A chip detection system

Abstract

The present invention discloses a chip detection system, including a sorting device and a detection device, wherein the sorting device can quickly control the material tray to receive the position of the detected chip and the position of the marked NG chip before the chip is detected, and the matching material tray can be quickly transported to different chip receiving positions, thereby improving the operation efficiency, avoiding manual participation in processing, improving the sorting efficiency and sorting accuracy, adapting to the chip detection rhythm, and improving the overall efficiency of chip detection; the detection device is provided with a movable fourth transfer mechanism on the second horizontal frame, and each chip is detected by multiple optical components in turn along with the rotation of the detection turntable, and the detected chip is moved to the material tray above the fourth track through the unloading mechanism, thereby completing the multi-component detection in a small space, and can also be based on the conveying rhythm of the track and the pre-inspection efficiency of the chip.

Description

Technical Field

[0001] The present application relates to the field of chip detection technology, and in particular to a chip detection system. Background Art

[0002] In chip production, it is usually necessary to manually inspect the chips in the tray and visually determine whether the product is damaged. This is limited by the low efficiency of manual inspection, which in turn affects the inspection rate of the product. The existing inspection method is to inspect the chips one by one with a probe and then record the unqualified chips. This is time-consuming and inefficient. In addition, when the wafer is packaged, it will be touched by humans and various mechanical equipment, which increases the probability of wafer contamination and is less than ideal.

[0003] During the chip detection process, the timing and probability of detecting NG parts (unqualified parts) or OK parts (qualified parts) are unknown. Before the detection, empty trays and trays with chips to be detected need to be placed one by one manually in different positions. At the same time, in order to cooperate with the rhythm of the detection process, after the NG parts or OK parts are detected, they are often operated one by one by manually referring to the chip positions marked by the detection mechanism until the NG parts and OK parts are placed in different trays. This process is inefficient and the labor intensity of the operators is high. Under long-term repetitive operations, the frequency of operator errors increases significantly, and multiple workstations with manual participation in operations need to be set up around the detection area, which is not conducive to efficient chip detection and processing. Summary of the invention

[0004] In view of the defects existing in the prior art, the present application provides a chip detection system to solve the problems of low efficiency and many errors in the manual chip detection process in the prior art.

[0005] The above-mentioned purpose of the present invention is mainly achieved through the following technical solutions:

[0006] A chip detection system comprises a sorting device and a detection device, wherein:

[0007] The sorting device comprises a first transverse frame, and a first track, a second track, a third track, a fourth track and a fifth track which are arranged under the first transverse frame and are used to carry and drive the material tray to move. A first transfer track and a second transfer track are arranged on both sides of the first transverse frame. A first transfer mechanism is arranged on the first transfer track. The first transfer mechanism comprises a displacement component and a chip grabbing component. A second transfer mechanism is arranged on the second transfer track. The second transfer mechanism comprises a displacement component and a material tray grabbing component. The two displacement components are respectively arranged on the first transfer track and the second transfer track for movement. The chip grabbing component is used to grab the chip and move following the displacement component. The material tray grabbing component is used to grab the material tray and move following the displacement component.

[0008] The detection device includes a fourth transfer mechanism movably arranged on the second horizontal frame, a detection turntable rotatably arranged on one side of the third track, and a material unloading mechanism, the fourth transfer mechanism includes a chip grabbing component for sucking or placing the chip; a plurality of optical components are arranged on one side of the detection turntable, and after the fourth transfer mechanism moves the chip to the detection turntable, when the detection turntable stops rotating, the chip is under each of the optical components, and when the detection turntable rotates, the chip moves under the plurality of optical components in turn, the material unloading mechanism includes a rotatable rotating arm and a chip grabbing component for sucking or placing the chip, and the rotating arm is used to drive the chip grabbing component to move from above the third track to above the fourth track.

[0009] Further, the chip detection system also includes a pre-processing system, the pre-processing system includes a first transverse frame and a second transverse frame mounted on the third track, the first transverse frame is provided with a second transfer track, the second transfer track is provided with a second transfer mechanism that can move along the extension direction of the second transfer track, the second transfer mechanism is provided with a first detection component for photographing the detection area, and a second detection component for photographing the chips one by one;

[0010] A third transfer track is provided on the second transverse frame, and a third transfer mechanism is provided on the third transfer track and can move along the extension direction of the third transfer track. The third transfer mechanism includes a chip grabbing component, and a first back inspection component for photographing the bottom of the chip is provided on the third transfer mechanism.

[0011] Furthermore, the chip grasping component includes a suction cup, both ends of which are connected to each other, one end of the suction cup is connected to a piston for vacuuming, and the other end is used to suck the chip. There are multiple suction cups, and the chip grasping component is provided with a first distance adjusting device for adjusting the distance between two adjacent suction cups.

[0012] Furthermore, a cleaning device is arranged under the third track, and the cleaning device includes a cleaning liquid tank and a cleaning cloth. A main inlet for filling the cleaning liquid is provided on the side wall of the cleaning liquid tank, a bottom hole for introducing compressed air is provided at the bottom of the cleaning liquid tank, and a spray hole is provided at the top of the cleaning liquid tank, and the cleaning cloth is laid on the spray hole.

[0013] Furthermore, the tray grabbing assembly includes two clamping plates extending to both sides of the tray, and a push-pull component is provided between the two clamping plates, and the push-pull component is used to drive the two clamping plates to move closer to or away from each other.

[0014] Furthermore, the first track, the second track, the third track, the fourth track and the fifth track are respectively provided with a tray placing mechanism on one side away from the chip detection position, and the tray placing mechanism includes: a lifting rod and a supporting component, one end of the lifting rod extends to the bottom of the tray, and the other end is provided with a push-pull component for driving the lifting rod to rise and fall, the supporting component is installed on both sides of the tray, the bottom of the tray has a supporting groove, and the supporting component has a telescopic end that can extend into the supporting groove and support the tray.

[0015] Furthermore, the optical component includes a third detection component, a fourth detection component and a fifth detection component, and a plurality of detection trays for loading chips are provided on the detection turntable, and when the detection turntable stops rotating, the detection trays are respectively stopped at the lower parts of the third detection component, the fourth detection component and the fifth detection component, and the detection trays are respectively stopped at the moving paths of the fourth transfer mechanism and the unloading mechanism.

[0016] Furthermore, the detection turntable is also provided with an adsorption positioning assembly, which includes a vacuum generator and adsorption tubes with the same number as the detection disk. The vacuum generator is arranged at one end of the adsorption tube and is connected to the adsorption tube. The other end of the adsorption tube extends to the end surface of the detection disk for carrying the chip.

[0017] Furthermore, a correction component is also provided on the chip grabbing component located on the fourth transfer mechanism. The correction component includes a correction motor. The output shaft of the correction motor is connected to the chip grabbing component and is used to drive the chip grabbing component to rotate.

[0018] Furthermore, each of the optical components is provided with an adjustment component, which includes a first adjustment part, a second adjustment part and a longitudinal lifting device, and the longitudinal lifting device is used to drive the optical component to move toward or away from the detection turntable. The first adjustment part is arranged vertically to the second adjustment part, and is used to drive the optical component to move radially along the detection turntable.

[0019] Compared with the prior art, the advantages of the present invention are:

[0020] The present invention is provided with a sorting device and a detection device, wherein the sorting device can, before chip detection, quickly transport the control tray to a position for receiving the detected chips and a position for receiving the chips marked as NG parts, and the matching tray can be quickly transported to different chip receiving positions, thereby improving operation efficiency, avoiding manual participation in processing, improving sorting efficiency and sorting accuracy, adapting to the chip detection rhythm, and improving the overall efficiency of chip detection; the detection device is provided with a movable fourth transfer mechanism on the second horizontal frame, and in the actual detection process, the tray carrying the chips is transported to one side of the detection turntable through the third track, and the chip grabbing group on the fourth transfer mechanism The chips are grabbed and placed on the inspection turntable. The chips are located under multiple optical components and are photographed and inspected by the optical components. As the inspection turntable rotates, each chip is inspected by multiple optical components in turn, and the inspected chips are moved to the tray above the fourth track through the unloading mechanism to complete multi-component inspection in a small space. In addition, the number of optical components to be inspected and the angle of each rotation of the inspection turntable can be reasonably arranged according to the conveying rhythm of the track and the pre-inspection efficiency of the chip, so as to achieve higher inspection efficiency and a more matched inspection rhythm, avoid stagnation and waiting of the tray during the inspection process, improve inspection efficiency and reduce misoperation. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A schematic diagram of the structure of a chip detection system provided in an embodiment of the present application;

[0023] Figure 2 A top view of a chip detection system provided in an embodiment of the present application;

[0024] Figure 3 The attached embodiment of the present application provides Figure 2 Schematic diagram of the middle 1-1 area;

[0025] Figure 4 The attached embodiment of the present application provides Figure 2 Schematic diagram of the middle 2-2 area;

[0026] Figure 5 The attached embodiment of the present application provides Figure 2 Schematic diagram of the middle 3-3 area;

[0027] Figure 6 A schematic diagram of the structure of the first platform area provided in an embodiment of the present application;

[0028] Figure 7 The attached embodiment of the present application provides Figure 6 A partial enlarged schematic diagram in the middle;

[0029] Figure 8 The attached embodiment of the present application provides Figure 6 The partial enlarged schematic diagram of F in the middle;

[0030] Fig. 9 The attached embodiment of the present application provides Figure 6 A partial enlarged schematic diagram of the G in the middle;

[0031] Fig.10 A front view of a first horizontal frame provided in an embodiment of the present application;

[0032] Fig.11 The attached embodiment of the present application provides Fig.10 A partial enlarged schematic diagram of point B in the middle;

[0033] Fig.12 The attached embodiment of the present application provides Fig.10 A partial enlarged schematic diagram of point C in the middle;

[0034] Fig.13 A rear view of a first transverse frame provided in an embodiment of the present application;

[0035] Fig.14 A schematic diagram of the second direction structure of the first platform area provided in an embodiment of the present application;

