Film pressing structure, film pressing system and film pressing method

Abstract

The present application relates to the field of semiconductor technology, and specifically discloses a film pressing structure, a film pressing system, and a film pressing method. The structure includes a shell, a carrier, a flexible part, a gas pipeline, and a controller. The shell has a first chamber and a second chamber inside; the carrier is arranged in the first chamber; the flexible part is connected to the second chamber, and together with the second chamber, it forms a closed space, and the flexible part is suitable for being subjected to the pressure in the closed space and expanding toward the carrier; the gas pipeline is connected to the closed space; the controller is used to control the pressure in the closed space at least twice in a single film pressing process, and the single cycle control includes controlling the gas to pressurize the closed space through the gas pipeline, maintaining a constant pressure for a preset time, and then reducing the pressure. The above-mentioned multi-stage pressurized film pressing method can pressurize the film to be pressed and the substrate multiple times, which can effectively improve the pressing effect, especially has a good filling effect on holes with high aspect ratios, thereby improving product performance and reliability.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a lamination structure, a lamination system, and a lamination method. Background Art

[0002] The trend toward miniaturization of electronic devices is placing increasing demands on manufacturing processes. Advanced packaging has significant potential for further development, with the goal of increasing chip density, reducing overall footprint, and boosting bandwidth and connection speed. Vacuum laminators are used in popular advanced packaging processes such as 3DIC packaging, HBM, and FOWLP.

[0003] The vacuum lamination process refers to laminating the film onto the substrate. Figure 3 The conventional method is single-stage pressurization lamination, which involves applying pressure to node P1, maintaining that pressure for time t1, and then releasing the pressure to node P2. However, many substrates have fine concave and convex structures, such as high-aspect-ratio TSV holes and high-density Cu pillar bumps. This single-stage pressurization lamination method cannot achieve satisfactory filling results for high-aspect-ratio holes. Summary of the Invention

[0004] Based on this, it is necessary to provide a film pressing structure, a film pressing system and a film pressing method to address the above problems.

[0005] According to a first aspect of an embodiment of the present application, a laminated film structure is provided, comprising:

[0006] a housing having a first chamber and a second chamber therein;

[0007] a carrier, disposed in the first chamber;

[0008] a flexible member connected to the second chamber and enclosing a closed space with the second chamber, wherein the flexible member is adapted to expand toward the carrier under pressure in the closed space;

[0009] a gas pipeline connected to the enclosed space;

[0010] The controller is electrically connected to the gas pipeline and is used to perform at least two cycles of pressure control on the confined space during a film pressing process. The single cycle control includes controlling the gas to pressurize the confined space through the gas pipeline, maintaining a constant pressure for a preset time, and then reducing the pressure.

[0011] In one embodiment, the pressure value achieved by pressurization in each cycle control is the same or different.

[0012] In one embodiment, in each cycle control, the pressure value reached by the pressure reduction is the same or different.

[0013] In one embodiment, in each cycle control, the pressure value reached by the pressure reduction is greater than 0, equal to 0, or less than 0.

[0014] In one embodiment, the gas pipeline includes an air intake pipeline, an exhaust pipeline and a vacuum pipeline;

[0015] When the enclosed space is pressurized, the controller controls the air intake pipe to open, and gas enters the enclosed space through the air intake pipe;

[0016] When the pressure of the enclosed space is reduced, the controller controls the exhaust pipeline to open, and the gas in the enclosed space is discharged through the exhaust pipeline; or controls the vacuum pipeline to open, and the gas in the enclosed space is discharged through the vacuum pipeline.

[0017] In one embodiment, the air intake pipeline and the exhaust pipeline are combined into one air intake and exhaust pipeline, and the air intake and exhaust pipeline includes an air intake end, an exhaust valve, and a first switch valve, and the first switch valve is connected to the enclosed space via a pipeline;

[0018] The exhaust valve comprises a first end, a second end and a third end, the first end being connected to the air inlet end, the second end being connected to the first switch valve, and the third end being an exhaust end;

[0019] When gas enters the first end from the air inlet end, the gas enters the second end from the first end through the inside of the exhaust valve; when gas in the enclosed space enters the second end through the first switch valve, the gas enters the third end from the second end through the inside of the exhaust valve to be discharged.

