Circuit board assembly and manufacturing method thereof

Abstract

An embodiment of the present invention discloses a circuit board assembly and a manufacturing method thereof. The circuit board assembly includes a substrate, the substrate includes multiple sub-boards stacked, a first conductive layer is provided between two adjacent sub-boards, conductive vias are provided in the sub-boards, and the conductive vias are electrically connected to the first conductive layer; a first frame structure and a second frame structure are respectively and correspondingly provided on two opposite surfaces of the substrate, a first circuit board, the first circuit board is covered on the surface of the first frame structure away from the substrate side to enclose a first accommodating cavity; and a second circuit board located on the side of the substrate away from the first circuit board, the second circuit board is covered on the surface of the second frame structure away from the substrate to enclose a second accommodating cavity; the first circuit board, the substrate and the second circuit board are electrically connected, and the inner wall of the accommodating cavity can be used for mounting electronic components.

Description

Technical Field

[0001] The present invention relates to the field of electronic components, and specifically, to a circuit board assembly and a manufacturing method thereof. Background Art

[0002] With the development of 5G technology and the application of high-frequency and high-speed materials, electronic devices require larger and larger battery capacities. Therefore, the size of the circuit board and the available space are getting smaller and smaller. Especially with the increasing power consumption of the large-screen mobile phone screen, the mobile phone needs to further increase the battery capacity, thus further compressing the motherboard space. In addition, due to the increase in mobile phone functions, more electronic components need to be mounted on the motherboard to achieve more functions.

[0003] In the related art, a sandwich stacking structure is adopted to increase the layout space of the whole machine. For example, as Figure 1 shown, an Application Processor (AP) board 70 and a Radio Frequency (RF) board 71 are stacked by welding. The RF board 71 is electrically connected to the AP board 70 through a circuit board 72 with conductive vias, and an accommodation space is formed between the RF board 71 and the AP board 70. Electronic devices 80 are located on the upper surface of the RF board 71 and in the accommodation cavity. However, the space utilization of such a sandwich stacking structure is insufficient, resulting in the thickening of the motherboard. Summary of the Invention

[0004] An object of the present invention is to provide a new technical solution for a circuit board assembly and a manufacturing method thereof.

[0005] In an embodiment of the present invention, a circuit board assembly is provided. The circuit board assembly includes a substrate, the substrate includes multiple sub-boards stacked, a first conductive layer is provided between adjacent two sub-boards, conductive vias are provided in the sub-boards, and the conductive vias are electrically connected to the first conductive layer;

[0006] A first frame structure and a second frame structure are respectively and correspondingly provided on two opposite surfaces of the substrate,

[0007] A first circuit board, which covers the surface of the first frame structure on the side away from the substrate to form a first accommodation cavity; and

[0008] A second circuit board located on the side of the substrate away from the first circuit board, the second circuit board covers the surface of the second frame structure away from the substrate to form a second accommodation cavity;

[0009] The first circuit board, the substrate and the second circuit board are electrically connected, and the inner wall of the accommodation cavity can be used for mounting electronic components.

[0010] Optionally, the electronic component is mounted on the top wall and / or the side wall of the accommodation cavity.

[0011] Optionally, the frame structure further includes a first via hole penetrating in the thickness direction. Frame pads are formed on two opposite surfaces of the frame structure. The frame pads facing the substrate are electrically connected to the substrate respectively; the frame pads facing the first circuit board are soldered to the first circuit board, and the frame pads facing the second circuit board are soldered to the second circuit board.

[0012] Optionally, a support structure is further included between the frame structure and the substrate. The support structure has an avoidance space opposite to the accommodation cavity; a second via hole is formed in the support structure, and the second via hole can be used to fill conductive paste.

[0013] Optionally, the daughter board in contact with the support structure is further provided with daughter board pads. The daughter board pads are opposite to the second via holes and are communicated with the first via holes through the second via holes.

[0014] Optionally, the substrate has five layers of daughter boards, which are the first daughter board, the second daughter board, the third daughter board, the fourth daughter board and the fifth daughter board in sequence from the direction of the first circuit board to the direction of the second circuit board. The first daughter board is electrically connected to the first circuit board, the fifth daughter board is electrically connected to the second circuit board, and the third daughter board electrically connects the first and second daughter boards to the fourth and fifth daughter boards, so that the first circuit board is electrically connected to the second circuit board.

