A circuit connection method for a shingled assembly

Abstract

A circuit connection method for a shingled component, the steps include: connecting each battery string through a bus bar at the positive terminal and the negative terminal of the component respectively; connecting each battery string through a bus bar at the position of each bypass diode of the component; and then setting a lead wire group at the position of the middle axis of the component to connect the current in the component with the peripheral device to form a loop current; the structure of the bus bar used at the positive terminal and the bypass diode position is different from that of the bus bar used at the negative terminal. The present invention is particularly suitable for double-glass solar shingled cells, at the positive terminal and the bypass diode position, the width of the bus bar at the welding point position is wider and the width at the non-welding point position is narrower; the negative terminal adopts a foldable bus bar; it can not only reduce the risk of poor welding, improve the welding stability and qualified rate of the component; but also reduce the heat generation at the bus bar during power generation, effectively reduce power loss, and improve the output power of the component; so that the proportion of power generation on the back of the component is increased by more than 5%.

Description

Technical Field

[0001] The invention belongs to the technical field of solar cell manufacturing, and in particular relates to a circuit connection method of a shingled assembly. Background Art

[0002] In the welding of existing components, the welding rods, i.e., welding busbars, are all strip structures with the same width and thickness. When welding busbars with existing joints, the materials used at the pad point and non-welding point are the same. Since the area of ​​the welding point is larger than that of the non-welding point, and the thickness of the welding point is thicker, the welding point is prone to fragmentation or hidden cracks after welding. At the same time, due to the wide width of the busbar, the output power of the component is low. How to design a circuit connection method to solve the technical problems of easy fragmentation or hidden cracks and low component output power is the focus of the invention in this case. Summary of the invention

[0003] The present invention provides a circuit connection method for a shingled assembly, which is particularly suitable for double-glass solar shingled cells and solves the technical problems that the existing circuit connection structure is prone to breakage or hidden cracks and the assembly output power is low.

[0004] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0005] A circuit connection method for a shingled assembly, comprising the steps of:

[0006] At the positive terminal and the negative terminal of the front side of the component, the battery strings in the positive terminal and the negative terminal are connected through bus bars respectively, so that the battery strings connected in parallel form a current channel;

[0007] Connecting the battery strings at the positions of the bypass diodes in the assembly through bus bars so that the positive terminal and the negative terminal are in circuit communication;

[0008] A lead wire group is then arranged at the middle axis position of the component to connect the current in the component with the peripheral device to form a loop current;

[0009] The busbars used at the positive terminal and the bypass diode position have different structures from the busbars used at the negative terminal.

[0010] Furthermore, the busbar structure used for the positive terminal and the bypass diode is the same, both including a plurality of soldering point areas and non-soldering point areas that are integrally connected and coaxially symmetrically arranged; the width of the soldering point area is greater than the width of the non-soldering point area.

[0011] Furthermore, the thickness of all the soldering point areas is the same; the thickness of all the non-soldering point areas is the same; and the thickness of the soldering point areas is not greater than the thickness of the non-soldering point areas.

[0012] Furthermore, the outer edge of the soldering point area is larger than the outer edge of the battery cell pad point.

[0013] Furthermore, all the soldering point areas are rectangular structures; and all the non-soldering point areas are long strip structures.

[0014] Furthermore, the busbar used for the negative terminal includes a welding section and a bus section that are integrally connected, and the welding sections are placed on the same side of the bus section and are evenly spaced.

[0015] Furthermore, the welding section is a trapezoidal structure, one side of the large diameter end of which is connected to the bus section, and the welding section is arranged along the length direction of the bus section, and the thickness of the bus section is greater than the thickness of the welding section.

[0016] Furthermore, when the negative terminal is welded, the welding section is welded to the pad point of the negative terminal, and the bus section is folded to the back of the component and connected to the insulating strip provided on the back of the component.

[0017] Furthermore, the width of the bus section is greater than the width of the non-welding point area.

[0018] Furthermore, the lead wire group includes middle lead wires and end lead wires, the middle lead wires are respectively connected to the bypass diodes; the end lead wires are respectively arranged at the positive terminal and the negative terminal, and are respectively connected to the peripheral devices.