[0036] Fig.15 A schematic diagram of the structure of the second horizontal frame provided in an embodiment of the present application;

[0037] Fig.16 The attached embodiment of the present application provides Fig.15 The local enlarged schematic diagram of point D in the middle;

[0038] Fig.17 The attached embodiment of the present application provides Fig.15 The local enlarged schematic diagram of point E in the middle;

[0039] Fig.18 A schematic diagram of the structure of some components of the detection turntable provided in an embodiment of the present application;

[0040] Fig.19 A schematic diagram of the structure of some components of the unloading mechanism provided in the embodiment of the present application;

[0041] Fig. 20 The attached embodiment of the present application provides Fig.19The partial enlarged schematic diagram of F in the middle;

[0042] Fig.21 A schematic diagram of the structure of some components of the fifth detection assembly provided in an embodiment of the present application;

[0043] Fig. 22 A cross-sectional view of some components of a correction motor provided in an embodiment of the present application;

[0044] Fig.23 A cross-sectional view of a chip provided in an embodiment of the present application;

[0045] Fig.24 A cross-sectional view of a cleaning device provided in an embodiment of the present application;

[0046] In the figure:

[0047] 101-first track; 102-second track; 103-third track; 104-fourth track; 105-fifth track; 106-sixth track; 107-seventh track; 108-eighth track; 110-first transverse frame; 111-first transfer track; 112-first transfer mechanism; 113-second transfer track; 114-second transfer mechanism; 115-first detection component; 116-second detection component; 120-second transverse frame; 121-third transfer track; 122-third transfer mechanism; 123-first a back inspection mechanism; 124-the fourth transfer track; 125-the fourth transfer mechanism; 130-displacement assembly; 131-chip grabbing assembly; 132-suction cup; 133-piston; 134-buffer; 135-tray grabbing assembly; 136-clamping plate; 137-pushing and pulling component; 138-longitudinal lifting device; 140-tray placing mechanism; 141-limiting plate; 142-lifting rod; 143-supporting component; 144-telescopic end; 145-clamping claw; 146-first clamping plate; 147-second clamping plate; 148-driving gear; 149- Clamping motor; 151-first motor; 152-first screw; 153-slider; 154-second motor; 155-second screw; 160-cleaning device; 161-cleaning liquid tank; 162-liquid discharge mechanism; 163-cleaning cloth; 164-addition port; 165-reflux plate; 170-material plate; 171-supporting groove; 172-primary area; 180-chip; 181-first detection surface; 182-second detection surface; 183-third detection surface; 184-fourth detection surface; 185-fifth detection surface; 190-first platform area; 191-second platform area; 192-third platform area; 200-detection turntable; 201-detection plate; 210-feeding mechanism; 211-rotating arm; 221-third detection component; 222-fourth detection component; 223- The fifth detection component; 230-correction motor; 240-second back detection mechanism; 251-adsorption tube; 252-vacuum generator; 260-adjustment component; 261-first adjustment part; 262-second adjustment part; 263-grating ruler component; 264-scanning terminal; 265-grating ruler body. DETAILED DESCRIPTION

[0048] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. The specific structures and functional details disclosed herein are only used to describe the exemplary embodiments of the present invention. However, the present invention can be embodied in many alternative forms, and it should not be understood that the present invention is limited to the embodiments set forth herein.

[0049] At present, chip is a general term for semiconductor component products, also known as integrated circuits, or microcircuits, microchips, wafers / chips in electronics is a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of semiconductor wafers. Only half a century after its development, integrated circuits have become ubiquitous, and computers, mobile phones and other digital appliances have become an indispensable part of the social structure. This is because modern computing, communication, manufacturing and transportation systems, including the Internet, all rely on the existence of integrated circuits. Even many scholars believe that the digital revolution brought about by integrated circuits is the most important event in human history. The maturity of IC will bring about technological progress, whether in design technology or semiconductor process breakthroughs, both are closely related, so the requirements for chip processing and manufacturing are increasing day by day, but the process production steps of chips are particularly numerous. One of the important process steps is microscopic inspection to eliminate defective products in some chips, but it is usually inspected by microscopic inspectors through high-power microscopes. Long-term work will not only make the microscopic inspectors tired of their naked eyes, but also cause greater work intensity and damage, and it is easy to make mistakes. Although an adjustment system has been added to the existing chip detection device to reduce manpower, when collecting chip images, inspectors are often required to manually focus, which results in low focusing efficiency and long detection time.

[0050] like Figure 1-24 As shown, a chip detection system includes a sorting system, a pretreatment system and a detection system, wherein the sorting system is used to place a tray 170 containing chips 180 into the detection system, and perform sorting operations in accordance with the production rhythm, including arranging empty trays 170 before detection, arranging trays 170 containing chips 180, and removing NG parts from the trays 170 containing chips 180 after detection; the pretreatment system is used to pre-position and preliminarily detect the chips 180 on the trays 170 containing chips 180 to be detected; the detection system is used to accurately detect and precisely detect the chips 180 that have been pre-positioned and preliminarily detected to distinguish NG parts from OK parts, so that the chips 180 that have been detected can be sorted again through the sorting system until the chips 180 on the trays 170 are all OK parts, and then enter the subsequent operation.

[0051] In order to maintain the operational consistency of the chip 180 during the detection operation, a processing operation platform can be provided. The above-mentioned sorting system, pretreatment system and detection system are respectively arranged on the platform. The platform includes a first platform area 190, a second platform area 191 and a third platform area 192.

[0052] Specifically, the above-mentioned sorting system includes a first transverse frame 110 arranged on the first platform area 190, and a first track 101, a second track 102, a third track 103, a fourth track 104 and a fifth track 105 arranged parallel to each other, wherein the first transverse frame 110 is erected on the first track 101, the second track 102, the third track 103, the fourth track 104 and the fifth track 105, and the length extension direction of the first transverse frame 110 is perpendicular to the length extension direction of the first track 101.

[0053] A first transfer track 111 and a second transfer track 113 are provided on both sides of the first transverse frame 110, that is, the first transfer track 111 and the second transfer track 113 are both arranged perpendicular to the first track 101, and both ends of the first track 101, the second track 102, the third track 103, the fourth track 104 and the fifth track 105 respectively extend to the first transfer track 111 side and the second transfer track 113 side of the first transverse frame 110.

[0054] A first transfer mechanism 112 is provided on the first transfer track 111. The first transfer mechanism 112 includes a group of displacement components 130 and a group of chip grabbing components 131. The displacement components 130 cooperate with the first transfer track 111, and under the drive of the displacement components 130, the first transfer mechanism 112 moves as a whole on the first transfer track 111 along the length direction of the first transfer track 111, and the first transfer mechanism 112 is stopped above the first track 101, the second track 102, the third track 103, the fourth track 104 or the fifth track 105 corresponding to the operation required through the displacement components 130, and the chip 180 in the loading tray 170 of the first track 101, the second track 102, the third track 103, the fourth track 104 or the fifth track 105 is grabbed and moved by the chip grabbing component 131.

[0055] It is worth noting that the displacement component 130 can adopt a driving motor, and a gear is arranged on the output shaft of the driving motor, and a row of convex teeth meshing with the gear is provided on the first transfer track 111. With the forward and reverse rotation of the gear, the displacement component 130 can be moved together with the first transfer mechanism 112 on the first transfer track 111, or the displacement component 130 can be arranged in other structural forms, which has been used to drive the first transfer mechanism 112 to move on the first transfer track 111, and can stay at the corresponding grasping position. It should be noted that in the present application, a plurality of displacement components 130 of different specifications can be arranged, and the displacement components 130 of different specifications can be installed on different tracks or operating positions to realize the displacement operation, and other displacement components 130 will not be described in detail again.

[0056] The chip grabbing component 131 may include a suction cup 132, the two ends of which are connected, and a vacuum piston 133 is installed at one end of the suction cup 132, and a buffer 134 is provided at the other end of the suction cup 132. When the chip grabbing component 131 moves onto the chip 180, the piston 133 at one end of the suction cup 132 works and vacuums the inside of the suction cup 132. At this time, the chip 180 located at the lower part of the buffer 134 moves toward the suction cup 132 together with the air until the suction cup 132 contacts the buffer 134, thereby completing the grabbing action of the chip 180. When the chip grabbing component 131 moves to the target position together with the chip 180, the piston 133 used for vacuum adsorption stops working, the chip 180 is separated from the buffer 134, and the placement action of the chip 180 is completed.

[0057] It is worth mentioning that installing a buffer 134 at one end of the suction cup 132 can effectively avoid contact between the chip 180 and the soft suction nozzle that needs to be deformed, thereby preventing the suction nozzle from contaminating the surface of the chip 180. Specifically, the buffer 134 can be made of polyetheretherketone (PEEK) material. The buffer 134 made of this material has high mechanical strength, high temperature resistance, impact resistance, flame retardancy, acid and alkali resistance, hydrolysis resistance, wear resistance, fatigue resistance, radiation resistance and good electrical properties.

[0058] Correspondingly, a second transfer mechanism 114 is provided on the second transfer track 113, and the second transfer mechanism 114 also includes a group of displacement components 130 and a group of material tray grabbing components 135. The displacement components 130 cooperate with the second transfer track 113, and under the drive of the displacement components 130, the second transfer mechanism 114 moves as a whole on the second transfer track 113 along the length direction of the second transfer track 113, and the displacement components 130 are used to make the second transfer mechanism 114 stay above the first track 101, the second track 102, the third track 103, the fourth track 104 or the fifth track 105 corresponding to the operation required, and the material tray 170 on the first track 101, the second track 102, the third track 103, the fourth track 104 or the fifth track 105 is grabbed and moved by the material tray grabbing component 135.

