Antenna packaging structure and manufacturing method thereof

Abstract

The present invention discloses an antenna packaging structure and a manufacturing method thereof, wherein the packaging structure includes at least one antenna substrate and a circuit substrate, wherein the antenna substrate is arranged above the circuit substrate, an input antenna is arranged inside the antenna substrate, the antenna substrate and the circuit substrate are welded / fixed by a support member, and the antenna packaging structure also includes a thin film layer, wherein the thin film layer completely covers the upper surface and side wall surface of the antenna substrate, and extends along the side wall surface of the antenna substrate to the upper surface of the circuit substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate, and the upper surface of the circuit substrate. A thin film layer is formed on the surface of the antenna substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate, and the upper surface of the circuit substrate, thereby reducing the signal transmission loss caused by the filling of the plastic packaging material between the circuit substrate and the antenna substrate, and also avoiding the signal transmission cavity between the circuit substrate and the antenna substrate being completely exposed to the air, thereby improving the reliability of the antenna packaging structure.

Description

Technical Field

[0001] The present invention relates to the technical field of antenna packaging, and in particular to an antenna packaging structure and a manufacturing method thereof. Background Art

[0002] With the advent of high-speed communication eras such as 5G and VR, millimeter wave communication has gradually become mainstream, and the design and application demand for millimeter wave antennas has become increasingly strong. Since the length of the transmission path in the millimeter wave band has a great impact on the signal amplitude loss, the traditional IC+PCB+antenna architecture model has gradually failed to meet high-performance requirements, and the IC+packaged antenna architecture has become the mainstream, which is the AiP (Antenna in Package) technology.

[0003] The antenna packaging structure is mainly achieved by stacking two or more substrates. The upper substrate is a multi-band input antenna (28G, 40G and 60G), and the lower substrate is used for routing. The distance between the upper and lower substrates varies with the antenna frequency. The lower the antenna frequency, the greater the distance between the upper and lower substrates. Therefore, the height of the interval can be kept consistent by mixing some core balls or high-melting-point balls between the upper and lower substrates. In the prior art, the antenna is directly exposed to the air and has low reliability. In order to improve reliability and facilitate subsequent board mounting processes, the antenna packaging structure is plastic-sealed as a whole, but the plastic sealing material around the antenna will reduce the transmission performance between the antennas. Summary of the invention

[0004] The object of the present invention is to provide an antenna packaging structure and a manufacturing method thereof.

[0005] To achieve one of the above-mentioned objects of the invention, an embodiment of the present invention provides an antenna packaging structure, comprising at least one antenna substrate and a circuit substrate, wherein the antenna substrate is arranged above the circuit substrate, an input antenna is arranged inside the antenna substrate, and the antenna substrate and the circuit substrate are fixed by a support member, wherein:

[0006] The antenna packaging structure also includes a thin film layer, which completely covers the upper surface and side wall of the antenna substrate and extends along the side wall of the antenna substrate to the upper surface of the circuit substrate. A closed cavity is formed between the thin film layer, the lower surface of the antenna substrate and the upper surface of the circuit substrate.

[0007] As a further improvement of one embodiment of the present invention, the thin film layer is an organic polymer film, the dielectric constant of which is less than 3.5 and the dielectric loss is less than 0.006.

[0008] As a further improvement of an embodiment of the present invention, the thickness of the thin film layer is greater than 40 μm.

[0009] As a further improvement of one embodiment of the present invention, the antenna substrate includes a first antenna substrate, a second antenna substrate and a third antenna substrate. The first antenna substrate is provided with an input antenna with a frequency of 28G, the second antenna substrate is provided with an input antenna with a frequency of 40G, and the third antenna substrate is provided with an input antenna with a frequency of 60G.

[0010] As a further improvement of one embodiment of the present invention, the distance between the first antenna substrate and the circuit substrate is greater than the distance between the second antenna substrate and the circuit substrate, and the distance between the second antenna substrate and the circuit substrate is greater than the distance between the third antenna substrate and the circuit substrate.

[0011] As a further improvement of an embodiment of the present invention, the support member is a solder ball and / or a core ball and / or a cured glue.

[0012] As a further improvement of an embodiment of the present invention, a plurality of beam bumps are formed on the upper surface of the antenna substrate corresponding to the input antenna, the beam bumps protrude upward along the antenna substrate, and the thin film layer also covers the upper surface of the beam bumps.

[0013] As a further improvement of an embodiment of the present invention, the beam wave convex point is a conical structure and has a lens function.

[0014] As a further improvement of an embodiment of the present invention, the angle between the conical surface and the bottom surface of the conical structure is less than 45 degrees.

[0015] As a further improvement of an embodiment of the present invention, the beam bump material is a composition of aluminum oxide and epoxy resin, and its dielectric constant is greater than 4 and its dielectric loss is less than 0.006.

[0016] As a further improvement of an embodiment of the present invention, the antenna packaging structure also includes at least one radio frequency chip and metal solder balls arranged on the lower surface of the circuit substrate, and the metal solder balls are used to achieve electrical connection with an external circuit.

[0017] As a further improvement of an embodiment of the present invention, the antenna packaging structure further includes a plastic packaging body, and the plastic packaging body completely covers the film layer and the uncovered upper surface of the circuit substrate.

