Transfer head, transfer head mold and method for manufacturing transfer head

Abstract

The present invention relates to a transfer head, a transfer head mold and a method for manufacturing a transfer head. In the manufactured transfer head, a region dividing portion is formed on the first surface of its carrier substrate, the region dividing portion is located in other regions outside the first surface where a pickup head is arranged, the region dividing portion is integrally formed with the carrier substrate, and the region dividing portion includes a protrusion protruding from the first surface and / or a concave portion concave from the first surface to a second surface opposite thereto, and by utilizing the height difference between the protrusion and / or the concave portion and the first surface, other regions outside the pickup head formed on the first surface are divided from an original plane into multiple surfaces with different heights, thereby avoiding as much as possible the formation of a wrinkled structure in the region during the curing process of the transfer head manufacturing, ensuring the quality of the transfer head and the consistency of the pickup head formed on the transfer head, and improving the yield and reliability of the transfer head.

Description

Technical Field

[0001] The present invention relates to the field of chip transfer, and in particular to a transfer head, a transfer head mold and a method for manufacturing the transfer head. Background Art

[0002] Micro-LED display technology has the advantages of high brightness, high response speed, low power consumption, and long life, and has become a research hotspot in the pursuit of a new generation of display technology. In the process of manufacturing large and medium-sized Micro-LED displays, a large amount of LED chips need to be transferred and bonded. The existing bonding process generally requires heating (mostly above 150°C) to achieve the connection between the LED chip and the backplane through metal solder.

[0003] The polydimethylsiloxane (PDMS) transfer head is an important medium for Micro-LED transfer. Figure 1 As shown, it includes a carrier substrate 41 made of PDMS material, and a plurality of PDMS protrusions formed on one of the surfaces (hereinafter referred to as the bottom surface) of the carrier substrate 41 are used as a pick-up head 42 for picking up the chip, and the bottom surface of the carrier substrate 41 is generally a plane. The production of the transfer head is generally produced and formed by a high-precision template method. During the production process, the PDMS material is coated on a template substrate formed with a pattern corresponding to the transfer head, and then cured and formed. The other areas (hereinafter referred to as blank areas) on the bottom surface of the transfer head prepared except the area where the pick-up head 42 is formed are on a plane as a whole, and the PDMS material has a thermoplastic property. During the curing process, the PDMS solvent in the blank area is cross-linked during the curing process and is prone to a wrinkled structure 43, resulting in poor consistency of the quality of the transfer head, and unpredictable unknown problems are prone to occur during the use of the transfer head, and even the wrinkled structure 43 may affect the consistency of the formed pick-up head 42.

[0004] Therefore, how to avoid the formation of a wrinkled structure on the surface of the pickup head on the transfer head is an urgent problem to be solved. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present application is to provide a transfer head, a transfer head mold and a method for manufacturing a transfer head, aiming to solve the problem of a wrinkled structure on the surface of a pickup head formed on the transfer head in the related art.

[0006] A transfer head, comprising:

[0007] A carrier substrate having a first surface and a second surface opposite to each other;

[0008] A plurality of pickup heads formed on the first surface, the pickup heads being used to pick up chips;

[0009] A region dividing portion formed on the first surface, the region dividing portion is located in other regions outside the pickup head, the region dividing portion is integrally formed with the carrier substrate, and the region dividing portion includes at least one of a protruding portion protruding from the first surface and a concave portion concave from the first surface to the second surface;

[0010] A first distance between an end of the pickup head away from the first surface and the second surface is greater than a second distance between an end of the protrusion away from the first surface and the second surface.

[0011] In the above-mentioned transfer head, an area dividing portion is formed on the first surface of the carrier substrate, and the area dividing portion is located in other areas outside the pickup head. The area dividing portion is integrally formed with the carrier substrate, and the area dividing portion includes at least one of a protrusion protruding from the first surface and a recessed portion recessed from the first surface to a second surface opposite thereto. By utilizing the height difference between the protrusion and / or the recessed portion and the first surface, other areas outside the pickup head formed on the first surface are divided from the original one plane into multiple surfaces with different heights, thereby avoiding as much as possible the formation of a wrinkled structure in the area during the curing process of the transfer head, ensuring the quality of the transfer head and the consistency of the pickup head formed on the transfer head, and improving the yield and reliability of the transfer head.

[0012] Based on the same inventive concept, the present application also provides a transfer head mold for making the transfer head as described above, comprising:

[0013] Template substrate body;

[0014] A transfer head pattern is formed on the template substrate body, the transfer head pattern includes a plurality of pickup head grooves for forming the plurality of pickup heads, and an area dividing pattern for forming the area dividing portion, the area dividing pattern includes at least one of an inner concave area for forming the raised portion and an upper convex area for forming the lower concave portion.

[0015] The transfer head pattern formed on the template substrate body of the above-mentioned transfer head mold, in addition to including a plurality of pickup head grooves for forming a plurality of pickup heads, also includes an area dividing pattern for forming an area dividing part on the transfer head, and the area dividing pattern includes an inner concave area forming a raised part on the transfer head and / or an upper convex area forming a lower concave part; thereby, the transfer head manufactured using the transfer head mold has an area dividing part, and the formation of a wrinkled structure in the area during the curing process of the transfer head manufacturing is avoided as much as possible, thereby ensuring the quality of the manufactured transfer head and the consistency of the pickup head formed on the transfer head, and improving the yield and reliability of the transfer head.

[0016] Based on the same inventive concept, the present application also provides a method for manufacturing the transfer head as described above, comprising:

[0017] Making a transfer head mold as described above;

[0018] Filling a preset material on the transfer head pattern;

[0019] Performing a curing process on the preset material;

[0020] The transfer head mold is removed to obtain the transfer head.

