Silicon wafer production system

Abstract

The embodiment of the present application provides a silicon wafer production system, comprising: a slicer for cutting silicon rods into silicon wafers and placing the silicon wafers and crystal support assemblies in a tooling basket; a transport trolley for transporting the tooling basket to a degumming device; a degumming device having a parking space for accommodating the transport trolley inside; the degumming device for degumming and slicing the silicon wafers; an insertion and washing device for inserting the silicon wafers after slicing; the tooling basket comprising: a tooling basket frame and a side support assembly; a storage space for accommodating silicon wafers is formed in the tooling basket frame, and an opening is provided at the top of the tooling basket frame for silicon wafers to enter and exit the storage space; the side support assembly is used to clamp the silicon wafers from both sides, and is respectively connected to both sides of the tooling basket frame; a magnetic suction part is provided in the side support assembly. The silicon wafer production system provided by the embodiment of the present application can realize automatic degumming, wiping and slicing operations on silicon wafers, thereby improving production efficiency.

Description

[0001] This application is a divisional application of the patent application with the application date of April 14, 2022, application number 202210387322.0, and the invention name "Silicon Wafer Production System". Technical Field

[0002] The present application relates to silicon wafer production technology, and in particular to a silicon wafer production system. Background Art

[0003] In the traditional solution, small monocrystalline silicon cells are usually produced by first cutting the monocrystalline silicon rods into large silicon wafers, and then using laser technology to scribing and cutting the large silicon wafers into small silicon wafers.

[0004] A slicer is a device that cuts hard, brittle material rods into thin slices. It typically uses two parallel main rollers arranged horizontally, with a single diamond wire wound around them to form at least 2,000 saw wires. As a silicon rod moves downward, it passes between the two rollers. The main rollers rotate, driving the diamond wire at high speed to slice the rod into thin slices.

[0005] A group of silicon wafers cut from a single silicon ingot is placed in a tooling basket and manually transported to the debonding unit. The basket then enters a cleaning tank for pre-cleaning and a debonding tank for debonding. After the wafers are debonded in the debonding tank, they are visually inspected for residual adhesive and manually removed. The wafers are then transferred to another tooling basket and transported to the insert-cleaning unit for insert cleaning.

[0006] From the above, we can see that traditional solutions involve a lot of manual work, which greatly affects production efficiency and product quality. Summary of the Invention

[0007] In order to solve one of the above technical defects, a silicon wafer production system is provided in an embodiment of the present application.

[0008] According to a first aspect of an embodiment of the present application, a silicon wafer production system is provided, comprising:

[0009] Slicer, used to cut silicon rods into silicon wafers and place the silicon wafers and wafer tray components into the tooling basket;

[0010] Transport trolley, used to transport tooling baskets to the degumming device;

[0011] A degumming device is provided with a parking space for accommodating a transport trolley; the degumming device is used to degumming and slicing silicon wafers;

[0012] Insertion and cleaning device, used to insert silicon wafers after slicing;

[0013] The tooling basket comprises:

[0014] A tool basket frame; a storage space for accommodating silicon wafers is formed in the tool basket frame, and an opening is provided at the top of the tool basket frame for silicon wafers to enter and exit the storage space;

[0015] The side support assembly for clamping the silicon wafer from both sides is arranged in the accommodating space and is respectively connected to both sides of the tooling basket frame; the side support assembly extends along the length direction of the tooling basket frame; and a magnetic attraction part is provided in the side support assembly.

[0016] In the technical solution provided by the embodiments of this application, the silicon wafers and wafer tray assemblies obtained by the slicer are placed in a tooling basket, which is then transported to a debonding unit via a transport cart. Debonding is performed in the debonding unit, separating the silicon wafers from the wafer tray assembly. The wafers are then separated by magnetic elements in the tooling basket. Subsequently, the wafers are inserted into a wafer-inserting and cleaning unit, automating the silicon wafer production process, improving production efficiency, reducing manual intervention, minimizing wafer damage, and increasing yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of a silicon wafer production system provided in an embodiment of the present application;

[0018] Figure 2 A schematic structural diagram of a degumming device provided in an embodiment of the present application;

[0019] Figure 3 A schematic diagram of the structure of placing silicon wafers provided in an embodiment of the present application in a tooling basket;

[0020] Figure 4 A schematic diagram of the structure of a degumming device applied to the silicon wafer degumming method provided in an embodiment of the present application;

[0021] Figure 5 A schematic diagram of the structure of the wafer support assembly and silicon wafer provided in an embodiment of the present application;

[0022] Figure 6 for Figure 4 Magnified view of area A in the middle;

[0023] Figure 7 A schematic structural diagram of an image acquisition component in a degumming device provided in an embodiment of the present application;

[0024] Figure 8 A schematic structural diagram of a conveying robot mechanism in a degumming device provided in an embodiment of the present application;

[0025] Figure 9 Another structural schematic diagram of placing silicon wafers provided in an embodiment of the present application in a tooling basket;

[0026] Figure 10 for Figure 2 A local enlarged schematic diagram in FIG.

[0027] Figure 11 A schematic structural diagram of the glue-erasing robot mechanism in the degumming device provided in an embodiment of the present application;

[0028] Figure 12 A schematic structural diagram of the glue erasing mechanism in the degumming device provided in an embodiment of the present application;

[0029] Figure 13 A schematic diagram of the structure of the glue erasing robot mechanism in the degumming device provided in an embodiment of the present application;

[0030] Figure 14 for Figure 2 A partial enlarged view of

[0031] Figure 15 A schematic diagram of the structure of a thick slice provided in an embodiment of the present application being located on a wafer support assembly;

[0032] Figure 16 A schematic diagram of the structure of a thick sheet removal robot mechanism in a degumming device provided in an embodiment of the present application;

[0033] Figure 17 A schematic structural diagram of a thick sheet clamping assembly in a degumming device provided in an embodiment of the present application;

[0034] Figure 18 A schematic diagram of the structure of a thick sheet clamping assembly in a degumming device provided in an embodiment of the present application for clamping a thick sheet;

[0035] Figure 19 A three-dimensional diagram of a tooling basket provided in an embodiment of the present application;

[0036] Figure 20 A side view of a tooling basket provided in an embodiment of the present application;

[0037] Figure 21 A top view of a tooling basket provided in an embodiment of the present application;

[0038] Figure 22 for Figure 21 Magnified view of area B in the middle;

[0039] Figure 23 A schematic diagram of the structure of the tooling basket provided in an embodiment of the present application entering the slicing station;

[0040] Figure 24 A three-dimensional diagram of a tooling basket provided in an embodiment of the present application;

[0041] Figure 25 A three-dimensional diagram of a tooling basket with silicon wafers provided in an embodiment of the present application;

[0042] Figure 26 A side view of a tooling basket provided in an embodiment of the present application;

[0043] Figure 27 A three-dimensional diagram of the tooling basket and the trigger plate provided in an embodiment of the present application;

[0044] Figure 28 A top view of the tooling basket and the trigger plate provided in an embodiment of the present application;

[0045] Figure 29 for Figure 24 Magnified view of area C in the middle;

[0046] Figure 30 for Figure 26 Cross-sectional view in the middle DD direction;

[0047] Figure 31 for Figure 30 Magnified view of area E in the middle;

[0048] Figure 32 Schematic diagram of the structure of the baffle;

[0049] Figure 33 A top view of another tooling basket provided in an embodiment of the present application applied to a slicing station.

