CMP automatic film laminating device and method

Abstract

The invention relates to a CMP automatic film sticking device and method, comprising a grinding table, a grinding pad is placed on the grinding table, and the outer diameter of the grinding pad is the same as that of the surface of the grinding table. The CMP automatic film sticking device also includes a positioning mechanism, which includes a first disk body and a second disk body rotatably connected to the far end of the first disk body, a first fixed end and a second fixed end are arranged on the side of the first disk body, and a third fixed end is arranged on the side of the second disk body, the end of the first fixed end and the end of the second fixed end respectively buckle the side of the grinding table and abut against the grinding pad, the second disk body rotates relative to the first disk body, so that the end of the third fixed end is closely attached to the side of the grinding table and rotates, and the grinding pad is driven to align with the surface of the grinding table, the operation is convenient, and there is no need to directly contact the grinding pad, thereby improving the grinding efficiency and wafer quality.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and in particular to a CMP automatic film pasting device and method. Background Art

[0002] In the process of chemical mechanical planarization (CMP), the oxide film on the surface of the silicon wafer contacts the polishing pad and reacts with the polishing liquid carried by the polishing pad, and the protrusions on the surface of the silicon wafer are smoothed through physical and chemical effects. In the prior art, the polishing pad is usually replaced manually for film lamination, but the manual replacement of the polishing pad has the following defects:

[0003] (1) The edge of the polishing pad cannot be aligned with the edge of the polishing table, resulting in the pattern on the polishing pad being out of center with the polishing table, causing part of the polishing pad to wear out too quickly during grinding, resulting in the need for replacement of the polishing pad;

[0004] (ii) Bubbles are easily generated when the polishing pad is attached to the surface of the polishing table, resulting in uneven polishing pads, reduced wafer polishing flatness, and reduced polishing rate;

[0005] (3) Manual replacement of the polishing pad can easily cause contamination to the polishing pad and the wafer, affecting the wafer quality. Summary of the invention

[0006] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a CMP automatic film lamination device and method to solve one or more problems in the prior art.

[0007] To achieve the above object, the technical solution of the present invention is as follows:

[0008] The CMP automatic film laminating device comprises a grinding table, a grinding pad is placed on the grinding table, and the outer diameter of the grinding pad is the same as that of the surface of the grinding table. The CMP automatic film laminating device also comprises a positioning mechanism, which comprises a first disc body and a second disc body rotatably connected to the far end of the first disc body, a first fixed end and a second fixed end are arranged on the side of the first disc body, and a third fixed end is arranged on the side of the second disc body, and the ends of the first fixed end and the second fixed end respectively buckle the side of the grinding table and abut against the grinding pad, and the second disc body rotates relative to the first disc body, so that the end of the third fixed end is closely attached to the side of the grinding table and rotates, and the grinding pad is driven to align with the surface of the grinding table, the far end refers to an end close to the ground, and the near end refers to an end away from the ground;

[0009] The angle between the first fixed end and the second fixed end is any degree between 0° and 180°; the moving angle between the third fixed end and the first fixed end is 0° to 270°.

[0010] Furthermore, a first fixing needle is arranged at the end of the first fixing end, a second fixing needle is arranged at the end of the second fixing end, a movable part is slidably arranged on the third fixing end, and a third fixing needle is arranged at the distal end of the movable part.

[0011] Furthermore, a slide rail is provided on the third fixed end, and the movable part moves along the slide rail.

[0012] Furthermore, an elastic member is disposed at a distal end of the first fixing end and connected to the first fixing needle, and an elastic member is disposed at a distal end of the second fixing end and connected to the second fixing needle.

[0013] Furthermore, the angle between the first fixing end and the second fixing end is 90°.

[0014] Furthermore, a moving angle between the third fixed end and the first fixed end is 90° to 180°.

[0015] Furthermore, the first disk body and the second disk body are connected via a fixing member.

