Chip mounting equipment and chip mounting method for chip repair

Abstract

The present invention discloses a patch device and patch method for chip repair in the field of chip repair technology, comprising an installation box, a solder box is horizontally limited and slidably connected on the installation box, a tin-applying roller is fixedly connected to the part of the second rotating rod located in the solder box, a tin ball hole is provided on the tin-applying roller, a direct heat-planting bead screen is fixedly connected to the installation box, a driving device capable of driving the tin-applying roller to rotate is also provided on the installation box, a vibration device is also provided in the solder box, a vibration column is internally limited and slidably connected to the vibration box, impact blocks are provided at both ends of the vibration box, a cylindrical cam is slidably connected in the vibration column, the cylindrical cam is fixedly connected to the first rotating rod, a sliding column is fixedly connected to the vibration column and is limited and slidably connected to the cylindrical cam, and a transmission device capable of rotating the first rotating rod is also provided on the solder box. The present invention is not only efficient but also very convenient to use.

Description

Technical Field

[0001] The present invention relates to the technical field of chip repair, in particular to a chip mounting device and a chip mounting method for chip repair. Background Art

[0002] Currently, when performing chip repairs, the ball grid array (BGA) technology is a surface mount packaging technology used on integrated circuits. This technology is often used to permanently fix devices such as microprocessors. BGA packaging can provide more pins than other packages such as dual in-line packages or quad flat packages. The entire bottom surface of the device can be used as pins instead of only the surrounding area. It can also have a shorter average wire length than the surrounding limited package type, so as to have better high-speed performance. Soldering BGA packaged devices requires precise control and is usually completed by factory equipment with automated procedures. BGA packaged devices are not suitable for socket fixing.

[0003] However, different from the packaging technology used in production, most factories still rely on manual chip packaging during maintenance due to the high cost of use. However, when packaging manually, solder beads need to be soldered on the solder joint pins one by one. Since the chips are small, most of them are within a few centimeters in diameter, and some microprocessors are even within one centimeter. Therefore, their pins are very small, and it is difficult to observe the solder joints with the naked eye. At the same time, it is difficult to weld, and it is easy to have problems such as leaking solder, too much solder on a single solder joint, and low solder quality. At the same time, welding one solder joint at a time is inefficient. In addition, there is also a direct heat bead planting net to assist welding. The solder beads are poured into the grid of the direct heat bead planting net. The grid limits the movement of the solder beads to achieve the effect of controlling accuracy. However, the direct heat bead planting net must be manually fixed and is prone to offset, resulting in misalignment with the solder joint pins. At the same time, the tiny solder beads cannot be accurately poured into the mesh holes of each direct heat bead planting net, and need to be placed one by one, which is inefficient.

[0004] Based on this, the present invention designs a chip mounting device and a chip mounting method for chip repair to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a chip mounting device and a chip mounting method for chip repair, so as to solve the problems of low welding efficiency, easy to cause welding leakage and excessive soldering of a single welding point in the prior art mentioned in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a chip mounting device and chip mounting method for chip repair, comprising an installation box, a solder box is horizontally limited and slidably connected to the installation box, a rotating rod 2 is rotatably connected to the solder box, a tin-applying roller is fixedly connected to the part of the rotating rod 2 located in the solder box, a tin-applying roller is provided with a tin ball hole, a direct heat-embedded bead-embedded mesh plate is fixedly connected to the installation box, the tin-applying roller is rotatably connected to the upper surface of the direct heat-embedded bead-embedded mesh plate, a driving device capable of driving the tin-applying roller to rotate is also provided on the installation box, a vibration device is also provided in the solder box, and the The vibration device includes a vibration box fixedly connected to the inner wall of the solder box, the internal limiting sliding connection of the vibration box is connected to a vibration column, both ends of the interior of the vibration box are provided with impact blocks, a cylindrical cam is slidably connected to the vibration column, the cylindrical cam is fixedly connected to a rotating rod, a sliding column is fixedly connected to the vibration column and is limited and slidably connected to the cylindrical cam, the solder box is also provided with a transmission device that can rotate the rotating rod, a partition is slidably connected to the solder box, a screw four is threadedly connected to the partition, the screw four is limited and rotatably connected to the solder box, and a screw one is threadedly connected to the mounting box.