[0050] Reference numerals:

[0051] 1- Slicer;

[0052] 2-Degumming device; 21-Silicon wafer processing line; 211-Degumming tank; 212-Transfer tank; 22-Wafer tray recovery line; 23-Thick wafer collection basket; 24-Conveyor robot mechanism; 241-Longitudinal guide rail; 242-Horizontal guide rail; 243-Vertical guide rail; 2441-Tooling top plate; 2442-Tooling basket clamp; 2443-Wafer tray clamp; 25-Thick wafer removal robot mechanism; 251-Thick wafer removal robot base; 252-Thick wafer removal robot arm; 253-Thick wafer clamp assembly; 2531- Gripper bracket; 2532-grip plate; 2533-gripper driver; 254-thick slice acquisition camera; 255-thick slice light source; 26-glue erasing robot mechanism; 261-glue erasing robot base; 262-glue erasing robot arm; 263-glue erasing mechanism; 2631-roller bracket; 2632-glue erasing roller; 264-residue glue acquisition camera; 265-glue erasing light source; 271-slide rail; 272-degumming acquisition camera; 273-camera bracket; 274-degumming light source;

[0053] 31-crystal support assembly; 311-metal plate; 312-resin plate; 32-thick slice; 33-silicon wafer;

[0054] 41-belt transport mechanism;

[0055] 5-Tool basket; 511-Frame front plate; 5111-Front plate through hole; 512-Frame rear plate; 513-Frame bottom plate; 52-Side support assembly; 521-Elastic rope; 522-Magnetic ring; 523-Buffer sleeve; 524-Threaded fastener; 525-Threaded sleeve; 53-Bottom support assembly; 531-Stainless steel rod; 532-Rubber sleeve; 54-Tool rack; 541-Base plate; 542-Front plate; 5421-Shelf plate through hole; 543-Rear plate; 55-Side stop assembly; 551-Clamping plate stop rod; 552-First support rod; 553-Second support rod; 56-Clamping plate assembly; 561-Baffle; 5611-Middle part; 56111- Ring; 5612-clamping part; 5613-triggering part; 562-torsion spring; 563-clamping gasket; 57-bottom receiving assembly;

[0056] 71-slicing workbench; 721-slicing conveying mechanism; 722-magnetic element; 723-slicing nozzle; 73-trigger plate;

[0057] 8-Plug and wash device. DETAILED DESCRIPTION

[0058] Figure 1 This is a schematic diagram of the structure of the silicon wafer production system provided in the embodiment of the present application. Figure 1 As shown, the silicon wafer production system includes: a slicer 1, a debonding device 2 and an insertion and cleaning device 8.

[0059] Slicer 1 is used to cut silicon ingots into wafers and place the wafers and wafer tray assembly into a tooling basket. Before slicing, glue is applied to the sides of the square ingot and attached to the wafer tray assembly. The wafer tray assembly is gripped by the silicon ingot grippers on slicer 1 and moved to the cutting area for cutting. The resulting wafers adhere to the underside of the wafer tray assembly and do not immediately fall off. The wafers, along with the wafer tray assembly, are then loaded into a tooling basket. After a subsequent debonding process, the wafers fall off the wafer tray assembly.

[0060] A transport trolley is used to transport the tool basket to the degumming unit 2. This trolley can be tracked or ground-mounted, with the tool basket placed on top. The trolley automatically transfers the tool basket 5 from the slicer to the degumming unit, eliminating manual handling. The degumming unit 2 includes a storage space for the transport trolley, which can be directly accessed.

[0061] The debonding device 2 is used to debond the silicon wafers to separate them from the wafer support assembly. The debonding device 2 can also separate the silicon wafers so that each silicon wafer can be separated from the adjacent silicon wafers and can be taken out.

[0062] The inserting and washing device 8 is used to perform inserting processing on each silicon wafer. The inserting and washing device 8 is provided with an inserting and washing tool basket, and the silicon wafers are inserted into the inserting and washing tool basket.

[0063] In this solution, the silicon wafers and wafer trays cut by the slicer are placed in a tooling basket, which is then transported to the debonding unit via a transport cart. Debonding is performed in the debonding unit, separating the silicon wafers from the wafer tray and allowing for wafer separation. The wafers then enter the inserting and cleaning unit for inserting. This automates the silicon wafer production process, improving production efficiency, reducing manual intervention, minimizing wafer damage, and increasing yield.

[0064] Furthermore, a wafer transfer mechanism is provided between the debonding device and the inserting and cleaning device for transferring the separated wafers to the inserting and cleaning device. In this embodiment, the wafer transfer mechanism is specifically a belt conveyor mechanism for transferring each wafer to the inserting and cleaning device.

[0065] This embodiment provides a specific implementation of a degumming device. The degumming device provided in this embodiment is used to degumming silicon wafers.

[0066] Figure 2 This is a schematic diagram of the structure of the degumming device provided in the embodiment of the present application. Figure 3 This is a schematic diagram of the structure of the silicon wafer provided in the embodiment of the present application being placed in a tooling basket. Figure 2 and Figure 3 As shown, the degumming apparatus provided in this embodiment includes a silicon wafer processing line 21. The silicon wafer processing line 21 is sequentially provided with a degumming station and a gluing station. The degumming station is used to degumming the silicon wafer 33 and the wafer tray assembly 31 contained in the tooling basket 5 to separate the silicon wafer from the wafer tray assembly. The gluing station is used to wipe the adhesive surface of the silicon wafer after degumming to remove residual adhesive on the adhesive surface of the silicon wafer.

[0067] The debonding device also features a conveyor robot mechanism 24 for grabbing and moving the tooling basket 5. Specifically, silicon wafers 33 and wafer tray assemblies 31 cut from the slicer are placed in the tooling basket 5, and a transport cart transports the tooling basket 5 to the debonding device. The conveyor robot mechanism 24 grabs the tooling basket 5 and transports it to the debonding station for debonding. After debonding is complete, the basket 5 is then transported to the gluing station for gluing.

[0068] Preferably, a waiting area is provided in the degumming device. After the transport trolley enters the degumming device, the conveying robot mechanism 24 transports the tooling basket 5 containing the silicon wafers and the crystal support assembly to the waiting area for waiting, and then the transport trolley returns to the slicer for reuse. After the degumming station is idle, the conveying robot mechanism 24 transports the tooling basket 5 containing the silicon wafers and the crystal support assembly located in the waiting area to the degumming station to degumming the silicon wafers.

[0069] Furthermore, the debonding device includes a wafer tray recovery line 22, located parallel to the wafer handling line 21. A thick wafer removal station is located adjacent to the wafer tray recovery line 22 for removing thick wafers adhered to the wafer tray assembly. The aforementioned conveyor robot mechanism 24 is also used to, after the tooling basket moves to the glue-wiping station, grab the wafer tray assembly with the thick wafer adhered to it and drive the wafer tray assembly to the thick wafer removal station for removal. The conveyor robot mechanism 24 then places the wafer tray assembly onto the wafer tray recovery line 22, returning it to the slicer for recycling.

[0070] Furthermore, a tool basket recovery line is provided within the debonding device, arranged alongside the wafer processing line 21 and the wafer tray recovery line 22. A conveyor robot mechanism 24 is also used to transport the empty tool baskets to the tool basket recovery line for recycling after the wafers are separated and removed.

[0071] A specific implementation method: Figure 2 As shown, the wafer processing line 21, the tool basket recovery line, and the wafer tray recovery line 22 are arranged side by side. A transport cart loaded with the tool basket 5 enters the debonding unit 2 from the left. The conveyor robot mechanism 24 grabs the tool basket and moves it to the right, first entering the waiting area, then the debonding station and the gluing station. Both the wafer tray recovery line 22 and the tool basket recovery line operate from right to left, transporting the wafer tray assembly and tool basket to the left.

[0072] The conveying robot mechanism 24 is arranged at the top and has at least six movement directions, so that the conveying robot mechanism 24 can move freely on each conveying line to cooperate with production and improve efficiency.

[0073] The degumming station is used to degumming the silicon wafer. This embodiment provides a specific solution:

[0074] Figure 4 This is a schematic diagram of the structure of a degumming device applied to the silicon wafer degumming method provided in an embodiment of the present application. Figure 5 This is a schematic diagram of the structure of the crystal support assembly and silicon wafer provided in the embodiment of the present application. Figure 4 and Figure 5As shown, the debonding station is equipped with a debonding tank 211, above which is an image acquisition assembly. A conveyor robot mechanism 24 hoists a tool basket 5, which moves downward into the debonding tank 211 for debonding. After initial debonding is completed, the conveyor robot mechanism 24 lifts the tool basket 5 and raises it to the height of the image acquisition assembly. The image acquisition assembly then captures side images of the silicon wafer and wafer support assembly. The image acquisition assembly exchanges data with the processor.

