Method and device for detecting performance of high-temperature heat pipe, electronic equipment and storage medium

Abstract

The application provides a high-temperature heat pipe performance detection method and device, electronic equipment and storage medium, and mainly comprises the following technical solutions: a first heating mode is used to heat a high-temperature heat pipe to be detected, so that the high-temperature heat pipe reaches a full load state; when the high-temperature heat pipe reaches the full load state, the flow rate of a cooling medium required for cooling the high-temperature heat pipe, the outlet temperature of the cooling medium and the inlet temperature of the cooling medium are detected; the output power of the high-temperature heat pipe is calculated according to the flow rate of the cooling medium, the outlet temperature of the cooling medium and the inlet temperature of the cooling medium; the heat flux density of the high-temperature heat pipe when working at full load is calculated according to the cross-sectional area of the high-temperature heat pipe and the output power; and the performance of the high-temperature heat pipe is judged according to the heat flux density. Compared with the related art in which the power of a heater is directly used as the output power of the high-temperature heat pipe, the heat flux density under the full load state is calculated, the accurate measurement of the output power of the high-temperature heat pipe is realized, and the accuracy of the performance detection of the high-temperature heat pipe is improved.

Description

Technical Field

[0001] This application relates to the field of heat pipe testing technology, and in particular to a method, apparatus, electronic device and storage medium for testing the performance of high-temperature heat pipes. Background Technology

[0002] High-temperature heat pipes are components with high heat transfer performance. They transfer heat through the continuous evaporation and condensation of liquid metal in a fully enclosed vacuum system. They have high heat transfer capacity and excellent isothermal properties, and have great application potential in aerospace, aviation, petrochemical, building materials, metallurgy and power industries.

[0003] The performance of a high-temperature heat pipe mainly includes its heat flux density when operating at full load, which is calculated from the output power of the heat pipe. Currently, the output power of a high-temperature heat pipe is generally determined by measuring the power of the heater and using it as the output power of the heat pipe. However, in practical applications, uncontrollable factors such as heat leakage may occur during the heat transfer process, causing the heater power to differ from the output power of the heat pipe, resulting in errors in the performance test results. Summary of the Invention

[0004] In view of this, this application provides a method, apparatus, electronic device and storage medium for testing the performance of high-temperature heat pipes, so as to achieve accurate measurement of the output power of high-temperature heat pipes and thereby improve the accuracy of performance testing of high-temperature heat pipes.

[0005] Firstly, this application provides a method for testing the performance of a high-temperature heat pipe, comprising:

[0006] The high-temperature heat pipe to be tested is heated using a first heating method to bring the high-temperature heat pipe to full load.

[0007] When the high-temperature heat pipe reaches the full load state, the flow rate of the cooling medium required to cool the high-temperature heat pipe, the outlet temperature of the cooling medium, and the inlet temperature of the cooling medium are detected.

[0008] The output power of the heat pipe is calculated based on the flow rate, outlet temperature, and inlet temperature of the cooling medium.

[0009] Calculate the heat flux density of the high-temperature heat pipe when it is operating at full load based on the cross-sectional area of ​​the high-temperature heat pipe and the output power.

[0010] The performance of the high-temperature heat pipe is determined based on the heat flux density.

[0011] Furthermore, the method also includes:

[0012] Based on the output power, set the initial heating power and power increase step size for the second heating method;

[0013] The high-temperature heat pipe is heated and controlled according to the initial heating power and the power increase step size until it reaches full load.

[0014] Record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe, and determine the first peak temperature of the outer wall surface;

[0015] Based on the first peak temperature and the preset first normal operating range of the high-temperature heat pipe, the wall temperature characteristics of the high-temperature heat pipe during low-power startup are determined.

[0016] Furthermore, the method also includes:

[0017] After the high-temperature heat pipe reaches the full load state, the heating power is adjusted to the stable working state of the high-temperature heat pipe. The stable working state of the high-temperature heat pipe is the working state that meets the preset performance test standard, where the working temperature of the high-temperature heat pipe changes by less than 1°C within a preset time period.

[0018] Set the heating power corresponding to the stable operating state as the starting power of the power reduction process;

[0019] Based on the initial power, the power reduction step size used in the second heating method is set;

[0020] The heating of the high-temperature heat pipe is controlled according to the starting power and the power reduction step size;

[0021] Record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe, and determine the second peak temperature of the outer wall surface;

[0022] Based on the second peak temperature and the preset second normal operating range of the high-temperature heat pipe, the wall temperature characteristics of the high-temperature heat pipe under power reduction conditions are determined.

[0023] Furthermore, the first heating method and the second heating method are any one of electromagnetic induction coil heating, heating wire heating, resistance heating, induction heating, electric arc heating, electron beam heating, infrared heating, and dielectric heating.

[0024] Furthermore, the output power of the high-temperature heat pipe is calculated based on the flow rate, outlet temperature, and inlet temperature of the cooling medium using the following formula:

[0025] P0=ρQC p (t out -t in )

[0026] Where P0 is the output power of the high-temperature heat pipe, ρ is the density of air, Q is the volumetric flow rate of air, and C... p t is the specific heat capacity of air at constant pressure. out t represents the outlet temperature of the cooling medium. in This is the inlet temperature of the cooling medium.