[0019] A circuit connection method for a shingled component designed by the present invention is particularly suitable for double-glass solar shingled cells. A special bus bar is used for welding at the positive terminal and the bypass diode position, so that the bus bar is wider at the welding point position and narrower at the non-welding point position; a foldable bus bar is used at the negative terminal; not only can the risk of poor welding be reduced, and the welding stability and qualified rate of the component be improved; it can also reduce the heat generated at the bus bar during power generation, effectively reduce power loss, and increase the output power of the component; and the proportion of power generated on the back of the component is increased by more than 5%. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic structural diagram of a circuit connection of a shingled assembly according to an embodiment of the present invention;

[0021] Figure 2 is a schematic structural diagram of a portion of a positive bus bar according to an embodiment of the present invention;

[0022] Figure 3 is a schematic structural diagram of a portion of negative electrode bus bars according to an embodiment of the present invention;

[0023] Figure 4It is a partial structural schematic diagram of any lead-out line of an embodiment of the present invention;

[0024] Figure 5 is a schematic structural diagram of an enlarged portion A of an embodiment of the present invention;

[0025] Figure 6 It is a schematic diagram of the structure of an enlarged portion B of an embodiment of the present invention.

[0026] In the figure:

[0027] 100, component 10, positive bus bar 11, welding point area

[0028] 12. Non-soldering area 20, positive terminal 30, negative terminal

[0029] 40, bypass diode 50, bypass bus bar 60, negative bus bar

[0030] 61, welding section 62, bus section 70, lead wire group

[0031] 71, middle lead wire 72, end lead wire DETAILED DESCRIPTION

[0032] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0033] This embodiment provides a circuit connection method for a shingled assembly, the steps comprising:

[0034] At the positive terminal 20 and the negative terminal 30 on the front side of the assembly 100 , the battery strings in the positive terminal 20 and the negative terminal 30 are connected through bus bars, respectively, so that the battery strings connected in parallel form a current channel.

[0035] Specifically, Figure 1 As shown, the component 100 includes several groups of battery strings arranged in series, and the battery strings arranged in series are arranged in parallel in pairs to form three groups of battery strings arranged in parallel, and the battery strings are then connected in series. A positive bus bar 10 is provided at the positive terminal 20 on the front of the component 100 to merge the currents of the battery strings at the positive terminal 20, and the location where the positive bus bar 10 is welded to each pad on the positive terminal 20 cannot be too thick, otherwise it will cause the battery cell to break and crack. A negative bus bar 60 is provided at the position of the negative terminal 30 to merge the currents of the battery strings at the negative terminal 30.

[0036] The battery strings are connected by bus bars at the positions of the bypass diodes 40 in the assembly 100 so that the circuits of the positive terminal 20 and the negative terminal 30 are connected.

[0037] Specifically, at least two groups of bypass diodes 40 are provided along the length direction of the assembly 100 for connecting the battery strings. A bypass bus bar 50 is provided at each bypass diode 40 to protect the bypass diode 40 so that the two sides of the bypass diode 40 form a circuit connection.

[0038] A lead wire group 70 is then provided at the axial position in the middle of the component 100 to connect the current in the component 100 with the peripheral device to form a loop current.

[0039] The busbars used at the positive terminal 20 and the bypass diode 40 have different structures from the busbars used at the negative terminal 30 .

[0040] Specifically, Figure 2 As shown, the positive busbar 10 at the positive terminal 20 and the busbar used in the bypass diode 40 have the same structure, both of which include a plurality of soldering point areas 11 and non-soldering point areas 12 that are integrally connected and coaxially symmetrically arranged. The coaxially symmetrically arranged structure is not only easy to process and simple in structure, but also reduces the material used for the overall busbar by about 40% compared with the prior art, saving materials and having a stable and unified structure. It is more conducive to the connection of each battery string at the positive terminal 20 of the component 100 and at the bypass diode 40, and is also used to merge current to ensure the stability of the working current flowing through each soldering point area 11 and non-soldering point area 12 in the busbar.