[0075] First, the processor captures a side image of the silicon wafer and the wafer tray assembly. It then determines the distance between the top of the silicon wafer and the bottom of the wafer tray assembly based on the side image, and determines whether this distance meets the debonding termination criteria. If so, debonding is terminated. During the debonding process, the silicon wafer separates from the wafer tray assembly and falls into the tooling basket, where the distance between the wafer and the wafer tray increases. Therefore, the distance between the wafer and the wafer tray assembly can be used to determine whether the silicon wafer has been debonded. This enables automatic identification, which is highly efficient and accurate, and helps improve yield rates.

[0076] A specific implementation method is to obtain a side image of the silicon wafer and the wafer tray assembly. Specifically, the image acquisition assembly is controlled to move at a uniform speed along the length direction of the wafer tray assembly, and multiple side images of the silicon wafer and the wafer tray assembly are collected during the movement. The multiple collected side images are then stitched together to obtain a set of side images of the entire silicon wafer.

[0077] Specifically, Figure 6 for Figure 4 A magnified view of area A in the middle. Figure 7 This is a schematic diagram of the structure of the image acquisition component in the degumming device provided in the embodiment of the present application. Figure 6 and Figure 7 As shown, a slide rail 271 extending in the horizontal direction and a driving mechanism are provided on the frame of the degumming device, and the image acquisition component is specifically a degumming acquisition camera 272, which is provided on the slide rail 271 through a camera bracket 273.

[0078] Furthermore, controlling the image acquisition assembly to move at a constant speed along the length of the wafer support assembly specifically includes: controlling the drive mechanism to operate, driving the image acquisition assembly to move at a constant speed along slide rail 271, wherein slide rail 271 extends in the same direction as the length of the wafer support assembly, i.e., horizontally. The drive mechanism drives camera bracket 273 to slide horizontally relative to slide rail 271, thereby driving debonding acquisition camera 272 to move synchronously. The length of slide rail 271 is adapted to the length of the wafer support assembly so that the travel range of debonding acquisition camera 272 is sufficient to capture images of the entire wafer support assembly and silicon wafer.

[0079] Furthermore, a light source is provided on top of the camera support 273, and the light source moves with the camera support 273. This light source is referred to as the debonding light source 274, and emits light toward the silicon wafer to increase the brightness within the camera's field of view and improve image clarity. The brightness of the debonding light source 274 can be constant or adjustable. In this embodiment, during the movement of the camera, the light source brightness is adjusted in real time based on the collected side image to adapt to the different ambient brightness levels within the debonding device, thereby obtaining an image with uniform brightness and providing a clear contrast between the top of the silicon wafer and the bottom edge of the wafer support assembly, facilitating subsequent image analysis and feature extraction to obtain edge contours.

[0080] Alternatively, the degumming light source 274 is an induction-type light source, on which a sensor is provided to sense the brightness of the reflected light and automatically adjust the brightness of the output light.

[0081] A specific implementation method: adjusting the brightness of the light source according to the collected side image includes: determining the grayscale value of each pixel in the collected side image; when the average grayscale value of each pixel is less than the grayscale lower limit value, controlling the light source to increase the brightness; when the average grayscale value of each pixel is greater than the grayscale upper limit value, controlling the light source to reduce the brightness.

[0082] The grayscale value in an image represents its brightness, ranging from 0 to 255. Lower grayscale values ​​indicate darker images, while higher grayscale values ​​indicate brighter images. The grayscale value of each pixel in the image is extracted and the average grayscale value of all pixels is calculated. If this average value is less than the grayscale lower limit, the image is dark and the light source needs to be controlled to increase the brightness. If this average value is greater than the grayscale upper limit, the image is bright and the light source needs to be controlled to decrease the brightness.

[0083] Furthermore, in the above steps, the distance between the top of the silicon wafer and the bottom of the wafer support assembly is determined based on the side image, which can be achieved specifically by the following method:

[0084] First, image processing and analysis techniques are used to identify the silicon wafer outline in the side image. The wafer outline includes at least the top and side profiles. The top edge profile of each wafer is then fitted into a curve. After debonding, the silicon wafers fall downward. Some wafers that have not been completely debonded remain attached to the wafer support assembly at a higher position, resulting in unevenness among the wafers.

[0085] Next, identify the bottom edge contour of the wafer tray assembly. The wafer tray assembly includes, from top to bottom, the wafer tray, metal plate 311, and resin plate 312. The silicon wafer is adhered to the resin plate 312 before debonding. Fit the bottom edge contour of the resin plate 312, the lowest in the wafer tray assembly, to a straight line.

[0086] Finally, the vertical distance between the fitting straight line and each point of the fitting curve is obtained to obtain the shortest distance D, which is used as the distance between the top of the silicon wafer and the bottom surface of the wafer support assembly.

[0087] If the shortest distance is within the preset range, the debonding conditions are met, debonding is complete, and the process can proceed to the next step. If it is not within the preset range, the debonding conditions are not met and re-debonding is required. The preset range can be set based on different debonding processes or wafer size. For example, if the preset range is 5mm-20mm, the debonding conditions are met when the shortest distance is within 5mm-20mm.

[0088] Assuming that the degumming collection camera 272 and the degumming light source 274 are at a fixed height, after the initial degumming is completed, the conveying robot mechanism 24 is controlled to work to drive the tooling basket 5 containing the silicon wafer 33 to rise to a preset position. At this preset position, it is ensured that the degumming collection camera 272 can completely collect the image of the glue point between the silicon wafer 33 and the crystal support assembly during the movement.

[0089] After the separation of the silicon wafer and the wafer support assembly is confirmed through the above solution, the conveying robot mechanism 24 drives the tooling basket 5 to move to the transfer slot of the glue erasing station.

[0090] On the basis of the above technical solution, this embodiment further provides an implementation method of the conveying robot mechanism 24:

[0091] Figure 8 This is a schematic diagram of the structure of the conveying robot mechanism in the degumming device provided in the embodiment of the present application. Figure 8 As shown, the conveying robot mechanism 24 includes: a longitudinal guide rail 241, a transverse guide rail 242, a vertical guide rail 243, a clamping claw assembly, a vertical drive, a transverse drive, and a longitudinal drive.

[0092] Two longitudinal guide rails 241 extend along the wafer tray recovery line. Transverse guide rails 242 extend perpendicular to the wafer tray recovery line and are positioned between the two longitudinal guide rails 241. A longitudinal actuator drives the transverse guide rails 242 and the entire clamping jaw assembly along the longitudinal guide rails 241.

[0093] The vertical guide rail 243 extends vertically, and the vertical driver drives the clamping jaw assembly to move up and down along the vertical guide rail 243. The transverse driver is used to drive the clamping jaw assembly and the vertical guide rail 243 to move along the transverse guide rail, so that the clamping jaw assembly can move in three directions: longitudinal, transverse, and vertical.

[0094] The clamp assembly is used to grip the work basket. Specifically, it includes a work top plate 2441 and a work basket clamp 2442. The work top plate 2441 is connected to a vertical actuator. The work basket clamp 2442 is located on the bottom surface of the work top plate. It extends vertically, with its bottom end bent in the opposite direction to form a hook-like structure. This hook-like structure hooks onto the work basket, lifting it.

[0095] During operation, the clamping assembly is adjusted to the top of the tooling basket by the transverse and longitudinal drivers, and then the clamping assembly is driven down by the vertical driver until the hook structure of the tooling basket clamp 2442 is located on the side of the tooling basket. The clamping assembly is then driven to move laterally by the transverse driver so that the hook structure of the tooling basket clamp 2442 is inserted under the boom in the tooling basket, and then the clamping assembly is driven up by the vertical driver to lift and move the tooling basket.

[0096] Furthermore, the clamping assembly includes a wafer clamping jaw 2443 for gripping the wafer assembly and a drive mechanism for lateral movement of the wafer clamping jaw 2443, both located on the bottom surface of the tooling top plate 2441. The wafer clamping jaw 2443 can move or extend laterally to accommodate the wafer assembly's size requirements. The structure of the wafer clamping jaw 2443 can be tailored to the wafer assembly's suspension structure. For example, if the wafer assembly has a T-slot at the top, the wafer clamping jaw 2443 can be T-shaped and inserted into the T-slot to lift the wafer assembly.

