Capacitor components
The capacitor assembly addresses the issue of bulkiness and resonances in parallel capacitors by using a single conductive structure with varying gap distances, achieving compactness and low resistance/inductance for efficient broadband noise filtering.
Patent Information
- Application Number
- CN202180018824.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2020-03-04
- Filing Date
- 2021-02-09
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2041-02-09
AI Technical Summary
Using multiple capacitors in parallel results in bulky circuits with unwanted resonances due to high equivalent series resistance and inductance, which is undesirable for applications requiring a wide frequency range.
A capacitor assembly design featuring a conductive structure with varying gap distances between interleaved conductive plates, allowing for multiple capacitors with different capacitance values to be formed using the same conductive structure, reducing bulkiness and equivalent series resistance and inductance.
The design provides a compact capacitor assembly with low equivalent series resistance and inductance, enabling broadband noise filtering across a wide frequency range without the need for multiple discrete capacitors.
Smart Images
Figure CN115244637B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of electrical and electronic technology. More specifically, the present invention relates to a capacitor assembly. Background Art
[0002] Capacitors are currently used in circuits, for example to filter noise on signal and power lines. Many other applications are of course possible, including decoupling an integrated circuit (sink) from its power supply (source). In this case, the capacitor acts as a local charge source, making (temporary) decoupling from the main power supply (source) possible. In such applications, large capacitance is needed to hold more charge.
[0003] However, in some applications it is desirable to use multiple capacitors (typically arranged in parallel), for example when trying to form a filter with a wide frequency range (eg to filter out noise within the wide frequency range).
[0004] However, using multiple capacitors usually results in a bulky circuit and creates unwanted resonances due to high equivalent series resistance and inductance. Summary of the invention
[0005] In this context, the present invention provides a capacitor assembly comprising:
[0006] A set of terminals, including at least a first terminal, a second terminal and a third terminal;
[0007] A conductive structure including a first conductive plate and a second conductive plate, the first conductive plate and the second conductive plate being electrically connected to the first terminal;
[0008] a third conductive plate electrically connected to the second terminal and facing the first conductive plate at a first distance, thereby forming a first gap filled with a first dielectric material; and
[0009] a fourth conductive plate electrically connected to the third terminal and facing the second conductive plate at a second distance, thereby forming a second gap filled with a second dielectric material,
[0010] Wherein the first distance is different from the second distance.
[0011] Thus, a capacitor having a first capacitance value is obtained between the first terminal and the second terminal, and another capacitor having a second capacitance value different from the first capacitance value is obtained between the first terminal and the third terminal.
[0012] In addition, since the same conductive structure (referred to as the "main conductive structure" in the following description) is used to form the two capacitors, the capacitor assembly is compact and provides low equivalent series resistance and inductance. Since this conductive structure forms the main plate of each capacitor of the capacitor assembly, it results in a very low equivalent series inductance value when installed, resulting in broadband characteristics.
[0013] According to possible optional features:
[0014] The conductive structure is a first conductive structure, the first conductive structure includes a first plurality of parallel conductive plates, the first plurality of parallel conductive plates including the first conductive plate;
[0015] The capacitor assembly includes a second conductive structure forming a second plurality of parallel conductive plates including a third conductive plate;
[0016] The first plurality of parallel conductive plates are interleaved with the second plurality of parallel conductive plates to define a first plurality of gaps, each gap having a thickness equal to the first distance;
[0017] The capacitor assembly includes a third conductive structure forming a third plurality of parallel conductive plates including a fourth conductive plate;
[0018] a first conductive structure comprising a fourth plurality of parallel conductive plates including said second conductive plate;
[0019] the fourth plurality of parallel conductive plates being interleaved with the third plurality of parallel conductive plates to define a second plurality of gaps, each of the second plurality of gaps having a thickness equal to the second distance;
[0020] The set of terminals includes a fourth terminal;
[0021] The conductive structure includes a fifth conductive plate electrically connected to the first terminal;
[0022] The sixth conductive plate is electrically connected to the fourth terminal and faces the fifth conductive plate at a third distance, thereby forming a gap;
[0023] The third distance is different from the first distance and different from the second distance;
[0024] The first conductive plate and / or the second conductive plate (and / or the fifth conductive plate) are conductively connected to a first terminal in the capacitor assembly;
[0025] a third conductive plate conductively connected to a second terminal within the capacitor assembly;
[0026] a fourth conductive plate conductively connected to a third terminal within the capacitor assembly;
[0027] a fifth conductive plate conductively connected to a fourth terminal within the capacitor assembly;
[0028] The first dielectric material is the same as the second dielectric material;
[0029] A resistance element is placed between the third conductive plate and the second terminal.