[0021] The transfer head mold made by the above-mentioned transfer head manufacturing method has a transfer head pattern formed on its template substrate body, which includes, in addition to a plurality of pickup head grooves for forming a plurality of pickup heads, also a region dividing pattern for forming a region dividing part on the transfer head; the transfer head made by the transfer head mold has a region dividing part, which avoids the formation of a wrinkled structure in the region during the curing process of the transfer head manufacturing as much as possible, ensures the quality of the manufactured transfer head and the consistency of the pickup heads formed on the transfer head, and improves the yield and reliability of the transfer head; and the above-mentioned transfer head manufacturing method is simple and versatile, and has high manufacturing efficiency and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a plan view of the existing transfer head structure;

[0023] Figure 2 A schematic diagram of a transfer head structure provided in an embodiment of the present application Figure 1 ;

[0024] Figure 3 for Figure 2 Middle AA section view;

[0025] Figure 4-1 A schematic diagram of a transfer head structure provided in an embodiment of the present application Figure 2 ;

[0026] Figure 4-2 for Figure 4-1 Middle BB section view;

[0027] Figure 4-3 A schematic diagram of a transfer head structure provided in an embodiment of the present application Figure 3 ;

[0028] Figure 4-4 for Figure 4-3 Middle CC section view;

[0029] Figure 4-5 A fourth plan view of a transfer head structure provided in an embodiment of the present application;

[0030] Figure 4-6 A fifth plan view of a transfer head structure provided in an embodiment of the present application;

[0031] Figure 5-1 A sixth plan view of a transfer head structure provided in an embodiment of the present application;

[0032] Figure 5-2 for Figure 5-1 Side view in the middle D direction;

[0033] Figure 5-3 A seventh plan view of a transfer head structure provided in an embodiment of the present application;

[0034] Figure 5-4 for Figure 5-3 Side view in the middle E direction;

[0035] Figure 5-5 Schematic diagram 8 of a plan view of a transfer head structure provided in an embodiment of the present application;

[0036] Figure 5-6 for Figure 5-5 Side view in the middle F direction;

[0037] Figure 5-7 A ninth plan view of a transfer head structure provided in an embodiment of the present application;

[0038] Figure 5-8 A plan view diagram 10 of a transfer head structure provided in an embodiment of the present application;

[0039] Figure 5-9 11 is a plan view of a transfer head structure provided in an embodiment of the present application;

[0040] Figure 5-10 A twelfth plan view of a transfer head structure provided in an embodiment of the present application;

[0041] Figure 6-1 A schematic plan view of a transfer head structure provided in another optional embodiment of the present application Figure 1 ;

[0042] Figure 6-2 for Figure 6-1 Middle GG section view;

[0043] Figure 6-3 A schematic plan view of a transfer head structure provided in another optional embodiment of the present application Figure 2 ;

[0044] Figure 6-4 for Figure 6-3 Middle HH section view;

[0045] Figure 6-5A schematic plan view of a transfer head structure provided in another optional embodiment of the present application Figure 3 ;

[0046] Figure 6-6 for Figure 6-5 Middle II sectional view;

[0047] Figure 6-7 A fourth plan view of a transfer head structure provided for another optional embodiment of the present application;

[0048] Figure 7-1 A fifth plan view of a transfer head structure provided for another optional embodiment of the present application;

[0049] Figure 7-2 A sixth plan view of a transfer head structure provided for another optional embodiment of the present application;

[0050] Figure 7-3 A seventh plan view of a transfer head structure provided for another optional embodiment of the present application;

[0051] Figure 7-4 A schematic plan view 8 of a transfer head structure provided for another optional embodiment of the present application;

[0052] Figure 7-5 A ninth plan view of a transfer head structure provided for another optional embodiment of the present application;

[0053] Figure 7-6 A plan view ten of a transfer head structure provided for another optional embodiment of the present application;

[0054] Figure 7-7 A schematic plan view eleven of a transfer head structure provided for another optional embodiment of the present application;

[0055] Figure 7-8 A twelfth plan view of a transfer head structure provided for another optional embodiment of the present application;

[0056] Figure 7-9 for Figure 7-8 Middle JJ section view;

[0057] Figure 8-1 A schematic diagram of a transfer head mold structure provided for another optional embodiment of the present application Figure 1 ;

[0058] Figure 8-2 A schematic diagram of a transfer head mold structure provided for another optional embodiment of the present application Figure 1 ;

[0059] Figure 8-3 A schematic diagram of a transfer head manufacturing method provided in another optional embodiment of the present application Figure 1 ;

[0060] Figure 9-1 A schematic diagram of a transfer head manufacturing method provided in another optional embodiment of the present application Figure 2 ;

[0061] Figure 9-2 for Figure 9-1 Schematic diagram of the transfer head manufacturing process;

[0062] Figure 10-1 A schematic diagram of a transfer head manufacturing method provided in another optional embodiment of the present application Figure 3 ;

[0063] Figure 10-2 for Figure 10-1 Schematic diagram of the transfer head manufacturing process;

[0064] Description of reference numerals:

[0065] 1, 41-carrying substrate, 2, 42-pickup head, 43-corrugated structure, 11-first surface, 121-first protruding unit, 122-second protruding unit, 123-third protruding unit, 131-transverse partition wall, 132-vertical partition wall, 133-enclosing wall, 141-first blind hole, 142-second blind hole, 143-third blind hole, 151-transverse isolation groove, 152-vertical isolation groove, 153-enclosed isolation groove, 5-template substrate body, 51-pickup head groove, 52-concave area unit, 53-convex area unit, 6-preset material, 7-support substrate. DETAILED DESCRIPTION

[0066] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thoroughly and comprehensively understood.

[0067] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0068] In the related art, a surface of a pickup head formed on a transfer head is prone to a wrinkled structure, resulting in poor consistency in the quality of the transfer head. Unpredictable and unknown problems may easily occur during the use of the transfer head, and the wrinkled structure may even affect the consistency of the pickup head formed.

[0069] Based on this, the present application hopes to provide a solution that can solve the above-mentioned technical problems, the details of which will be described in the subsequent embodiments.

[0070] This embodiment provides a transfer head, which is used to transfer chips; the chips in this embodiment include but are not limited to LED chips, and the LED chips can be but are not limited to micro-light-emitting chips. The micro-light-emitting chips in this embodiment refer to um-level light-emitting chips, for example, they can include but are not limited to at least one of Mini LED chips and Micro LED chips. Of course, the micro-light-emitting chip can also be replaced with chips of other sizes according to needs, which will not be repeated here; and the chips in this embodiment are not limited to light-emitting chips, and can also be replaced with other chips equivalently according to needs; of course, the transfer head in this embodiment is not limited to transfer chips, and can also be replaced with other devices according to needs.

