Method and device for measuring scanning electron microscope images based on design layout

Abstract

The present application provides a method, device, equipment and computer-readable storage medium for measuring a scanning electron microscope image based on a design layout. The method includes: determining a target measurement point according to the coordinate position information of the design layout; generating all measurement frames within a preset measurement range based on the design layout and preset measurement conditions; generating a measurement recipe file according to the target measurement point and all measurement frames, and obtaining a scanning electron microscope image of the target measurement point based on the measurement recipe file; aligning the scanning electron microscope image with the design layout to obtain an alignment result; based on the alignment result and the measurement recipe file, measuring the scanning electron microscope image to obtain a measurement value, and outputting the measurement value. According to the embodiments of the present application, it is possible to save manpower and time, expand the scope of application of the measurement method, and avoid human import errors.

Description

Technical Field

[0001] The present application belongs to the technical field of scanning electron microscope image measurement, and in particular, relates to a scanning electron microscope image measurement method, device, equipment and computer-readable storage medium based on a design layout. Background Art

[0002] In the current chip manufacturing process, the following two methods are mainly used to measure the scanning electron microscope (SEM) image.

[0003] Method 1: If Figure 1a As shown, the method is mainly implemented based on the reference position image. Specifically, the method can first obtain the SEM image of the reference position, then manually add a measurement frame to the SEM image of the reference position, and then use the measurement method of the reference position image to obtain the SEM image at the position to be measured, and align the obtained SEM image with the reference position image; finally, based on the alignment result, the measurement frame position is determined on the SEM image of the position to be measured, and the measurement is performed and the measurement result is output.

[0004] Method 2: If Figure 1b As shown, the method is mainly implemented based on the design layout. Specifically, the method can first determine the position to be measured on the design layout, then manually place the measurement frame on the position to be measured, and align the SEM image of the position to be measured with its pattern in the design layout; finally, based on the alignment result, determine the position of the measurement frame on the SEM image of the position to be measured, perform measurement and output the measurement result.

[0005] However, when using the above two methods, since both methods require manual addition of measurement frames, it takes a lot of manpower and time to create measurement recipe files. In addition, when using the above two methods, when the number of measurement points is large, it takes a lot of time to create measurement recipe files, which leads to long measurement time and easy introduction of human errors.

[0006] Secondly, when using the above method 2, if Figure 1c As shown in the figure, since the corresponding range of each set of measurement recipe files is limited, once the measurement object changes slightly, a new measurement recipe file must be created. This means that with each technical and process improvement of the production line, the corresponding measurement recipe files must be manually updated for each new product introduced. As a result, this method cannot meet the needs of rapid improvement of semiconductor chip production technology and rapid product iteration and upgrade.

[0007] And, if Figure 1d and Figure 1eAs shown, the above method 2 is only suitable for simple graphics. For complex graphics, it is usually necessary to manually add multiple measurement frames. However, due to manpower and time constraints, generally only 3-5 measurement values ​​are generated at most at a time, so it is impossible to complete multi-point measurement that requires complex condition settings at one time.

[0008] Therefore, how to save manpower and time, expand the scope of application of the measurement method, and avoid human-induced errors are technical problems that technical personnel in this field urgently need to solve. Summary of the invention

[0009] The embodiments of the present application provide a method, device, equipment and computer-readable storage medium for measuring a scanning electron microscope image based on a design layout, which can save manpower and time, expand the scope of application of the measurement method, and avoid human-induced errors.

[0010] In a first aspect, an embodiment of the present application provides a method for measuring a scanning electron microscope image based on a design layout, the method comprising:

[0011] Determine the target measurement point according to the coordinate position information of the design layout;

[0012] Based on the design layout and preset measurement conditions, generate all measurement frames within the preset measurement range;

[0013] Generate a measurement recipe file according to the target measurement point and all measurement frames, and obtain a scanning electron microscope image of the target measurement point based on the measurement recipe file;

[0014] Aligning the scanning electron microscope image with the design layout to obtain an alignment result;

[0015] Based on the alignment result and the measurement recipe file, the scanning electron microscope image is measured to obtain a measurement value, and the measurement value is output.

[0016] Optionally, the measurement frame includes an edge position measurement frame, a line width measurement frame and a spacing measurement frame between graphics of different layers.

[0017] Optionally, if the measurement frame includes an edge position measurement frame, all measurement frames within the preset measurement range are generated based on the design layout and preset measurement conditions, including:

[0018] Based on the design layout and preset measurement conditions, all edge position measurement frames within the preset measurement range are generated.

[0019] Optionally, based on the design layout and preset measurement conditions, all edge position measurement frames within a preset measurement range are generated, including:

[0020] Determine the positions of all straight lines within the preset measurement range;

[0021] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all straight line positions.

[0022] Optionally, based on the design layout and preset measurement conditions, all edge position measurement frames within a preset measurement range are generated, including:

[0023] Determine the positions of all corners within the preset measurement range;

[0024] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all corner positions.