[0007] As a further solution of the present invention, the solder box is also provided with a flux applying device, which includes a sliding rod that is limitedly slidably connected to the solder box, the lower end of the sliding rod is fixedly connected to a liquid box, the liquid box slides on the solder box, the lower end of the liquid box is connected to a liquid discharge pipe, the lower end of the liquid discharge pipe is provided with a sponge, the liquid box is provided with a liquid replenishing port, and the solder box is also provided with a pushing device that can drive the liquid box to reciprocate up and down.

[0008] As a further solution of the present invention, the pushing device includes a push rod horizontally limited and slidably connected to the solder box, the installation box is fixedly connected to a wavy convex tooth plate that can intermittently push the push rod to move away from the installation box, the outer wall of the push rod is provided with a spring that can reset the push rod toward the direction of the wavy convex tooth plate, the lower side of the push rod is fixedly connected to a wedge block 1, the liquid box is fixedly connected to a wedge block 2, and the outer wall of the sliding rod is provided with a spring that can move the sliding rod upward.

[0009] As a further solution of the present invention, the pushing device also includes a feeding device, which includes a liquid squeezing plate that is limitedly slidably connected in the liquid box, a screw rod 2 is slidably connected to the liquid box, the screw rod 2 is fixedly connected to the liquid squeezing plate, a spline is fixedly connected to the upper end of the screw rod 2, the solder box is upper limit rotatably connected to a rotating rod 2, and the end of the push rod close to the screw rod 2 is fixedly connected to a rack 2, and the rack 2 is meshed with the rotating rod 2.

[0010] As a further solution of the present invention, a placement plate is slidably connected to the upper and lower limit positions inside the installation box, a top block is fixedly connected to the lower surface of the placement plate, a screw rod three is threadedly connected to the installation box, one end of the screw rod three located in the installation box is rotatably connected to a wedge block three, and the wedge block three is horizontally slidably connected to the inner wall of the installation box.

[0011] As a further solution of the present invention, the driving device includes a slot opened on the mounting box, a rack 1 is fixedly connected in the slot, a gear 1 meshing with the rack 1 is provided at one end of the rotating rod 2 close to the slot, and no convex teeth are provided at the end of the rack 1 away from the solder box.

[0012] As a further solution of the present invention, the transmission device includes a driving wheel fixedly connected to the second rotating rod, and a passive wheel fixedly connected to the first rotating rod, and the passive wheel and the driving wheel are connected to each other through a synchronous belt.

[0013] As a further solution of the present invention, the specific steps of the method for using the patch equipment for chip repair are as follows:

[0014] Step 1: Put solder beads into the solder box, put the chip under the direct heat bead planting stencil and close to the lower surface of the direct heat bead planting stencil, then push the solder box to slide on the installation box, the driving device will drive the second rotating rod to rotate, the second rotating rod will drive the tin roller to rotate, when the tin roller rotates, the solder beads in the solder box will fall into the tin ball hole, and then with the rotation of the tin roller, the solder box will be taken out and fall into the mesh of the direct heat bead planting stencil from the bottom of the solder box;

[0015] Step 2: While the solder box is moving, the pushing device will push the push rod to continuously move toward the side away from the wave convex tooth plate, so that the wedge block 1 can continuously push the wedge block 2 to move downward, so that the wedge block 2 can push the liquid box to slide downward on the solder box through the slide rod. At the same time, the liquid box will slide upward again under the reset action of the spring on the slide rod, so that it can continuously slide up and down, so that the flux in the liquid box can flow to the sponge through the liquid discharge pipe, and then continuously touch the solder joint pins of the chip through the sponge;

[0016] Step three: The transmission device can drive the rotating rod 1 to rotate, so that the rotating rod 1 drives the cylindrical cam to rotate in the vibration column, so that the cylindrical cam will drive the sliding column to reciprocate in the vibration box, so that the sliding column drives the vibration column to reciprocate rapidly in the vibration box, so that the vibration column can continuously hit the impact block, thereby realizing the vibration function, promoting the solder beads to fall into the solder ball holes, and the solder beads to fall into the mesh holes of the direct heat bead planting mesh plate.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. This technology manually drives the solder box to rotate, and drives the tin roller to rotate through a driving device, so as to place solder beads in the mesh holes of each directly heatable bead-planting stencil, and place only one solder bead, thereby reducing the problems of solder joint pin leakage and excessive soldering of a single solder joint pin. At the same time, it is more convenient than manual use and has a simple structure. In addition, a vibration device is provided, which not only promotes the solder beads to fall into the tin ball holes, but also ensures that there are solder beads in each directly heatable bead-planting stencil, further reducing the possibility of solder leakage, and at the same time, the solder beads falling into the directly heatable bead-planting stencil can be attached to the solder joint pins of the chip, thereby ensuring that the solder can be soldered to the solder joint pins during welding, thereby ensuring the welding effect.