[0071] The transfer head illustrated in this embodiment includes:

[0072] A carrier substrate, the carrier substrate having a first surface and a second surface opposite to each other; for example, the first surface may be the bottom surface of the carrier substrate, and the second surface may be the top surface of the carrier substrate, or the first surface may be the top surface and the second surface may be the bottom surface;

[0073] A plurality of bumps formed on the first surface of the carrier substrate serve as a pickup head, and the pickup head is used to pick up the chip;

[0074] The area dividing portion is formed on the first surface of the carrier substrate, and the area dividing portion is located in other areas outside the pickup head, that is, the area dividing portion is located in other areas outside the pickup head formed on the first surface. The area dividing portion includes at least one of a protrusion protruding from the first surface and a concave portion concave from the first surface to the second surface, and the area dividing portion is integrally formed with the carrier substrate. In this way, during the integral forming process of the area dividing portion and the carrier substrate, the height difference between the protrusion and / or concave portion included in the area dividing portion and the first surface can be used to divide other areas outside the pickup head formed on the first surface from the original one plane into multiple surfaces with different heights, thereby avoiding as much as possible the formation of a wrinkled structure in the area during the curing process of the transfer head, ensuring the quality of the transfer head and the consistency of the pickup head formed on the transfer head, and improving the yield and reliability of the transfer head.

[0075] In this embodiment, when the area dividing portion formed on the first surface of the carrier substrate includes a protruding portion, in order to ensure that the pickup head can directly contact the chip to be transferred to pick up the chip, a first distance between an end of the pickup head away from the first surface and the second surface is set to be greater than a second distance between an end of the protruding portion away from the first surface and the second surface; that is, a height of the pickup head on the first surface is greater than a height of the protruding portion on the first surface.

[0076] It should be understood that the number of the plurality of pickup heads formed on the first surface in this embodiment, as well as the spacing and layout between the plurality of pickup heads, can be set according to, but not limited to, the number and layout of the chips to be picked up. For example, the spacing between the pickup heads can be set according to, but not limited to, the corresponding pad layout in the chip bonding area on the display backplane.

[0077] The raised portions and recessed portions included in the area dividing portion in this embodiment can be flexibly combined. In some application examples, the area dividing portion may only include the raised portions, in other application examples, the area dividing portion may only include the recessed portions, and in still other examples, the area dividing portion may include the raised portions and the raised portions.

[0078] For ease of understanding, this embodiment is described by taking the region dividing portion including the protruding portion as an example. The protruding portion formed on the first surface of the carrier substrate in this embodiment may include but is not limited to at least one of the following:

[0079] A plurality of protrusion units are formed on the first surface, and the plurality of protrusion units are dispersedly distributed on the first surface;

[0080] Partition walls are formed on the first surface.

[0081] In this embodiment, when the protrusion includes a plurality of protrusion units, there is no limitation on the specific shape, number and specific layout of the protrusion units on the first surface. For example, in one example, a plurality of pickup heads may be distributed in an array on the first surface, and the plurality of protrusion units included in the area dividing portion may include but are not limited to at least one of the following:

[0082] A first protrusion unit is formed between adjacent pickup heads of at least one row of pickup heads; for example, see Figure 2 The transfer head shown includes a carrier substrate 1, on which a plurality of pick-up heads 2 are formed. The pick-up heads 2 can be integrally formed with the carrier substrate 1. The pick-up heads 2 are distributed in an array on the first surface 11. Figure 2 In the embodiment, a first protruding unit 121 is provided between adjacent pickup heads 2 of each row of pickup heads. At least one of the shapes and sizes of the first protruding units 121 may be the same or different. The height of the first protruding unit 121 on the first surface 11 is lower than the height of each pickup head 2 on the first surface. Figure 3 As shown, Figure 3 Shown Figure 2The cross-sectional view of the AA region in FIG. 1 is a cross-sectional view of the AA region in FIG. 1; and it should be understood that the heights of the first protrusion units 121 in this embodiment can be the same or different. It should be understood that in this embodiment, the first protrusion units 121 can be set only between adjacent pickup heads 2 in one row of pickup heads 2 or several rows of pickup heads 2. For a row of pickup heads 2, the first protrusion units 121 can be set only between a portion of adjacent pickup heads 2 according to requirements. Figure 2 It can be seen that, through the setting of the first protrusion unit 121, the other areas on the first surface 11 except for the pickup head 2 can be divided into multiple areas that are not on the same plane. When the number of the first protrusion units 121 set is sufficient, the other areas on the first surface 11 except for the pickup head 2 can be divided into multiple grid areas, thereby avoiding the appearance of a wrinkled structure in this part of the area.

[0083] A second protrusion unit is formed between adjacent pickup heads of at least one row of pickup heads; for example, see Figure 4-1 In the transfer head shown, the pick-up heads 2 are distributed in an array on the first surface 11. Figure 4-1 In the embodiment, a second protruding unit 122 is provided between adjacent pickup heads 2 in each row of pickup heads. At least one of the shapes and sizes of the second protruding units 122 may be the same or different. The height of the second protruding unit 122 on the first surface 11 is lower than the height of each pickup head 2 on the first surface. Figure 4-2 As shown, Figure 4-2 Shown Figure 4-1 The cross-sectional view of the BB region in FIG. 1 is a cross-sectional view of the BB region in FIG. 1; and it should be understood that the heights of the second protrusion units 122 in this embodiment can be the same or different. It should be understood that in this embodiment, the second protrusion units 122 can be set only between adjacent pick-up heads 2 in one column of pick-up heads 2 or several columns of pick-up heads 2. For a column of pick-up heads 2, the second protrusion units 122 can be set only between a part of adjacent pick-up heads 2 according to requirements. Figure 4-1 It can be seen that, through the setting of the second protrusion unit 122, the other areas on the first surface 11 except for the pickup head 2 can also be divided into a plurality of areas that are not on the same plane. When the number of the second protrusion units 122 set is sufficient, the other areas on the first surface 11 except for the pickup head 2 can also be divided into a plurality of grid areas, thereby avoiding the appearance of a wrinkled structure in this part of the area.

[0084] A third protrusion unit is formed in the inter-row area between two adjacent rows of pickup heads and the overlapping area between two adjacent columns of pickup heads; for example, see Figure 4-3The transfer head shown in the figure is provided with three raised units 123 in the inter-row area between the first row pickup head 2 and the second row pickup head 2, the inter-row area between the third row pickup head 2 and the fourth row pickup head 2, the inter-row area between the fifth row pickup head 2 and the sixth row pickup head 2, and the overlapping area of ​​the inter-column area between each adjacent column pickup head 2. Of course, at least one of the shape and size of each third raised unit 123 can be the same or different, and the height of the third raised unit 123 on the first surface 11 is lower than the height of each pickup head 2 on the first surface, see Figure 4-4 As shown, Figure 4-4 Shown Figure 4-3 It should be understood that in this embodiment, the heights of the third protrusion units 123 can be the same or different. It should be understood that in this embodiment, the third protrusion units 123 can be set only in a part of the overlapping area between the row area and the column area, and the specific setting method can be flexible and varied, and this example does not limit it.