[0015] Optionally, a second conductive layer is provided on the part of the support structure and the frame structure located in the accommodation cavity. The second conductive layer is electrically connected to the first conductive layer.

[0016] In an embodiment of the present invention, a manufacturing method of a circuit board assembly is provided. The manufacturing method of the circuit board assembly includes: providing a substrate, the substrate having a plurality of stacked daughter boards, and electrical connections are formed between the daughter boards; frame structures are respectively provided on two opposite surfaces of the substrate; a first circuit board is covered on one side of the frame structure away from the substrate to enclose an accommodation cavity, and the first circuit board is electrically connected to the substrate; a second circuit board is covered on one side of the other frame structure away from the substrate to enclose another accommodation cavity, and the second circuit board, the substrate and the first circuit board are electrically connected; electronic components are mounted on the inner wall of the accommodation cavity.

[0017] Optionally, the method for manufacturing the circuit board assembly includes: providing a support plate, laminating the substrate and the support plate, opening holes in the support plate to form a support structure, and the support structure encloses an avoidance area; a second via hole is opened in the support plate, and the second via hole is electrically connected to the substrate.

[0018] Optionally, the circuit board assembly includes: providing a bottom plate, covering the bottom plate on the surface of the support structure away from the substrate; at a position on the bottom plate opposite to the second via hole, a first via hole penetrating along the thickness direction of the bottom plate is formed, and the first via hole is electrically connected to the second via hole; a second through hole is opened at a position on the bottom plate opposite to the avoidance area to form the frame structure, and the frame structure encloses the accommodation cavity, and the accommodation cavity is disposed opposite to the avoidance area.

[0019] With the structure of the circuit board assembly in the present invention, electrical connections can be achieved on both the upper and lower surfaces of the substrate 10, and accommodation cavities are formed on the upper and lower surfaces of the substrate 10, thereby increasing the space for mounting components. The components in the two accommodation cavities can be wired through the substrate 10, the first circuit board 30, and the second circuit board 40, thus also reducing the thickness of the circuit board assembly, increasing the wiring space, and maximizing the utilization of the internal space of the circuit board.

[0020] Other features and advantages of the present specification will become clear through the following detailed description of the exemplary embodiments of the present specification with reference to the accompanying drawings. Description of the Drawings

[0021] The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present specification, and together with the description are used to explain the principles of the present specification.

[0022] Figure 1 is a schematic diagram of the circuit board structure of the prior art;

[0023] Figure 2 is a schematic diagram of the circuit board structure in the embodiment of the present invention;

[0024] Figure 3 is a partial schematic diagram of the circuit board structure in the embodiment of the present invention;

[0025] Figure 4 is a partial schematic diagram of the circuit board structure in the embodiment of the present invention;

[0026] Figure 5 is a partial schematic diagram of the circuit board structure in the embodiment of the present invention;

[0027] Figure 6 is a partial schematic diagram of the circuit board structure in the embodiment of the present invention;

[0028] Figure 7 It is the fifth partial schematic diagram of the circuit board structure in the embodiment of the present invention;

[0029] Figure 8 It is the sixth partial schematic diagram of the circuit board structure in the embodiment of the present invention.

[0030] Explanation of reference numerals:

[0031] 10. Substrate; 11. Daughter board; 12. First conductive layer;

[0032] 20. Frame structure; 21. First via hole; 22. Bottom plate; 23. Second through hole;

[0033] 30. First circuit board;

[0034] 40. Second circuit board;

[0035] 50. Support structure; 51. Second via hole; 52. Avoidance area; 53. Support plate;

[0036] 61. Second conductive layer;

[0037] 70. AP board; 71. RF board; 72. Circuit board

[0038] 80. Electronic device; 81. First type of electronic component; 82. Second type of electronic component. Detailed implementation manners

[0039] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals indicate the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0040] The terms "first" and "second" in the description and claims of the present invention may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, the meaning of "a plurality" is two or more.