[0016] Furthermore, the CMP automatic film laminating device also includes a transfer mechanism, which includes a suction cup assembly and a transfer clamp connected to the proximal end of the suction cup assembly. The suction cup assembly includes at least two suction cups, which are used to suck the polishing pad, and an air vent is set at the proximal end of the suction cup.

[0017] Furthermore, a handle is provided at the proximal end of the suction cup.

[0018] Furthermore, the grinding table includes a ceramic layer, a chassis, and a vacuum pumping component arranged between the ceramic layer and the chassis, the vacuum pumping component includes at least one first groove and at least one second groove connected to the first groove, a plurality of air holes are arranged on the surface of the ceramic layer and connected to the first groove, the air holes are used to adsorb the grinding pad, the far end of the second groove is connected to the second interface, the far end of the second interface is connected to the first interface, and the first interface is used to connect to a vacuum pump.

[0019] Furthermore, a valve is provided between the second interface and the first interface.

[0020] Furthermore, the first groove is any one of annular, square, and arc-shaped.

[0021] Furthermore, the vacuum pumping component also includes a reserved opening.

[0022] The present invention also discloses a method for using the CMP automatic film attaching device, comprising the following steps:

[0023] The transfer mechanism absorbs the polishing pad;

[0024] Transferring the polishing pad to the polishing table by the transfer mechanism;

[0025] The positioning mechanism positions the polishing pad;

[0026] The grinding table absorbs the grinding pad.

[0027] Compared with the prior art, the beneficial technical effects of the present invention are as follows:

[0028] (i) The CMP automatic film laminating device of the present invention has a positioning mechanism, which can adjust the position of the movable part according to the outer diameter of the grinding table and the grinding pad, and buckle the first fixing pin of the first fixing end and the second fixing pin of the second fixing end of the positioning mechanism on the side of the grinding table. The third fixing pin of the third fixing end is controlled by a motor (not shown in the figure) or manually controlled to slide back and forth on the edge of the grinding table several times, so that the edge of the grinding pad is completely aligned with the edge of the grinding table. The operation is convenient and there is no need to directly contact the grinding pad, thereby improving the grinding efficiency and wafer quality.

[0029] (ii) Furthermore, the CMP automatic film laminating device of the present invention has a transfer mechanism, which sucks the two suction cups of the suction cup assembly onto the surface of the polishing pad by pressure, and transfers the polishing pad to the surface of the polishing table by a transfer clamp or a manual clamping handle. It has a simple structure and is easy to operate, and does not require direct contact with the polishing pad, thereby improving the polishing efficiency.

[0030] (III) Furthermore, the grinding table of the CMP automatic film laminating device of the present invention has a vacuum pumping component. When the vacuum pump and the valve are turned on, air is drawn out in sequence through the air hole, the first groove, the second groove, the second interface, and the first interface to achieve vacuum pumping, and the grinding pad is adsorbed on the surface of the grinding table, thereby ensuring the flatness of the grinding pad and improving the grinding efficiency.

[0031] (iv) Furthermore, the first groove is any one of an annular, square, and arc-shaped, and the second groove is a linear shape that diverges outward from the axis. The divergent first groove and the second groove can better fit the polishing pad and avoid air path blockage. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 The schematic diagram shows the structure of the transfer mechanism in the CMP automatic film laminating device provided in the first embodiment of the present invention.

[0033] Figure 2 A front view structural schematic diagram of a suction cup in a CMP automatic film laminating device provided in Embodiment 1 of the present invention is shown.

[0034] Figure 3 The figure shows a bottom view structural diagram of a suction cup in a CMP automatic film laminating device provided in the first embodiment of the present invention.

[0035] Figure 4The schematic diagram of the structure of the grinding table in the CMP automatic film laminating device provided in the first embodiment of the present invention is shown.

[0036] Figure 5 A partial structural schematic diagram of a grinding table in a CMP automatic film laminating device provided in Embodiment 1 of the present invention is shown.

