A miniature voltage-doubler integrated module and manufacturing method thereof

Abstract

The present invention belongs to the field of high-voltage power supply, and specifically relates to a miniature voltage-doubler integrated module and a manufacturing method thereof, comprising a plurality of component platforms arranged at intervals, wherein the insides of the component platforms are respectively provided with diode slots and capacitor slots, and a through pole slot is provided between the diode slots and the capacitor slots; the voltage-doubler module is designed in a modular manner, wherein the capacitor and the high-voltage diode are welded and then welded to a circuit board after being arranged in a specific manner, and the independent component platforms only need four welding points to be connected to a PCB board after being integrated, so that the independent component platforms have miniaturization, integration, and product consistency, so as to facilitate standardized production, i.e., surface mounting; the component platforms of the miniature voltage-doubler integrated module are independently arranged, and except for the component platforms at the input and output ends, the components are not directly connected to the PCB board, so that when a fault occurs, the fault point can be specially repaired, which can solve the problem that traditional repairs require repeated desoldering, soldering and other processes, thereby improving the convenience of maintenance.

Description

Technical Field

[0001] The present invention relates to the field of high voltage power supplies, and in particular to a miniature voltage multiplication integrated module and a manufacturing method thereof. Background Art

[0002] The voltage doubler module has the advantages of small size, light weight, high insulation, stable performance, reliability, low power, safety and flexibility. When used in conjunction with a micro high-voltage power supply, it has a withstand voltage of 6500V and a reverse leakage current of ≤5NA, playing the role of rectification and voltage doubling. A large number of diodes and capacitors are used in the voltage doubler rectifier module.

[0003] The prior art has the following problems:

[0004] 1. The micro voltage doubler module is used in micro high-voltage power supply to play the role of rectification and voltage doubler. However, in the existing technology, 30 solder joints are required when assembling the PCB board and the module, the product preparation material consumption is large, the manual operation process is many, the product consistency is poor, and the assembly efficiency is low;

[0005] 2. Because there are many solder joints, when some capacitors and diodes of the voltage doubler module are damaged, it is necessary to remove the solder joints, disassemble and replace the components, and solder them again, which makes the maintenance process cumbersome. Summary of the invention

[0006] (I) Purpose of the invention

[0007] In order to solve the technical problems existing in the background technology, the present invention proposes a miniature voltage-doubler integrated module and a manufacturing method thereof, which has the characteristics of convenient sequential arrangement and combination of electrical components, reduced welding points for easy assembly and modular design for easy replacement of damaged components.

[0008] (II) Technical solution

[0009] In order to solve the above technical problems, the present invention provides a miniature voltage multiplier integrated module, comprising a plurality of component platforms arranged at intervals, wherein a diode slot and a capacitor slot are respectively provided inside the component platforms, a through pole slot is provided between the diode slot and the capacitor slot, and a pole through hole penetrating the outer wall of the component platform is provided at the bottom of both;

[0010] A diode is placed inside the diode slot, and the positive and negative electrodes of the diode are respectively installed with diode poles. A capacitor is placed inside the capacitor slot, and the positive and negative electrodes of the capacitor are installed with capacitor poles. The diode pole at the positive pole is bonded to the capacitor pole at the negative pole, and the remaining diode poles and capacitor poles respectively pass through the pole through holes.

[0011] A wiring mechanism is arranged outside the pole through hole, and the wiring mechanism comprises a pole clamping block installed in the inner cavity of the component platform, an inner sleeve ring matching the pole through hole is provided at one end of the pole clamping block, a groove is symmetrically opened on one side of the inner sleeve ring, a conductive clamping ring is installed in the groove, a wiring piece for wiring is arranged on one side of the conductive clamping ring, and a conductive column core penetrating into the inner cavity of the conductive clamping ring is installed in the wiring piece;

[0012] Adjacent component platforms are combined into an integrated module through the conductive column core, a PCB board is arranged below the integrated module, and the input end and the output end of the PCB board are respectively provided with column holes for plugging the diode pole and the capacitor pole.

[0013] Preferably, the wiring member is a bendable flexible structure, and two ends of the conductive column core inside are respectively plugged into the conductive clamp ring.