[0059] On the above-mentioned first track 101, second track 102, third track 103, fourth track 104 and fifth track 105, there are displacement components 130 for carrying the movement of the material tray 170. The displacement component 130 can be set to the structural form of the above-mentioned drive motor, and can also be set to other drive devices, such as a cylinder or a linear drive, which will not be further explained here. Under the driving action of the displacement component 130, according to the progress of the operation, the material tray 170 on the first track 101, second track 102, third track 103, fourth track 104 and fifth track 105 stays at the designated working position to improve the overall working efficiency.

[0060] Since the material tray 170 moves with the displacement assembly 130 and when the chip 180 is carried on the material tray 170, it is necessary to maintain the smooth movement of the material tray 170. A clamp 145 is set on each displacement assembly 130 that carries the material tray 170 to move. The clamp 145 can fix the material tray 170 to keep it stable during the movement of the material tray 170, and after the clamp is released, the material tray 170 can be separated from the displacement assembly 130 without restraint.

[0061] Specifically, the clamping jaw 145 includes two first clamping plates 146, two second clamping plates 147, a driving gear 148 and a clamping motor 149. The output shaft of the clamping motor 149 is connected to the driving gear 148. The two first clamping plates 146 are respectively meshed with the driving gear 148, and under the rotation of the driving gear 148, the two first clamping plates 146 are driven to approach or move away from each other. One ends of the two first clamping plates 146 extend to two opposite sides of the material tray 170 respectively. The two second clamping plates 147 are respectively meshed with the driving gear 148, and under the rotation of the driving gear 148, the two second clamping plates 147 are driven to approach or move away from each other. One ends of the two second clamping plates 147 extend to the other two opposite sides of the material tray 170 respectively.

[0062] The first clamping plate 146 and the second clamping plate 147 are vertically arranged, and in order to reasonably arrange the space between the material tray 170 and the displacement assembly 130, the driving gear 148 can be arranged to include multiple meshing gears. The combination of multiple meshing gears can effectively transmit the output power of the clamping motor 149, and can also keep the first clamping plate 146 and the second clamping plate 147 moving at the same time through reasonable arrangement. When clamping the material tray 170, the two first clamping plates 146 and the two second clamping plates 147 can move at the same time until the four sides of the material tray 170 are stably clamped.

[0063] The first track 101 is used to load empty material trays 170 , and under the driving action of the second transfer mechanism 114 , the empty material trays 170 on the first track 101 are transported to the second track 102 and the fourth track 104 .

[0064] The third track 103 is used to load the tray 170 with the chips 180 , and driven by the displacement assembly 130 on the third track 103 , the tray 170 with the chips 180 is moved to the detection position for detection.

[0065] The fourth track 104 is arranged parallel to one side of the third track 103. The empty tray 170 transferred from the first track 101 to the fourth track 104 is used to load the chips 180 after inspection in sequence. Under the drive of the displacement component 130 on the fourth track 104, the tray 170 loaded with the chips 180 after inspection is moved to the lower part of the moving path of the first transfer mechanism 112.

[0066] When the empty material tray 170 is lowered onto the second track 102 under the operation of the material tray grabbing component 135 on the second transfer mechanism 114, and is moved to the bottom of the movement path of the first transfer mechanism 112 under the drive of the displacement component 130 on the second track 102, at this time, there are a part of NG parts and a part of OK parts on the material tray 170 equipped with the chips 180 after inspection located at the lower part of the movement path of the first transfer mechanism 112, wherein the NG parts are grabbed by the chip grabbing component 131 of the first transfer mechanism 112, and move to the empty material tray 170 on the second track 102 with the displacement component 130 of the first transfer mechanism 112, so that the inspected chips 180 are removed one by one onto the empty material tray 170, and when the empty material tray 170 on the second track 102 is filled with NG parts, a new empty material tray 170 is used for filling in a cycle to facilitate the subsequent processing of NG parts.

[0067] The fifth track 105 is used to place the tray 170 after the NG parts are removed on the fourth track 104 through the third transfer mechanism 122. Only OK parts are left on the tray 170, and the OK parts in the tray 170 moved to the fifth track 105 are used to fill the vacant chip 180 positions in the next tray 170 located on the fourth track 104 and after the NG parts are removed, so that after the NG parts are removed from the chips 180 on the subsequent tray 170, they can be filled with OK parts, so as to obtain a tray 170 with a whole tray of OK parts on the fifth track 105, and facilitate subsequent operations.

[0068] It is worth mentioning that in order to facilitate the movement of the material tray 170 as a whole to the fifth track 105 after the NG parts are removed from the fourth track 104, the second transfer mechanism 114 also includes a material tray grabbing assembly 135, which can fix and lift the material tray 170 as a whole, and then realize the overall movement operation of the material tray 170 under the action of the displacement assembly 130 on the second transfer mechanism 114.

[0069] Specifically, the tray grabbing assembly 135 includes two clamping plates 136, and a push-pull component 137 is provided between the two clamping plates 136. The push-pull component 137 is used to drive the two clamping plates 136 to move closer to or away from each other, and when the two clamping plates 136 extend to both sides of the tray 170 and move closer to each other under the drive of the push-pull component 137 until they are clamped on both sides of the tray 170, the clamping action of the entire tray 170 is completed. The two clamping plates 136 are separated from each other under the drive of the push-pull component 137 until the spacing between the two clamping plates 136 is greater than the width of the tray 170, and the tray 170 is separated from the tray grabbing assembly 135.

[0070] It is worth noting that the push-pull component 137 can adopt a cylinder or a linear drive, and the maximum stroke of the push-pull component 137 can be adjusted to match the width of the tray 170 through parameter preset, so that higher efficiency can be obtained when grabbing the tray 170.

[0071] In order to reduce misoperation and avoid mutual interference between structures during operation, a longitudinal lifting device 138 is set on the tray grabbing component 135 and the chip grabbing component 131, and the tray grabbing component 135 and the chip grabbing component 131 can be driven by the longitudinal lifting device 138 to perform lifting operations.

[0072] Specifically, when the empty tray 170 or the tray 170 loaded with chips 180 is placed and moved to the lower part of the tray grabbing assembly 135 and the chip grabbing assembly 131, or the tray grabbing assembly 135 and the chip grabbing assembly 131 are moved to the upper part of the chip 180 or the upper part of the tray 170, the tray grabbing assembly 135 or the chip grabbing assembly 131 is driven toward the tray 170 by the longitudinal lifting device 138. Or the chip 180 moves until the tray grabbing assembly 135 grabs the tray 170, and the chip grabbing assembly 131 grabs the chip 180, and when the tray grabbing assembly 135 and the chip grabbing assembly 131 do not operate the tray 170 and the chip 180, the tray grabbing assembly 135 and the chip grabbing assembly 131 can move in the direction away from the tray 170 under the drive of the longitudinal lifting device 138, so that the tray 170 and the chip 180 will not be hindered by the tray grabbing assembly 135 or the chip grabbing assembly 131, thereby improving the smoothness of the movement of the tray 170.

[0073] The above-mentioned longitudinal lifting device 138 can be set as a linear drive, a screw or a cylinder to drive the tray grabbing assembly 135 and the chip grabbing assembly 131 to reciprocate along a straight line. It should be noted that multiple longitudinal lifting devices 138 of different specifications can be set in the present application, and the longitudinal lifting devices 138 of different specifications can be installed on different tracks or operating positions to achieve the purpose of driving the longitudinal lifting displacement, and other longitudinal lifting devices 138 will not be described in detail again.

[0074] In actual operation, the processing of the sorting system includes:

[0075] 1. Prepare two empty trays 170 and place them on the first track 101 . The two empty trays 170 are moved one by one through the displacement assembly 130 on the first track 101 to below the moving path of the second transfer mechanism 114 on the first transverse frame 110 .

[0076] 2. After grabbing an empty tray 170 through the tray grabbing assembly 135 of the second transfer mechanism 114, it is moved along the second transfer track 113 driven by the displacement assembly 130 of the second transfer mechanism 114 until the empty tray 170 moves above the second track 102, and the empty tray 170 is lowered onto the second track 102 again through the tray grabbing assembly 135 of the second transfer mechanism 114, and driven by the displacement assembly 130 of the second track 102, the empty tray 170 is moved to the bottom of the moving path of the first transfer mechanism 112 to receive NG parts.

[0077] 3. After another empty tray 170 is grabbed by the tray grabbing assembly 135 of the second transfer mechanism 114, it is moved along the second transfer track 113 driven by the displacement assembly 130 of the second transfer mechanism 114 until the empty tray 170 moves to above the fourth track 104, and the empty tray 170 is again lowered onto the fourth track 104 by the tray grabbing assembly 135 of the second transfer mechanism 114, and driven by the displacement assembly 130 of the second track 102, the empty tray 170 is moved to the station for receiving the tested chip 180.

[0078] 4. Prepare the tray 170 containing the chips 180 on the third track 103, and transport the tray 170 containing the chips 180 to the chip 180 inspection station for inspection through the displacement assembly 130 on the third track 103.

[0079] 5. The tested chips 180 are placed one by one into the empty trays 170 on the fourth track 104 , and the trays 170 containing the tested chips 180 are transported to the bottom of the moving path of the second transfer mechanism 114 by the displacement assembly 130 on the fourth track 104 .

[0080] 6. The tray 170 containing the tested chip 180 is grabbed as a whole by the tray grabbing assembly 135 of the second transfer mechanism 114, and driven by the displacement assembly 130 of the second transfer mechanism 114 until the tray 170 is located above the fifth track 105, and then the tray 170 is lowered onto the fifth track 105 by operating the tray grabbing assembly 135 of the second transfer mechanism 114, and then the tray 170 is moved to the bottom of the moving path of the first transfer mechanism 112 by the displacement assembly 130 on the fifth track 105.

[0081] 7. The chip grabbing component 131 of the first transfer mechanism 112 absorbs NG parts according to the detection result of the chips 180 on the tray 170 on the fifth track 105 , and moves and places them on the empty tray 170 on the second track 102 under the driving of the displacement component 130 of the first transfer mechanism 112 .