[0018] The present invention also provides a method for manufacturing an antenna packaging structure, the manufacturing method comprising the steps of:

[0019] Providing at least one antenna substrate and a circuit substrate, wherein an input antenna is arranged in the antenna substrate;

[0020] A support member is arranged on the upper surface of the circuit substrate, and the antenna substrate is fixed above the circuit substrate through the support member;

[0021] A thin film layer is formed on the upper surface and side wall of the antenna substrate, and the thin film layer extends along the side wall of the antenna substrate to the upper surface of the circuit substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate, and the upper surface of the circuit substrate.

[0022] As a further improvement of an embodiment of the present invention, at least one antenna substrate and a circuit substrate are provided, and an input antenna is arranged in the antenna substrate, specifically comprising:

[0023] A first antenna substrate, a second antenna substrate and a third antenna substrate are provided. The first antenna substrate is provided with an input antenna of 28G frequency, the second antenna substrate is provided with an input antenna of 40G frequency, and the third antenna substrate is provided with an input antenna of 60G frequency.

[0024] As a further improvement of an embodiment of the present invention, forming a support member on the upper surface of the circuit substrate and fixing the antenna substrate above the circuit substrate through the support member specifically includes:

[0025] Solder balls and / or glue are welded on the upper surface of the circuit substrate, and the first antenna substrate, the second antenna substrate, and the third antenna substrate are fixedly placed on the circuit substrate by means of the solder balls and / or glue;

[0026] The distance between the first antenna substrate and the circuit substrate is greater than the distance between the second antenna substrate and the circuit substrate, and the distance between the second antenna substrate and the circuit substrate is greater than the distance between the third antenna substrate and the circuit substrate.

[0027] As a further improvement of an embodiment of the present invention, a thin film layer is formed on the upper surface and side wall surface of the antenna substrate, the thin film layer extends along the side wall surface of the antenna substrate to the upper surface of the circuit substrate, and a closed cavity is formed between the thin film layer and the lower surface of the antenna substrate and the upper surface of the circuit substrate, specifically including:

[0028] A film layer with a thickness greater than 40 μm is formed on the upper surfaces and side wall surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate by means of a lamination process, and the film layer extends along the side wall surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate to the upper surface of the circuit substrate, respectively, and a closed cavity is formed between the film layer and the lower surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate and the upper surface of the circuit substrate.

[0029] As a further improvement of an embodiment of the present invention, before forming a thin film layer on the upper surface and side wall surface of the antenna substrate corresponding to the input antenna, the method further includes the following steps:

[0030] A plurality of beam convex points with a conical structure are made on the upper surface of the antenna substrate corresponding to the upper surface where the input antenna is arranged, and the beam convex points protrude upward along the antenna substrate.

[0031] As a further improvement of an embodiment of the present invention, the manufacturing method further comprises the steps of:

[0032] By using a lamination process, a thin film layer with a thickness greater than 40 μm is formed on the upper surface of the beam wave bump.

[0033] As a further improvement of an embodiment of the present invention, the manufacturing method further comprises the steps of:

[0034] The upper surface of the film layer and the uncovered upper surface of the circuit substrate are plastic-sealed.

[0035] The beneficial effects of the present invention are as follows: a thin film layer is formed on the surface of the antenna substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate, and the upper surface of the circuit substrate, thereby reducing the signal transmission loss caused by the filling of plastic packaging material between the circuit substrate and the antenna substrate, and also avoiding the signal transmission cavity between the circuit substrate and the antenna substrate being completely exposed to the air, thereby improving the reliability of the antenna packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a side view of the antenna packaging structure in one embodiment of the present invention.

[0037] Figure 2 It is a side view of the antenna packaging structure in embodiment 1 of the present invention.

[0038] Figure 3 It is a top view of the antenna packaging structure in Example 1 of the present invention (before plastic packaging).

[0039] Figure 4 It is a side view of the antenna packaging structure in embodiment 2 of the present invention.

[0040] Figure 5 It is a top view of the antenna packaging structure in Example 2 of the present invention (before plastic packaging).

[0041] Figure 6 It is a side view of an antenna packaging structure with another beam bump structure in embodiment 2 of the present invention.

[0042] Figure 7 Schematic diagram of a method for manufacturing an antenna packaging structure in one embodiment of the present invention.

[0043] Figure 8 It is a schematic flow chart of the method for manufacturing the antenna packaging structure in Embodiment 1 of the present invention.

[0044] 9(a) to (d) are the manufacturing steps of the antenna packaging structure in Embodiment 1 of the present invention.

[0045] Fig.10 It is a schematic diagram of the process of manufacturing the antenna packaging structure in Embodiment 2 of the present invention.

[0046] 11 ( a1 ), ( a2 ) to ( d ) are the manufacturing steps of the antenna packaging structure in Embodiment 2 of the present invention. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in combination with the specific implementation methods of the present invention and the corresponding drawings. Obviously, the described implementation methods are only part of the implementation methods of the present invention, not all implementation methods. Based on the implementation methods of the present invention, all other implementation methods obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0048] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0049] For ease of explanation, this document uses terms that represent relative positions in space for description, such as "above", "below", "back", "front", etc., to describe the relationship of one unit or feature shown in the drawings relative to another unit or feature. Terms of relative positions in space can include different orientations of the device in use or operation other than the orientation shown in the figure. For example, if the device in the figure is turned over, the unit described as being "below" or "above" other units or features will be located "below" or "above" the other units or features. Therefore, the exemplary term "below" can encompass both the spatial orientations of below and above.