[0020] In one embodiment, an electro-pneumatic proportional valve is further provided between the air inlet end and the exhaust valve.

[0021] In one embodiment, the vacuum pumping pipeline includes an air extraction end and a second switch valve, and the second switch valve is connected to the enclosed space through the pipeline.

[0022] In one embodiment, the vacuum pumping line further includes a third switch valve, one end of the third switch valve is connected to the vacuum end, and the other end is connected to the first chamber.

[0023] In one embodiment, the flexible member is connected to the bottom of the second chamber.

[0024] In one embodiment, the central axis of the flexible member is perpendicular to the supporting surface of the platform.

[0025] In one embodiment, the carrier is an adsorption platform.

[0026] According to a second aspect of an embodiment of the present application, a film pressing system is provided, comprising:

[0027] The pressed film structure as described above;

[0028] The film to be pressed is arranged between the first chamber and the second chamber;

[0029] A substrate is disposed on the carrier;

[0030] When the flexible member is subjected to the pressure in the enclosed space, it expands toward the carrier to squeeze the film to be laminated and the substrate.

[0031] According to a third aspect of an embodiment of the present application, a lamination method is provided, which is applied to the lamination structure described above, and the method includes:

[0032] Placing the substrate on the carrying surface of the carrier, and laying the film to be laminated between the first chamber and the second chamber;

[0033] evacuating the enclosed space formed by the flexible member and the second chamber, and the first chamber;

[0034] By controlling the flow direction of gas in the gas pipeline, the pressure in the confined space is controlled in at least two cycles; wherein, the single cycle control includes: controlling the gas to pressurize the confined space through the gas pipeline so that the flexible part expands toward the carrier, squeezing the film to be pressed and the substrate, and then reducing the pressure after maintaining a constant pressure for a preset time.

[0035] The above-mentioned film pressing structure, film pressing system and film pressing method, during a film pressing process, the controller performs at least two cycle controls on the pressure in the enclosed space formed by the flexible part and the second chamber. The single cycle control includes controlling the gas to pressurize the enclosed space through the gas pipeline, and then reducing the pressure of the enclosed space after maintaining a constant pressure for a preset time. When the enclosed space is pressurized, the flexible part is forced to expand toward the carrier, and then the film to be pressed between the first chamber and the second chamber can be squeezed onto the substrate on the carrier, and the squeezed state is maintained for a preset time before the pressure is reduced. When the pressure is reduced to a certain pressure value, the above-mentioned pressurization, constant pressure and pressure reduction process is recycled. In this way, the film to be pressed and the substrate can be pressed multiple times, which can effectively improve the pressing effect, especially for substrates with high aspect ratio hole structures. The above-mentioned multi-stage pressurization and film pressing method can have a good filling effect on high aspect ratio holes, thereby improving product performance and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic structural diagram of a film pressing structure provided in one embodiment of the present application;

[0037] Figure 2A schematic diagram of a flexible member in a laminated film structure according to an embodiment of the present application;

[0038] Figure 3 This is a diagram showing the relationship between time and pressure corresponding to single-end pressurized lamination in traditional technology;

[0039] Figure 4-6 1 is a diagram showing several exemplary relationships between time and pressure corresponding to the pressure cycle control method in this embodiment;

[0040] Figure 7 A schematic structural diagram of a film pressing structure provided in another embodiment of the present application;

[0041] Figure 8 This is a flow chart of a lamination method provided in one embodiment of the present application.

[0042] Description of reference numerals:

[0043] 110, first housing; 111, first chamber; 120, second housing; 121, second chamber; 130, sealing ring; 140, film to be pressed;

[0044] 200, stage; 210, substrate; 220, transmission mechanism;

[0045] 300, flexible parts; 310, confined space;

[0046] 410. Inlet and exhaust pipelines; 411. Inlet end; 412. Exhaust valve; a. First end; b. Second end; c. Third end; 413. First switch valve; 414. Electro-pneumatic proportional valve; 420. Vacuum pipeline; 421. Exhaust end; 422. Second switch valve; 430. Pressure gauge. DETAILED DESCRIPTION

[0047] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the accompanying drawings. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0048] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, or indirect connection through an intermediate medium; internal communication between two components, or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0049] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0050] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0051] As mentioned in the background, laminators are currently used in various advanced packaging processes. Lamination involves pressing a thin film onto a substrate. The conventional method involves a single-stage pressurization process, where pressure is applied to node P1, maintained at that pressure for a time period t1, and then released to node P2. However, many substrates have finely contoured structures, such as high-aspect-ratio TSVs and high-density Cu pillar bumps. This single-stage pressurization process cannot achieve the desired filling results for these high-aspect-ratio holes.