[0082] 8. When the second tray 170 containing chips 180 enters the chip 180 detection station from the third track 103 for detection, and the detected chips 180 are placed one by one in the empty tray 170 on the fourth track 104, the tray 170 containing the detected chips 180 is transported to the bottom of the moving path of the first transfer mechanism 112 through the displacement assembly 130 on the fourth track 104.

[0083] 9. Repeat the operation in step 7 above, and then use the chip grabbing component 131 of the first transfer mechanism 112 to grab the OK parts in the tray 170 on the fifth track 105, and drive the displacement component 130 of the first transfer mechanism 112 to move the OK parts to the position of the chip 180 vacated by the removal of NG parts in the tray 170 on the fourth track 104, until the tray 170 on the fourth track 104 is full of OK parts.

[0084] It should be emphasized that the above processing process does not have a unique order of operation. Under the premise of not affecting the operation logic, the above processing process can be rearranged to a certain extent, and other different processing orders will no longer be listed and expanded one by one.

[0085] It should be noted that when all the OK parts in the tray 170 on the fifth track 105 are used as supplements after the NG parts in the subsequent tray 170 are discarded, that is, when there are no chips 180 in the tray 170 on the fifth track 105, the tray 170 can be moved to the first track 101 in the operating gap of the first transfer mechanism 112 and recycled as a new empty tray 170.

[0086] It is worth noting that when the empty material tray 170 is placed on the first track 101, in order to facilitate operation, one end of the first track 101, the second track 102, the third track 103, the fourth track 104 and the fifth track 105 can be arranged flush, and the end of the first track 101, the second track 102, the third track 103, the fourth track 104 and the fifth track 105 away from the chip 180 detection station can be used as the operating end to facilitate operation by operators and operating machinery.

[0087] At the same time, in order to improve the stacking of multiple material trays 170 at one time and to transport them one by one, a tray placing mechanism 140 is provided on one side of the operating end of the first track 101, the second track 102, the third track 103, the fourth track 104 and the fifth track 105, and the tray placing mechanism 140 includes: a limit plate 141, a lifting rod 142 and a supporting component 143. The limit plate 141 is installed at the edge of the operating end to serve as a reference for the placement position of the material tray 170. In order to ensure that the material tray 170 can be placed at the set position, one end of the material tray 170 is directly placed on the limit plate 141 to complete the alignment of the position of the material tray 170. The lifting rod 142 is movably installed at the bottom of the track, and one end of the lifting rod 142 extends under the material tray 170. The other end of the lifting rod 142 is provided with a push-pull component 137. Driven by the lifting rod 142, the lifting rod 142 rises or falls, thereby supporting the material tray 170 to move up and down, and in order to improve the stability of the lifting process of the material tray 170 by the lifting rod 142, four lifting rods 142 are provided and distributed at the four corners of the bottom of the material tray 170, and at least two supporting parts 143 are provided and are evenly arranged on both sides of the material tray 170. The supporting part 143 has a telescopic end 144, and the bottom of the material tray 170 has a supporting groove 171 for accommodating the telescopic end 144. When the supporting part 143 is working, the telescopic end 144 is driven to move close to the material tray 170 or away from the material tray 170 until the telescopic end 144 extends into the supporting groove 171. The two telescopic ends 144 support the material tray 170 at the lower part of both sides of the material tray 170. The supporting part 143 can be set as a cylinder or a linear drive.

[0088] In actual use, the tray placing mechanism 140 can place multiple empty trays 170 at one time on the first track 101, and multiple trays 170 with chips 180 can be placed on the third track 103 at one time. Here, the placement of multiple trays 170 with chips 180 on the third track 103 is specifically described: multiple trays 170 with chips 180 are placed on the third track 103, and multiple trays 170 are stacked. At this time, one of the trays 170 needs to be transported to the chip 180 detection position via the first track 101. First, the push-pull component 137 is operated to drive the lifting rod 142 to rise until the second tray 170 from bottom to top is located above the horizontal plane where the supporting component 143 is located, and the first tray 170 from bottom to top is located below the horizontal plane where the supporting component 143 is located, and then the supporting component 143 is driven to extend the multiple telescopic ends 144 to the supporting grooves 171 on the second tray 170 from bottom to top. The push-pull component 137 is then operated again to drive the lifting rod 142 to descend, so that the first material tray 170 from bottom to top is located on the track and moved to the detection position through the track. After the first material tray 170 from bottom to top is taken away, when the second material tray 170 from bottom to top needs to be lowered, the above operation process can be repeated. Correspondingly, when multiple material trays 170 are stacked on other tracks, the operation method and principle are the same, and the operation method of the material tray 170 on each track will not be repeated here.

[0089] Specifically, the above-mentioned pretreatment system includes a first transverse frame 110 and a second transverse frame 120 arranged on the second platform area 191, the first transverse frame 110 is arranged in parallel with the second transverse frame 120, and the first transverse frame 110 is the aforementioned first transverse frame 110 erected on the first track 101, the second track 102, the third track 103, the fourth track 104 and the fifth track 105, and the second transverse frame 120 is located on the side of the second transfer track 113 on the first transverse frame 110.

[0090] A first detection component 115 and a second detection component 116 are further provided on the second transfer mechanism 114 of the first transverse frame 110 , and the first detection component 115 and the second detection component 116 move synchronously with the second transfer mechanism 114 .

[0091] There are two groups of tray grabbing components 135, which are respectively arranged on both sides of the first detection component 115 and the second detection component 116, so that the tray grabbing components 135 do not need to cross the first detection component 115 and the second detection component 116 to complete the material tray 170 grabbing and moving operations on both sides of the first detection component 115 and the second detection component 116.

[0092] The first detection component 115 is used to shoot from above the tray 170. When the tray 170 is loaded with chips 180 and moves to the lower part of the moving path of the second transfer mechanism 114, the first detection component 115 moves onto the tray 170. Due to the limitation of the field of view of the lens, the first detection component 115 is provided with a larger field of view, and more chips 180 can be included in a single shot image, so that the information of the chips 180 shot by the first detection component 115 can be preliminarily analyzed, and then the number of chips 180 in each row and column on the tray 170, whether there are empty spaces without chips 180, and the shooting path of the second detection component 116 can be planned using this information.

[0093] The second detection component 116 is also used to take pictures from above the tray 170. The difference is that when the tray 170 is equipped with chips 180 and moves to the lower part of the moving path of the second transfer mechanism 114, the second detection component 116 moves onto the tray 170 and takes pictures one by one according to the moving path of the second detection component 116 planned by the first detection component 115 based on the acquired chip 180 information. Then, the second detection component 116 can take a clearer image of the chip 180 each time, and at the same time avoids the second detection component 116 from taking pictures of empty spaces, thereby reducing the deviation of the detection data output, avoiding unnecessary shooting operations, and obtaining a shorter moving path, thereby improving the overall detection operation efficiency.

[0094] Specifically, during the pre-processing of the chip 180, the tray 170 containing the chip 180 is placed on the third track 103, and the tray 170 containing the chip 180 is transported to the chip 180 inspection station for inspection by the displacement assembly 130 on the third track 103.

[0095] When the material tray 170 containing the chip 180 moves to the bottom of the moving path of the second transfer mechanism 114, it stops moving forward, and the first detection component 115 is moved to the material tray 170 containing the chip 180 through the displacement component 130 of the second transfer mechanism 114. The material tray 170 is photographed by the first detection component 115, and the chip 180 within the shooting range is preliminarily positioned.

[0096] It should be noted that the area of ​​the tray 170 where the chips 180 are loaded can be divided into three primary areas 172, and the flat plate with the chips 180 can be placed in the primary area 172. Since the sizes of the chips 180 are inconsistent, the flat plates in the three primary areas 172 can be used as standard specifications for reference, and chips 180 of different specifications can be placed on the flat plates at different densities, so that the tray 170 and the flat plates can adopt a universal and relatively fixed size, and then the placement density of the chips 180 on the flat plates can be reasonably adapted to the different specifications of the chips 180. However, since the sizes of the chips 180 are different, the chips 180 need to be repositioned during the subsequent detection process such as grabbing and testing to ensure that the chips 180 to be tested can be accurately grabbed and effectively tested. After the first detection component 115 shoots and locates the primary area 172 on the tray 170, the quantity information of the chips 180 in the primary area 172 is obtained.

[0097] Next, as the displacement component 130 of the second transfer mechanism 114 continues to work, the first detection component 115 is removed from the tray 170 containing the chip 180, providing the space required for the second detection component 116 to move. The second detection component 116 is then moved to the tray 170 containing the chip 180, and the chip 180 on the tray 170 is detected again by the second detection component 116.

[0098] It should be noted that, unlike the first detection component 115, when the second detection component 116 moves to the tray 170 containing chips 180, the second detection component 116 first detects the first row of chips 180 on the tray 170, and photographs the chips 180 one by one along the arrangement of the first row of chips 180. At this time, for the sake of convenience, the length extension direction of the third track 103 is used as the length direction of the tray 170, and it is also the column direction of the chips 180 loaded on the tray 170. That is, the stopped tray 170 is captured by the second detection component 116 in units of one row, and each time the second detection component 116 detects a chip 180, the second transfer mechanism 114 moves a corresponding distance according to the distance information between the two adjacent chips 180 obtained by the first detection mechanism, and the second detection component 116 moves with the second transfer mechanism 114 to the top of the next chip 180 to be photographed for shooting.

[0099] After the second detection component 116 has photographed the first row of chips 180 on the tray 170 in units of rows, the tray 170 containing the chips 180 is moved toward the detection position by the distance of one row of chips 180 through the displacement component 130 on the third track 103. The distance can be adjusted according to the distance information between two adjacent rows of chips 180 obtained by the first detection mechanism, so that the chips 180 in the second row on the tray 170 are located at the lower part of the moving path of the second detection component 116. At the same time, the second detection component 116 is driven by the displacement component 130 of the second transfer mechanism 114 to photograph the second row of chips 180 on the tray 170 again. After the second row of chips 180 are photographed by the second detection component 116, the above operation is repeated until all the chips 180 on the tray 170 are photographed.