[0025] Optionally, based on the design layout and preset measurement conditions, all edge position measurement frames within a preset measurement range are generated, including:

[0026] Determine the positions of all the ends within the preset measurement range;

[0027] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all end positions.

[0028] Optionally, if the measurement frame includes a line width measurement frame, all measurement frames within the preset measurement range are generated based on the design layout and preset measurement conditions, including:

[0029] Based on the design layout and preset measurement conditions, all line width measurement frames within the preset measurement range are generated.

[0030] Optionally, based on the design layout and preset measurement conditions, all line width measurement frames within the preset measurement range are generated, including:

[0031] Determine all straight lines within the preset measurement range;

[0032] According to all the straight lines, the line widths of the straight lines between two parallel straight lines are determined respectively;

[0033] Generate a line width measurement frame based on the design layout, preset measurement conditions and line width.

[0034] Optionally, based on the design layout and preset measurement conditions, all line width measurement frames within the preset measurement range are generated, including:

[0035] Determine the linear spacing of all straight lines within a preset measurement range;

[0036] Generate a line width measurement frame based on the design layout, preset measurement conditions and line spacing.

[0037] Optionally, based on the design layout and preset measurement conditions, all line width measurement frames within the preset measurement range are generated, including:

[0038] Determine all contact holes within a preset measurement range;

[0039] Generate a line width measurement frame based on the design layout, preset measurement conditions and contact holes.

[0040] Optionally, based on the design layout and preset measurement conditions, all line width measurement frames within the preset measurement range are generated, including:

[0041] Determine the spacing information of all contact holes within a preset measurement range;

[0042] Generate a line width measurement frame based on the design layout, preset measurement conditions and contact hole spacing information.

[0043] Optionally, the line width measurement frame includes a longitudinal line width measurement frame and a transverse line width measurement frame.

[0044] Optionally, if the measurement frame includes a measurement frame for the spacing between graphics of different layers, all measurement frames within the preset measurement range are generated based on the design layout and preset measurement conditions, including:

[0045] Based on the design layout and preset measurement conditions, all the graphic spacing measurement frames between different layers within the preset measurement range are generated.

[0046] Optionally, based on the design layout and preset measurement conditions, all different inter-layer pattern spacing measurement frames within the preset measurement range are generated, including:

[0047] Determine all the different inter-layer graphics within the preset measurement range;

[0048] Based on the graphics between different layers, respectively determine the spacing information between the graphics between different layers;

[0049] Generate a line width measurement frame based on the design layout, preset measurement conditions and spacing information between graphics on different layers.

[0050] In a second aspect, an embodiment of the present application provides a measurement device based on a scanning electron microscope image of a design layout, the device comprising:

[0051] A determination module is used to determine the target measurement point according to the coordinate position information of the design layout;

[0052] A generation module, used to generate all measurement frames within a preset measurement range based on the design layout and preset measurement conditions;

[0053] An acquisition module, used for generating a measurement recipe file according to the target measurement point and all measurement frames, and acquiring a scanning electron microscope image of the target measurement point based on the measurement recipe file;

[0054] An alignment module, used to align the scanning electron microscope image with the design layout to obtain an alignment result;

[0055] The measurement module is used to measure the scanning electron microscope image based on the alignment result and the measurement recipe file to obtain the measurement value and output the measurement value.

[0056] Optionally, the measurement frame includes an edge position measurement frame, a line width measurement frame and a spacing measurement frame between graphics of different layers.

[0057] Optionally, if the measurement frame includes an edge position measurement frame, the generation module includes:

[0058] The generation unit is used to generate all edge position measurement frames within a preset measurement range based on the design layout and preset measurement conditions.

[0059] Optionally, generate a unit to:

[0060] Determine the positions of all straight lines within the preset measurement range;

[0061] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all straight line positions.

[0062] Optionally, generate a unit to:

[0063] Determine the positions of all corners within the preset measurement range;

[0064] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all corner positions.

[0065] Optionally, generate a unit to:

[0066] Determine the positions of all the ends within the preset measurement range;

[0067] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all end positions.

[0068] Optionally, if the measurement frame includes a line width measurement frame, the generation module includes:

[0069] The generation unit is used to generate all line width measurement frames within a preset measurement range based on the design layout and preset measurement conditions.

[0070] Optionally, generate a unit to:

[0071] Determine all straight lines within the preset measurement range;

[0072] According to all the straight lines, the line widths of the straight lines between two parallel straight lines are determined respectively;

[0073] Generate a line width measurement frame based on the design layout, preset measurement conditions and line width.

[0074] Optionally, generate a unit to:

[0075] Determine the linear spacing of all straight lines within a preset measurement range;

[0076] Generate a line width measurement frame based on the design layout, preset measurement conditions and line spacing.

[0077] Optionally, generate a unit to:

[0078] Determine all contact holes within a preset measurement range;

[0079] Generate a line width measurement frame based on the design layout, preset measurement conditions and contact holes.

[0080] Optionally, generate a unit to:

[0081] Determine the spacing information of all contact holes within a preset measurement range;

[0082] Generate a line width measurement frame based on the design layout, preset measurement conditions and contact hole spacing information.

