Magnetic structure and inductive coupling control

Abstract

Embodiments of the present disclosure generally relate to magnetic structures and inductive coupling control. According to one configuration, a manufacturing facility manufactures a core of a circuit component to include a magnetically permeable material. The manufacturing facility further produces the circuit component to include a plurality of electrically conductive paths extending through the core of the magnetically permeable material. In one arrangement, the plurality of electrically conductive paths includes a first electrically conductive path and a second electrically conductive path. The manufacturing facility manufactures the circuit component, and more particularly the core of the magnetically permeable material, to include at least one cutout portion operable to reduce inductive coupling between the first electrically conductive path and the second electrically conductive path disposed in the core.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure generally relate to magnetic structures and inductive coupling control. BACKGROUND

[0002] Conventional switching power supply circuits sometimes include energy storage components, such as inductors, for generating an output voltage to power a load. For example, to maintain the magnitude of the output voltage within a desired range, a controller controls the switching of input current through one or more inductors.

[0003] Generally, conventional inductors are components that include wire or other conductive material shaped as a coil or spiral to increase the amount of magnetic flux through a corresponding circuit path. Wrapping the wire into a multi-turn coil increases the number of corresponding magnetic flux lines in the corresponding inductor component, thereby increasing the magnetic field and thus the overall inductance of the corresponding inductor component. SUMMARY

[0004] Implementation of clean energy (or green technology) is important to reduce our impact as humans on the environment. Generally, clean energy includes any developing methods and materials for reducing the overall toxicity of energy consumption on the environment.

[0005] The present disclosure includes the observation that raw energy, such as received from green or non-green energy sources, generally needs to be converted into an appropriate form (such as a desired AC voltage, DC voltage, etc.) before it can be used to power end devices, such as servers, computers, mobile communication devices, wireless base stations, etc. In some cases, the energy is stored in a corresponding one or more battery resources. Regardless of whether the energy is from green or non-green sources, it is desirable to most efficiently utilize the raw energy provided by such systems (such as storage and subsequent distribution) to reduce our impact on the environment. The present disclosure helps to reduce our carbon footprint and better utilize energy via more efficient energy conversion.

[0006] For example, the present disclosure includes the observation that conventional wound inductor components, such as used to support power conversion, are generally bulky and thus implementation is undesirable in some applications. Such conventional devices inevitably make it difficult to create compact, efficient, and high-current output power supply circuits.

[0007] Embodiments herein provide novel and improved inductor components for use in applications such as power conversion. For example, embodiments herein include novel inductor devices, corresponding uses, methods of manufacturing them, etc.

[0008] More specifically, embodiments herein include the manufacture of an apparatus, such as a circuit component. In one example embodiment, a manufacturing facility manufactures a core of a circuit component to include a magnetically permeable material. The manufacturing facility further produces the circuit component to include a plurality of electrically conductive paths (inductive paths), such as extending through the core of the magnetically permeable material from one surface of the circuit component to another surface. The presence of the magnetically permeable material around the electrically conductive paths causes a first electrically conductive path to become a first inductive path in the circuit component and a second electrically conductive path to become a second inductive path in the circuit component.

[0009] In one embodiment, the plurality of electrically conductive paths includes a first electrically conductive path and a second electrically conductive path. The manufacturing facility manufactures the circuit component, and more specifically the core of the magnetically permeable material, to include one or more cutout portions (also referred to as cutaway portions). The presence of the cutout portions at respective appropriate one or more locations of the circuit component reduces the inductive coupling between the first electrically conductive path and the second electrically conductive path provided in the core. The degree of inductor coupling between the first electrically conductive path and the second electrically conductive path is dependent on the size of the at least one cutout portion. For example, in one embodiment, the larger the cutout portion, the less the inductive coupling between the first electrically conductive path and the second electrically conductive path.

[0010] According to a further example embodiment, via the manufacturing facility, the one or more cutout portions of the magnetically permeable material include a first cutout portion and a second cutout portion. Both the first cutout portion and the second cutout portion are free of the magnetically permeable material, thereby reducing the inductive coupling coefficient between the first electrically conductive path and the second electrically conductive path.

[0011] In a still further example embodiment, in addition to the one or more cutout portions, the manufacturing facility produces the circuit component to include a portion of the magnetically permeable material (such as a continuous body without interruption in the material) between the first electrically conductive path and the second electrically conductive path. Additionally or alternatively, further embodiments herein include, via the manufacturing facility, providing a portion of the magnetically permeable material (such as a continuous body without interruption in the material) between the first cutout portion and the second cutout portion.

[0012] Yet another example embodiment herein includes, via the manufacturing facility, providing the first electrically conductive path and the second electrically conductive path to be parallel to each other, such that the first electrically conductive path and the second electrically conductive path extend from a first surface of the circuit component to connect to a second surface of the circuit component, the second surface being provided opposite to the first surface.

[0013] In yet another example embodiment, the manufacturing facility manufactures the circuit component to include a first cutout portion and a second cutout portion, wherein the magnetically permeable material is absent in both the first cutout portion and the second cutout portion. As previously described, the absence of the magnetically permeable material at one or more locations of the circuit component reduces the mutual magnetic flux flow, and thus the inductive coupling between the first electrically conductive path and the second electrically conductive path.

[0014] In further example embodiments, a manufacturing facility manufactures at least one cutout portion to include a first cutout portion. In one embodiment, the first cutout portion is disposed in a flux path associated with a first current flowing through the first conductive path and a second current flowing through the second conductive path.

[0015] Still further example embodiments herein include manufacturing, via a manufacturing facility, at least one cutout portion to include a first cutout portion. In one embodiment, the first cutout portion is occupied (such as filled) by a first conductive material. The manufacturing facility manufactures the at least one cutout portion to further include a second cutout portion; the second cutout portion is occupied (such as filled) by a second conductive material.

[0016] In still further example embodiments, the plurality of conductive paths disposed in the core includes N conductive paths, where N is greater than 2.

[0017] Other embodiments herein include receiving a circuit component as previously discussed and using the circuit component (device) to manufacture a circuit. For example, a circuit board manufacturing facility or manufacturing system disposes the circuit component in a power converter that is affixed to a circuit board. In one embodiment, the power converter (such as a voltage regulator) operates to convert an input voltage to an output voltage.

[0018] In further example embodiments, when installing the circuit component in the power converter, the manufacturing system disposes a longitudinal axis of the first conductive path to be orthogonal to a surface of the substrate; and the manufacturing system disposes a longitudinal axis of the second conductive path to be orthogonal to the surface of the substrate. Alternatively, the manufacturing system disposes the longitudinal axis of the first conductive path to be parallel to a planar surface of the substrate; and the manufacturing system disposes the longitudinal axis of the second conductive path to be parallel to the planar surface of the substrate.

[0019] In further example embodiments, one or more cutout portions in the core of the circuit component include a first cutout portion and a second cutout portion. The manufacturing system fills the first cutout portion with a first conductive material; the manufacturing system fills the second cutout portion with a second conductive material. In one embodiment, the first conductive material operates to convey a first voltage provided from the substrate; and the second conductive material operates to convey a second voltage provided from the substrate.

[0020] In further example embodiments, a device as discussed herein includes a plurality of cells, for example: i) a first cell, the first conductive path resides in the first cell, the first cell is at least partially defined by the at least one cutout portion; and ii) a second cell, the second conductive path resides in the second cell, the second cell is at least partially defined by the at least one cutout portion.

[0021] Each cutout portion can be manufactured in any suitable shape, form, size, etc. For example, in one embodiment, a cross-section of each of the at least one cutout portion in the component is triangular, rectangular, trapezoidal, etc.

[0022] These and other more specific embodiments are disclosed in more detail below.

[0023] Note that any resource (such as a manufacturing facility) implemented in a system as discussed herein can include one or more computerized devices, production devices, manufacturing devices, circuit board assembly devices, material handlers, controllers, mobile communication devices, hand-held or laptop computers, etc. to perform and / or support any or all of the method operations disclosed herein. In other words, one or more computerized devices or processors or corresponding devices can be programmed and / or configured to operate as explained herein to perform different embodiments as described herein.

[0024] Other embodiments herein include software programs to perform the steps and operations summarized above and disclosed in detail below. One such embodiment includes a computer program product that has a non-transitory computer readable storage medium (i.e., any computer readable hardware storage medium) encoded thereon with software instructions. The instructions, when executed in a computerized device with a processor (hardware), program and / or cause the processor (hardware) to perform the operations disclosed herein. Such arrangements are typically provided as software, code, instructions and / or other data (e.g., data structures) arranged or encoded on the non-transitory computer readable storage medium such as an optical medium (e.g., CD-ROM), floppy or hard disk, memory stick, memory device, etc., or other media suitable for the storage of computer readable hardware storage medium such as one or more ROMs, RAMs, PROMs, etc., firmware, or other hardware that is arranged or programmed to provide the instructions, code and / or other data to the processor (hardware) of the computerized device. The software or firmware or other such configurations can be installed onto a computerized device to cause the computerized device to perform the techniques explained herein.

[0025] Accordingly, embodiments herein are directed to methods, systems, computer program products, etc. that support operations as discussed herein.