[0100] In order to improve the shooting efficiency of the second detection component 116 and reduce the working frequency of the displacement component 130 of the second transfer mechanism 114, after the second detection component 116 completes shooting of the first row of chips 180 on the tray 170 in the first direction, the displacement component 130 of the second transfer mechanism 114 is used to progressively move the tray 170 containing the chips 180 by the distance of one row of chips 180 during the process of resetting in the direction opposite to the first direction through the displacement component 130 on the third track 103, so as to control the second detection component 116 to shoot the second row of chips 180 on the tray 170 during the process of resetting in the direction opposite to the first direction, thereby improving the detection efficiency, effectively utilizing the path of each movement of the second detection component 116, and rationally planning the shooting operation rhythm.

[0101] The second transverse frame 120 is arranged parallel to the first transverse frame 110 , and a third transfer track 121 is provided on one side of the second transverse frame 120 . The third transfer track 121 is arranged parallel to the first transfer track 111 , and the third transfer track 121 is arranged on one side of the second transverse frame 120 close to the second transfer track 113 .

[0102] A third transfer mechanism 122 is provided on the third transfer track 121. The third transfer mechanism 122 includes a group of displacement components 130 and a group of chip grabbing components 131. The displacement components 130 cooperate with the third transfer track 121, and under the drive of the displacement components 130, the third transfer mechanism 122 moves as a whole on the third transfer track 121 along the length direction of the third transfer track 121.

[0103] It should be noted that the chip 180 has five surfaces to be inspected, namely the first inspection surface 181, the second inspection surface 182, the third inspection surface 183, the fourth inspection surface 184 and the fifth inspection surface 185. When the chip 180 is placed in the tray 170 on the third track 103, the first inspection surface 181 and the fourth inspection surface 184 on the chip 180 are facing away from the third track 103, the third inspection surface 183 and the fifth inspection surface 185 are facing the third track 103, and the second inspection surface 182 is the sandwich surface.

[0104] A first back inspection mechanism 123 is provided under the third transfer track 121. The first back inspection mechanism 123 is located under the third transfer track 121 and shoots toward the bottom surface of the chip 180, that is, shoots the third inspection surface 183 and the fourth inspection surface 184 on the chip 180. In actual operation, the chip 180 is moved to the lower part of the third transfer track 121 in the tray 170 on the third track 103, and after being grasped by the chip grasping component 131 on the third transfer mechanism 122, it follows the third transfer mechanism 122 to move to the upper part of the first back inspection mechanism 123. It is worth mentioning that the setting position of the first back inspection mechanism 123 can ensure that it is below the grasped chip 180, and then it can be realized that direct shooting can be performed without flipping the chip 180 to obtain images of the third inspection surface 183 and the fifth inspection surface 185, thereby further improving operation efficiency.

[0105] After being inspected row by row by the second inspection component 116, the chip 180 follows the material tray 170 to the moving path of the third transfer mechanism 122, so that the chip 180 can be grabbed by the chip grabbing component 131 of the third transfer mechanism 122, and then lifted and separated from the material tray 170. Driven by the displacement component 130 of the third transfer mechanism 122, the chip 180 is moved to the first back inspection mechanism 123. On the premise that the chip 180 is not separated from the chip grabbing component 131 of the third transfer mechanism 122, the back side inspection of the chip 180 is completed. After the inspection, the chip 180 inspected by the first back inspection mechanism 123 is placed back on the material tray 170 through the cooperation of the displacement component 130 and the chip grabbing component 131 of the third transfer mechanism 122.

[0106] It is worth noting that since the chips 180 on the tray 170 are not of a single size, when grabbing the chips 180 on the tray 170, it is necessary to make reasonable adjustments based on the arrangement of each row of the chips 180, so that after changing the specifications of the chips 180 to be tested, corresponding adjustments can be made to improve the operation accuracy and detection effectiveness.

[0107] In order to make the chip grabbing component 131 flexible and adaptable while also having the ability to efficiently carry chips, the chip grabbing component 131, based on the suction cup 132, the piston 133 and the buffer 134, also includes a first distance adjustment device, wherein one suction cup 132, one piston 133 and one buffer 134 are taken as a group, and multiple groups are provided to enable multiple suction cups 132 to grab multiple chips 180 at a time, thereby improving efficiency. However, due to the different sizes of the chips 180 and the different densities of the chips 180 arranged on the tray 170, it is necessary to adjust the distance between the suction cups 132 according to the different placement conditions of the chips 180. At this time, the distance between the multiple suction cups 132 is adjusted by the first distance adjustment device to adapt to the processing of chips 180 with different specifications. Each suction cup 132 can accurately grab the chip 180, thereby improving the detection efficiency of the first back inspection mechanism 123.

[0108] The structures and connection relationships of the suction cup 132 , the piston 133 and the buffer member 134 will not be described again in detail.

[0109] The first distance adjusting device includes a first motor 151 and a first screw 152. The first screw 152 is connected to the output shaft of the first motor 151 and rotates when driven by the first motor 151. Two suction cups 132 are fixed to the first screw 152 via a slider 153 connected by a thread. When the first screw 152 rotates, the two suction cups 132 move closer to each other or away from each other on the first screw 152, thereby adjusting the distance between the two suction cups 132.

[0110] In order to further improve the suction efficiency of the chip 180, the chip grasping component 131 also includes a second distance adjusting device, which includes a second motor 154 and a second screw 155. The second screw 155 is connected to the output shaft of the second motor 154 and rotates under the drive of the second motor 154. Two suction cups 132 are fixed on the second screw 155 through a slider 153 connected by a thread. When the second screw 155 rotates, the two suction cups 132 move closer to each other or away from each other on the second screw 155, thereby adjusting the distance between the two suction cups 132.

[0111] A fixed suction cup 132 is provided between the two suction cups 132 moving on the first screw 152. When the first screw 152 rotates, the distance between the two suction cups 132 moving on the first screw 152 and the fixed suction cup 132 always remains the same to meet the preset same gap between adjacent chips 180.

[0112] In addition, the two suction cups 132 moving on the second screw 155 are arranged on both sides of the suction cup 132 fixedly set relative to the first screw 152. When the second screw 155 rotates, the distance between the two suction cups 132 moving on the second screw 155 and the fixed suction cup 132 always remains the same to meet the preset same gap between adjacent chips 180.

[0113] During specific operation, according to the width of the material tray 170 and the specification range of the chips 180, the number of chips 180 in a row on the material tray 170 is at most ten. In order to balance the operating efficiency and the component layout space, the suction cup 132 can be set to five, that is, a row of chips 180 can be grabbed with at most two operations. An example of ten chips 180 in a row on the material tray 170 is given below.

[0114] The chip grasping component 131 includes two suction cups 132 on the first screw 152, a suction cup 132 on the second screw 155, and a suction cup 132 fixedly arranged between the two suction cups 132 on the first screw 152, that is, the chip grasping component 131 includes five suction cups 132, and under the drive of the first screw 152 and the second screw 155, it is ensured that there is the same distance between adjacent suction cups 132, thereby achieving that when the chip 180 is placed in a different position, the first motor 151 drives the first screw 152, and the second motor 154 drives the second screw 155 to achieve that the suction cups 132 are respectively suspended above the chip 180.

[0115] At this time, under the operation of the five suction cups 132, five chips 180 are adsorbed, and the five chips 180 are adsorbed at intervals relative to the ten chips 180 in a row on the tray 170, and driven by the displacement component 130 of the third transfer mechanism 122, the first back inspection mechanism 123 completes the inspection of the chips 180 one by one. That is to say, the remaining five chips 180 in the row on the tray 170 wait for the five suction cups 132 to put back the inspected chips 180, and then are inspected again by the five suction cups 132 in the above process, thereby completing the back inspection of the chips 180 in a row.

[0116] After the back inspection, the chip 180 is put back into the tray 170. It should be noted that at this time, when the first back inspection mechanism 123 inspects and identifies the chips 180 loaded on the tray 170 in units of rows, the tray 170 with the chips 180 is moved a distance of one row of chips 180 by the displacement component 130 on the third track 103. The distance is set with reference to the detection information of the first detection component 115, so that the chips 180 in the second row on the tray 170 are located under the third transfer track 121. At the same time, the chip grabbing component 131 on the third transfer mechanism 122 is driven by the displacement component 130 of the third transfer mechanism 122 to inspect the chips 180 in the second row on the tray 170 again. After the chips 180 in the second row are inspected by the first back inspection mechanism 123, the above operation is repeated so that the chips 180 on the tray 170 are inspected row by row, thereby achieving the goal that the chips 180 transferred on the tray 170 are inspected by the first back inspection mechanism 123 in sequence.

[0117] Since the trays 170 containing chips 180 are placed on the third track 103 for inspection in turn, that is, the chip grabbing assembly 131 on the third transfer track 121 needs to grab the chips 180 on multiple trays 170 one by one, in order to avoid the chips 180 being contaminated by dirt generated during the contact between the suction cup 132 or the buffer 134 and different chips 180, thereby affecting the accuracy of the chip 180 inspection results, a cleaning device 160 can be set under the third track 103.

[0118] After the chip grabbing assembly 131 inspects all the chips 180 in the loading tray 170 on the third track 103 respectively through the first back inspection mechanism 123, the displacement assembly 130 on the third transfer track 121 drives the multiple suction cups 132 or buffers 134 of the chip grabbing assembly 131 on the third transfer track 121 to be moved to the cleaning device 160 for cleaning.

[0119] Specifically, the cleaning device 160 includes: a cleaning liquid tank 161, a liquid outlet mechanism 162 and a cleaning cloth 163. The cleaning liquid tank 161 is hollow inside, and a adding port 164 for adding cleaning liquid is provided on the side wall of the cleaning liquid tank 161. The liquid outlet mechanism 162 is provided at the bottom of the cleaning liquid tank 161, and the liquid outlet mechanism 162 includes a compressed air output device. The output end of the compressed air output device is connected and extends to the inside of the cleaning liquid tank 161. A liquid outlet is provided at the top of the cleaning liquid tank 161, and the liquid outlet is covered with a cleaning cloth 163.