[0052] To solve the above problems, embodiments of the present application provide a film pressing structure, a film pressing system and a film pressing method.

[0053] Reference Figures 1-2 In one embodiment, a film pressing structure is provided, comprising a housing, a carrier 200, a flexible member 300, a gas pipeline, and a controller. The housing comprises a first chamber 111 and a second chamber 121; the carrier 200 is disposed in the first chamber 111; the flexible member 300 is connected to the second chamber 121 and together with the second chamber 121 forms a closed space 310, wherein the flexible member 300 is adapted to expand toward the carrier 200 due to the pressure in the closed space 310; the gas pipeline is connected to the closed space 310; and the controller is electrically connected to the gas pipeline and is configured to perform at least two cycles of pressure control in the closed space 310 during a single film pressing process. A single cycle of control comprises controlling the gas to pressurize the closed space 310 through the gas pipeline, maintaining a constant pressure for a preset period of time, and then reducing the pressure.

[0054] In the above-mentioned film pressing structure, during a film pressing process, the controller performs at least two cycles of controlling the pressure in the enclosed space 310 formed by the flexible member 300 and the second chamber 121. The single cycle control includes controlling the gas to pressurize the enclosed space 310 through the gas pipeline, and then reducing the pressure of the enclosed space 310 after maintaining a constant pressure for a preset time. When the enclosed space 310 is pressurized, the flexible member 300 is forced to expand toward the carrier 200, thereby separating the first chamber 111 and the second chamber 1 21, the film to be pressed 140 is squeezed onto the substrate 210 on the carrier 200, and the extrusion state is maintained for a preset period of time before the pressure is reduced. When the pressure is reduced to a certain pressure value, the above-mentioned process of pressurization, constant pressure, and pressure reduction is recycled. In this way, the film to be pressed 140 and the substrate 210 can be pressed multiple times, which can effectively improve the pressing effect, especially for the substrate 210 with a high aspect ratio hole structure. The above-mentioned multi-stage pressurization and film pressing method can have a good filling effect on the high aspect ratio holes, thereby improving the product performance and reliability.

[0055] Specifically, refer to Figure 1 The housing may include a first housing 110 and a second housing 120. The first housing 110 has a first chamber 111, and the second housing 120 has a second chamber 121. The first housing 110 and the second housing 120 each have an opening, and the openings are joined to form a closed inner cavity of the housing. To ensure the sealing of the inner cavity, a sealing ring 130 may be provided at the junction of the first housing 110 and the second housing 120.

[0056] The carrier 200 is arranged in the first chamber 111, and its bearing surface is used to carry the substrate 210 to be pressed. The carrier 200 can be an adsorption platform, such as a vacuum adsorption platform or an electrostatic adsorption platform. Taking the vacuum adsorption platform as an example, the substrate 210 can be adsorbed on the vacuum adsorption platform under the action of negative pressure, and is not prone to deviation, thereby ensuring that the substrate 210 and the film to be pressed 140 can be aligned and pressed during the pressing process. The film to be pressed 140 can be arranged between the first chamber 111 and the second chamber 121. When the flexible member 300 is forced to expand toward the carrier 200, the flexible member 300 can squeeze the film to be pressed 140 between the first chamber 111 and the second chamber 121 toward the carrier 200, thereby pressing the film to be pressed 140 and the substrate 210 on the carrier 200 together.

[0057] In this embodiment, the stage 200 can also be connected to a transmission mechanism 220, which can drive the stage 200 to rise or fall to adjust the vertical height of the stage 200 and further adjust the position of the substrate 210 on the stage 200. In addition, the stage 200 also has a heating function.