[0085] It should be understood that the first protrusion unit 121, the second protrusion unit 122, and the third protrusion unit 123 in the above-mentioned example in this embodiment can be set separately or flexibly combined, and when set, they can be distributed on the first surface according to a certain rule or randomly distributed. Figure 4-5 As shown, a plurality of first protrusion units 121 and a plurality of second protrusion units 122 are provided on the first surface 11, and the plurality of first protrusion units 121 and the plurality of second protrusion units 122 are enclosed to form a "U" shape. Of course, the first protrusion unit 121 and the third protrusion unit 123, or the second protrusion unit 122 and the third protrusion unit 123, or the first protrusion unit 121, the second first protrusion unit 122, and the third protrusion unit 123 can also be provided on the first surface 11 according to needs. For example, see Figure 4-6 As shown, the first surface is provided with a first protrusion unit 121 and a third protrusion unit 123 .

[0086] In this embodiment, when the raised portion includes a plurality of partition walls, there is no limitation on the specific shape, number, and specific layout of the partition walls on the first surface. For example, in one example, a plurality of pickup heads may be distributed in an array on the first surface, and the partition walls included in the area dividing portion may include but are not limited to at least one of the following:

[0087] A transverse partition wall formed in the inter-row region between two adjacent rows on the first surface; for example, see Figure 5-1 The transfer head shown includes a carrier substrate 1, on which a plurality of pick-up heads 2 are formed. The pick-up heads 2 can be integrally formed with the carrier substrate 1. The pick-up heads 2 are distributed in an array on the first surface 11. Figure 5-1In the embodiment, a transverse partition wall 131 is provided in the inter-row area (i.e., the area between two adjacent rows) of the pickup heads of each adjacent row. At least one of the shape and size of each transverse partition wall 131 may be the same or different. The height of the transverse partition wall 131 on the first surface 11 is lower than the height of each pickup head 2 on the first surface. Figure 5-2 As shown, Figure 5-2 Shown Figure 5-1 The projection diagram (or side view) shown in the direction D in the figure; and it should be understood that the heights of the transverse partition walls 131 in this embodiment can be the same or different. It should be understood that in this embodiment, the transverse partition walls 131 can be set only in a part of the inter-row area, and the length of the transverse partition walls 131 can be the same as the length of the inter-row area, or shorter than the length of the inter-row area; and the shape of the transverse partition walls 131 is not limited to a straight line, and can also be set to other strip shapes. Figure 5-1 It can be seen that by setting the transverse partition wall 131, the other areas on the first surface 11 except for the pickup head 2 can be separated into multiple areas, and the surface of the transverse partition wall 131 is not on the same plane as the first surface, thereby avoiding the appearance of a wrinkled structure in this area.

[0088] A vertical partition wall formed in the inter-column region between two adjacent columns on the first surface; for example, see Figure 5-3 In the transfer head shown, the pick-up heads 2 are distributed in an array on the first surface 11. Figure 5-3 In the embodiment, a vertical partition wall 132 is provided in the inter-row area (i.e., the area between two adjacent rows) of the pickup heads of each adjacent row. At least one of the shape and size of each vertical partition wall 132 may be the same or different. The height of the vertical partition wall 132 on the first surface 11 is lower than the height of each pickup head 2 on the first surface. Figure 5-4 As shown, Figure 5-4 Shown Figure 5-3 The projection shown in the E direction is a schematic diagram after rotating 90°; and it should be understood that the heights of the vertical partition walls 132 in this embodiment can be the same or different. It should be understood that in this embodiment, the vertical partition walls 132 can be set only in a part of the inter-column area, and the length of the vertical partition walls 132 can be the same as the length of the inter-column area, or shorter than the length of the inter-column area; and the shape of the vertical partition walls 132 is not limited to a straight line, and can also be set to other strip shapes. According to Figure 5-3 It can be seen that by setting the vertical partition wall 132, the other areas on the first surface 11 except for the pickup head 2 can be separated into multiple areas, and the surface of the vertical partition wall 132 is not on the same plane as the first surface, thereby avoiding the appearance of a wrinkled structure in this area.

[0089] A wall encloses a closed area on the first surface, and the closed area includes at least one pickup head; it should be understood that the shape of the closed area enclosed by the wall in this embodiment can be flexibly set, and can be a regular shape, such as a circle, an ellipse, a rectangle, etc., or an irregular shape. For example, see Figure 5-5 In the transfer head shown, the pick-up heads 2 are distributed in an array on the first surface 11. Figure 5-5 In the embodiment, a plurality of walls 133 are provided, and at least one of the shapes and sizes of the walls 133 may be the same or different. The height of the walls 133 on the first surface 11 is lower than the height of each pickup head 2 on the first surface. Figure 5-6 As shown, Figure 5-6 Shown Figure 5-5 It should be understood that in this embodiment, only one wall 133 can be provided, or multiple walls 133 can be provided as required. When multiple walls 133 are provided, the walls 133 can be nested, for example, see Figure 5-7 As shown, the two walls 133 are nested to form a "U" shape, or they may not be nested, for example, see Figure 5-5 Of course, at least two of the walls 133 may be arranged to partially overlap the areas enclosed by them as required. Figure 5-5 and Figure 5-7 It can be seen that by setting the wall 133, the other areas on the first surface 11 except for the pickup head 2 can be separated into multiple areas, and the surface of the wall 133 is not on the same plane as the first surface, thereby avoiding the appearance of a wrinkled structure in this area.

[0090] Of course, it should be understood that the transverse partition wall 131, the vertical partition wall 132 and the wall 133 in the above examples can be provided separately or in combination. The transverse partition wall 131, the vertical partition wall 132, the wall 133 and the protruding units shown in the above examples can also be provided flexibly. For example, see Figure 5-8 As shown, a wall 133 is provided on the first surface, and a vertical partition wall 132 is also provided. Figure 5-9 As shown, a vertical partition wall 132 is provided on the first surface, and a first protrusion unit 121 is also provided. Figure 5-10 As shown, vertical partition walls 132 and transverse partition walls 131 are provided on the first surface, and the vertical partition walls 132 and transverse partition walls 131 cross to divide the first surface 11 into a plurality of grids.