[0041] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0042] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] According to an embodiment of the present invention, a circuit board assembly is provided. The circuit board assembly includes a substrate 10, and the substrate 10 includes a plurality of sub-boards 11 stacked. A first conductive layer 12 is formed between two adjacent sub-boards 11, and conductive vias are formed in the sub-boards 11, and the conductive vias are electrically connected to the first conductive layer 12. Frame structures 20 are respectively provided corresponding to two opposite surfaces of the substrate 10. A first circuit board 30 is disposed on the surface of one frame structure 20 away from the substrate 10 to enclose a receiving cavity. A second circuit board 40 is located on the side of the substrate 10 away from the first circuit board 30, and the second circuit board 40 is disposed on the surface of the other frame structure 20 away from the substrate 10 to enclose another receiving cavity. The first circuit board 30, the substrate 10, and the second circuit board 40 are electrically connected, and the inner wall of the receiving cavity is configured to mount electronic components.

[0044] As Figure 2 shown, slots are provided on the upper and lower opposite surfaces of the substrate 10. The frame structures 20 are welded to the upper and lower surfaces of the substrate 10 and are electrically connected to the substrate 10. Frame pads are formed on the upper and lower surfaces of the substrate 10, and the frame structures 20 are welded to the frame pads. Slots can be provided in the substrate 10, and conductive materials can be filled in the slots, or the inner walls of the slots can be metallized. The inner walls of the slots can be metallized by means of deposition, sputtering, etc. A High Density Microvia and Buried Via Board (HighDensity Interconnector) is a high density interconnect board formed by the method of printed circuit board and is a circuit board with a relatively high circuit distribution density using the microvia and buried via technology.

[0045] For example, a first circuit board 30 is covered on a frame structure 20 on the upper surface of a substrate 10. The frame structure 20 is located between the first circuit board 30 and the substrate 10, and the substrate 10 is electrically connected to the first circuit board 30. The first circuit board 30, the substrate 10, and the frame structure 20 enclose a receiving space. A second circuit board 40 is covered on the frame structure 20 on the lower surface of the substrate 10. The frame structure 20 is located between the second circuit board 40 and the substrate 10, and the substrate 10 is electrically connected to the second circuit board 40. The second circuit board 40, the substrate 10, and the frame structure 20 enclose another receiving space. In this way, receiving cavities are formed on both the upper and lower surfaces of the substrate 10, and electronic components can be mounted on the inner walls of the receiving cavities. The electronic components in the receiving cavities can be conducted with the first circuit board 30 and / or the second circuit board 40 through the substrate 10 and the frame structure 20.

[0046] Through the structure of the circuit board assembly in the present invention, electrical connections can be realized on both the upper and lower surfaces of the substrate 10, and receiving cavities are formed on the upper and lower surfaces of the substrate 10, thereby increasing the space for mounting components. The components in the two receiving cavities can be wired through the substrate 10, the first circuit board 30, and the second circuit board 40, thus reducing the thickness of the circuit board assembly, increasing the wiring space, and improving the maximum utilization of the internal space of the circuit board.

[0047] As Figures 2 - 8 shown, the substrate 10 is a multi-layer sub-board 11, and the sub-board 11 is an insulating material, such as a polymer, for example, polypropylene, polyethylene, polyvinyl chloride, or polystyrene, etc. The multi-layer sub-boards 11 are connected by lamination. Before lamination, conductive vias can be formed on each layer of the sub-board 11 and metallized, or conductive paste can be added to the conductive vias to make them have the function of conducting electricity. Conductive paste, also known as electric compound grease, is an electrical engineering material. A first conductive layer 12 is formed between each layer of the sub-board 11. The first conductive layer 12 can be formed between each layer of the sub-board 11 through processes such as deposition and sputtering. The first conductive layer 12 can be made of materials such as copper, platinum, or nickel-gold. Each layer of the sub-board 11 is added with conductive paste through the conductive vias located therein, and the conductive paste and the first conductive layer 12 form an electrical connection during the lamination process.

[0048] In this way, the electronic components located on the upper and lower surfaces of the substrate 10 are electrically connected.

[0049] Optionally, as Figure 3 and Figure 4 shown, the electronic components are mounted on the top wall and / or the side wall of the receiving cavity.

