Probe block, signal expander, and semiconductor test machine

Abstract

The application relates to a probe block, a signal expansion device and a semiconductor testing machine. The probe block comprises: an insulating base; a conductive component arranged on the back surface of the insulating base, wherein a first through hole structure and a second through hole structure are arranged in the conductive component, the first through hole structure is used for penetrating a first wire core, and the conductive component is used for electrically connecting with a reference signal layer; a first signal type probe penetratingly arranged on the front surface of the insulating base and used for connecting with the first wire core penetrating the first through hole structure; and a second signal type probe penetratingly arranged on the front surface of the insulating base and adjacent to the first signal type probe, wherein the second signal type probe penetrates out of the second through hole structure and is electrically connected with the conductive component. The probe block is connected with a cable, so that the return path of the signal can be kept continuous and complete.

Description

Technical Field

[0001] This application relates to the field of signal transmission technology, and in particular to a probe block, a signal extension device, and a semiconductor testing machine. Background Technology

[0002] A cable consists of, from the inside out, wire cores, dielectric layer, reference signal layer, and insulation layer. When using a cable for high-speed signal transmission, the wire cores are used to transmit signals, the dielectric layer is used to control impedance, the reference signal layer is equivalent to a shielding ground, serving as the signal return path and also shielding external noise. It can be used to shield external signals after they are brought in from the wire cores to prevent signal leakage to the outside of the cable, and the insulation layer is equivalent to a protective sleeve, used to protect the internal layers.

[0003] When existing cables are connected to probes on a probe block, the wire core is usually connected to the first signal type probe, and after reference signal layer processing, it is connected to another adjacent second signal type probe. This is equivalent to connecting the signal ground to another second signal type probe. However, this connection method means that the first signal type probe can only be matched with one second signal type probe, and the impedance continuity is poor, resulting in poor integrity of the returned signal and easy signal crosstalk. Summary of the Invention

[0004] Therefore, it is necessary to provide a probe block, signal expansion device, and semiconductor tester that can guarantee the integrity of the returned signal in response to the above-mentioned technical problems.

[0005] A probe block for connection to a cable, the cable comprising, from the inside out, a first conductor, a dielectric layer, a reference signal layer, and an insulating layer, the probe block comprising:

[0006] Insulating base;

[0007] A conductive component is disposed on the back side of the insulating base. The conductive component has a first through-hole structure and a second through-hole structure. The first through-hole structure is used for the first wire core to pass through. The conductive component is used for electrical connection with the reference signal layer.

[0008] A first signal type probe is disposed through the front side of the insulating base for connection with a first wire core passing through the first through-hole structure;

[0009] A second signal type probe is disposed through the front side of the insulating base and adjacent to the first signal type probe; the second signal type probe passes through the second through hole structure and is electrically connected to the conductive component.

[0010] The aforementioned probe block electrically connects its conductive components to the reference signal layer and to each second signal type probe, thereby matching one first signal type probe with multiple adjacent second signal type probes. This converts the return path into multiple second signal type probes with multiple wrapping wire cores. This configuration maintains the continuity and integrity of the return path and eliminates the need to cut and separate the braided mesh into burr wire groups for connection with the second signal type probes. It also prevents the introduction of air into the dielectric layer, solving the problem of signal impedance discontinuity in the prior art and thus improving the integrity of the returned signal.

[0011] In one embodiment, each of the first signal type probes and each of the second signal type probes are arranged in an array. When the first signal type probe is at the edge position, one first signal type probe is adjacent to two or three second signal type probes; when the first signal type probe is not at the edge position, one first signal type probe is adjacent to four second signal type probes.

[0012] In one embodiment, the conductive component includes a plurality of interconnected conductive sheets, each of which has a first recess and a second recess on its edge. The first recesses are spliced ​​together to form a first through-hole structure, and the second recesses are spliced ​​together to form a second through-hole structure.

[0013] A signal extension device includes: a cable and a probe block as described above. The cable includes a first wire core, a dielectric layer, a reference signal layer and an insulating layer respectively disposed from the inside to the outside. The first wire core passes through a first through-hole structure and is connected to a first signal type probe. The reference signal layer abuts against the conductive component.

[0014] The advantages of the aforementioned signal expansion device over existing technologies are the same as those of the aforementioned probe block over existing technologies, and will not be repeated here.

[0015] In one embodiment, the first signal type probe includes a first signal type probe body and a first connection terminal, the first connection terminal being located on the side of the first signal type probe body near the cable, and the first connection terminal being connected to a first wire core passing through the first through-hole structure; the second signal type probe includes a second signal type probe body and a second connection terminal, the second connection terminal being located on the side of the second signal type probe body near the cable, and the second connection terminal being electrically connected to the conductive component.

[0016] In one embodiment, when the cable is a coaxial cable, the reference signal layer includes a braided mesh layer that is electrically connected to the conductive component.

[0017] In one embodiment, at least a portion of the braided mesh layer not covered by the insulating layer is located within the first through-hole structure, and the side of the braided mesh layer is welded to or abuts against the inner wall of the first through-hole structure; or...

[0018] The braided mesh layer, which is not covered by the insulating layer, is located outside the first through-hole structure. The end face of the braided mesh layer near the conductive component is welded or abutted to the surface of the conductive component near the braided mesh layer.