[0097] The wafer support assembly is lifted away by the above-mentioned conveying robot mechanism 24, and the remaining silicon wafers and tooling baskets are Figure 9 As shown, Figure 9 Another structural schematic diagram of placing silicon wafers provided in an embodiment of the present application in a tooling basket.

[0098] Figure 10 for Figure 2 A local enlarged schematic diagram in FIG. Figure 2 and Figure 10 As shown, the eraser station 22 is equipped with a transfer slot 212. An image acquisition component and an eraser robot mechanism 26 are located adjacent to the transfer slot 323. The image acquisition component is used to identify residual adhesive on the silicon wafer, while the eraser robot mechanism 26 is used to erase residual adhesive on the silicon wafer. Compared to traditional manual erasing methods, the solution provided by this embodiment is more efficient and requires fewer operators. This reduces manpower and workload, while also increasing production speed.

[0099] This embodiment provides an implementation method of a glue erasing robot mechanism: Figure 11 This is a schematic diagram of the structure of the glue-wiping robot mechanism in the degumming device provided in the embodiment of the present application. Figure 11 As shown, the eraser robot mechanism 26 includes an eraser robot base 261, an eraser robot arm 262, and an eraser mechanism 263. The eraser robot base 261 is fixed to a workbench. The eraser robot arm 262 is rotatably mounted on the eraser robot base 261 and can rotate relative to the eraser robot base 261. The eraser robot arm 262 has at least two degrees of freedom, for example, two, three, four, five, six, or more degrees of freedom, to enable precise movement of the working end of the eraser robot arm 262. The eraser mechanism 263 is disposed at the working end of the eraser robot arm 262 and is used to erase residual adhesive from the silicon wafer.

[0100] A specific implementation method: Figure 12 This is a schematic diagram of the structure of the glue wiping mechanism in the degumming device provided in the embodiment of the present application. Figure 12 As shown, the eraser mechanism 263 includes a roller support 2631 and an eraser roller 2632. The roller support 2631 is mounted on the working end of the eraser arm 262. The eraser roller 2632 is mounted on the roller support 2631 and is freely rotatable. The eraser roller 2632 is provided with a glue-removing layer that resists adhesive adhesion. The eraser roller 2632 rolls along the side of the silicon wafer 33, removing any residual glue from the wafer 33 and effectively removing the glue. The glue-removing layer is made of a soft, sticky material.

[0101] Furthermore, an image acquisition component can be mounted on the roller support 2631. Specifically, the image acquisition component can be a residual adhesive acquisition camera 264. The residual adhesive acquisition camera 264 is mounted on the roller support 2631 and faces the silicon wafer to capture images. The eraser arm 262 can operate based on the captured images to drive the eraser roller 2632 into contact with the silicon wafer and roll it across the wafer.

[0102] Furthermore, a light source (ie: Figure 12 The eraser light source 265 is mounted on the roller support 2631. The eraser light source 265 emits light toward the silicon wafer to be erased, thereby increasing the brightness in that area and facilitating the capture of clear images. The eraser light source 265 can be a monochromatic light source, and its brightness can be adjusted based on the brightness of the working environment of the degumming device.

[0103] A specific solution: Figure 9 As shown, multiple silicon wafers 33 are placed in a work basket 5, with the sides of the wafers 33 containing adhesive residue facing upward. An adhesive residue collection camera 264 is located on the lower surface of a roller support 2631 to capture images of the adhesive residue below. An adhesive erasing light source 265 emits light downward to increase brightness in the area below.

[0104] Based on the implementation of the aforementioned eraser station, this embodiment further provides an eraser method. First, an image acquisition component captures an image of the adhesive surface of a silicon wafer. The image acquisition component exchanges data with a processor, which acquires the image of the adhesive surface of the silicon wafer and then determines, based on the image, whether there is residual adhesive on the adhesive surface of the silicon wafer. If residual adhesive is present, the eraser robot mechanism is controlled to erase the residual adhesive on the adhesive surface of the silicon wafer.

[0105] Furthermore, in the above steps, the eraser mechanism is controlled to erase the residual glue on the adhesive surface of the silicon wafer, specifically in the following manner:

[0106] First, the current position of the eraser robot mechanism and the position of the silicon wafer are obtained, and then the eraser robot mechanism is controlled to move to the adhesive surface of the silicon wafer according to the current position of the eraser robot mechanism and the position of the silicon wafer; the eraser robot mechanism is controlled to erase on the adhesive surface of the silicon wafer according to the preset eraser trajectory.

[0107] Figure 13 This is a schematic diagram of the structure of the glue erasing robot mechanism in the degumming device provided in the embodiment of the present application. Figure 13 Specifically, the process of controlling the eraser mechanism to erase the adhesive surface of the silicon wafers according to a preset erase trajectory includes: starting from one end of a group of silicon wafers, the eraser mechanism is controlled to move back and forth along the width of the group of silicon wafers to erase the adhesive surface of the silicon wafers until reaching the other end of the group of silicon wafers. A group of silicon wafers is a collection of all silicon wafers obtained by slicing a silicon ingot.

[0108] After a group of silicon wafers are wiped, the method also includes: controlling the wipe robot mechanism to move to a preset starting position and reacquiring an image of the adhesive surface of the silicon wafer; determining again whether there is residual glue on the adhesive surface of the silicon wafer based on the reacquired image; and when residual glue exists, controlling the wipe robot mechanism to wipe the residual glue on the adhesive surface of the silicon wafer again until the residual glue is completely removed.

[0109] This embodiment also provides another method of erasing: controlling the erasing robot mechanism to erase the adhesive surface of the silicon wafer according to a preset erasing trajectory. The following method can also be used: obtaining the length of a group of silicon wafers and dividing the length into at least two sections; repeatedly wiping at least two sections of silicon wafers at least twice, thereby eliminating the step of re-acquiring the image in the above scheme and improving the erasing quality.

[0110] For example: divide the length into three sections; wipe the three sections of silicon wafers repeatedly twice.

[0111] In addition, after wiping at least two sections of silicon wafers respectively, adhesive surface images of each section of silicon wafer can be collected respectively; based on the adhesive surface images of each section of silicon wafer, it is determined whether there is residual adhesive on each section of silicon wafer, and if so, the section of silicon wafer is re-wiped.

[0112] One specific implementation involves setting a preset starting position for photographing. When erasing is required, the eraser robot is first controlled to move to this starting position to take a photo and capture an image of the adhesive surface of the silicon wafer. The adhesive surface of a group of silicon wafers is then divided into three sections. The robot moves from the starting position to the first section, wiping it back and forth across the width of the group of wafers twice. The robot then moves to the next section, wiping it back and forth twice, and finally to the third section, wiping it back and forth twice.

[0113] Afterwards, the three sections of silicon wafers are photographed respectively, and the images of each section of silicon wafer are analyzed to see if there is residual glue. If there is, the glue erasing robot mechanism is controlled to move to the corresponding position to erase the glue again.

[0114] Furthermore, a light source is provided within the degumming device, emitting light toward the adhesive surface of the silicon wafer to enhance the brightness of the field of view of the image acquisition component. During image acquisition, the brightness of the light source is adjusted based on the captured wafer image. The light source can be located on the eraser mechanism or on the frame of the degumming device.

[0115] The conveyor robot mechanism 24 lifts the wafer tray assembly from the transfer tank 212 and transports it to the slab removal station, where it is broken off from the wafer tray assembly. The slab removal station is equipped with an image acquisition component for identifying the slab and a slab removal robot mechanism for gripping and separating the slab from the wafer tray assembly. The conveyor robot mechanism 24 then places the wafer tray assembly into the wafer tray recovery line 22 for transport back to the slicer for reuse. Figure 14 for Figure 2 A partial enlarged view of Figure 15 This is a schematic diagram of the structure of the thick slice provided in the embodiment of the present application being located on the wafer support assembly. Figure 2 and Figure 14 、 Figure 15 Specifically, when the conveying robot mechanism 24 drives the wafer tray assembly to the vicinity of the thick sheet removal robot mechanism 25, the image acquisition component captures a front-side image and identifies the thick sheet. After the processor identifies the thick sheet and determines its position based on the image, it controls the thick sheet removal robot mechanism 25 to move into position, clamp the thick sheet, and drive the thick sheet to move horizontally, downwardly, and / or rotate to remove the thick sheet from the wafer tray assembly and place it in the thick sheet collection area.