[0050] For example, the inner walls of the first circuit board 30, the substrate 10, and the frame structure 20 enclose a receiving cavity. The top wall of the receiving cavity is the surface of the substrate 10 located inside the receiving cavity and the surface of the first circuit board 30 located inside the receiving cavity. Electronic components can be mounted on the surface of the first circuit board 30 located inside the receiving cavity, or can be mounted on the surface of the substrate 10 located inside the receiving cavity. In another receiving cavity, as described above, electronic components can be mounted on the surface of the second circuit board 40 located inside the receiving cavity, or can be mounted on the surface of the substrate 10 located inside the receiving cavity. It is also possible that the electronic components are mounted on the side walls of the frame structure 20. This can increase the utilization rate of the receiving cavity. It is also possible that the electronic components are mounted on both the top wall and the side walls of the receiving cavity, which can further improve the utilization rate of the receiving cavity.

[0051] In one example, the frame structure 20 further includes a first via 21 that penetrates in the thickness direction. The first via 21 forms frame pads on two opposite surfaces of the frame structure 20. The frame pads of the frame structure 20 facing the substrate 10 are electrically connected to the substrate 10 respectively;

[0052] The frame pads of the frame structure 20 facing the first circuit board 30 are soldered to the first circuit board 30, and the frame pads of the frame structure 20 facing the second circuit board 40 are soldered to the second circuit board 40.

[0053] As Figures 2 - 8 shown, the upper surface of the frame structure 20 is the surface on the side away from the substrate 10, and the lower surface of the frame structure 20 is the surface on the side close to the substrate 10. The first via 21 of the frame structure 20 is arranged in a direction perpendicular to the substrate 10. The first via 21 of the frame structure 20 forms frame pads on two opposite surfaces of the frame structure 20. The frame pad located on the side away from the substrate 10 is soldered to the first circuit board 30. For example, frame pads are provided on the first circuit board 30, and the frame pads of the frame structure 20 are connected to the frame pads of the first circuit board 30. The frame pad located on the side close to the substrate 10 is soldered to the substrate 10. In this way, an electrical connection is formed between the first circuit board 30 and the substrate 10. A second circuit board 40 is also provided between the substrate 10 on the side away from the first circuit board 30 and the substrate 10. A frame structure 20 is also formed on the second circuit board 40. A first via 21 is also formed on the frame structure 20. The side of the frame structure 20 close to the second circuit board 40 is soldered to the second circuit board 40 and forms an electrical connection. The side of the frame structure 20 close to the substrate 10 is soldered to the substrate 10 and forms an electrical connection. The electronic components located inside the receiving cavity are electrically connected through the substrate 10, the first circuit board 30, and the second circuit board 40.

[0054] In this way, the routing space is increased, enabling wiring on both the upper and lower surfaces of the substrate 10, thereby reducing the thickness of the overall circuit board assembly.

[0055] In one example, as Figure 6 and Figure 7 shown, it further includes a support structure 50 located between the frame structure 20 and the substrate 10. The support structure 50 has an avoidance space opposite to the accommodation cavity.

[0056] A second via 51 is formed in the support structure 50, and conductive paste is filled in the second via 51.

[0057] For example, in the prior art, a bottom plate 22 is stacked on the substrate 10, and the bottom plate 22 is an integral flat structure. Then, a second through hole 23 is formed by the method of depth-fixed grooving to form the frame structure 20. In order to ensure the reliability of the circuit board assembly and avoid damaging the substrate 10 during the depth-fixed grooving process of the bottom plate 22. The common practice is to increase the number of layers of the substrate 10 so that when the substrate 10 is accidentally touched, the preset effective number of layers of the substrate 10 can be retained. In this way, the thickness of the substrate 10 will increase, resulting in an increase in the thickness of the circuit board.

[0058] In this embodiment, a support structure 50 is further provided between the frame structure 20 and the substrate 10. The support structure 50 is welded to the substrate 10 and forms an electrical connection. The support structure 50 is used to support the upper frame structure 20. For example, the support structure 50 is a support plate 53 stacked on the substrate 10, and a first through hole is opened inside the support plate 53 to form the support structure 50. The first through hole is the avoidance space. When the bottom plate 22 is stacked on the support structure 50 and then the second through hole 23 is formed by the method of depth-fixed grooving, the avoidance space serves as the processing margin, avoiding the situation of accidental touch of the substrate 10. In this way, the thickness of the substrate 10 can be reduced. The volume of the mounting space is increased.

