member 200 is introduced into the driving mechanism through the metal body part 220, and then discharged to the ground.

[0038] The present application discloses a specific structure of a clamping member 200. Of course, the clamping member 200 may also be other structures, which are not limited in this article. Specifically, the conductive plastic part 210 may include a pin 211 and a first connecting shaft 212. The pin 211 may be arranged at one end of the first connecting shaft 212, and the pin 211 and the first connecting shaft 212 may be eccentrically arranged. Optionally, the pin 211 is arranged at the edge position of the end surface of one end of the first connecting shaft 212. An installation groove may be provided at one end of the first connecting shaft 212 away from the pin 211 along the axial direction of the first connecting shaft 212, and a portion of the metal main body 220 may be located in the installation groove, and the metal main body 220 is interference fit with the installation groove.

[0039] In this solution, the first connecting shaft 212 and the metal main body 220 are connected by an interference fit, and the first connecting shaft 212 and the metal main body 220 are tightly connected, so the contact between the conductive plastic part 210 and the metal main body 220 is relatively close, so the conductivity between the conductive plastic part 210 and the metal main body 220 is better, and static charge is more easily transferred from the conductive plastic part 210 to the metal main body 220, and it is not easy to cause charge accumulation in the conductive plastic part 210.

[0040] In the above embodiment, the top surfaces of the multiple first connecting shafts 212 can jointly support the wafer. When the multiple clamping members 200 are all in the first position, the multiple ejector pins 211 can jointly clamp the wafer. At this time, the multiple ejector pins 211 move to a position in contact with the edge of the wafer. The clamping structure formed by the multiple ejector pins 211 is closed, so that the wafer is in a clamped state. When the multiple clamping members 200 are in the second position, the multiple ejector pins 211 are separated from the wafer. The multiple ejector pins 211 surround the above-mentioned limiting space. At this time, the multiple ejector pins 211 move to a position that does not contact the edge of the wafer. The clamping structure formed by the multiple ejector pins 211 is opened.

[0041] In another optional embodiment, the metal body 220 may include a second connecting shaft 221 and a gear 222, a portion of the second connecting shaft 221 may be located in the mounting groove, and the second connecting shaft 221 and the mounting groove are interference fit. The gear 222 may be disposed at an end of the second connecting shaft 221 away from the first connecting shaft 212, and the gear 222 may be rotatably connected to the chuck body 100 along its central axis.

[0042] Specifically, when the gear 222 rotates to the first position, the ejector pin 211 contacts the edge of the wafer. When the gear 222 rotates to the second position, the ejector pin 211 is away from the wafer and does not contact the wafer.

[0043] In this solution, the clamping member 200 rotates along the central axis. Compared with the clamping member 200 adopting a moving motion mode, the installation space occupied by the clamping member 200 is smaller.

[0044] In the above embodiment, the gear 222 may be connected to a driving mechanism, and the driving mechanism drives the gear 222 to rotate, thereby realizing the rotation of the clamping member 200 .

[0045] In the above embodiment, the cleaning liquid easily enters into the chuck body 100 from the assembly gap between the inner wall of the mounting hole and the conductive plastic part 210, thereby corroding the metal body part 220, causing the clamping part 200 to generate particles, which are easily adsorbed on the wafer, causing wafer contamination.

[0046] Based on this, in another optional embodiment, a ventilation channel 101 may be provided in the chuck body 100, the ventilation channel 101 may be connected to the assembly gap, and a purge gas may be introduced into the ventilation channel 101. In this solution, a purge gas may be introduced into the ventilation channel 101, and the purge gas is transmitted to the assembly gap through the ventilation channel 101, and the purge gas is blown upward, thereby preventing the cleaning liquid from entering the chuck body 100 through the assembly gap, thereby preventing the metal main body 220 from being corroded.

[0047] In another optional embodiment, the chuck body 100 may include a chuck cover plate 110, a chuck base 120 and a chuck base 130 stacked in sequence, the chuck base 120 may be provided with a mounting hole, a plurality of clamping members 200 may be distributed at intervals along the circumference of the chuck cover plate 110, and the chuck cover plate 110 is used to carry a wafer. A portion of the metal body portion 220 is located in the chuck base 120, specifically, a portion of the metal body portion 220 may be located between the chuck base 120 and the chuck base 130. The portion of the metal body portion 220 located between the chuck base 120 and the chuck base 130 is not covered with the conductive plastic portion 210. The metal body portion 220 may be rotatably connected to the chuck base 130. Optionally, the above-mentioned gear 222 is rotatably connected to the chuck base 130.