[0120] After cleaning liquid is added to the cleaning liquid tank 161, the compressed air output device works and compressed air is output from the output end. The compressed air enters the cleaning liquid tank 161 and compresses the cleaning agent inside the cleaning liquid tank to be sprayed out from the liquid outlet and soak the cleaning cloth 163. At this time, the chip grabbing assembly 131 on the third transfer track 121 moves along the third transfer track 121 to the upper part of the cleaning device 160, and drives the suction cup 132 and the buffer 134 to descend and contact the cleaning cloth 163, so that the cleaning liquid adsorbed on the cleaning cloth 163 contacts the suction cup 132 and the buffer 134 to complete the cleaning operation, and maintain the cleanliness of the suction cup 132 and the buffer 134 in the next operation cycle. The cleaning frequency can be reasonably set according to the efficiency of the chip 180 operation, so as to reduce the number of cleaning times and avoid the cleaning operation affecting the operation efficiency under the premise that the cleanliness meets the requirements.

[0121] The cleaning device 160 also includes a flow control device, which is arranged on the output end of the compressed air output device to adjust the ejection flow rate of the compressed air in the output end of the compressed air output device. Specifically, the process control device can be set as a valve body, and by adjusting the flow size of the valve body, the flow rate of the compressed air entering the cleaning liquid tank 161 is controlled, thereby reducing the control requirements of the compressed air output device.

[0122] The cleaning device 160 also includes a liquid level control device, which is arranged inside the cleaning liquid tank 161 and detects the liquid level height of the cleaning liquid inside the cleaning liquid tank 161, thereby achieving more accurate adding operations and avoiding failure to replenish the cleaning liquid in time after it is used up. Specifically, the liquid level control device can be set as a liquid level meter or a liquid sensor, and an audible and visual alarm can be set to be electrically connected to the liquid level control device to achieve the purpose of reminder.

[0123] The cleaning device 160 also includes a reflux mechanism. Since the amount of cleaning liquid that can be absorbed by the cleaning cloth 163 is limited, when there is already a certain amount of cleaning liquid on the cleaning cloth 163, or the cleaning liquid is not completely absorbed by the cleaning cloth 163 after each spray, there will be overflow of cleaning liquid around the cleaning cloth 163. In order to avoid uncontrollable overflow of the cleaning liquid, a reflux mechanism is provided on the cleaning liquid tank 161 to collect excess cleaning liquid. Specifically, the reflux mechanism includes a reflux tray 165, which is provided on the cleaning liquid tank 161, and one side opening of the reflux tray 165 extends under the cleaning cloth 163, and the other side opening is used to extend into the cleaning liquid recovery part, so as to collect and guide the excess cleaning liquid at the cleaning cloth 163 until the excess cleaning liquid is gathered in the cleaning liquid recovery part, thereby reducing the operating cost through recycling.

[0124] After the material tray 170 with the chips 180 passes through the above-mentioned pre-processing system, it moves on the third track 103 to the subsequent station for inspection.

[0125] Specifically, the detection system includes a first turntable detection area disposed on the third platform area 192 , and the first turntable detection area includes a detection turntable 200 , a material discharge mechanism 210 , a third detection component 221 , a fourth detection component 222 and a fifth detection component 223 .

[0126] The detection system also includes a fourth transfer track 124 arranged on the second transverse frame 120, and a fourth transfer mechanism 125 is provided on the fourth transfer track 124. The fourth transfer mechanism 125 includes a displacement component 130 and a chip grabbing component 131. The displacement component 130 cooperates with the fourth transfer track 124, and under the drive of the displacement component 130, the fourth transfer mechanism 125 moves as a whole on the fourth track 104 along the length direction of the fourth transfer track 124, and through the displacement component 130, the fourth transfer mechanism 125 can stay above the third track 103 where operation is required, and the chip 180 in the upper tray 170 of the third track 103 can be grabbed by the chip grabbing component 131.

[0127] The fourth transfer track 124 is disposed on a side of the second transverse frame 120 away from the third transfer track 121 .

[0128] The detection turntable 200 is installed on one side of the third track 103 , and a rotating assembly is provided on the detection turntable 200 . The rotating assembly is fixed on the third platform area 192 and is used to drive the detection turntable 200 to rotate.

[0129] At least five detection disks 201 are provided on the detection turntable 200, each detection disk 201 is used to place a chip 180, and as the detection turntable 200 rotates, the chip 180 in the detection disk 201 rotates along with the detection turntable 200. When the detection turntable 200 stops rotating, one of the detection disks 201 is located at the upper material position, one detection disk 201 is located at the lower material position, and the other three detection disks 201 are used to correspond to the third detection component 221, the fourth detection component 222 and the fifth detection component 223, respectively.

[0130] When five detection discs 201 are provided, the five detection discs 201 are evenly distributed on the detection disc 200 along the rotation axis of the detection disc 200, that is, the central angles of every two adjacent detection discs 201 on the detection disc 200 are the same, that is, as long as there is a detection disc 201 located at the loading position, there will be a detection disc 201 correspondingly located at the unloading position, and at the same time, there are three detection discs 201 corresponding to the third detection component 221, the fourth detection component 222 and the fifth detection component 223 respectively. When the detection disc 200 is controlled to rotate, keep The angle of each rotation of the detection turntable 200 is the same as the central angle of the two adjacent detection disks 201 on the detection turntable 200. After the detection turntable 200 rotates five times, a chip 180 passes through the loading position, three detection components and the unloading position. With the continuous rotation of the detection turntable 200, after each chip 180 is placed in the detection disk 201 on the loading position, it will be detected by the third detection component 221, the fourth detection component 222 and the fifth detection component 223, and then moved to the unloading position until all chips 180 are detected.

[0131] The third detection component 221 is fixed on the third platform area 192, and is used to photograph the chip 180 rotated to the bottom of the third detection component 221, and to determine the defects of the chip 180 through the photographed image of the chip 180. The third detection component 221 uses a dark-field light source to detect the chip 180, that is, the chip 180 is made white or bright by the dark-field light source, and the background of the chip 180 is made black or dark. Under this light source condition, the chip 180 is photographed, and the defects of the chip 180 displayed in the image are analyzed.

[0132] The fourth detection component 222 is fixed on the third platform area 192, and is used to photograph the chip 180 rotated to the bottom of the third detection component 221, and to judge the defects of the chip 180 through the photographed image of the chip 180. The third detection component 221 can photograph the second detection surface 182 of the chip 180 through a pre-set focal length, and analyze the defects of the chip 180 displayed in the image.

[0133] The fifth detection component 223 is fixed on the third platform area 192, and is used to photograph the chip 180 rotated to the bottom of the fifth detection component 223, and to determine the defects of the chip 180 through the photographed image of the chip 180. The fifth detection component 223 uses a bright field light source to detect the chip 180, that is, the chip 180 is made black or dark by the bright field light source, and the background of the chip 180 is made white or bright. Under this light source condition, the chip 180 is photographed, and the defects of the chip 180 displayed in the image are analyzed.

[0134] After the chip grabbing component 131 grabs the chip 180, the displacement component 130 drives the chip grabbing component 131 to grab the chip 180 and move it above the loading position. The chip grabbing component 131 releases the chip 180 into the detection disk 201 on the detection turntable 200, and after the detection turntable 200 rotates a unit angle, the chip 180 moves to the third detection component 221. While the detection turntable 200 rotates, the chip grabbing component 131 cooperates with the displacement component 130 to grab a chip 180 in the loading disk 170 of the third track 103 again, and after the detection turntable 200 stops rotating, the chip 180 is lowered into the detection disk 201 at the loading position again, and the above operations are continuously repeated to complete the step-by-step detection of the chips 180 in the material tray 170.

[0135] The unloading mechanism 210 is fixed on the third platform area 192, and the unloading mechanism 210 includes a rotating arm 211 and a chip grabbing assembly 131. The chip grabbing assembly 131 is fixed at one end of the rotating arm 211, and the other end of the rotating arm 211 is rotatable relative to the third platform area 192. In the process of the rotating arm 211 driving the chip grabbing assembly 131 to rotate, the chip grabbing assembly 131 can be moved above the unloading position and above the fourth track 104. In the specific setting, the rotation power source of the rotating arm 211 can be a stepping motor or other power driving part to drive the rotating part to move back and forth, thereby driving the chip grabbing assembly 131 to reciprocate above the third track 103 and above the fourth track 104.

[0136] A longitudinal lifting device 138 is provided between the rotating arm 211 and the chip grabbing assembly 131. Driven by the longitudinal lifting device 138, the chip grabbing assembly 131 can reciprocate in a direction perpendicular to the third platform area 192. The longitudinal lifting device 138 has been specifically described above and will not be further expressed here.

[0137] When the chip 180 passes through the inspection of the third inspection component 221, the fourth inspection component 222 and the fifth inspection component 223 from the loading position on the inspection turntable 200 and moves to the unloading position, the rotating arm 211 drives the chip grabbing component 131 to move above the unloading position, and is driven by the longitudinal lifting device 138 to move to above the chip 180 located at the unloading position through the chip grabbing component 131. After sucking the chip 180, the rotating arm 211 drives the grabbing chip 180 to move to the empty tray 170 on the fourth track 104 under the rotation drive, and the chip 180 grabbing device is driven by the longitudinal lifting device 138 again to lower the inspected chip 180 onto the empty tray 170 to complete the inspection of the chip 180.

[0138] In order to further adapt to the production rhythm, after the chip 180 is placed on the empty tray 170, the rotating arm 211 can be controlled to drive the chip grabbing assembly 131 to move to above the unloading position of the detection turntable 200 and wait.