[0019] In one embodiment, when the cable is an aluminum foil wire, the reference signal layer includes a second wire core and a shielding layer that are interconnected, the second wire core being electrically connected to the conductive component.

[0020] In one embodiment, at least a portion of the second wire core not covered by the insulation layer is located within the first through-hole structure, and the side of the second wire core is welded to or abuts against the inner wall of the first through-hole structure; or...

[0021] The second wire core, which is not covered by the insulating layer, is located outside the first through-hole structure, and the end face of the second wire core near the conductive component is welded or abutted to the surface of the conductive component near the second wire core.

[0022] A semiconductor testing machine includes the signal expansion device described above.

[0023] The advantages of the aforementioned semiconductor testing machine over existing technologies are the same as those of the aforementioned signal expansion device over existing technologies, and will not be repeated here. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the cross-sectional structure of an existing coaxial cable;

[0025] Figure 2 This is a schematic diagram of the connection structure between a coaxial cable and a probe block in the prior art.

[0026] Figure 3 This is a schematic diagram of the cross-sectional structure of an existing aluminum foil wire;

[0027] Figure 4 This is a schematic diagram of the connection structure between the aluminum foil wire and the probe block in the prior art.

[0028] Figure 5 This is a diagram showing the positional relationship between probes of the first signal type and the second signal type in the prior art.

[0029] Figure 6 This is a schematic diagram of the probe block structure in one embodiment;

[0030] Figure 7 for Figure 6Enlarged view of section I;

[0031] Figure 8 This is a bottom view of the connection structure between the probe block and the cable in one embodiment;

[0032] Figure 9 This is a diagram showing the connection relationship between the probe block and the cable in one embodiment;

[0033] Figure 10 and Figure 11 These are schematic diagrams of the conductive sheet structure in different embodiments;

[0034] Figure 12 This is a diagram showing the connection relationship between the probe block and the coaxial cable in one embodiment;

[0035] Figure 13 This is a diagram showing the connection relationship between the probe block and the aluminum foil line in one embodiment;

[0036] Figure 14 This is an arrangement diagram of the first signal type and the second signal type probes in one embodiment;

[0037] Figure 15 This is a diagram showing the positional relationship between the first signal type and the second signal type probes in one embodiment;

[0038] Figure 16 This is a diagram showing the connection relationship between the probe block and the coaxial cable in another embodiment;

[0039] Figure 17 This is a diagram showing the connection relationship between the probe block and the coaxial cable in another embodiment;

[0040] Figure 18 This is a side view of the connection structure between the probe block and the coaxial cable in one embodiment;

[0041] Figure 19 This is a diagram showing the connection relationship between the probe block and the aluminum foil wire in another embodiment;

[0042] Figure 20 This is a diagram showing the connection relationship between the first and second connecting terminals and the base in one embodiment.

[0043] Explanation of reference numerals in the attached figures:

[0044] 1-Cable, 1A-Coaxial cable, 1B-Aluminum foil wire, 11-First core, 12-Dielectric layer, 13-Reference signal layer, 13A-Braided mesh layer, 13B-Second core, 13C-Shielding layer, 14-Insulation layer, 2-Probe block, 21-Insulating base, 22-Conductive component, 221-First through-hole structure, 222-Second through-hole structure, 223-Conductive sheet, 224-Substrate, 225-Conductive ring, 226-Signal transmission line, 227-Insulating sleeve, 23-First signal type probe, 230-First signal type probe body, 231-First connection terminal, 24-Second signal type probe, 240-Second signal type probe body, 241-Second connection terminal, 3-Solder. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0047] It is understood that the terms “first,” “second,” etc., used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another.

[0048] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0049] It should be noted that when one element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediary element. Furthermore, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if there is an exchange of electrical signals or data between the connected objects.

[0050] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0051] As described in the background section, existing cables 1 include, from the inside out, a first conductor, a dielectric layer, a reference signal layer, and an insulation layer. When the cable is connected to probes on a probe block, the first conductor is typically connected to a probe of a first signal type, and the reference signal layer, after processing, is connected to an adjacent probe of a second signal type. For example, as... Figure 1 and Figure 2 As shown, if cable 1 is a coaxial cable 1A, then for coaxial cable 1A, the reference signal layer 13 is a braided mesh layer 13A. Since the braided mesh material is relatively brittle, it can only be split open and separated into a group of burr wires. This group of burr wires is then connected to a second signal type probe 24. For example, as... Figure 3 and Figure 4 As shown, if cable 1 is aluminum foil wire 1B, for aluminum foil wire 1B, the reference signal layer 13 includes a second core 13B and a shielding layer 13C. The second core 13B can only be connected to one second signal type probe 24. Therefore, the reference signal layer 13 can only be connected to one second signal type probe 24, that is, the first signal type probe 23 corresponding to the core has only one corresponding second signal type probe 24 as a reference.