[0048] The ventilation channel 101 may include a first channel 101a and a second channel 101b that are connected. The chuck cover 110 and the chuck base 120 may surround the first channel 101a. The chuck base 120 may have a second channel 101b that is connected to the first channel 101a and may be connected to the assembly gap.

[0049] In this solution, part of the vent channel 101 is surrounded by the chuck cover plate 110 and the chuck base 120 , thereby simplifying the manufacturing method of the vent channel 101 .

[0050] The driving mechanism in the above embodiment may be connected to the chuck base 130 , and the driving mechanism drives the chuck body 100 to rotate via the chuck base 130 . The driving mechanism may also be connected to the chuck base 120 .

[0051] In the above embodiment, the gas flow rate introduced into the assembly gap is too large, which can easily blow the wafer to an angle and affect the clamping and positioning effect between the clamp 200 and the wafer. Based on this, in another optional embodiment, the second channel 101b can pass through the outer wall of the chuck base 120. In this scheme, the purge gas of the ventilation channel 101 is divided into two paths, one of which flows upward and is used to purge the cleaning liquid in the assembly gap, and the other is blown out from the second channel 101b through one side of the chuck base. At this time, the flow rate of the purge gas at the assembly gap can be reduced, and it is not easy to affect the clamping and positioning effect between the clamp 200 and the wafer.

[0052] In the above embodiment, the chuck base 120 is connected to the driving mechanism, and the driving mechanism drives the chuck base 120 to rotate, thereby driving the chuck body to rotate. However, when the radial and axial runouts between the chuck base 120 and the driving mechanism are too large, the cleaning liquid spraying of the cleaning equipment during the spraying process of the cleaning liquid is uneven, and the liquid film on the wafer surface is unstable, thus causing the cleaning uniformity of the wafer to be poor. To this end, in another optional embodiment, the driving mechanism may include a driving source 310 and a rotating connector 320, and the rotating connector 320 may include a conical positioning portion 321 and a connecting flange 322, the conical positioning portion 321 having a first end and a second end, the connecting flange 322 is arranged around the conical positioning portion 321, and the connecting flange 322 is located at the first end of the conical positioning portion 321. In the direction from the first end to the second end, the cross-sectional area of ​​the conical positioning portion 321 gradually decreases. The chuck base 120 may be provided with a conical positioning hole 452, and at least a portion of the conical positioning portion 321 is located in the conical positioning hole 452 and matches the conical positioning hole 452. The chuck base 120 may be connected to the driving source 310 via the connecting flange 322. At this time, the cross-sectional area of ​​the conical positioning hole 452 gradually decreases in the direction from the first end to the second end.

[0053] In this scheme, the driving source 310 is connected to the chuck base 120 through a rotating connector 320. The outer wall of the rotating connector 320 is a conical surface, and the conical surface can cooperate with the conical hole, so that the inner wall of the conical hole can be pressed against the conical surface of the rotating connector 320, thereby ensuring the coaxiality between the rotating connector 320 and the chuck base 120, thereby further reducing the radial and axial runout of the rotating connector 320 and the chuck base 120, making the cleaning liquid spraying process more uniform and the stability of the liquid film on the wafer surface better, thereby further improving the cleaning uniformity of the wafer.

[0054] Specifically, the driving source 310 includes a rotating part 311, which is a power component of the driving source 310. The rotating part 311 can rotate, and the above-mentioned rotating connector 320 can be connected to the rotating part 311. Optionally, the rotating connector 320 can be connected to the chuck base 120, and the chuck base 120 is provided with a tapered hole.

[0055] In the above embodiment, the external pipeline is connected to the ventilation channel 101, and the purge gas is passed into the ventilation channel 101 through the external pipeline. However, the chuck base 120 is in a rotating state during cleaning, so when the chuck base 120 rotates, the external pipeline is easily entangled on the chuck base 120.

[0056] Based on this, in another optional embodiment, the driving source 310 may further include a support shaft 312, the rotating portion 311 is arranged around the support shaft 312, and the rotating portion 311 can rotate relative to the support shaft 312 along the central axis of the support shaft 312. The conical positioning portion 321 can be arranged around the support shaft 312, and the chuck body 100 can be connected to the rotating portion 311 through a connecting flange 322. The chuck device may further include a nozzle 410, and the nozzle 410 may be arranged at the end of the support shaft 312, and the support shaft 312 is provided with a gas channel 3121 along its axial direction, and the nozzle 410 is connected to the gas channel 3121, and the nozzle 410 is provided with a first jet hole 412, and the first jet hole 412 is connected to the ventilation channel 101.