[0014] Preferably, the connection between the diode pole, the conductive clamp ring, the conductive column core and the capacitor pole forms a conductive path as a whole.

[0015] Preferably, the bonded diode pole and the capacitor pole are placed in the pole groove.

[0016] Preferably, the pole clamps are insulating components, which are respectively arranged on the outside of the diode pole and the outside of the capacitor pole.

[0017] Preferably, PCB pole seats are provided at the corners of the PCB board, and the four PCB pole seats are respectively an input positive pole, an input negative pole, an output positive pole and an output negative pole.

[0018] Preferably, a positioning mechanism is arranged between the component platform and the PCB board, and the positioning mechanism includes protrusions installed on the component platform at intervals and buckle grooves opened on the front and rear walls of the component platform. The protrusion is an "H-shaped" structure, and the front section and the rear section are respectively plugged and fixed to the buckle grooves opened on the two component platforms.

[0019] Preferably, the diode pole and the capacitor pole are fixed by soldering at one end passing through the terminal hole.

[0020] The present invention also provides a method for manufacturing a micro voltage-doubler integrated module, comprising the following steps:

[0021] Step 1, bonding the diode and the diode pole and the capacitor pole of the capacitor in the positive and negative order, and placing the bonded diode and the capacitor into the diode slot and the capacitor slot along the slot direction of the component platform;

[0022] Step 2: The remaining ends of the diode poles and the capacitor poles that pass through the pole through holes are respectively pulled through the inner rings provided in the two pole clamps, and only the diode poles and the capacitor poles at the input and output ends are retained to pass through the pole through holes, and the remaining sections of the diode poles and the capacitor poles that protrude from the pole through holes are cut off using a cutting tool;

[0023] Step 3, the adjacent component platforms are attached in sequence, the wiring pieces are inserted into the openings of the side walls of the pole clamp blocks, and the electrical connection relationship of the electrical components between the adjacent component platforms is established through the cooperation between the two ends of the internal conductive column core and the conductive clamp ring, so that several component platforms are combined into an integrated module;

[0024] Step 4: Place the protruding diode pole and capacitor pole left at the bottom of the component platform at the first and second ends into the receiving pole holes opened on the PCB board respectively, and preliminarily fix them by fitting the protruding block into the buckle groove;

[0025] Step 5: Use a welding tool to solder the diode pole, the capacitor pole and the corresponding terminal hole, solder the integrated module and the PCB board into a voltage doubling integrated module, and connect the high-voltage power supply and external electrical equipment through the PCB pole seat connected at the corner of the PCB board.

[0026] The above technical solution of the present invention has the following beneficial technical effects:

[0027] 1. The voltage doubler module is designed in a modular way. The capacitor and the high-voltage diode are welded in a specific order and then welded to the circuit board. After the independent component platform is integrated, only four solder joints are needed to connect to the PCB board, making it miniaturized, integrated, and product consistent, so as to facilitate standardized production (surface mount);

[0028] 2. The component platform of the micro voltage doubler integrated module is independently set. Except for the input and output component platforms, there is no direct connection with the PCB board. When a fault occurs, the fault point can be repaired specifically. The design of the wiring mechanism can solve the problem that traditional repairs require repeated desoldering, soldering and other processes, thereby improving the convenience of maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the present invention;

[0030] Figure 2 It is a schematic diagram of the component platform structure of the present invention;

[0031] Figure 3 It is a schematic diagram of the cross-sectional structure of the component platform of the present invention;

[0032] Figure 4 It is a schematic diagram of the combined structure of a diode and a capacitor of the present invention;

[0033] Figure 5 It is a schematic diagram of the wiring mechanism structure of the present invention;

[0034] Figure 6 It is a schematic diagram of the separation structure of the component platform and the PCB board of the present invention.

[0035] Reference numerals:

[0036] 1. Component platform; 11. Diode slot; 12. Capacitor slot; 13. Pole slot; 14. Pole through hole; 2. Diode; 21. Diode pole; 3. Capacitor; 31. Capacitor pole; 41. Pole clamp; 42. Inner ring; 43. Conductive clamp ring; 44. Wiring piece; 45. Conductive column core; 5. PCB board; 6. Post hole; 71. Bump; 72. Buckle slot; 8. PCB pole seat. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present invention. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present invention.