[0052] For both coaxial cable 1A and aluminum foil cable 1B, the existing connection method introduces air into the dielectric layer 12. Therefore, the existing connection method also suffers from signal impedance discontinuity; the air in the return path causes impedance abrupt changes. For example... Figure 5 As shown, in the prior art, since the first signal type probe 23 only matches one corresponding second signal type probe 24, the first signal type probe 23 and the second signal type probe 24 are distributed in a 1:1 ratio. Let S represent the first signal type probe 23 and G represent the second signal type probe 24. Then, for the probe at the center position (… Figure 5 For the first signal type probe 23 (circled in the middle), there can be a situation where one S corresponds to three Gs. That is, even at non-edge positions, the first signal type probe 23 cannot guarantee that one S always corresponds to four Gs. Since the impedance is better controlled by having one S surrounded by four Gs, the situation where one S corresponds to three Gs is also not conducive to controlling impedance continuity. When multiple cables 1 are connected simultaneously, let one of two adjacent cables 1 be the first cable and the other be the second cable. The first cable is connected to one first signal type probe 23 and one second signal type probe 24. The second cable adjacent to the first cable is also connected to one first signal type probe 23 and one second signal type probe 24. The first signal type probe 23 connected to the first cable is also adjacent to the other second signal type probe 24 connected to the second cable. Taking the signal transmitted by the first signal type probe 23 as the S-end signal and the signal transmitted by the second signal type probe 24 as the G-end signal, theoretically, the S-end signal transmitted by the first cable can refer to either the corresponding G-end signal or the G-end signal transmitted by the second cable. However, if... Figure 2 and Figure 4 As shown, air is introduced into all dielectric layers 12. Because only a small section of the braided mesh layer 13A and the second core 13B is exposed, with the rest shielded by the insulation layer 14 in the cable 1, the S-terminal signal transmitted by the first cable cannot be completely referenced to the G-terminal signal transmitted by the second cable. After receiving a small portion of the G-terminal signal, the return current signal in the adjacent return path is interrupted because the reference signal layer 13 is covered by the insulation layer 14, preventing further reception and resulting in decreased signal integrity. Furthermore, due to the inability to completely reference the G-terminal signal transmitted by the second cable, even in the prior art where one S corresponds to four Gs, poor signal integrity still exists. Even with multiple surrounding G-terminal signals for reference, the impedance jump caused by the air dielectric and the interruption of the reference G-terminal signal caused by the insulation layer 14 cannot be eliminated. Therefore, the existing connection method between the cable 1 and the probe block 2 leads to poor return signal integrity.

[0053] To address the above problems, in one embodiment, such as Figures 6 to 9As shown, this application provides a probe block 2 for connecting to a cable 1. The cable 1 includes a first core 11, a dielectric layer 12, a reference signal layer 13, and an insulating layer 14, respectively arranged from the inside to the outside. The probe block 2 includes an insulating base 21, a conductive component 22, a first signal type probe 23, and a second signal type probe 24. The conductive component 22 is disposed on the back side of the insulating base 21. The conductive component 22 has a first through-hole structure 221 and a second through-hole structure 222. The first through-hole structure 221 is used for the first core 11 to pass through, and the conductive component 22 is used for electrical connection with the reference signal layer 13. The first signal type probe 23 is disposed through the front side of the insulating base 21 and is used for connection with the first core 11 passing through the first through-hole structure 221. The second signal type probe 24 is disposed through the front side of the insulating base 21 and is adjacent to the first signal type probe 23. The second signal type probe 24 passes through the second through-hole structure 222 and is electrically connected to the conductive component 22.

[0054] The insulating base 21 is made of insulating material in at least a portion of its area, ensuring that when the first signal type probe 23 and the second signal type probe 24 are mounted on the insulating base 21, they are not electrically connected solely through the insulating base 21. The first signal type probe 23 and the second signal type probe 24 penetrate the front of the insulating base 21, meaning they pass through the insulating base 21 from the front and are mounted on it. When the conductive component 22 is connected to the back of the probe block 2, there is no gap between the conductive component 22 and the probe block 2, preventing the exposed first wire core 11 from being exposed to the outside air. The material of the conductive component 22 can be selected from one or more of metals and conductive rubber. Figure 10 As shown, the conductive component 22 may include multiple interconnected conductive sheets 223. The overall shape of the conductive sheet 223 may be similar to a rectangle, with first recesses at the edges exposing first signal type probes 23, and second recesses for connecting second signal type probes 24. When multiple conductive sheets 223 are spliced ​​together, the first recesses are spliced ​​to form first through-hole structures 221, and the second recesses are spliced ​​to form second through-hole structures 222. This type of rectangular conductive sheet 223 includes at least two first recesses and two second recesses to facilitate the formation of an association between a cable 1 and at least two surrounding second signal type probes 24. The shape of the conductive sheet 223 may also be as follows: Figure 11The conductive component 223 is shaped like a long rectangular strip, covering the area between two rows of signal type probes. It has first recesses at the edges exposing the ends of the first signal type probe 23 and second recesses exposing the ends of the second signal type probe 24. When multiple conductive components 223 are joined together, they form a honeycomb-like mesh. The first recesses can be combined to form first through-hole structures 221, and the second recesses can be combined to form second through-hole structures 222. Alternatively, the conductive component 22 can be a single large conductive sheet 223 with first and second through-hole structures 221 and 222, connecting the second signal type probes 24. This allows the cable 1 portion of the return path to be connected via the conductive sheet 223, improving the continuity of the return path and increasing signal integrity. The conductive component 22 can be electrically connected to the reference signal layer 13 by contacting or soldering it to it. Similarly, the second signal type probes can be electrically connected to the reference signal layer 13 by contacting or soldering them to the conductive component 22.