[0116] The thick flake removal robot mechanism 25 can be fixed to the ground or to a workbench above the ground. In this embodiment, a workbench is provided within the degumming device, to which the thick flake removal robot mechanism 25 is fixed. A thick flake collection basket 23 is provided in the thick flake collection area, into which the thick flake removal robot mechanism 25 places the broken-off thick flakes.

[0117] Furthermore, this embodiment provides an implementation method of a thick sheet removal robot mechanism:

[0118] Figure 16 This is a schematic diagram of the structure of the thick sheet removal robot mechanism in the degumming device provided in the embodiment of the present application. Figure 16 As shown, the thick film removal robot mechanism includes: a thick film removal robot base 251, a thick film removal robot arm 252 and a thick film clamping claw assembly 253. Among them, the thick film removal robot base 251 is set on the workbench. The thick film removal robot arm 252 is rotatably set on the thick film removal robot base 251 and can rotate relative to the thick film removal robot base 251. The thick film removal robot arm 252 has at least 2 degrees of freedom, for example, it can have 2, 3, 4, 5, 6 or more degrees of freedom, so that the working end of the thick film removal robot arm 252 can move accurately. The thick film clamping claw assembly 253 is set at the working end of the thick film removal robot arm 252 for clamping the thick film.

[0119] This embodiment provides an implementation method: the thick sheet gripper assembly 253 includes a gripper bracket, a gripper, and a gripper driver. The gripper bracket is rotatably mounted on the working end of the thick sheet removal robot arm 252. A cavity is defined within the gripper bracket. The gripper is positioned within this cavity. The gripper driver is mounted on the gripper bracket to drive the gripper to perform the gripping operation.

[0120] The structure of the clamping jaw can be various, for example, the following methods can be adopted:

[0121] Figure 17 FIG18 is a schematic diagram of the structure of the thick slice clamping assembly in the degumming device provided in the embodiment of the present application, FIG19 is a schematic diagram of the structure of the thick slice clamping assembly in the degumming device provided in the embodiment of the present application for clamping the thick slice. Figure 17 and Figure 18 As shown, in this embodiment, the clamping claw bracket 2531 is a rectangular parallelepiped structure, which is provided with a receiving cavity therein, and an opening communicating with the receiving cavity is provided at one end.

[0122] The clamping jaws include two parallel and oppositely disposed clamping plates 2532 disposed in the receiving cavity. A clamping jaw driver 2533 is connected to the two clamping plates 2532 to drive the two clamping plates 2532 to move toward each other to produce a clamping action, and to move away from each other.

[0123] During use, the slab removal robot 252 drives the slab clamping assembly to the bottom of the slab 32 and adjusts the distance between the two clamping plates 2532 to a value greater than the thickness of the slab 32. The slab removal robot 252 then slowly moves the slab clamping assembly upward until the two clamping plates 2532 are positioned on either side of the slab 32. The two clamping plates 2532 are then driven toward each other, contacting the slab 32 and applying a clamping force. The slab removal robot 252 then drives the slab clamping assembly downward or horizontally, or it can rotate horizontally, to separate the slab 32 from the wafer support assembly 31.

[0124] The clamping jaw driver 2533 may be a cylinder, a hydraulic cylinder or a driving motor.

[0125] Furthermore, the slab clamping jaw assembly 253 also includes a jaw extension actuator disposed within the receiving cavity and connected to the jaws, configured to drive the jaws to extend out of the receiving cavity to perform the clamping operation. Taking the clamping plate 2532 as an example, specifically, when not in operation, the jaw extension actuator retracts the clamping plate 2532 into the receiving cavity, while the clamping jaw support 2531 protects the clamping plate 2532 from damage. When in operation, the jaw extension actuator drives the clamping plate 2532 outward, extending it from the opening of the clamping jaw support 2531 to clamp the slab.

[0126] The image acquisition component can be specifically a thick slice acquisition camera 254, which is disposed on the outer surface of the gripper bracket 2531. The thick slice acquisition camera 254 captures images in the direction of the wafer support assembly. The thick slice robot arm 252 can operate according to the acquired images.

[0127] Furthermore, a light source (ie: Figure 17 The thick sheet light source 255 is mounted on the clamping jaw support 2531. The light from the thick sheet light source 255 is directed toward the wafer support assembly to increase the brightness in this area and facilitate the capture of clear images. The thick sheet light source 255 can be a monochromatic light source, and its brightness can be adjusted according to the brightness of the working environment of the debonding device.

[0128] After the thick slice is broken off, the image acquisition component can recognize this state, and then the controller controls the conveying robot mechanism 24 to place the wafer tray assembly into the wafer tray recovery line 22, and transport the wafer tray assembly back to the slicing station for reuse.

[0129] Furthermore, this embodiment provides an implementation of the aforementioned tooling basket 5. The tooling basket 5 is used to hold silicon wafers cut by a slicer and transport the wafers to a degumming device for degumming, gluing, and slicing. Using a single tooling basket to transport wafers between different workstations eliminates the need to transfer wafers from one tooling basket to another.

[0130] Figure 19 A three-dimensional diagram of a tooling basket provided in an embodiment of the present application, Figure 20 A side view of a tooling basket provided in an embodiment of the present application, Figure 21 This is a top view of the tooling basket provided in the embodiment of the present application. Figure 19 to Figure 21 As shown, the tooling basket provided in this embodiment includes: a tooling basket frame and a side support assembly 52.

[0131] The tool basket frame can be a rectangular parallelepiped structure, and the length direction of the tool basket frame is Figure 20 The Y direction in the tooling basket frame is Figure 21 The X direction in the tooling basket frame is consistent with the vertical direction, such as Figure 20 The Z direction in .

[0132] A storage space for silicon wafers is formed within the tooling basket frame. An opening is provided at the top of the tooling basket frame for the wafers to enter and exit the storage space. A group of silicon wafers, after being removed from the slicer, falls through the opening into the storage space. The silicon wafers are inserted vertically into the storage space, perpendicular to the length of the tooling basket frame. Multiple wafers are arranged side by side, sequentially along the length.

[0133] Side support assemblies 52 are positioned within the storage space and connected to either side of the tooling basket frame. They clamp the silicon wafers from both sides to prevent them from tipping over. The side support assemblies 52 extend along the length of the tooling basket frame. Their length can be adjusted based on the length of a group of silicon wafers or the length of silicon ingots before slicing. Slightly longer than a group of silicon wafers, they are capable of clamping all wafers.

[0134] The side support assembly 52 is equipped with a magnetic element. When the side of the tooling basket is equipped with a magnetic element, a magnetic attraction is generated between the magnetic element and the magnetic element, causing the side support assembly 52 near the magnetic element to deform outward, eliminating the clamping force on the silicon wafer. The silicon wafer, now free, is free. A slicing medium is sprayed toward the side of the silicon wafer through a slicing nozzle on the side of the tooling basket, increasing the distance between the wafer and adjacent wafers, achieving the desired slicing effect. The separated silicon wafers are then removed for subsequent production steps.

[0135] The tooling basket provided in this embodiment is used to hold silicon wafers produced by a slicer, and then sent to a degumming device for degumming and slicing. The tooling basket can adapt to the degumming station, the gluing station and the slicing station. There is no need to transfer the silicon wafers to another tooling basket between the stations. The same tooling basket can meet the operating requirements of each station, thereby realizing the automation of the process flow of degumming, gluing and slicing. On the one hand, it saves time and improves production efficiency; on the other hand, it also reduces the occurrence of silicon wafers being damaged by collisions during the transfer process, thereby improving the yield rate and reducing production costs.

[0136] The above-mentioned tool basket frame can be a box-type structure or a hollow skeleton structure. This embodiment provides a specific implementation method: Figures 19 to 21 As shown, the tool basket frame includes: a frame front plate 511, a frame rear plate 512, and a frame bottom plate 513. The frame bottom plate 513 is a rectangular plate. The frame front plate 511 and the frame rear plate 512 are arranged parallel to each other and opposite to each other. The frame front plate 511 and the frame rear plate 512 are respectively vertically connected to the two ends of the frame bottom plate 513 in the longitudinal direction.