[0026] One embodiment includes a manufacturing facility, such as a system including a computer readable storage medium and / or having instructions stored thereon to manufacture an inductor component as described herein. The instructions, when executed by computer processor hardware, cause the computer processor hardware, such as one or more processor devices or hardware located in the same location or in different locations, to: manufacture a core of the circuit component to include a magnetically permeable material; extend a plurality of electrically conductive paths through the core of the magnetically permeable material, the plurality of electrically conductive paths including a first electrically conductive path and a second electrically conductive path; and manufacture the core of the magnetically permeable material to include at least one cutout portion, the at least one cutout portion operable to reduce an inductive coupling between the first electrically conductive path and the second electrically conductive path.

[0027] For clarity, the order of the above steps has been added. Note that any of the processing steps as discussed herein can be performed in any suitable order.

[0028] Other embodiments of the present disclosure include software programs and / or corresponding hardware for implementing any of the method embodiments summari zed and disclosed in detail below.

[0029] It should be appreciated that, as discussed herein, systems, methods, apparatuses, instructions, etc. on computer readable storage media can also be embodied strictly as software programs, firmware, software, a mixture of hardware and / or firmware, or solely as hardware, for example within a processor (hardware or software), or within an operating system or within a software application.

[0030] It is further noted that although embodiments discussed herein are applicable to switched mode power supplies, the concepts disclosed herein can be advantageously applied to any other suitable topology.

[0031] Additionally, it is noted that although each of the different features, techniques, configurations, etc. discussed herein can be discussed with respect to different embodiments of the present disclosure, each of the concepts can be optionally and independently employed in other embodiments of the present disclosure, as appreciated.

[0032] Furthermore, it is noted that the initial discussions of embodiments herein (SUMMARY) are intentionally in non-specific terms so as to not designate or limit each embodiment and / or incremental novel aspect of the present disclosure or claimed invention. Rather, this brief description merely presents general embodiments and corresponding points of novelty over conventional technology. For additional details and / or possible points of view, the reader is referred to the DETAILED DESCRIPTION of the Invention section of the present disclosure discussed further below (which is a summary of the embodiments) and to the corresponding drawings. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1 is an exemplary three-dimensional view of an inductive circuit component according to embodiments herein.

[0034] Figure 2 is an example plot illustrating magnetic permeability versus magnetic field for a magnetic permeable material according to embodiments herein.

[0035] Figure 3 is an example plot illustrating a region of shared core area for inductor circuit components that results in inductive coupling between multiple electrically conductive paths where mutual flux does exist according to embodiments herein.

[0036] Figure 4A is an example plot illustrating magnetic flux coupling between multiple electrically conductive paths according to embodiments herein.

[0037] Figure 4B is an example plot illustrating implementing multiple cutout portions to reduce inductive coupling between multiple inductive paths in a circuit component according to embodiments herein.

[0038] Figure 4C is an example plot illustrating implementing multiple cutout portions to reduce inductive coupling between multiple inductive paths in a circuit component according to embodiments herein.

[0039] Figure 5A is an example plot illustrating a top view of a circuit component according to embodiments herein.

[0040] Figure 5B is an example plot illustrating a side view of a circuit component according to embodiments herein.

[0041] Figure 6A is an example plot illustrating a top view of a circuit component and implementation of cutout portions at a first width according to embodiments herein.

[0042] Figure 6B is an example plot illustrating a top view of a circuit component and implementation of cutout portions at a second width according to embodiments herein.

[0043] Figure 6C is an example plot illustrating a top view of a circuit component and implementation of cutout portions at a third width according to embodiments herein.

[0044] Figure 7A is an example plot illustrating variation in inductive coupling between multiple inductive paths in a circuit component based on implementation of cutout portions of different depths according to embodiments herein.

[0045] Figure 7B is an example plot illustrating variation in inductance of inductive paths in a circuit component based on implementation of cutout portions of different depths according to embodiments herein.

[0046] Figure 8Ais an example diagram illustrating a top view of a circuit component manufactured to include conductive material, in accordance with an embodiment herein.

[0047] Figure 8B is an example diagram illustrating a top view of a circuit component manufactured to include conductive material, in accordance with an embodiment herein.

[0048] Figure 9 is an example diagram illustrating an exploded view of a voltage regulator circuit assembly, in accordance with an embodiment herein.

[0049] Figure 10 is an example diagram illustrating a voltage regulator circuit assembly, in accordance with an embodiment herein.

[0050] Figure 11 is an example diagram illustrating connectivity of a circuit component including one or more inductor devices in a power supply, in accordance with an embodiment herein.

[0051] Figure 12 is an example side view of a multiphase power supply (in Figure 11 ) and inductor devices supporting vertical power flow, in accordance with an embodiment herein.

[0052] Figure 13 is an example diagram illustrating a power supply circuit assembly including one or more inductor devices, in accordance with an embodiment herein.

[0053] Figure 14 is an example diagram illustrating a power supply circuit assembly including one or more inductor devices, in accordance with an embodiment herein.

[0054] Figure 15 is an example diagram illustrating a power supply circuit assembly including one or more inductor devices, in accordance with an embodiment herein.

[0055] Figure 16 is an example diagram illustrating an implementation of a circuit assembly including inductive circuit components, in accordance with an embodiment herein.

[0056] Figure 17 is an example diagram illustrating an example computer architecture (manufacturing facility system, manufacturing facility hardware, etc.) operable to perform one or more methods in accordance with an embodiment herein.

[0057] Figure 18 is an example diagram illustrating a method, in accordance with an embodiment herein.

[0058] The foregoing and other objects, features and advantages of the embodiments herein will be apparent from the following more particular descriptions of particular embodiments of the application, as illustrated in the accompanying drawings in which the same reference numbers will be used for like components throughout the different views. The drawings are not necessarily to scale, emphasis has been placed on illustrating the embodiments, principles, concepts, etc. DETAILED DESCRIPTION

[0059] According to one configuration, a manufacturing facility manufactures a core of a circuit component to include a magnetically permeable material. The manufacturing facility further produces the circuit component to include a plurality of electrically conductive paths, such as extending through the core of the magnetically permeable material from one surface to another surface. In one arrangement, the plurality of electrically conductive paths includes a first electrically conductive path and a second electrically conductive path. The manufacturing facility further manufactures the circuit component, and more specifically the core of the magnetically permeable material, to include at least one cutout portion operable to reduce an inductive coupling between the first electrically conductive path and the second electrically conductive path disposed in the core.

[0060] Referring now to the drawings, Figure 1 is an exemplary three-dimensional view of an inductive circuit component according to embodiments herein.

[0061] In this example embodiment, a manufacturing facility 150 receives a material of one or more metals, such as a metal (electrically conductive material), a metal alloy, a magnetically permeable material, and the like.

[0062] Based on the received material, the manufacturing facility 150 manufactures a core (such as a monolithic solid structure) of a circuit component 110 via a magnetically permeable material 161. The manufacturing facility 150 further manufactures the circuit component 110 to include a plurality of electrically conductive paths 120 (such as electrically conductive path 120-1, electrically conductive path 120-2, electrically conductive path 120-3, electrically conductive path 120-4) extending through the core of the magnetically permeable material 161. In one embodiment, the manufacturing facility 150 drills a hole through the magnetically permeable material 161 and fills the hole with an electrically conductive material to produce the electrically conductive paths 120.

[0063] As desired, each of the electrically conductive paths 120 is surrounded by a layer of insulating material (such as a non-conductive material) such that the electrically conductive paths are not in contact with the core magnetically permeable material 161. In other words, each electrically conductive path 120 is optionally coated with a layer of insulating material disposed between the corresponding electrically conductive path and the magnetically permeable material 161.

[0064] In further example embodiments, the manufacturing facility 150 manufactures the circuit component 110, and more specifically the core of the magnetically permeable material 161, to include one or more cutout portions 130 (such as one or more of cutout portion 130-1, cutout portion 130-2, cutout portion 130-3, cutout portion 130-4, cutout portion 130-5, cutout portion 130-6).

[0065] As further discussed herein, the presence of the cutout portions 130 at the respective one or more locations of the circuit component 110 as shown reduces the inductive coupling between each pair of conductive paths, such as between: i) the first conductive path 130-1 and the second conductive path 130-2, ii) the second conductive path 130-2 and the third conductive path 130-3, iii) the third conductive path 130-3 and the fourth conductive path 130-4.

[0066] Note that the implementation of the four conductive paths provided in the component 110 is shown by way of non-limiting example embodiment only. In a still further example embodiment, the plurality of conductive paths 120 provided in the core includes N conductive paths, where N is any value greater than 2.

[0067] As previously mentioned, the one or more cutout portions 130 of the magnetically permeable material 161 include the cutout portion 130-1, the cutout portion 130-2, the cutout portion 130-3, the cutout portion 130-4, the cutout portion 130-5, the cutout portion 130-6, etc. by the manufacturing operation performed by the manufacturing facility 150. In this example embodiment, the magnetically permeable material 161 is not present in the cutout portion 130-1, the cutout portion 135-2, the cutout portion 130-3, the cutout portion 130-4, the cutout portion 130-5, the cutout portion 130-6, etc.

[0068] In a still further example embodiment, in addition to the one or more cutout portions 130, the manufacturing facility 150 manufactures the circuit component 110 to include a portion of the magnetically permeable material (such as a continuous body of the magnetically permeable material 161 without breaks or voids) between each pair of conductive paths, such as between: i) the conductive path 120-1 and the conductive path 120-2, ii) the conductive path 120-2 and the conductive path 120-3, iii) the conductive path 120-3 and the conductive path 120-4.