[0083] Optionally, the line width measurement frame includes a longitudinal line width measurement frame and a transverse line width measurement frame.

[0084] Optionally, if the measurement frame includes a measurement frame for spacing between graphics of different layers, the generation module includes:

[0085] The generation unit is used to generate all the different inter-layer graphic spacing measurement frames within a preset measurement range based on the design layout and preset measurement conditions.

[0086] Optionally, generate a unit to:

[0087] Determine all the different inter-layer graphics within the preset measurement range;

[0088] Based on the graphics between different layers, respectively determine the spacing information between the graphics between different layers;

[0089] Generate a line width measurement frame based on the design layout, preset measurement conditions and spacing information between graphics on different layers.

[0090] In a third aspect, an embodiment of the present application provides a measurement device based on a scanning electron microscope image of a design layout, the device comprising: the measurement device based on a scanning electron microscope image of a design layout comprises: a processor and a memory storing computer program instructions;

[0091] When the processor executes the computer program instructions, the scanning electron microscope image measurement method based on the design layout as described in any one of the first aspects above is implemented.

[0092] In a fourth aspect, an embodiment of the present application provides a computer-readable storage medium having computer program instructions stored thereon, and when the computer program instructions are executed by a processor, a method for measuring a scanning electron microscope image based on a design layout as described in any one of the above-mentioned first aspects is implemented.

[0093] The measurement method, device, equipment and computer-readable storage medium of the scanning electron microscope image based on the design layout of the embodiment of the present application can determine the target measurement point according to the coordinate position information of the design layout; generate all measurement frames within the preset measurement range based on the design layout and the preset measurement conditions; generate a measurement recipe file based on the target measurement point and all measurement frames, and obtain the scanning electron microscope image of the target measurement point based on the measurement recipe file; align the scanning electron microscope image with the design layout to obtain the alignment result; measure the scanning electron microscope image based on the alignment result and the measurement recipe file to obtain the measurement value, and output the measurement value, so that, on the one hand, the measurement frame can be automatically generated, and there is no need to manually add the measurement frame, thereby saving manpower and time, and avoiding errors caused by human import. Moreover, since the measurement frame is generated based on the design layout and the preset measurement conditions, when the technology is upgraded and the product is updated, it is only necessary to simply modify the settings of the configuration file to automatically perform automatic measurement on the new product, avoiding the waste of manpower and time required to rebuild a large number of measurement recipe files when the technology is upgraded and the product is updated in the prior art.

[0094] On the other hand, since the present application can automatically add measurement frames to all measurement objects that meet the preset measurement conditions, the measurement method provided by the present application is suitable for all types of graphics. Moreover, through the measurement method provided by the present application, all measurement values ​​that can be measured on the scanning electron microscope image can be obtained with only one measurement, which can greatly improve the measurement effectiveness and efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0095] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0096] Figure 1a and Figure 1bIt is a flow chart of a method for measuring a scanning electron microscope image provided by the related art;

[0097] Figure 1c It is a schematic diagram showing that after the measurement object provided by the relevant technology changes, the original measurement formula file cannot adapt to the changed measurement product;

[0098] Figure 1d and Figure 1e It is a schematic diagram that the method provided by the related art for measuring the scanning electron microscope image based on the design layout cannot achieve multi-point measurement at one time;

[0099] Figure 2a It is a flow chart of a method for measuring a scanning electron microscope image based on a design layout provided by an embodiment of the present application;

[0100] Figure 2b It is a flowchart of a method for generating all edge position measurement frames within a preset measurement range based on a design layout and preset measurement conditions provided by an embodiment of the present application;

[0101] Figure 2c It is a flowchart of a method for generating all edge position measurement frames within a preset measurement range based on a design layout and preset measurement conditions provided by an embodiment of the present application;

[0102] Figure 2d It is a flowchart of a method for generating all edge position measurement frames within a preset measurement range based on a design layout and preset measurement conditions provided by an embodiment of the present application;

[0103] Figure 2e It is a flowchart of a method for generating all line width measurement frames within a preset measurement range based on a design layout and preset measurement conditions provided by an embodiment of the present application;

[0104] Figure 2f It is a flowchart of a method for generating all line width measurement frames within a preset measurement range based on a design layout and preset measurement conditions provided by an embodiment of the present application;

[0105] Figure 2g It is a flowchart of a method for generating all line width measurement frames within a preset measurement range based on a design layout and preset measurement conditions provided by an embodiment of the present application;

[0106] Figure 2h It is a flowchart of a method for generating all line width measurement frames within a preset measurement range based on a design layout and preset measurement conditions provided by an embodiment of the present application;

[0107] Figure 2iIt is a flowchart of a method for generating all different inter-layer graphic spacing measurement frames within a preset measurement range based on a design layout and preset measurement conditions provided by an embodiment of the present application;

[0108] Figure 3 It is a structural schematic diagram of a measurement device based on a scanning electron microscope image of a design layout provided by an embodiment of the present application;

[0109] Figure 4 It is a schematic diagram of the structure of a measurement device for a scanning electron microscope image based on a design layout provided by an embodiment of the present application. DETAILED DESCRIPTION

[0110] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0111] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0112] In the current chip manufacturing process, the following two methods are mainly used to measure the scanning electron microscope (SEM) image.