[0058] In this embodiment, the flexible member 300 can be connected to the bottom of the second chamber 121. When the first housing 110 and the second housing 120 are combined, the flexible member 300 can be located near the first chamber 111 to maintain a small distance from the carrier 200 in the first chamber 111. This ensures that when the flexible member 300 expands, it can apply pressure to the substrate 210 on the carrier 200. Figure 2 The figure shows the installation position of the flexible member 300 and the schematic diagram of the flexible member 300 being expanded under force after gas is introduced into the closed space 310.

[0059] In one embodiment, the central axis of the flexible member 300 is perpendicular to the supporting surface of the carrier 200. Specifically, the outer edge of the flexible member 300 can be horizontally connected to the bottom of the second chamber 121. Therefore, when gas is injected into the enclosed space 310, the expanded flexible member 300 can apply pressure perpendicular to the supporting surface to the carrier 200, thereby facilitating the lamination of the film 140 to the substrate 210.

[0060] Of course, the flexible member 300 can also be connected to other positions in the second chamber 121. For example, the outer edge of the flexible member 300 is connected to the side wall of the second chamber 121 at an angle, or the outer edge of the flexible member 300 is connected to the side wall of the second chamber 121 in a vertical direction, etc. As long as the flexible member 300 that is expanded under force can apply pressure to the substrate 210 in the first chamber 111, the present application does not impose an absolute restriction on the setting position of the flexible member 300.

[0061] In this embodiment, a heating component is further provided in the enclosed space 310 . The heating component is provided close to the flexible member 300 , and can be provided above the flexible member 300 .

[0062] In this embodiment, the flexible member 300 may include an airbag, and the material of the airbag may include soft silicone or other materials that can expand under force.

[0063] During the lamination process, the controller can control the flow direction of the gas in the gas pipeline, and thus control the pressure in the confined space 310. The greater the pressure in the confined space 310, the greater the force on the flexible part 300, and the greater the pressing force on the film to be laminated 140 and the substrate 210. Conversely, the smaller the pressure in the confined space 310, the smaller the force on the flexible part 300, and the smaller the pressing force on the film to be laminated 140 and the substrate 210.

[0064] In this embodiment, during one lamination process, the pressure in the enclosed space 310 can be cyclically controlled at least twice. Each cyclic control process includes pressurizing the enclosed space 310; maintaining a constant pressure state in the enclosed space 310 for a preset time period; and reducing the pressure in the enclosed space 310. The above process is, that is, controlling the flexible member 300 to expand and apply pressure to the film to be laminated 140 and the substrate 210; when the flexible member 300 expands to a certain extent, maintaining the current expansion state unchanged, that is, maintaining the flexible member 300 in a constant pressure state on the film to be laminated 140 and the substrate 210 for a preset time period; and controlling the flexible member 300 to contract and reduce the pressure on the film to be laminated 140 and the substrate 210. When a single cycle ends, a new pressure cycle begins. This means that after reducing the pressure on the film 140 and substrate 210 to be laminated, the enclosed space 310 is pressurized again, causing the flexible member 300 to expand and apply pressure to the film 140 and substrate 210. This constant pressure is maintained for a predetermined period of time before the pressure is reduced. This allows the film 140 and substrate 210 to be laminated to be laminated repeatedly during a single lamination process, effectively filling holes with high aspect ratios.

[0065] The pressure of each control node in each loop control can be flexibly set.

[0066] In one embodiment, the pressure value achieved during each cycle of pressurization is the same or different. For example, during each cycle of pressurization, the pressure value achieved can remain consistent, gradually increase or decrease, increase first and then decrease, decrease first and then increase, or vary randomly. In this embodiment, there is no specific limitation on the pressure value achieved during each pressurization, and the pressure value can be determined based on actual needs.

[0067] In one embodiment, the pressure values ​​achieved during each cycle of pressure reduction are the same or different. That is, during each cycle of pressure reduction, the pressure values ​​achieved can remain consistent, for example, all at the same pressure value greater than 0, or all at zero pressure, or all at a pressure value less than 0 (i.e., a vacuum state); the pressure values ​​achieved during each cycle of pressure reduction can also be different, for example, at different pressure values ​​greater than 0, or at some pressure values ​​greater than 0, some at zero pressure, or some at less than 0. Similarly, in this embodiment, there is no specific limitation on the pressure value achieved during each pressure reduction, and it can be determined based on actual needs.

