Backlight module and manufacturing method thereof, and display device

Abstract

The present invention discloses a backlight module and a manufacturing method thereof, and a display device. The backlight module includes a conductive frame, a flexible circuit board, a light-emitting component, an electrical protection component, and a light guide plate; the flexible circuit board includes a first sub-section arranged in the conductive frame and a second sub-section extending outside the conductive frame; the light-emitting component is arranged on the first sub-section; the electrical protection component is arranged on the flexible circuit board and electrically connected to the light-emitting component; the light guide plate is arranged in the conductive frame, one end of the light guide plate is attached to the first sub-section close to the light-emitting component, and the light guide plate and the light-emitting component are located on the same side of the first sub-section; wherein the second sub-section includes a conductive component electrically connected to the electrical protection component, and the conductive component is electrically connected to the conductive frame. The present invention can improve the light efficiency of the backlight module, and realize the electrical protection of the light-emitting component by the electrical protection component, improve the yield rate of the backlight module, and will not affect the alignment and assembly of the light guide plate and other optical films.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a backlight module and a manufacturing method thereof, and a display device. Background Art

[0002] In a liquid crystal display (LCD), a backlight module is usually required to provide a backlight source for a display panel to achieve a display function; the backlight module may include a direct-type and an edge-entry type, and with the demand for thinner and lighter displays, the research and development of edge-entry backlight modules is becoming more and more important.

[0003] Currently, in edge-type liquid crystal displays, in order to prevent the light-emitting components from being damaged by static electricity or discharge, a transient voltage suppressor (TVS) diode is often connected to the flexible circuit board and the TVS tube is grounded to prevent the light-emitting components from being damaged by static electricity or discharge.

[0004] However, in the related art, the flexible circuit board is often attached to the iron frame by conductive double-sided tape to achieve grounding of the TVS tube, and the position of the light-emitting component arranged on the flexible circuit board is therefore fixed. During the subsequent assembly of the light guide plate and other optical films, the relative position between the light-emitting component and the light guide plate is not fixed. As a result, during the reliability test, the light guide plate will shrink, resulting in an increase in the distance between the light-emitting component and the light guide plate, thereby reducing the amount of light emitted by the light-emitting component and entering the light guide plate, thereby reducing the light efficiency of the backlight module. Summary of the invention

[0005] The embodiments of the present invention provide a backlight module and a manufacturing method thereof, and a display device, which can reduce the distance between the light-emitting element and the light guide plate and improve the light efficiency of the backlight module.

[0006] An embodiment of the present invention provides a backlight module, comprising:

[0007] Conductive frame;

[0008] A flexible circuit board, comprising a first sub-portion disposed within the conductive frame, and a second sub-portion extending outside the conductive frame;

[0009] A light emitting member, disposed on the first sub-section;

[0010] An electrical protection component is disposed on the flexible circuit board and is electrically connected to the light-emitting component;

[0011] A light guide plate is disposed in the conductive frame, one end of the light guide plate is attached to the first sub-section near the light-emitting element, and the light guide plate and the light-emitting element are located on the same side of the first sub-section;

[0012] Wherein, the second sub-section includes a conductive component electrically connected to the electrical protection component, and the conductive component is electrically connected to the conductive frame.

[0013] In an embodiment of the present invention, the conductive frame is provided with an opening near the flexible circuit board, and the second sub-portion is connected to the first sub-portion and extends from the opening to the outside of the conductive frame.

[0014] In one embodiment of the present invention, the conductive frame includes a first frame disposed on a side of the light guide plate away from the light emitting side of the backlight module, and a second frame disposed around the periphery of the light guide plate, and the first sub-portion is disposed on a side of the first frame close to the light emitting side;

[0015] Wherein, the opening is arranged in the first frame body or the second frame body.

[0016] In one embodiment of the present invention, the conductive member is electrically connected to a surface of the first frame body away from the light emitting side;

[0017] Alternatively, the conductive member is electrically connected to a surface of the second frame away from the light guide plate.

[0018] In an embodiment of the present invention, the light guide plate includes a light incident side surface close to one side of the second frame body, the light emitting element includes a light emitting surface close to one side of the light guide plate, and the light emitting surface is in contact with the light incident side surface.

[0019] In an embodiment of the present invention, the conductive component is bonded to the conductive frame through conductive adhesive, and one end of the light guide plate is bonded to the first sub-part through transparent adhesive.

[0020] In one embodiment of the present invention, the flexible circuit board includes two second sub-parts, and the two second sub-parts are respectively connected to the two ends of the first sub-part, each of the second sub-parts includes at least one conductive component, and each of the second sub-parts extends outside the conductive frame and is electrically connected to the conductive frame through the conductive component.