[0137] The side support assembly 52 is connected between the frame front plate 511 and the frame rear plate 512. The height of the side support assembly 52 is set according to the height of the silicon wafer, and the side support assembly 52 is located at or above the center height of the silicon wafer. There are two side support assemblies 52, one connected to the X-direction edge of the frame front plate 511 and the other connected to the X-direction edge of the frame rear plate 512.

[0138] Figure 22 for Figure 21 Magnified view of area B in the middle. Figure 21 and Figure 22 As shown in one implementation, the side support assembly 52 includes an elastic cord 521, a magnetic ring 522, and a buffer sleeve 523. The elastic cord 521 extends along the length of the work basket frame and is connected between the frame front plate 511 and the frame rear plate 512. The elastic cord 521 has a certain degree of tensile deformation capability.

[0139] The magnetic ring 522 serves as a magnetic attraction component and is sleeved onto the elastic rope. There are multiple magnetic rings 522, and the multiple magnetic rings are arranged at intervals. The buffer sleeve 523 is sleeved on the outside of the multiple magnetic rings 522, and is tightly fitted with the magnetic rings 522 to prevent relative sliding. The buffer sleeve 523 and the magnetic ring 522 can rotate together relative to the elastic rope. The magnetic ring 522 can be a circular ring, and its diameter can be approximately 10 mm. The magnetic ring 522 can be made of a material that can produce magnetic attraction with the magnetic component, such as an electromagnet, a permanent magnet, or iron. In this embodiment, the magnetic ring 522 is an iron ring.

[0140] The buffer sleeve 523 can be made of a material with a certain buffering capacity, such as rubber, silicone, sponge, etc. In this embodiment, sponge is used as an example, and the buffer sleeve 523 is specifically a sponge sleeve, which can clamp the silicon wafer without damaging the silicon wafer.

[0141] The elastic cord 521 can be connected to the frame front plate 511 and the frame rear plate 512 in the same manner. The connection method can be, for example, the following scheme:

[0142] Taking the frame front plate 511 as an example, the frame front plate 511 is provided with a front plate through hole 5111. One end of the threaded sleeve 525 is connected to the elastic cord 521, and the other end is inserted into the front plate through hole 5111. The threaded sleeve 525 has a threaded hole that mates with the threaded fastener 524. The threaded fastener 524 is inserted into the threaded hole and fastened to the threaded sleeve 525, thereby fixing the threaded sleeve 525 to the frame front plate 511.

[0143] One approach involves positioning the centerline of the threaded hole perpendicular to the centerline of the threaded sleeve 525. A front plate connection hole, with its centerline perpendicular to the front plate through-hole, is provided on the side of the frame front plate 511. A threaded fastener 524 passes through the front plate connection hole and screws into the threaded hole of the threaded sleeve 525 to secure the connection. The threaded fastener 524 also acts as a stop, preventing the threaded sleeve 525 from falling out of the front plate through-hole. Adjusting the threaded fastener 524 also allows the side support assembly to be adjusted to accommodate silicon wafers of varying sizes.

[0144] Another method is to parallel the centerline of the threaded hole with the centerline of the threaded sleeve 525. The opening of the front plate through-hole 5111, away from the elastic cord, is set to be smaller than the head of the threaded fastener 524. This allows the tail of the threaded fastener 524 to enter the front plate through-hole 5111 and be tightened into the threaded hole of the threaded sleeve 525. The head of the threaded fastener 524 is located on the side of the frame front plate 511 away from the elastic cord 521, which prevents the threaded sleeve 525 from being removed from the front plate through-hole.

[0145] Furthermore, the front plate through hole 5111 is an oblong hole extending along the width direction of the tooling basket frame. By adjusting the position of the threaded sleeve 525 in the oblong hole, the width between the two side support assemblies 52 can be adjusted to accommodate silicon wafers of different widths.

[0146] Building on the above technical solution, the tooling basket also includes a bottom support assembly 53, located at the bottom of the storage space. After the silicon wafer enters the storage space, it rests on the bottom support assembly 53, which supports the silicon wafer from below. Specifically, the bottom support assembly 53 is connected between the frame front plate 511 and the frame rear plate 512. There are two bottom support assemblies 53, spaced apart.

[0147] The bottom support assembly 53 includes a stainless steel rod 531 and a rubber sleeve 532. The stainless steel rod 531 is vertically connected between the frame front plate 511 and the frame rear plate 512, while the rubber sleeve 532 is positioned around the outside of the stainless steel rod 531. The stainless steel rod 531 provides rigid support, while the rubber sleeve 532 acts as a buffer to prevent damage to the silicon wafer.

[0148] A group of silicon wafers 33 coming off the slicer are adhered to the wafer support assembly 31 and placed together with the wafer support assembly 31 into the tooling basket 5. Figure 2 Then the tooling basket is sent to the degumming device for degumming. After degumming, the silicon wafer 33 is separated from the crystal support assembly 31, the silicon wafer 33 remains in the tooling basket 5, and the crystal support assembly 31 is recovered. Figure 9 A slicing station is further provided after the degumming station and the gluing station, and the tooling basket 5 is sent to the slicing station after gluing.

[0149] Figure 23 This is a schematic diagram of the structure of the tooling basket entering the slicing station provided in the embodiment of the present application. Figure 23 As shown, the silicon wafer production line of the debonding device is further provided with a slicing station, which is provided with a slicing workbench 71 , a slicing conveying mechanism 721 , a magnetic member 722 and a slicing nozzle 723 .

[0150] The slicing conveying mechanism 721 is arranged on the slicing workbench 71. The tooling basket 5 is arranged on the slicing conveying mechanism 721 and can move along the length direction of the tooling basket 5 under the drive of the slicing conveying mechanism 721, that is, along the length direction of the tooling basket 5. Figure 7 The area where the tooling basket 5 moves is referred to as the travel area.

[0151] Magnetic members 722 are positioned on both sides of the tool basket's travel area. For example, magnetic members 722 are symmetrically positioned on both sides of the tool basket's travel area. Magnetic members 722 can generate magnetic attraction with the magnetic members (magnetic rings 522) on the tool basket 5. Slicing nozzles 723 are positioned on both sides of the tool basket's travel area, adjacent to magnetic members 722, with the outlet of slicing nozzles 723 facing the tool basket's travel area. Slicing nozzles 723 can spray a slicing medium, which can be either a gas or a liquid.

[0152] by Figure 23 For example, the tooling basket 5 moves from left to right. When it moves to the position of the magnetic part 722, the magnetic force between the magnetic part 722 and the magnetic ring 522 causes the side support assembly 52 in the area of ​​the magnetic ring 522 to stretch and deform outward, away from the silicon wafer 33 at this position, and loses the clamping force on the silicon wafer. The slicing nozzle 723 sprays water between two adjacent silicon wafers to separate the adjacent silicon wafers, increase the distance, and facilitate taking out the silicon wafers from the tooling basket.

[0153] As the tooling basket 5 continues to move rightward, the magnetic rings 522 are sequentially subjected to magnetic force from right to left, causing the side support assemblies 52 to stretch and deform outward. The silicon wafers that have lost their grip are sprayed with water and separated from their adjacent wafers, allowing them to be removed. In the above scheme, the cooperation between the magnetic member 722 and the magnetic attraction member allows only a small portion of the silicon wafers to lose their grip and be removed, while the remaining silicon wafers remain clamped and prevent them from toppling.

[0154] The transport mechanism 721 may specifically include a transport screw, a transport slide, and a drive motor. The transport screw extends along the length of the tooling basket 5. The transport slide engages with the transport screw via threads, connecting the transport slide to the tooling basket. The drive motor rotates the transport screw, thereby driving the transport slide and tooling basket 5 in the Y direction.

[0155] like Figure 10 As shown, a belt conveyor mechanism 41 is provided at the front end of the conveying screw. The belt in this mechanism 41 includes a vertically movable portion and a horizontally movable portion. The vertically movable portion is located adjacent to the tooling basket 5 and is coated with glue. After being sliced ​​through the aforementioned steps, the silicon wafers come into contact with the belt surface, adhere to it, and then move upward along the belt and horizontally away from the tooling basket to the insertion and washing device. The insertion and washing device houses a tooling basket into which each silicon wafer is inserted.