[0113] Method 1: Based on the reference position image, specifically, this method can first obtain the SEM image of the reference position, then manually add a measurement frame to the SEM image of the reference position, and then use the measurement method of the reference position image to obtain the SEM image at the position to be measured, and align the obtained SEM image with the reference position image; finally, based on the alignment result, determine the measurement frame position on the SEM image of the position to be measured, perform measurement and output the measurement result.

[0114] Method 2: Based on the design layout, specifically, this method can first determine the position to be measured on the design layout, then manually place the measurement frame on the position to be measured, and align the SEM image of the position to be measured with its pattern in the design layout; finally, based on the alignment result, determine the position of the measurement frame on the SEM image of the position to be measured, perform measurement and output the measurement result.

[0115] However, when using the above two methods, since both methods require manual addition of measurement frames, it takes a lot of manpower and time to create measurement recipe files. In addition, when using the above two methods, when the number of measurement points is large, it takes a lot of time to create measurement recipe files, which leads to long measurement time and easy introduction of human errors.

[0116] Secondly, when using the above method 2, since the corresponding range of each set of measurement formula files is limited, once the measurement object changes slightly, a new measurement formula file must be created, which means that with each technical and process improvement of the production line, the corresponding measurement formula files must be manually updated for each new product introduced. As a result, this method cannot meet the needs of rapid improvement of semiconductor chip production technology and rapid product iteration and upgrade.

[0117] Moreover, the above method 2 is only suitable for simple graphics. For complex graphics, it is usually necessary to manually add multiple measurement frames. However, due to manpower and time constraints, generally only 3-5 measurement values ​​can be generated at a time, so it is impossible to complete multi-point measurement that requires complex conditions to be set at one time.

[0118] In order to solve the problems of the prior art, the embodiments of the present application provide a method, device, equipment and computer-readable storage medium for measuring a scanning electron microscope image based on a design layout. The method specifically includes: in chip manufacturing and production, determining the measurement points according to user needs, and then obtaining a design layout consistent with the production silicon wafer pattern. Afterwards, a measurement frame of all measurable positions is automatically generated based on the design layout. After checking the measurement frame, a recipe file for automatic measurement is formed. Afterwards, a scanning electron microscope image is automatically taken on a scanning electron microscope image measurement machine, and then the obtained scanning electron microscope image is automatically aligned with the design layout, and finally all measurable measurement values ​​are automatically obtained on the image aligned with the design layout.

[0119] The following first introduces the measurement method of the scanning electron microscope image based on the design layout provided in the embodiment of the present application.

[0120] Figure 2a FIG. 1 is a flow chart of a method for measuring a scanning electron microscope image based on a design layout provided by an embodiment of the present application. Figure 2a As shown, the method comprises the following steps:

[0121] S201, determining a target measurement point according to coordinate position information of a design layout.

[0122] In the embodiment of the present application, the target measurement point can be determined based on actual needs and coordinate position information of the design layout.

[0123] S202, generating all measurement frames within a preset measurement range based on the design layout and preset measurement conditions.

[0124] It should be noted that if other technical solutions generate part of the measurement frames according to the design layout and use part of the measurement frames for measurement applications, they should be regarded as alternatives to this solution.

[0125] S203, generating a measurement recipe file according to the target measurement point and all measurement frames, and acquiring a scanning electron microscope image of the target measurement point based on the measurement recipe file.

[0126] S204, aligning the scanning electron microscope image with the design layout to obtain an alignment result.

[0127] S205 , based on the alignment result and the measurement recipe file, measure the scanning electron microscope image to obtain a measurement value, and output the measurement value.

[0128] Optionally, the measurement frame includes an edge position measurement frame, a line width measurement frame and a spacing measurement frame between graphics of different layers.

[0129] Optionally, if the measurement frame includes an edge position measurement frame, all measurement frames within the preset measurement range are generated based on the design layout and preset measurement conditions, including:

[0130] Based on the design layout and preset measurement conditions, all edge position measurement frames within the preset measurement range are generated.

[0131] Optional, such as Figure 2b As shown, based on the design layout and the preset measurement conditions, all edge position measurement frames within the preset measurement range are generated, including:

[0132] Determine the positions of all straight lines within the preset measurement range;

[0133] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all straight line positions.

[0134] Optional, such as Figure 2c As shown, based on the design layout and the preset measurement conditions, all edge position measurement frames within the preset measurement range are generated, including:

[0135] Determine the positions of all corners within the preset measurement range;

[0136] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all corner positions.

[0137] Optional, such as Figure 2d As shown, based on the design layout and the preset measurement conditions, all edge position measurement frames within the preset measurement range are generated, including:

[0138] Determine the positions of all the ends within the preset measurement range;

[0139] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all end positions.