[0030] By reading the preferred embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the embodiments of the present invention will be better understood. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] Figure 1 shows a capacitor assembly according to a possible embodiment of the present invention;
[0032] Figure 2 yes Figure 1 An exploded view of the capacitor assembly;
[0033] Figure 3 Yes means Figure 1 A circuit diagram of a capacitor assembly;
[0034] Figure 4 It is shown Figure 1 A schematic diagram of possible uses of a capacitor assembly;
[0035] Figure 5 shows a main conductive structure of a capacitor assembly according to another possible embodiment of the present invention;
[0036] Figure 6 showing the secondary conductive structure of the capacitor assembly; and
[0037] Figure 7 is another circuit diagram showing another embodiment of a capacitor assembly according to the present invention. DETAILED DESCRIPTION
[0038] Now refer to Figure 1 and 2 Exemplary embodiments of capacitor assemblies according to the present invention are described.
[0039] In this specification, "conductive" should be understood as "electrically conductive".
[0040] like Figure 2 As can be clearly seen in FIG. 8 , the capacitor assembly comprises a primary conductive structure 2 and a plurality (here four) of secondary conductive structures 20 , 40 , 60 , 80 .
[0041] Each conductive structure 2, 20, 40, 60, 80 is made of one or more conductive materials, as further described below.
[0042] The main conductive structure 2 comprises a wall 4 (made of conductive material) from which a plurality of groups 12 , 14 , 16 , 18 of parallel conductive plates 13 , 15 , 17 , 19 extend.
[0043] More precisely, each such group 12, 14, 16, 18 comprises a plurality of parallel conductive plates 13, 15, 17, 19 extending parallel to each other and perpendicular to the wall 4. Figure 2 As shown, each conductive plate 13, 15, 17, 19 of these groups 12, 14, 16, 18 is fixed to the wall 4 along the edge of the associated conductive plate 13, 15, 17, 19. In this embodiment, each conductive plate 13, 15, 17, 19 of the main conductive structure 2 is therefore in electrical contact with (i.e. electrically connected to) the wall 4.
[0044] In the present case, some conductive plates 13, 19 (here conductive plates 13, 19 of groups 12, 18) extend from a first side of the wall 4, whereas other conductive plates 15, 17 (here conductive plates 15, 17 of groups 14, 16) extend from a second side of the wall 4 (opposite to the first side of the wall 4).
[0045] According to a possible embodiment, the main conductive structure 2 is made entirely of copper. According to another possible embodiment, the wall 4 is made of copper and the conductive plates 13, 15, 17, 19 of the main conductive structure 2 are made of nickel.
[0046] Adjacent (parallel) conductive plates 13, 15, 17, 19 within a given group 12, 14, 16, 18 are separated by the same distance, but this distance varies from one group to another, as explained further below.
[0047] The main conductive structure 2 is electrically connected to the terminal 6. For example, an edge portion 8 of the wall 4, here protruding from two sets of parallel conductive plates, is electrically connected to the terminal 6.
[0048] The conductive plates 13, 15, 17, 19 of the different groups 12, 14, 16, 18 are thus electrically connected to the terminal 6. In other words, the conductive plates 13, 15, 17, 19 of the different groups 12, 14, 16, 18 are thus electrically connected to the terminal 6 (within the capacitor assembly).