[0027] Furthermore, the heat flux density of the high-temperature heat pipe under full load operation is calculated based on the cross-sectional area of ​​the high-temperature heat pipe and the output power using the following formula:

[0028]

[0029] Where q is the heat flux density, P0 is the output power of the high-temperature heat pipe, and r is the radius of the high-temperature heat pipe.

[0030] Secondly, this application provides a device for testing the performance of a high-temperature heat pipe, comprising:

[0031] A heating unit is used to heat the high-temperature heat pipe to be tested using a first heating method, so that the high-temperature heat pipe reaches full load.

[0032] The detection unit is used to detect the flow rate of the cooling medium required to cool the high-temperature heat pipe, the outlet temperature of the cooling medium, and the inlet temperature of the cooling medium when the high-temperature heat pipe reaches the full load state.

[0033] The first calculation unit is used to calculate the output power of the high-temperature heat pipe based on the flow rate of the cooling medium, the outlet temperature of the cooling medium, and the inlet temperature of the cooling medium.

[0034] The second calculation unit is used to calculate the heat flux density of the high-temperature heat pipe when it is working at full load, based on the cross-sectional area of ​​the high-temperature heat pipe and the output power.

[0035] The first judgment unit is used to judge the performance of the high-temperature heat pipe based on the heat flux density.

[0036] Furthermore, the device also includes:

[0037] The first setting unit is used to set the initial heating power and power increase step size of the second heating method according to the output power.

[0038] The first control unit is used to control the heating of the high-temperature heat pipe according to the initial heating power and the power increase step size until the full load is reached.

[0039] The first determining unit is used to record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe and to determine the first peak temperature of the outer wall surface.

[0040] The second judgment unit is used to judge the wall temperature characteristics of the high-temperature heat pipe during low-power startup based on the first peak temperature and the first normal operating range of the preset high-temperature heat pipe.

[0041] Furthermore, the device also includes:

[0042] The adjustment unit is used to adjust the heating power to a stable working state of the high-temperature heat pipe after the high-temperature heat pipe reaches the full load state. The stable working state of the high-temperature heat pipe is the working state that meets the preset performance test standard, where the working temperature of the high-temperature heat pipe changes by less than 1°C within a preset time period.

[0043] The second setting unit is used to set the heating power corresponding to the stable working state as the starting power of the power reduction process;

[0044] The third setting unit is used to set the power reduction step size adopted by the second heating method according to the starting power;

[0045] The second control unit is used to control the heating of the high-temperature heat pipe according to the starting power and the power reduction step size;

[0046] The second determining unit is used to record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe and to determine the second peak temperature of the outer wall surface.

[0047] The third judgment unit is used to judge the wall temperature characteristics of the high-temperature heat pipe under power reduction conditions based on the second peak temperature and the second normal operating range of the preset high-temperature heat pipe.

[0048] Thirdly, this application provides an electronic device, comprising:

[0049] At least one processor; and a memory communicatively connected to said at least one processor; wherein,

[0050] The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method described in the first aspect above.

[0051] Fourthly, this application provides a non-transitory computer-readable storage medium storing computer instructions, characterized in that the computer instructions are used to cause the computer to perform the method described in accordance with the first aspect above.

[0052] Fifthly, this application provides a computer program product, characterized in that it includes a computer program, which, when executed by a processor, implements the method described in the first aspect above.

[0053] Compared with the prior art, this application has the following advantages:

[0054] This application provides a method, apparatus, electronic device, and storage medium for testing the performance of a high-temperature heat pipe. The method involves heating the high-temperature heat pipe under test using a first heating method to bring it to full load. When the high-temperature heat pipe reaches full load, the flow rate, outlet temperature, and inlet temperature of the cooling medium required to cool the heat pipe are measured. The output power of the high-temperature heat pipe is calculated based on these parameters. The heat flux density of the high-temperature heat pipe under full load operation is calculated based on its cross-sectional area and the output power. The performance of the high-temperature heat pipe is then determined based on the heat flux density. Compared to related technologies that directly use the heater power as the output power of the high-temperature heat pipe, this method achieves accurate measurement of the high-temperature heat pipe's output power by calculating the heat flux density under full load, thereby improving the accuracy of high-temperature heat pipe performance testing.

[0055] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this application, nor is it intended to limit the scope of this application. Other features of this application will become readily apparent from the following description. Attached Figure Description

[0056] Figure 1 A schematic flowchart illustrating a method for testing the performance of a high-temperature heat pipe, provided in an embodiment of this application;

[0057] Figure 1a A schematic diagram of a high-temperature heat pipe performance testing device provided in an embodiment of this application;

[0058] Figure 1b A schematic diagram of an electromagnetic induction coil heating device provided in this application embodiment;

[0059] Figure 1c A schematic diagram of a single-tube heat exchanger provided in an embodiment of this application;

[0060] Figure 2 A schematic flowchart of another method for testing the performance of a high-temperature heat pipe provided in an embodiment of this application;

[0061] Figure 2a A schematic diagram of another high-temperature heat pipe performance testing device provided in an embodiment of this application;

[0062] Figure 3 A schematic flowchart of another method for testing the performance of a high-temperature heat pipe provided in an embodiment of this application;

[0063] Figure 4 A schematic diagram of a high-temperature heat pipe performance testing device provided in an embodiment of this application;

[0064] Figure 5 A schematic diagram of another high-temperature heat pipe performance testing device provided in an embodiment of this application;

[0065] Figure 6 This is a schematic diagram illustrating an example of an electronic device provided in an embodiment of this application. Detailed Implementation

[0066] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings and specific implementation details. The described embodiments are merely some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0067] This application provides a method for testing the performance of a high-temperature heat pipe. By heating the high-temperature heat pipe to its full load state, the method measures the flow rate, outlet temperature, and inlet temperature of the cooling medium required to cool the heat pipe to accurately calculate the heat flux density. This achieves precise measurement of the high-temperature heat pipe's output power, enabling accurate assessment of its performance. Figure 1 As shown, the method includes the following steps:

[0068] Step 101: Heat the high-temperature heat pipe to be tested using the first heating method to bring the high-temperature heat pipe to full load.