[0068] In one embodiment, during each cycle of control, the pressure value reached by the depressurization is greater than 0, equal to 0, or less than 0. That is, during the depressurization process, the pressure in the enclosed space can be reduced to a certain pressure value greater than 0, or to zero pressure. After the pressure is reduced to zero pressure, the enclosed space can be evacuated to achieve a vacuum state.

[0069] The following are three examples of loop control: Figures 4-6 The figure shows the relationship between time and pressure for each example.

[0070] Reference Figure 4 In each cycle control, the pressure value achieved during pressurization is the same, and the pressure value achieved during depressurization is also the same. That is, during each cycle control process, the pressure applied by the flexible member 300 to the film to be laminated 140 and the substrate 210 is the same, and the pressure value achieved during depressurization is always less than 0.

[0071] Reference Figure 5 In each cycle control, the pressure value reached by pressurization is the same, but the pressure value reached by depressurization is not the same. In the first two cycle controls, the pressure value reached by depressurization is 0, and in the last cycle control, the pressure value reached by depressurization is less than 0.

[0072] Reference Figure 6 In each cycle, the pressure value achieved by pressurization gradually increases, while the pressure value achieved by depressurization is not always the same. Specifically, in each cycle, the pressure value achieved by pressurization gradually increases, meaning that the flexible member 300 compresses the film 140 to be laminated and the substrate 210 with increasing pressure. In the first two cycles, the pressure value achieved by depressurization is zero, and in the final cycle, the pressure value achieved by depressurization is less than zero.

[0073] Figure 3 This is the relationship between time and pressure for the single-stage pressurized lamination method in traditional technology. Figure 3 In the traditional technology, when the pressure is increased to the pressure value P1, the pressure value P1 is maintained for a preset time t1, and then the pressure is reduced and the vacuum is exhausted to reach the vacuum value P2, and the film pressing process is completed.

[0074] In one embodiment, the gas pipeline includes an air intake pipeline, an exhaust pipeline, and a vacuum pipeline 420. The air intake pipeline is used to introduce gas into the enclosed space 310, the exhaust pipeline is used to discharge the gas in the enclosed space 310 to the outside, and the vacuum pipeline 420 is used to vacuum the enclosed space 310.

[0075] In this embodiment, when pressurizing the enclosed space 310, the controller controls the air intake line to open, allowing gas to enter the enclosed space 310 through the air intake line. When depressurizing the enclosed space 310, the controller controls the air exhaust line to open, allowing gas in the enclosed space 310 to be discharged through the exhaust line; or controls the vacuum line 420 to open, allowing gas in the enclosed space 310 to be discharged through the vacuum line 420. At the depressurization node, only the exhaust line may be controlled to open, allowing gas in the enclosed space 310 to be discharged through the exhaust line, reducing the pressure in the enclosed space 310 to zero. Alternatively, the exhaust line may be controlled to open first, allowing gas in the enclosed space 310 to be discharged through the exhaust line, reducing the pressure in the enclosed space 310 to zero, and then the vacuum line 420 may be opened to evacuate the enclosed space 310, bringing the enclosed space 310 to a vacuum state.

[0076] Reference Figure 7 In one embodiment, the intake and exhaust lines are combined into a single intake and exhaust line 410, which includes an intake port 411, an exhaust valve 412, and a first on / off valve 413. The first on / off valve 413 is connected to the enclosed space 310 via a pipeline. The exhaust valve 412 includes a first end a, a second end b, and a third end c. The first end a is connected to the intake port 411, the second end b is connected to the first on / off valve 413, and the third end c serves as the exhaust port. When gas enters the first end a from the intake port 411, it flows from the first end a through the interior of the exhaust valve 412 into the second end b. When gas within the enclosed space 310 flows through the first on / off valve 413 into the second end b, it flows from the second end b through the interior of the exhaust valve 412 into the third end c for discharge.