[0038] like Figure 1-6 As shown, a miniature voltage multiplier integrated module proposed by the present invention comprises a plurality of component platforms 1 arranged at intervals, wherein a diode slot 11 and a capacitor slot 12 are respectively provided inside the component platforms 1, a through pole slot 13 is provided between the diode slot 11 and the capacitor slot 12, and a pole through hole 14 penetrating the outer wall of the component platform 1 is provided at the bottom of both;

[0039] A diode 2 is placed inside the diode slot 11, and a diode pole 21 is installed at the positive and negative poles of the diode 2, respectively. A capacitor 3 is placed inside the capacitor slot 12, and a capacitor pole 31 is installed at the positive and negative poles of the capacitor 3. The diode pole 21 at the positive pole is bonded to the capacitor pole 31 at the negative pole, and the remaining diode pole 21 and capacitor pole 31 pass through the pole through hole 14 respectively.

[0040] A wiring mechanism is arranged outside the pole through hole 14, and the wiring mechanism includes a pole clamp block 41 installed in the inner cavity of the component platform 1, and an inner ring 42 matching with the pole through hole 14 is provided at one end of the pole clamp block 41, and a groove is symmetrically opened on one side of the inner ring 42, and a conductive clamp ring 43 is installed in the groove, and a wiring piece 44 for wiring is arranged on one side of the conductive clamp ring 43, and a conductive column core 45 penetrating into the inner cavity of the conductive clamp ring 43 is installed in the wiring piece 44;

[0041] Adjacent component platforms 1 are combined into an integrated module through conductive column cores 45 , a PCB board 5 is arranged below the integrated module, and the input and output ends of the PCB board 5 are respectively provided with column holes 6 for plugging in diode poles 21 and capacitor poles 31 .

[0042] It should be noted that: the component platform 1 is used to place the diode 2 and the capacitor 3, wherein the diode pole 21 and the capacitor pole 3 of the diode 2 and the capacitor 3 are bonded and connected, and the connected component as a whole is inserted into the component platform 1 through the openings of the diode slot 11 and the capacitor slot 12, and the bonded diode pole 21 and the capacitor pole 31 are placed in the pole slot 13, and the remaining two pole through holes 14 respectively penetrate the unbonded diode pole 21 and the capacitor pole 31.

[0043] In this embodiment, as an example of the combination between component platforms 1, the component platforms 1 equipped with the bonded components are arranged in sequence, and the components in adjacent component platforms 1 are electrically connected through a wiring mechanism. Since the component platforms 1 are arranged in parallel, it is only necessary to insert the conductive column cores 45 at both ends of the wiring member 44 into the inner sleeve ring 42 deep in the opening of the pole clamp block 41, so as to realize the connection between the diode 2 and the capacitor 3 in the adjacent component platforms 1. The connection combination of the diode pole 21, the conductive clamp ring 43, the conductive column core 45 and the capacitor pole 31 is formed into a conductive path, and the front and rear components between the adjacent component platforms 1 are electrically connected in sequence, so as to build an integrated module that can realize a voltage doubling circuit.

[0044] It should be added that the terminal 44 is a bendable flexible structure, and the two ends of the internal conductive column core 45 are respectively plugged into the conductive clamp ring 43. The conductive column core 45 is a magnetic structure, which can magnetically adsorb the conductive clamp ring 43 during plugging, thereby fastening the connection part and having a certain anti-slip function.

[0045] In order to prevent leakage problems at the pole clamp 41, the pole clamp 41 is further an insulating component, which is respectively arranged on the outside of the diode pole 21 and the outside of the capacitor pole 31. When the pole transmits current, the insulating component can prevent the current from being conducted to the outside, thereby improving its safety.