[0059] Optionally, the support structure 50 is arranged around the edge of the substrate 10. The support structure 50 is located between the frame structure 20 and the substrate 10. The projection range of the support structure 50 on the substrate 10 is located within the projection range of the frame structure 20 on the substrate 10. In this way, on the premise that the support structure 50 effectively supports the frame structure 20, the space of the accommodation cavity can be further increased.

[0060] For example, a second via 51 extending along the extension direction of the first via 21 of the frame structure 20 is formed in the support structure 50. One end of the second via 51 close to the substrate 10 is connected to the substrate 10, and one end of the second via 51 close to the frame structure 20 is connected to the frame structure 20.

[0061] In this way, not only can the damage to the substrate 10 be avoided during the processing of the frame structure 20, but also the number of layers of the substrate 10 can be reduced, thereby reducing the thickness of the overall circuit board assembly. At the same time, the avoidance space surrounded by the support structure 50 communicates with the accommodation space, increasing the space for mounting electronic components, and enabling the electronic components on the two surfaces on both sides of the substrate 10 to form an electrical connection through the substrate 10 and the frame structure 20.

[0062] Optionally, a groove is formed on the surface of the part of the substrate 10 located in the accommodation cavity. The groove communicates with the accommodation cavity and at least penetrates a sub-board 11 in the thickness direction. The first conductive layer 12 is located at the bottom of the groove, and the bottom of the groove is used for mounting the second type of electronic component 82. The first type of electronic component 81 is mounted in the accommodation cavity. The size of the first type of electronic component 81 is smaller than the size of the second type of electronic component 82.

[0063] In this way, the first type of electronic component 81 can be located in the accommodation cavity, and the second type of electronic component 82 can be located in the groove. By means of the communication between the groove and the accommodation cavity, the mounting space for electronic components is further increased, and the mounting position of the electronic components can be set according to the size of the electronic components, thereby increasing the utilization rate of the mounting space.

[0064] Optionally, the grooves on the side of the substrate 10 close to the first circuit board 30 and the grooves on the side of the substrate 10 close to the second circuit board 40 are arranged staggeredly.

[0065] In this way, small-sized electronic components can be mounted on the surface of the substrate 10 opposite to the grooves. By means of the staggered distribution of the grooves on both sides of the substrate 10, the density of the grooves can be increased, further increasing the mounting space.

[0066] For example, as Figures 2 - 8 shown, a sub-board 11 pad is also provided on the sub-board 11 in contact with the support structure 50. The sub-board 11 pad in contact with the support structure 50 is opposite to the second via 51 and communicates with the first via 21 through the second via 51.

[0067] As Figure 2 shown, the frame pad is opposite to the second via 51, the sub-board 11 pad is opposite to the second via 51 and the frame pad, the second via 51 is located between the frame pad and the sub-board 11 pad, and is electrically connected to the second via 51 and the frame pad.

[0068] For example, an insulating layer is formed on the upper surface of the substrate 10. The insulating layer covers the first conductive layer 12, and an opening is formed in the insulating layer to expose the first conductive layer 12 to form a sub-board 11 pad.

[0069] In this way, the stability of the electrical connection can be improved.

[0070] For example, the substrate 10 has five sub-boards 11. In the direction from the first circuit board 30 towards the second circuit board 40, they are the first sub-board 11, the second sub-board 11, the third sub-board 11, the fourth sub-board 11, and the fifth sub-board 11 in sequence. The first sub-board 11 is electrically connected to the first circuit board 30, the fifth sub-board 11 is electrically connected to the second circuit board 40, and the third sub-board 11 electrically connects the first and second sub-boards 11 to the fourth and fifth sub-boards 11, so that the first circuit board 30 and the second circuit board 40 form an electrical connection.

[0071] To form an electrical connection between the multiple sub-boards 11.

[0072] For example, a second conductive layer 61 is formed in the part of the support structure 50 and the frame structure 20 located in the accommodation cavity, and the second conductive layer 61 is electrically connected to the first conductive layer 12.

[0073] Such as Figure 4 As shown, a second conductive layer 61 is formed on the side wall of the frame structure 20 in the side wall of the frame structure 20 and the support structure 50 located in the accommodation cavity by the side plating process. The second conductive layer 61 and the first conductive layer 12 form an electrical connection. Electronic components are mounted on the side wall of the frame structure 20 through the second conductive layer 61. In this way, the mounting space is further increased.