[0140] Optionally, if the measurement frame includes a line width measurement frame, all measurement frames within the preset measurement range are generated based on the design layout and preset measurement conditions, including:

[0141] Based on the design layout and preset measurement conditions, all line width measurement frames within the preset measurement range are generated.

[0142] Optional, such as Figure 2e As shown, based on the design layout and the preset measurement conditions, all line width measurement frames within the preset measurement range are generated, including:

[0143] Determine all straight lines within the preset measurement range;

[0144] According to all the straight lines, the line widths of the straight lines between two parallel straight lines are determined respectively;

[0145] Generate a line width measurement frame based on the design layout, preset measurement conditions and line width.

[0146] Optional, such as Figure 2f As shown, based on the design layout and the preset measurement conditions, all line width measurement frames within the preset measurement range are generated, including:

[0147] Determine the linear spacing of all straight lines within a preset measurement range;

[0148] Generate a line width measurement frame based on the design layout, preset measurement conditions and line spacing.

[0149] Optional, such as Figure 2g As shown, based on the design layout and the preset measurement conditions, all line width measurement frames within the preset measurement range are generated, including:

[0150] Determine all contact holes within a preset measurement range;

[0151] Generate a line width measurement frame based on the design layout, preset measurement conditions and contact holes.

[0152] Optional, such as Figure 2h As shown, based on the design layout and the preset measurement conditions, all line width measurement frames within the preset measurement range are generated, including:

[0153] Determine the spacing information of all contact holes within a preset measurement range;

[0154] Generate a line width measurement frame based on the design layout, preset measurement conditions and contact hole spacing information.

[0155] Optionally, the line width measurement frame includes a longitudinal line width measurement frame and a transverse line width measurement frame.

[0156] Optionally, if the measurement frame includes a measurement frame for the spacing between graphics of different layers, all measurement frames within the preset measurement range are generated based on the design layout and preset measurement conditions, including:

[0157] Based on the design layout and preset measurement conditions, all the graphic spacing measurement frames between different layers within the preset measurement range are generated.

[0158] Optional, such as Figure 2i As shown, based on the design layout and the preset measurement conditions, all the different inter-layer pattern spacing measurement frames within the preset measurement range are generated, including:

[0159] Determine all the different inter-layer graphics within the preset measurement range;

[0160] Based on the graphics between different layers, respectively determine the spacing information between the graphics between different layers;

[0161] Generate a line width measurement frame based on the design layout, preset measurement conditions and spacing information between graphics on different layers.

[0162] By adopting the measurement method of the scanning electron microscope image based on the design layout provided in the embodiment of the present application, the target measurement point can be determined according to the coordinate position information of the design layout; based on the design layout and the preset measurement conditions, all measurement frames within the preset measurement range are generated; a measurement recipe file is generated according to the target measurement point and all the measurement frames, and a scanning electron microscope image of the target measurement point is obtained based on the measurement recipe file; the scanning electron microscope image is aligned with the design layout to obtain an alignment result; based on the alignment result and the measurement recipe file, the scanning electron microscope image is measured to obtain a measurement value, and the measurement value is output. In this way, on the one hand, the measurement frame can be automatically generated without the need to manually add the measurement frame, thereby saving manpower and time, and avoiding errors caused by human introduction.

[0163] On the other hand, since the present application can automatically add measurement frames to all measurement objects that meet the preset measurement conditions, the measurement method provided by the present application is suitable for all types of graphics. Moreover, through the measurement method provided by the present application, all measurement values ​​that can be measured on the scanning electron microscope image can be obtained with only one measurement, which can greatly improve the measurement effectiveness and efficiency.

[0164] Figure 3 FIG. 1 is a schematic diagram showing a structure of a measuring device based on a scanning electron microscope image of a design layout provided in an embodiment of the present application. Figure 3 As shown, the device comprises:

[0165] A determination module 301 is used to determine a target measurement point according to coordinate position information of a design layout;

[0166] A generating module 302, for generating all measurement frames within a preset measurement range based on the design layout and preset measurement conditions;

[0167] An acquisition module 303 is used to generate a measurement recipe file according to the target measurement point and all measurement frames, and acquire a scanning electron microscope image of the target measurement point based on the measurement recipe file;

[0168] An alignment module 304 is used to align the scanning electron microscope image with the design layout to obtain an alignment result;

[0169] The measurement module 305 is used to measure the scanning electron microscope image based on the alignment result and the measurement recipe file to obtain the measurement value and output the measurement value.

[0170] Optionally, the measurement frame includes an edge position measurement frame, a line width measurement frame and a spacing measurement frame between graphics of different layers.

[0171] Optionally, if the measurement frame includes an edge position measurement frame, the generating module 302 includes:

[0172] The generation unit is used to generate all edge position measurement frames within a preset measurement range based on the design layout and preset measurement conditions.

[0173] Optionally, generate a unit to:

[0174] Determine the positions of all straight lines within the preset measurement range;

[0175] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all straight line positions.

[0176] Optionally, generate a unit to:

[0177] Determine the positions of all corners within the preset measurement range;

[0178] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all corner positions.