[0091] It can be seen that the raised portion arranged on the transfer head provided in the present embodiment can utilize the height difference between the raised portion arranged on the first surface of the carrier substrate and the first surface of the carrier substrate to divide the other areas on the first surface other than the pickup head from the original one plane into multiple surfaces with different heights (including the surface of the raised portion itself), thereby avoiding as much as possible the formation of a wrinkled structure in the area during the curing process of the transfer head, ensuring the quality of the transfer head and the consistency of the pickup head formed on the transfer head, and improving the yield and reliability of the transfer head.

[0092] Another Alternative Embodiment

[0093] For ease of understanding, this embodiment is described by taking the region dividing portion including the concave portion as an example. In this embodiment, the concave portion formed on the first surface of the carrier substrate may include but is not limited to at least one of the following:

[0094] A plurality of blind holes are formed on the first surface, and the plurality of blind holes are dispersedly distributed on the first surface; the blind holes in this embodiment refer to holes opened from the first surface of the carrier substrate to the second surface, and do not penetrate the second surface;

[0095] An isolation trench is formed on the first surface.

[0096] In this embodiment, when the concave portion includes a plurality of blind holes, there is no limitation on the specific shape, number and specific layout of the blind holes on the first surface. For example, in one example, the plurality of pickup heads may be distributed in an array on the first surface, and the plurality of blind holes included in the area dividing portion may include but are not limited to at least one of the following:

[0097] A first blind hole formed between adjacent pickup heads of at least one row of pickup heads; for example, see Figure 6-1 The transfer head shown includes a carrier substrate 1, on which a plurality of pick-up heads 2 are formed. The pick-up heads 2 can be integrally formed with the carrier substrate 1. The pick-up heads 2 are distributed in an array on the first surface 11. Figure 6-1 In the embodiment, a first blind hole 141 is provided between adjacent pickup heads 2 of each row of pickup heads. At least one of the shapes and sizes of the first blind holes 141 may be the same or different. The first blind holes 141 do not penetrate the second surface. Figure 6-2 As shown, Figure 6-2 Shown Figure 6-1 A cross-sectional view of the GG region in FIG. 1; and it should be understood that the depths of the first blind holes 141 in this embodiment may be the same or different. It should be understood that in this embodiment, the first blind holes 141 may be provided only between adjacent pickup heads 2 in one row of pickup heads 2 or in several rows of pickup heads 2. For a row of pickup heads 2, the first blind holes 141 may be provided only between a portion of adjacent pickup heads 2 as required. Figure 6-1 It can be seen that, through the setting of the first blind hole 141, the other area on the first surface 11 except for the pickup head 2 can be divided into a plurality of areas that are not on the same plane (including the bottom and side walls of the blind hole). When the number of the first blind holes 141 set is sufficient, the other area on the first surface 11 except for the pickup head 2 can also be divided into a plurality of grid areas, thereby avoiding the appearance of a wrinkled structure in this area.

[0098] A second blind hole formed between adjacent pickup heads of at least one row of pickup heads; for example, see Figure 6-3 In the transfer head shown, the pick-up heads 2 are distributed in an array on the first surface 11. Figure 6-1 In the embodiment, a second blind hole 142 is provided between adjacent pickup heads 2 of each row of pickup heads. At least one of the shapes and sizes of the second blind holes 142 may be the same or different. The second blind holes 142 do not penetrate the second surface. Figure 6-4 As shown, Figure 6-4 Shown Figure 6-3 The cross-sectional view of the HH region in FIG. 1 is a cross-sectional view of the HH region in FIG. 1; and it should be understood that the depths of the second blind holes 142 in this embodiment can be the same or different. It should be understood that in this embodiment, the second blind holes 142 can be set only between adjacent pickup heads 2 in one column of pickup heads 2 or several columns of pickup heads 2. For a column of pickup heads 2, the second blind holes 142 can be set only between a part of adjacent pickup heads 2 according to requirements. Figure 6-3 It can be seen that, through the setting of the second blind hole 142, the other area on the first surface 11 except for the pickup head 2 can be divided into a plurality of areas that are not on the same plane (including the bottom and side walls of the blind hole). When the number of the second blind holes 142 set is large enough, the other area on the first surface 11 except for the pickup head 2 can also be divided into a plurality of grid areas, thereby avoiding the appearance of a wrinkled structure in this area.

[0099] A third blind hole is formed in the inter-row area between two adjacent rows of pickup heads and in the overlapping area between two adjacent columns of pickup heads; for example, see Figure 6-5 The transfer head shown in the figure has a third blind hole 143 in the inter-column area between the first column pickup head 2 and the second column pickup head 2, the inter-column area between the fourth column pickup head 2 and the fifth column pickup head 2, the inter-column area between the seventh column pickup head 2 and the eighth column pickup head 2, the inter-column area between the eleventh column pickup head 2 and the twelfth column pickup head 2, and the overlapping area between the inter-row areas between the adjacent rows of pickup heads 2. Of course, at least one of the shapes and sizes of the third blind holes 143 can be the same or different, and the third blind holes 143 do not penetrate the second surface, see Figure 6-6 As shown, Figure 6-6 Shown Figure 6-5Cross-sectional view of area II; in this embodiment, the third blind hole 143 can be set only in a part of the overlapping area between the row areas and the column areas. The specific setting method can be flexible and this example does not limit it.

[0100] It should be understood that the first blind hole 141, the second blind hole 142, and the third blind hole 143 in the above-mentioned example in this embodiment can be set separately or flexibly combined, and can be distributed on the first surface according to a certain rule or randomly. Figure 6-7 As shown, a plurality of first blind holes 141 and a plurality of third blind holes 143 are provided on the first surface 11, and the plurality of third blind holes 143 are distributed along the diagonal line. Of course, the first blind hole 141 and the second blind hole 142, or the second blind hole 142 and the second blind hole 143, or the first blind hole 141, the second blind hole 142 and the third blind hole 143 can also be provided on the first surface 11 according to the requirements. They will not be described one by one here.