[0046] As an example of connection between the integrated module combined between the component stage 1 and the PCB board 5:

[0047] 1. Only the protruding diode pole 21 and capacitor pole 31 are retained on the component platform 1 at the input end and the output end, which are divided into two diode poles 21 and two capacitor poles 31. Each pole has a terminal hole opened on the PCB board, and one end of the terminal hole 6 is soldered and fixed. The four pole welding points are set and used together with the wiring mechanism. The wires originally integrated on the PCB board are improved into a modular combination. The problem of too many pole welding points in the traditional voltage doubling module is effectively solved without affecting the normal operation of the voltage doubling circuit.

[0048] 2. A positioning mechanism is provided between the component stage 1 and the PCB board 5. The positioning mechanism includes protrusions 71 installed at intervals on the component stage 1 and buckle grooves 72 provided on the front and rear walls of the component stage 1. The protrusion 71 is an "H-shaped" structure, and the front section and the rear section are respectively plugged and fixed with the buckle grooves 72 provided on the two component stages 1. Through the cooperation between the protrusion 71 and the buckle groove 72, the contact part is reinforced, thereby assisting each component stage 1 to be stably limited and installed on the PCB board 5.

[0049] It should be added that: when a fault occurs in a diode 2 or capacitor 3 in some component platforms 1, the electrical connection between the faulty diode 2 or capacitor 3 and its adjacent normal diode 2 or capacitor 3 can be released by plugging and unplugging the wiring member 44 on the wiring mechanism. After replacing a new diode 2 or capacitor 3 and placing it in the component platform 1, the wiring member 44 on the wiring mechanism can be reset to complete the repair of the faulty part without complicated desoldering and resoldering, thereby improving the convenience of maintenance.

[0050] A method for manufacturing a miniature voltage-doubler integrated module comprises the following steps:

[0051] Step 1: Bond the diode 2 and the capacitor 3 in the positive and negative order, and place the bonded diode 2 and capacitor 3 into the diode slot 11 and capacitor slot 12 along the slot direction of the component platform 1;

[0052] Step 2: The remaining diode poles 21 and capacitor poles 31 are respectively pulled through the inner rings 42 provided in the two pole clamps 41 at one end through the pole through holes 14, and only the diode poles 21 and capacitor poles 31 at the input and output ends are retained to pass through the pole through holes 14, and the remaining diode poles 21 and capacitor poles 31 protruding from the pole through holes 14 are removed using a cutting tool;

[0053] Step 3: Adjacent component platforms 1 are attached in sequence, and the wiring pieces 44 are inserted into the openings of the side walls of the pole clamps 41. The electrical connection relationship between the electrical components of the adjacent component platforms 1 is established through the cooperation between the two ends of the internal conductive column core 45 and the conductive clamp ring 43, so that several component platforms 1 are combined into an integrated module;

[0054] Step 4: Place the protruding diode pole 21 and capacitor pole 31 left at the bottom of the head and tail end component platform 1 into the pole hole 6 opened on the PCB board 5 respectively, and preliminarily fix them by fitting the protrusion 71 and the buckle groove 72;

[0055] Step 5: Use welding tools to solder the diode pole 21, the capacitor pole 31 and the corresponding terminal hole 6, solder the integrated module and the PCB board 5 into a voltage doubling integrated module, and connect the high-voltage power supply and external electrical equipment through the PCB pole seat 8 connected at the corner of the PCB board 5.