[0021] In an embodiment of the present invention, the distance between the light emitting element and the light guide plate is less than or equal to 2 mm.

[0022] According to the above object of the present invention, an embodiment of the present invention further provides a method for manufacturing a backlight module, which comprises the following steps:

[0023] Providing a conductive frame;

[0024] Providing a flexible circuit board, the flexible circuit board comprising a first sub-section and a second sub-section, wherein a conductive member is formed in the second sub-section;

[0025] An electrical protection component is formed on the flexible circuit board, a light-emitting component electrically connected to the electrical protection component is formed on the first sub-section, and one end of a light guide plate is placed close to the light-emitting component and attached to the first sub-section, and the light guide plate and the light-emitting component are located on the same side of the first sub-section;

[0026] The first sub-section, the light-emitting element and the light guide plate are assembled in the conductive frame, and the second sub-section is extended out of the conductive frame;

[0027] The conductive member is electrically connected to the conductive frame.

[0028] According to the above objective of the present invention, an embodiment of the present invention further provides a display device, which includes a display panel and the backlight module, and the display panel is arranged on the light emitting side of the backlight module.

[0029] Beneficial effects of the present invention: The present invention can fix the relative position relationship between the light-emitting component and the light guide plate by arranging the light-emitting component on the first sub-section of the flexible circuit board and attaching one end of the light guide plate to the first sub-section of the flexible circuit board, and one end of the light guide plate is arranged close to the light-emitting component, which can reduce the distance between the light guide plate and the light-emitting component, so as to increase the amount of light emitted by the light-emitting component and entering the light guide plate, and improve the lighting effect of the backlight module; in addition, in the present invention, the second sub-section of the flexible circuit board extends outside the conductive frame, and the conductive component located on the second sub-section is electrically connected between the electrical protection component and the conductive frame to realize electrical protection of the light-emitting component by the electrical protection component, thereby improving the yield rate of the backlight module, and at the same time, the second sub-section extends outside the conductive frame for bonding, and the position of the first sub-section located in the conductive frame will not be completely fixed, so it will not affect the alignment and assembly of the light guide plate and other optical films. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The technical solutions and other beneficial effects of the present invention will be made apparent by describing in detail the specific embodiments of the present invention in conjunction with the accompanying drawings.

[0031] Figure 1 and Figure 2 It is a structural schematic diagram of the manufacturing process of a backlight assembly in the related art;

[0032] Figure 3 A schematic diagram of the structure of a backlight assembly provided by an embodiment of the present invention;

[0033] Figure 4 A schematic diagram of a planar unfolded structure of a flexible circuit board provided by an embodiment of the present invention;

[0034] Figure 5A schematic diagram of another planar unfolded structure of a flexible circuit board provided in an embodiment of the present invention;

[0035] Figure 6 A schematic diagram of an electrical protection circuit provided by an embodiment of the present invention;

[0036] Figure 7 Another structural schematic diagram of a backlight assembly provided by an embodiment of the present invention;

[0037] Figure 8 Another structural schematic diagram of a backlight assembly provided by an embodiment of the present invention;

[0038] Fig. 9 Another structural schematic diagram of a backlight assembly provided by an embodiment of the present invention;

[0039] Fig.10 A flow chart of a method for manufacturing a backlight assembly provided by an embodiment of the present invention;

[0040] Figures 11 to 13 A schematic diagram of a manufacturing process of a backlight assembly provided by an embodiment of the present invention;

[0041] Fig.14 A schematic diagram of the structure of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0043] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0044] In the related art, for edge-type backlight modules, in order to prevent the light-emitting components from being damaged by static electricity or discharge, a transient voltage suppressor diode (TVS) is often connected to the flexible circuit board, and the TVS tube is grounded to prevent the light-emitting components from being damaged by static electricity or discharge. Figure 1 and Figure 2 In the related art, the manufacturing process of the backlight module is usually as follows: a flexible circuit board 2 equipped with an LED lamp 3 is attached to an iron frame 1. In order to prevent the LED lamp 3 from being damaged by static electricity or discharge, the flexible circuit board 2 is often attached to the inner surface of the iron frame through a conductive double-sided tape 4, and power is released through the exposed copper (not shown in the figure) arranged on the flexible circuit board 2 and connected to the LED lamp 3 and the iron frame; and a reflective sheet 5 is assembled in the iron frame; then, a light guide plate 6 and other optical films 7 are aligned and assembled on the reflective sheet 5; however, since the relative position between the LED lamp 3 and the light guide plate 6 is not fixed, when performing reliability testing, such as high temperature testing, the light guide plate 6 will shrink, resulting in an increase in the distance between the LED lamp 3 and the light guide plate 6, which reduces the amount of light emitted by the LED lamp 3 and entering the light guide plate 6, thereby reducing the light efficiency of the backlight module.