[0101] In this embodiment, when the concave portion includes an isolation groove, there is no limitation on the specific shape, number, and specific layout of the isolation groove on the first surface. For example, in one example, a plurality of pickup heads may be distributed in an array on the first surface, and the isolation grooves included in the area dividing portion may include but are not limited to at least one of the following:

[0102] A transverse isolation groove is formed in the inter-row region between two adjacent rows on the first surface; for example, see Figure 7-1 In the transfer head shown, the pick-up heads 2 are distributed in an array on the first surface 11. Figure 7-1 In the embodiment, transverse isolation grooves 151 are provided in the inter-row regions of each adjacent row of pickup heads. At least one of the shapes and sizes of each transverse isolation groove 151 may be the same or different. The transverse isolation grooves 151 do not penetrate the second surface of the carrier substrate (of course, they may penetrate in some application examples). It should be understood that in the present embodiment, the heights of each transverse isolation groove 151 may be the same or different. It should be understood that in the present embodiment, the transverse isolation grooves 151 may be provided in only a part of the inter-row regions. The length of the transverse isolation grooves 151 may be the same as that of the inter-row regions or may be shorter than that of the inter-row regions. The shape of the transverse isolation grooves 151 is not limited to a rectangle, but may also be other strip shapes. According to Figure 7-1 It can be seen that by setting the transverse isolation groove 151, the other areas on the first surface 11 except for the pickup head 2 can be divided into multiple areas, and the bottom surface and side wall of the transverse isolation groove 151 are not on the same plane as the first surface, thereby avoiding the appearance of a wrinkled structure in this area.

[0103] A vertical isolation groove is formed in the inter-column region between two adjacent columns on the first surface; for example, see Figure 7-2In the transfer head shown, the pick-up heads 2 are distributed in an array on the first surface 11. Figure 7-2 In the embodiment, vertical isolation grooves 152 are provided in the inter-column regions of some adjacent columns of pickup heads, and at least one of the shapes and sizes of the vertical isolation grooves 152 may be the same or different, and the vertical isolation grooves 152 do not penetrate the second surface of the carrier substrate (of course, they may penetrate in some application examples). And it should be understood that, in the present embodiment, the heights of the vertical isolation grooves 152 may be the same or different. It should be understood that, in the present embodiment, vertical isolation grooves 152 may be provided in the inter-column regions, and the length of the vertical isolation grooves 152 may be the same as the length of the inter-column region, or may be shorter than the length of the inter-column region; and the shape of the vertical isolation grooves 152 is not limited to a rectangle, and may also be set to other strip shapes. According to Figure 7-2 It can be seen that by setting the vertical isolation groove 152, the other areas on the first surface 11 except for the pickup head 2 can be divided into multiple areas, and the bottom surface and side walls of the vertical isolation groove 152 are not on the same plane as the first surface, thereby avoiding the appearance of a wrinkled structure in this area.

[0104] The enclosed isolation grooves enclose a closed area on the first surface, and the closed area includes at least one pickup head; it should be understood that the shape of the closed area enclosed by the enclosed isolation grooves in this embodiment can be flexibly set, and can be a regular shape, such as a circle, an ellipse, a rectangle, etc., or an irregular shape. For example, see Figure 7-3 In the transfer head shown, the pick-up heads 2 are distributed in an array on the first surface 11. Figure 7-3 In the embodiment, a plurality of enclosed isolation grooves 153 are provided, and at least one of the shapes and sizes of the enclosed isolation grooves 153 may be the same or different, and the enclosed isolation grooves 153 do not penetrate the second surface. In this embodiment, the heights of the enclosed isolation grooves 153 may be the same or different. It should be understood that in this embodiment, only one enclosed isolation groove 153 may be provided, or a plurality of enclosed isolation grooves 153 may be provided as required. When a plurality of enclosed isolation grooves 153 are provided, the enclosed isolation grooves 153 may be nested, for example, see Figure 7-4 As shown, the two enclosed isolation grooves 153 are nested to form a "U" shape, or they may not be nested, for example, see Figure 7-3 The three enclosed isolation grooves 153 are shown; of course, the areas enclosed by at least two of the enclosed isolation grooves 153 may also overlap according to the requirements. Figure 7-3 and Figure 7-4 It can be seen that by setting the enclosing isolation groove 153, the other areas on the first surface 11 except for the pickup head 2 can also be isolated into multiple areas, and the bottom surface and side wall of the enclosing isolation groove 153 are not on the same plane as the first surface, thereby avoiding the appearance of a wrinkled structure in this area.

[0105] Of course, it should be understood that the transverse isolation groove 151, the vertical isolation groove 152 and the enclosed isolation groove 153 in the above examples can be provided separately or flexibly combined. The transverse isolation groove 151, the vertical isolation groove 152 and the enclosed isolation groove 153 and the blind holes, protruding units and partition walls shown in the above examples can also be flexibly combined. For example, see Figure 7-5 As shown, a transverse isolation groove 151, a vertical isolation groove 152 and an enclosed isolation groove 153 are provided on the first surface. Figure 7-6 As shown, a transverse isolation groove 151 and a vertical isolation groove 152 are provided on the first surface, and the transverse isolation groove 151 and the vertical isolation groove 152 cross to divide the first surface 11 into a plurality of grids. Figure 7-7 As shown, a vertical isolation groove 152 and a first blind hole 141 are provided on the first surface. Figure 7-9 As shown, a first blind hole 141 and a first protrusion unit 121 are provided on the first surface.

[0106] It should be understood that the several combinations shown in the above examples are merely illustrations for ease of understanding. In this embodiment, the specific combinations of the above-mentioned protruding units, partition walls, blind holes and isolation grooves can be flexibly changed and will not be described one by one here.

[0107] It can be seen that the raised portion and / or recessed portion arranged on the transfer head provided in the present embodiment can utilize the height difference between the raised portion and / or recessed portion arranged on the first surface of the carrier substrate and the first surface of the carrier substrate to divide the other areas on the first surface other than the pickup head from the original one plane into multiple surfaces with different heights (including the surfaces of the raised portion and / or recessed portion themselves), thereby avoiding as much as possible the formation of a wrinkled structure in the area during the curing process of the transfer head, ensuring the quality of the transfer head and the consistency of the pickup head formed on the transfer head, and improving the yield and reliability of the transfer head.

[0108] In some examples of this embodiment, the transfer head may further include a supporting substrate on the second surface of the carrier substrate to enhance the overall strength of the transfer head. The supporting substrate may be, but is not limited to, a quartz substrate, a sapphire substrate, a glass substrate or a metal substrate.

[0109] Yet another optional embodiment:

[0110] This embodiment provides a transfer head mold, which is used to manufacture the transfer head in the above embodiments, and includes:

[0111] A template substrate body, and a transfer head pattern formed on the template substrate body.

