An integrated circuit chip dedicated to skin collagen detection

Abstract

The present invention discloses an integrated circuit chip dedicated to skin collagen detection, which includes a base layer and multiple dielectric layers. A main controller, a digital synthetic ultrasonic carrier wave generator, a digital synthetic infrasonic adjustment scanning wave generator, a driving circuit module, and a receiving circuit module are integrated in the multiple dielectric layers. The receiving circuit module is electrically connected to the main controller, the main controller is electrically connected to the digital synthetic ultrasonic carrier wave generator and the digital synthetic infrasonic adjustment scanning wave generator, and both the digital synthetic ultrasonic carrier wave generator and the digital synthetic infrasonic adjustment scanning wave generator are electrically connected to the driving circuit module. The integrated chip dedicated to skin collagen detection with the above structure has the advantages of small volume, concentrated distribution, high integration degree, power saving and easy use, and good anti-interference performance. It is convenient for the detection device to be upgraded from a large desktop computer to a handheld portable device, and it can also conveniently manufacture peripheral devices in the form of Bluetooth to cooperate with mobile terminals to expand the scope of application scenarios.

Description

Technical Field

[0001] The present invention relates to the technical field of application specific integrated circuit chips, and more particularly to an application specific integrated circuit chip for detecting skin collagen. Background Art

[0002] The prior art uses the ultrasonic principle to detect the content of skin collagen. In the previous technical detection schemes, they are often based on a computer microprocessor, and multiple peripheral functional modules are built by combining multiple integrated circuit chips that are dispersed, independent, and of different scales. They have a large volume, are scattered, have a low integration degree, are vulnerable to external interference, have high energy consumption, serious radiation leakage, and poor anti-interference performance. Summary of the Invention

[0003] The purpose of the present invention is to provide an application specific integrated circuit chip for detecting skin collagen, which has the advantages of small volume, concentrated distribution, high integration degree, power saving, easy use, and good anti-interference performance.

[0004] To achieve the above purpose, the present invention provides an application specific integrated circuit chip for detecting skin collagen, including a base layer and multiple dielectric layers. The multiple dielectric layers are arranged on the base layer. A main controller, a digital synthesized ultrasonic carrier wave generator, a digital synthesized infrasonic adjustment scanning wave generator, a driving circuit module, and a receiving circuit module are integrated in the multiple dielectric layers. The receiving circuit module is electrically connected to the main controller. The main controller is electrically connected to the digital synthesized ultrasonic carrier wave generator and the digital synthesized infrasonic adjustment scanning wave generator. Both the digital synthesized ultrasonic carrier wave generator and the digital synthesized infrasonic adjustment scanning wave generator are electrically connected to the driving circuit module.

[0005] Preferably, the multiple dielectric layers include a first dielectric layer, a second dielectric layer, a third dielectric layer, and a fourth dielectric layer arranged in sequence. Insulating and heat-conducting layers are provided between the fourth dielectric layer and the third dielectric layer, between the third dielectric layer and the second dielectric layer, between the second dielectric layer and the first dielectric layer, and between the first dielectric layer and the base layer.

[0006] Preferably, the integrated receiving circuit module is embedded in the first dielectric layer. The receiving circuit module is an amplification and filtering circuit. The output end of the amplification and filtering circuit is electrically connected to the main controller. An input interface is connected to the input end of the amplification and filtering circuit. The input interface is arranged on one side of the first dielectric layer.

[0007] Preferably, a main controller is embedded in the second dielectric layer. A communication output interface for connecting to a host computer is provided on one side of the second dielectric layer. The communication output interface is electrically connected to the main controller. A first writing interface for controlling the program to be copied is provided on the other side of the second dielectric layer.

[0008] Preferably, the digital synthetic ultrasonic carrier wave generator and the digital synthetic infrasonic adjustment scanning wave generator arranged in parallel are embedded in the third dielectric layer. A second writing interface and a third writing interface are respectively provided on both sides of the third dielectric layer. The second writing interface and the third writing interface are respectively electrically connected to the digital synthetic ultrasonic carrier wave generator and the digital synthetic infrasonic adjustment scanning wave generator.

[0009] Preferably, a driving circuit module is embedded in the fourth dielectric layer. The driving circuit module integrates a charge pump boost conversion circuit and a crystal triode coupling circuit. Both the charge pump boost conversion circuit and the crystal triode coupling circuit are electrically connected to the output interface. The output interface is provided on one side of the fourth dielectric layer. A button is provided on the top of the fourth dielectric layer. The button is electrically connected to the main controller.

[0010] Therefore, for a dedicated integrated circuit chip for skin collagen detection adopting the above structure in the present invention, the main controller, the digital synthetic ultrasonic carrier wave generator, the digital synthetic infrasonic adjustment scanning wave generator, the driving circuit module and the receiving circuit module are all integrated in a multi-layer dielectric layer. The above-mentioned partial devices are selected based on a standard cell library, combined with building circuit modules, integrating the advantages of full-custom design and semi-custom design, shortening the design cycle, facilitating mass production, and having the advantages of small volume, concentrated distribution, high integration, power saving and easy use, as well as good anti-interference performance.