[0069] In one embodiment, the manufacturing facility 150 controls the dimensions of the circuit component 110 to control the degree to which adjacent pairs of conductive paths are inductively coupled. For example, the manufacturing facility 150 produces the circuit component 110 to have a width W1 along the z-axis. The manufacturing facility 150 controls the degree of inductive coupling between the continuous pairs of conductive paths by the width W2 between the respective opposing pairs of cutout portions, such as between the first pair including the cutout portion 130-1 and the cutout portion 130-2, between the second pair including the cutout portion 130-3 and the cutout portion 130-4.

[0070] For example, in one embodiment, the manufacturing facility 150 reduces the amount of inductive coupling between respective pairs of conductive paths by implementing a smaller width W2 (the smaller the size, the larger the cut) between respective cut portions 130. Conversely, the manufacturing facility 150 increases the amount of inductive coupling between respective pairs of conductive paths by implementing a wider width W2 between respective cut portions 130.

[0071] Further note that the presence of the magnetically permeable material 161 transforms each conductive path into an inductive path (i.e., an inductor device 110). For example, the flow of current through the conductive path 120-1 (inductive path) results in the generation of a corresponding magnetic flux in accordance with the right-hand rule.

[0072] As the name implies, the magnetically permeable material 161 surrounding the conductive paths 120 is magnetically permeable. The magnetically permeable material can be made of any suitable material. In one embodiment, by way of non-limiting example embodiment, the core material 120 has a magnetic permeability between 10-100 henries / meter or any other suitable value or range.

[0073] In further embodiments, again note that the conductive paths can be made of any suitable electrically conductive material, such as a metal, a metal alloy (a combination of different metals, including electrically conductive materials such as copper, tin, etc.), and the like.

[0074] Further note that the conductive paths 131 can be manufactured in any suitable shape, such as a rod, a column, and the like.

[0075] In one embodiment, each of the conductive paths in the magnetically permeable material 161 is a non-wound circuit path that extends along (parallel to) the Y-axis through the inductor device 110. Note that each inductor disposed in a shared medium (i.e., the magnetically permeable material 161) can be manufactured as a cylinder or any other suitable shape.

[0076] Accordingly, embodiments herein include novel circuit components 110 that include a common core (structure) of magnetically permeable material 161. Implementing multiple inductor devices in the same structure of magnetically permeable material 161 associated with the circuit component 110 facilitates the mounting or fixing of the corresponding circuit component 110 on a respective circuit substrate and assembly of a respective circuit. Implementing multiple inductor devices in the same structure of the circuit component 110 enables the manufacturing of smaller footprint circuits.

[0077] As previously mentioned, state-of-the-art (conventional) multiphase solutions include implementing independent magnetic devices and independent cores for each phase of the power supply, rather than providing an integrated monolithic structure as described herein. From a total circuit board space consumption perspective, conventional single inductor components are not optimal, which results in a larger system size. This not only impacts the overall power density of the power generation, but also limits the selection of the inductor components to be physically close to the location of the corresponding power load.

[0078] Accordingly, embodiments herein propose a monolithic magnetic structure (such as the magnetically permeable material block 161) with a linear arrangement of single-turn inductor paths (such as the electrically conductive paths 120), where the lateral coupling (electrically conductive paths 120) of adjacent phases can be adjusted from a first amount of inductive coupling to substantially no inductive coupling by a geometric cutout (cutout portion) of the core magnetically permeable material 161.

[0079] In certain cases, the magnetic structure (circuit component 110) enables the integration of a vertical power flow and a single-turn inductor multiphase arrangement. Note that even though the primary embodiment is a solution without any air gap between each pair of electrically conductive paths, the core magnetically permeable material 161 can be manufactured to include a single or distributed air gap (or no air gap at all) per phase between pairs of electrically conductive paths. The cutout of the core material (such as the cutout portion or void of the magnetically permeable material 161) is not considered an air gap as it does not extend across the entire cross-section of the core. In other words, the value of W2 is greater than zero, resulting in multiple inductor paths rigidly disposed in the same circuit component 110 structure.

[0080] Figure 2 is an example plot illustrating the magnetic permeability of a magnetically permeable material versus the magnetic field according to embodiments herein.

[0081] In one embodiment, by way of non-limiting example, Figure 1 The circuit component 110 in can be manufactured as follows:

[0082] - The initial core magnetic permeability μ of the magnetically permeable material 161 is: 66

[0083] - The corresponding μ vs. Hdc curve is as shown in Figure 2

[0084] - The magnetically permeable material 161 Yang-axis core height: 2 mm

[0085] - The single core XY dimensions: 6.75 mm x 6.75 mm

[0086] - The total core XY dimensions: 30 mm

[0087] - The electrically conductive path diameter (such as the copper bar diameter): 1 mm

[0088] - The current: 62.5 Amps DC.​

[0089] As previously discussed, Figure 2 Curve 220 in graph 200 illustrates the relationship of permeability to DC magnetic field. As shown, as the DC magnetic field increases, i.e., by increasing the current in the respective conductive path (e.g., single-turn inductor), the permeability slowly decreases.

[0090] Figure 3 is an example graph illustrating the area of shared core area (where mutual flux exists) that results in inductive coupling between multiple conductive paths, in accordance with embodiments herein.

[0091] In one embodiment, without the cutout portions provided in the magnetic permeable material 161, Figure 3 Circuit component 110-10 in has an inductance of 29 nH for each of the four phases (conductive paths 120), while the coupling between each adjacent pair of conductive paths (also referred to as phases) is 4%. Thus, even before the cutout portions 130 are implemented in the magnetic permeable material 161, the inductive coupling is fairly low.

[0092] The present disclosure includes the observation that in some circuit applications, it can be desirable to reduce the coupling between pairs of consecutive conductive paths to a controlled minimum, while maintaining a monolithic core structure (of the magnetic permeable material 161). The remaining coupling between pairs of phases (i.e., conductive paths) has a non-negligible mutual flux due to the shared core area (such as volume 310-1, volume 310-2, volume 310-3, volume 310-4, volume 310-5, etc.) of the magnetic permeable material 161.

[0093] Note that the following FIGS. 4-6 illustrate different examples of implementing a void cutout portion (filled with other material or not) in the magnetic permeable material to reduce the magnetic flux coupling, in accordance with embodiments herein.

[0094] Referring to Figure 1 And other figures, the cutout portions 130 are symmetrically arranged with respect to a longitudinal axis, such as the X-axis, as discussed herein. In one embodiment, the conductive paths, such as copper bars, are also symmetric.

[0095] In further example embodiments, as discussed herein, one purpose of the cutout portions is to eliminate / reduce the area where mutual flux exists between adjacent conductive paths 120. Since the placement of the conductive paths 120 in component 110 is symmetric along the X-axis, they also symmetrically generate flux, so they are the core area where mutual flux exists, so the cutouts (cutout portions) are symmetric in one embodiment. More specifically, as previously discussed with respect to Figure 1As discussed, cutout portion 130-1 is disposed opposite cutout portion 130-2; cutout portion 130-3 is disposed opposite cutout portion 130-4, and so on. Thus, the location of the cutout portions is related to the arrangement and / or location of the conductive paths 120 in the component 110.

[0096] Further, note that the component can include cutout portions disposed on only one side of the component 110. For example, the component 110 can include cutout portions 130-1, 130-3, and 130-5 without implementing cutout portions 130-2, 130-4, and 130-6. In this case, this would result in less reduction of mutual coupling from one conductive path output to the next adjacent conductive path.

[0097] In further example embodiments, note that the presence of the cutout portions 130 imparts a configuration to the overall structure of the component 110 that presents a plurality of adjacent and contiguous“cells,” each having one of the conductive paths disposed therethrough. For example, Figure 1 The component 110 of FIG. 1 includes: cell #1 (including conductive path 120-1 and corresponding surrounding magnetically permeable material 161), cell #2 (including conductive path 120-2 and corresponding surrounding magnetically permeable material 161), cell #3 (including conductive path 120-3 and corresponding surrounding magnetically permeable material 161), cell #4 (including conductive path 120-1 and corresponding surrounding magnetically permeable material 161).

[0098] As previously discussed, the components 110 as discussed herein can include any number of cells along the X-axis, Z-axis, etc. Thus, embodiments herein include one-dimensional arrays of cells, two-dimensional arrays of cells, etc.

[0099] In one embodiment, each cell has the same shape. However, this is optional as the shape of the cells in the respective component 110, the corresponding cross-section and volume of the cutout portions, etc. can vary according to embodiments.

[0100] In still further embodiments, note that the adjacent and contiguous cell configuration of the component 110 and their spacing provides a way to maximize the inductance of each conductive path (given the available area and its form factor) and to keep the coupling from one conductive path to the next one at a reduced or minimum value (without introducing air gaps and cutouts). Embodiments herein include different core geometries and winding arrangements of the component 110 shown, and where there is no symmetry between the bars. In this case, the cutout portions or cutouts (intended to remove the shared core area where mutual flux exists) and the resulting core structure can also not be symmetrical. Figure 1 The component 110 shown, and where there is no symmetry between the bars. In this case, the cutout portions or cutouts (intended to remove the shared core area where mutual flux exists) and the resulting core structure can also not be symmetrical.