[0069] For ease of understanding, the embodiments of this application are based on a high-temperature heat pipe performance testing device to complete the testing of high-temperature heat pipe performance. For the sake of clarity, the high-temperature heat pipe performance testing device will be described below. Figure 1a This is a schematic diagram of a high-temperature heat pipe performance testing device provided in an embodiment of this application. Figure 1a As shown, 1 is the high-temperature heat pipe to be tested, 2 is the electromagnetic induction coil heating device and the material to reduce magnetic leakage, 3 is the high-temperature thermocouple, 4 is the single tube heat exchanger, 5 is the air compressor, 6 is the test circuit switch, 7 is the test circuit flow meter, 8 is the inlet thermometer, and 9 is the outlet thermometer.

[0070] The following embodiments detail how to base on Figure 1a The process of testing the high-temperature heat pipe performance using the device shown:

[0071] To better test the performance of high-temperature heat pipes, the high-temperature heat pipes first need to be heated to full load. In this embodiment, the full load state is defined as the condition under which the evaporation section of the high-temperature heat pipe experiences a significant local temperature rise or significant oscillation and instability. This indicates that the high-temperature heat pipe has reached its heat transfer limit under the test condition, and further increasing the power may cause the high-temperature heat pipe to burn out or be damaged. The heat transfer power of the high-temperature heat pipe when it just reaches the heat transfer limit is considered to be the full load power, which is the output power.

[0072] In the specific implementation process, the first heating method used to heat to full load includes any one of the following: electromagnetic induction coil heating, electric heating wire heating, resistance heating, induction heating, electric arc heating, electron beam heating, infrared heating, and dielectric heating. The following embodiments will use electromagnetic induction coil heating as the first heating method for explanation. This heating method has a fast heating speed and simple test setup.

[0073] It should be noted that this description is not intended to limit the first heating method described in the embodiments of this application to only electromagnetic induction coil heating. Any high-temperature heat pipe heating method that can realize the detection method described in the embodiments of this application is within the protection scope of this application.

[0074] As an example, such as Figure 1b As shown, Figure 1b This is a schematic diagram of an electromagnetic induction coil heating device provided in an embodiment of this application.

[0075] The basic components of a heat pipe induction heating system include: 1. an AC power supply; 2. a circuit switch; 3. an electromagnetic induction coil; 4. a heat pipe workpiece to be heated; and 5. insulation material. Depending on the heating length of the heat pipe's evaporation section, the electromagnetic induction coil can be made into different shapes. The electromagnetic induction coil is connected to the power supply, which provides alternating current to the coil. This alternating current generates an alternating magnetic field through the workpiece. When the high-temperature heat pipe to be tested is inserted into the customized induction heating coil, this magnetic field induces eddy currents in the workpiece, thus heating it. The induction heating device is placed inside the magnetically conductive and insulation materials to reduce heat dissipation and interference from the magnetic field on the external environment. This design allows for simultaneous and independent control of the heating power of multiple induction heating devices, enabling efficient and rapid testing of multiple alkali metal heat pipes.

[0076] The high-temperature heat pipe described in this application embodiment can be any one of a high-temperature sodium heat pipe, a high-temperature potassium heat pipe, a high-temperature lithium heat pipe, or a high-temperature sodium-potassium heat pipe. This application embodiment does not limit the specific type of high-temperature heat pipe.

[0077] Step 102: When the high-temperature heat pipe reaches the full load state, detect the flow rate of the cooling medium required to cool the high-temperature heat pipe, the outlet temperature of the cooling medium, and the inlet temperature of the cooling medium.

[0078] High-temperature heat pipes, as enclosed heat transfer elements, are divided axially into an evaporation section, an adiabatic section, and a condensation section. The high-temperature heat pipe is heated in the evaporation section and cooled in the condensation section to achieve heat transfer. To make the operating conditions of the high-temperature heat pipe under test as close as possible to actual operating conditions, the condensation section of the high-temperature heat pipe needs to be cooled. Therefore, this application embodiment provides a single-tube heat exchanger for a single high-temperature heat pipe, namely… Figure 1a 4.

[0079] To better understand the experimental apparatus of the embodiments of this application, such as Figure 1c As shown, Figure 1c This is a schematic diagram of a single-tube heat exchanger provided in an embodiment of this application. 1 is a high-temperature thermocouple, 2 is the outlet and connector of the single-tube heat exchanger, 3 is the inlet and connector of the single-tube heat exchanger, 4 is the fins and baffles of the single-tube heat exchanger, and 5 is the shell of the single-tube heat exchanger. This embodiment of the application uses forced air convection cooling to cool the high-temperature heat pipe under test, and measures the airflow and inlet / outlet temperatures of the air heat exchanger. The inlet and outlet pipes are DN20. The single-tube heat exchanger has 5 baffles with a thickness of 1mm, and 120 fins with a thickness of 1mm and a slit width of 2mm. The baffle orifice height is 8.25mm, and the baffles and fins are at the same height.