[0011] The technical solution of the present invention will be further described in detail below with reference to the drawings and embodiments. Description of the Drawings

[0012] Figure 1 It is a schematic structural diagram of a dedicated integrated circuit chip for skin collagen detection according to the present invention;

[0013] Figure 2 It is a circuit schematic diagram of a dedicated integrated circuit chip for skin collagen detection according to the present invention.

[0014] Reference Signs

[0015] 1. First dielectric layer; 11. Receiving circuit module; 12. Input interface; 2. Second dielectric layer; 21. Main controller; 22. First writing interface; 23. Communication output interface; 3. Third dielectric layer; 31. Digital synthetic ultrasonic carrier generator; 32. Digital synthetic infrasonic adjustment scanning wave generator; 33. Second writing interface; 34. Third writing interface; 4. Fourth dielectric layer; 41. Driving circuit module; 42. Button; 43. Output interface; 5. Substrate layer; 6. Insulating and heat-conducting layer. Detailed implementation mode

[0016] Embodiment

[0017] Figure 1 This is a schematic structural diagram of an integrated circuit chip dedicated to skin collagen detection according to the present invention. As Figure 1 shown, an integrated circuit chip dedicated to skin collagen detection includes a substrate layer and multiple dielectric layers. The multiple dielectric layers are arranged on the substrate layer 5, and a main controller 21, a digital synthetic ultrasonic carrier generator 31, a digital synthetic infrasonic adjustment scanning wave generator 32, a driving circuit module 41, and a receiving circuit module 11 are integrated in the multiple dielectric layers.

[0018] In this embodiment, the multiple dielectric layers are provided with four layers, including a first dielectric layer 1, a second dielectric layer 2, a third dielectric layer 3, and a fourth dielectric layer 4 arranged in sequence. Between the fourth dielectric layer 4 and the third dielectric layer 3, between the third dielectric layer 3 and the second dielectric layer 2, between the second dielectric layer 2 and the first dielectric layer 1, and between the first dielectric layer 1 and the substrate layer 5, an insulating and heat-conducting layer 6 is provided.

[0019] The first dielectric layer 1 is embedded with an integrated receiving circuit module 11. The receiving circuit module 11 is an amplification and filtering circuit. The output end of the amplification and filtering circuit is electrically connected to the main controller 21, and the input end of the amplification and filtering circuit is connected to input data for amplifying and filtering to obtain the effective value of the data.

[0020] The second dielectric layer 2 is embedded with a main controller 21. The main controller 21 is electrically connected to the receiving circuit module 11 to transmit the effective value to the main controller 21. On one side of the second dielectric layer 2, there is a communication output interface 23 for connecting to the upper computer. The communication output interface 23 is electrically connected to the main controller 21. On the other side of the second dielectric layer 2, there is a first writing interface 22 for controlling the program to be copied in.

[0021] The third dielectric layer 3 is embedded with a digitally synthesized ultrasonic carrier wave generator 31 and a digitally synthesized infrasonic adjustment scanning wave generator 32 arranged in parallel. Both the digitally synthesized ultrasonic carrier wave generator 31 and the digitally synthesized infrasonic adjustment scanning wave generator 32 are electrically connected to the main controller 21. The digitally synthesized infrasonic adjustment scanning wave generator 32 is used to generate a digitally synthesized wave in the infrasonic frequency band from 0.5 Hz to 20 Hz. The waveform of the digitally synthesized wave can be a sine wave, a square wave or a triangular sawtooth wave, and the digitally synthesized wave in the infrasonic frequency band from 0.5 Hz to 20 Hz is used as a baseband modulation signal. The digitally synthesized ultrasonic carrier wave generator 31 is used to modulate a carrier electromagnetic oscillation with a standard frequency of 40 KHz. The carrier electromagnetic oscillation is used to activate the drive circuit module to emit an ultrasonic energy flow modulated by the digitally synthesized wave in the infrasonic frequency band outward. A second writing interface 33 and a third writing interface 34 are respectively arranged on both sides of the third dielectric layer 3. The second writing interface 33 and the third writing interface 34 are respectively electrically connected to the digitally synthesized ultrasonic carrier wave generator 31 and the digitally synthesized infrasonic adjustment scanning wave generator 32, facilitating the loading of the control program to realize automatic program operation.