[0049] Each secondary conductive structure 20 , 40 , 60 , 80 includes a wall 24 , 44 , 64 , 84 (made of a conductive material) and a set of parallel conductive plates 22 , 42 , 62 , 82 extending from the wall 24 , 44 , 64 , 84 .
[0050] More precisely, each such group comprises a plurality of conductive plates 22, 42, 62, 82 that are parallel to each other and perpendicular to the walls 24, 44, 64, 84. The conductive plates 22, 42, 62, 82 of a secondary conductive structure 20, 40, 60, 80 are fixed to the walls 24, 44, 64, 84 of the secondary conductive structure 20, 40, 60 and are therefore electrically connected to the walls 24, 44, 64, 84.
[0051] In the secondary conductive structure 20, 40, 60, 80, the walls 24, 44, 64, 84 and the conductive plates 22, 42, 62, 82 may be made of the same conductive material, for example copper. However, according to possible embodiments, several conductive materials may be used. For example, the walls 24, 44, 64, 84 may be made of copper, while the conductive plates 22, 42, 62, 82 may be made of nickel.
[0052] In each secondary conductive structure 20, 40, 60, 80, adjacent (parallel) conductive plates 22, 42, 62, 82 are separated by the same distance, which is therefore a feature of the relevant secondary conductive structure 20, 40, 60, 80. However, the distance between the conductive plates 22, 42, 62, 82 varies from one secondary conductive structure to another, as further explained below.
[0053] Each secondary conductive structure 20 , 40 , 60 , 80 is electrically connected to a corresponding terminal 26 , 46 , 66 , 86 .
[0054] exist Figure 2 In the illustrated embodiment, the terminals 26 , 46 , 66 , 86 are formed by respective conductive blocks (shown in phantom) that are in direct or indirect electrical contact with the walls 24 , 44 , 64 , 84 of the associated secondary conductive structure 20 , 40 , 60 , 80 .
[0055] Such conductive blocks 26 , 46 , 66 , 86 are made of a conductive material, such as copper.
[0056] According to a possible implementation (such as Figure 2 The terminals (or conductive blocks) 46, 66, 86 shown in the figure may be in physical contact with the corresponding walls 44, 64, 84 and thereby achieve a (direct) electrical connection between the associated secondary conductive structures 40, 60, 80 and the corresponding terminals 46, 66, 86 (and thereby achieve an electrical connection between the conductive plates 42, 62, 82 of each secondary conductive structure 40, 60, 80 and the corresponding terminals 46, 66).
[0057] According to another possible implementation (such as Figure 2A resistor element 28 (e.g., a resistor block, such as a resistor block made of carbon powder) is placed between the secondary conductive structure 20 and the corresponding terminal 26. Figure 2 In the illustrated embodiment, the resistive element 28 is arranged to be in physical contact with the wall 24 of the secondary conductive structure 20 (on one side of the resistive element 28 ) and the terminal 26 (on the other side of the resistive element 28 ).
[0058] In this case, the secondary conductive structure 20 , and therefore the conductive plate 22 comprised therein, is electrically connected to the terminal 26 via the resistive element 28 .
[0059] Thus, the conductive plates 22, 42, 62, 82 in each secondary conductive structure 20, 40, 60, 80 are conductively connected (within the capacitor assembly) to corresponding terminals 26, 46, 66, 86 within the capacitor assembly.
[0060] The conductive plates 13, 15, 17, 19 of each group 12, 14, 16, 18 of primary conductive structures 2 interact with a specific secondary conductive structure 20, 40, 60, 80, as will now be explained.
[0061] like Figure 1 As shown, for the secondary conductive structures 60, 80, the conductive plates 22, 42, 62, 82 of a given secondary conductive structure 20, 40, 60, 80 are interleaved with the conductive plates of the corresponding group 12, 14, 16, 18 of the primary conductive structure 2 (the conductive plates 22, 42, 62, 82 of the associated secondary conductive structures 20, 40, 60, 80 are parallel to the conductive plates of the corresponding group 12, 14, 16, 18 of the primary conductive structures).