[0037] Figure 6 A schematic diagram of the top view of the positioning mechanism in the CMP automatic film laminating device provided in the first embodiment of the present invention is shown.

[0038] Figure 7 The schematic diagram shows the structure of the first fixed end and the second fixed end of the positioning mechanism in the CMP automatic film laminating device provided in the first embodiment of the present invention.

[0039] Figure 8 A schematic structural diagram of the third fixed end of the positioning mechanism in the CMP automatic film laminating device provided in the first embodiment of the present invention is shown.

[0040] Fig. 9 The figure shows a front view structural schematic diagram of the positioning mechanism in the CMP automatic film laminating device provided in the first embodiment of the present invention.

[0041] Fig.10 A second structural schematic diagram of the grinding table in the CMP automatic film laminating device provided in the first embodiment of the present invention is shown.

[0042] Fig.11 A third structural schematic diagram of the grinding table in the CMP automatic film laminating device provided in the first embodiment of the present invention is shown.

[0043] Fig.12 A fourth structural schematic diagram of the grinding table in the CMP automatic film laminating device provided in the first embodiment of the present invention is shown.

[0044] Markings in the accompanying drawings:

[0045] 1. Grinding table; 11. First interface; 12. Valve; 13. Second interface; 14. First groove; 15. Second groove; 16. Reserved opening; 17. Ceramic layer; 18. Chassis; 2. Suction cup assembly; 21. Handle; 22. Air vent; 23. Suction cup; 3. Positioning mechanism; 31. First disk body; 311. First fixed end; 3111. First fixed pin; 312. Second fixed end; 3121. Second fixed pin; 32. Second disk body; 321. Third fixed end; 3211. Movable part; 3212. Slide rail; 3213. Third fixed pin; 33. Fixing piece; 331. Nut; 332. Bolt; 4. Elastic piece; 5. Grinding pad. DETAILED DESCRIPTION

[0046] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the attached drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the attached drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any modification of the structure, change of the proportion relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0047] In the description of the present invention, the orientations or positional relationships indicated by terms such as “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “top”, “bottom”, “inside”, “outside”, “axial”, “radial”, and “circumferential” are defined as orientations or positional relationships based on those shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention.

[0048] In order to more clearly describe the structure of the CMP automatic film laminating device, the present invention defines the terms "distal end" and "proximal end". Specifically, the "distal end" refers to the end close to the ground, and the "proximal end" refers to the end far from the ground. Figure 1 For example, Figure 1 The upper end of the middle suction cup 23 is the proximal end. Figure 1 The lower end of the middle suction cup 23 is the distal end.

[0049] Embodiment 1

[0050] Please refer to Figure 1 , Figure 4 , Figure 6 and Fig. 9The CMP automatic film laminating device comprises a grinding table 1, a grinding pad 5 is placed on the grinding table 1, and the outer diameter of the grinding pad 5 is the same as that of the surface of the grinding table 1. The CMP automatic film laminating device also comprises a positioning mechanism 3, and the positioning mechanism 3 comprises a first disk body 31 and a second disk body 32 rotatably connected to the distal end of the first disk body 31. The first disk body 31 is provided with a first fixed end 311 and a second fixed end 312 on the side, and the second disk body 32 is provided with a third fixed end 321 on the side. The ends of the first fixed end 311 and the second fixed end 312 respectively buckle the side of the grinding table 1 and abut against the grinding pad 5. The second disk body 32 rotates relative to the first disk body 31, so that the end of the third fixed end 321 is closely attached to the side of the grinding table 1 and rotates, and the grinding pad 5 is driven to align with the surface of the grinding table 1. The distal end refers to the end close to the grinding pad 5 when in use, and the proximal end refers to the end away from the grinding pad 5 when in use.