[0112] It should be understood that the material of the template substrate body in this embodiment can be flexibly adopted, for example, it can be adopted but not limited to a silicon substrate body, a quartz substrate body, a sapphire substrate body, a glass substrate body, a metal substrate body, etc.

[0113] In this embodiment, the template substrate body has a third surface and a fourth surface relative to each other, and the transfer head pattern formed on the template substrate body includes a plurality of pickup head grooves that are recessed from the third surface to the fourth surface of the template substrate body, and the plurality of pickup head grooves are used to form a plurality of pickup heads. The transfer head pattern also includes a region dividing pattern for forming a region dividing portion, and the region dividing pattern includes at least one of a concave region forming a convex portion and an upper convex region forming a lower concave portion.

[0114] It should be understood that in this embodiment, when the area dividing portion of the transfer head includes a convex portion, the area dividing pattern includes a concave area for forming the convex portion, for example: when the convex portion includes a convex unit, the concave area includes a concave unit for forming each convex unit, and when the convex portion includes a partition wall, the concave area includes an inner groove for forming a corresponding partition wall. Figure 3 The transfer head shown is an example. Figure 3 The partial cross-sectional view shown here corresponds to the partial cross-sectional view of the transfer head mold. Figure 8-1 As shown, the transfer head mold includes a template substrate body 5 , and the transfer head pattern formed on the template substrate body 5 includes a pickup head groove 51 and a concave area unit 52 for forming a first protrusion unit 121 corresponding to the first protrusion unit 121 .

[0115] It should be understood that in this embodiment, when the area dividing portion of the transfer head includes a concave portion, the area dividing pattern includes an upper convex area for forming the concave portion. For example, when the concave portion includes a blind hole, the upper convex area includes an upper convex area unit for forming each blind hole. When the concave portion includes an isolation groove, the upper convex area includes an isolation protrusion for forming a corresponding isolation groove. Figure 6-4 The transfer head shown is an example. Figure 6-4 The partial cross-sectional view shown here corresponds to the partial cross-sectional view of the transfer head mold. Figure 8-2 As shown, the transfer head mold includes a template substrate body 5 , and the transfer head pattern formed on the template substrate body 5 includes a pickup head groove 51 and an upper convex area unit 53 for forming a second blind hole 142 corresponding to the second blind hole 142 .

[0116] The transfer head patterns corresponding to other transfer head structures may be arranged in a manner similar to that shown in the above examples, and will not be described in detail here.

[0117] This embodiment also provides a method for making a transfer head, see Figure 8-3 As shown, it includes but is not limited to:

[0118] S801: Make a transfer head mold.

[0119] The transfer head pattern formed on the main body of the template substrate may be formed by, but not limited to, etching.

[0120] S802: Filling the transfer head pattern with a preset material.

[0121] It should be understood that the materials of the pick-up head and the carrier substrate in this embodiment can be flexibly set, and the two can be the same or different. In some application examples, the pick-up head and the carrier substrate are made of the same material, and the two can be integrally formed. In this embodiment, the pick-up head can be formed by but not limited to direct contact with the chip to form adhesion, and the chip to be transferred from the temporary substrate or the growth substrate is separated from the temporary substrate or the growth substrate by adhesion, and transferred to the display backplane or other circuit board. At this time, the selection of the preset material can meet the adhesion between the pick-up head and the chip to be transferred, which is greater than the bonding force between the chip to be transferred and the temporary substrate or the growth substrate to realize the pickup of the chip, and is less than the bonding force between the chip to be transferred and the display backplane or other circuit board after the chip to be transferred is transferred to the display backplane or other circuit board and the bonding is completed, so as to complete the release of the chip to be transferred. For example, in an example, the preset material can include but is not limited to PDMS, and of course it can also be replaced with other materials that meet the above conditions.

[0122] In some examples of this embodiment, in order to improve the yield rate of the pickup head, before filling the preset material on the transfer head pattern, a release agent layer may be formed on the transfer head pattern to facilitate the demolding process after curing, that is, to facilitate the separation of the template substrate and the transfer head.

[0123] S803: performing a curing process on the preset material.

[0124] In some examples of this embodiment, the PDMS material can be selected from UV-curable silicone materials; the thermal curing shrinkage of UV-curable silicone materials is low, and the array structure after actual curing is best matched with the actual design, which can further improve the yield rate of the pickup head. At this time, the curing process can be UV curing. Of course, thermal curing silicone materials can also be used.

[0125] S804: removing the transfer head mold to obtain the transfer head.

[0126] In some examples of the present embodiment, in order to improve the yield rate of the pickup head, before the pickup head layer is filled in the groove to form the pickup head, a release agent layer can be formed on at least one of the third top surface, the side wall of the groove, and the bottom of the groove, so as to facilitate the demolding process after the pickup head layer and the carrier substrate layer are cured, that is, to facilitate the separation of the template substrate, the pickup head and the carrier substrate.

[0127] For ease of understanding, the following Figure 8-1 and Figure 8-2 The process of making a transfer head by using the transfer head mold shown is described as an example.

[0128] Production Example 1:

[0129] See also Figure 9-1 to Figure 9-2 As shown, through Figure 8-1 The process of making the transfer head by the transfer head mold shown includes but is not limited to:

[0130] S901: After cleaning the template substrate body, a transfer head pattern is formed on the template substrate body.

[0131] See for example Figure 9-2 As shown, the template substrate body 5 is a silicon substrate, and a deep silicon etching template substrate is prepared, and a specific transfer head pattern is presented on the template substrate body 5. In this example, the transfer head pattern can be made on the template substrate body 5 according to the chip size to be transferred.

[0132] S902: Setting a preset material on the transfer head pattern.

[0133] See also Figure 9-2 As shown, the preset material 6 can be formed on the transfer head pattern by, but not limited to, molding, spraying, spin coating, etc. In this example, the preset material 6 uses PDMS material, which can be used to bond the chip, and has stronger viscosity than the bonding adhesive on the temporary substrate, but weaker than the welding force of the metal solder after welding, and the PDMS material in this embodiment can be selected from UV-curable silicone material; the thermal curing shrinkage rate of UV-curable silicone material is low, and the array structure after actual curing is best matched with the actual design, which can further improve the yield rate of the pickup head.

[0134] Optionally, in this embodiment, before filling the PDMS material on the transfer head pattern, a release agent layer may be formed on the transfer head pattern.

[0135] S903: After the support substrate is pressed onto the preset material layer, a curing process is performed.

[0136] See also Figure 9-2 As shown, a corresponding supporting substrate 7 is pressed onto the preset material 6 .