[0019] 2. The function of squeezing out the flux in the liquid box can be realized through the pushing device. When the solder beads are put into the direct heating bead planting stencil through the solder ball hole, since the flux is liquid, its surface liquid tension can slightly pull the solder beads, which is conducive to the solder beads falling into the direct heating bead planting stencil, and can promote the effect of the vibration device to prevent solder beads.

[0020] 3. The placement board can cooperate with the direct heat bead planting stencil to clamp the chip so that it will not be offset due to mechanical vibration, thereby ensuring that the solder point pins are aligned with the mesh holes of the direct heat bead planting stencil, ensuring the accuracy of solder bead placement, and at the same time being suitable for chips of different thicknesses. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a structural schematic diagram of the present invention from the left side viewing angle;

[0024] Figure 3 For the present invention Figure 1 Schematic diagram of right view in state;

[0025] Figure 4 It is a schematic diagram of the connection structure between the solder box and the tinning roller of the present invention;

[0026] Figure 5 It is a schematic diagram of the internal structure of the liquid box of the present invention;

[0027] Figure 6 It is a structural schematic diagram of the tinning roller of the present invention;

[0028] Figure 7 This is a schematic diagram of the internal structure of the vibration box of the present invention;

[0029] Figure 8 The present invention is a flowchart of the steps of the method.

[0030] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0031] 01. Installation box; 02. Solder box; 03. Screw rod 1; 04. Placement plate; 05. Direct heat bead planting screen; 06. Slotting; 07. Rack rod 1; 08. Gear rod 1; 09. Synchronous belt; 10. Wave convex tooth plate; 11. Push rod; 12. Sliding rod; 13. Liquid box; 14. Liquid discharge pipe; 15. Screw rod 2; 16. Spline; 17. Rack rod 2; 18. Wedge block 1; 19. Wedge block 2; 20. Partition plate; 21. Screw rod 3; 22. Passive wheel; 23. Screw rod 4; 24. Wedge block 3; 25. Top block; 26. Liquid filling port; 27. Sponge; 28. Rotating rod 1; 29. ​​Tinning roller; 30. Liquid squeezing plate; 31. Rotating rod 2; 32. Tin ball hole; 33. Vibration box; 34. Impact block; 35. Cylindrical cam; 36. Vibration column; 37. Sliding column; 38. Driving wheel. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figures 1 to 8The present invention provides a technical solution: a patch device for chip repair and a patch method thereof, comprising an installation box 01, a solder box 02 is horizontally limited and slidably connected to the installation box 01, a rotating rod 31 is rotatably connected to the solder box 02, a tin roller 29 is fixedly connected to the part of the rotating rod 31 located in the solder box 02, a tin ball hole 32 is opened on the tin roller 29, a direct heat implanting screen 05 is fixedly connected to the installation box 01, the tin roller 29 is rollingly connected to the upper surface of the direct heat implanting screen 05, a driving device capable of driving the tin roller 29 to rotate is also provided on the installation box 01, and a vibration device is also provided in the solder box 02, the vibration device includes a fixed A vibration box 33 is connected to the inner wall of the solder box 02, and a vibration column 36 is slidably connected inside the vibration box 33. Impact blocks 34 are provided at both ends of the interior of the vibration box 33. A cylindrical cam 35 is slidably connected inside the vibration column 36. The cylindrical cam 35 is fixedly connected to a rotating rod 28. A sliding column 37 is fixedly connected to the vibration column 36 and is slidably connected to the cylindrical cam 35. The solder box 02 is also provided with a transmission device that can rotate the rotating rod 28. A partition 20 is slidably connected to the solder box 02, and a screw rod 23 is threadedly connected to the partition 20. The screw rod 23 is rotatably connected to the solder box 02 in an upper limit position, and a screw rod 03 is threadedly connected to the mounting box 01.