[0139] The chip grabbing component 131 is also provided with a correction component, and the correction component includes a correction motor 230. The output shaft of the correction motor 230 is connected to the chip grabbing component 131 and is used to drive the chip grabbing component 131 to rotate. Since a plurality of primary areas 172 are provided on the material tray 170, and a loading plate corresponding to the size of the primary area 172 can be directly placed in each primary area 172, a plurality of chips 180 are arranged on each loading plate, and since there is a difference in length between the long side and the short side of the chip 180, in order to unify the direction in which the chips 180 are placed and to make the long side and short side of the chip 180 adapt to the long side and short side of the field of view of the detection component, after the chip 180 is sucked between the chip 180 grabbers on the fourth transfer mechanism 125, the correction component drives the chip grabbing component 131 to rotate until the long side and short side of the chip 180 are consistent with the long side and end face direction of the field of view of the detection component.

[0140] And because the chip 180 after rotational alignment needs to be placed on the detection disk 201 on the detection turntable 200, in order to avoid secondary errors, the position and angle of the detection disk 201 can be pre-adjusted to be consistent with the position and direction of the field of view of the detection component, that is, when the detection disk 201 is located at the lower part of the third detection component 221, the detection disk 201 and the chip 180 in the detection disk 201 are consistent with the shooting field of view of the third detection component 221, and the chip 180 is centered in the shooting field of view of the third detection component 221.

[0141] The third platform area 192 is also provided with a second back inspection mechanism 240, which is located between the unloading position and the third track 103. When the chip 180 on the third track 103 is grabbed by the chip grabbing component 131 of the fourth transfer mechanism 125, the fourth transfer mechanism 125 is driven by the displacement component 130. During the process of moving toward the unloading position on the fourth transfer track 124, the chip 180 will pass above the second back inspection mechanism 240, and during the stop process, the second back inspection mechanism 240 The bottom surface of the chip 180 is photographed below the fourth track 104. During the actual operation, the chip 180 is moved from the tray 170 on the third track 103 to the lower part of the fourth transfer track 124, and after being grasped by the chip grasping component 131 on the fourth transfer mechanism 125, it moves to the upper part of the second back inspection mechanism 240 following the fourth transfer mechanism 125. The setting position of the second back inspection mechanism 240 can ensure that it is below the grasped chip 180, so that direct photography can be achieved without flipping the chip 180 to obtain the long side and short side directions of the chip 180 at this time, and the image information captured by the second back inspection mechanism 240 can be used for analyzing the image information, which can be used to correct the component driving the chip 180 to rotate to the target state.

[0142] At the same time, after the second back inspection mechanism 240 performs back inspection and photography on the chip 180, it can perform image comparison between the third inspection surface 183 and the fifth inspection surface 185 again after the first back inspection mechanism 123 has performed the back inspection, and complete the second back defect screening while judging the long side direction and the short side direction of the chip 180, thereby improving the detection accuracy. At the same time, when one of the first back inspection mechanism 123 and the second back inspection mechanism 240 is damaged, the other can complete the back inspection operation, thereby improving the stability of the overall detection process.

[0143] The detection turntable 200 is also provided with an adsorption positioning assembly, which includes an adsorption tube 251 and a vacuum generator 252. The vacuum generator 252 is arranged at one end of the adsorption tube 251 and is connected to the adsorption tube 251. The number of the adsorption tubes 251 is the same as the number of the detection disk 201. The other end of the adsorption tube 251 extends to the end surface of the detection disk 201 for carrying the chip 180. When the chip 180 is placed on the detection disk 201, the vacuum generator 252 works and the vacuum generator 252 By utilizing a positive pressure gas source to generate negative pressure, negative pressure is generated at one end of the adsorption tube 251 close to the chip 180 and the chip 180 is adsorbed onto the detection disk 201. Even if the detection turntable 200 has a certain degree of jitter during rotation, or the chip 180 has inertia when the detection turntable 200 starts to rotate and stops rotating, the chip 180 can still be stably adsorbed on a fixed position on the detection disk 201. On the one hand, the chip 180 is always kept in the best position of the shooting field of view of the detection component. On the other hand, the chip 180 is prevented from falling out and causing damage, thereby improving the stability of the detection process. Moreover, while maintaining a relatively stable positional relationship between the chip 180 and the detection disk 201, the rotation speed of the detection turntable 200 can have a more flexible adjustment range, and the rotation speed can be reasonably set according to the processing rhythm.

[0144] An adjustment assembly 260 is respectively disposed between the third detection assembly 221 , the fourth detection assembly 222 , and the fifth detection assembly 223 and the third platform area 192 . The adjustment assembly 260 includes a first adjustment portion 261 , a second adjustment portion 262 , and a longitudinal lifting device 138 .

[0145] The longitudinal lifting device 138 is used to drive the third detection component 221 , the fourth detection component 222 or the fifth detection component 223 toward or away from the third platform area 192 , thereby achieving the purpose of focusing adjustment when detecting the chip 180 on the turntable 200 .

[0146] Since the size of the chip 180 to be inspected cannot be kept uniform, the chip 180 within a certain size range can be covered by the field of view of the third inspection component 221, the fourth inspection component 222 and the fifth inspection component 223, that is, after adjusting the longitudinal height of the third inspection component 221, the fourth inspection component 222 and the fifth inspection component 223 through the longitudinal lifting device 138, the chip 180 can be covered and the detection and shooting without missing can be achieved. However, if the chip 180 to be inspected is larger, the third inspection component 221, the fourth inspection component 222 and the fifth inspection component 223 cannot achieve a single shot.

[0147] The driving path of the first adjustment part 261 on the third platform area 192 is vertically arranged to the driving path of the second adjustment part 262 on the third platform area 192, so that the first adjustment part 261 and the second adjustment part 262 drive the third detection component 221, the fourth detection component 222 or the fifth detection component 223 to move on the third platform area 192, so that the third detection component 221, the fourth detection component 222 or the fifth detection component 223 can perform regional shooting of the chip 180 on the detection turntable 200, and form a complete shot image after splicing the images of multiple attached areas through the processing system, thereby improving the applicability of detecting chips 180 of different specifications.

[0148] The first adjusting portion 261 and the second adjusting portion 262 may adopt a linear driver or a cylinder to drive the third detection component 221 , the fourth detection component 222 or the fifth detection component 223 to perform linear reciprocating motion on the third platform area 192 .

[0149] When the third detection component 221, the fourth detection component 222, and the fifth detection component 223 divide the chip 180 into regions for shooting, for example, the chip 180 is evenly divided into nine regions, and the images of the nine regions are respectively spliced ​​to obtain a shot image of the entire region of the chip 180. However, since there are generally no fixed feature points on the chip 180, that is, taking the fifth detection component 223 as an example, after shooting a certain region on the chip 180, it is necessary to move the shooting region of the fifth detection component 223 to the next adjacent region on the chip 180 through the first adjustment unit 261 and the second adjustment unit 262. During the process, if there are no feature points or boundaries for reference in the area that has been photographed, then at this time, it is impossible to know the displacement amount generated by the first adjustment part 261 and the second adjustment part 262 driving the fifth detection component 223. Since the first adjustment part 261 and the second adjustment part 262 are both mechanical transmission components, there is a large relative error compared to the optical accuracy of the fifth detection component 223, and improving the mechanical progress to adapt to the optical accuracy requires a large cost investment and space occupancy. In order to solve this problem, the adjustment component 260 also includes a grating scale component 263 respectively arranged corresponding to the first adjustment part 261 and the second adjustment part 262.

[0150] The grating ruler assembly 263 includes a scanning terminal 264 and a grating ruler body 265. The scanning terminal 264 is clamped on the grating ruler body 265 and moves along the length extension direction of the grating ruler. Taking the fifth detection assembly 223 as an example, when the first adjustment part 261 drives the fifth detection assembly 223 to reciprocate, the scanning terminal 264 is connected to the fifth detection assembly 223 and moves synchronously. The scanning terminal 264 moves on the grating ruler body 265 and converts the linear displacement into pulses through optical signals, thereby obtaining a more accurate displacement distance of the fifth detection assembly 223, and then realizing the reference during the movement of the fifth detection assembly 223 according to the displacement distance, thereby improving the shooting accuracy.

[0151] Since the second transfer mechanism 114 installed on the third track 103 is provided with the first detection component 115 and the second detection component 116, and at the same time, the third detection component 221, the fourth detection component 222 and the fifth detection component 223 are arranged on one side of the detection turntable 200, accordingly, the total time of the third detection component 221, the fourth detection component 222 and the fifth detection component 223 to detect the chip 180 is greater than the total time of the first detection component 115 and the second detection component 116. That is to say, the detection speed of the chip 180 at the second transfer mechanism 114 is greater than the detection speed on the detection turntable 200, then the chip 180 detected by the first detection component 115 and the second detection component 116 will be retained in front of the detection turntable 200, that is, there are more chips 180 left on the third track 103, which poses certain safety hazards and also interrupts the progress of the detection operation on the detection turntable 200.

[0152] In order to improve the matching degree of the detection rhythm of the entire detection system at different detection positions, the detection system is further provided with a second group of first turntable detection areas and a sixth track 106 , a seventh track 107 and an eighth track 108 .

[0153] The first turntable detection area is symmetrically arranged with the second group of first turntable detection areas. The structures and relative positional relationships of the detection turntable 200, unloading mechanism 210, third detection component 221, fourth detection component 222 and fifth detection component 223 in the second group of first turntable detection areas are arranged in the same manner as those in the first turntable detection area.

[0154] One end of the fifth track 105 extends into the second group of first turntable detection areas. When the tray 170 loaded with chips 180 on the third track 103 moves to the lower part of the third transfer track 121 on the second transverse frame 120, the tray 170 is grabbed by the tray grabbing assembly 135 on the third transfer mechanism 122, and driven by the displacement assembly 130 on the third transfer mechanism 122, the tray 170 is moved to the upper part of the fifth track 105 and then lowered onto the fifth track 105. Driven by the displacement assembly 130 on the fifth track 105, it is moved into the second group of first turntable monitoring areas to detect the chips 180 one by one.