[0050] like Figure 1 As shown, this embodiment provides an antenna packaging structure, including at least one antenna substrate 1 and a circuit substrate 2, wherein the antenna substrate 1 is arranged above the circuit substrate 2, and an input antenna is arranged in the antenna substrate 1.

[0051] The antenna substrate 1 and the circuit substrate 2 are fixed by a support member 3, and the support member 3 is a solder ball and / or a core ball 31 and / or a cured glue 32. In this embodiment, glue is dispensed at the middle position of the upper surface of the circuit substrate 2 for bonding and fixing the antenna substrate 1 and the circuit substrate 2. Solder balls and / or core balls 31 having the same height as the cured glue 32 are welded at both ends of the upper surface of the circuit substrate 2, and the antenna substrate 1 and the circuit substrate 2 are welded together, and the surface plane of the antenna substrate 1 is ensured to be at the same position height.

[0052] Of course, in some other embodiments of the present invention, the antenna substrate 1 can also be fixed by setting metal columns and glue of the same height on the upper surface of the circuit substrate 2. The present invention does not limit the fixing method between the antenna substrate 1 and the circuit substrate 2. It is only necessary to ensure that the plane of the antenna substrate 1 fixed above the circuit substrate 2 is at the same position height and does not affect the signal transmission between the two.

[0053] Specifically, the distance between the antenna substrate 1 and the circuit substrate 2, that is, the antenna cavity height, can be controlled by controlling the height of the support member 3. The antenna cavity height is related to the input antenna frequency set in the antenna substrate 1. The higher the input antenna frequency, the lower the antenna cavity height.

[0054] Furthermore, the antenna packaging structure in this embodiment further includes a thin film layer 4, which completely covers the upper surface and side wall of the antenna substrate 1 and extends along the side wall of the antenna substrate 1 to the upper surface of the circuit substrate 2, and a closed cavity 5 is formed between the thin film layer 4 and the lower surface of the antenna substrate 1 and the upper surface of the circuit substrate 2. The thin film layer 4 can form a closed cavity structure between the antenna substrate 1 and the circuit substrate 2, which can effectively reduce the loss of signal transmission between the antenna substrate 1 and the circuit substrate 2, and also prevent the cavity formed between the antenna substrate 1 and the circuit substrate 2 from being completely exposed to the air, thereby improving the reliability of the antenna packaging structure.

[0055] The material of the film layer 4 can be an organic polymer film composed of one or more organic polymer materials such as ABF (Ajinomoto Build-Up Film), epoxy resin, etc. Specifically, the film layer 4 has a thickness greater than 40 μm, a dielectric constant less than 3.5, and a dielectric loss less than 0.006, so as to reduce the loss of signal transmission.

[0056] Here, the thicker the film layer 4 is, the higher the production cost is, and the corresponding dielectric constant and dielectric loss will also increase; the thinner the film layer 4 is, the higher the production process requirements are, and the film is more likely to be damaged during the production process. Therefore, in practical applications, the thickness of the film layer 4 can be specifically set according to the process means and cost considerations, and it only needs to ensure that the dielectric constant is less than 3.5 and the dielectric loss is less than 0.006.

[0057] The present invention provides the following two embodiments to specifically illustrate some implementation methods of the present invention.

[0058] Example 1

[0059] like Figure 2 and 3 As shown, it is a schematic diagram of the antenna packaging structure in Embodiment 1 of the present invention. The antenna packaging structure in this embodiment is a multi-module antenna packaging structure. The antenna substrate 1 specifically includes a first antenna substrate 11, a second antenna substrate 12 and a third antenna substrate 13. The first antenna substrate 11 is provided with a 28G frequency input antenna 111, the second antenna substrate 12 is provided with a 40G frequency input antenna 121, and the third antenna substrate 13 is provided with a 60G frequency input antenna 131. Specifically, the specific size of the antenna substrate with different frequency input antennas arranged above the circuit substrate 2 can be designed according to actual needs.

[0060] In other embodiments, other numbers of antenna substrates 1 may be provided, and the frequency of the input antenna provided on the antenna substrate 1 may also be specifically adjusted.

[0061] The first antenna substrate 11 and the circuit substrate 2, the second antenna substrate 12 and the circuit substrate 2, and the third antenna substrate 13 and the circuit substrate 2 are all welded / fixed via the support 3. Specifically, they are all fixed by welding solder balls and / or core balls 31 and glue 32, and the distance between the antenna substrates and the circuit substrate 2 of different input frequencies is adjusted by controlling the heights of the corresponding solder balls and / or core balls 31 and glue 32.

[0062] Since the antenna cavity height is related to the input antenna frequency set in the antenna substrate 1, it can be obtained by simulation based on the performance of antenna substrates with different frequencies. The higher the frequency of the antenna substrate input antenna, the lower the antenna cavity height. When the input antenna is a millimeter antenna with a frequency band of 28G to 60G, the antenna cavity height can be controlled at 45μm to 250μm.