[0041] Furthermore, the width of the soldering area 11 is greater than the width of the non-soldering area 12. The width of the soldering area 11 is its length relative to the width of the non-soldering area 12, that is, the width axis of the soldering area 11 is perpendicular to the length axis of the non-soldering area 12, in order to ensure the difference in the width of the busbar used at the soldering point and the non-soldering point. Since the height of the welding pad points at the end and the middle position of the component 100 are set along the length direction of the battery string, in order to meet the position of the pad point at the soldering area 11, the width axis of the soldering area 11 is required to be perpendicular to the length axis of the busbar as a whole. The thickness of all soldering areas 11 is the same; the thickness of all non-soldering areas 12 is the same; since the cross-sectional area of ​​the soldering area 11 can be the same as or different from the cross-sectional area of ​​the non-soldering area 12, depending on the working current flowing through, the thickness of the soldering area 11 is not greater than the thickness of the non-soldering area 12. In this embodiment, the width of the welding spot area 11 is 6±1mm, and its thickness is 0.08±0.02mm; the width of the non-welding spot area 12 is 5±1mm. The purpose of this structure is to prevent the welding spot area 11 welded to the pad point in the positive bus bar 10 and the bypass bus bar 50 from being broken or cracked, so as to improve the stability and qualified rate of the battery cell welding; the width of the non-welding spot area 12 is reduced, so as to reduce the component working current flowing through this position, thereby effectively reducing power loss and increasing the output power of the component. At the same time, the outer edge of the welding spot area 11 is larger than the outer edge of the battery cell pad point to ensure that the welding spot is not exposed to the outside and is covered by the bus bar, so as to protect the battery cell pad point, ensure the welding quality at the welding spot, and improve the welding stability.

[0042] Furthermore, all solder joint areas 11 are rectangular structures; accordingly, along the width direction, the cross-sectional areas of the solder joint areas 11 are the same. The cross-sectional areas of the same structure make the working current passing through the solder joint areas 11 more stable, and the thinned thickness can reduce the welding cracks or fragments of the solder joint areas 11. At the same time, the solder joint areas 11 of this structure are easier to process and easier to align with the pad points. For the upper and lower sides of the width direction of the solder joint areas 11 of the rectangular structure, they can be straight lines or wavy lines (the drawings are omitted), and the structure of the solder joint areas 11 of this structure can be obtained. All non-solder joint areas 12 are long strip structures. The width of the non-solder joint areas 12 is consistent and the thickness is consistent. Then, the cross-sectional areas of the non-solder joint areas 12 are the same, so that the working current flowing through the non-solder joint areas 12 is relatively stable, and the power loss flowing through here can also be quantified and controllable. At the same time, since the width of the non-solder joint area 12 is reduced, the working current flowing through here can be reduced, thereby effectively reducing power loss and increasing component output power.

[0043] The connection between the soldering point area 11 and the non-soldering point area 12 is an arc-shaped structure, so that stress concentration will not occur at the connection between the soldering point area 11 and the non-soldering point area 12, avoiding cracks at this location during welding, and ensuring welding strength and quality. The structure of the soldering point area 11 is different from that of the non-soldering point area 12, the purpose is to increase the difference between the soldering point area 11 and the non-soldering point area 12, so that according to actual welding, the width of the soldering point area 11 that matches the pad point is wider, and the width of other positions that match the non-soldering point area 12 is narrower, so that the width at the soldering point position is wider and the width at the non-soldering point position is narrower, which can not only reduce the heat generation at the bus bar during power generation, effectively reduce power loss, and increase the output power of the component; but also reduce the risk of poor welding, improve the stability and qualified rate of welding; while ensuring welding stability, it can also increase the power on the back of the component, so that the proportion of the power generated on the back of the shingled component is increased, thereby increasing the overall power generation of the component.

[0044] Further, such as Figure 3 As shown, the negative bus bar 60 used for the negative terminal 30 includes a plurality of integrally connected welding sections 61 and a long bus section 62, and all welding sections 61 are placed in parallel on the same side of the bus section 62 and are evenly spaced.

[0045] Furthermore, the welding section 61 is a trapezoidal structure, one side of the large diameter end of which is connected to the bus section 62, and the welding section 61 is arranged along the length direction of the bus section 62, and the thickness of the bus section 62 is greater than the thickness of the welding section 61. The reduction in the thickness of the bus section 62 can prevent the area where it is welded to the pad point from being broken or cracked, thereby improving the stability of the battery cell welding; at the same time, the outer edge of the welding section 61 corresponding to the pad point is larger than the outer edge of the pad point, so as to protect the battery cell pad point and ensure the welding quality at the welding point.

[0046] Furthermore, when the negative terminal 30 is welded, the welding section 61 is aligned with the pad point of the negative terminal 30, so that the negative bus bar 60 is electrically connected to the positive negative terminal 30 of the component 100 without gaps; and then the bus section 62 is folded to the back of the component 100 along the width direction of the component 100, and connected to the insulating strip configured on the back of the component 100. This structure can increase the length of the battery string by about 4-10mm while keeping the creepage distance of the component 100 unchanged, thereby increasing the light receiving area of ​​the entire component 100 to improve the effective output power of the component 100.