[0045] Please refer to Figure 3 , Figure 4 as well as Figure 5 An embodiment of the present invention provides a backlight module, which includes a conductive frame 10, a flexible circuit board 20, a light-emitting component 30, an electrical protection component 40 and a light guide plate 50.

[0046] Among them, the flexible circuit board 20 includes a first sub-portion 21 arranged in the conductive frame 10, and a second sub-portion 22 extending outside the conductive frame 10; the light-emitting component 30 is arranged on the first sub-portion 21; the electrical protection component 40 is arranged on the flexible circuit board 20 and is electrically connected to the light-emitting component 30; the light guide plate 50 is arranged in the conductive frame 10, and one end of the light guide plate 50 is attached to the first sub-portion 21 close to the light-emitting component 30, and the light guide plate 50 and the light-emitting component 30 are located on the same side of the first sub-portion 21.

[0047] Furthermore, the second sub-section 22 includes a conductive member 60 electrically connected to the electrical protection member 40 , and the conductive member 60 is electrically connected to the conductive frame 10 .

[0048] In the implementation and application process, the embodiment of the present invention can fix the relative position relationship between the light emitting element 30 and the light guide plate 50 by arranging the light emitting element 30 on the first sub-portion 21 of the flexible circuit board 20 and attaching one end of the light guide plate 50 to the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is arranged close to the light emitting element 30, which can reduce the distance between the light guide plate 50 and the light emitting element 30, so as to increase the amount of light emitted by the light emitting element 30 and entering the light guide plate 50, thereby improving the light efficiency of the backlight module; in addition, the present invention In the embodiment of the present invention, the second sub-portion 22 of the flexible circuit board 20 extends outside the conductive frame 10, and the conductive member 60 located on the second sub-portion 22 is electrically connected between the electrical protection member 40 and the conductive frame 10, so as to realize the electrical protection of the light-emitting member 30 by the electrical protection member 40, thereby improving the yield rate of the backlight module. At the same time, the second sub-portion 22 extends outside the conductive frame 10 for bonding, and does not completely fix the position of the first sub-portion 21 located in the conductive frame 10, so it will not affect the alignment and assembly of the light guide plate 50 and other optical films.

[0049] In one embodiment of the present invention, please refer to Figure 3 , Figure 4 as well as Figure 5 The backlight module includes a conductive frame 10, a flexible circuit board 20, a light emitting component 30, an electrical protection component 40, a light guide plate 50 and other optical films.

[0050] Among them, the conductive frame 10 is conductive, and the material of the conductive frame 10 can be a conductive metal material; wherein the conductive frame 10 includes a first frame 11, a third frame 13 arranged opposite to the first frame 11, and a second frame 12 connected between the first frame 11 and the third frame 13 and connected to the periphery of the first frame 11, wherein the second frame 12 surrounds the first frame 11 and the third frame 13 to form a hollow space 102 between the first frame 11 and the third frame 13, and the second frame 12 is formed with a light outlet 103 to connect the hollow space 102 with the outside; further, the backlight module includes a light outlet side, and the third frame 13 is located on the side of the first frame 11 close to the light outlet side of the backlight module, and the light outlet 103 in the third frame 13 can realize the light outlet of the backlight module.

[0051] It should be noted that, in the embodiment of the present invention, part of the flexible circuit board 20 , the light emitting element 30 , the electrical protection element 40 , the light guide plate 50 and other optical films may all be disposed in the hollow space 102 .

[0052] Specifically, the flexible circuit board 20 includes a first sub-portion 21 arranged in the conductive frame 10 and a second sub-portion 22 extending outside the conductive frame 10, and the first sub-portion 21 is located on a surface of the first frame 11 close to the light emitting side; it can be understood that the first sub-portion 21 is located on one side of the first frame 11, and the conductive frame 10 is provided with an opening 101 on a side close to the first sub-portion 21, then the second sub-portion 22 is connected to the first sub-portion 21, and extends from the opening 101 to the outside of the conductive frame 10.

[0053] Optionally, the opening 101 is disposed in the first frame body 11 or the second frame body 12 ; and in this embodiment, the opening 101 is disposed in the second frame body 12 .