[0034] Place the chip close to the lower surface of the direct heat implantable bead stencil 05 and align its solder joint pins with the grid holes of each direct heat implantable bead stencil 05, and rotate the screw 03. Since the screw 03 and the installation box 01 are threadedly connected, the screw 03 can drive the solder box 02 to slide back and forth on the installation box 01. Figure 1As shown, when the screw rod 1 03 is rotated to make the solder box 02 slide from left to right, the driving device will drive the rotating rod 2 31 to rotate, and when the rotating rod 21 rotates, it will drive the tin roller 29 to rotate. As the tin roller 29 rotates continuously, the solder beads in the solder box 02 can continuously fall into the tin ball holes 32, and as the tin roller 29 rotates, it reaches the lower end of the solder box 02, and then falls into the grid holes of the direct heat bead implanting stencil 05, and each direct heat bead implanting stencil 05 has only one. As the solder box 02 continues to move from left to right, the tin roller 29 can also rotate continuously, thereby continuously placing the solder beads into the direct heat bead implanting stencil 05, thereby ensuring that each direct heat bead implanting stencil 05 has solder beads, until the solder box 02 moves to the rightmost end. After the placement of the solder beads is completed, the hot air is used to The gun directly heats the top of the direct heat bead implanting stencil 05, so that the solder beads can be heated and melted, and then welded to the solder point pins of the chip, and then the chip is placed on the circuit board, and then the hot air gun is used for welding to complete the function of welding the chip to the circuit board; when the solder beads are placed in the solder box 02, the transmission device will also drive the rotating rod 28 to rotate, so that the rotating rod 28 drives the cylindrical cam 35 to rotate in the vibration column 36, so that the cylindrical cam 35 will drive the sliding column 37 to reciprocate in the vibration box 33, so that the sliding column 37 drives the vibration column 36 to reciprocate rapidly in the vibration box 33, so that the vibration column 36 can continuously hit the impact block 34, thereby realizing the vibration function, promoting the solder beads to fall into the solder ball holes 32, and the solder beads to fall into the mesh separation holes of the direct heat bead implanting stencil 05;

[0035] By rotating the screw 03 to make the solder box 02 slide on the installation box 01, the solder box 02 can be moved forward at a uniform speed, thereby ensuring that the solder beads in the solder box 02 have sufficient time to fall into the tin ball holes 32, and the solder beads in the tin ball holes 32 have sufficient time to fall into the directly heated bead implanting stencil 05, thereby ensuring that there are solder beads in each directly heated bead implanting stencil 05, thereby ensuring the welding effect. At this time, the structure is simple and the cost of use is low. When implementing the tin ball holes 32, it is necessary to make their diameter slightly larger than the diameter of the solder beads, and at the same time, it is necessary that the number of its arrays in the direction perpendicular to the movement direction of the solder box 02 is consistent with the number of mesh holes of the directly heated bead implanting stencil 05 in the direction perpendicular to the movement direction of the solder box 02 and the intervals are equal, and the upper tin roller 29 rotates the upper tin roller 29 arc length of the two tin ball holes 32 interval angle, which is parallel to the movement of the directly heated bead implanting stencil 05 in the solder box 02. The intervals between two adjacent direct heat bead implanting stencils 05 in the moving direction are equal, so as to ensure that with the rotation of the tin roller 29 and the movement of the solder box 02 from left to right, there is only one solder bead in each direct heat bead implanting stencil 05, and the solder box 02 can slide in the installation box 01 by setting two rectangular sliding rods on both sides. The rectangular limiting rods can ensure that the solder box 02 will not slide when sliding, so as to ensure that the solder ball hole 32 can be aligned with the direct heat bead implanting stencil 05; in addition, the direct heat bead implanting stencil 05 can limit each The solder beads falling into the grid of the direct heat bead planting stencil 05 can separate each solder bead. Firstly, it can ensure that each solder bead is aligned with its solder joint pin. Secondly, mechanical vibration will not cause the solder bead to roll and thus detach from the solder joint pin, which is beneficial to welding. The solder beads are placed by rotating the tin roller 29 and moving the solder box 02. Compared with manual placement, not only is the efficiency greatly improved, but also it is ensured that there is a solder bead in each direct heat bead planting stencil 05, and there is only one solder bead, so that no leakage occurs during welding. In addition, a vibration device is provided. When the solder box 02 moves, the transmission device drives the rotating rod 28 to rotate, so that the vibration column 36 continuously hits the block 34, thereby realizing the vibration function, thereby transmitting the vibration to the solder box 02, thereby promoting the solder beads in the solder box 02 to fall into the solder ball holes 32, so that each solder ball hole 32 has a solder bead, ensuring that there will be no leakage during welding, and because the tin roller 29 is rollingly connected to the direct heat bead planting mesh plate 05 The upper surface, so that the vibration will also be transmitted to the direct heat bead implanting stencil 05, so that the solder beads falling on the direct heat bead implanting stencil 05 will not stay on the edge of the grid hole of the direct heat bead implanting stencil 05, but will fall on the solder point pins of the chip, so as to ensure that the solder beads can melt on the solder point pins during welding, so as to ensure that there is solder on each solder point pin, so as to ensure that there will be no leakage; in addition, the vibration achieved by the reciprocating motion of the vibration column 36 is a vibration in the horizontal direction, which is not easy to make the solder beads falling into the direct heat bead implanting stencil 05 be ejected by the vibration;In addition, when the screw rod 23 is rotated, the partition 20 can be driven to slide on the solder box 02, so that the partition 20 can cover part of the solder ball hole 32 or cover it completely, so as to meet the use requirements of chips of different sizes, and facilitate the solder box 02 to reset without pouring the solder ball into the direct heat implantable bead stencil 05. ;