[0062] Thus, each conductive plate 22, 42, 62, 82 of the secondary conductive structure 20, 40, 60, 80 faces the conductive plates 13, 15, 17, 19 of the corresponding group 12, 14, 16, 18 of the primary conductive structure 2, thereby defining a gap therebetween, which gap is filled with a dielectric material.
[0063] Although other solutions can be considered, the conductive plates 22, 42, 62, 82 of the secondary conductive structures 20, 40, 60, 80 are in fact typically located midway between two conductive plates 13, 15, 17, 19 of the corresponding group 12, 14, 16, 18 of the main conductive structure 2 (except for the conductive plates 42, 62, 82 that may be located at the end of the relevant series of conductive plates).
[0064] Accordingly, the conductive plates 13, 15, 17, 19 in the groups 12, 14, 16, 18 of the primary conductive structures 2 are in fact typically located midway between two conductive plates 22, 42, 62, 82 of the corresponding secondary conductive structures 20, 40, 60, 80 (possibly with the exception of conductive plates 13, 15, 17, 19 located at the ends of the relevant series of conductive plates).
[0065] Due to the above-mentioned construction, the conductive plates 13, 15, 17, 19 of the groups 12, 14, 16, 18 of the primary conductive structures 20, 40, 60, 80 and the conductive plates 22, 42, 62, 82 of the secondary conductive structures 20, 40, 60, 80 form a gap (filled with dielectric material), the thickness of which varies depending on the relevant groups 12, 14, 16, 18 and secondary conductive structures 20, 40, 60, 80.
[0066] exist Figure 1 and 2 In the example, the conductive plate 22 of the secondary conductive structure 20 faces the conductive plate 13 in the first group 12 (or multiple) conductive plates of the main conductive structure 2 at a first distance (i.e., the conductive plate 22 and the conductive plate 13 are parallel to and staggered with each other, and adjacent conductive plates 13, 22 are separated by the first distance).
[0067] The gap formed between the conductive plate 22 and the conductive plate 13 thus has a thickness equal to the first distance and is filled with the first dielectric material.
[0068] The conductive plates 42 of the secondary conductive structure 40 face the conductive plates 15 in the second group 14 (or multiple) of conductive plates of the primary conductive structure 2 at a second distance (i.e., the conductive plates 42 and the conductive plates 15 are parallel to each other and staggered, and adjacent conductive plates 15 and 42 are separated by a second distance).
[0069] The gap formed between the conductive plate 42 and the conductive plate 15 thus has a thickness equal to the second distance and is filled with the second dielectric material.
[0070] The conductive plates 62 of the secondary conductive structure 60 face the conductive plates 17 of the third group 16 (or multiple) of conductive plates of the primary conductive structure 2 at a third distance (i.e., the conductive plates 62 and 17 are parallel to and staggered with each other, and adjacent conductive plates 17 and 62 are separated by a third distance).
[0071] The gap formed between the conductive plate 62 and the conductive plate 17 thus has a thickness equal to the third distance and is filled with the third dielectric material.
[0072] The conductive plate 82 of the secondary conductive structure 80 faces the conductive plate 19 of the fourth group 18 (or multiple) conductive plates of the primary conductive structure 2 at a fourth distance (i.e., the conductive plate 82 and the conductive plate 19 are parallel to each other and staggered, and adjacent conductive plates 19 and 82 are separated by a fourth distance).
[0073] The gap formed between the conductive plate 82 and the conductive plate 19 thus has a thickness equal to the fourth distance and is filled with the fourth dielectric material.
[0074] In this example, the same dielectric material is used to fill all gaps formed between the primary conductive structure 2 and each secondary conductive structure 20, 40, 60, 80. However, in other embodiments, different dielectric materials may be used for the gaps formed by each secondary conductive structure 20, 40, 60, 80, respectively.
[0075] The interaction between each secondary conductive structure 20, 40, 60, 80 and the conductive plates 13, 15, 17, 19 of the respective set 12, 14, 16, 18, 20 of the primary conductive structure 2 creates a capacitor having a capacitance value C1, C2, C3, C4.