[0054] Furthermore, the electrical protection component 40 is arranged on the flexible circuit board 20, and can be arranged on the first sub-section 21 or the second sub-section 22. In the embodiment of the present invention, the electrical protection component 40 is arranged on the first sub-section 21 as an example for explanation, and the electrical protection component 40 is arranged on the first sub-section 21, so that the electrical protection component 40 is located inside the conductive frame 10, which can improve the protection effect of the electrical protection component 40.

[0055] Optionally, the electrical protection component 40 may be a transient voltage suppressor diode (TVS), and the specific transient voltage suppressor diode may be any one of a unidirectional TVS tube and a bidirectional TVS tube, which may be selected according to actual needs and is not limited here.

[0056] In the embodiment of the present invention, a conductive member 60 is further provided in the second sub-section 22. It should be noted that the flexible circuit board 20 includes a substrate, a metal wiring layer provided on the substrate, and an insulating layer covering the metal wiring layer, wherein the metal wiring layer is used to form a metal wiring for transmitting signals, and the insulating layer is used to cover the metal wiring for protection and insulation. In the embodiment of the present invention, part of the insulating layer located on the second sub-section 22 can be removed to expose the internal metal wiring layer to form the conductive member 60, and the metal wiring layer corresponding to the conductive member 60 can be covered as a whole layer, so as to reduce the impedance and improve the signal transmission efficiency by increasing the contact area between the conductive member 60 and other conductors.

[0057] Furthermore, the light emitting member 30 is disposed on the first sub-portion 21 and is electrically connected to the electrical protection member 40, and the electrical protection member 40 is connected between the light emitting member 30 and the conductive member 60. The second sub-portion 22 extends from the opening 101 to the outside of the conductive frame 10 and to the side of the first frame 11 away from the light emitting side, and the conductive member 60 in the second sub-portion 22 is attached to the side of the first frame 11 away from the light emitting side.

[0058] Optionally, the conductive member 60 is attached to a surface of the first frame body 11 away from the light emitting side by means of a conductive adhesive 71 .

[0059] Please combine Figure 1 and Figure 6 The light emitting component 30 is electrically connected to the first frame 11 through the electrical protection component 40, the conductive component 60 and the conductive adhesive 71. When the electrical protection component 40 can withstand an instantaneous high-energy impact, it can suddenly reduce its impedance at an extremely high speed to absorb a large current and clamp the voltage between the two ends of the electrical protection component 40 at a predetermined value. One end of the electrical protection component 40 is connected to the light emitting component 30, and the other end is connected to the conductive frame 10 through the conductive component 60, which can be regarded as grounding. Therefore, the electrical protection component 40 can effectively electrically protect the light emitting component 30 to prevent the light emitting component 30 from being damaged by static electricity or discharge, thereby improving the yield rate of the backlight module.

[0060] It should be noted that in the embodiment of the present invention, the number of the light-emitting components 30 and the electrical protection component 40 is not limited, and can be selected according to actual needs. Similarly, the number and shape of the second sub-sections 22 are not limited. In the embodiment of the present invention, the number of the second sub-sections 22 is two, and the shape is a long strip. The two second sub-sections 22 are respectively connected to the two ends of the first sub-section 21. Each second sub-section 22 is provided with a conductive component 60, and the number of openings 101 is also two, and they are correspondingly located at the two ends of the second frame 12. The two second sub-sections 22 extend from the two openings 101 to the outside of the conductive frame 10, and are electrically connected to the conductive frame 10 through their respective conductive components 60. In addition, as the number of the second sub-sections 22 increases, the electrical transmission path between the flexible circuit board 20 and the conductive frame 10 also increases, which can improve the electrical protection effect of the electrical protection component 40 on the light-emitting components 30, and further improve the yield rate of the backlight module.

[0061] In addition, one end of the light guide plate 50 is attached to the first sub-portion 21 near the light emitting element 30, and the light guide plate 50 and the light emitting element 30 are located on the same side of the first sub-portion 21. In the embodiment of the present invention, the light guide plate 50 and the light emitting element 30 are located on the side of the first sub-portion 21 away from the first frame 11. That is, the embodiment of the present invention fixes the relative position relationship between the light guide plate 50 and the light emitting element 30 by arranging both the light guide plate 50 and the light emitting element 30 on the first sub-portion 21, thereby avoiding the phenomenon that the distance between the light guide plate 50 and the light emitting element 30 increases due to the contraction of the light guide plate 50 during the subsequent reliability test of the backlight module; and the light guide plate 50 is arranged close to the light emitting element 30 to reduce the distance between the light guide plate 50 and the light emitting element 30, thereby increasing the amount of light emitted by the light emitting element 30 and entering the light guide plate 50, and improving the light efficiency of the backlight module.