[0063] Specifically, in this embodiment, the distance between the first antenna substrate 11 and the circuit substrate 2 is greater than the distance between the second antenna substrate 12 and the circuit substrate 2 , and the distance between the second antenna substrate 12 and the circuit substrate 2 is greater than the distance between the third antenna substrate 13 and the circuit substrate 2 .

[0064] Furthermore, the antenna packaging structure in this embodiment also includes a thin film layer 4, which completely covers the upper surface and side walls of the first antenna substrate 11, and extends along the side walls of the first antenna substrate 11 to the upper surface of the circuit substrate 2, and a first closed cavity 51 is enclosed between the thin film layer 4 and the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2; the thin film layer 4 completely covers the upper surface and side walls of the second antenna substrate 12, and extends along the side walls of the second antenna substrate 12 to the upper surface of the circuit substrate 2, and a second closed cavity 52 is enclosed between the thin film layer 4 and the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2; the thin film layer 4 completely covers the upper surface and side walls of the third antenna substrate 13, and extends along the side walls of the third antenna substrate 13 to the upper surface of the circuit substrate 2, and a third closed cavity (not shown in the figure) is enclosed between the thin film layer 4 and the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2. Specifically, the height of the first sealed cavity 51 is greater than the height of the second sealed cavity 52 , and the height of the second sealed cavity 52 is greater than the height of the third sealed cavity.

[0065] The thin film layer 4 can simultaneously form a closed cavity structure between each antenna substrate and the circuit substrate 2 with different antenna cavity heights, which can effectively reduce the signal transmission loss between each antenna substrate and the circuit substrate 2, and also avoid the cavity formed between each antenna substrate and the circuit substrate 2 from being completely exposed to the air, thereby improving the reliability of the antenna packaging structure.

[0066] The material of the film layer 4 can be an organic polymer film composed of one or more organic polymer materials such as ABF, epoxy resin, etc. Specifically, the film layer 4 has a thickness greater than 40 μm, a dielectric constant less than 3.5, and a dielectric loss less than 0.006 to reduce the loss of signal transmission.

[0067] The antenna packaging structure in this embodiment also includes at least one RF chip 6. Here, the present invention is not limited to the manufacturing process of packaging the RF chip 6 on the surface of the circuit substrate 2. The RF chip 6 can be welded to a specific position on the circuit substrate 2 through a chip flip-chip process or a conventional flip-chip process. The present invention is not limited here either. The RF chip 6 can be flip-chip welded to the lower surface of the circuit substrate 2 or welded to the upper surface of the circuit substrate 2. This embodiment is described with the structure of flip-chip welding the chip to the lower surface of the circuit substrate 2. The welding place between the RF chip 6 and the circuit substrate 2 is also filled with bottom filling glue to prevent the problem of fracture of the welding place between the RF chip 6 and the circuit substrate 2 due to thermal stress or mechanical impact, and enhance the bonding force between the two.

[0068] Furthermore, in order to achieve transmission between the antenna packaging structure and external signals, metal solder balls 7 are further provided on the lower surface of the circuit substrate 2 , and the metal solder balls 7 are used to achieve electrical connection with external circuits.

[0069] Furthermore, in order to enhance the reliability of the antenna packaging structure and adjust the warping problem of the substrate, the antenna packaging structure in this embodiment also includes a plastic package 8, which completely covers the film layer 4 and the uncovered upper and lower surfaces of the circuit substrate 2.

[0070] The material of the plastic package 8 is an EMC (Epoxy Molding Compound) material with low dielectric constant and low dielectric loss, specifically a composition of silicon dioxide and epoxy resin materials, and its material properties meet the requirements of dielectric constant less than 3 and dielectric loss less than 0.006, thereby reducing the loss of signal transmission between substrates.

[0071] Of course, in some other embodiments of the present invention, the plastic packaging body 8 can also be a plastic packaging material of one or more compositions such as phenolic resin, silicone, amino, unsaturated resin, etc. The present invention is not limited here. The material performance of the plastic packaging body 8 satisfies that the dielectric constant is less than 3 and the dielectric loss is less than 0.006.

[0072] Example 2

[0073] like Figure 4 and 5 As shown, it is a schematic diagram of the antenna packaging structure in Example 2 of the present invention. Different from the structure in Example 1, in this embodiment, a plurality of beam bumps 9 are formed on the upper surface of the antenna substrate 1 corresponding to the input antenna. The beam bumps 9 protrude upward along the antenna substrate 1, which can focus and transmit the antenna transmission signal.

[0074] Specifically, in Figure 3 The corresponding positions of the input antenna 111 with a frequency of 28G on the upper surface of the first antenna substrate 11, the corresponding positions of the input antenna 121 with a frequency of 40G on the upper surface of the second antenna substrate 12, and the corresponding positions of the input antenna 131 with a frequency of 60G on the upper surface of the third antenna substrate 13 are respectively formed with beam bumps 9. Providing beam bumps 9 at the input antenna positions can enhance the directivity of the antenna signal transmission of the antenna substrate and avoid mutual interference between different transmission signals.