[0179] Optionally, generate a unit to:

[0180] Determine the positions of all the ends within the preset measurement range;

[0181] Based on the design layout and preset measurement conditions, edge position measurement frames are generated at all end positions.

[0182] Optionally, if the measurement frame includes a line width measurement frame, the generating module 302 includes:

[0183] The generation unit is used to generate all line width measurement frames within a preset measurement range based on the design layout and preset measurement conditions.

[0184] Optionally, generate a unit to:

[0185] Determine all straight lines within the preset measurement range;

[0186] According to all the straight lines, the line widths of the straight lines between two parallel straight lines are determined respectively;

[0187] Generate a line width measurement frame based on the design layout, preset measurement conditions and line width.

[0188] Optionally, generate a unit to:

[0189] Determine the linear spacing of all straight lines within a preset measurement range;

[0190] Generate a line width measurement frame based on the design layout, preset measurement conditions and line spacing.

[0191] Optionally, generate a unit to:

[0192] Determine all contact holes within a preset measurement range;

[0193] Generate a line width measurement frame based on the design layout, preset measurement conditions and contact holes.

[0194] Optionally, generate a unit to:

[0195] Determine the spacing information of all contact holes within a preset measurement range;

[0196] Generate a line width measurement frame based on the design layout, preset measurement conditions and contact hole spacing information.

[0197] Optionally, the line width measurement frame includes a longitudinal line width measurement frame and a transverse line width measurement frame.

[0198] Optionally, if the measurement frame includes a measurement frame for spacing between graphics of different layers, the generating module 302 includes:

[0199] The generation unit is used to generate all the different inter-layer graphic spacing measurement frames within a preset measurement range based on the design layout and preset measurement conditions.

[0200] Optionally, generate a unit to:

[0201] Determine all the different inter-layer graphics within the preset measurement range;

[0202] Based on the graphics between different layers, respectively determine the spacing information between the graphics between different layers;

[0203] Generate a line width measurement frame based on the design layout, preset measurement conditions and spacing information between graphics on different layers.

[0204] Figure 3 Each module in the device shown has the function of realizing Figure 2a The functions of each step in the process can achieve the corresponding technical effects, which will not be described in detail here for the sake of brevity.

[0205] Figure 4 A schematic diagram of the structure of a measurement device for a scanning electron microscope image based on a design layout provided in an embodiment of the present application is shown.

[0206] The metrology device based on a scanning electron microscope image of a design layout may include a processor 401 and a memory 402 storing computer program instructions.

[0207] Specifically, the processor 401 may include a central processing unit (CPU), or an application specific integrated circuit (ASIC), or may be configured to implement one or more integrated circuits of the embodiments of the present application.

[0208] The memory 402 may include a large capacity memory for data or instructions. By way of example and not limitation, the memory 402 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a tape, or a universal serial bus (USB) drive or a combination of two or more of these. Where appropriate, the memory 402 may include a removable or non-removable (or fixed) medium. Where appropriate, the memory 402 may be inside or outside a measurement device based on a scanning electron microscope image of a design layout. In a particular embodiment, the memory 402 may be a non-volatile solid-state memory.

[0209] In one embodiment, the memory 402 may be a read-only memory (ROM). In one embodiment, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically rewritable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0210] The processor 401 reads and executes the computer program instructions stored in the memory 402 to implement any one of the measurement methods of the scanning electron microscope image based on the design layout in the above embodiments.

[0211] In one example, the measurement device based on the scanning electron microscope image of the design layout may also include a communication interface 403 and a bus 410. Figure 4 As shown, the processor 401, the memory 402, and the communication interface 403 are connected via a bus 410 and communicate with each other.

[0212] The communication interface 403 is mainly used to implement communication between various modules, devices, units and / or equipment in the embodiments of the present application.

[0213] Bus 410 includes hardware, software or both, and the parts of the measurement equipment of the scanning electron microscope image based on the design layout are coupled to each other. For example, but not limitation, the bus may include accelerated graphics port (AGP) or other graphics bus, enhanced industrial standard architecture (EISA) bus, front-end bus (FSB), hypertransport (HT) interconnection, industrial standard architecture (ISA) bus, infinite bandwidth interconnection, low pin count (LPC) bus, memory bus, micro channel architecture (MCA) bus, peripheral component interconnection (PCI) bus, PCI-Express (PCI-X) bus, serial advanced technology attachment (SATA) bus, video electronics standard association local (VLB) bus or other suitable bus or two or more of these combinations. In appropriate cases, bus 410 may include one or more buses. Although the present application embodiment describes and shows a specific bus, the present application considers any suitable bus or interconnection.

[0214] In addition, in combination with the measurement method of the scanning electron microscope image based on the design layout in the above embodiment, the embodiment of the present application can provide a computer-readable storage medium for implementation. The computer-readable storage medium stores computer program instructions; when the computer program instructions are executed by the processor, any one of the measurement methods of the scanning electron microscope image based on the design layout in the above embodiment is implemented.

[0215] It should be clear that the present application is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present application is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present application.