[0062] Optionally, one end of the light guide plate 50 can be attached to the first sub-section 21 through a transparent adhesive 72, and the transparent adhesive 72 is located on the light-emitting side of the light-emitting component 30. The transparent adhesive 72 is transparent and will not affect the light emission of the light-emitting component 30, further improving the light efficiency of the backlight module.

[0063] Furthermore, other optical films are arranged on both sides of the first frame 11, wherein the other optical films may include a reflective film 81, a diffuser 82, a lower brightening film 83 and an upper brightening film 84, the reflective film 81 is arranged between the first frame 11 and the light guide plate 50, and the diffuser 82, the lower brightening film 83 and the upper brightening film 84 are arranged in sequence on the side of the light guide plate 50 away from the first frame 11.

[0064] It can be understood that the above-mentioned reflective sheet 81, diffuser 82, lower brightness enhancement sheet 83 and upper brightness enhancement sheet 84 all need to be aligned and assembled with the light guide plate 50. In the embodiment of the present invention, by extending the second sub-section 22 to the outside of the conductive frame 10 for bonding, the position of the first sub-section 21 located in the conductive frame 10 will not be completely fixed, which will not affect the alignment and assembly of the light guide plate 50 and the above-mentioned reflective sheet 81, diffuser 82, lower brightness enhancement sheet 83 and upper brightness enhancement sheet 84, thereby further improving the yield rate of the backlight module.

[0065] Optionally, the distance between the light emitting element 30 and the light guide plate 50 is less than or equal to 2 mm; further preferably, the distance between the light emitting element 30 and the light guide plate 50 is less than or equal to 1.5 mm.

[0066] In an embodiment of the present invention, the light guide plate 50 includes a light incident side surface close to the second frame 12, and the light emitting component 30 includes a light emitting surface close to the light guide plate 50, and the light emitting surface is in contact with the light incident side surface, thereby minimizing the light emitting loss of the light emitting component 30 and effectively improving the light efficiency of the backlight module.

[0067] In the above, the embodiment of the present invention can fix the relative position relationship between the light emitting element 30 and the light guide plate 50 by arranging the light emitting element 30 on the first sub-portion 21 of the flexible circuit board 20 and attaching one end of the light guide plate 50 to the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is arranged close to the light emitting element 30, so as to reduce the distance between the light guide plate 50 and the light emitting element 30, so as to increase the amount of light emitted by the light emitting element 30 and entering the light guide plate 50, thereby improving the light efficiency of the backlight module; in addition, the embodiment of the present invention In the example, the second sub-portion 22 of the flexible circuit board 20 extends outside the conductive frame 10, and the conductive component 60 located on the second sub-portion 22 is electrically connected between the electrical protection component 40 and the conductive frame 10, so as to realize the electrical protection of the light-emitting component 30 by the electrical protection component 40, thereby improving the yield rate of the backlight module. At the same time, the second sub-portion 22 extends outside the conductive frame 10 for bonding, and will not completely fix the position of the first sub-portion 21 located in the conductive frame 10, so it will not affect the alignment and assembly of the light guide plate 50 and other optical films.

[0068] In another embodiment of the present invention, please refer to Figure 7 The difference between this embodiment and the previous embodiment is that the opening 101 on the conductive frame 10 is set in the first frame 11, the second sub-portion 22 extends from the opening 101 to the outside of the conductive frame 10, and the conductive member 60 is attached to the surface of the first frame 11 away from the light emitting side of the backlight module through the conductive adhesive 71.

[0069] In the above, the embodiment of the present invention can fix the relative position relationship between the light emitting element 30 and the light guide plate 50 by arranging the light emitting element 30 on the first sub-portion 21 of the flexible circuit board 20 and attaching one end of the light guide plate 50 to the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is arranged close to the light emitting element 30, so as to reduce the distance between the light guide plate 50 and the light emitting element 30, so as to increase the amount of light emitted by the light emitting element 30 and entering the light guide plate 50, thereby improving the light efficiency of the backlight module; in addition, the embodiment of the present invention In the example, the second sub-portion 22 of the flexible circuit board 20 extends outside the conductive frame 10, and the conductive component 60 located on the second sub-portion 22 is electrically connected between the electrical protection component 40 and the conductive frame 10, so as to realize the electrical protection of the light-emitting component 30 by the electrical protection component 40, thereby improving the yield rate of the backlight module. At the same time, the second sub-portion 22 extends outside the conductive frame 10 for bonding, and will not completely fix the position of the first sub-portion 21 located in the conductive frame 10, so it will not affect the alignment and assembly of the light guide plate 50 and other optical films.