[0057] In this solution, the rotating part 311 rotates relative to the supporting shaft 312. The rotating part 311 is a power component of the driving source 310, and the supporting shaft 312 is a fixed component of the driving source 310. Therefore, when the rotating part 311 rotates, the supporting shaft 312 does not rotate. A gas channel 3121 is provided on the supporting shaft 312, and the purge gas can be passed into the ventilation channel 101 through the gas channel 3121. Therefore, there is no risk of external pipelines being entangled on the chuck body 100, further improving the safety of the chuck device.

[0058] In another optional embodiment, the nozzle 410 is further provided with a second air jet hole 411, and the second air jet hole 411 is used to purge the wafer carried on the chuck base 120. In this solution, the nozzle 410 can spray air toward the wafer, thereby preventing contaminants from entering the gap between the side of the wafer facing the chuck body 100 and the chuck body 100, and can also ventilate the assembly gap between the clamping member 200 and the mounting hole, thereby preventing the back corrosion of the clamping member 200, thereby further improving the safety and reliability of the chuck device.

[0059] In the above embodiment, the chuck body 100 is in direct contact with the wafer, so the chuck body 100 is made of corrosion-resistant resin material, and the rotating connector 320 is made of metal material. The resin material is not conductive, so the charge on the chuck body 100 is difficult to be discharged through the driving mechanism.

[0060] To this end, in another optional embodiment, the chuck device may further include a conductive block 420, which may be disposed on the bottom wall of the chuck base 120, and the conductive block 420 is connected to the connecting flange 322. At this time, the charge in the chuck body 100 may be transferred to the rotating connector 320 through the conductive block 420, and then led out of the chuck device.

[0061] Furthermore, the chuck device may further include an elastic member 430, and the elastic member 430 may be pressed between the conductive block 420 and the connecting flange 322, and the connecting flange 322 may be electrically connected to the conductive block 420 through the elastic member 430. In this solution, the elastic member 430 is provided between the conductive block 420 and the connecting flange 322, so that the conductive block 420 and the connecting flange 322 are not prone to virtual contact, thereby ensuring the contact reliability of the connecting flange 322 and the conductive block 420.

[0062] Optionally, the elastic member 430 may be a spring, a metal spring, or other elastic structures with conductive functions.

[0063] In another optional embodiment, the chuck base 120, the conductive block 420 and the connecting flange 322 can be threadedly connected by a first threaded member 440. At this time, the first threaded member 440 can pass through the chuck base 120, the conductive block 420 and the connecting flange 322 from top to bottom, so as to achieve the fixed connection of the chuck base 120, the conductive block 420 and the connecting flange 322. The elastic member 430 and the first threaded member 440 can be located on the same circumference. At this time, the pre-tightening force of the first threaded member 440 on the chuck base 120, the conductive block 420 and the connecting flange 322 is in the same direction as the elastic force of the elastic member 430, so that the chuck base 120, the conductive block 420 and the connecting flange 322 will not be installed skewed, thereby further ensuring the coaxiality of the chuck base 120, the conductive block 420 and the connecting flange 322.

[0064] In another optional embodiment, the driving mechanism may further include a first bearing seat 450 and a first bearing 460. The first bearing seat 450 may be disposed on the rotating portion 311, and the connecting flange 322 may be disposed on a side of the first bearing seat 450 away from the rotating portion 311. The connecting flange 322 is connected to the rotating portion 311 through the first bearing seat 450, and the connecting flange 322 may be interference fit with the outer ring of the first bearing 460, and the outer ring of the first bearing 460 may be interference fit with the first bearing seat 450. The inner ring of the first bearing 460 may be interference fit with the support shaft 312.

[0065] In this solution, the connecting flange 322 can be interference fit with the outer ring of the first bearing 460, and the outer ring of the first bearing 460 can be interference fit with the first bearing seat 450. The inner ring of the first bearing 460 can be interference fit with the support shaft 312. Therefore, the coaxiality between the connecting flange 322, the first bearing seat 450, the first bearing 460 and the support shaft 312 is high, further reducing the radial and axial runout of the chuck body 100.

[0066] Optionally, in order to improve the connection strength between the first bearing seat 450, the first bearing 460 and the connecting flange 322, the first bearing seat 450, the first bearing 460 and the connecting flange 322 may be threadedly connected by a second threaded member.

[0067] In the above embodiment, the driving mechanism may include multiple driving motors, each of which is connected to the clamping member 200 in a one-to-one correspondence to drive the clamping member 200 to move. However, setting up multiple driving motors consumes a lot of energy and occupies a large installation space, so the economy and practicality are not high.