[0074] According to an embodiment of the present invention, a manufacturing method of a circuit board assembly is further provided. The method includes providing a substrate 10, the substrate 10 having multiple sub-boards 11 arranged in a stacked manner, with an electrical connection formed between the sub-boards 11, and frame structures 20 are respectively arranged on two opposite surfaces of the substrate 10. A first circuit board 30 is covered on one side of a frame structure 20 away from the substrate 10 to enclose an accommodation cavity, and the first circuit board 30 is electrically connected to the substrate 10. A second circuit board 40 is covered on one side of the other frame structure 20 away from the substrate 10 to enclose another accommodation cavity, and the second circuit board 40, the substrate 10, and the first circuit board 30 are electrically connected. A first type of electronic component 81 is mounted on the inner wall of the accommodation cavity.

[0075] For example, such as Figure 5As shown, the substrate 10 includes a plurality of sub-boards 11 stacked on top of each other, and the plurality of sub-boards 11 are press-connected to each other. The electrical connection method between the sub-boards 11 is as described above. No repeated description will be given here. On the two surfaces of the substrate 10, two frame structures 20 are welded to the corresponding two sides of the substrate 10 by welding. The first circuit board 30 is welded to the surface of one frame structure 20 away from the substrate 10, and the second high-density micro blind buried via circuit board is welded to the surface of the other frame structure 20 away from the substrate 10, so as to form two accommodating cavities on both sides of the substrate 10. Electronic components can be welded to the inner wall of the accommodating cavity. For example, they can be mounted on the area of the substrate 10 located in the accommodating cavity or the area of the first circuit board 30 located in the accommodating cavity, and the surface of the first circuit board 30 on the side away from the accommodating cavity. They can also be mounted on the side wall of the frame structure 20.

[0076] In this way, the mounting space for components is increased. The components in the two accommodating cavities can be wired through the substrate 10, the first circuit board 30, and the second circuit board 40, thereby also reducing the thickness of the circuit board assembly, increasing the wiring space, and maximizing the utilization of the internal space of the circuit board.

[0077] Optionally, as Figure 7 and Figure 8 shown, the manufacturing method of the circuit board assembly further includes providing a support plate 53, with the substrate 10 and the support plate 53 stacked, and opening holes in the support plate 53 to form a support structure 50, and the support structure 50 encloses an avoidance area 52. A second via hole 51 is opened in the support plate 53, and the second via hole 51 is electrically connected to the substrate 10.

[0078] For example, the support plate 53 is a polypropylene plate. First, a first through hole and the second via hole 51 are opened in the support plate 53 by laser to form a support structure 50 with the second via hole 51, and conductive paste is filled in the second via hole 51. The support structure 50 with the second via hole 51 is pressed onto the substrate 10, and a bottom plate 22 is pressed on the side of the support structure 50 away from the substrate 10. A second through hole 23 is opened in the bottom plate 22, thus forming the support structure 50.

[0079] In this way, it can enable the support structure 50, the substrate 10, and the frame structure 20 to be tightly connected and form an electrical connection.

[0080] In one example, as Figure 2 、 Figure 7 and Figure 8As shown, a bottom plate 22 is provided, and the bottom plate 22 covers the surface of the support structure 50 on the side away from the substrate 10. At a position on the bottom plate 22 opposite to the second through hole 51, a first through hole 21 penetrating along the thickness direction of the bottom plate 22 is formed, and the first through hole 21 is electrically connected to the second through hole 51. A second through hole 23 is formed at a position on the bottom plate 22 opposite to the avoidance area 52 to form a frame structure 20. The frame structure 20 encloses a receiving cavity, and the receiving cavity is disposed opposite to the avoidance area 52.

[0081] The frame plate is made of polypropylene. A first through hole 21 penetrating along the thickness direction of the frame plate is formed in the frame plate by means of laser, and frame pads are formed on the upper and lower surfaces of the frame plate. The frame plate is laminated on the support structure 50 and pressed together with the support structure 50. The frame pads of the frame plate are opposite to and electrically connected to the second through holes 51 of the support structure 50. Then, a second through hole 23 is formed at a position opposite to the avoidance area 52 by means of deep grooving. A first circuit board 30 is connected to the frame structure 20, and the frame pads on the side away from the substrate 10 are soldered to the first circuit board 30. Of course, on the side of the substrate 10 opposite to the first circuit board 30, the second circuit board 40 and the frame structure 20 are also formed and electrically connected in the above manner.