[0047] Furthermore, the width of the bus section 62 is greater than the width of the non-welding point area 12. The purpose of this structure is to ensure that the negative bus bar 60 can be folded to the back of the component 100 to ensure the stability of the circuit connection of the component 100, which can not only reduce the degree of hidden cracks in the component welding, but also reduce the heat generated at the bus bar during outdoor power generation. In this embodiment, the width of the bus section 62 is 7±1 mm, and the width of the non-welding point area 12 is 5±1 mm.

[0048] Further, such as Figure 4-6 As shown, the lead wire group 70 includes an intermediate lead wire 71 and an end lead wire 72. The intermediate lead wire 71 is connected to each bypass diode 40 respectively; the end lead wire 72 is respectively arranged at the positive terminal 20 and the negative terminal 30, and is respectively connected to the peripheral device, and the intermediate lead wire 71 is disconnected from the end lead wire 72, that is, there is a certain space between them. All lead wires 71 are a long strip structure with a certain width. In this embodiment, two groups of intermediate lead wires 71 are included. The intermediate lead wires 71 are connected end to end along the middle axis of the component 100 and are respectively connected to the two groups of bypass diodes 40. The end lead wires 72 are respectively placed at the positive terminal 20 and the negative terminal 30, and one end leads the current of the positive terminal 20 and the negative terminal 30 respectively, and the other end is respectively connected to the peripheral device, so that the peripheral device and the component 100 form a loop current.

[0049] A circuit connection method for a shingled component designed by the present invention is particularly suitable for double-glass solar shingled cells. A special bus bar is used for welding at the positive terminal and the bypass diode position, so that the bus bar is wider at the welding point position and narrower at the non-welding point position; a foldable bus bar is used at the negative terminal; not only can the risk of poor welding be reduced, and the welding stability and qualified rate of the component be improved; it can also reduce the heat generated at the bus bar during power generation, effectively reduce power loss, and increase the output power of the component; and the proportion of power generated on the back of the component is increased by more than 5%.

[0050] The above embodiments of the present invention are described in detail, and the contents are only preferred embodiments of the present invention, and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of application of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A circuit connection method for a shingled assembly, It is characterized in that the steps include: At the positive terminal and the negative terminal of the front side of the component, the battery strings in the positive terminal and the negative terminal are connected through bus bars respectively, so that the battery strings connected in parallel form a current channel; Connecting the battery strings at the positions of the bypass diodes in the assembly through bus bars so that the positive terminal and the negative terminal are in circuit communication; A lead wire group is then arranged at the middle axis position of the component to connect the current in the component with the peripheral device to form a loop current; The busbar used at the positive terminal and the bypass diode position has a different structure from the busbar used at the negative terminal; The busbar structure used for the positive terminal and the bypass diode is the same, both comprising a plurality of soldering point areas and non-soldering point areas that are integrally connected and coaxially symmetrically arranged; the width of the soldering point area is greater than the width of the non-soldering point area; The busbar used for the negative terminal includes a welding section and a busbar section which are integrally connected; When the negative terminal is welded, the welding section is welded to the pad point of the negative terminal, and the bus section is folded to the back of the component and connected to the insulating strip provided on the back of the component.

2. A circuit connection method for a shingled assembly according to claim 1, It is characterized in that The thickness of all the soldering point areas is the same; the thickness of all the non-soldering point areas is the same; the thickness of the soldering point areas is not greater than the thickness of the non-soldering point areas.

3. A circuit connection method for a shingled assembly according to claim 1 or 2, It is characterized in that The outer edge of the soldering point area is larger than the outer edge of the battery cell pad point.

4. A circuit connection method for a shingled assembly according to claim 3, It is characterized in that All the soldering point areas are rectangular structures; all the non-soldering point areas are long strip structures.

5. A circuit connection method for a shingled assembly according to any one of claims 1 to 2 and 4, It is characterized in that The welding sections are placed on the same side of the busbar section and are evenly spaced.

6. A circuit connection method for a shingled assembly according to claim 5, It is characterized in that The welding section is a trapezoidal structure, one side of the large diameter end of which is connected to the confluence section, and the welding section is arranged along the length direction of the confluence section, and the thickness of the confluence section is greater than the thickness of the welding section.

7. A circuit connection method for a shingled assembly according to claim 6, It is characterized in that The width of the bus section is greater than the width of the non-welding point area.

8. A circuit connection method for a shingled assembly according to claim 6 or 7, It is characterized in that The lead wire group includes middle lead wires and end lead wires, the middle lead wires are respectively connected to the bypass diodes; the end lead wires are respectively arranged at the positive terminal and the negative terminal, and are respectively connected to the peripheral devices.

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