[0036] The present technology drives the solder box 02 to rotate manually, and drives the tinning roller 29 to rotate through a driving device, so as to place solder beads in the mesh holes of each directly heatable bead-embedded stencil 05, and only one solder bead is placed, thereby reducing the problems of solder leakage of solder joint pins and excessive soldering of a single solder joint pin. At the same time, it is more convenient than manual use and has a simple structure. In addition, a vibration device is provided, which can not only promote the solder beads to fall into the tin ball holes 32, ensuring that there are solder beads in each directly heatable bead-embedded stencil 05, further reducing the possibility of solder leakage, but also enable the solder beads falling into the directly heatable bead-embedded stencil 05 to stick to the solder joint pins of the chip, thereby ensuring that the solder can be welded to the solder joint pins during welding, thereby ensuring the welding effect.

[0037] As a further solution of the present invention, a flux applying device is also provided on the solder box 02, and the flux applying device includes a sliding rod 12 which is limitedly slidably connected to the solder box 02, and the lower end of the sliding rod 12 is fixedly connected to a liquid box 13, the liquid box 13 slides on the solder box 02, and the lower end of the liquid box 13 is connected to a liquid discharge pipe 14, and the lower end of the liquid discharge pipe 14 is provided with a sponge 27, and a liquid replenishing port 26 is provided on the liquid box 13. The solder box 02 is also provided with a pushing device which can drive the liquid box 13 to reciprocate up and down.

[0038] Participation Figure 5 The pushing device can drive the liquid box 13 to move up and down. When the liquid box 13 moves up and down, the liquid box 13 can drive the liquid discharge tube 14 to move up and down at the same time. The liquid discharge tube 14 will drive the sponge 27 to move up and down continuously, so that the liquid discharge tube 14 can drive the sponge 27 to pass through the grid holes of the direct heat bead implanting mesh board 05 and squeeze on the solder joint pins of the chip, so that the flux can be applied to the solder joint pins. The flux can improve the progress of welding, which is beneficial to the formation of solder joints and improves the welding effect. At the same time, the liquid box 13 is arranged in front of the solder box 02 in the forward direction. Therefore, the flux will be applied before the solder bead is placed. After applying, when the solder bead is placed into the direct heat bead implanting mesh board 05 by the solder ball hole 32, since the flux is liquid, its surface liquid tension can slightly pull the solder bead, which is beneficial to the solder bead falling into the direct heat bead implanting mesh board 05, and can promote the effect of the vibration device to prevent solder beads.

[0039] As a further solution of the present invention, the pushing device includes a push rod 11 horizontally limited and slidably connected to the solder box 02, a wavy convex tooth plate 10 is fixedly connected to the installation box 01 and can intermittently push the push rod 11 to move away from the installation box 01, the outer wall of the push rod 11 is provided with a spring that can reset the push rod 11 toward the wavy convex tooth plate 10, the lower side of the push rod 11 is fixedly connected with a wedge block 18, the liquid box 13 is fixedly connected with a wedge block 2 19, and the outer wall of the slide rod 12 is provided with a spring that can move the slide rod 12 upward.