[0068] To this end, in another optional embodiment, the chuck device may further include a drive disk 470, a blocking member, and a second bearing 480. The drive disk 470 may be located in the chuck base 120, and a plurality of clamping members 200 may be arranged at intervals along the circumference of the drive disk 470. The metal body 220 of each clamping member 200 is connected to the side edge of the drive disk 470. The inner ring of the second bearing 480 is connected to the chuck base 120, and the drive disk 470 may be sleeved on the outer ring of the second bearing 480 and have an interference fit with the outer ring of the second bearing 480. The blocking member may be movably connected to the chuck base 120.

[0069] When the driving mechanism drives the chuck base 120 to rotate, the blocking member may be used to block the driving disk 470 so that the chuck base 120 rotates relative to the driving disk 470 , and the driving disk 470 drives the plurality of clamping members 200 to rotate.

[0070] In a specific working process, when the driving mechanism drives the chuck base 120 to rotate, a blocking member can be inserted into the driving disk 470, and the blocking member prevents the driving disk 470 from rotating. At this time, the chuck base 120 and the driving disk 470 are connected through a bearing, so the chuck base 120 drives the inner ring of the second bearing 480 to rotate, while the driving disk 470 and the outer ring of the second bearing 480 are in a stationary state, and the chuck base 120 drives the clamping member 200 to rotate, and the reaction force of the clamping member 200 on the driving disk 470 drives the clamping member 200 to rotate, so that the clamping member 200 rotates, thereby realizing the position switching of the clamping member 200 between the first position and the second position. The chuck base 120 rotates a preset angle along the first direction or the second direction opposite thereto, so as to drive multiple clamping members 200 to rotate synchronously to the first position capable of clamping the wafer, or to rotate synchronously to the second position capable of releasing the rotation of the wafer.

[0071] When the blocking member on the driving disk 470 is removed, the chuck base 120 rotates together with the driving disk 470, so that the driving disk 470 and the clamping member 200 are relatively stationary. Therefore, during the cleaning process, it can be ensured that when multiple clamping members 200 clamp the wafer, the multiple clamping members 200 are not prone to accidental rotation, causing the wafer to detach from the clamping space formed by the multiple clamping members 200.

[0072] In this solution, the driving disk 470 can drive multiple clamping members 200 to rotate together. Compared with the method of using multiple driving motors, the solution of using the driving disk 470 in this application consumes less energy, and the size of the chuck device is smaller, so it is more economical and practical.

[0073] In addition, the chuck base 120 is driven by the driving source 310 , so the driving source 310 can also drive the clamping member 200 , thereby achieving the sharing of the driving source 310 and further reducing the energy consumption of the chuck device.

[0074] In the above embodiment, the metal body 220 and the drive disk 470 can be connected by friction contact. In another optional embodiment, the drive disk 470 is a gear disk, and the gear disk meshes with the above gear 222. Of course, the drive disk 470 and the metal body 220 can also be connected by other methods, which are not limited herein.

[0075] In the above embodiment, the driving mechanism may include a driving motor, which may be arranged on a fixed seat of the driving source 310, and the driving motor may drive the blocking member to move. Of course, the component driving the blocking member to move may also be a power structure such as a cylinder or a hydraulic cylinder.

[0076] In another optional embodiment, the first bearing seat 450 may be provided with a positioning hole 452 and a first threaded hole 451, the rotating part 311 may be provided with a positioning pin, the rotating part 311 is provided with a second threaded hole, and the positioning hole 452 and the positioning pin are positioned and matched. The first bearing seat 450 and the rotating part 311 are threadedly matched through a third threaded member, the third threaded member is threadedly matched with the first threaded hole 451 and the second threaded hole, and the center of the first threaded hole 451 and the center of the positioning hole 452 are located on the same circumference. This solution can further improve the coaxiality of the first bearing seat 450 and the rotating part 311.

[0077] According to the chuck device described above, the static charge is first transferred from the conductive plastic part 210 of the clamping part 200 to the metal main body part 220. The gear 222 of the metal main body part 220 is meshed with the driving disk 470. Therefore, the static charge is transferred from the gear 222 to the driving disk 470, and then transferred to the connecting flange 322 of the rotating connecting part 320 through the conductive block 420, and then transferred to the rotating part 311 through the first bearing seat 450 and the first bearing 460. Then, the rotating part 311 transfers the static charge to the housing and other components of the driving source 310, and the static charge is introduced into the ground through the housing and other components.