[0051] The specific structure of the positioning mechanism 3 is first described below:

[0052] Furthermore, the positioning mechanism 3 is coaxially arranged with the grinding table 1 to ensure that the center of the inscribed circle formed by the first fixing needle 3111 , the second fixing needle 3121 , and the third fixing needle 3213 is located on the axis line.

[0053] Please refer to Figure 6 , Figure 7 and Figure 8 Furthermore, a first fixing needle 3111 is arranged at the end of the first fixing end 311, a second fixing needle 3121 is arranged at the end of the second fixing end 312, a movable part 3211 is slidably arranged on the third fixing end 321, and a third fixing needle 3213 is arranged at the distal end of the movable part 3211.

[0054] Please refer to Figure 8 Furthermore, a slide rail 3212 is provided on the third fixed end 321 , and the movable portion 3211 moves along the slide rail 3212 , and the positions of the movable portion 3211 and the third fixed needle 3213 can be adjusted according to the size of the grinding table 1 and the grinding pad 5 .

[0055] Please refer to Figure 7Further, an elastic member 4 is provided at the distal end of the first fixed end 311 to be connected to the first fixed pin 3111, and an elastic member 4 is provided at the distal end of the second fixed end 312 to be connected to the second fixed pin 3121. The elastic member 4 enables the first fixed pin 3111 and the second fixed pin 3121 to be firmly buckled on the edge of the grinding table 1, and also enables the first fixed pin 3111 and the second fixed pin 3121 to be fine-tuned to adapt to different sizes of grinding tables 1 and grinding pads 5. Preferably, an elastic member 4 can also be provided between the third fixed pin 3213 and the movable portion 3211, so that the third fixed pin 3213 can be buckled on the edge of the grinding table 1.

[0056] Please refer to Figure 6 , further, the angle A between the first fixed end 311 and the second fixed end 312 is 90°. Of course, in other embodiments of the present invention, the angle between the first fixed end 311 and the second fixed end 312 can also be any angle between 0° and 180°, as long as it can satisfy the first fixing needle 3111, the second fixing needle 3121 and the third fixing needle 3213 to coordinate and align the polishing pad 5, and the present invention does not impose any further restrictions on this.

[0057] Please refer to Figure 6 , further, the moving angle B between the third fixed end 321 and the first fixed end 311 is 0° to 270°. Preferably, the moving angle B between the third fixed end 321 and the first fixed end 311 is 90° to 180°. More preferably, the moving angle B between the third fixed end 321 and the first fixed end 311 is 150° to 175°, and the third fixed end 321 is located in an arc relative to the first fixed end 311 and the second fixed end 312, so as to better position and align the grinding pad 5.

[0058] Please refer to Fig. 9 Further, the first plate body 31 and the second plate body 32 are connected by a fixing member 33. The fixing member 33 includes a bolt 332 and a nut 331 threadedly connected to the proximal end of the bolt 332, and the bolt 332 passes through the first plate body 31 and the second plate body 32.

[0059] The specific structure of the transfer mechanism and the grinding table 1 is described below:

[0060] Please refer to Figure 1 , Figure 2 and Figure 3Furthermore, the CMP automatic film laminating device also includes a transfer mechanism, which includes a suction cup assembly 2, and the suction cup assembly 2 includes at least two suction cups 23 and a transfer clamp connected to the proximal end of the suction cup 23. The suction cup 23 is used to suck the polishing pad 5. The proximal end of the suction cup 23 is provided with a venting hole 22 for venting air to release the vacuum state of the suction cup 23.

[0061] Please refer to Figure 1 Furthermore, a handle 21 is provided at the proximal end of the suction cup 23 for transferring the suction cup assembly 2 by clamping or manually taking the suction cup assembly 2.

[0062] Preferably, in the CMP automatic film laminating device described in Example 1 of the present invention, the transfer clamp is a commercially available mechanical arm structure with a clamp, which can clamp the suction cup assembly 2 or directly clamp the polishing pad 5. As long as it can transfer the polishing pad 5 to the polishing table 1, the present invention does not impose any further restrictions on this.