[0076] In order to obtain several capacitance values C1 , C2 , C3 , C4 of the capacitor assembly, the gap thickness is varied depending on the associated secondary conductive structure-group pair.
[0077] Therefore, in Figure 1 and 2 In the example, the first distance, the second distance, the third distance and the fourth distance are not the same.
[0078] For example, at least the first distance is different from the second distance (the difference between the first distance and the second distance is, for example, greater than 10% of the first distance). Here, the third distance is also different from the first distance, and different from the second distance (the difference between the third distance and the first distance, and / or the difference between the third distance and the second distance is, for example, greater than 10% of the third distance).
[0079] Specifically, in this embodiment, the first distance, the second distance, the third distance and the fourth distance are different from each other (the difference between any two of the first, second, third and fourth distances is, for example, greater than 10% of the minimum distance of the first, second, third and fourth distances).
[0080] In other words, the thickness of a gap formed by the interaction of a secondary conductive structure with the primary conductive structure is different from the thickness of a gap formed by the interaction of another secondary conductive structure with the primary conductive structure.
[0081] Therefore, if Figure 3 As shown in the circuit diagram, the capacitor assembly provides a plurality of capacitors with different capacitance values, such as C1, C2, C3, C4 ( Figure 3 2 shows a case where the resistor element 28 is not used).
[0082] Specifically, a first capacitance value C1 is obtained between terminal 6 and terminal 26 , a second capacitance value C2 is obtained between terminal 6 and terminal 46 , a third capacitance value C3 is obtained between terminal 6 and terminal 66 , and a fourth capacitance value C4 is obtained between terminal 6 and terminal 26 .
[0083] Since the first distance is different from the second distance, the first capacitance value C1 is different from the second capacitance value C2.
[0084] In addition, in this embodiment, since the first distance, the second distance, the third distance and the fourth distance are different from each other, the first capacitance value C1, the second capacitance value C2, the third capacitance value C3 and the fourth capacitance value C4 are also different from each other.
[0085] Furthermore, as mentioned above, the capacitance values may also be different from each other due to the use of different dielectric materials.
[0086] like Figure 3 As shown, a further terminal 7 may be provided which is electrically connected to the main conductive structure 2 (eg connected to the opposite end of the wall 4 compared to the connection point of the terminal 6 to the wall 4).
[0087] Figure 4 Possible applications of the above described capacitor assembly are shown.
[0088] In this application, the capacitor assembly is used to suppress noise by filtering the voltage signal V carried by the conductor between the first electronic circuit E1 and the second electronic circuit E2.
[0089] In this object, terminal 6 of the capacitor assembly is connected to a pin of the first electronic circuit E1 and terminal 7 of the capacitor assembly is connected to a pin of the second electronic circuit E2.
[0090] In this application, all terminals 26, 46, 66, 86 (electrically connected to the secondary conductive structures 20, 40, 60, 80 within the capacitor assembly) are connected to ground potential (to which the first electronic circuit E1 and the second electronic circuit E2 are also connected).
[0091] This structure makes it possible to filter out noise in a wide frequency range obtained by cascading a plurality of frequency ranges corresponding to the respective capacitance values C1, C2, C3, C4. Therefore, a capacitor assembly can be used instead of a plurality of capacitors.
[0092] Therefore, this structure is particularly compact and can also reduce the equivalent series resistance (ESR) and equivalent series inductance (ESL).
[0093] The present invention is not limited to the above-described embodiments. In particular, the capacitor assembly may use only 2 or 3 secondary conductive structures (and corresponding conductive plate groups in the primary conductive structure), or more than 4 secondary conductive structures (and corresponding conductive plate groups in the primary conductive structure).
[0094] Similarly, the secondary conductive structures may be arranged in different ways (eg, relative to the primary conductive structures). In a possible embodiment, the various secondary conductive structures may be arranged in a circular manner around the center of the primary conductive structure, such as Figure 5 and 6 Star arrangement shown.
[0095] To be precise, in Figure 5 and 6 In the illustrated embodiment, the main conductive structure 102 includes a plurality of groups 110 , 112 , 114 , 116 , 118 (here triangular) of conductive plates, which are arranged around a central connecting portion 104 .