[0216] The functional modules shown in the above-described block diagram can be implemented as hardware, software, firmware or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a function card, etc. When implemented in software, the elements of the present application are programs or code segments that are used to perform the required tasks. Programs or code segments can be stored in machine-readable media, or transmitted on a transmission medium or a communication link by a data signal carried in a carrier wave. "Machine-readable media" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical disks, hard disks, optical fiber media, radio frequency (RF) links, etc. Code segments can be downloaded via computer networks such as the Internet, intranets, etc.

[0217] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.

[0218] The above reference is according to the method of the embodiment of the present application, the flow chart of the device (system) and the computer program product and / or the block diagram described various aspects of the present application.It should be understood that each square box in the flow chart and / or the block diagram and the combination of each square box in the flow chart and / or the block diagram can be realized by computer program instructions.These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer or other programmable data processing device to produce a machine so that these instructions executed by the processor of the computer or other programmable data processing device enable the realization of the function / action specified in one or more square boxes of the flow chart and / or the block diagram.Such a processor can be but is not limited to a general-purpose processor, a special-purpose processor, a special application processor or a field programmable logic circuit.It can also be understood that each square box in the block diagram and / or the flow chart and the combination of the square boxes in the block diagram and / or the flow chart can also be realized by the dedicated hardware that performs the specified function or action, or can be realized by the combination of dedicated hardware and computer instructions.

[0219] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.

Claims

1. A method for measuring a scanning electron microscope image based on a design layout, characterized in that: include: Determine the target measurement point according to the coordinate position information of the design layout; Based on the design layout and preset measurement conditions, generating all measurement frames within a preset measurement range; The measurement frame includes: an edge position measurement frame, a line width measurement frame and a different-layer pattern spacing measurement frame, wherein the generation of all different-layer pattern spacing measurement frames within a preset measurement range based on the design layout and preset measurement conditions includes: determining all different-layer patterns within the preset measurement range; based on the different-layer patterns, respectively determining the spacing information between the different-layer patterns; generating the line width measurement frame based on the design layout, the preset measurement conditions and the spacing information between the different-layer patterns; generating a measurement recipe file according to the target measurement point and all the measurement frames, and acquiring a scanning electron microscope image of the target measurement point based on the measurement recipe file; Aligning the scanning electron microscope image with the design layout to obtain an alignment result; Based on the alignment result and the measurement recipe file, the scanning electron microscope image is measured to obtain a measurement value, and the measurement value is output.

2. The method for measuring a scanning electron microscope image based on a design layout according to claim 1, characterized in that: If the measurement frame includes an edge position measurement frame, all measurement frames within a preset measurement range are generated based on the design layout and preset measurement conditions, including: Based on the design layout and the preset measurement conditions, all the edge position measurement frames within the preset measurement range are generated.

3. The method for measuring a scanning electron microscope image based on a design layout according to claim 2, characterized in that: Based on the design layout and the preset measurement conditions, generating all edge position measurement frames within the preset measurement range includes: Determine the positions of all straight lines within the preset measurement range; Based on the design layout and the preset measurement conditions, the edge position measurement frames are generated at the positions of all the straight lines respectively.

4. The method for measuring a scanning electron microscope image based on a design layout according to claim 2, characterized in that: Based on the design layout and the preset measurement conditions, generating all edge position measurement frames within the preset measurement range includes: Determine the positions of all corners within the preset measurement range; Based on the design layout and the preset measurement conditions, the edge position measurement frames are generated at the positions of all the corners respectively.

5. The method for measuring a scanning electron microscope image based on a design layout according to claim 2, characterized in that: Based on the design layout and the preset measurement conditions, generating all edge position measurement frames within the preset measurement range includes: Determine the positions of all the ends within the preset measurement range; Based on the design layout and the preset measurement conditions, the edge position measurement frames are generated at the positions of all the ends respectively.

6. The method for measuring a scanning electron microscope image based on a design layout according to claim 1, characterized in that: If the measurement frame includes a line width measurement frame, all measurement frames within a preset measurement range are generated based on the design layout and preset measurement conditions, including: Based on the design layout and the preset measurement conditions, all the line width measurement frames within the preset measurement range are generated.

7. The method for measuring a scanning electron microscope image based on a design layout according to claim 6, characterized in that: Based on the design layout and the preset measurement conditions, generating all the line width measurement frames within the preset measurement range, including: Determine all straight lines within the preset measurement range; According to all the straight lines, respectively determine the line widths of the straight lines between two straight lines located in parallel positions; The line width measurement frame is generated based on the design layout, the preset measurement conditions and the line width.

8. The method for measuring a scanning electron microscope image based on a design layout according to claim 6, characterized in that: Based on the design layout and the preset measurement conditions, generating all the line width measurement frames within the preset measurement range, including: Determine the straight line spacing of all straight lines within the preset measurement range; The line width measurement frame is generated based on the design layout, the preset measurement conditions and the straight line spacing.