[0055] It is understood that the conductive component 22 and the reference signal layer 13 are electrically connected during signal transmission between the cable 1 and the probe block 2. Since the conductive component 22 is electrically connected to each of the second signal type probes 24, the reference signals of each second signal type probe 24 can be jointly connected to form a reference ground. The reference signal layer 13 of the cable 1 is electrically connected to the conductive component 22, and there is no air medium between the reference signal layer 13 and the conductive component 22, thus there is no interruption in the reference ground. The signal path in the cable 1 is transmitted to the first signal type probe 23 through the first core 11. The return path in the cable 1 is transmitted to the conductive component 22 surrounding the first core 11 through the connection between the reference signal layer 13 and the conductive component 22, and then transmitted to the multiple second signal type probes 24 surrounding the first core 11 through the conductive component 22. This arrangement ensures that one cable 1 corresponds to multiple adjacent second signal type probes 24, enabling multiple second signal type probes 24 to return a reference signal, thereby improving signal integrity. In addition, by connecting in the above manner, the dielectric layer 12 will not introduce air medium, will not cause signal impedance discontinuity, and will not cause impedance abrupt change, thus ensuring the integrity of the return signal transmission process.

[0056] In applications, when the conductive component 22 includes multiple conductive sheets 223, the conductive sheets 223 can be disposed one by one on the back of the probe block 2, or multiple sheets can be pre-assembled together and then disposed on the back of the probe block 2. The first core 11 of the cable 1 can be connected to the first signal type probe 23 after one or more conductive sheets 223 are disposed, or it can be connected to the first signal type probe 23 after all the conductive sheets 223 are disposed on the back of the probe block 2.

[0057] In this embodiment, by placing the conductive component 22 on the back of the insulating base 21, the conductive component 22 is electrically connected to the reference signal layer 13 when the cable 1 is connected to the probe block 2. Since the conductive component 22 is electrically connected to a plurality of adjacent second signal type probes 24, the reference signal layer 13 is electrically connected to a plurality of adjacent second signal type probes 24. This allows a first signal type probe 23 to match with a plurality of adjacent second signal type probes 24, converting the return path into a plurality of second signal type probes 24 surrounding the first wire core 11. This configuration allows the return path to maintain continuity and integrity, and since the conductive component 22 abuts against the reference signal layer 13, the return path will not introduce air medium, solving the problem of signal impedance discontinuity in the prior art, thereby further improving the integrity of the return signal.

[0058] In one embodiment, such as Figure 12 and 13 As shown, the conductive component 22 includes a substrate 224 and a conductive ring 225. The substrate 224 has a first through-hole structure 221, a second through-hole structure 222, and a signal transmission line 226 inside. The signal transmission line 226 is used to connect the first through-hole structure 221 (not shown in the figure) and the second through-hole structure 222 (not shown in the figure). The first through-hole structure 221 is used for the first wire core 11 to pass through and connect to the first signal type probe 23. The second through-hole structure 222 is used to accommodate the second signal type probe 24. The conductive ring 225 is disposed in the first through-hole structure 221 and electrically connected to the signal transmission line 226. The conductive ring 225 is used to electrically connect to the reference signal layer 13 of the cable 1.

[0059] The substrate 224 can be a printed circuit board. The conductive ring 225 can be circular, hollow polygonal, ring with bosses, ring with notches, etc. The conductive ring 225 can also be fitted onto the reference signal layer 13, and the conductive ring 225 can be connected to the reference signal layer 13 by soldering. When the conductive ring 225 is a ring with notches, and the cable 1 is an aluminum foil wire 1B, the conductive ring 225 can be fitted onto the reference signal layer 13, and the second wire core 13B fills the notch of the conductive ring 225, and the second wire core 13B contacts the two inner walls of the notch.

[0060] It is understood that the conductive ring 225 is conductive as a whole, and the inner wall of the conductive ring 225 is in contact with the reference signal layer 13 (braided mesh layer 13A or second wire core 13B). The two are electrically connected when signal transmission occurs between the cable 1 and the probe block 2. The reference signal layer 13 is electrically connected to the signal transmission line 226 in the substrate 224 through the conductive ring 225. The second signal type probe 24 passes through the second through-hole structure 222 and is electrically connected to the signal transmission line 226. Since the signal transmission line 226 is connected to each adjacent second signal type probe 24, the reference signal layer 13 is connected to each adjacent second signal type probe 24. This arrangement allows one cable 1 to correspond to multiple second signal type probes 24, realizing multiple second signal type probes 24 reference signals, thereby improving signal integrity.

[0061] The connection between the conductive ring 225 and the substrate 224 can be achieved through direct connection methods such as interference fit or clearance fit; indirect connection can also be achieved through conductive auxiliary connectors; or welding can be used. It should be noted that the above methods are merely examples and do not constitute a limitation on this embodiment. Other methods may be used besides those listed above.

[0062] In this embodiment, by electrically connecting the conductive ring 225 to the reference signal layer 13 and electrically connecting the conductive ring 225 to the signal transmission line 226 in the substrate 224, the reference signal layer 13 of a cable 1 can be simultaneously connected to multiple adjacent second signal type probes 24, and a first signal type probe 23 can be matched with multiple adjacent second signal type probes 24, thereby converting the return path into multiple second signal type probes 24 surrounding the first wire core 11. This configuration can maintain the continuity and integrity of the return path and improve the integrity of the return signal.