[0080] Compared to related technologies that directly use the heater's power as the output power of the high-temperature heat pipe, this application's embodiment calculates the precise output power by detecting the flow rate, outlet temperature, and inlet temperature of the cooling medium when the high-temperature heat pipe reaches full load. To obtain the operating parameters of the high-temperature heat pipe under test at full load, the following methods are used: Figure 1a In step 2 (electromagnetic induction coil heating device), the heating element 1 (high-temperature heat pipe to be tested) heats the heat pipe to full load; then the heating element is turned on. Figure 1a 6 (test circuit switch) in the middle, through Figure 1a 5 (air compressor) provides forced convection air for cooling 4 (single-tube heat exchanger); when the high-temperature heat pipe to be tested reaches the full load state, it is through Figure 1a 7 (test loop flow meter), 8 (inlet thermometer), and 9 (outlet thermometer) are used to measure the air volume flow rate, inlet temperature, and outlet temperature of the single-tube heat exchanger, respectively.

[0081] Cooling methods include any one of natural air convection / cooling, forced air convection cooling, water cooling, oil cooling, and coolant cooling. This application uses forced air convection cooling as an example for illustration; however, it should be clarified that this description is not intended to limit the cooling method to forced air convection. Any cooling method capable of implementing the detection method described in this application's embodiments is within the protection scope of this application.

[0082] Step 103: Calculate the output power of the high-temperature heat pipe based on the flow rate of the cooling medium, the outlet temperature of the cooling medium, and the inlet temperature of the cooling medium.

[0083] Based on the flow rate, outlet temperature, and inlet temperature of the cooling medium detected in step 102, according to the formula P0 = ρQC p (t out -t in The output power P0 of the high-temperature heat pipe under full load is obtained. Where P0 is the output power of the high-temperature heat pipe, ρ is the density of air, Q is the volumetric flow rate of air, and C... p t is the specific heat capacity of air at constant pressure. out t represents the outlet temperature of the cooling medium. in This is the inlet temperature of the cooling medium.

[0084] Step 104: Calculate the heat flux density of the high-temperature heat pipe when it is operating at full load, based on the cross-sectional area of ​​the high-temperature heat pipe and the output power P0.

[0085] Based on the output power P0 calculated in step 103 and the cross-sectional area of ​​the high-temperature heat pipe, further calculations are performed using the formula:

[0086]

[0087] The heat flux density of the high-temperature heat pipe under full load is obtained.

[0088] Where q is the heat flux density, P0 is the output power of the high-temperature heat pipe, and r is the radius of the high-temperature heat pipe.

[0089] Step 105: Determine the performance of the high-temperature heat pipe based on the heat flux density.

[0090] Heat flux density is the amount of heat transferred per unit area of ​​cross-section per unit time. It is an important indicator of the heat dissipation performance of a device or equipment and a crucial parameter for evaluating the performance of a high-temperature heat pipe. Based on the heat flux density q calculated in step 104, the performance of the high-temperature heat pipe can be determined.

[0091] This application provides a method for testing the performance of a high-temperature heat pipe. The method involves heating the high-temperature heat pipe under test using a first heating method until it reaches full load. When the heat pipe reaches full load, the flow rate, outlet temperature, and inlet temperature of the cooling medium required to cool the heat pipe are measured. The output power P0 of the high-temperature heat pipe is calculated based on these parameters. The heat flux density of the high-temperature heat pipe at full load is calculated based on its cross-sectional area and the output power P0. The performance of the high-temperature heat pipe is then determined based on the heat flux density. Compared to related technologies that directly use the heater power as the output power of the high-temperature heat pipe, this method achieves accurate measurement of the high-temperature heat pipe's output power by calculating the heat flux density under full load, thereby improving the accuracy of high-temperature heat pipe performance testing.

[0092] To comprehensively assess the performance of high-temperature heat pipes, performance can be judged not only by heat flux density but also by the wall temperature characteristics during low-power startup and under reduced power conditions. For example... Figure 2 As shown, Figure 2 This is a flowchart illustrating another method for testing the performance of a high-temperature heat pipe, provided in an embodiment of this application. This method determines the performance of the high-temperature heat pipe by detecting its wall temperature characteristics during low-power startup and under reduced power conditions. The method includes the following steps:

[0093] Step 201: Based on the output power, set the initial heating power and power increase step size for the second heating method.

[0094] In specific implementation, the second heating method includes any one of the following: electromagnetic induction coil heating, electric heating wire heating, resistance heating, induction heating, electric arc heating, electron beam heating, infrared heating, and dielectric heating. The following embodiments will be described with electric heating wire heating as the second heating method. This heating method has accurate power control and precise heating power measurement.

[0095] It should be noted that this description is not intended to limit the second heating method described in the embodiments of this application to only electric heating wire heating. Any high-temperature heat pipe heating method that can realize the detection method described in the embodiments of this application is within the protection scope of this application.

[0096] Based on the output power P0 calculated in the above embodiments and the test objectives, the initial heating power and power increase step size used for heating the heating wire are set. Generally, we can set the initial heating power to 10% to 20% of the output power P0 according to the test objectives, and increase the power with a power increase step size of 10%P0 / 30mins.