[0077] Specifically, the exhaust valve 412 is a three-way valve connected between the air inlet end 411 and the first on-off valve 413. During both the pressurization and depressurization processes, the first on-off valve 413 is open. During the pressurization process, gas enters the air inlet end 411, and the gas within the exhaust valve 412 flows from the first end a to the second end b. That is, the gas is transferred from the first end a to the second end b of the exhaust valve 412, and from the second end b to the first on-off valve 413, and then into the enclosed space 310. During the depressurization process, the gas within the enclosed space 310 is transferred through the first on-off valve 413 to the second end b of the exhaust valve 412. At this time, the gas within the exhaust valve 412 flows from the second end b to the third end c. That is, the gas is transferred from the second end b to the third end c and discharged through the third end c.

[0078] By setting the exhaust valve 412, the exhaust and pressure reduction can be achieved quickly at the pressure reduction node, and the rapid switching of the charging and discharging process can be achieved, which effectively shortens the oscillation time of the pressure at the pressurization node.

[0079] In one embodiment, an electro-pneumatic proportional valve 414 is further provided between the air inlet 411 and the exhaust valve 412. The electro-pneumatic proportional valve 414 can be used to set the pressurization pressure value, thereby accurately controlling the air intake volume.

[0080] In one embodiment, the vacuum line 420 includes an exhaust port 421 and a second on-off valve 422. The second on-off valve 422 is connected to the enclosed space 310 via the line. When the enclosed space 310 needs to be vacuumed, the second on-off valve 422 is opened, and the exhaust port 421 extracts the gas in the enclosed space 310 through the line.

[0081] In one embodiment, the vacuum line 420 further includes a third on-off valve, one end of which is connected to the air extraction port 421 and the other end of which is connected to the first chamber 111. Specifically, the vacuum line 420 can also evacuate the first chamber 111, and this evacuation can be independently controlled by the third on-off valve. Prior to lamination, the third on-off valve can be opened to evacuate the first chamber 111 to prevent the presence of gas in the first chamber 111 from causing bubbles in the film formed after lamination of the substrate 210 and the film to be laminated 140. Because the third on-off valve and the second on-off valve 422 can be independently controlled, the evacuation process of the first chamber 111 can be performed independently of the evacuation process of the enclosed space 310.

[0082] It should be noted that the air extraction end connected to the second switch valve 422 and the air extraction end connected to the third switch valve can be the same or two independently set ends. In practical applications, there is no absolute limitation on this.

[0083] In addition, refer to Figure 7 In this embodiment, a pressure gauge 430 is further provided on the gas pipeline, through which the current pressure in the pipeline can be known in real time.

[0084] In one embodiment, a lamination system is also provided, referring to Figure 7 , comprising a film to be laminated 140, a substrate 210, and the lamination structure described above, wherein the film to be laminated 140 is disposed between the first chamber 111 and the second chamber 121, and the substrate 210 is disposed on the carrier 200. When subjected to pressure within the enclosed space 310, the flexible member 300 expands toward the carrier 200 to compress the film to be laminated 140 and the substrate 210.

[0085] In the laminating system provided in this embodiment, during a laminating process, the controller performs at least two cyclic controls on the pressure in the enclosed space 310 formed by the flexible member 300 and the second chamber 121. The single cyclic control includes controlling the gas to pressurize the enclosed space 310 through the gas pipeline, and then reducing the pressure of the enclosed space 310 after maintaining a constant pressure for a preset time. When the enclosed space 310 is pressurized, the flexible member 300 is forced to expand toward the carrier 200, thereby separating the first chamber 111 from the second chamber 121. The film 140 to be pressed between the chambers 121 is squeezed onto the substrate 210 on the carrier 200, and the squeezed state is maintained for a preset period of time before the pressure is reduced. When the pressure is reduced to a certain value, the above-mentioned process of pressurization, constant pressure, and pressure reduction is recycled. In this way, the film 140 to be pressed and the substrate 210 can be pressed multiple times, which can effectively improve the pressing effect, especially for the substrate 210 with a high aspect ratio hole structure. The above-mentioned multi-stage pressurization and film pressing method can have a good filling effect on the high aspect ratio holes, thereby improving product performance and reliability.