[0063] In one embodiment, such as Figure 12 and 13 As shown, the probe block 2 also includes an insulating sleeve 227, which is disposed in the first through hole structure 221 and located on one side of the conductive ring 225 along the axial direction.

[0064] It is understandable that when the conductive ring 225 is fitted onto the exposed reference signal layer 13, there is a risk that the conductive ring 225 will come into contact with the first wire core 11. When the conductive ring 225 comes into contact with the first wire core 11, the reference signal layer 13 and the first wire core 11 are electrically connected, and a short circuit occurs between the signal line and the signal ground.

[0065] Specifically, the insulating sleeve 227 is disposed within the first through-hole structure 221 and is located on one axial side of the conductive ring 225. When connecting the cable 1 and the probe block 2 through the conductive component 22, the first wire core 11 exposed from the cable 1 penetrates into the first through-hole structure 221 from the side close to the conductive ring 225, and sequentially passes through the conductive ring 225 and the insulating sleeve 227 to be connected to the first signal type probe 23. At this time, the insulating sleeve 227 is on the side of the ground ring close to the exposed first wire core 11, and the insulating sleeve 227 is located between the first wire core 11 and the conductive ring 225, separating the first wire core 11 from the conductive ring 225, thereby preventing the reference signal layer 13 from being electrically connected to the first wire core 11.

[0066] In this embodiment, by disposing the insulating sleeve 227 within the first through-hole structure 221 and on one side of the conductive ring 225, the insulating sleeve 227 can separate the first wire core 11 from the conductive ring 225, preventing the reference signal layer 13 from being electrically connected to the first wire core 11, and further preventing a short circuit between the signal line and the signal ground.

[0067] In one embodiment, the portion of the second signal type probe 24 that penetrates out of the second through-hole structure 222 is connected to the substrate 21 through solder 3.

[0068] In one embodiment, as Figure 14 and Figure 15 shown, the first signal type probes 23 and the second signal type probes 24 are arranged in an array. When a first signal type probe 23 is in an edge position, one first signal type probe 23 is adjacent to two or three second signal type probes 24; when a first signal type probe 23 is not in an edge position, one first signal type probe 23 is adjacent to four second signal type probes 24.

[0069] Figure 15 In

[0070] wherein, except for Figure 15 the "cross" arrangement shown, the first signal type probes 23 and the second signal type probes 24 can also be arranged in an "X" shape, with the midpoint position being S and the four edge points being G, and it can also achieve one first signal type probe 23 being adjacent to four second signal type probes 24. Even in a "star" shape arrangement, one first signal type probe 23 can be adjacent to more second signal type probes 24. In this application, the arrangement of the first signal type probes 23 and the second signal type probes 24 is not limited to the above example arrangements, and can also be other arrangements, as long as one first signal type probe 23 can be adjacent to multiple second signal type probes 24.

[0071] It is understandable that the probes 23 of each first signal type and the probes 24 of each second signal type are arranged in an array. When the first signal type probe 23 is simultaneously located in an edge row and an edge column, there is only one adjacent second signal type probe 24 in both the row and column directions, and one first signal type probe 23 is adjacent to two second signal type probes 24. When the first signal type probe 23 is located in an edge row but not in an edge column, there are two adjacent second signal type probes 24 in the row direction and only one adjacent second signal type probe 24 in the column direction, and one first signal type probe 23 is adjacent to three second signal type probes 24. Similarly, when the first signal type probe 23 is located in an edge column but not in an edge row, there are two adjacent second signal type probes 24 in the column direction and only one adjacent second signal type probe 24 in the row direction, and one first signal type probe 23 is adjacent to three second signal type probes 24. When the first signal type probe 23 is not located in an edge position, there will be two adjacent second signal type probes 24 in both the row and column directions, and one first signal type probe 23 will be adjacent to four second signal type probes 24. Specifically, the first signal type probe 23 at the edge position transmits signals with low signal integrity requirements, while the first signal type probe 23 at the center position transmits critical signals, such as... Figure 15 As shown, the first signal type probe 23 at the center position must match the four adjacent second signal type probes 24, and no match will occur. Figure 5 The problem of the first signal type probe 23 at the center position only matching with the three adjacent second signal type probes 24 is solved, thereby ensuring that the first signal type probe 23 transmitting the key signal matches with the four adjacent second signal type probes 24, thus enabling the return path to maintain continuity and integrity, and thereby improving signal integrity.

[0072] In this embodiment, by arranging each first signal type probe 23 and each second signal type probe 24 in an array, one first signal type probe 23 is adjacent to at least two second signal type probes 24, thereby matching one first signal type probe 23 with at least two adjacent second signal type probes 24. The return path includes a large number of second signal type probes 24, thus ensuring the integrity of the returned signal.

[0073] In one embodiment, such as Figure 16-20 As shown, this application also provides a signal extension device, including: a cable 1 and a probe block 2 as described above. The cable 1 includes a first wire core 11, a dielectric layer 12, a reference signal layer 13 and an insulating layer 14 respectively disposed from the inside to the outside. The first wire core 11 passes through a first through-hole structure 221 and is connected to a first signal type probe 23. The reference signal layer 13 is electrically connected to a conductive component 22.