[0097] Step 202: Based on the initial heating power and the power increase step size, control the heating of the high-temperature heat pipe until it reaches full load.

[0098] To facilitate understanding, specific examples will be used below. Figure 2a A schematic diagram of another high-temperature heat pipe performance testing device provided in this application. Figure 2a As shown, 1 is a high-temperature thermocouple, 2 is a heating wire, 3 is the high-temperature heat pipe to be tested, 4 is the cooling medium outlet of the single-tube heat exchanger, 5 is the cooling medium inlet of the single-tube heat exchanger, 6 is the heat exchange fins and baffles inside the single-tube heat exchanger, 7 is the shell of the single-tube heat exchanger, 8 is the insulation material of the evaporation section of the high-temperature heat pipe to be tested, and 9 is the insulation material of the insulation section of the high-temperature heat pipe to be tested.

[0099] In the specific implementation process, the power control device used in this application is a programmable power controller. However, it should be noted that the embodiments of this application are not limited to programmable power controllers. Any method that can realize the detection method described in this application to change the heating power is within the protection scope of this application.

[0100] Based on the set initial heating power and power increment step, the programmable power controller controls the process. Figure 2a The power of 2 (heating wire) in 2a is used to control the heating of 3 (high-temperature heat pipe to be tested) in 2a until it reaches full load.

[0101] Step 203: Record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe, and determine the first peak temperature of the outer wall surface.

[0102] To detect the temperature of the outer wall surface during the heating process of the high-temperature heat pipe, embodiments of this application employ a K-type high-temperature thermocouple arranged on the outer wall surface of the high-temperature heat pipe for temperature measurement, such as... Figure 2a As shown in Figure 1. It should be noted that the temperature measuring device in this application embodiment is not limited to a type K high-temperature thermocouple. Any temperature measuring method that can realize the detection method described in this application embodiment is within the protection scope of this application.

[0103] K-type high-temperature thermocouples are arranged on the wall of the high-temperature heat pipe, and the K-type thermocouples should be in close contact with the wall of the high-temperature heat pipe. High-temperature fixing thermal conductive adhesive is applied on them to make the temperature measurement more accurate. K-type high-temperature thermocouples are arranged along the axial and radial directions of the surface of the high-temperature heat pipe and connected to the temperature acquisition and recording equipment to accurately measure the temperature change and peak temperature of the outer wall of the high-temperature heat pipe.

[0104] In practical applications, high-temperature heat pipes have complex evaporation and condensation flow heat transfer. When the heat pipe is under a certain heat load, the two-phase circulation of the working fluid cannot be maintained stably. When the working fluid dries up in some areas and cannot work, it is considered that the heat transfer limit has been reached. High-temperature heat pipes commonly encounter viscosity limit, sound velocity limit and capillary limit during operation. When the heat transfer limit is reached, the wall temperature may rise sharply, resulting in a peak wall temperature.

[0105] Step 204: Determine the wall temperature characteristics of the high-temperature heat pipe during low-power startup based on the first peak temperature and the preset first normal operating range of the high-temperature heat pipe.

[0106] The wall temperature characteristics of a high-temperature heat pipe during low-power startup reflect the operating temperature and axial temperature difference of the heat pipe under a certain axial heat transfer flow rate, and reflect the axial thermal resistance of the heat pipe. The performance of the high-temperature heat pipe can be characterized by the above wall temperature characteristics.

[0107] Figure 3 A flowchart illustrating another method for testing the performance of a high-temperature heat pipe provided in this application embodiment, the method comprising the following steps:

[0108] Step 301: After the high-temperature heat pipe reaches the full load state, adjust the heating power to the stable working state of the high-temperature heat pipe. The stable working state of the high-temperature heat pipe is the working state that meets the preset performance test standard, where the working temperature of the high-temperature heat pipe changes by less than 1°C within a preset time period.

[0109] For a better understanding, please refer to [link / reference]. Figure 2a After the high-temperature heat pipe reaches full load, we adjust it using a programmable power controller. Figure 2a The power of 2 (heating wire) in the high-temperature heat pipe is adjusted to the stable operating state of the high-temperature heat pipe. According to GB / T 14812-2008 Test Method for Heat Transfer Performance of Heat Pipe, the stable operating state of a high-temperature heat pipe is generally considered to be when the test operating temperature of the high-temperature heat pipe changes by less than 1℃ within 30 minutes, and various test data can be measured and recorded.

[0110] Step 302: Set the heating power corresponding to the stable working state as the starting power of the power reduction process.

[0111] The starting power of the so-called power reduction process is the stable operating power of the high-temperature heat pipe, which is a fixed power value that is less than the heat transfer limit power P0 of the heat pipe; the power corresponding to the stable working state of the high-temperature heat pipe obtained in step 301 is set as the starting power in the implementation process of this embodiment.

[0112] Step 303: Based on the initial power, set the power reduction step size for the second heating method.

[0113] The step size and degree of power reduction can be set according to the experimental requirements to study the performance changes of high-temperature heat pipes at different power levels.

[0114] Step 304: Control the heating of the high-temperature heat pipe according to the initial power and the power reduction step size.

[0115] Based on the starting power and power reduction step size set in steps 302 and 303, a programmable power controller is used to control the power reduction process. Figure 2a The heating control is performed on the 3 (high-temperature heat pipe to be tested).

[0116] Step 305: Record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe, and determine the second peak temperature of the outer wall surface.