[0056] It should be understood that the above specific embodiments of the present invention are only used to illustrate or explain the principles of the present invention, and do not constitute a limitation of the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the appended claims of the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A miniature voltage multiplier integrated module, characterized in that: It comprises a plurality of component platforms (1) arranged at intervals, wherein a diode slot (11) and a capacitor slot (12) are respectively provided inside the component platforms (1), a through pole slot (13) is provided between the diode slot (11) and the capacitor slot (12), and a pole through hole (14) penetrating the outer wall of the component platform (1) is provided at the bottom of both; A diode (2) is placed inside the diode slot (11), and the positive and negative electrodes of the diode (2) are respectively installed with diode poles (21); a capacitor (3) is placed inside the capacitor slot (12), and the positive and negative electrodes of the capacitor (3) are installed with capacitor poles (31); the diode pole (21) located at the positive pole is bonded to the capacitor pole (31) located at the negative pole, and the remaining diode poles (21) and capacitor poles (31) respectively penetrate the pole through holes (14); A wiring mechanism is arranged outside the pole through hole (14), and the wiring mechanism comprises a pole clamp block (41) installed in the inner cavity of the element platform (1); an inner ring (42) matching the pole through hole (14) is provided at one end of the pole clamp block (41); a groove is symmetrically opened on one side of the inner ring (42); a conductive clamp ring (43) is installed in the groove; a wiring member (44) for wiring is arranged on one side of the conductive clamp ring (43); a conductive column core (45) penetrating into the inner cavity of the conductive clamp ring (43) is installed in the wiring member (44); The wiring member (44) is a bendable flexible structure, and the two ends of the conductive column core (45) inside are respectively plugged into the conductive clamp ring (43), and the adjacent component platforms (1) are combined into an integrated module through the conductive column core (45), and a PCB board (5) is arranged below the integrated module. The input end and the output end of the PCB board (5) are respectively provided with column holes (6) for plugging the diode pole (21) and the capacitor pole (31), and only the protruding diode pole (21) and the capacitor pole (31) are retained on the component platform (1) at the input end and the output end; The diode pole (21) and the capacitor pole (31) are bonded and placed in the pole groove (13); The protruding diode pole (21) and the capacitor pole (31) are retained and one end thereof passes through the connecting pole hole (6) and is fixed by soldering; PCB pole seats (8) are provided at the corners of the PCB board (5), and the four PCB pole seats (8) are respectively an input positive pole, an input negative pole, an output positive pole and an output negative pole; A positioning mechanism is provided between the component platform (1) and the PCB board (5), the positioning mechanism comprising protrusions (71) installed at intervals on the component platform (1) and buckle grooves (72) provided on the front and rear walls of the component platform (1), the protrusions (71) being an "H-shaped" structure, and the front section and the rear section are respectively plugged and fixed to the buckle grooves (72) provided on the two component platforms (1).

2. The micro voltage multiplier integrated module according to claim 1, characterized in that: The connection of the diode pole (21), the conductive clamp ring (43), the conductive column core (45) and the capacitor pole (31) forms a conductive path.

3. The micro voltage multiplier integrated module according to claim 1, characterized in that: The pole clamping block (41) is an insulating component, and is respectively arranged on the outside of the diode pole (21) and the outside of the capacitor pole (31).

4. A method for manufacturing a micro voltage multiplier integrated module according to any one of claims 1 to 3, characterized in that: The following steps are involved: Step 1: Bonding the diode (2) and the diode pole (21) and the capacitor pole (31) of the capacitor (3) in the positive and negative order, and placing the bonded diode (2) and the capacitor (3) into the diode slot (11) and the capacitor slot (12) along the slot direction of the component platform (1); Step 2: The remaining ends of the diode pole (21) and the capacitor pole (31) that pass through the pole through hole (14) are respectively pulled through the inner rings (42) provided in the two pole clamps (41), and only the diode pole (21) and the capacitor pole (31) at the input end and the output end are retained to pass through the pole through hole (14), and the remaining section of the diode pole (21) and the capacitor pole (31) that protrudes from the pole through hole (14) is cut off using a cutting tool; Step 3, the adjacent component platforms (1) are attached in sequence, the terminal piece (44) is inserted into the opening of the side wall of the pole clamp block (41), and the electrical connection relationship between the electrical components of the adjacent component platforms (1) is established through the cooperation between the two ends of the internal conductive column core (45) and the conductive clamp ring (43), so that a plurality of the component platforms (1) are combined into an integrated module; Step 4: The protruding diode pole (21) and the capacitor pole (31) left at the bottom of the component platform (1) at the head and tail ends are respectively placed into the receiving pole holes (6) opened on the PCB board (5), and are preliminarily fixed by fitting the protruding block (71) and the buckle groove (72); Step 5: Soldering the diode pole (21), the capacitor pole (31) and the corresponding terminal hole (6) by using a welding tool, integrating the integrated module and the PCB board (5) into a voltage doubling integrated module by soldering, and connecting the high-voltage power supply and the external electrical equipment through the PCB pole seat (8) connected at the corner of the PCB board (5).

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