[0086] In this embodiment, the film to be pressed 140 can be guided and laid between the first chamber 111 and the second chamber 121, and the substrate 210 is placed on the carrier 200 in the first chamber 111. When the flexible part 300 in the second chamber 121 is subjected to the pressure in the closed space 310, the flexible part 300 expands toward the first chamber 111, and then squeezes the film to be pressed 140 toward the carrier 200, so that the film to be pressed 140 and the substrate 210 on the carrier 200 are pressed to form a film material.

[0087] The film to be laminated 140 includes a dry film, which may be a mold sheet, PI photosensitive adhesive, or other dry film materials. The substrate 210 may include, but is not limited to, any one of pure silicon wafer, glass, PCB board, sapphire substrate, SiN, SiC, and GaAs.

[0088] The film pressing system provided in this embodiment and the film pressing structure provided in the previous embodiment belong to the same inventive concept. For the specific content of the film pressing structure, please refer to the specific description of the film pressing structure provided in the previous embodiment, which will not be repeated here.

[0089] In one embodiment, a lamination method is also provided, which is applied to the lamination structure described above. Figure 8 The lamination method provided in this embodiment includes the following steps:

[0090] Step S200 : placing the substrate 210 on the supporting surface of the carrier 200 , and laying the film 140 to be laminated between the first chamber 111 and the second chamber 121 .

[0091] First, the substrate 210 is placed on the supporting surface of the carrier 200. The carrier 200 can be a vacuum adsorption platform, that is, the substrate 210 can be vacuum-adsorbed on the carrier 200. After the substrate 210 is placed, the transmission mechanism 220 of the carrier 200 can be controlled to drive the carrier 200 to a certain height, and then the film 140 to be laminated is laid on the upper surface of the first chamber 111. The second shell 120 is then combined with the first shell 110, that is, the first chamber 111 and the second chamber 121 are combined into the inner cavity of the shell. At this time, the film 140 to be laminated is located between the first chamber 111 and the second chamber 121.

[0092] In step S400 , the enclosed space 310 formed by the flexible member 300 and the second chamber 121 and the first chamber 111 are evacuated.

[0093] After placing the substrate 210 and the film to be pressed 140, the vacuum line 420 in the gas pipeline can be controlled to open to vacuum the enclosed space 310 and the first chamber 111 to form a vacuum environment, so that the subsequent pressing process can be carried out in the vacuum environment, thereby avoiding the generation of bubbles in the film material formed after pressing.

[0094] Step S600: By controlling the flow direction of gas in the gas pipeline, the pressure in the confined space 310 is controlled in a cycle for at least two times; wherein, the single cycle control includes: controlling the gas to pressurize the confined space 310 through the gas pipeline, so that the flexible part 300 expands toward the carrier 200, squeezing the film 140 to be pressed and the substrate 210, and then reducing the pressure after maintaining a constant pressure for a preset time.

[0095] After the vacuum environment is formed, the transmission mechanism 220 of the carrier 200 can be controlled to drive the carrier 200 to rise to a position close to the upper surface of the first chamber 111. This allows the flexible member 300 to more easily press the film 140 to be laminated onto the substrate 210 during the subsequent lamination process. The distance between the carrier 200 and the upper surface of the first chamber 111 after the rise can be between 0 and 10 mm.

[0096] After adjusting the position of the carrier 200, the gas flow direction in the gas pipeline can be controlled, and the pressure in the enclosed space 310 can be cyclically controlled at least twice. For details about the cyclic control, please refer to the detailed description of the film pressing structure provided in the previous embodiment, and will not be repeated here.

[0097] The lamination method provided in this embodiment controls the pressure in the enclosed space 310 formed by the flexible member 300 and the second chamber 121 by at least two cycles during one lamination process. The single cycle control includes controlling the gas to pressurize the enclosed space 310 through the gas pipeline, and then reducing the pressure of the enclosed space 310 after maintaining a constant pressure for a preset time. When the enclosed space 310 is pressurized, the flexible member 300 is forced to expand toward the carrier 200, thereby separating the first chamber 111 and the second chamber. The film to be pressed 140 between 121 is squeezed onto the substrate 210 on the carrier 200, and the extrusion state is maintained for a preset period of time before the pressure is reduced. When the pressure is reduced to a certain pressure value, the above-mentioned process of pressurization, constant pressure, and pressure reduction is recycled. In this way, the film to be pressed 140 and the substrate 210 can be pressed multiple times, which can effectively improve the pressing effect, especially for the substrate 210 with a high aspect ratio hole structure. The above-mentioned multi-stage pressurization and film pressing method can have a good filling effect on the high aspect ratio holes, thereby improving product performance and reliability.