[0117] pass Figure 2a In the first part, the high-temperature thermocouple measures the temperature of the outer wall of the high-temperature heat pipe. The high-temperature thermocouple is connected to a temperature acquisition and recording device to record temperature changes and peak temperatures.

[0118] Step 306: Determine the wall temperature characteristics of the high-temperature heat pipe under power reduction conditions based on the second peak temperature and the preset second normal operating range of the high-temperature heat pipe.

[0119] By comparing the peak temperature obtained in step 305 with the preset temperature of the high-temperature heat pipe in the normal operating range, the wall temperature characteristics of the high-temperature heat pipe under power reduction conditions are determined.

[0120] The wall temperature characteristics of a high-temperature heat pipe under power reduction conditions reflect the operating temperature of the heat pipe under a certain axial heat transfer flow rate and the axial temperature difference of the heat pipe, and reflect the axial thermal resistance of the heat pipe. The performance of the high-temperature heat pipe can be characterized by the above wall temperature characteristics.

[0121] In summary, the embodiments of this application can achieve the following effects:

[0122] By heating the high-temperature heat pipe under test to bring it to full load, the flow rate, outlet temperature, and inlet temperature of the cooling medium required to cool the heat pipe are measured when the heat pipe reaches full load. The output power of the heat pipe is calculated based on the flow rate, outlet temperature, and inlet temperature of the cooling medium. The heat flux density of the heat pipe at full load is calculated based on the cross-sectional area of ​​the heat pipe and the output power, thus achieving accurate measurement of the heat pipe power to accurately determine its performance.

[0123] In addition, the wall temperature characteristics of the high-temperature heat pipe during low-power startup and under reduced power conditions were measured, further improving the comprehensiveness of the high-temperature heat pipe performance testing.

[0124] Corresponding to the above-described method for testing the performance of high-temperature heat pipes, this application also proposes a device for testing the performance of high-temperature heat pipes. Since the device embodiment of this application corresponds to the method embodiment described above, details not disclosed in the device embodiment can be referred to the method embodiment described above, and will not be repeated here.

[0125] Figure 4 A schematic diagram of a high-temperature heat pipe performance testing device provided in this application embodiment includes:

[0126] Heating unit 41 is used to heat the high-temperature heat pipe to be tested using a first heating method, so that the high-temperature heat pipe reaches full load.

[0127] The detection unit 42 is used to detect the flow rate, outlet temperature and inlet temperature of the cooling medium required to cool the high-temperature heat pipe when the high-temperature heat pipe reaches the full load state of the heating unit 41.

[0128] The first calculation unit 43 is used to calculate the output power of the high-temperature heat pipe based on the flow rate of the cooling medium, the outlet temperature of the cooling medium and the inlet temperature of the cooling medium as described by the detection unit 42.

[0129] The second calculation unit 44 is used to calculate the heat flux density of the high-temperature heat pipe when it is working at full load, based on the cross-sectional area of ​​the high-temperature heat pipe and the output power of the first calculation unit 43.

[0130] The first judgment unit 45 is used to judge the performance of the high-temperature heat pipe based on the heat flux density of the second calculation unit 44.

[0131] This application provides a device for testing the performance of a high-temperature heat pipe. The device heats the heat pipe under test using a first heating method until it reaches full load. When the heat pipe reaches full load, the device detects the flow rate, outlet temperature, and inlet temperature of the cooling medium required to cool the heat pipe. Based on these parameters, the device calculates the output power of the heat pipe. Then, based on the cross-sectional area of ​​the heat pipe and the output power, it calculates the heat flux density of the heat pipe at full load. This allows for accurate measurement of the heat pipe's output power to precisely determine its performance.

[0132] Furthermore, in one possible implementation of the embodiments of this application, such as Figure 5 As shown, the device further includes:

[0133] The first setting unit 46 is used to set the initial heating power and power increase step size of the second heating method according to the output power of the first calculation unit 43.

[0134] The first control unit 47 is used to control the heating of the high-temperature heat pipe according to the initial heating power and power increase step size described by the first setting unit 46 until the full load state is reached.

[0135] The first determining unit 48 is used to record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe and to determine the first peak temperature of the outer wall surface.

[0136] The second judgment unit 49 is used to determine the wall temperature characteristics of the high-temperature heat pipe during low-power startup based on the first peak temperature of the first determination unit 48 and the first normal operating range of the preset high-temperature heat pipe.

[0137] Furthermore, in one possible implementation of this embodiment, such as Figure 5 As shown, the device further includes:

[0138] The adjustment unit 410 is used to adjust the heating power to a stable working state of the high-temperature heat pipe after the high-temperature heat pipe reaches the full load state described by the first control unit 47. The stable working state of the high-temperature heat pipe is the working state that meets the preset performance test standard, where the working temperature of the high-temperature heat pipe changes by less than 1°C within a preset time period.

[0139] The second setting unit 411 is used to set the heating power corresponding to the stable working state of the adjustment unit 410 as the starting power of the power reduction process;

[0140] The third setting unit 412 is used to set the power reduction step size adopted by the second heating method according to the starting power described by the second setting unit 411.

[0141] The second control unit 413 is used to control the heating of the high-temperature heat pipe according to the starting power of the second setting unit 411 and the power reduction step size of the third setting unit 52.

[0142] The second determining unit 414 is used to record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe and determine the second peak temperature of the outer wall surface.