[0063] Please refer to Figure 4 and Figure 5 Furthermore, the grinding table 1 includes a ceramic layer 17, a chassis 18, and a vacuum pumping component arranged between the ceramic layer 17 and the chassis 18, the vacuum pumping component includes at least one first groove 14 and at least one second groove 15 connected to the first groove 14, a plurality of pores (not shown in the figure) are arranged on the surface of the ceramic layer 17 and connected to the first groove 14, the pores are used to adsorb the grinding pad 5, the second groove 15 is connected to the second interface 13 at the far end, the second interface 13 is connected to the first interface 11 at the far end, and the first interface 11 is used to connect a vacuum pump.

[0064] Please refer to Figure 4 Furthermore, a valve 12 is provided between the second interface 13 and the first interface 11 to control the start and stop of the vacuum state of the grinding table 1 .

[0065] Please refer to Figure 5 , Fig.10 , Fig.11 and Fig.12 Preferably, in the CMP automatic film laminating device described in Example 1 of the present invention, the first groove 14 is any one of an annular, square, and arc-shaped, and the second groove 15 is a linear shape diverging outward from the axis. As long as it can satisfy the requirement that the polishing pad 5 can be adsorbed on the surface of the polishing table 1 so that no bubbles are generated when the polishing pad 5 is attached to the polishing table 1, the present invention does not make further restrictions on this, and the divergent groove type is less likely to cause air path blockage.

[0066] Furthermore, the vacuum assembly also includes a reserved opening 16 .

[0067] Taking the CMP automatic film laminating device described in Example 1 as an example, the method of using the CMP automatic film laminating device is described in detail below, including the following steps:

[0068] Step S1 : the transfer mechanism adsorbs the polishing pad 5 .

[0069] Specifically, the polishing pad 5 is placed on the operating table, and the two suction cups 23 of the suction cup assembly 2 are adsorbed on the surface of the polishing pad 5 by pressing downward.

[0070] Step S2, transferring the polishing pad 5 to the polishing table 1 by the transfer mechanism.

[0071] Specifically, the transfer clamp clamps the handle 21 of the suction cup 23 or manually takes the handle 21 of the suction cup 23 to transfer the grinding pad 5 to the surface of the grinding table 1. At this time, the surface of the grinding table 1 is not vacuumed, and the grinding pad 5 can slide freely on the surface of the grinding table 1, and the vent hole 22 is opened to separate the suction cup assembly 2 from the surface of the grinding pad 5. Preferably, in the CMP automatic film attaching device described in Example 1 of the present invention, the suction cup assembly 2 can also open the vent hole 22 after positioning in step S3 to separate the suction cup assembly 2 from the surface of the grinding pad 5.

[0072] In step S3 , the positioning mechanism 3 positions the polishing pad 5 .

[0073] The position of the movable part 3211 is adjusted in advance according to the outer diameters of the grinding table 1 and the grinding pad 5, and the movable part 3211 is fixed. The first fixing pin 3111 of the first fixing end 311 of the positioning mechanism 3 and the second fixing pin 3121 of the second fixing end 312 are manually buckled on the side of the grinding table 1, and the third fixing pin 3213 of the third fixing end 321 is controlled by a motor (not shown) or manually operated to slide back and forth several times within the range of 150° to 175° with the second fixing end 312, so that the edge of the grinding pad 5 is completely aligned with the edge of the grinding table 1.

[0074] In step S4 , the grinding table 1 adsorbs the grinding pad 5 .

[0075] Specifically, the vacuum pump and the valve 12 are turned on, and air is drawn out in sequence through the air hole, the first groove 14, the second groove 15, the second interface 13, and the first interface 11 to achieve vacuuming, and the grinding pad 5 is adsorbed on the surface of the grinding table 1. When the grinding pad 5 needs to be replaced, it is only necessary to open the valve 12 to release the vacuum.