[0155] The sixth track 106 is arranged parallel to the fourth track 104, and the first track 101 is used to load empty material trays 170, and under the drive of the material tray grabbing component 135 and the displacement component 130 on the second transfer mechanism 114, the empty material tray 170 is transported to the third track 103, and the control material tray 170 is moved on the third track 103 to the third transfer track 121, and under the drive of the material tray grabbing component 135 and the displacement component 130 on the third transfer mechanism 122, the controlled material tray 170 is transported to the sixth track 106, and the material tray 170 is driven by the displacement component 130 on the sixth track 106 to the unloading mechanism 210 in the second group of first turntable detection areas, waiting for the unloading mechanism 210 in the area to grab the chips 180 one by one into the empty material tray 170 on the sixth track 106.

[0156] When the tray 170 on the sixth track 106 is loaded with the inspected chips 180 , the tray 170 loaded with the inspected chips 180 is moved to the lower part of the moving path of the first transfer mechanism 112 under the driving of the displacement assembly 130 on the sixth track 106 .

[0157] The seventh track 107 is arranged in parallel with the sixth track 106. The seventh track 107 is provided with the The empty material tray 170 transported by the second transfer mechanism 114 is moved to the bottom of the moving path of the first transfer mechanism 112 under the drive of the displacement component 130 on the seventh track 107. At this time, there are a part of NG parts and a part of OK parts on the material tray 170 equipped with the chips 180 after inspection on the sixth track 106 and located at the lower part of the moving path of the first transfer mechanism 112, wherein the NG parts are captured by the chip grabbing component 131 of the first transfer mechanism 112 and moved to the empty material tray 170 on the seventh track 107 along with the displacement component 130 of the first transfer mechanism 112, so that the chips 180 after inspection are removed one by one onto the empty material tray 170, and when the empty material tray 170 on the seventh track 107 is filled with NG parts, a new empty material tray 170 is used for filling in a cycle to facilitate the subsequent processing of NG parts.

[0158] Furthermore, a tray placing device can be provided at one end of the second track 102 and one end of the seventh track 107. When the empty tray 170 is filled with NG parts, the tray placing device can be used to stack them, so that multiple trays 170 filled with NG parts can be stacked and then processed collectively to improve processing efficiency.

[0159] In order to clearly explain the stacking process of multiple trays 170 filled with NG parts, the processing process at one end of the second track 102 is used for explanation. When a tray 170 filled with NG parts is on the second track 102, the displacement assembly 130 on the second track 102 moves the tray 170 to the tray placement device until one side of the tray 170 contacts the limiting plate 141. At this time, the lifting rod 142 is driven to lift the tray 170 to the height corresponding to the supporting component 143. Then the telescopic end 144 is driven to extend into the supporting groove 171 of the material tray 170. After the lifting rod 142 descends, the second material tray 170 filled with NG parts is moved to the tray placement device by the displacement assembly 130 on the second track 102 again, and is lifted up by the lifting rod 142 again until the two material trays 170 are stacked. Then the telescopic end 144 of the supporting component 143 is separated from the material tray 170, and then the lifting rod 142 lifts the material tray 170 again until the supporting groove 171 on the lower material tray 170 corresponds to the telescopic end 144 of the supporting component 143, and the telescopic end 144 is driven again to extend into the supporting groove 171 on the lower material tray 170. At this time, the supporting component 143 supports the two stacked material trays 170 filled with NG parts. Repeating the above operation can repeatedly stack multiple material trays 170.

[0160] The eighth track 108 is arranged in parallel with the seventh track 107. The eighth track 108 is used to place the tray 170 after the NG parts are removed on the sixth track 106 through the third transfer mechanism 122. Only OK parts are left on the tray 170, and the OK parts in the tray 170 moved to the eighth track 108 are used to fill the vacant chip 180 positions in the next tray 170 located on the sixth track 106 and after the NG parts are removed, so that after the NG parts are removed from the chips 180 on the subsequent tray 170, they can be filled with OK parts, so as to obtain a tray 170 filled with OK parts on the sixth track 106, and facilitate subsequent operations.

[0161] It should be noted that the loading process, detection process and unloading process in the second group of the first turntable detection area are the same as those in the aforementioned first turntable detection area.

[0162] Through the coordinated operation of the two groups of first turntable detection areas, the material tray 170 loaded with chips 180 on the third track 103 is evenly transferred to the two groups of first turntable detection areas for simultaneous detection and processing, thereby improving the detection efficiency. The detection speed is increased by two groups of detection turntables 200 and coordinated with the transportation detection rhythm on multiple tracks to avoid waiting or stagnation in some detection positions or transfer positions.

Claims

1. A chip detection system, characterized in that: It includes a sorting device, a detection device and a pre-processing system, wherein: The sorting device comprises a first transverse frame, and a first track, a second track, a third track, a fourth track and a fifth track which are arranged under the first transverse frame and are used to carry and drive the material tray to move. A first transfer track and a second transfer track are arranged on both sides of the first transverse frame. A first transfer mechanism is arranged on the first transfer track. The first transfer mechanism comprises a displacement component and a chip grabbing component. A second transfer mechanism is arranged on the second transfer track. The second transfer mechanism comprises a displacement component and a material tray grabbing component. The two displacement components are respectively arranged on the first transfer track and the second transfer track for movement. The chip grabbing component is used to grab the chip and move following the displacement component. The material tray grabbing component is used to grab the material tray and move following the displacement component. The detection device comprises a fourth transfer mechanism movably arranged on the second transverse frame, a detection turntable rotatably arranged on one side of the third track, and a material unloading mechanism, wherein the fourth transfer mechanism comprises a chip grabbing assembly for sucking or placing the chip; a plurality of optical assemblies are arranged on one side of the detection turntable, and after the fourth transfer mechanism moves the chip onto the detection turntable, when the detection turntable stops rotating, the chip is located under each of the optical assemblies, and when the detection turntable rotates, the chip moves under the plurality of optical assemblies in turn, and the material unloading mechanism comprises a rotatable rotating arm and a chip grabbing assembly for sucking or placing the chip, and the rotating arm is used to drive the chip grabbing assembly to move from above the third track to above the fourth track; The pre-processing system comprises a first transverse frame and a second transverse frame erected on the third track, the first transverse frame is provided with a second transfer track, the second transfer track is provided with a second transfer mechanism movable along the extension direction of the second transfer track, the second transfer mechanism is provided with a first detection component for photographing the tray, and a second detection component for photographing the chips one by one, the chip information photographed by the first detection component is preliminarily analyzed, and the shooting path of the second detection component is planned using the information, the second detection component photographs one by one according to the moving path of the second detection component planned by the first detection component based on the acquired chip information, the second transfer mechanism moves a corresponding distance based on the distance information between two adjacent chips acquired by the first detection component, and the second detection component moves together with the second transfer mechanism to the top of the next chip to be photographed to perform the photographing operation; A third transfer track is provided on the second transverse frame, a third transfer mechanism is provided on the third transfer track and can move along the extension direction of the third transfer track, the third transfer mechanism includes a chip grabbing component, and a first back inspection component is provided on the third transfer mechanism for photographing the bottom of the chip.

2. The chip detection system according to claim 1, characterized in that: The chip grabbing assembly includes a suction cup, both ends of which are connected, one end of the suction cup is connected to a piston for vacuuming, and the other end is used to suck the chip. There are multiple suction cups, and the chip grabbing assembly is provided with a first distance adjusting device for adjusting the distance between two adjacent suction cups.

3. The chip detection system according to claim 2, characterized in that: A cleaning device is arranged under the third track, and the cleaning device includes a cleaning liquid tank and a cleaning cloth. A main inlet for filling the cleaning liquid is arranged on the side wall of the cleaning liquid tank, a bottom hole for introducing compressed air is arranged at the bottom of the cleaning liquid tank, a spray hole is arranged at the top of the cleaning liquid tank, and the cleaning cloth is laid on the spray hole.

4. The chip detection system according to claim 3, characterized in that: The tray grabbing assembly includes two clamping plates extending to both sides of the tray, and a push-pull component is provided between the two clamping plates, and the push-pull component is used to drive the two clamping plates to move closer to or away from each other.

5. The chip detection system according to claim 1, characterized in that: The first track, the second track, the third track, the fourth track and the fifth track are respectively provided with a tray placing mechanism on one side away from the chip detection position, and the tray placing mechanism includes: a lifting rod and a supporting component, one end of the lifting rod extends to under the tray, and the other end is equipped with a push-pull component for driving the lifting rod to rise and fall, the supporting component is installed on both sides of the tray, the bottom of the tray has a supporting groove, and the supporting component has a telescopic end that can extend into the supporting groove and support the tray.

6. The chip detection system according to claim 1, characterized in that: The optical component includes a third detection component, a fourth detection component and a fifth detection component. The detection turntable is provided with a plurality of detection trays for loading chips, and when the detection turntable stops rotating, the detection trays are respectively parked under the third detection component, the fourth detection component and the fifth detection component, and the detection trays are respectively parked on the moving paths of the fourth transfer mechanism and the unloading mechanism.

7. The chip detection system according to claim 6, characterized in that: The detection turntable is also provided with an adsorption positioning assembly, which includes a vacuum generator and adsorption tubes with the same number as the detection disk. The vacuum generator is arranged at one end of the adsorption tube and is connected to the adsorption tube. The other end of the adsorption tube extends to the end surface of the detection disk for carrying the chip.

8. The chip detection system according to claim 1, characterized in that: The chip grabbing assembly located on the fourth transfer mechanism is also provided with a correction assembly, and the correction assembly includes a correction motor. The output shaft of the correction motor is connected to the chip grabbing assembly and is used to drive the chip grabbing assembly to rotate.

9. The chip detection system according to claim 1, characterized in that: Each of the optical components is provided with an adjustment component, which includes a first adjustment part, a second adjustment part and a longitudinal lifting device. The longitudinal lifting device is used to drive the optical component to move toward or away from the detection turntable. The first adjustment part is arranged vertically with the second adjustment part, and is used to drive the optical component to move radially along the detection turntable.

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