[0143] The third judgment unit 415 is used to judge the wall temperature characteristics of the high-temperature heat pipe under the power reduction condition based on the second peak temperature of the second determination unit 414 and the second normal operating range of the preset high-temperature heat pipe.

[0144] According to embodiments of this application, this application also provides an electronic device, a readable storage medium, and a computer program product.

[0145] Figure 6A schematic block diagram of an example electronic device 500 that can be used to implement embodiments of this application is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the application described and / or claimed herein.

[0146] like Figure 6 As shown, device 500 includes a computing unit 501, which can perform various appropriate actions and processes based on a computer program stored in ROM (Read-Only Memory) 502 or a computer program loaded from storage unit 508 into RAM (Random Access Memory) 503. RAM 503 can also store various programs and data required for the operation of device 500. The computing unit 501, ROM 502, and RAM 503 are interconnected via bus 504. I / O (Input / Output) interface 505 is also connected to bus 504.

[0147] Multiple components in device 500 are connected to I / O interface 505, including: input unit 506, such as keyboard, mouse, etc.; output unit 507, such as various types of monitors, speakers, etc.; storage unit 508, such as disk, optical disk, etc.; and communication unit 509, such as network card, modem, wireless transceiver, etc. Communication unit 509 allows device 500 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0148] The computing unit 501 can be various general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, CPUs (Central Processing Units), GPUs (Graphics Processing Units), various special-purpose AI (Artificial Intelligence) computing chips, various computing units running machine learning model algorithms, DSPs (Digital Signal Processors), and any suitable processor, controller, microcontroller, etc. The computing unit 501 performs the various methods and processes described above, such as the method for detecting the performance of a high-temperature heat pipe. For example, in some embodiments, the method for detecting the performance of a high-temperature heat pipe can be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as storage unit 508. In some embodiments, part or all of the computer program can be loaded and / or installed on device 500 via ROM 502 and / or communication unit 509. When the computer program is loaded into RAM 503 and executed by the computing unit 501, one or more steps of the methods described above can be performed. Alternatively, in other embodiments, the computing unit 501 may be configured to perform the aforementioned method for detecting the performance of a high-temperature heat pipe by any other suitable means (e.g., by means of firmware).

[0149] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, FPGAs (Field Programmable Gate Arrays), ASICs (Application-Specific Integrated Circuits), ASSPs (Application-Specific Standard Products), SOCs (System-on-Chips), CPLDs (Complex Programmable Logic Devices), computer hardware, firmware, software, and / or combinations thereof. These various implementations may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0150] The program code used to implement the methods of this application may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing device, such that when executed by the processor or controller, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0151] In the context of this application, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, RAM, ROM, EPROM (Electrically Programmable Read-Only Memory) or flash memory, optical fiber, CD-ROM (Compact Disc Read-Only Memory), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0152] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (Cathode-Ray Tube) or LCD (Liquid Crystal Display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0153] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication (e.g., communication networks) of any form or medium. Examples of communication networks include LANs (Local Area Networks), WANs (Wide Area Networks), the Internet, and blockchain networks.

[0154] Computer systems can include clients and servers. Clients and servers are generally geographically separated and typically interact via communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. A server can be a cloud server, also known as a cloud computing server or cloud host, a hosting product within the cloud computing service ecosystem, addressing the shortcomings of traditional physical hosts and VPS (Virtual Private Server, or simply "VPS") services, such as high management difficulty and weak business scalability. Servers can also be servers for distributed systems or servers incorporating blockchain technology.

[0155] It's important to note that artificial intelligence (AI) is the study of enabling computers to simulate certain human thought processes and intelligent behaviors (such as learning, reasoning, thinking, and planning). It encompasses both hardware and software technologies. AI hardware technologies generally include sensors, dedicated AI chips, cloud computing, distributed storage, and big data processing. AI software technologies primarily include computer vision, speech recognition, natural language processing, machine learning / deep learning, big data processing, and knowledge graph technologies.

[0156] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application can be achieved, and this is not limited herein.

[0157] The specific embodiments described above do not constitute a limitation on the scope of protection of this application. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A method for detecting the performance of a high temperature heat pipe, characterized by, include: The high-temperature heat pipe to be tested is heated using a first heating method to bring it to full load. The full load state is the heat transfer limit state in which the evaporation section of the high-temperature heat pipe experiences a significant local temperature rise or unstable oscillation. When the high-temperature heat pipe reaches the full load state, the flow rate of the cooling medium required to cool the high-temperature heat pipe, the outlet temperature of the cooling medium, and the inlet temperature of the cooling medium are detected. The output power of the high-temperature heat pipe is calculated based on the flow rate, outlet temperature, and inlet temperature of the cooling medium. Calculate the heat flux density of the high-temperature heat pipe when it is operating at full load based on the cross-sectional area of ​​the high-temperature heat pipe and the output power. The performance of the high-temperature heat pipe is determined based on the heat flux density. The output power of the high-temperature heat pipe is calculated based on the flow rate, outlet temperature, and inlet temperature of the cooling medium using the following formula: Where P0 is the output power of the high-temperature heat pipe, ρ is the density of air, Q is the volumetric flow rate of air, and C... p t is the specific heat capacity of air at constant pressure. out t represents the outlet temperature of the cooling medium. in This refers to the inlet temperature of the cooling medium. The heat flux density of the high-temperature heat pipe under full load operation is calculated based on the cross-sectional area of ​​the high-temperature heat pipe and the output power using the following formula: Where q is the heat flux density, P0 is the output power of the high-temperature heat pipe, and r is the radius of the high-temperature heat pipe; The method further includes: Based on the output power, set the initial heating power and power increase step size for the second heating method; The high-temperature heat pipe is heated and controlled according to the initial heating power and the power increase step size until it reaches full load. Record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe, and determine the first peak temperature of the outer wall surface; wherein, the peak temperature is the wall surface temperature that rises when the heat pipe reaches its heat transfer limit; Based on the first peak temperature and the preset first normal operating range of the high-temperature heat pipe, the wall temperature characteristics of the high-temperature heat pipe during low-power startup are determined.