[0082] In this way, damage to the substrate 10 can be avoided during the processing of the frame structure 20, and the number of layers of the substrate 10 can be reduced, thereby reducing the thickness of the overall circuit board assembly.

[0083] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0084] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that, Comprising: A substrate, the substrate includes multiple sub-boards arranged in a stacked manner, a first conductive layer is provided between two adjacent sub-boards, conductive vias are formed in the sub-boards, and the conductive vias are electrically connected to the first conductive layer; A first frame structure and a second frame structure are respectively and correspondingly provided on two opposite surfaces of the substrate; A first circuit board, the first circuit board is covered on the surface of the first frame structure away from the substrate side to enclose a first accommodation cavity; and A second circuit board located on the side of the substrate away from the first circuit board, the second circuit board is covered on the surface of the second frame structure away from the substrate to enclose a second accommodation cavity; The first circuit board, the substrate and the second circuit board are electrically connected, and the inner wall of the accommodation cavity can be used for mounting electronic components; A support structure, located between the frame structure and the substrate, the support structure has an avoidance space opposite to the accommodation cavity, a second through hole is formed in the support structure, and the second through hole can be used for filling conductive paste.

2. The circuit board assembly according to claim 1, characterized in that, The electronic components are mounted on the top wall and / or the side wall of the accommodation cavity.

3. The circuit board assembly according to claim 1, wherein The frame structure further includes a first through hole penetrating in the thickness direction, the first through hole forms frame pads on two opposite surfaces of the frame structure, and the frame pads facing the substrate are respectively electrically connected to the substrate; The frame pads facing the first circuit board are soldered to the first circuit board, and the frame pads facing the second circuit board are soldered to the second circuit board.

4. The circuit board assembly according to claim 3, characterized in that, The sub-board in contact with the support structure is further provided with sub-board pads, the sub-board pads are opposite to the second through hole and are communicated with the first through hole through the second through hole.

5. The circuit board assembly according to claim 1, wherein, The substrate has five layers of sub-boards, which are the first sub-board, the second sub-board, the third sub-board, the fourth sub-board and the fifth sub-board in sequence from the direction of the first circuit board towards the direction of the second circuit board. The first sub-board is electrically connected to the first circuit board, the fifth sub-board is electrically connected to the second circuit board, and the third sub-board electrically connects the first and second sub-boards to the fourth and fifth sub-boards, so that the first circuit board is electrically connected to the second circuit board.

6. The circuit board assembly according to claim 1, wherein, A second conductive layer is provided on the part of the support structure and the frame structure located in the accommodation cavity, and the second conductive layer is electrically connected to the first conductive layer.

7. A method for manufacturing a circuit board assembly according to any one of claims 1-6, characterized in that, Comprising: Providing a substrate, the substrate has multiple sub-boards arranged in a stacked manner, electrical connections are formed between the sub-boards, and frame structures are respectively provided on two opposite surfaces of the substrate; Covering a first circuit board on one side of a frame structure away from the substrate to enclose an accommodation cavity, and electrically connecting the first circuit board and the substrate; Covering a second circuit board on one side of the other frame structure away from the substrate to enclose another accommodation cavity, and electrically connecting the second circuit board, the substrate and the first circuit board; Mounting electronic components on the inner wall of the accommodation cavity; Providing a support plate, the substrate and the support plate are stacked, and openings are formed in the support plate to form a support structure, and the support structure encloses an avoidance area; A second through hole is formed in the support plate, and the second through hole is electrically connected to the substrate.

8. The manufacturing method of the circuit board assembly according to claim 7, wherein, Comprising: Providing a bottom plate, the bottom plate covering the surface of the support structure on the side away from the substrate; At a position on the bottom plate opposite to the second through hole, a first through hole penetrating along the thickness direction of the bottom plate is formed, and the first through hole is electrically connected to the second through hole; A second through hole is formed at a position on the bottom plate opposite to the avoidance area to form the frame structure, the frame structure enclosing the accommodation cavity, and the accommodation cavity is disposed opposite to the avoidance area.

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