[0156] This embodiment provides another implementation of the tooling basket 5, which automatically clamps the silicon wafers during the slicing process to prevent them from falling over, and can cooperate with the slicing station to separate the silicon wafers.

[0157] Figure 24 A three-dimensional diagram of a tooling basket provided in an embodiment of the present application, Figure 25 A three-dimensional diagram of a tooling basket with silicon wafers provided in an embodiment of the present application, Figure 26 A side view of a tooling basket provided in an embodiment of the present application, Figure 27 A three-dimensional diagram of the tooling basket and the trigger plate provided in an embodiment of the present application. Figure 28 A top view of the tooling basket and trigger plate provided in an embodiment of the present application.

[0158] like Figures 24 to 28 As shown, the tooling basket provided in this embodiment includes a tooling frame 54, a side guard assembly 55, and a clamping plate assembly 56. The tooling frame 54 is a basic structure used to support silicon wafers and mount various components. In this embodiment, the tooling frame 54 is defined as having a length direction Y, a width direction X, and a height direction Z.

[0159] Side guard assemblies 55 are provided on either side of the fixture frame 54. Together, the side guard assemblies 55 and the fixture frame 54 define a storage space for the silicon wafers 33. A group of silicon wafers 33 enter the storage space from above and are inserted vertically into the storage space, perpendicular to the Y-axis. Multiple silicon wafers 33 are arranged side by side, sequentially arranged along the Y-axis.

[0160] The debonding device is equipped with a trigger plate 73 that cooperates with the clamping plate assembly 56 to tighten or loosen the silicon wafer 33. The clamping plate assembly 56 is rotatably mounted on the side stop assembly 55. Initially, the clamping plate assembly 56 is in a first position, which clamps the silicon wafer 33. When force is applied by the trigger plate 73, the clamping plate assembly 56 rotates relative to the side stop assembly 55 to a second position, which loosens the silicon wafer 33.

[0161] There are multiple clamping plate assemblies 56, which are arranged sequentially along the Y direction. The length of the clamping plate assemblies 56 can be set according to the length of a group of silicon wafers, or according to the length of the silicon rods before slicing. The length of the clamping plate assemblies 56 is slightly longer than the length of a group of silicon wafers, so that all silicon wafers can be clamped.

[0162] After the silicon wafer is placed in the tooling basket, the clamping plate assembly 56 is in the first position, clamping the silicon wafer 33. When the tooling basket is placed in the slicing station, the trigger plate 73 applies force, causing one clamping plate assembly 56 to rotate to the second position, releasing the silicon wafer 33. The clamping force on the silicon wafer disappears, and the silicon wafer, which has lost its clamping force, becomes free. Slicing medium is sprayed toward the side of the silicon wafer through a slicing nozzle on the side of the tooling basket, increasing the distance between the wafer and the adjacent wafers, achieving the slicing effect. The separated silicon wafers are then removed for subsequent production steps. The remaining clamping plate assemblies 56 continue to clamp the remaining silicon wafers 33.

[0163] The tooling frame can be a box-type structure or a hollowed-out skeleton-type structure. This embodiment provides a specific implementation method: the tooling frame 54 includes a base plate 541, a front plate 542, and a rear plate 543. The base plate 541 is a rectangular plate-like structure with its length oriented in the Y direction. The front plate 542 and the rear plate 543 are parallel and connected to the base plate 541 at both ends of its length, perpendicular to the length of the base plate 541. The side guard assembly 55 is connected between the front plate 542 and the rear plate 543.

[0164] In one specific implementation, the bottom ends of the rear frame plate 543 and the front frame plate 542 are connected to the bottom frame plate 541, with the top of the rear frame plate 543 being higher than the front frame plate 542. The top of the rear frame plate 543 can be higher than the silicon wafer 33, allowing the silicon wafer 33 to rest against the rear frame plate 543. The front frame plate 542 and the bottom frame plate 541 are detachably connected, facilitating assembly and disassembly, as well as conveniently inserting a silicon wafer.

[0165] This embodiment also provides a method for implementing a side guard assembly. Figure 29 for Figure 24 Magnified view of area C in the middle, Figure 30 for Figure 26 Cross-sectional view in the DD direction, Figure 31 for Figure 30 Magnified view of area E in the middle; Figure 32 is a schematic diagram of the baffle structure. Figures 24 to 32 As shown, the side guard assembly 55 includes a plywood guard bar 551, a first support bar 552, and a second support bar 553. The plywood guard bar 551, the first support bar 552, and the second support bar 553 are parallel and vertically connected between the front frame plate 542 and the rear frame plate 543. The plywood guard bar 551, the first support bar 552, and the second support bar 553 are distributed on three different vertical planes. The plywood guard bar 551 is higher than the first support bar 552, and the first support bar 552 is higher than the second support bar 553.

[0166] For example, the clamping plate bars 551, the first support bars 552, and the second support bars 553 on both sides of the tooling frame are symmetrically arranged. The distance between the two second support bars 553 is smaller than the distance between the two first support bars 552, and the distance between the two clamping plate bars 551 is smaller than the distance between the two first support bars 552.

[0167] Specifically, the front frame plate 542 and the rear frame plate 543 each have through-holes, referred to as frame plate through-holes 5421, for the clamping plate guard rod 551, the first support rod 552, and the second support rod 553 to pass through. These through-holes 5421 are oblong holes extending along the width of the base frame plate. The clamping plate guard rod 551, the first support rod 552, and the second support rod 553 can all be moved within the oblong holes, adjusting their positions to accommodate silicon wafers of varying sizes.

[0168] The ends of the splint retaining rod 551 , the first support rod 552 and the second support rod 553 pass through the frame plate through hole 5421 and are fixedly connected with nuts to fix the splint retaining rod 551 , the first support rod 552 and the second support rod 553 .

[0169] Furthermore, the clamping plate assembly 56 includes a baffle 561 and a torsion spring 562. The baffle 561 is rotatably connected to the first support rod 522 and is located outside the clamping plate baffle rod 551 and the second support rod 553. The middle portion of the torsion spring 562 is sleeved onto the first support rod 552, the bottom end of the torsion spring 562 is inserted into the connection hole defined in the second support rod 553, and the top end of the torsion spring 562 is secured to the outside of the baffle 561. In this embodiment, the inside is directed toward the receiving space; the outside and inside are opposite directions.

[0170] The torsion spring 562 can rotate relative to the first support rod 552 , but one end of the torsion spring 562 is restricted by the second support rod 553 , and the other end is restricted by the baffle 561 , so it cannot rotate to a large angle, and returns to its original shape by elastic force when the external force disappears.

[0171] The trigger plate 73 exerts an inward force on the bottom end of the baffle 561, causing the top of the baffle 561 to rotate outward, releasing the silicon chip 33. When the force exerted by the trigger plate disappears, the baffle 561 rotates in the opposite direction to restore its original shape.

[0172] A specific implementation method: The baffle 561 includes a middle portion 5611, a clamping portion 5612, and a triggering portion 5613. The clamping portion 5612 is located at the top of the middle portion 5611, and the triggering portion 5613 is located at the bottom of the middle portion 5611. The middle portion 5611 extends vertically and is provided with a collar 56111, which is sleeved on the first support rod 522. The clamping portion 5612 bends inward from the top of the middle portion 5611. The inner surface of the clamping portion 5612 is provided with a clamping gasket 563. The clamping gasket 563 is made of a soft material, such as rubber, silicone, felt, sponge, etc., which can protect the silicon wafer while applying clamping force to the silicon wafer and prevent damage to the silicon wafer.

[0173] The trigger portion 5613 bends outward from the bottom end of the middle portion and extends forward and inward toward the front frame plate 542 to cooperate with the trigger plate 73 .

[0174] The trigger portion 5613 comprises a connecting section, a supporting section, and a trigger section. The connecting section is connected to the bottom end of the intermediate portion 5611. The supporting section extends along the width of the base plate 541 (i.e., the X-direction), with one end connected to the connecting section and the other end connected to the trigger section. The trigger section extends along the length of the base plate (i.e., the Y-direction) to mate with the trigger plate.