[0074] The conductive component 22 can be electrically connected to the reference signal layer 13 by contacting or welding with it.

[0075] In this embodiment, by connecting the first wire core 11 through the first through-hole structure 221 to the first signal type probe 23, and placing the conductive component 22 on the back of the insulating base 21, the conductive component 22 is electrically connected to the reference signal layer 13 when the cable 1 is connected to the probe block 2. Since the conductive component 22 is electrically connected to the adjacent plurality of second signal type probes 24, the reference signal layer 13 is electrically connected to the adjacent plurality of second signal type probes 24. This allows one first signal type probe 23 to match with the adjacent plurality of second signal type probes 24, converting the return path into the multiple second signal type probes 24 surrounding the wire core. This configuration allows the return path to maintain continuity and integrity, and since the conductive component 22 abuts against the reference signal layer 13, the return path will not introduce air medium, solving the problem of signal impedance discontinuity in the prior art, thereby further improving the integrity of the return signal.

[0076] In one embodiment, such as Figure 1 , Figure 12 , Figure 16-18 As shown, when cable 1 is a coaxial cable 1A, the reference signal layer 13 includes a braided mesh layer 13A, which is electrically connected to the conductive component 22.

[0077] When cable 1 is a coaxial cable 1A, the coaxial cable 1A includes a first core 11, a dielectric layer 12, a braided mesh layer 13A, and an insulating layer 14 arranged from the inside out. When the braided mesh layer 13A is connected to the second signal type probe 24, it serves as a signal ground, transmitting the return path from the braided mesh layer 13A in the coaxial cable 1A to the corresponding second signal type probe 24. Since the conductive component 22 is electrically connected to the second signal type probe 24, by electrically connecting the braided mesh layer 13A to the conductive component 22, the braided mesh layer 13A can be electrically connected to each second signal type probe 24, thereby transmitting the return path from the braided mesh layer 13A in the coaxial cable 1A to each second signal type probe 24, enabling multiple second signal type probes 24 to return a reference signal, thus improving signal integrity.

[0078] In the application, when connecting the coaxial cable 1A to the probe block 2, firstly, a portion of the insulation layer 14 of the coaxial cable 1A is peeled off to expose a small section of the braided mesh layer 13A. Then, a portion of the braided mesh layer 13A and the dielectric layer 12 are peeled off to expose a small section of the first wire core 11. The exposed first wire core 11 is then passed through the first through-hole structure 221 and connected to the first signal type probe 23. When the first wire core 11 is connected to the first signal type probe 23, the braided mesh layer 13A of the coaxial cable 1A can abut or be soldered to the conductive component 22, thereby electrically connecting the conductive component 22 to the braided mesh layer 13A. Subsequently, the braided mesh layer 13A of one coaxial cable 1A is connected to multiple second signal type probes 24 through the conductive component 22.

[0079] In one embodiment, such as Figure 16 As shown, at least a portion of the braided mesh layer 13A without an insulating layer is located within the first through-hole structure 221, and the side of the braided mesh layer 13A is welded to or abuts against the inner wall of the first through-hole structure 221.

[0080] It is understood that when the aperture of the first through-hole structure 221 is greater than or equal to the outer diameter of the braided mesh layer 13A, the braided mesh layer 13A can enter the first through-hole structure 221. When the braided mesh layer 13A is located inside the first through-hole structure 221, the side of the braided mesh layer 13A can be welded or abutted against the inner wall of the first through-hole structure 221, thereby making the braided mesh layer 13A electrically connected to the conductive component 22.

[0081] The braided mesh layer 13A can also be connected to the inner wall of the first through-hole structure 221 by both abutment and welding. When the aperture of the first through-hole structure 221 is larger than the aperture of the braided mesh layer 13A, in order to ensure that the side of the braided mesh layer 13A is stably abutted against the inner wall of the first through-hole structure 221, the braided mesh layer 13A can be further fixed by welding, so that the braided mesh layer 13A is fixedly connected to the conductive component 22, thereby keeping the side of the braided mesh layer 13A in close contact with the inner wall of the first through-hole structure 221.

[0082] In one embodiment, such as Figure 17 As shown, the uninsulated braided mesh layer 13A is located outside the first through-hole structure 221, and the end face of the braided mesh layer 13A near the conductive component 22 abuts against the surface of the conductive component 22 near the braided mesh layer 13A.

[0083] It is understandable that the aperture of the first through-hole structure 221 can be larger than the outer diameter of the dielectric layer 12 but smaller than the outer diameter of the braided mesh layer 13A. In this case, the first through-hole structure 221 can only be used to pass through the first core 11 of the coaxial cable 1A and the dielectric layer 12, while the braided mesh layer 13A is stuck outside the first through-hole structure 221, so that the end face of the braided mesh layer 13A near the conductive component 22 abuts against the surface of the conductive component 22 near the braided mesh layer 13A. Obviously, this method can also achieve an electrical connection between the braided mesh layer 13A and the conductive component 22. However, in application, there may be a situation where the end face of the braided mesh layer 13A near the conductive component 22 cannot abut against the surface of the conductive component 22 near the braided mesh layer 13A. In this case, welding can be used to connect the braided mesh layer 13A and the conductive component 22. Alternatively, with the end face of the braided mesh layer 13A near the conductive component 22 abutting against the surface of the conductive component 22 near the braided mesh layer 13A, the braided mesh layer 13A can be further fixed to the surface of the conductive component 22 by welding. When the coaxial cable is connected to the probe block 2, its side view is as follows. Figure 18 As shown.