[0101] Further, as noted previously, again note that the shape of the cutout portion can vary depending on the embodiment. Again note that the coupling between and / or among different cells and corresponding conductive paths is tuned by removing / reducing the corresponding core area where mutual flux exists (such as by the cutout portion discussed previously).

[0102] Figure 4A is an example diagram illustrating a top view of a circuit component according to embodiments herein and where there is magnetic flux coupling between multiple conductive paths in a circuit component without a cutout portion.

[0103] In this embodiment, current flow through conductive path 120-2 results in flux 450 being generated according to the right-hand rule. There is magnetic flux 450 resulting from the current through conductive path 120-2 that causes a corresponding amount of current to flow through conductive path 120-1 and conductive path 120-3 as a result of magnetic flux 450. In other words, the inductive coupling between conductive path 120-2 and conductive path 120-1 causes current to flow through conductive path 120-1 based on the current flowing through conductive path 120-2.

[0104] More specifically, due to the inductive coupling between conductive path 120-2 and conductive path 120-1, current flow through conductive path 120-2 results in a corresponding small amount of current flowing through conductive path 120-1. Similarly, due to the inductive coupling between conductive path 120-2 and conductive path 120-3, current flow through conductive path 120-2 results in a corresponding small amount of current flowing through conductive path 120-3.

[0105] The following figures illustrate how implementation of one or more cutout portions in circuit component 110 results in a reduction in inductive coupling between pairs of adjacent conductive path pairs.

[0106] Figure 4B is an example diagram illustrating implementation of multiple cutout portions to reduce inductive coupling between multiple inductive paths in a circuit component according to embodiments herein.

[0107] As noted previously, in one embodiment, manufacturing facility 150 manufactures circuit component 110 to include a portion of magnetically permeable material 161 (such as a continuous body without interruption in the material).

[0108] Additionally or alternatively, the manufacturing facility 150 manufactures the circuit component 110 to include a cutout portion 130-1 (such as a triangular top view cross-sectional cutout portion) and a cutout portion 130-2 (such as a triangular top view cross-sectional cutout portion), where neither the cutout portion 130-1 nor the cutout portion 130-2 includes a magnetically permeable material 161. The manufacturing facility 150 manufactures the circuit component 110 to include a cutout portion 130-3 (such as a triangular top view cross-sectional cutout portion) and a cutout portion 130-4 (such as a triangular top view cross-sectional cutout portion), where neither the cutout portion 130-3 nor the cutout portion 130-4 includes a magnetically permeable material 161.

[0109] The absence of the magnetically permeable material 161 at one or more locations of the circuit component 110-1 reduces the mutual magnetic flux 450 flow, and thus reduces the inductive coupling between the conductive path 130-2 and the conductive path 130-1. As previously discussed, the presence of the magnetically permeable material 161 around the conductive path 120 results in each conductive path being an inductive path in the circuit component 110-1.

[0110] In further example embodiments, the manufacturing facility 150 manufactures at least one cutout portion in the circuit component to include a first cutout portion 130-1. In one embodiment, the first cutout portion 130-1 is disposed in a flux path associated with a first current flowing through the conductive path 120-2 and a flux path associated with a second current flowing through the conductive path 120-1 (see magnetic flux 450). As discussed further below, the cutout portion is not limited to a particular shape or axis.

[0111] Figure 4C FIG. 4 is an example diagram illustrating implementing multiple cutout portions to reduce inductive coupling between multiple inductive paths in a circuit component, in accordance with embodiments herein.

[0112] This example embodiment illustrates how the manufacturing facility 150 disposes each conductive path 120 to be parallel with respect to the Y-axis and to each other, such that each conductive path 120 extends from a first surface 481 of the circuit component 110-1 to a second surface 482 of the circuit component 110-1.

[0113] In this embodiment, cutout portions 430-1, 430-2, 430-3, 430-4, etc. along the Z-axis can also be used to disrupt the magnetic flux 450 to reduce the degree of inductive coupling between pairs of conductive paths, if desired.

[0114] Figure 5A FIG. 5 is an example diagram illustrating a top view of a circuit component, in accordance with embodiments herein.

[0115] As previously mentioned, the manufacturing facility 150 controls the width W2 associated with the manufacture of the cutout portions. In one embodiment, each cutout portion 130 (such as a triangular top view cross-section) is wedge-shaped, although the cutout portions can be any suitable shape or size. Note that the cutout portions 130 can be manufactured in any suitable manner.

[0116] For example, in one embodiment, the manufacturing facility 150 implements tools to physically cut away existing portions of the magnetically permeable material 161 to produce each cutout portion. Alternatively or additionally, the manufacturing facility 150 produces the structure of the magnetically permeable material 161 by filling a mold that includes the cutout portions. In the latter case, the cutout portions do not need to be manufactured by removing magnetically permeable material 161 in these regions.

[0117] Figure 5B is an example diagram illustrating a side view of a circuit component according to embodiments herein.

[0118] As shown in this example embodiment, each conductive path (conductive path 120-1, conductive path 120-2, conductive path 120-3, and conductive path 120-4) extends parallel from a surface 581 to a surface 582 of the circuit component 110.

[0119] Figure 6A is an example diagram illustrating a top view of a circuit component according to embodiments herein and an implementation of a cutout portion at a first width.

[0120] As previously mentioned, implementing one or more cutout portions 130 (such as, from a top cross-sectional view, a ladder-shaped cutout portion) of the magnetically permeable material 161 in the circuit component 110 (such as a monolithic magnetic structure, a monolithic magnetically permeable material solid 161) controls the inductive coupling between the conductive paths.

[0121] In one embodiment, the purpose of such cutouts (such as the cutout portions 130) is to reduce the shared core area (volume) of mutual flux present in the magnetically permeable material 161 until the desired coupling is achieved between adjacent pairs of conductive paths. For example, the amount of magnetic (inductive) coupling between the respective pairs of conductive paths is related to the remaining shared portion (core area) of the magnetically permeable material 161 and thus can be tuned by the width W2.

[0122] In Figure 6A In the example embodiment shown, the manufacturing facility 150 controls the width associated with the cutout portions 130 to a value of W2-1 in the example circuit component 110-1.

[0123] Figure 6B is an example diagram illustrating a top view of a circuit component according to embodiments herein and an implementation of a cutout portion at a second width.

[0124] InFigure 6B In the example embodiment shown, manufacturing facility 150 controls the width associated with cutout portion 130 to the value of W2-2 in example circuit component 110-2.

[0125] Figure 6C is an example diagram illustrating a top view of a circuit component and an implementation of a cutout portion at a third width, in accordance with an embodiment herein.

[0126] In Figure 6C In the example embodiment shown, manufacturing facility 150 controls the width associated with cutout portion 130 to the value of W2-3 in example circuit component 110-3. This results in the lowest inductive coupling between pairs of adjacent conductive paths.

[0127] Figure 7A is an example diagram illustrating a variation in inductive coupling between multiple inductive paths in a circuit component based on implementing cutout portions of different depths, in accordance with an embodiment herein.

[0128] In this example embodiment, curve 711 in graph 710 represents a variation in inductive coupling associated with pairs of adjacent conductive paths as a function of the width W2 (which corresponds to the depth of the cutout portion) implemented by manufacturing facility 150. For example, as previously described, larger values of width W2 (smaller sized cutout portions 130) result in larger inductive coupling and larger total inductance per conductive path. Conversely, smaller values of width W2 result in lower inductive coupling and lower total inductance.

[0129] Figure 7B is an example diagram illustrating a variation in inductance of an inductive path in a circuit component based on implementing cutout portions of different depths, in accordance with an embodiment herein.

[0130] As previously described and as illustrated in graph 720, a reduction in the core area of magnetic permeable material 161 (through the cutout portion) in each circuit component 110 results in an increase in the corresponding magnetic reluctance; that is, the deeper the cutout (the smaller the width W2), the lower the inductance of each corresponding inductive path (conductive path) as illustrated in graph 720. Thus, there is a tradeoff between inductive coupling and inductance, and the optimal coupling and inductance values are selected by manufacturing facility 150 according to the desired component requirements (by selecting an appropriate size for W2 and other dimensions associated with the circuit component).

[0131] Figure 8A is an example diagram illustrating a circuit component manufactured to include conductive material, in accordance with an embodiment herein.

[0132] In further example embodiments, the manufacturing facility 150 (such as a manufacturing system) fills one or more of the cutout portions 130 with electrically conductive material. For example, in one embodiment, the manufacturing facility 150 fills the first cutout portions 130-1, 130-3, and 130-5 of the circuit component 110-3 with a first electrically conductive material 820-1 (such as a metal); the manufacturing facility 150 fills the second cutout portions 130-2, 130-4, and 130-6 with a second electrically conductive material 820-2 (such as a metal).

[0133] Thus, in one embodiment, the first cutout portion 130-1 is occupied (such as filled) with the first electrically conductive material 820-1. The manufacturing facility 150 manufactures at least one of the cutout portions in the circuit component 110-3 to further include a second cutout portion 130-2; the second cutout portion 130-2 is occupied (such as filled) with the second electrically conductive material 820-2.

[0134] Figure 8B FIG. 1 is an example diagram illustrating a circuit component manufactured to include electrically conductive material, in accordance with embodiments herein.

[0135] In this example embodiment, the electrically conductive material (such as a metal or other conductor) disposed in each of the respective cutout portions is electrically isolated from one another.