[0022] The fourth dielectric layer 4 is embedded with a drive circuit module 41. Both the digitally synthesized ultrasonic carrier wave generator 31 and the digitally synthesized infrasonic adjustment scanning wave generator 32 are electrically connected to the drive circuit module 41. The drive circuit module 41 integrates a charge pump boost conversion circuit and a crystal triode coupling circuit, and outputs the combined waveform of the above-mentioned digitally synthesized wave in the infrasonic frequency band and the carrier electromagnetic oscillation with a voltage above 10 V to drive the ultrasonic transmitting head to output. Both the charge pump boost conversion circuit and the crystal triode coupling circuit are electrically connected to the output interface 43. The output interface 43 is arranged on one side of the fourth dielectric layer 4 and is used to connect the ultrasonic transmitting head. A button 42 is arranged on the top of the fourth dielectric layer 4. The button 42 is electrically connected to the main controller 21 to realize manual control.

[0023] Therefore, for a dedicated integrated circuit chip for skin collagen detection adopting the above structure in the present invention, the main controller, the digitally synthesized ultrasonic carrier wave generator, the digitally synthesized infrasonic adjustment scanning wave generator, the drive circuit module and the receiving circuit module are all integrated in the multi-layer dielectric layer. Some of the above devices are selected based on a standard cell library, combined with building circuit modules, integrating the advantages of full-custom design and semi-custom design, shortening the design cycle, facilitating mass production, and having the advantages of small volume, concentrated distribution, high integration, power saving and easy use, as well as good anti-interference performance. It can upgrade a detection device with the same precision level from a relatively large desktop computer to a handheld portable device, and further can conveniently manufacture a peripheral device in the form of Bluetooth to cooperate with a mobile terminal to expand the application scenario range.

[0024] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions of the present invention or make equivalent replacements, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. An integrated circuit chip dedicated to skin collagen detection, including a base layer, characterized in that: It further includes a multi-layer dielectric layer disposed on a base layer. A main controller, a digital synthetic ultrasonic carrier generator, a digital synthetic infrasonic adjustment scanning wave generator, a drive circuit module, and a receiving circuit module are integrated in the multi-layer dielectric layer. The receiving circuit module is electrically connected to the main controller. The main controller is electrically connected to the digital synthetic ultrasonic carrier generator and the digital synthetic infrasonic adjustment scanning wave generator. Both the digital synthetic ultrasonic carrier generator and the digital synthetic infrasonic adjustment scanning wave generator are electrically connected to the drive circuit module; The digital synthetic infrasonic adjustment scanning wave generator is used to generate a digital synthetic wave in the infrasonic frequency band from 0.5 Hz to 20 Hz and use the digital synthetic wave in the infrasonic frequency band from 0.5 Hz to 20 Hz as a baseband modulation signal. The digital synthetic ultrasonic carrier generator is used to modulate a carrier electromagnetic oscillation with a standard frequency of 40 KHz. The carrier electromagnetic oscillation is used to activate the drive circuit module to emit an ultrasonic energy flow modulated by the digital synthetic wave in the infrasonic frequency band outward.

2. The dedicated integrated circuit chip for skin collagen detection according to claim 1, wherein: The multi-layer dielectric layer includes a first dielectric layer, a second dielectric layer, a third dielectric layer, and a fourth dielectric layer arranged in sequence. Insulating and heat-conducting layers are provided between the fourth dielectric layer and the third dielectric layer, between the third dielectric layer and the second dielectric layer, between the second dielectric layer and the first dielectric layer, and between the first dielectric layer and the base layer.

3. The dedicated integrated circuit chip for skin collagen detection according to claim 2, characterized in that: The integrated receiving circuit module is embedded in the first dielectric layer. The receiving circuit module is an amplifying and filtering circuit. The output end of the amplifying and filtering circuit is electrically connected to the main controller. An input interface is connected to the input end of the amplifying and filtering circuit. The input interface is disposed on one side of the first dielectric layer.

4. The dedicated integrated circuit chip for skin collagen detection according to claim 3, characterized in that: The main controller is embedded in the second dielectric layer. A communication output interface for connecting to a host computer is provided on one side of the second dielectric layer. The communication output interface is electrically connected to the main controller. A first writing interface for controlling the program to be loaded is provided on the other side of the second dielectric layer.

5. An integrated circuit chip dedicated to skin collagen detection according to claim 4, characterized in that: The digital synthetic ultrasonic carrier generator and the digital synthetic infrasonic adjustment scanning wave generator arranged in parallel are embedded in the third dielectric layer. A second writing interface and a third writing interface are respectively provided on both sides of the third dielectric layer. The second writing interface and the third writing interface are respectively electrically connected to the digital synthetic ultrasonic carrier generator and the digital synthetic infrasonic adjustment scanning wave generator.

6. The dedicated integrated circuit chip for skin collagen detection according to claim 5, characterized in that: The drive circuit module is embedded in the fourth dielectric layer. The drive circuit module integrates a charge pump boost conversion circuit and a crystal triode coupling circuit. Both the charge pump boost conversion circuit and the crystal triode coupling circuit are electrically connected to an output interface. The output interface is disposed on one side of the fourth dielectric layer. A key is provided on the top of the fourth dielectric layer. The key is electrically connected to the main controller.

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