2. The detection method according to claim 1, characterized in that, The method further includes: After the high-temperature heat pipe reaches the full load state, the heating power is adjusted to the stable working state of the high-temperature heat pipe. The stable working state of the high-temperature heat pipe is the working state that meets the preset performance test standard, where the working temperature of the high-temperature heat pipe changes by less than 1°C within a preset time period. Set the heating power corresponding to the stable operating state as the starting power of the power reduction process; Based on the initial power, the power reduction step size used in the second heating method is set; The heating of the high-temperature heat pipe is controlled according to the starting power and the power reduction step size; Record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe, and determine the second peak temperature of the outer wall surface; Based on the second peak temperature and the preset second normal operating range of the high-temperature heat pipe, the wall temperature characteristics of the high-temperature heat pipe under power reduction conditions are determined.

3. The method according to any of claims 1-2, characterized in that, The first heating method and the second heating method are any one of electromagnetic induction coil heating, heating wire heating, resistance heating, induction heating, electric arc heating, electron beam heating, infrared heating, and dielectric heating.

4. A device for detecting the performance of a high temperature heat pipe, characterized by include: The heating unit is used to heat the high-temperature heat pipe to be tested using a first heating method, so that the high-temperature heat pipe reaches a full load state; the full load state is the heat transfer limit state in which the evaporation section of the high-temperature heat pipe experiences a significant local temperature rise or unstable oscillation. The detection unit is used to detect the flow rate of the cooling medium required to cool the high-temperature heat pipe, the outlet temperature of the cooling medium, and the inlet temperature of the cooling medium when the high-temperature heat pipe reaches the full load state. The first calculation unit is used to calculate the output power of the high-temperature heat pipe based on the flow rate of the cooling medium, the outlet temperature of the cooling medium, and the inlet temperature of the cooling medium. The second calculation unit is used to calculate the heat flux density of the high-temperature heat pipe when it is working at full load, based on the cross-sectional area of ​​the high-temperature heat pipe and the output power. The first judgment unit is used to judge the performance of the high-temperature heat pipe based on the heat flux density. The first calculation unit uses the following formula for calculation: wherein P0 is the output power of the high temperature heat pipe, p is the density of air, Q is the volumetric flow rate of air, C p is the specific heat capacity of air at constant pressure, t out is the outlet temperature of the cooling medium, t in is the inlet temperature of the cooling medium; The second calculation unit calculates using the following formula: Where q is the heat flux density, P0 is the output power of the high-temperature heat pipe, and r is the radius of the high-temperature heat pipe; The device further includes: The first setting unit is used to set the initial heating power and power increase step size of the second heating method according to the output power. The first control unit is used to control the heating of the high-temperature heat pipe according to the initial heating power and the power increase step size until the full load is reached. The first determining unit is used to record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe and to determine the first peak temperature of the outer wall surface; wherein, the peak temperature is the wall surface temperature that rises when the heat pipe reaches the heat transfer limit; The second judgment unit is used to judge the wall temperature characteristics of the high-temperature heat pipe during low-power startup based on the first peak temperature and the first normal operating range of the preset high-temperature heat pipe.

5. The detection device of claim 4, wherein, The device further includes: The adjustment unit is used to adjust the heating power to a stable working state of the high-temperature heat pipe after the high-temperature heat pipe reaches the full load state. The stable working state of the high-temperature heat pipe is the working state that meets the preset performance test standard, where the working temperature of the high-temperature heat pipe changes by less than 1°C within a preset time period. The second setting unit is used to set the heating power corresponding to the stable working state as the starting power of the power reduction process; The third setting unit is used to set the power reduction step size adopted by the second heating method according to the starting power; The second control unit is used to control the heating of the high-temperature heat pipe according to the starting power and the power reduction step size; The second determining unit is used to record the temperature of the outer wall surface during the heating process of the high-temperature heat pipe and to determine the second peak temperature of the outer wall surface. The third judgment unit is used to judge the wall temperature characteristics of the high-temperature heat pipe under power reduction conditions based on the second peak temperature and the second normal operating range of the preset high-temperature heat pipe.

6. The device of any of claims 4-5, wherein, The first heating method and the second heating method are any one of electromagnetic induction coil heating, heating wire heating, resistance heating, induction heating, electric arc heating, electron beam heating, infrared heating, and dielectric heating.

7. An electronic device, comprising: include: At least one processor; and a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform the method of any one of claims 1-3.

8. A non-transitory computer-readable storage medium having stored thereon computer instructions, wherein, The computer instructions are for causing the computer to perform the method according to any one of claims 1-3.

9. A computer program product, characterised in that, A computer program comprising instructions which, when executed by a processor, implement the method according to any one of claims 1-3.

Images