[0075] The beam bump 9 is specifically a conical structure, which can maximize the concentration and emission of the transmission signal of the antenna substrate. To facilitate process processing, the angle between the cone surface and the bottom surface of the conical structure is set to be less than 45 degrees, which has a lens function. The material used to make the beam bump 9 is an EMC material with a high dielectric constant and low dielectric loss, specifically a composition of aluminum oxide and epoxy resin. The larger the dielectric constant of the material used to make the beam bump 9, the higher the binding property of its material field. In order to further enhance the beam capability of the beam bump 9, the performance of the specific material used to make the beam bump 9 satisfies the dielectric constant greater than 4 and the dielectric loss less than 0.006.

[0076] The beam wave convex point 9 forms a conical lens, and the angle between the cone surface and the bottom surface of the conical structure is set to be less than 45 degrees. While being able to focus and transmit the antenna transmission signal, it can also reduce the loss of signal transmission.

[0077] It is understandable that, due to manufacturing errors, it is difficult to form a standard conical structure at the top corner of the beam bump 9, so the structure in which the top corner of the beam bump 9 is rounded is also within the protection scope of the present invention.

[0078] In some other embodiments of the present invention, Figure 6 As shown, a base 91 is included at the bottom of the conical beam bump 9 to enhance the stability of the beam bump 9 on the antenna substrate surface. The base 91 is integrally formed with the beam bump 9 and made of the same material. The present invention does not limit the specific thickness of the base 91, which can be designed according to actual application requirements.

[0079] The beam wave convex point 9 can also be a tower-type structure, a prismatic structure or other structures with upward protruding points, which are also within the protection scope of the present invention as long as they can form a beam wave and the signals emitted by each beam wave convex point 9 do not interfere with each other.

[0080] In this embodiment, the thin film layer 4 completely covers the upper surface of the beam bump 9, and the upper surfaces and side walls of the first antenna substrate 11, the second antenna substrate 12, and the third antenna substrate 13 that are not covered by the beam bump 9, and extends along the side walls of the first antenna substrate 11, the second antenna substrate 12, and the third antenna substrate 13 to the upper surface of the circuit substrate 2. Similarly, the thin film layer 4 forms a first closed cavity 51 between the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2, a second closed cavity 52 between the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2, and a third closed cavity (not shown in the figure) between the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2.

[0081] Specifically, the height of the first sealed cavity 51 is greater than the height of the second sealed cavity 52 , and the height of the second sealed cavity 52 is greater than the height of the third sealed cavity.

[0082] The thin film layer 4 can simultaneously form a closed cavity structure between the antenna substrate and the circuit substrate 2 with different antenna cavity heights, which can effectively reduce the signal transmission loss between the antenna substrate and the circuit substrate 2, and prevent the cavity formed between the antenna substrate and the circuit substrate 2 from being completely exposed to the air, thereby improving the reliability of the antenna packaging structure.

[0083] The material of the film layer 4 can be an organic polymer film composed of one or more organic polymer materials such as ABF, epoxy resin, etc. Specifically, the film layer 4 has a thickness greater than 40 μm, a dielectric constant less than 3.5, and a dielectric loss less than 0.006 to reduce the loss of signal transmission.

[0084] The antenna packaging structure in this embodiment specifically also includes a radio frequency chip 6 flip-chip mounted on the lower surface of the circuit substrate 2, a metal solder ball 7 for electrically connecting to an external circuit, and a plastic package 8. Its specific structural arrangement is the same as that in Example 1 and will not be described in detail here.

[0085] like Figure 7 As shown, the present invention also provides a method for manufacturing an antenna packaging structure, comprising the steps of:

[0086] S1: Provide at least one antenna substrate 1 and a circuit substrate 2, wherein the antenna substrate 1 is provided with an input antenna.

[0087] S2: forming a support member 3 on the upper surface of the circuit substrate 2 , and fixing the antenna substrate 1 on the circuit substrate 2 through the support member 3 .

[0088] S3: forming a thin film layer 4 on the upper surface and side wall of the circuit substrate 2, the thin film layer 4 extending along the side wall of the antenna substrate 1 to the upper surface of the circuit substrate 2, and forming a closed cavity 5 between the thin film layer 4 and the lower surface of the antenna substrate 1 and the upper surface of the circuit substrate 2.

[0089] To further illustrate in detail the manufacturing method of the antenna packaging structure in some embodiments of the present invention, the manufacturing method of the antenna packaging structure in Example 1 and Example 2 provided by the present invention is specifically described below.

[0090] like Figure 8 FIG. 1 is a flow chart of a method for manufacturing an antenna packaging structure in Embodiment 1 of the present invention, which specifically includes the following steps:

[0091] S11 : providing a first antenna substrate 11 , a second antenna substrate 12 , a third antenna substrate 13 and a circuit substrate 2 .

[0092] Specifically, the first antenna substrate 11 is provided with an input antenna of a 28G frequency, the second antenna substrate 12 is provided with an input antenna of a 40G frequency, and the third antenna substrate 13 is provided with an input antenna of a 60G frequency.

[0093] S21: Solder solder balls and / or core balls 31 and / or dispense glue on the upper surface of the circuit substrate 2, and fix the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 on the circuit substrate 2 by soldering solder balls and / or core balls 31 and / or dispensing glue.