[0040] Can be combined Figure 1 and Figure 5 When the push rod 11 moves from left to right, the wave convex tooth plate 10 can continuously push the push rod 11 to move in the direction away from the wave convex tooth plate 10, and the push rod 11 will drive the wedge block 18 to move at the same time, so the wedge block 18 will push the wedge block 2 19 to move downward, and the wedge block 2 19 will push the liquid box 13 to slide downward on the solder box 02 through the slide rod 12, so that the liquid box 13 will drive the liquid discharge tube 14 to drive the sponge 27 to move downward. At the same time, the spring on the push rod 11 can make the push rod 11 reset in the direction close to the wave convex tooth plate 10, and the spring on the slide rod 12 can reset the liquid box 13 upward, so that the liquid box 13 can continuously realize reciprocating up and down movement with the advancement of the solder box 02, so that flux can be applied to each solder joint pin.

[0041] As a further solution of the present invention, the pushing device also includes a feeding device, which includes a liquid squeezing plate 30 that is limitedly slidably connected in the liquid box 13, a screw 2 15 is slidably connected to the liquid box 13, the screw 2 15 is fixedly connected to the liquid squeezing plate 30, a spline 16 is fixedly connected to the upper end of the screw 2 15, the solder box 02 is upper limit rotatably connected to a rotating rod 2 31, and one end of the push rod 11 close to the screw 2 15 is fixedly connected to a rack 2 17, and the rack 2 17 is meshed with the rotating rod 2 31.

[0042] When the push rod 11 reciprocates, it will also drive the rack 2 17 to reciprocate, and the reciprocating motion of the rack 2 17 will drive the rotating rod 2 31 to rotate. Due to the characteristics of the rotating rod 2 31, the spline 16 will only be driven to rotate in one direction. When the rack 2 17 moves in the direction away from the wave convex tooth plate 10, it will drive the rotating rod 2 31 to rotate, and the rotating rod 2 31 will drive the spline 16 to rotate, and the spline 16 will drive the screw 2 15 to rotate. Since the screw 2 15 is threadedly connected to the liquid box 13, the screw 2 15 can drive the liquid squeezing plate 30 to slide downward in the liquid box 13, thereby squeezing the flux in the liquid box 13 to flow downward into the sponge 27. When the rack 2 17 moves in the direction close to the wave convex tooth plate 10, the rotating rod 2 31 will not drive the spline 16 to rotate when it rotates, thereby realizing the unidirectional rotation of the spline 16, ensuring that when applying solder, there is flux on each solder joint pin and the application is even.

[0043] As a further solution of the present invention, a placement plate 04 is connected to the upper and lower limit sliding inside the installation box 01, a top block 25 is fixedly connected to the lower surface of the placement plate 04, a screw rod 3 21 is threadedly connected to the installation box 01, one end of the screw rod 3 21 located inside the installation box 01 is connected to a wedge block 3 24 for limited rotation, and the wedge block 3 24 is horizontally connected to the inner wall of the installation box 01 for limited sliding.

[0044] Place the chip upside down on the placement board 04, with the solder pins facing the lower surface of the direct heat implantable bead screen 05, so that the solder pins are aligned with the mesh holes of the direct heat implantable bead screen 05, and then rotate the screw rod 3 21, the screw rod 3 21 will move on the installation box 01 to the installation box 01, thereby driving the wedge block 3 24 to move at the same time, the wedge block 3 24 will push the top block 25 to move forward, so that the top block 25 will push the placement board 04 to move upward;

[0045] The placement plate 04 can cooperate with the direct heat bead implanting stencil 05 to clamp the chip so that it will not be offset due to mechanical vibration, thereby ensuring that the solder point pins are aligned with the mesh holes of the direct heat bead implanting stencil 05, ensuring the accuracy of solder bead placement, and being suitable for chips of different thicknesses.

[0046] As a further solution of the present invention, the driving device includes a slot 06 opened on the installation box 01, a rack 07 is fixedly connected in the slot 06, a gear 08 meshing with the rack 07 is provided at one end of the rotating rod 31 close to the slot 06, and no convex teeth are provided at the end of the rack 07 away from the solder box 02.

[0047] See also Figure 7 When the solder box 02 moves to the right, it can drive the rotating rod 2 31 to move at the same time, and the rotating rod 2 31 will drive the gear 1 08 to move at the same time. Since the gear 1 08 and the rack 1 07 are meshed, the gear 1 08 will rotate, thereby realizing the function of driving the rotating rod 2 31 to rotate.

[0048] As a further solution of the present invention, the transmission device includes a driving wheel 38 fixedly connected to the second rotating rod 31, and a driven wheel 22 fixedly connected to the first rotating rod 28, and the driven wheel 22 and the driving wheel 38 are connected to each other through a synchronous belt 09.