[0084] In one embodiment, such as Figure 19 As shown, cable 1 is aluminum foil wire 1B, and reference signal layer 13 includes a second wire core 13B and a shielding layer 13C that are interconnected. The second wire core 13B is electrically connected to the conductive component 22.

[0085] When cable 1 is an aluminum foil wire 1B, the aluminum foil wire 1B includes a first core 11, a dielectric layer 12, a second core 13B, a shielding layer 13C, and an insulating layer 14, arranged from the inside out. The first core 11 serves as the signal path, and the second core 13B and the shielding layer 13C serve as the return path. The first core 11 is connected to a first signal type probe 23 to transmit signals, transferring the signal path from the first core 11 in the aluminum foil wire 1B to the corresponding first signal type probe 23. When the second core 13B is electrically connected to the second signal type probe 24, it serves as the signal ground, transferring the return path from the second core 13B and the shielding layer 13C in the aluminum foil wire 1B to the second signal type probe 24. Since the conductive component 22 is electrically connected to the second signal type probe 24, and each conductive component 22 in the array of conductive components 22 is connected, by abutting the second wire core 13B with the conductive component 22, the braided mesh layer 13A can be electrically connected to each second signal type probe 24, thereby transmitting the return path from the braided mesh layer 13A in the cable 1 to each second signal type probe 24, realizing that multiple second signal type probes 24 return the reference signal, thereby improving the integrity of the signal.

[0086] In one embodiment, such as Figure 19As shown, at least a portion of the second core 13B without an insulating layer is located within the first through-hole structure 221, and the side of the second core 13B abuts against the inner wall of the first through-hole structure 221.

[0087] It is understood that when the aperture of the first through-hole structure 221 is greater than or equal to the sum of the outer diameter of the dielectric layer 12 and the diameter of the cross-section of the second wire core 13B, the second wire core 13B can enter the first through-hole structure 221. When the second wire core 13B is located inside the first through-hole structure 221, the side of the second wire core 13B can be welded or abutted against the inner wall of the first through-hole structure 221, thereby electrically connecting the second wire core 13B to the conductive component 22. Alternatively, while the side of the second wire core 13B abuts against the inner wall of the first through-hole structure 221, the second wire core 13B can be further fixed by welding, thus fixing the second wire core 13B to the conductive component 22 and maintaining a tight contact between the side of the second wire core 13B and the inner wall of the first through-hole structure 221.

[0088] In one embodiment, such as Figure 19 As shown, when the second core 13B without an insulating layer is located outside the first through-hole structure 221, the end face of the second core 13B near the conductive component 22 is welded or abutted to the surface of the conductive component 22 near the second core 13B.

[0089] It is understandable that the aperture of the first through-hole structure 221 can be larger than the outer diameter of the dielectric layer 12 but smaller than the sum of the outer diameter of the dielectric layer 12 and the diameter of the cross-section of the second wire core 13B. In this case, the first through-hole structure 221 can only be used to pass through the first wire core 11 of the aluminum foil wire 1B and the dielectric layer 12, while the second wire core 13B is stuck outside the first through-hole structure 221. Then, the end face of the second wire core 13B near the conductive component 22 abuts against the surface of the conductive component 22 near the braided mesh layer 13A. Obviously, this method can also achieve an electrical connection between the second wire core 13B and the conductive component 22. In applications, there may be situations where the end face of the second wire core 13B near the conductive component 22 cannot abut against the surface of the conductive component 22 near the second wire core 13B. In this case, welding can be used to connect the second wire core 13B and the conductive component 22. Alternatively, when the end face of the braided mesh layer 13A near the conductive component 22 abuts against the surface of the conductive component 22 near the braided mesh layer 13A, the braided mesh layer 13A can be further fixed to the surface of the conductive component 22 by welding.

[0090] It should be noted that the connection methods shown in the above embodiments are only examples of specific connection methods and do not constitute a limitation on the specific connection methods of this application. Other connection methods can also be used to realize the electrical connection of the corresponding structure.

[0091] In one embodiment, such as Figure 20As shown, the first signal type probe 23 includes a first signal type probe body 230 and a first connection terminal 231. The first connection terminal 231 is located on the side of the first signal type probe 230 body near the cable 1, and the first connection terminal 231 is connected to the first wire core 11 passing through the first through hole structure 221. The second signal type probe 24 includes a second signal type probe body 240 and a second connection terminal 241. The second connection terminal 241 is located on the side of the second signal type probe body 240 near the cable 1, and the second connection terminal 241 is electrically connected to the conductive component 22.

[0092] In this configuration, one end of the first connecting terminal 231 connected to the first wire core 11 can be a metal sheet to facilitate connection with the first wire core 11; similarly, the end of the second connecting terminal 241 connected to the conductive component 22 can also be a metal sheet to ensure sufficient contact between the second connecting terminal 241 and the conductive component 22, thereby guaranteeing connection stability. When both ends of the first connecting terminal 231 and the second connecting terminal 241 are metal sheets, the first signal type probe 23 and the second signal type probe 24 are easily arranged in an array.