[0070] In another embodiment of the present invention, please refer to Figure 8The difference between this embodiment and the first embodiment is that the second sub-portion 22 extends from the opening 101 to the outside of the conductive frame 10 , and the conductive member 60 is attached to the surface of the second frame 12 away from the light guide plate 50 through the conductive adhesive 71 .

[0071] In the above, the embodiment of the present invention can fix the relative position relationship between the light emitting element 30 and the light guide plate 50 by arranging the light emitting element 30 on the first sub-portion 21 of the flexible circuit board 20 and attaching one end of the light guide plate 50 to the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is arranged close to the light emitting element 30, so as to reduce the distance between the light guide plate 50 and the light emitting element 30, so as to increase the amount of light emitted by the light emitting element 30 and entering the light guide plate 50, thereby improving the light efficiency of the backlight module; in addition, the embodiment of the present invention In the example, the second sub-portion 22 of the flexible circuit board 20 extends outside the conductive frame 10, and the conductive component 60 located on the second sub-portion 22 is electrically connected between the electrical protection component 40 and the conductive frame 10, so as to realize the electrical protection of the light-emitting component 30 by the electrical protection component 40, thereby improving the yield rate of the backlight module. At the same time, the second sub-portion 22 extends outside the conductive frame 10 for bonding, and will not completely fix the position of the first sub-portion 21 located in the conductive frame 10, so it will not affect the alignment and assembly of the light guide plate 50 and other optical films.

[0072] In another embodiment of the present invention, please refer to Fig. 9 The difference between this embodiment and the previous embodiment is that the opening 101 is set on the first frame 11, the second sub-portion 22 extends from the opening 101 to the outside of the conductive frame 10, and the conductive member 60 is attached to the side of the second frame 12 away from the light guide plate 50 through the conductive adhesive 71.

[0073] In the above, the embodiment of the present invention can fix the relative position relationship between the light emitting element 30 and the light guide plate 50 by arranging the light emitting element 30 on the first sub-portion 21 of the flexible circuit board 20 and attaching one end of the light guide plate 50 to the first sub-portion 21 of the flexible circuit board 20, and one end of the light guide plate 50 is arranged close to the light emitting element 30, so as to reduce the distance between the light guide plate 50 and the light emitting element 30, so as to increase the amount of light emitted by the light emitting element 30 and entering the light guide plate 50, thereby improving the light efficiency of the backlight module; in addition, the embodiment of the present invention In the example, the second sub-portion 22 of the flexible circuit board 20 extends outside the conductive frame 10, and the conductive component 60 located on the second sub-portion 22 is electrically connected between the electrical protection component 40 and the conductive frame 10, so as to realize the electrical protection of the light-emitting component 30 by the electrical protection component 40, thereby improving the yield rate of the backlight module. At the same time, the second sub-portion 22 extends outside the conductive frame 10 for bonding, and will not completely fix the position of the first sub-portion 21 located in the conductive frame 10, so it will not affect the alignment and assembly of the light guide plate 50 and other optical films.

[0074] In addition, the present invention also provides a method for manufacturing a backlight module. Figure 3 , Figure 4 , Fig.10 , Figures 11 to 13 The manufacturing method of the backlight module comprises the following steps:

[0075] S10, providing a conductive frame 10.

[0076] The conductive frame 10 is conductive, and the material of the conductive frame 10 can be a conductive metal material; wherein the conductive frame 10 includes a first frame 11, a third frame 13 arranged opposite to the first frame 11, and a second frame 12 connected between the first frame 11 and the third frame 13 and connected to the periphery of the first frame 11, wherein the second frame 12 surrounds the first frame 11 and the third frame 13 to form a hollow space 102 between the first frame 11 and the third frame 13, and the second frame 12 is formed with a light outlet 103 to connect the hollow space 102 with the outside; further, the backlight module includes a light outlet side, and the third frame 13 is located on the side of the first frame 11 close to the light outlet side of the backlight module, and the light outlet 103 in the third frame 13 can realize the light outlet of the backlight module.

[0077] An opening 101 is provided on a side of the second frame body 12 close to the first frame body 11 .

[0078] A reflective sheet 81 is formed in the hollow space 102 of the conductive frame 10, and the reflective sheet 81 is disposed on a surface of the first frame 11 close to the third frame 13. Fig.11 shown.