[0049] When the rotating rod 2 31 rotates, it will also drive the push rod 11 to rotate. When the push rod 11 rotates, it will drive the passive wheel 22 to rotate through the synchronous belt 09. When the passive wheel 22 rotates, it will drive the rotating rod 1 28 to rotate, thereby realizing the function of driving the rotating rod 1 28 to rotate. In addition, the diameter of the push rod 11 is larger than that of the passive wheel 22, which can increase the transmission ratio, thereby increasing the rotation speed of the rotating rod 1 28, thereby increasing the movement speed of the vibration column 36.

[0050] As a further solution of the present invention, the specific steps of the method for using the patch equipment for chip repair are as follows:

[0051] Step 1: Put solder beads into the solder box 02, put the chip under the direct heat bead planting stencil 05 and close to the lower surface of the direct heat bead planting stencil 05, then push the solder box 02 to slide on the installation box 01, the driving device will drive the second rotating rod 31 to rotate, the second rotating rod 31 will drive the tin roller 29 to rotate, when the tin roller 29 rotates, the solder beads in the solder box 02 will fall into the tin ball hole 32, and then with the rotation of the tin roller 29, the solder box 02 is taken out and falls from the bottom of the solder box 02 into the mesh of the direct heat bead planting stencil 05;

[0052] Step 2: While the solder box 02 is moving, the pushing device will push the push rod 11 to continuously move toward the side away from the wave convex tooth plate 10, so that the wedge block 18 can continuously push the wedge block 2 19 to move downward, so that the wedge block 2 19 can push the liquid box 13 to slide downward on the solder box 02 through the slide rod 12. At the same time, under the reset action of the spring on the slide rod 12, the liquid box 13 will slide upward again, thereby continuously sliding up and down, so that the solder flux in the liquid box 13 can flow to the sponge 27 through the liquid discharge pipe 14, and then continuously touch the solder joint pins of the chip through the sponge 27;

[0053] Step 3: The transmission device can drive the rotating rod 28 to rotate, so that the rotating rod 28 drives the cylindrical cam 35 to rotate in the vibration column 36, so that the cylindrical cam 35 will drive the sliding column 37 to reciprocate in the vibration box 33, so that the sliding column 37 drives the vibration column 36 to reciprocate rapidly in the vibration box 33, so that the vibration column 36 can continuously impact the impact block 34, thereby realizing the vibration function, promoting the solder beads to fall into the solder ball holes 32, and the solder beads to fall into the mesh holes of the direct heat implantable mesh plate 05.

Claims

1. A chip mounting device for chip repair, comprising a mounting box (01), characterized in that: The installation box (01) is horizontally limited and slidably connected to a solder box (02), the solder box (02) is rotatably connected to a second rotating rod (31), the part of the second rotating rod (31) located inside the solder box (02) is fixedly connected to a tinning roller (29), the tinning roller (29) is provided with a tin ball hole (32), the installation box (01) is fixedly connected to a direct heat bead implanting screen (05), the tinning roller (29) is rollingly connected to the upper surface of the direct heat bead implanting screen (05), the installation box (01) is also provided with a driving device capable of driving the tinning roller (29) to rotate, the solder box (02) is also provided with a vibration device, the vibration device comprises a vibration box (33) fixedly connected to the inner wall of the solder box (02), the vibration box (33) ) is slidably connected to a vibration column (36) in a limited position, both ends of the vibration box (33) are provided with impact blocks (34), a cylindrical cam (35) is slidably connected to the vibration column (36), the cylindrical cam (35) is fixedly connected to the rotating rod (28), a sliding column (37) is fixedly connected to the vibration column (36) and is slidably connected to the cylindrical cam (35), a transmission device capable of rotating the rotating rod (28) is also provided on the solder box (02), a partition (20) is slidably connected to the solder box (02), a screw rod four (23) is threadedly connected to the partition (20), the screw rod four (23) is slidably connected to the solder box (02), and a screw rod one (03) is threadedly connected to the mounting box (01); The solder box (02) is also provided with a solder flux coating device, the solder flux coating device comprises a sliding rod (12) which is limitedly slidably connected to the solder box (02), the lower end of the sliding rod (12) is fixedly connected to a liquid box (13), the liquid box (13) slides on the solder box (02), the lower end of the liquid box (13) is connected to a liquid discharge pipe (14), the lower end of the liquid discharge pipe (14) is provided with a sponge (27), the liquid box (13) is provided with a liquid replenishing port (26), and the solder box (02) is also provided with a driving device capable of driving the liquid box (13) to perform up and down reciprocating motion; The pushing device comprises a push rod (11) horizontally limited and slidably connected to the solder box (02); a wave-shaped convex tooth plate (10) is fixedly connected to the installation box (01) and can intermittently push the push rod (11) to move in a direction away from the installation box (01); the outer wall of the push rod (11) is provided with a spring that can reset the push rod (11) in the direction of the wave-shaped convex tooth plate (10); the lower side of the push rod (11) is fixedly connected with a wedge block 1 (18); the liquid box (13) is fixedly connected with a wedge block 2 (19); and the outer wall of the slide rod (12) is provided with a spring that can move the slide rod (12) upward.