[0136] More specifically, in this example embodiment, the cutout portion 130-1 is filled with the electrically conductive material 850-1; the cutout portion 130-2 is filled with the electrically conductive material 850-2; the cutout portion 130-3 is filled with the electrically conductive material 850-3; the cutout portion 130-4 is filled with the electrically conductive material 850-4; the cutout portion 130-5 is filled with the electrically conductive material 850-5; the cutout portion 130-6 is filled with the electrically conductive material 850-6, by the manufacturing facility 150.

[0137] The respective corners of the core of the magnetically permeable material 161 include the electrically conductive materials 850-7, 850-8, 850-9, and 850-10.

[0138] Also, in this embodiment, each instance of the electrically conductive material 850 that fills a respective cutout portion is isolated from one another, such that each instance of the electrically conductive material is able to carry a different signal or voltage.

[0139] Figure 9 FIG. 2 is an example exploded diagram illustrating a voltage regulator circuit assembly, in accordance with embodiments herein.

[0140] In this example embodiment, the power assembly 910 includes the electrically conductive material 820-1, the electrically conductive material 820-2, the electrically conductive paths 120, the magnetically permeable material core 161, the circuit board 966 including the circuits 920-1, 920-2, 920-3, etc., and the protective cover 930 or heat sink.

[0141] In one embodiment, each instance of the circuits 920-1, 920-2, 920-3, etc., includes respective one or more switches and control circuits to control the amount of current flowing through the respective electrically conductive paths.

[0142] For example, in one embodiment, the circuit 920-1 is configured to control the amount of current through the electrically conductive path 120-1; the circuit 920-2 is configured to control the amount of current through the electrically conductive path 120-2; the circuit 920-3 is configured to control the amount of current through the electrically conductive path 120-3; and so on.

[0143] In one embodiment, the first electrically conductive material 820-1 is operative to provide a first voltage (such as an input voltage) from a substrate on which the assembly 910 is mounted to respective instances of the power circuits 920; the second electrically conductive material 820-2 is operative to electrically connect the respective instances of the power circuits 920 to a second voltage (such as a ground reference voltage) provided from the substrate on which the assembly is mounted.

[0144] Figure 10 is an example diagram illustrating a voltage regulator circuit assembly according to embodiments herein.

[0145] In this example embodiment, the circuit assembly 910 is assembled as an array of power circuits 920 that control the flow of current through respective electrically conductive paths and generate one or more output voltages to power a load. As previously mentioned, the assembly 910 can be mounted in a respective circuit board (substrate).

[0146] Figure 11 is an example diagram illustrating connectivity of circuit components in a power supply according to embodiments herein.

[0147] In this non-limiting example embodiment, the power supply 1500 includes a controller 1540 and a plurality of phases 221 and 222 that collectively generate a respective output voltage 123 (output current) to power a load 118. The load 118 can be any suitable circuit that can be located on a standalone circuit board or a remote circuit board, such as a CPU (central processing unit), a GPU, and an ASIC (such as including one or more artificial intelligence accelerators), etc.

[0148] Note that power supply 1500 can include any number of phases. If desired, the phases can be split such that a first phase 221 powers a first load and a second phase 222 powers a second load. Alternatively, a combination of phase 221 and phase 222 drives the same load 118.

[0149] As shown in the example embodiment in which a combination of phase 221 and phase 222 powers the same load 118, phase 221 includes switch QA1, switch QB1, and a plurality of paths 1531, such as conductive paths 120-1. Phase 222 includes switch QA2, switch QB2, and a plurality of paths 1532.

[0150] Further, in this example embodiment, voltage source 120-1 provides voltage VI, such as 6VDC or any suitable voltage, to a series combination of switch QA1, such as a high-side switch, and switch QB1, such as a low-side switch.

[0151] In one embodiment, the combination of switches QA1 and QB1 and inductive path 1531, such as an inductor implemented by conductive paths 120-1 through circuit components 110, operates according to a buck converter topology to produce output voltage 123.

[0152] Further, in this example embodiment, note that the drain node (D) of switch QA1 is connected to receive voltage VI provided by voltage source 120-1. The source node (S) of switch QA1 is coupled to the drain node (D) of switch QB1 and to an input node of inductive path 1531. The source node of switch QB1 is coupled to ground. An output node of inductive path 1531 is coupled to load 118.

[0153] Still further in this example embodiment, the drain node of switch QA2 of phase 222 is connected to receive voltage VI provided by voltage source 120-1. The source node (S) of switch QA2 is coupled to the drain node (D) of switch QB2 and to an input node of inductive path 1532, such as an inductor implemented via conductive paths 120-2 through circuit components 110. The source node of switch QB2 is coupled to ground. An output node of plurality of paths 1532 is coupled to load 118.

[0154] As previously mentioned, the combination of phase 221 and 222 produces output voltage 123 to power load 118. That is, inductive path 1531 produces output voltage 123; inductive path 1532 also produces output voltage 123.

[0155] As shown, during operation, the controller 1540 generates control signals 105 (such as control signal Al and control signal Bl) to control the state of the respective switches QA1 and QB1. For example, the control signal Al generated by the controller 1540 drives and controls the gate node of the switch QA1; the control signal Bl generated by the controller 1540 drives and controls the gate node of the switch QB1.

[0156] Additionally, the controller 1540 generates control signals A2 and B2 to control the state of the switches QA2 and QB2. For example, the control signal A2 generated by the controller 1540 drives and controls the gate node of the switch QA2; the control signal B2 generated by the controller 1540 drives and controls the gate node of the switch QB2.

[0157] In one embodiment, the controller 1540 controls the phases 221 and 222 to be 180 degrees out of phase with respect to each other.

[0158] As known for a buck converter, in phase 221, when the switch QB1 is deactivated (OFF), activating the high-side switch QA1 to the ON state couples the input voltage VI to the input of the inductive path 1531, causing an increase (such as a ramp) in the amount of current provided by the inductive path 1531 to the load 118. Conversely, when the switch QA1 is deactivated (OFF), activating the low-side switch QB1 to the ON state couples the ground reference voltage to the input of the inductive path 1531, causing a decrease (such as a ramp) in the amount of current provided by the inductive path 1531 to the load 118. The controller 1540 monitors the magnitude of the output voltage 123 and controls the switches QA1 and QB1 such that the output voltage 123 remains within a desired voltage range.

[0159] In a similar manner, via phase 222, when the switch QB2 is deactivated (OFF), activating the high-side switch QA2 to the ON state couples the input voltage VI to the input of the inductive path 1532, causing an increase in the amount of current provided by the inductive path 1532 to the load 118. Conversely, when the switch QA2 is deactivated (OFF), activating the low-side switch QB2 to the ON state couples the ground reference voltage to the input of the inductive path 1532, causing a decrease in the amount of current provided by the inductive path 1532 to the load 118. The controller 1540 monitors the magnitude of the output voltage 123 and controls the switches QA2 and QB2 such that the output voltage 123 remains within a desired voltage range.

[0160] Figure 12 FIG. 1 is a schematic diagram illustrating a multi-phase power supply 100 according to embodiments herein. Figure 11 FIG. 2 is a schematic diagram illustrating a multi-phase power supply 200 according to embodiments herein.

[0161] Other embodiments herein include receiving a circuit component 110 as previously described (such as including a conductive path 120-1 and a conductive path 120-2).

[0162] A circuit board manufacturing facility 150 or manufacturing system disposes the circuit component 110 in a power converter that is fixed to a circuit board (such as a substrate 1505). In one embodiment, the power converter (such as a voltage regulator) operates to convert an input voltage to an output voltage.

[0163] In a further example embodiment, when installing the circuit component in the power converter, the manufacturing facility 150 disposes a longitudinal axis of the first conductive path 120-1 (also referred to as an inductance path 1531 along the Y-axis) orthogonal to a planar surface of the substrate 1505; and the manufacturing system disposes a longitudinal axis of the second conductive path 120-2 (also referred to as an inductance path 1532 along the Y-axis) orthogonal to the surface of the substrate 1505.

[0164] Instantiation of the power supply 1500 in this example embodiment supports vertical power flow. For example, the substrate 1505 and corresponding one or more power supplies (such as VI) power a power supply stack assembly 1600, which in turn powers a dynamic load 118. A ground reference (GND) conveyed through the power supply stack assembly 1600 provides a return path for reference voltage and current to be conveyed through the stack to the load 118. As previously described, cutout portions (such as cutout portion 130-1, cutout portion 130-2, etc.) can be filled with a conductive material that provides a respective path between the load 118 and the substrate 1505.

[0165] In one embodiment, the substrate 1505 is a circuit board (such as a standalone board, a motherboard, a standalone board intended to be coupled to a motherboard, etc.). The power supply stack assembly 1600 including one or more inductor devices is coupled to the substrate 1505. As previously described, the load 118 can be any suitable circuit that can be located on a standalone circuit board, such as a CPU (central processing unit), a GPU, and an ASIC (such as including one or more artificial intelligence accelerators).

[0166] Note that the inductance paths 1531, 1532, etc. in the power supply stack assembly 1600 (such as instantiation of any inductor device 110, etc. as discussed herein) can be instantiated in any suitable manner as described herein. In this non-limiting example embodiment, the power supply stack assembly 1600 includes one or more instances of any inductor device as discussed herein, such as conductive paths 120-1, 120-2, etc. The power supply stack assembly 1600 can be configured to include any number of inductor devices (conductive paths) as described herein. In this example embodiment, the circuit component 110 includes two instances of the conductive paths 120-1 and 120-2.