[0078] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0079] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A chuck device for a cleaning device, characterized in that: It comprises a chuck body (100) and a plurality of clamping members (200); A chuck body (100), wherein the chuck body (100) is provided with a mounting hole; A plurality of clamping members (200), wherein the plurality of clamping members (200) are movably arranged on the chuck body (100), and each of the clamping members (200) can move relative to the chuck body (100) to clamp the wafer during a cleaning process; Each of the clamping members (200) comprises a conductive plastic part (210) and a metal main body part (220), a portion of each of the metal main body parts (220) is fitted with the conductive plastic part (210) corresponding thereto, and at least a portion of each of the conductive plastic parts (210) extends out of the chuck body (100) through the mounting hole, for clamping or releasing the wafer.

2. The chuck device according to claim 1, characterized in that: The resistivity of the conductive plastic part (210) is less than 10 4 Ω·m.

3. The chuck device according to claim 1, characterized in that: The conductive plastic part (210) comprises a pin (211) and a first connecting shaft (212); the pin (211) is arranged at one end of the first connecting shaft (212), and the pin (211) and the first connecting shaft (212) are eccentrically arranged; an installation groove is provided along the axial direction of the first connecting shaft (212) at one end of the first connecting shaft (212) away from the pin (211); at least a portion of the metal main body (220) is located in the installation groove, and the metal main body (220) is interference-fitted with the installation groove.

4. The chuck device according to claim 1, characterized in that: A ventilation channel (101) is provided in the chuck body (100), an assembly gap is provided between the inner side wall of the mounting hole and the conductive plastic part (210), the ventilation channel (101) is connected to the assembly gap, and a purge gas can be introduced into the ventilation channel (101).

5. The chuck device according to claim 4, characterized in that: The chuck body (100) comprises a chuck cover plate (110) and a chuck base (120) stacked in sequence, the chuck base (120) is provided with the mounting hole, the plurality of clamping members (200) are distributed at intervals along the circumference of the chuck cover plate (110), and a portion of the metal main body (220) is located inside the chuck base (120); The ventilation channel (101) comprises a first channel (101a) and a second channel (101b) which are connected to each other; the chuck cover plate (110) and the chuck base (120) enclose the first channel (101a); the chuck base (120) is provided with a second channel (101b); the second channel (101b) is connected to the first channel (101a); and the second channel (101b) is connected to the assembly gap.

6. The chuck device according to claim 5, characterized in that: The second channel (101b) passes through the outer side wall of the chuck base (120).

7. The chuck device according to claim 5, characterized in that: The chuck device also includes a driving mechanism, which includes a driving source (310) and a rotating connecting member (320). The rotating connecting member (320) includes a conical positioning portion (321) and a connecting flange (322). The conical positioning portion (321) has a first end and a second end. The connecting flange (322) surrounds the conical positioning portion and is located at the first end. In the direction from the first end to the second end, the cross-sectional area of ​​the conical positioning portion (321) gradually decreases. The chuck base (120) is provided with a conical positioning hole (452). At least a portion of the conical positioning portion (321) is located in the conical positioning hole (452) and cooperates with the conical positioning hole (452). The chuck base (120) is connected to the driving source (310) via the connecting flange (322).

8. The chuck device according to claim 7, characterized in that: The driving source (310) comprises a rotating part (311) and a supporting shaft (312); the rotating part (311) is arranged around the supporting shaft (312); the rotating part (311) can rotate relative to the supporting shaft (312) along the central axis of the supporting shaft (312); the conical positioning part (321) is arranged around the supporting shaft (312); and the chuck body (100) is connected to the rotating part (311) via the connecting flange (322); The chuck device also includes a nozzle (410), the nozzle (410) is arranged at the end of the support shaft (312), the support shaft (312) is provided with a gas channel (3121) along its axial direction, the nozzle (410) is connected to the gas channel (3121), the nozzle (410) is provided with a first jet hole (412), and the first jet hole (412) is connected to the ventilation channel (101).

9. The chuck device according to claim 8, characterized in that: The nozzle (410) is provided with a second jet hole (411), and the second jet hole (411) is used for blowing out the wafer carried on the chuck body (100).

10. The chuck device according to claim 7, characterized in that: The chuck device also includes a conductive block (420) and an elastic member (430), wherein the conductive block (420) is arranged at the bottom of the chuck base (120), and the elastic member (430) is pressed between the conductive block (420) and the connecting flange (322), and the connecting flange (322) and the conductive block (420) are electrically connected via the elastic member (430).

11. The chuck device according to claim 10, characterized in that: The chuck base (120), the conductive block (420) and the connecting flange (322) are threadedly connected via a first threaded member (440), and the elastic member (430) and the first threaded member (440) are located on the same circumference.

12. A cleaning device, characterized in that: A chuck device comprising any one of claims 1 to 11.

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