[0175] Furthermore, a bottom support assembly 57 can be used, connected between the front frame 542 and the rear frame 543, at the bottom of the storage space. Two bottom support assemblies 57 are provided, spaced apart. Each bottom support assembly 57 comprises a stainless steel rod and a rubber sleeve. The stainless steel rod is vertically connected between the front frame 542 and the rear frame 543, while the rubber sleeve fits over the outside of the stainless steel rod. The stainless steel rod provides rigid support, while the rubber sleeve acts as a buffer to prevent damage to the silicon wafer. The rubber sleeve can also be replaced with a sponge sleeve or other soft materials.

[0176] Figure 33 Another tool basket provided in the embodiment of the present application is used in a top view of a slicing station. Figure 33 As shown, the slicing station is provided with a slicing workbench 71 , a slicing conveying mechanism 721 , a slicing nozzle 723 and a trigger plate 73 .

[0177] The slicing conveying mechanism 721 is disposed on the slicing workbench 71. The tooling basket 5 is disposed on the slicing conveying mechanism 721 and can move along the length direction of the tooling basket 5, i.e., along the Y direction in the figure, driven by the slicing conveying mechanism 721. The area where the tooling basket 5 moves is referred to as the travel area.

[0178] Trigger plates 73 are provided on both sides of the tooling basket travel area to apply force to the clamping plate assembly 56 in the tooling basket 5. Trigger plates 73 are provided on both the left and right sides of the tooling basket 5, and the trigger plates 73 on both sides are symmetrically arranged to release both sides of the silicon wafer simultaneously.

[0179] The slicing nozzles 723 are located on both sides of the tool basket travel area and are adjacent to the trigger plate 73. The outlet of the slicing nozzles 723 is directed toward the tool basket travel area. The slicing nozzles 723 can spray a slicing medium, which can be a gas or a liquid.

[0180] by Figure 32 For example, when the tooling basket 5 moves from left to right and reaches the position of the trigger plate 73, the trigger plate 73 applies force to the baffle 561, causing the baffle 561 to rotate and release the silicon wafer 33 at that position. The separating nozzle 723 sprays water between two adjacent silicon wafers to separate the adjacent silicon wafers, increasing the distance between them and making it easier to remove the silicon wafers from the tooling basket.

[0181] The tooling basket 5 continues to move to the right, and the baffles 561 from right to left are successively acted upon by the trigger plate 73, and rotate in sequence to release the silicon wafers. The silicon wafers that have lost their clamping force are separated from the adjacent silicon wafers after being sprayed with water, and then adhere to the belt conveyor mechanism 41 and transported to the insertion and washing device.

[0182] In the above solution, the baffle 561 cooperates with the trigger plate 73 so that only a small portion of the silicon wafer loses the clamping force and can be taken out, while the remaining silicon wafer remains in a clamped state and will not fall over.

[0183] The transport mechanism 721 may specifically include a transport screw, a transport slide, and a drive motor. The transport screw extends along the length of the tooling basket 5. The transport slide engages with the transport screw via threads, connecting the transport slide to the tooling basket. The drive motor rotates the transport screw, thereby driving the transport slide and tooling basket 5 in the Y direction.

Claims

1. A silicon wafer production system, characterized in that: include: Slicer, used to cut silicon rods into silicon wafers and place the silicon wafers and wafer tray components into the tooling basket; Transport trolley, used to transport tooling baskets to the degumming device; A degumming device is provided with a parking space for accommodating a transport trolley; the degumming device is used to degumming and slicing silicon wafers; Insertion and cleaning device, used to insert silicon wafers after slicing; The tooling basket comprises: A tool basket frame; a storage space for accommodating silicon wafers is formed in the tool basket frame, and an opening is provided at the top of the tool basket frame for silicon wafers to enter and exit the storage space; Side support assemblies for clamping the silicon wafer from both sides are arranged in the accommodation space and are respectively connected to both sides of the tooling basket frame; the side support assemblies extend along the length direction of the tooling basket frame; and magnetic elements are provided in the side support assemblies; The tooling basket frame includes: a frame front plate, a frame rear plate and a frame bottom plate; The frame front plate and the frame rear plate are arranged parallel to and opposite to each other, and the frame front plate and the frame rear plate are respectively vertically connected to the two ends of the frame bottom plate in the length direction; The side support assembly is connected between the frame front plate and the frame rear plate; the bottom support assembly is connected between the frame front plate and the frame rear plate; The side support assembly comprises: an elastic cord extending along the length of the work basket frame and connected between the front plate and the rear plate of the frame; A magnetic ring, serving as the magnetic attraction member, is sleeved on the elastic rope; a plurality of magnetic rings are arranged at intervals; The buffer sleeve is sleeved on the outside of the plurality of magnetic rings and is tightly fitted with the magnetic rings; The degumming device is provided with a slicing station; the slicing station is provided with: Sharding workbench; The conveying mechanism is arranged on the slicing workbench; the tooling basket is arranged on the conveying mechanism and can move along the length direction of the tooling basket under the drive of the conveying mechanism; Magnetic parts for generating magnetic attraction with the magnetic parts are arranged on both sides of the tooling basket travel area; Slicing nozzles for spraying slicing media are arranged on both sides of the tooling basket travel area and are adjacent to the magnetic member; the outlet direction of the slicing nozzle is toward the tooling basket travel area.

2. The silicon wafer production system according to claim 1, wherein: The tooling basket further comprises: a threaded sleeve; The frame front plate is provided with a front plate through hole; one end of the threaded sleeve is connected to the elastic rope, and the other end is passed through the front plate through hole; a threaded hole is provided in the threaded sleeve to match the threaded fastener.

3. The silicon wafer production system according to claim 2, wherein: The threaded hole of the threaded sleeve is perpendicular to the center line of the threaded sleeve; The side surface of the frame front plate is provided with a front plate connecting hole whose center line is perpendicular to the front plate through hole for the threaded fastener to pass through; the threaded fastener passes through the front plate connecting hole and is screwed into the threaded hole of the threaded sleeve for fixation; The through hole of the front plate is an oblong hole and extends along the width direction of the tooling basket frame.

4. The silicon wafer production system according to claim 1, wherein: The tooling basket also includes: A bottom support assembly for supporting the silicon wafer from the bottom is arranged in the accommodating space; the bottom support assembly extends along the length direction of the tooling basket frame and is connected to the bottom of the tooling basket frame.

5. The silicon wafer production system according to claim 4, characterized in that: The bottom support assembly comprises: A stainless steel rod is vertically connected between the front plate and the rear plate of the frame; The rubber sleeve is sleeved on the outer side of the stainless steel rod.

6. The silicon wafer production system according to claim 1, wherein: The degumming device comprises: Silicon wafer production line; the silicon wafer production line is provided with a degumming station and a gluing station; the degumming station is used to degumming the silicon wafers and the wafer tray assembly contained in the tooling basket to separate the silicon wafers from the wafer tray assembly; the gluing station is used to wipe the adhesive surface of the degummed silicon wafer to remove residual adhesive on the adhesive surface of the silicon wafer; the slicing station is located at the rear end of the gluing station; The conveying robot mechanism is used to grab the tooling basket and drive the tooling basket to move to the degumming station and the gluing station in sequence.

7. The silicon wafer production system according to claim 6, characterized in that: The degumming device also includes: The wafer tray recovery line is arranged side by side with the silicon wafer production line; a thick wafer removal station is provided next to the wafer tray recovery line; the thick wafer removal station is used to remove the thick wafers adhered to the wafer tray assembly; The conveying robot mechanism is also used to grab the wafer tray assembly with thick slices attached after degumming at the gluing station and drive the wafer tray assembly to move to the thick slice removal station, and place the wafer tray assembly into the wafer tray recovery line after the thick slices are removed.

8. The silicon wafer production system according to claim 7, characterized in that: The degumming device also includes: The tool basket recovery line is arranged side by side with the silicon wafer operation line and the wafer tray recovery line; the conveying robot mechanism is also used to transport the tool basket above the silicon wafer operation line to the tool basket recovery line.

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