[0079] S20 , providing a flexible circuit board 20 , wherein the flexible circuit board 20 includes a first sub-section 21 and a second sub-section 22 , and a conductive member 60 is formed in the second sub-section 22 .

[0080] The flexible circuit board 20 is defined as a first sub-section 21 and a second sub-section 22 connected to each other, and the first sub-section 21 and the second sub-section 22 are respectively located at two sides of the flexible circuit board 20 .

[0081] It should be noted that the flexible circuit board 20 includes a substrate, a metal routing layer arranged on the substrate, and an insulating layer covering the metal routing layer, wherein the metal routing layer is used to form a metal routing to transmit signals, and the insulating layer is used to cover the metal routing to play a role of protection and insulation. In an embodiment of the present invention, part of the insulating layer located on the second sub-section 22 is removed to expose the internal metal routing layer to form a conductive member 60, and the metal routing layer corresponding to the conductive member 60 can be covered as a whole layer to reduce the contact area between the conductive member 60 and other conductors, thereby reducing impedance and improving signal transmission efficiency.

[0082] Then, a conductive adhesive 71 is coated on the surface of the conductive member 60 , and a protective film 73 is attached to a side of the conductive adhesive 71 away from the conductive member 60 .

[0083] S30, forming an electrical protection component 40 on the flexible circuit board 20, forming a light-emitting component 30 electrically connected to the electrical protection component 40 on the first sub-section 21, and placing one end of the light guide plate 50 close to the light-emitting component 30 and fitting it to the first sub-section 21, and the light guide plate 50 and the light-emitting component 30 are located on the same side of the first sub-section 21.

[0084] A light emitting component 30 and an electrical protection component 40 are formed on the first sub-portion 21 , and the light emitting component 30 is electrically connected to the electrical protection component 40 .

[0085] Optionally, the electrical protection component 40 may be a transient voltage suppressor diode (TVS), and the specific transient voltage suppressor diode may be any one of a unidirectional TVS tube and a bidirectional TVS tube, which may be selected according to actual needs and is not limited here.

[0086] Next, one end of the light guide plate 50 is attached to the first sub-portion 21 close to the light emitting element 30 by using a transparent adhesive 72 , and the light guide plate 50 and the light emitting element 30 are located on the same side of the first sub-portion 21 .

[0087] In the embodiment of the present invention, the light guide plate 50 includes a light incident side surface close to the second frame 12, and the light emitting element 30 includes a light emitting surface close to the light guide plate 50, and the light emitting surface is in contact with the light incident side surface, thereby minimizing the light loss of the light emitting element 30 and effectively improving the light efficiency of the backlight module. Fig.12 shown.

[0088] S40 , assembling the first sub-portion 21 , the light emitting element 30 and the light guide plate 50 in the conductive frame 10 , and extending the second sub-portion 22 out of the conductive frame 10 .

[0089] The first sub-section 21, the light emitting element 30 and the light guide plate 50 are assembled in the conductive frame 10 and arranged close to the opening 101, and the second sub-section 22 passes through the opening 101 and extends to the outside of the conductive frame 10. Fig.13 shown.

[0090] Then, a diffusion sheet 82 , a lower brightness enhancement sheet 83 and an upper brightness enhancement sheet 84 are sequentially arranged on a side of the light guide plate 50 away from the reflection sheet 81 , and are aligned and assembled.

[0091] In the embodiment of the present invention, the second sub-section 22 is arranged outside the conductive frame 10, and the position of the second sub-section 22 is not fixed, so that the first sub-section 21 can move freely, and the light guide plate 50 and the first sub-section 21 are fixedly attached together, and then the light guide plate 50 can also move, so as to complete the alignment and assembly of the light guide plate 50 and the reflective sheet 81, the diffuser 82, the lower brightening sheet 83 and the upper brightening sheet 84, thereby improving the yield and stability of the backlight module.

[0092] S50 , electrically connecting the conductive member 60 to the conductive frame 10 .

[0093] The protective film 73 on the surface of the conductive adhesive 71 is removed, and then the second sub-section 22 is bent to the side of the first frame 11 away from the light guide plate 50, and the conductive member 60 is attached to the first frame 11 through the conductive adhesive 71. Figure 3 shown.

[0094] In addition, the embodiment of the present invention further provides a display device, please refer to Fig.14 The display device includes a display panel and the backlight module described in the above embodiment. The structure and manufacturing method of the backlight module can be carried out with reference to the above embodiment and will not be repeated here.