[0094] Specifically, as shown in FIG9(a), glue is dispensed on the upper surface of the circuit substrate 2 to bond and fix the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 to the circuit substrate 2, and solder balls and / or core balls 31 at the same height as the cured glue 32 are welded on the upper surface of the circuit substrate 2 at both ends of each antenna substrate placed above it, and each antenna substrate is welded to the circuit substrate 2, and the surface plane of each antenna substrate is ensured to be parallel to the surface of the circuit substrate 2. In some other embodiments of the present invention, each antenna substrate can also be bonded and fixed to the circuit substrate by opening holes in each antenna substrate and dispensing glue.

[0095] More specifically, since the height of the antenna cavity is related to the input antenna frequency set in the antenna substrate, it is necessary to pay attention to the spacing between the antenna substrate and the circuit substrate 2 at different antenna frequencies. In this embodiment, the height of the solder ball and / or core ball 31 and / or glue 32 between the first antenna substrate 11 and the circuit substrate 2 is controlled to be greater than the height of the solder ball and / or core ball 31 and / or glue 32 between the second antenna substrate 12 and the circuit substrate 2, and the height of the solder ball and / or core ball 31 and / or glue 32 between the second antenna substrate 12 and the circuit substrate 2 is controlled to be greater than the height of the solder ball and / or core ball 31 and / or glue 32 between the third antenna substrate 13 and the circuit substrate 2, that is, the spacing formed between the first antenna substrate 11 and the circuit substrate 2 is greater than the spacing formed between the second antenna substrate 12 and the circuit substrate 2, and the spacing formed between the second antenna substrate 12 and the circuit substrate 2 is greater than the spacing formed between the third antenna substrate 13 and the circuit substrate 2.

[0096] S31: A thin film layer 4 having a thickness greater than 40 μm is formed on the upper surfaces and side walls of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 by means of a lamination process, and the thin film layer 4 extends along the side walls of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 to the upper surface of the circuit substrate 2, and a closed cavity 5 is formed between the thin film layer 4 and the lower surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 and the upper surface of the circuit substrate 2.

[0097] The material of the thin film layer 4 can be an organic polymer film composed of one or more organic polymer materials such as ABF, epoxy resin, etc., with a dielectric constant less than 3.5 and a dielectric loss less than 0.006 to reduce the loss of signal transmission.

[0098] Specifically, as shown in FIG9(b), the thin film layer 4, the lower surface of the first antenna substrate 11, and the upper surface of the circuit substrate 2 are surrounded to form a first closed cavity 51, the thin film layer 4, the lower surface of the second antenna substrate 12, and the upper surface of the circuit substrate 2 are surrounded to form a second closed cavity 52, and the thin film layer 4, the lower surface of the third antenna substrate 13, and the upper surface of the circuit substrate 2 are surrounded to form a third closed cavity (not shown in the figure). Of course, the height of the first closed cavity 51 is greater than that of the second closed cavity 52, and the height of the second closed cavity 52 is greater than that of the third closed cavity.

[0099] S41: The RF chip 6 is flip-chip bonded to the lower surface of the circuit substrate 2 using a flip-chip bonding process.

[0100] The present invention does not limit the specific manufacturing process of packaging the RF chip 6 on the lower surface of the circuit substrate 2, and the RF chip 6 can also be welded to the lower surface of the circuit substrate 2 through a conventional flip chip process. Of course, the welding point between the RF chip 6 and the circuit substrate 2 is also filled with bottom filling glue to prevent the problem of fracture of the welding point between the RF chip 6 and the circuit substrate 2 due to thermal stress or mechanical impact, and enhance the bonding force between the two.

[0101] S51: soldering metal solder balls 7 on the lower surface of the circuit substrate 2, as shown in FIG. 9(c).

[0102] In order to realize the transmission between the antenna packaging structure and the external signal, metal solder balls 7 are soldered on the lower surface of the circuit substrate 2 to realize electrical connection with the external circuit.

[0103] S61: The upper surface of the plastic film layer 4 and the uncovered upper and lower surfaces of the circuit substrate 2 are sealed, as shown in FIG. 9( d ).

[0104] like Fig.10 FIG. 1 is a flow chart of a method for manufacturing an antenna packaging structure in Embodiment 2 of the present invention. The difference from the method for manufacturing the structure in Embodiment 1 is that before the lamination process is performed, the method further includes the following steps:

[0105] Sa: A plurality of beam bumps 9 with a conical structure are made on the upper surface of the antenna substrate 1 corresponding to the input antenna, and the beam bumps 9 extend upward along the antenna substrate.

[0106] A mold with a conical structure can be used to form a conical beam bump 9 by injection molding in the conical mold. Specifically, as shown in FIG11(a1), a conical beam bump 9 is formed at a corresponding position of a 28G frequency input antenna on the upper surface of the first antenna substrate 11, a corresponding position of a 40G frequency input antenna on the upper surface of the second antenna substrate 12, and a corresponding position of a 60G frequency input antenna on the upper surface of the third antenna substrate 13.