[0093] In one embodiment, the cable 1 further includes a conductor cap, which is fitted onto the exposed first wire core 11 and electrically connected to the first wire core 11. When the cable 1 is connected to the probe block 2, the conductor cap is electrically connected to the inner wall of the needle sleeve of the first signal type probe 23.

[0094] Among them, the conductor cap is a bullet-shaped conductor cap.

[0095] Specifically, the core portion of the wire that passes through the first through-hole structure 221 is connected by a bullet-shaped conductor cap, and finally pressed into the probe sleeve of the first signal type probe 23 at the corresponding position by a corresponding fixture. The outer wall of the bullet-shaped conductor cap is connected to the inner wall of the needle sleeve of the first signal type probe 23 by an interference fit.

[0096] The first wire core 11 is easily deformed. Directly connecting the first wire core 11 to the first signal type probe 23 makes it difficult to guarantee connection stability. Therefore, a conductor cap is used to assist in the connection.

[0097] The first conductor core 11 and the conductor cap can be connected by welding, by interference fit, or indirectly by auxiliary conductor components. Besides these methods, other methods are also possible, such as snap-fit.

[0098] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0099] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A probe block, characterized in that, For connection to a cable, the cable comprising, from the inside out, a first conductor, a dielectric layer, a reference signal layer, and an insulation layer, and the probe block comprising: Insulating base; A conductive component is disposed on the back side of the insulating base. The conductive component includes a plurality of interconnected conductive sheets. Each conductive sheet has a first recess and a second recess on its edge. Each first recess is spliced ​​together to form a first through-hole structure, and each second recess is spliced ​​together to form a second through-hole structure. The first through-hole structure is used for the first wire core to pass through. The conductive component is used for electrical connection with the reference signal layer. A first signal type probe is disposed through the front side of the insulating base and is used to connect with a first wire core that passes through the first through-hole structure; the signal path in the cable is transmitted to the first signal type probe through the first wire core. A second signal type probe is disposed through the front side of the insulating base and adjacent to the first signal type probe; the second signal type probe passes through the second through-hole structure and is electrically connected to the conductive component; the return path in the cable is transmitted to the conductive component around the first wire core through the electrical connection between the reference signal layer and the conductive component, and then transmitted to the multiple second signal type probes surrounding the first wire core through the conductive component.

2. The probe block according to claim 1, characterized in that, The first signal type probes and the second signal type probes are arranged in an array. When the first signal type probe is at the edge position, one first signal type probe is adjacent to two or three second signal type probes. When the first signal type probe is not at the edge position, one first signal type probe is adjacent to four second signal type probes.

3. The probe block according to claim 1, characterized in that, The conductive component further includes a substrate and a conductive ring. The substrate has a first through-hole structure, a second through-hole structure, and a signal transmission line inside. The signal transmission line is used to connect the first through-hole structure and the second through-hole structure. The conductive ring is disposed in the first through-hole structure and electrically connected to the signal transmission line. The conductive ring is used to electrically connect to the reference signal layer.

4. A signal extension device, characterized in that, include: The cable and the probe block as described in any one of claims 1-3, the cable comprising a first wire core, a dielectric layer, a reference signal layer and an insulating layer respectively disposed from the inside to the outside, the first wire core passing through the first through-hole structure and connected to the first signal type probe, and the reference signal layer being electrically connected to the conductive component.

5. The signal extension device according to claim 4, characterized in that, The first signal type probe includes a first signal type probe body and a first connection terminal. The first connection terminal is located on the side of the first signal type probe body near the cable and is connected to a first wire core passing through the first through-hole structure. The second signal type probe includes a second signal type probe body and a second connection terminal. The second connection terminal is located on the side of the second signal type probe body near the cable and is electrically connected to the conductive component.

6. The signal extension device according to claim 4, characterized in that, When the cable is a coaxial cable, the reference signal layer includes a braided mesh layer, which is electrically connected to the conductive component.

7. The signal extension device according to claim 6, characterized in that, At least a portion of the braided mesh layer, not covered by the insulating layer, is located within the first through-hole structure, and the side of the braided mesh layer is welded to or abuts against the inner wall of the first through-hole structure; or... The braided mesh layer, which is not covered by the insulating layer, is located outside the first through-hole structure. The end face of the braided mesh layer near the conductive component is welded or abutted to the surface of the conductive component near the braided mesh layer.

8. The signal extension device according to claim 4, characterized in that, When the cable is an aluminum foil wire, the reference signal layer includes a second wire core and a shielding layer that are interconnected, and the second wire core is electrically connected to the conductive component.

9. The signal extension device according to claim 8, characterized in that, At least a portion of the second wire core, which is not covered by the insulation layer, is located within the first through-hole structure, and the side of the second wire core is welded to or abuts against the inner wall of the first through-hole structure. or, The second wire core, which is not covered by the insulating layer, is located outside the first through-hole structure, and the end face of the second wire core near the conductive component is welded or abutted to the surface of the conductive component near the second wire core.

10. A semiconductor testing machine, characterized in that, Includes the signal extension device as described in any one of claims 4-9.

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