[0137] S904: Remove the main body of the template substrate to obtain Figure 3 Transfer head shown.

[0138] Production Example 2:

[0139] See also Figure 10-1 to Figure 10-2 As shown, through Figure 8-2 The process of making the transfer head by the transfer head mold shown includes but is not limited to:

[0140] S1001: After cleaning the template substrate body, a transfer head pattern is formed on the template substrate body.

[0141] See for example Figure 10-2 As shown, the template substrate body 5 is a silicon substrate, and a deep silicon etching template substrate is prepared to present a specific transfer head pattern on the template substrate body 5 .

[0142] S1002: Setting a preset material on the transfer head pattern.

[0143] See also Figure 10-2 As shown, the preset material 6 can be formed on the transfer head pattern by, but not limited to, molding, spraying, spin coating, etc. In this example, the preset material 6 is PDMS material, and the PDMS material can be a UV curable silicone material.

[0144] Optionally, in this embodiment, before filling the PDMS material on the transfer head pattern, a release agent layer may be formed on the transfer head pattern.

[0145] S1003: After the support substrate is pressed onto the preset material layer, a curing process is performed.

[0146] See also Figure 10-2 As shown, a corresponding supporting substrate 7 is pressed onto the preset material 6 .

[0147] S1004: Remove the main body of the template substrate to obtain Figure 8-2 Transfer head shown.

[0148] Yet another optional embodiment:

[0149] This embodiment also provides a display screen, including a frame and a display panel; the display panel is fixed on the frame; the display panel includes a display backplane, and a plurality of micro-light-emitting chips arranged on the display backplane, wherein the plurality of micro-light-emitting chips are transferred to the display backplane through the transfer head in the above embodiments, so that the micro-light-emitting chips on the display backplane have better consistency after bonding, thereby improving the display effect of the display screen. The display screen can be applied to, but not limited to, various intelligent mobile terminals, vehicle-mounted terminals, PCs, monitors, electronic billboards, etc.

[0150] This embodiment also provides a spliced ​​display screen, including a spliced ​​display screen that can be formed by splicing at least two display screens as shown above. Since the micro-light-emitting chips of the display screens have better consistency after bonding, the consistency of the micro-light-emitting chips between the spliced ​​display screens after bonding can be further ensured, thereby improving the visual effect.

[0151] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A transfer head, characterized in that: include: A carrier substrate having a first surface and a second surface opposite to each other; A plurality of pickup heads formed on the first surface, the pickup heads being used to pick up chips; an area dividing portion formed on the first surface, the area dividing portion being located in the surrounding area of ​​the pickup head, the area dividing portion being integrally formed with the carrier substrate, the area dividing portion comprising at least one of a protruding portion protruding from the first surface and a concave portion concave from the first surface to the second surface, the protruding portion and / or the concave portion dividing the area dividing portion into a plurality of surfaces with different heights; wherein a first distance between an end of the pickup head away from the first surface and the second surface is greater than a second distance between an end of the protruding portion away from the first surface and the second surface.

2. The transfer head according to claim 1, characterized in that: The area dividing portion includes the convex portion, and the convex portion includes at least one of the following: A plurality of protrusion units formed on the first surface, wherein the plurality of protrusion units are dispersedly distributed on the first surface; Partition walls are formed on the first surface.

3. The transfer head according to claim 2, characterized in that: The plurality of pickup heads are distributed in an array on the first surface, the area dividing portion includes the plurality of protrusion units, and the plurality of protrusion units include at least one of the following: a first protruding unit formed between adjacent pickup heads of at least one row of the pickup heads; A second protruding unit formed between adjacent pickup heads of at least one column of the pickup heads; A third protrusion unit is formed by an overlapping area between the inter-row area between two adjacent rows of pickup heads and the inter-column area between two adjacent columns of pickup heads.

4. The transfer head according to claim 2, characterized in that: The plurality of pickup heads are distributed in an array on the first surface, the protrusion includes the partition wall, and the partition wall includes at least one of the following: A wall enclosing a closed area on the first surface, wherein the closed area includes at least one of the pickup heads; a transverse partition wall formed in an inter-row region between two adjacent rows on the first surface; A vertical partition wall is formed in an inter-column region between two adjacent columns on the first surface.

5. The transfer head according to any one of claims 1 to 4, characterized in that: The area dividing portion includes the concave portion, and the concave portion includes at least one of the following: A plurality of blind holes formed on the first surface, wherein the plurality of blind holes are dispersedly distributed on the first surface; An isolation groove is formed on the first surface.

6. The transfer head according to claim 5, characterized in that: The plurality of pickup heads are distributed in an array on the first surface, the concave portion includes the isolation groove, and the isolation groove includes at least one of the following: An enclosed isolation groove enclosing a closed area on the first surface, wherein the closed area includes at least one of the pickup heads; a transverse isolation groove formed in an inter-row region between two adjacent rows on the first surface; A vertical isolation groove is formed in an inter-column region between two adjacent columns on the first surface.

7. The transfer head according to claim 5, characterized in that: The plurality of pickup heads are distributed in an array on the first surface, the area dividing portion includes the plurality of blind holes, and the plurality of blind holes include at least one of the following: a first blind hole formed between adjacent pickup heads of at least one row of pickup heads; a second blind hole formed between adjacent pickup heads of at least one column of the pickup heads; A third blind hole is formed in an overlapping area between the inter-row area between two adjacent rows of pickup heads and the inter-column area between two adjacent columns of pickup heads.

8. The transfer head according to any one of claims 1 to 4, characterized in that: The transfer head further includes a supporting substrate pressed on the second surface of the carrying substrate.

9. A transfer head mold, used for making the transfer head according to any one of claims 1 to 8, characterized in that: include: Template substrate body; A transfer head pattern is formed on the template substrate body, the transfer head pattern includes a plurality of pickup head grooves for forming the plurality of pickup heads, and a region dividing pattern for forming the region dividing portion, the region dividing pattern is located in the surrounding area of ​​the pickup head grooves, the region dividing pattern includes at least one of an inner concave area for forming the raised portion and an upper convex area for forming the lower concave portion, so that the region dividing pattern has multiple surfaces with different heights.

10. A method for manufacturing a transfer head according to any one of claims 1 to 8, characterized in that: include: Making the transfer head mold as claimed in claim 9; Filling a preset material on the transfer head pattern; Performing a curing process on the preset material; The transfer head mold is removed to obtain the transfer head.

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