[0098] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0099] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and such modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be determined by the appended claims.

Claims

1. A film pressing system, characterized in that: It includes a lamination structure, a film to be laminated and a substrate; The substrate is a high aspect ratio hole structure, and the laminated structure includes: A shell having a first chamber and a second chamber therein, wherein the film to be pressed is laid on a side surface of the first chamber facing the second chamber; A carrier is disposed in the first chamber, and the substrate is disposed on the carrier; the carrier is connected to a transmission mechanism, which can drive the carrier to rise or fall to adjust the position of the substrate on the carrier; a flexible member connected to the second chamber and enclosing a closed space with the second chamber, wherein the flexible member is adapted to expand toward the carrier under pressure in the closed space to squeeze the film to be laminated onto the substrate; a gas pipeline connected to the enclosed space; the gas pipeline includes an inlet and exhaust pipeline and a vacuum pipeline, the inlet and exhaust pipeline includes an inlet end, an exhaust valve, and a first switch valve, the first switch valve is connected to the enclosed space via the pipeline, the exhaust valve includes a first end, a second end and a third end, the first end is connected to the inlet end, the second end is connected to the first switch valve, and the third end is the exhaust end, when gas enters the first end from the inlet end, the gas enters the second end from the first end through the inside of the exhaust valve; when gas in the enclosed space enters the second end through the first switch valve, the gas enters the third end from the second end through the inside of the exhaust valve to be discharged, the vacuum pipeline includes an exhaust end, a second switch valve and a third switch valve, the exhaust end is connected to the enclosed space via the second switch valve, and is simultaneously connected to the first chamber via the third switch valve; The controller is electrically connected to the gas pipeline and is used to perform at least two cycles of pressure control on the confined space during a film pressing process. The single cycle control includes controlling the gas to pressurize the confined space through the gas pipeline, maintaining a constant pressure for a preset time, and then reducing the pressure.

2. The lamination system according to claim 1, characterized in that: In each cycle control, the pressure value reached by pressurization is the same or different.

3. The lamination system according to claim 1, characterized in that: In each cycle control, the pressure value reached by the pressure reduction is the same or different.

4. The lamination system according to claim 1, characterized in that In each cycle control, the pressure value reached by the pressure reduction is greater than 0, equal to 0, or less than 0.

5. The lamination system according to claim 1, characterized in that: An electro-pneumatic proportional valve is also provided between the air inlet end and the exhaust valve.

6. The lamination system according to claim 1, characterized in that: The flexible member is connected to the bottom of the second chamber.

7. The lamination system according to claim 6, characterized in that: The central axis of the flexible component is perpendicular to the supporting surface of the platform.

8. The lamination system according to claim 1, characterized in that: The carrier is an adsorption platform.

9. A lamination method, characterized in that: Applied to the lamination system according to any one of claims 1 to 8, the method comprises: Placing the substrate on the supporting surface of the carrier, laying the film to be laminated on the upper surface of the first cavity, and then merging the first cavity and the second cavity to form the inner cavity of the shell, so that the film to be laminated is located between the first cavity and the second cavity; evacuating the enclosed space formed by the flexible member and the second chamber, and the first chamber; The pressure in the enclosed space is controlled by controlling the flow direction of gas in the gas pipeline for at least two cycles; wherein a single cycle control includes: controlling the gas through the gas pipeline to pressurize the enclosed space so that the flexible member expands toward the carrier, squeezing the film to be laminated and the substrate, and then reducing the pressure after maintaining the constant pressure for a preset period of time; Among them, the pressurization process is: the control gas enters from the air inlet end, the gas in the exhaust valve is transmitted from the first end of the exhaust valve to the second end, and from the second end to the first switch valve, and then passes into the confined space; the pressure reduction process is: the control gas in the confined space is transmitted through the first switch valve to the second end of the exhaust valve, and then discharged from the third end of the exhaust valve.

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