2. A chip mounting device for chip repair according to claim 1, characterized in that: The pushing device also includes a feeding device, which includes a liquid squeezing plate (30) that is limitedly slidably connected in the liquid box (13), a second screw (15) that is slidably connected to the liquid box (13), the second screw (15) being fixedly connected to the liquid squeezing plate (30), a spline (16) being fixedly connected to the upper end of the second screw (15), a second rotating rod (31) that is limitedly rotatably connected to the solder box (02), and a second rack (17) that is fixedly connected to one end of the push rod (11) close to the second screw (15), the second rack (17) being meshed with the second rotating rod (31).

3. The chip mounting device for chip repair according to claim 1, characterized in that: The installation box (01) is internally connected to a placement plate (04) in an upper and lower limited sliding manner, and a top block (25) is fixedly connected to the lower surface of the placement plate (04). The installation box (01) is threadedly connected to a screw rod three (21), and one end of the screw rod three (21) located in the installation box (01) is connected to a wedge block three (24) in a limited rotation manner. The wedge block three (24) is horizontally connected to the inner wall of the installation box (01) in a limited sliding manner.

4. The chip mounting device for chip repair according to claim 1, characterized in that: The driving device comprises a slot (06) formed on the mounting box (01), a rack (07) being fixedly connected in the slot (06), a gear (08) meshing with the rack (07) being provided at one end of the rotating rod (31) close to the slot (06), and no protruding teeth being provided at one end of the rack (07) away from the solder box (02).

5. The chip mounting device for chip repair according to claim 1, characterized in that: The transmission device comprises a driving wheel (38) fixedly connected to the second rotating rod (31), and a driven wheel (22) fixedly connected to the first rotating rod (28), wherein the driven wheel (22) and the driving wheel (38) are connected in transmission via a synchronous belt (09).

6. A method for using a chip mounting device for chip repair, applicable to a chip mounting device for chip repair according to any one of claims 1 to 5, characterized in that: The specific steps are as follows: Step 1: Place solder beads in the solder box (02), place the chip under the direct heat bead implanting stencil (05) and close to the lower surface of the direct heat bead implanting stencil (05), then push the solder box (02) to slide on the installation box (01), the driving device will drive the second rotating rod (31) to rotate, the second rotating rod (31) will drive the tinning roller (29) to rotate, when the tinning roller (29) rotates, the solder beads in the solder box (02) will fall into the tin ball hole (32), and then with the rotation of the tinning roller (29), the solder box (02) will be taken out and fall from the bottom of the solder box (02) into the mesh of the direct heat bead implanting stencil (05); Step 2: While the solder box (02) is moving, the pushing device will push the push rod (11) to continuously move toward the side away from the wave convex tooth plate (10), so that the wedge block 1 (18) can continuously push the wedge block 2 (19) to move downward, so that the wedge block 2 (19) can push the liquid box (13) to slide downward on the solder box (02) through the slide rod (12). At the same time, under the reset action of the spring on the slide rod (12), the liquid box (13) will slide upward again, thereby continuously sliding up and down, so that the soldering flux in the liquid box (13) can flow to the sponge (27) through the liquid discharge pipe (14), and then continuously touch the soldering pins of the chip through the sponge (27); Step 3: The transmission device can drive the rotating rod 1 (28) to rotate, so that the rotating rod 1 (28) drives the cylindrical cam (35) to rotate in the vibration column (36), so that the cylindrical cam (35) can drive the sliding column (37) to reciprocate in the vibration box (33), so that the sliding column (37) drives the vibration column (36) to reciprocate rapidly in the vibration box (33), so that the vibration column (36) can continuously impact the impact block (34), thereby realizing the vibration function, promoting the solder beads to fall into the solder ball holes (32), and the solder beads to fall into the mesh holes of the direct heat implanting mesh plate (05).

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