[0167] Further, in this example embodiment, the manufacturing facility 150 fabricates the power stack assembly 1600 (such as a DC-DC power converter) by stacking a plurality of components including a first power interface 1601, one or more switches in a switch layer 1610, a connection layer 1620, one or more inductor assemblies (such as circuit components 110 including inductor devices), and a second power interface 1602.

[0168] The manufacturing facility 150 further provides the first power interface 1601 at a base of the stack (power assembly 1600 of components). The base of the power stack assembly 1600 (such as the power interface 1601) couples the power stack assembly 1600 to the substrate 1505.

[0169] In one embodiment, the manufacturing facility 150 provides the capacitors 1521 and 1522 in a layer of the power stack assembly 1600 including the power interface 1601.

[0170] Further, when fabricating the power stack assembly 1600, the manufacturing facility 150 electrically couples a plurality of switches (such as switches QA1, QB1, QA2, and QB2) in the power stack assembly 1600 to the first power interface 1601. The first power interface 1601, and corresponding connections to the substrate 1505, enable the switches QA1, QB1, QA2, and QB2 to receive power inputs from the substrate 1505 such as input voltage VI and GND reference voltage. One or more traces, power layers, etc. on the substrate 1505 provide or deliver voltage from a voltage (or power) source to the power interface 1601 of the power stack assembly 1600.

[0171] As previously described, the controller 1540 generates control signals 105 to control respective switches QA1, QB1, QA2, and QB2 in the power stack assembly 1600 (see Figure 11 interconnectivity of FIG. 1). The manufacturing facility 150 provides connections between the controller 1540 and the switches QA1, QB1, QA2, and QB2 in any suitable manner to deliver respective signals 105.

[0172] Above the switches in the switch layer 1610, the manufacturing facility 150 further fabricates the power stack assembly 1600 to include one or more inductor devices as described herein. Additionally, via the connection layer 1620, the manufacturing facility 150 further connects the switches QA1, QB1, QA2, and QB2 to one or more inductor devices 1531 (such as conductive path 120-1), 1532 (such as conductive path 120-2), etc.

[0173] More specifically, in this example embodiment, fabrication facility 150 connects the source node (S) of switch QB1 to a ground reference node 1510-1 in power interface 1601. Note that ground reference node 1510-1 (such as a ground reference return path connected to dynamic load 118) extends from substrate 1505 to dynamic load 118 via L-shaped ground node 1510-1 (connected to a ground voltage reference). Additionally or alternatively, as previously mentioned, a cutout portion filled with conductive material can also be used to provide a return path through circuit component 110.

[0174] Fabrication facility 150 connects the drain node (D) of switch QB1 to node 1621 (such as fabricated from metal), which is electrically connected to first end portion 141 of inductive path 1531 (such as an instantiation of conductive path 120-1). Thus, via connection layer 1620, fabrication facility 150 connects the drain node of switch QB1 to inductive path 1531.

[0175] Fabrication facility 150 connects the drain node (D) of switch QB1 to node 1621 (such as fabricated from metal), which is electrically connected to first end portion 141 of inductive path 1531 (such as an instantiation of conductive path 120-1). Thus, via connection layer 1620, fabrication facility 150 connects the drain node of switch QB1 to inductive path 1531.

[0176] As further shown, fabrication facility 150 connects the source node (S) of switch QB2 to a ground reference node 1510-2 in power interface 1601. Ground reference node 1510-2 (a current return path) extends from substrate 1505 to dynamic load 118 via L-shaped ground reference node 1510-2 (connected to a ground voltage reference). Fabrication facility 150 connects the drain node (D) of switch QB2 to node 1622 (fabricated from metal, for example), which is electrically connected to first end portion 141 of inductive path 1532 (such as an instantiation of conductive path 131 or conductive path 831). Thus, via connection layer 1620, the drain node of switch QB2 is connected to inductive path 1532 of inductor device 110.

[0177] Note that while each of the nodes 1510-1 and 1510-2 appears to be L-shaped from a side view of the power stack assembly 1600, in one embodiment, the nodes 1510 extend circumferentially around the outer surface of the power stack assembly 1600 (in a similar manner to the conductive path 133 discussed previously). Additionally or alternatively, as previously noted, the cutout portions of the circuit component 110 provide a means for transmitting a voltage through the circuit component 110.

[0178] As further shown, the manufacturing facility 150 connects the drain node (D) of the switch QA2 to a voltage source node 1520 in the power interface 1601 (which is connected to the voltage VI). The manufacturing facility 150 connects the source node (S) of the switch QA2 to a node 1622, which is electrically connected to the first axial end portion 141 of the inductive path 1532 (an instantiation of the conductive path 131 or the conductive path 831). Thus, via the connection layer 1620 and the corresponding node 1622, the source node of the switch QA2 is connected to the inductive path 1532 (such as the conductive path 120-2).

[0179] Thus, the manufacturing facility 150 provides one or more switches (such as QA1, QB1, QA2, and QB2) in the power stack assembly 1600 between the first power interface 1601 and the inductor device 110.

[0180] In one non-limiting example embodiment, each of the one or more switches QA1, QB1, QA2, and QB2 in the power stack assembly 1600 is a vertical field effect transistor provided between the first power interface 1601 and the inductor device. However, additionally or alternatively, note that one or more of the switches QA1, QB1, QA2, and QB2 can be any suitable type of switch, such as a vertical or lateral field effect transistor, a bipolar junction transistor, etc. A lateral FET is also possible, but a vertical FET is the ideal choice for this concept because of the flip-chip approach taken to minimize current loops.

[0181] As previously noted, the manufacturing facility 150 manufactures the power stack assembly 1600 to include one or more inductor devices. In this example embodiment, the manufacturing facility 150 provides a plurality of inductive paths 1531 (the conductive path 120-1) and the inductive path 1532 (the conductive path 120-2) in the power stack assembly 1600 between the plurality of switches QA1, QB1, QA2, and QB2 and the second power interface 1602.

[0182] According to a further embodiment, note that the fabrication of the plurality of inductor paths 1531 and 1532 includes: fabricating the plurality of inductor paths as including a first inductor path 1531 (conductive path 120-1) and a second inductor path 1532 (conductive path 120-2), the first inductor path 1531 and the second inductor path 1532 extending through the core magnetic material 161 of the respective inductor device 110 between the connection layer 1620 and the power interface 1602. In one embodiment, the fabrication facility 150 fabricates each inductor device 1510 as including: i) a core magnetic material 161, the core magnetic material being a magnetically conductive material, and ii) a conductive path 120-1 extending from a first axial end of conductive path 120-1 through the core material 161 to a second axial end 142-1 of conductive path 120.

[0183] Furthermore, in this example embodiment, the first inductor path 1531 is disposed in the first phase 221 of the power stack fabrication 1600 (power converter circuit). Figure 11 In the second inductor path 1532, the second inductor path 1532 is located in the second phase 222 of the power stack assembly 1600 (power converter circuit). Figure 11 In the power converter (power stack assembly 1600), during operation, the combination of the first phase 221 and the second phase 222, which are configured in parallel, produces the output voltage 123. If desired, a controller 1540 can also be manufactured into the power stack assembly 1600.

[0184] In one embodiment, each of one or more inductor paths 1531 (such as conductive path 120-1) and 1532 (such as conductive path 120-2) is a corresponding winding path from a first layer (such as switch layer 1610) in the stack, which includes multiple switches QA1, QB1, QA2 and QB2, to a second layer in the stack, which includes a second power interface 1602.

[0185] Note that further embodiments herein include connecting multiple inductor paths in inductor device 1510 in parallel to increase the inductance of each inductor path. As described herein, any number of inductor paths can be connected in parallel to provide the desired total inductance. Therefore, in addition to control parameters such as the permeability of the core material 161 of the respective circuit component 110 and the respective length (between the first end 141 and the second end 142) of each non-winding conductive path (such as a straight or direct path) in inductor device 110, embodiments herein also include connecting multiple inductor paths in parallel to control the inductance magnitude provided by the respective inductor device 110. Furthermore, as previously stated, embodiments herein include fabricating the core material 161 in the inductor device such that the magnitude of the core's permeability varies relative to the respective conductive path providing the connection between layers 1620 and 1602.

[0186] As further shown, the manufacturing facility 150 places the inductor device in the power supply stack assembly 1500 between a plurality of switches (QA1, QB1, QA2, and QB2) in the switch layer 1610 and the second power interface 1602.

[0187] More specifically, the manufacturing facility 150 produces the power supply assembly 1600 to include the second power interface 1602. In one embodiment, the manufacturing facility 150 connects the output axial end of the inductor device (120-1 and 120-2) and the corresponding node to the second power interface 1602. The second power interface 1602 is operable to receive and output the output voltage 123 generated by the inductor devices LI (conductive path 120-1) and L2 (conductive path 120-2) to the dynamic load 118. The manufacturing facility 150 couples the output node of both the inductive path 1531 and the inductive path 1532 to the output voltage node 1631 (e.g., a layer of material such as metal). Thus, the output voltage node 1631 is electrically connected to the output of the respective inductive paths 1531 and 1532.