[0076] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0077] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. CMP automatic film laminating device, characterized by: The invention comprises a grinding table, a grinding pad is placed on the grinding table, and the outer diameter of the grinding pad is the same as that of the surface of the grinding table. The CMP automatic film laminating device also comprises a positioning mechanism, which comprises a first disc body and a second disc body rotatably connected to the distal end of the first disc body. A first fixed end and a second fixed end are arranged on the side of the first disc body, and a third fixed end is arranged on the side of the second disc body. The ends of the first fixed end and the second fixed end respectively buckle the side of the grinding table and abut against the grinding pad. The second disc body rotates relative to the first disc body, so that the end of the third fixed end is closely attached to the side of the grinding table and rotates, and the grinding pad is driven to align with the surface of the grinding table. The distal end refers to an end close to the ground, and the proximal end refers to an end away from the ground. The angle between the first fixed end and the second fixed end is any degree between 0° and 180°; the moving angle between the third fixed end and the first fixed end is 0° to 270°.

2. The CMP automatic film laminating device according to claim 1, characterized in that: A first fixing needle is arranged at the end of the first fixing end, a second fixing needle is arranged at the end of the second fixing end, a movable part is slidably arranged on the third fixing end, and a third fixing needle is arranged at the distal end of the movable part.

3. The CMP automatic film laminating device according to claim 2, characterized in that: A slide rail is arranged on the third fixed end, and the movable part moves along the slide rail.

4. The CMP automatic film laminating device according to claim 2, characterized in that: An elastic member is disposed at the distal end of the first fixing end and connected to the first fixing needle, and an elastic member is disposed at the distal end of the second fixing end and connected to the second fixing needle.

5. The CMP automatic film laminating device according to claim 1, characterized in that: The angle between the first fixing end and the second fixing end is 90°.

6. The CMP automatic film laminating device according to claim 5, characterized in that: The moving angle between the third fixed end and the first fixed end is 90° to 180°.

7. The CMP automatic film laminating device according to claim 1, characterized in that: The first disk body is connected to the second disk body via a fixing member.

8. The CMP automatic film laminating device according to claim 1, characterized in that: The CMP automatic film laminating device also includes a transfer mechanism, which includes a suction cup assembly and a transfer clamp connected to the proximal end of the suction cup assembly. The suction cup assembly includes at least two suction cups, which are used to suck the polishing pad. An air release hole is arranged at the proximal end of the suction cup.

9. The CMP automatic film laminating device according to claim 8, characterized in that: A handle is arranged at the proximal end of the suction cup.

10. The CMP automatic film laminating device according to claim 1, characterized in that: The grinding table includes a ceramic layer, a chassis, and a vacuum pumping component arranged between the ceramic layer and the chassis, the vacuum pumping component includes at least one first groove and at least one second groove connected to the first groove, a plurality of air holes are arranged on the surface of the ceramic layer and connected to the first groove, the air holes are used to adsorb the grinding pad, the far end of the second groove is connected to the second interface, the far end of the second interface is connected to the first interface, and the first interface is used to connect to a vacuum pump.

11. The CMP automatic film laminating device according to claim 10, characterized in that: A valve is arranged between the second interface and the first interface.

12. The CMP automatic film laminating device according to claim 10, characterized in that: The first groove is any one of annular, square and arc-shaped.

13. The CMP automatic film laminating device according to claim 10, characterized in that: The vacuum pumping assembly further comprises a reserved opening.

14. A method for using the CMP automatic film laminating device according to any one of claims 8 or 9, characterized in that: The following steps are involved: The transfer mechanism absorbs the polishing pad; Transferring the polishing pad to the polishing table by the transfer mechanism; The positioning mechanism positions the polishing pad; The grinding table absorbs the grinding pad.

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