[0107] To facilitate processing, the angle between the cone surface and the bottom surface of the beam bump 9 forming a conical structure is usually less than 45 degrees, and it has a lens function. The material of the beam bump 9 is an EMC material with a high dielectric constant and low dielectric loss, specifically a composition of aluminum oxide and epoxy resin. The larger the dielectric constant of the material of the beam bump 9, the higher the binding property of the material field. In order to further enhance the beaming ability of the beam bump 9, the performance of the specific material of the beam bump 9 satisfies the dielectric constant greater than 4 and the dielectric loss less than 0.006.

[0108] The beam bump 9 is manufactured to form a conical lens, and the angle between the cone surface and the bottom surface of the conical structure is less than 45 degrees, which can focus and transmit the antenna transmission signal while reducing the loss of signal transmission.

[0109] It is understandable that, due to manufacturing errors, it is difficult to manufacture the top corner of the beam bump 9 into a standard conical structure, so the top corner of the beam bump 9 is manufactured into a rounded structure which is also within the protection scope of the present invention.

[0110] In some other embodiments of the present invention, as shown in FIG. 11 (a2), a base 91 is further made at the bottom of the beam wave convex point 9 to enhance the stability of the beam wave convex point 9 set on the surface of the antenna substrate. The base 91 is integrally formed with the beam wave convex point 9 and made of the same material. The present invention does not limit the specific thickness of the base 91, which can be designed according to actual application requirements.

[0111] S32: By means of a lamination process, a thin film layer 4 having a thickness greater than 40 μm is formed on the upper surface of the beam bump 9, and the upper surfaces and side walls of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 that are not covered by the beam bump 9, wherein the thin film layer 4 extends along the side walls of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 to the upper surface of the circuit substrate 2, and a closed cavity 5 is formed between the thin film layer 4 and the lower surfaces of the first antenna substrate 11, the second antenna substrate 12 and the third antenna substrate 13 and the upper surface of the circuit substrate 2.

[0112] Similarly, the material of the thin film layer 4 can be an organic polymer film composed of one or more organic polymer materials such as ABF, epoxy resin, etc., with a dielectric constant less than 3.5 and a dielectric loss less than 0.006 to reduce the loss of signal transmission.

[0113] The lamination process is described based on the structure in FIG11(a1). As shown in FIG11(b), the thin film layer 4, the lower surface of the first antenna substrate 11 and the upper surface of the circuit substrate 2 are surrounded to form a first closed cavity 51, the thin film layer 4, the lower surface of the second antenna substrate 12 and the upper surface of the circuit substrate 2 are surrounded to form a second closed cavity 52, and the thin film layer 4, the lower surface of the third antenna substrate 13 and the upper surface of the circuit substrate 2 are surrounded to form a third closed cavity (not shown in the figure). Of course, the height of the first closed cavity 51 is greater than that of the second closed cavity 52, and the height of the second closed cavity 52 is greater than that of the third closed cavity.

[0114] The other steps of the manufacturing method are the same as those of the structural manufacturing method in Example 1, and will not be described in detail here. The specific manufacturing process is as follows: Figure 11(a1) to Figure 11(d) shown.

[0115] In summary, the present invention forms a thin film layer on the surface of the antenna substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate, and the upper surface of the circuit substrate, thereby reducing the signal transmission loss caused by the filling of the plastic packaging material between the circuit substrate and the antenna substrate, and also avoiding the signal transmission cavity between the circuit substrate and the antenna substrate being completely exposed to the air, thereby improving the reliability of the antenna packaging structure. In addition, a plurality of beam bumps are formed at the position where the antenna is transmitted on the surface of the antenna substrate, thereby enhancing the directionality of the signal transmission of the antenna substrate and avoiding interference between signals transmitted by different antennas.

[0116] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0117] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

Claims

1. An antenna packaging structure, comprising at least one antenna substrate and a circuit substrate, wherein the antenna substrate is arranged above the circuit substrate, an input antenna is arranged inside the antenna substrate, and the antenna substrate and the circuit substrate are fixed by a support member, characterized in that: The antenna packaging structure further includes a thin film layer, which completely covers the upper surface and side wall surface of the antenna substrate and extends along the side wall surface of the antenna substrate to the upper surface of the circuit substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate and the upper surface of the circuit substrate; Among them, the antenna packaging structure includes multiple antenna substrates with different input frequencies, and the multiple antenna substrates form cavities of different heights with the upper surface of the circuit substrate through support members of different heights. The thin film layer extends from the area between adjacent antenna substrates to the upper surface of the circuit substrate to form multiple closed cavities corresponding to the multiple antenna substrates.

2. The antenna packaging structure according to claim 1, characterized in that: The thin film layer is an organic polymer film, the dielectric constant of which is less than 3.5 and the dielectric loss is less than 0.

006.

3. The antenna packaging structure according to claim 2, characterized in that: The film layer has a thickness greater than 40 μm.

4. The antenna packaging structure according to claim 1, characterized in that: The antenna substrate includes a first antenna substrate, a second antenna substrate and a third antenna substrate. The first antenna substrate is provided with an input antenna of 28G frequency, the second antenna substrate is provided with an input antenna of 40G frequency, and the third antenna substrate is provided with an input antenna of 60G frequency.