[0188] As the name implies, the output voltage node 1631 communicates the output voltage 123 to power the dynamic load 118.

[0189] In one embodiment, one or more nodes or pins, pads, etc. of the dynamic load 118 are coupled to the output voltage node 1631. For example, the output voltage node 1631 of the power supply stack assembly 1500 communicates the output voltage 123 generated by each of the inductive paths 1531 and 1532 to one or more nodes, pins, pads, etc. of the dynamic load 118.

[0190] Thus, by switching the inductive paths between the ground voltage and the input voltage VI, the combination of the inductive paths 1531 and 1532 collectively generates the output voltage 123 to power the dynamic load 118.

[0191] As previously mentioned, the power supply stack assembly 1600 also includes the ground nodes 1510-1 and 1510-2. In one embodiment, instances of the conductive paths 1510-1 and 1510-2, such as ground nodes, provide electromagnetic shielding relative to the perimeter of the power supply stack assembly 1600, preventing or reducing corresponding radiated emissions into the surrounding environment.

[0192] In yet another embodiment, the manufacturing facility 150 manufactures the first power interface 1601 to include a first contact element operable to connect the first power interface 1601 located at the base of the power supply stack assembly 1600 to the host substrate 1505. The manufacturing facility 150 manufactures the second power interface 1602 to include a second contact element operable to secure the dynamic load 118 to the power supply stack assembly 1600.

[0193] Note that the power stack assembly 1500 is fabricated to further include first capacitors 1521, 1522, etc., thereby providing a connection between the input voltage node 1520 (providing the input voltage VI to the first conductive path of the power stack assembly 1600) and the ground nodes 1510-1 and 1510-2 (such as providing a ground reference voltage to the second conductive path of the power stack assembly 1600).

[0194] The fabrication facility 150 further provides an output voltage node 1631 (such as another conductive path) in the layer of the power stack assembly 1600 that includes the second power interface 1602. As previously described, the output voltage node 1631 (such as a metal layer) is operable to communicate the output voltage 123 to the dynamic load 118.

[0195] According to further embodiments, the fabrication facility 150 fabricates the power stack assembly 1600 to include second capacitors (1691, 1692, etc.) connected between the output voltage node 1631 and the respective ground nodes 1510. More specifically, the capacitor 1691 is coupled between the output voltage node 1631 and the ground node 1510-1; the capacitor 1692 is coupled between the output voltage node 1631 and the ground node 1510-2.

[0196] Other embodiments herein include securing the dynamic load 118 to the second power interface 1602. Thus, the dynamic load 118 is secured at the top of the power stack assembly 1600.

[0197] The power stack assembly 1600 (such as the assembly of vertically stacked components) as described herein provides advantages over conventional power converters. For example, the power stack assembly 1600 as described herein provides novel connections of components (such as via stacking) in the fabricated piece, thereby resulting in shorter circuit paths and lower losses in converting and delivering power to the dynamic load 118.

[0198] As previously discussed with respect to Figure 11 During operation, the inductor devices LI and L2 and the corresponding inductive paths 1531 and 1532 are operable to produce the output voltage 123 based on the received power (current provided by the input voltage VI). In other words, the power stack assembly 1600 and the corresponding fabricated stack of components (such as the first power interface 1601, the one or more switches QA1, QB1, QA2, and QB2, the inductor device 110, the second power interface 1602) is a power converter operable to convert the input voltage VI (such as a DC voltage) received at the first power interface 1601 to the output voltage 123 (such as a DC voltage) output from the second power interface 1602 to the dynamic load 118.

[0199] Other embodiments herein include the manufacture of systems. For example, embodiments herein include a manufacturing facility 150. The manufacturing facility 150 receives a substrate 1505, such as a circuit board; the manufacturing facility 150 secures a base of a component stack (such as the power stack assembly 1600), such as an interface 1601, to the circuit board. As previously described, the component stack (the power stack assembly 1600) is operable to generate an output voltage 123 to power a load 118. The load 118 is secured to the circuit board or the load 118 is secured on top of the power stack assembly 1600.

[0200] Further, as previously described, the load 118 can be any suitable circuit, such as a CPU (central processing unit), a GPU, and an ASIC (such as including one or more artificial intelligence accelerators) that can be located on a standalone circuit board.

[0201] Figure 13 is an example diagram illustrating a circuit assembly according to embodiments herein.

[0202] As shown in this example embodiment, the circuit assembly 2100 includes the power stack assembly 1600 disposed in an interposer 2110. The interposer 2110 provides a circuit path connection between the substrate 2190 and a load substrate 2130 (and the load 118).

[0203] In a manner as previously described, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or VI, V2, etc.) from the substrate 2190. The power stack assembly (1600) converts the input voltage to an output voltage 123 (and / or output current) that powers the respective load 118 and / or other circuit components disposed on the load substrate 2130.

[0204] In one embodiment, the substrate 2190 is a printed circuit board (PCB) substrate, but the substrate 2190 can be any suitable component to which the interposer 2110 is connected. Via insertion into a socket 2150, the interposer 2110 is in communication with the substrate 2190. Without the socket 2150, the interposer 2110 is directly connected to the substrate 2190.

[0205] Figure 14 is an example diagram illustrating a circuit assembly according to embodiments herein.

[0206] As shown in this example embodiment, the circuit assembly 1900 includes the power stack assembly 1600 disposed in a substrate 2390, such as a circuit board (such as a printed circuit board).

[0207] In the manner as previously described, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or V1, V2, etc.) from the substrate 2390. The power stack assembly (1600) converts the input voltage to an output voltage (and / or output current) that powers the respective load 128 and / or other circuit components disposed on the CPU substrate 2310.

[0208] In one embodiment, the substrate 2390 is a printed circuit board (PCB) substrate, but the substrate 2390 can be any suitable component to which the CPU substrate 2310 is directly connected, without the socket 2250 (optional). With insertion into the socket 2250, the CPU substrate layer 2310 and the power stack assembly are in communication with the substrate 2390. Without the socket 2250, the CPU substrate 2310 is directly connected to the substrate 2390.

[0209] Figure 15 is an example diagram illustrating a circuit assembly according to embodiments herein.

[0210] As shown in this example embodiment, the circuit assembly 1900 includes the power stack assembly 1600 disposed in a substrate 2390, such as a circuit board (such as a printed circuit board).

[0211] In one embodiment, the power stack assembly 1600 is embedded or manufactured in an opening of the substrate 2390. In other words, in one embodiment, the power stack assembly 1600 (converter unit) is manufactured (inserted) into an opening below the CPU substrate 2310. The CPU substrate 2310 provides circuit path connections between the substrate 2390 and the load 128 (and / or other components connected to the CPU substrate load 1910).

[0212] In the manner as previously described, the power stack assembly (1600) receives an input voltage (and any other voltage reference signals, such as ground and / or V1, V2, etc.) from the substrate 2390. The power stack assembly (1600) converts the input voltage to an output voltage (and / or output current) that powers the respective load 128 and / or other circuit components disposed on the CPU substrate 2310.

[0213] In one embodiment, the substrate 2390 is a printed circuit board (PCB) substrate, although the substrate 2390 can be any suitable component to which the socket 2350 (optional) or the CPU substrate 2310 is directly connected. In one embodiment, the CPU substrate 2310 is in communication with the substrate 2390 by insertion into the socket 2350. In the absence of the socket 2350, the CPU substrate 2310 is directly connected to the substrate 2390.

[0214] Figure 16 is an example diagram illustrating an implementation of a circuit assembly including circuit components according to embodiments herein.

[0215] In this example embodiment, the assembly machine 1550 receives the substrate 1610 and corresponding components of the power supply 100 to manufacture the controller 140, the switch 1655, the circuit components 110, etc. The assembly machine 1550 secures (couples) the controller 140 and other components 100 associated with the power supply to the substrate 1610.

[0216] As described herein, the assembly machine 1550 provides connections between the controller 140, the switch 1655, the circuit components 110, and the load 118 via respective circuit paths 1021, 1022, 1023, etc.

[0217] Note that components such as the controller 140, the circuit components 110, and corresponding components can be secured or coupled to the substrate 1610 in any suitable manner. For example, each of one or more components in the power supply 100 can be soldered to the substrate 1610, inserted into a respective socket provided on the substrate 1610, etc.

[0218] Further note that the substrate 1610 is optional. Any of the one or more circuit paths or connections as shown in the figures and as described herein can be provided in a cable or other suitable medium.

[0219] In one non-limiting example embodiment, the load 118 is independent of the substrate 1610, provided on its own substrate; the substrate of the load 118 (such as the substrate 1610 or other substrate) is connected to the substrate 1610 directly or indirectly via a connection 1023 such as one or more of a wire, cable, link, etc. Any portion of the controller 140 or the power supply 100 and corresponding components can also be provided on a separate smaller board that is inserted into a socket of the substrate 1610.

[0220] The assembled machine 1550 couples the power supply 100 and corresponding components to the load 118 via one or more circuit paths 1023, such as one or more traces, cables, connectors, wires, conductors, conductive paths, etc. In one embodiment, the circuit paths 1023 carry the output voltage generated by the circuit components 110 and electrically connect the conductive path 120 to the load 118. The conductive path produces the output voltage to power the load 118.