9. The method for measuring a scanning electron microscope image based on a design layout according to claim 6, characterized in that: Based on the design layout and the preset measurement conditions, generating all the line width measurement frames within the preset measurement range, including: Determine all contact holes within the preset measurement range; The line width measurement frame is generated based on the design layout, the preset measurement conditions and the contact hole.

10. The method for measuring a scanning electron microscope image based on a design layout according to claim 6, characterized in that: Based on the design layout and the preset measurement conditions, generating all the line width measurement frames within the preset measurement range, including: Determining the spacing information of all contact holes within the preset measurement range; The line width measurement frame is generated based on the design layout, the preset measurement conditions and the spacing information of the contact holes.

11. The method for measuring a scanning electron microscope image based on a design layout according to claim 9 or 10, characterized in that: The line width measurement frame includes a longitudinal line width measurement frame and a transverse line width measurement frame.

12. A device for measuring scanning electron microscope images based on a design layout, characterized in that: The device comprises: A determination module is used to determine the target measurement point according to the coordinate position information of the design layout; A generation module, used to generate all measurement frames within a preset measurement range based on the design layout and preset measurement conditions; the measurement frames include: an edge position measurement frame, a line width measurement frame and a measurement frame for spacing between different layers of graphics; if the measurement frame includes a measurement frame for spacing between different layers of graphics, the generation module includes: a generation unit, used to: determine all different layers of graphics within the preset measurement range; based on the different layers of graphics, respectively determine the spacing information between the different layers of graphics; generate the line width measurement frame based on the design layout, the preset measurement conditions and the spacing information between the different layers of graphics; an acquisition module, configured to generate a measurement recipe file according to the target measurement point and all the measurement frames, and acquire a scanning electron microscope image of the target measurement point based on the measurement recipe file; An alignment module, used for aligning the scanning electron microscope image with the design layout to obtain an alignment result; A measurement module is used to measure the scanning electron microscope image based on the alignment result and the measurement recipe file to obtain a measurement value, and output the measurement value.

13. The device for measuring scanning electron microscope images based on design layout according to claim 12, characterized in that: If the measurement frame includes an edge position measurement frame, the generation module includes: A generating unit is used to generate all the edge position measurement frames within the preset measurement range based on the design layout and the preset measurement conditions.

14. The device for measuring the scanning electron microscope image based on the design layout according to claim 13, characterized in that: Generates units for: Determine the positions of all straight lines within the preset measurement range; Based on the design layout and the preset measurement conditions, the edge position measurement frames are generated at the positions of all the straight lines respectively.

15. The device for measuring the scanning electron microscope image based on the design layout according to claim 13, characterized in that: Generates units for: Determine the positions of all corners within the preset measurement range; Based on the design layout and the preset measurement conditions, the edge position measurement frames are generated at the positions of all the corners respectively.

16. The device for measuring the scanning electron microscope image based on the design layout according to claim 13, characterized in that: Generates units for: Determine the positions of all the ends within the preset measurement range; Based on the design layout and the preset measurement conditions, the edge position measurement frames are generated at the positions of all the ends respectively.

17. The device for measuring the scanning electron microscope image based on the design layout according to claim 12, characterized in that: If the measurement frame includes a line width measurement frame, the generation module includes: A generating unit is used to generate all the line width measurement frames within the preset measurement range based on the design layout and the preset measurement conditions.

18. The device for measuring the scanning electron microscope image based on the design layout according to claim 17, characterized in that: Generates units for: Determine all straight lines within the preset measurement range; According to all the straight lines, respectively determine the line widths of the straight lines between two straight lines located in parallel positions; The line width measurement frame is generated based on the design layout, the preset measurement conditions and the line width.

19. The device for measuring the scanning electron microscope image based on the design layout according to claim 17, characterized in that: Generates units for: Determine the straight line spacing of all straight lines within the preset measurement range; The line width measurement frame is generated based on the design layout, the preset measurement conditions and the straight line spacing.

20. The device for measuring the scanning electron microscope image based on the design layout according to claim 17, characterized in that: Generates units for: Determine all contact holes within the preset measurement range; The line width measurement frame is generated based on the design layout, the preset measurement conditions and the contact hole.

21. The device for measuring the scanning electron microscope image based on the design layout according to claim 17, characterized in that: Generates units for: Determining the spacing information of all contact holes within the preset measurement range; The line width measurement frame is generated based on the design layout, the preset measurement conditions and the spacing information of the contact holes.

22. The device for measuring the scanning electron microscope image based on the design layout according to claim 20 or 21, characterized in that: The line width measurement frame includes a longitudinal line width measurement frame and a transverse line width measurement frame.

23. A measurement device based on a scanning electron microscope image of a design layout, characterized in that: The measurement device based on the scanning electron microscope image of the design layout includes: a processor and a memory storing computer program instructions; When the processor executes the computer program instructions, the method for measuring a scanning electron microscope image based on a design layout as described in any one of claims 1 to 11 is implemented.

24. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer program instructions, and when the computer program instructions are executed by a processor, the method for measuring a scanning electron microscope image based on a design layout according to any one of claims 1 to 11 is implemented.

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