[0095] The display panel is arranged on the light-emitting side of the backlight module, and the backlight module provides a backlight source for the display panel. The display panel includes an array substrate 91 and a color filter substrate 92 arranged on the light-emitting side of the backlight module, and the array substrate 91 is located between the color filter substrate 92 and the backlight module, and is arranged opposite to the color filter substrate 92; in addition, the display panel also includes a lower polarizer 93 arranged on the side of the array substrate 91 away from the color filter substrate 92 and an upper polarizer 94 arranged on the side of the color filter substrate 92 away from the array substrate 91.

[0096] Furthermore, the display device also includes a foam 96 arranged between the array substrate 91 and the conductive frame 10 to play a protective and buffering role. The display device also includes a fixing tape 95 arranged on the surrounding sides of the display panel and the backlight module. The fixing tape 95 can reinforce the assembly of the display panel and the backlight module, and can shield the sides and frames of the display device to improve the display effect of the display device.

[0097] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0098] The above is a detailed introduction to a backlight module and a manufacturing method thereof, and a display device provided in an embodiment of the present invention. Specific examples are used herein to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present invention. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A backlight module, characterized in that: include: Conductive frame; A flexible circuit board, comprising a first sub-portion disposed within the conductive frame, and a second sub-portion extending outside the conductive frame; A light emitting member, disposed on the first sub-section; An electrical protection component is disposed on the flexible circuit board and is electrically connected to the light-emitting component; A light guide plate is disposed in the conductive frame, one end of the light guide plate is attached to the first sub-section near the light-emitting element, and the light guide plate and the light-emitting element are located on the same side of the first sub-section; The conductive frame includes a first frame disposed on a side of the light guide plate away from the light emitting side of the backlight module, and a second frame disposed around the circumference of the light guide plate, the second frame is provided with an opening, the second sub-portion is connected to the first sub-portion and extends from the opening to the outside of the conductive frame, and the first sub-portion is disposed on a side of the first frame close to the light emitting side; Among them, the second sub-section includes a conductive component electrically connected to the electrical protection component, and the conductive component is electrically connected to the conductive frame, the conductive component is attached to a surface of the second frame away from the light guide plate through a conductive adhesive, and the conductive component is electrically connected to a surface of the second frame away from the light guide plate, the first sub-section is in contact with the first frame, and the part of the first sub-section in contact with the first frame is not fixedly connected to the first frame.

2. The backlight module according to claim 1, characterized in that: The light guide plate includes a light incident side surface close to one side of the second frame body, and the light emitting element includes a light emitting surface close to one side of the light guide plate, and the light emitting surface is in contact with the light incident side surface.

3. The backlight module according to claim 1, characterized in that: One end of the light guide plate is attached to the first sub-part via transparent adhesive.

4. The backlight module according to claim 1, characterized in that: The flexible circuit board includes two second sub-parts, and the two second sub-parts are respectively connected to the two ends of the first sub-part, each of the second sub-parts includes at least one conductive component, and each of the second sub-parts extends outside the conductive frame and is electrically connected to the conductive frame through the conductive component.

5. The backlight module according to claim 1, characterized in that: The distance between the light emitting element and the light guide plate is less than or equal to 2 mm.

6. A method for manufacturing a backlight module, characterized in that: The following steps are involved: Providing a conductive frame, the conductive frame comprising a first frame and a second frame, the second frame being provided with an opening; Providing a flexible circuit board, the flexible circuit board comprising a first sub-section and a second sub-section, wherein a conductive member is formed in the second sub-section; An electrical protection component is formed on the flexible circuit board, a light-emitting component electrically connected to the electrical protection component is formed on the first sub-section, and one end of a light guide plate is placed close to the light-emitting component and attached to the first sub-section, and the light guide plate and the light-emitting component are located on the same side of the first sub-section; The first sub-section, the light-emitting element and the light guide plate are assembled in the conductive frame, the first frame is arranged on a side of the light guide plate away from the light-emitting side of the backlight module, the second frame is arranged around the peripheral side of the light guide plate, and the second sub-section is connected to the first sub-section and extends from the opening to the outside of the conductive frame, the first sub-section is in contact with the first frame, the part of the first sub-section in contact with the first frame is not fixedly connected to the first frame, and the first sub-section is arranged on a side of the first frame close to the light-emitting side; The conductive component is electrically connected to the conductive frame, and the conductive component is attached to a surface of the second frame away from the light guide plate through a conductive adhesive, and the conductive component is electrically connected to a surface of the second frame away from the light guide plate.

7. A display device, characterized in that: The display device comprises a display panel and a backlight module as claimed in any one of claims 1 to 5, and the display panel is arranged on a light emitting side of the backlight module.

Images