[0096] Here, the central connecting portion 104 is in physical contact with (and therefore conductively connected to) each of the sets of conductive plates 110, 112, 114, 116, 118. The central connecting portion 104 is also connected to a first terminal 106 of the capacitor assembly.
[0097] like Figure 6 As shown, respective secondary conductive structures 100 , 120 , 140 , 160 , 180 are provided, each conductive structure 100 , 120 , 140 , 160 , 180 being connected to a terminal 105 , 126 , 146 , 166 , 186 .
[0098] Each secondary conductive structure 100 , 120 , 140 , 160 , 180 comprises a plurality of conductive plates (here having a trapezoidal shape in order to cooperate with the triangular conductive plates of the primary conductive structure 102 ).
[0099] As in Figure 1 and 2 In the embodiment of FIG. 1 , the conductive plates of a given secondary conductive structure 100 , 120 , 140 , 160 , 180 are interleaved with the conductive plates of the corresponding set 110 , 112 , 114 , 116 , 118 of the primary conductive structure 102 .
[0100] The distance between the conductive plates is variable from one set of primary conductive structures to another, and in a similar manner, from one secondary conductive structure to another.
[0101] Thus, for each secondary conductive structure-group pair, a different gap thickness (and thus a different capacitance) is obtained.
[0102] In another possible embodiment, a resistor element (eg Figure 2 The resistor element 28 (visible in FIG. 2 ) is placed between each terminal and each corresponding secondary conductive structure. This makes it possible to obtain a device having a Figure 7 Schematic diagram of the conductive components of the characteristics shown, wherein resistors R1, R2, R3, R4 (corresponding to one of these resistive elements) are associated in series with each capacitor C1, C2, C3, C4.
Claims
1. A capacitor assembly, comprising: A set of terminals, including at least a first terminal, a second terminal and a third terminal; A conductive structure comprising a first conductive plate (13) and a second conductive plate (15), wherein the first conductive plate (13) and the second conductive plate (15) are electrically connected to the first terminal; a third conductive plate electrically connected to the second terminal (26) and facing the first conductive plate (13) at a first distance, thereby forming a first gap filled with a first dielectric material; and a fourth conductive plate electrically connected to the third terminal (46) and facing the second conductive plate (15) at a second distance, thereby forming a second gap filled with a second dielectric material, Wherein, the first distance is different from the second distance.
2. The capacitor assembly according to claim 1, wherein: The conductive structure is a first conductive structure comprising a first plurality of parallel conductive plates including the first conductive plate (13).
3. The capacitor assembly of claim 2, comprising a second conductive structure, wherein the second conductive structure forms a second plurality of parallel conductive plates including the third conductive plate (22), wherein the first plurality of parallel conductive plates are interleaved with the second plurality of parallel conductive plates to define a first plurality of gaps, each of the first plurality of gaps having a thickness equal to the first distance.
4. The capacitor assembly of claim 3, comprising a third conductive structure forming a third plurality of parallel conductive plates including the fourth conductive plate (42), wherein: The first conductive structure comprises a fourth plurality of parallel conductive plates including the second conductive plate (15), and wherein the fourth plurality of parallel conductive plates are interlaced with the third plurality of parallel conductive plates to define a second plurality of gaps, each of the second plurality of gaps having a thickness equal to the second distance.
5. The capacitor assembly according to any one of claims 1 to 4, wherein: The set of terminals includes a fourth terminal, wherein the conductive structure includes a fifth conductive plate (17) electrically connected to the first terminal, and wherein a sixth conductive plate (62) is electrically connected to the fourth terminal and faces the fifth conductive plate (17) at a third distance, thereby forming a gap, and wherein the third distance is different from the first distance and different from the second distance.
6. The capacitor assembly according to any one of claims 1 to 4, wherein: The first dielectric material is the same as the second dielectric material.
7. The capacitor assembly according to any one of claims 1 to 4, wherein a resistive element (28) is interposed between the third conductive plate (22) and the second terminal (26).