5. The antenna packaging structure according to claim 4, characterized in that: The distance between the first antenna substrate and the circuit substrate is greater than the distance between the second antenna substrate and the circuit substrate, and the distance between the second antenna substrate and the circuit substrate is greater than the distance between the third antenna substrate and the circuit substrate.

6. The antenna packaging structure according to claim 1, characterized in that: The support member is a solder ball and / or a core ball and / or curing glue.

7. The antenna packaging structure according to any one of claims 1 to 6, characterized in that: A plurality of beam convex points are formed on the upper surface of the antenna substrate corresponding to the upper surface where the input antenna is arranged. The beam convex points protrude upward along the antenna substrate, and the thin film layer also covers the upper surface of the beam convex points.

8. The antenna packaging structure according to claim 7, characterized in that: The beam wave convex point is a conical structure and has a lens function.

9. The antenna packaging structure according to claim 8, characterized in that: The angle between the conical surface and the bottom surface of the conical structure is less than 45 degrees.

10. The antenna packaging structure according to claim 9, characterized in that: The beam wave bump material is a composition of aluminum oxide and epoxy resin, with a dielectric constant greater than 4 and a dielectric loss less than 0.

006.

11. The antenna packaging structure according to claim 7, characterized in that: The antenna packaging structure also includes at least one radio frequency chip and metal solder balls arranged on the lower surface of the circuit substrate, and the metal solder balls are used to achieve electrical connection with an external circuit.

12. The antenna packaging structure according to claim 7, characterized in that: The antenna packaging structure further includes a plastic packaging body, which completely covers the film layer and the uncovered upper surface of the circuit substrate.

13. A method for manufacturing an antenna packaging structure, characterized in that: The production method comprises the steps of: Providing at least one antenna substrate and a circuit substrate, wherein an input antenna is arranged in the antenna substrate; A support member is arranged on the upper surface of the circuit substrate, and the antenna substrate is fixed above the circuit substrate through the support member; A thin film layer is formed on the upper surface and side wall of the antenna substrate, the thin film layer extends along the side wall of the antenna substrate to the upper surface of the circuit substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate and the upper surface of the circuit substrate, wherein the antenna packaging structure includes a plurality of antenna substrates with different input frequencies, and the plurality of antenna substrates form cavities of different heights with the upper surface of the circuit substrate through support members of different heights, and the thin film layer extends from the area between adjacent antenna substrates to the upper surface of the circuit substrate to form a plurality of closed cavities corresponding to the plurality of antenna substrates.

14. The method for manufacturing the antenna packaging structure according to claim 13, characterized in that: The providing of at least one antenna substrate and a circuit substrate, wherein an input antenna is arranged in the antenna substrate, specifically comprises: A first antenna substrate, a second antenna substrate and a third antenna substrate are provided. The first antenna substrate is provided with an input antenna of 28G frequency, the second antenna substrate is provided with an input antenna of 40G frequency, and the third antenna substrate is provided with an input antenna of 60G frequency.

15. The method for manufacturing the antenna packaging structure according to claim 14, characterized in that: The step of forming a support member on the upper surface of the circuit substrate and fixing the antenna substrate on the circuit substrate through the support member specifically includes: Solder balls and / or glue are welded on the upper surface of the circuit substrate, and the first antenna substrate, the second antenna substrate, and the third antenna substrate are fixedly placed on the circuit substrate by means of the solder balls and / or glue; The distance between the first antenna substrate and the circuit substrate is greater than the distance between the second antenna substrate and the circuit substrate, and the distance between the second antenna substrate and the circuit substrate is greater than the distance between the third antenna substrate and the circuit substrate.

16. The method for manufacturing the antenna packaging structure according to claim 15, characterized in that: The method comprises forming a thin film layer on the upper surface and the side wall of the antenna substrate, wherein the thin film layer extends along the side wall of the antenna substrate to the upper surface of the circuit substrate, and a closed cavity is formed between the thin film layer, the lower surface of the antenna substrate, and the upper surface of the circuit substrate. Specifically, the method comprises: A film layer with a thickness greater than 40 μm is formed on the upper surfaces and side wall surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate by means of a lamination process, and the film layer extends along the side wall surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate to the upper surface of the circuit substrate, respectively, and a closed cavity is formed between the film layer and the lower surfaces of the first antenna substrate, the second antenna substrate and the third antenna substrate and the upper surface of the circuit substrate.

17. The method for manufacturing the antenna packaging structure according to claim 16, characterized in that: Before forming a thin film layer on the upper surface and side wall surface of the antenna substrate corresponding to the input antenna, the method further includes the following steps: A plurality of beam convex points with a conical structure are made on the upper surface of the antenna substrate corresponding to the upper surface where the input antenna is arranged, and the beam convex points protrude upward along the antenna substrate.

18. The method for manufacturing the antenna packaging structure according to claim 17, characterized in that: The production method further comprises the steps of: By using a lamination process, a thin film layer with a thickness greater than 40 μm is formed on the upper surface of the beam wave bump.

19. The method for manufacturing the antenna packaging structure according to claim 18, characterized in that: The production method further comprises the steps of: The upper surface of the film layer and the uncovered upper surface of the circuit substrate are plastic-sealed.

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