[0221] Accordingly, embodiments herein include a system, the system comprising: a substrate 1610, such as a circuit board, a standalone board, a motherboard, a standalone board intended to be coupled to a motherboard, a host computer, etc.; a power supply system 100 comprising corresponding components as discussed herein; and a load 118, such as a motor, a winding, etc.

[0222] Note that the load 118 can be any suitable circuit or hardware that can be located on the substrate 1610 or disposed at a remote location, such as one or more CPUs (central processing units), GPUs (graphics processing units), and ASICs (application specific integrated circuits, e.g., comprising one or more artificial intelligence accelerators).

[0223] Figure 17 FIG. 1 is a diagram illustrating an example computer architecture operable to perform one or more methods in accordance with embodiments herein.

[0224] As previously discussed, any resource as discussed herein, such as the manufacturing facility 150, etc., can be configured to include computer processor hardware and / or corresponding executable instructions to perform different operations as discussed herein.

[0225] As shown, the computer system 1700 of the present example includes an interconnect 1711 that couples a computer readable storage medium (C.R.S.M.) 1712, such as a non-transitory type of medium, which can be any suitable type of hardware storage medium that can store and retrieve digital information, a processor 1713 (computer processor hardware), an I / O interface 1714, and a communication interface 1717.

[0226] The I / O interface(s) 1714 support connection to external hardware, such as a keyboard, a display screen, a repository, a manufacturing device, etc.

[0227] The computer readable storage medium 1712 can be any hardware storage device, such as a memory, an optical storage, a hard disk drive, a floppy disk, etc. In one embodiment, the computer readable storage medium 1712 stores instructions and / or data.

[0228] As shown, the computer readable storage medium 1712 can be encoded with a manufacturing application 150-1 (e.g., comprising instructions) to perform any of the operations discussed herein.

[0229] During operation of one embodiment, the processor 1713 accesses computer- readable storage media 1712 via the use of the interconnect 1711 to initiate, load, run, execute, interpret or otherwise process the instructions included within the manufacturing application 150-1 stored thereon. Execution of the manufacturing application 150-1 produces a manufacturing process 150-2 to perform any of the operations and / or processes as discussed herein.

[0230] Those skilled in the art will appreciate that the computer system 1700 can include other processes and / or software and hardware components, such as an operating system to control the allocation and usage of hardware resources in the execution of the manufacturing application 150-1.

[0231] According to different embodiments, note that the computer system can reside in any of various types of devices including, but not limited to, a power supply, a switched capacitor converter, a power converter, a mobile computer, a personal computer system, a wireless device, a wireless access point, a base station, a telephone device, a desktop computer, a laptop computer, a notebook computer, a netbook computer, a mainframe computer system, a handheld computer, a workstation, a network computer, an application server, a storage device, a consumer electronics device such as a camera, a camcorder, a set-top box, a mobile device, a video game console, a handheld video game device, a peripheral device such as a switch, a modem, a router, a set-top box, a content management device, a handheld remote control device, any type of computing or electronic device, and the like. The computer system 1700 can reside at any location or can be included in any suitable resource in any network environment to implement functionality as discussed herein.

[0232] The functionality supported by one or more resources as described herein is discussed via flowcharts in Figure 18 Please note that the steps in the following flowcharts can be performed in any suitable order.

[0233] Figure 18 is a flowchart 1800 illustrating an example method according to embodiments herein. Please note that there is some overlap in the concepts discussed above.

[0234] In process operation 1810, the manufacturing facility 150 manufactures the core of the circuit component 110 to include a magnetically permeable material 161.

[0235] In process operation 1820, the manufacturing facility 150 manufactures a plurality of electrically conductive paths 120 to extend through the core of the magnetically permeable material 161. The plurality of electrically conductive paths 120 includes a first electrically conductive path 120-1 and a second electrically conductive path 120-1.

[0236] In process operation 1830, the manufacturing facility 150 manufactures the core of the magnetic permeable material 161 to include one or more cutout portions 130 operable to reduce inductive coupling between the first conductive path 120-1 and the second conductive path 120-2.

[0237] Again, it is noted that the techniques herein are well suited for use in the manufacture of inductor devices and corresponding implementations in power converter applications. However, it is noted that the embodiments herein are not limited to use in such applications, and the techniques discussed herein are well suited for other applications as well.

[0238] While the application has been particularly shown and described with reference to particular embodiments thereof, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope of the application as defined by the appended claims. Such changes are intended to fall within the scope of the application. Accordingly, the foregoing description of embodiments of the application are not intended to be limiting. Rather, any limitations with respect to the application are presented in the accompanying claims.

Claims

1. An electronic device comprising: a core made of a magnetically permeable material; an arrangement of a plurality of electrically conductive paths extending through the core of the magnetically permeable material, the plurality of electrically conductive paths comprising a first electrically conductive path and a second electrically conductive path; and the core of the magnetically permeable material is fabricated to include at least one cutout portion that operates to reduce an inductive coupling between the first electrically conductive path and the second electrically conductive path; wherein the at least one cutout portion comprises a first cutout portion and a second cutout portion, wherein the first electrically conductive path and the second electrically conductive path are disposed parallel to each other and extend from a first surface of the electronic device to a second surface of the electronic device, wherein the first cutout portion extends parallel to the first electrically conductive path and the second electrically conductive path from the first surface, wherein the second cutout portion extends parallel to the first electrically conductive path and the second electrically conductive path from the second surface, wherein the core of the magnetically permeable material includes a portion disposed between the first electrically conductive path and the second electrically conductive path, and wherein the portion of the magnetically permeable material is also disposed between the first cutout portion and the second cutout portion.

2. The electronic device of claim 1, wherein the at least one cutout portion comprises a first cutout portion and a second cutout portion, both of which are free of the magnetically permeable material.

3. The electronic device of claim 1, wherein a magnitude of the reduced inductor coupling between the first electrically conductive path and the second electrically conductive path depends on a size of the at least one cutout portion.

4. The electronic device of claim 1, wherein the at least one cutout portion comprises a first cutout portion that is disposed in both of: i) a first flux path associated with a first current flowing through the first electrically conductive path, and ii) a second flux path associated with a second current flowing through the second electrically conductive path.

5. The electronic device of claim 1, wherein the at least one cutout portion comprises a first cutout portion that is occupied by a first electrically conductive material; and wherein the at least one cutout portion comprises a second cutout portion that is occupied by a second electrically conductive material.

6. The electronic device of claim 1, further comprising: a first cell in which the first electrically conductive path resides, the first cell being at least partially defined by the at least one cutout portion; and a second cell in which the second electrically conductive path resides, the second cell being at least partially defined by the at least one cutout portion.

7. The electronic device of claim 1, wherein the plurality of electrically conductive paths comprises N electrically conductive paths, where N is greater than 2.

8. An electronic system comprising: a circuit board; the electronic device of claim 1 disposed in a power converter that is secured to the circuit board, the power converter operating to convert an input voltage to an output voltage.

9. An electronic circuit comprising: a substrate; ​ The electronic device of claim 1, disposed in a voltage regulator circuit coupled with the substrate.

10. A method of manufacturing a circuit component, the method comprising: manufacturing a core of the circuit component to include a magnetically permeable material; extending a plurality of electrically conductive paths through the core of the magnetically permeable material, the plurality of electrically conductive paths including a first electrically conductive path and a second electrically conductive path; and manufacturing the core of the magnetically permeable material to include at least one cutout portion, the at least one cutout portion operative to reduce an inductive coupling between the first electrically conductive path and the second electrically conductive path; wherein the at least one cutout portion includes a first cutout portion and a second cutout portion, wherein the first electrically conductive path and the second electrically conductive path are disposed parallel to each other and extend from a first surface of the circuit component to a second surface of the circuit component, wherein the first cutout portion extends parallel to the first electrically conductive path and the second electrically conductive path from the first surface, wherein the second cutout portion extends parallel to the first electrically conductive path and the second electrically conductive path from the second surface, wherein the core of the magnetically permeable material includes a portion disposed between the first electrically conductive path and the second electrically conductive path, and wherein the portion of the magnetically permeable material is also disposed between the first cutout portion and the second cutout portion.

11. The method of claim 10, further comprising: manufacturing the at least one cutout portion to include a first cutout portion and a second cutout portion, both of the first cutout portion and the second cutout portion being free of the magnetically permeable material.

12. The method of claim 10, wherein a magnitude of the reduced inductor coupling between the first electrically conductive path and the second electrically conductive path is dependent on a size of the at least one cutout portion.

13. The method of claim 10, further comprising: manufacturing the at least one cutout portion to include a first cutout portion, the first cutout portion disposed in a flux path associated with a first current flowing through the first electrically conductive path and a flux path associated with a second current flowing through the second electrically conductive path.

14. The method of claim 10, further comprising: manufacturing the at least one cutout portion to include a first cutout portion, the first cutout portion occupied by a first electrically conductive material; and manufacturing the at least one cutout portion to include a second cutout portion, the second cutout portion occupied by a second electrically conductive material.

15. The method of claim 14, further comprising: manufacturing the at least one cutout portion to include a second cutout portion, the second cutout portion occupied by a second electrically conductive material.

16. The method of claim 10, wherein the plurality of electrically conductive paths includes N electrically conductive paths, where N is greater than 2.

17. A method of operating an electronic device, the method comprising: receiving the electronic device of claim 1; and disposing the electronic device in a power converter secured to a circuit board, the power converter operative to convert an input voltage to an output voltage.

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