Encryption device, encryption method, and encryption equipment for the device main control system

Abstract

The present invention discloses an encryption device, an encryption method, and an encryption equipment for a device main control system. The encryption device includes a microprocessing component, which is composed of multiple substrate layers stacked. The multiple substrates at least include: a first substrate layer, on which a central processing chip, a software encryption chip, a first connector, a second connector, and a battery are provided; a second substrate layer, on which a clock chip is provided. The clock chip provides a clock for the microprocessing component, and the random access memory in the clock chip cooperates with the software encryption chip to complete the encryption of the microprocessing component; a third substrate layer, on which a third connector and a fourth connector are provided. The first substrate layer, the second substrate layer, and the third substrate layer are sequentially stacked to form the microprocessing component, and the second substrate layer covers the central processing chip on the first substrate layer. The encryption device provided by the present invention assists software encryption in a physical shielding form, and uses the random access memory of the clock chip to cooperate with the encryption chip to complete the encryption function.

Description

Technical Field

[0001] The present invention relates to the technical field of software and hardware encryption, and particularly to an encryption device, an encryption method, and an encryption device for a device main control system. Background Art

[0002] Existing MCU control units generally have the problems of low encryption and low cracking cost. Generally, an MCU control unit has a single-layer substrate structure, and this single-layer substrate structure has weak encryption. Generally, encryption is carried out by means of program writing, but this protection function is easily cracked. There is also encryption by burning out the data bus. Although there is a risk of damage, it can also be cracked. There is also software encryption, which is a method to prevent others from understanding the program. A single such method cannot prevent others from copying the whole, and other encryption algorithms must be combined. When the budget cost permits, there are also encryption methods with better effects, such as adding external hardware circuits and chip grinding and modification. High investment brings high information security. Currently, relatively common methods include encryption by connecting to the network and adding a serial number, encryption by using the unique identifier of the MCU, and encryption by using read protection + unique ID.

[0003] The above-mentioned various encryption methods all have their advantages and disadvantages. Encryption methods with high encryption degree and difficult to crack naturally have high costs, and in order to save costs, encryption methods with low encryption degree are selected, but the information security is difficult to guarantee. In this case, the main production and operation equipment such as machine tools and systems used by processing enterprises inevitably encounter the encryption problem of the main control system. How to provide an encryption device and an encryption method with high encryption degree and low cost has become an urgent problem for enterprises at present.

[0004] Therefore, there is an urgent need to propose a new technical solution to solve the problems existing in the prior art. Summary of the Invention

[0005] In order to solve the problems existing in the prior art, the present invention provides an encryption device, an encryption method, and an encryption device for a device main control system, and the specific technical solutions adopted are as follows:

[0006] An encryption device for a device main control system includes a microprocessing component, and the microprocessing component is composed of multiple substrate layers stacked, and the multiple substrate layers constituting the microprocessing component at least include:

[0007] A first substrate layer, on which a central processing chip, a software encryption chip, a first connector, a second connector, and a battery are provided;

[0008] The second substrate layer, on which a clock chip is provided, the clock chip provides a clock for the microprocessing component, and the random access memory in the clock chip cooperates with the software encryption chip to complete the encryption of the microprocessing component;

[0009] The third substrate layer, on which a third connector, a fourth connector and a plurality of high-speed input / output interfaces are provided; the signal output by the microprocessing component and the output signal of the external system are coupled through the third connector, the fourth connector is connected to the first connector, so that information interaction is formed between the third substrate layer and the first substrate layer, and information interaction is formed between the central processing chip of the first substrate layer and the second substrate layer through the second connector;

[0010] The first substrate layer, the second substrate layer and the third substrate layer are stacked in sequence to form the microprocessing component, and the second substrate layer covers the central processing chip of the first substrate layer.

[0011] Further in the above technical solution, the encryption device further includes:

[0012] A motherboard, on which a plurality of card slots are provided, and a plurality of communication interfaces are provided in each card slot;

[0013] A power module, which is installed on one of the card slots on the motherboard, and the power module is electrically connected to the motherboard through the communication interface in the card slot;

[0014] One or more communication modules, and one or more card slots on the motherboard are configured to respectively accommodate the corresponding one or more communication modules;

[0015] One or more input / output modules, and one or more card slots on the motherboard are configured to respectively accommodate the corresponding one or more input / output modules;

[0016] The microprocessing component is installed on one of the card slots on the motherboard, and the microprocessing component is connected to the power module, the communication module and the input / output module through the communication interface in the card slot, and the plurality of high-speed input / output interfaces on the third substrate layer form information interaction between the external system and the microprocessing component.

[0017] Furthermore, circuit elements are provided on the surface of the second substrate layer facing the central processing chip, and the shape and size of the second substrate layer respectively match the shape and size of the central processing chip, so that the second substrate layer completely covers the central processing chip;

[0018] The shape and size of the third substrate layer are respectively the same as the shape and size of the first substrate layer, so that the third substrate layer completely covers the first substrate layer;

[0019] The operation data of the central processing chip is encrypted by the software encryption chip and then stored in the random access memory. The first connector is connected in alignment with the fourth connector. The microprocessing component is pulled out from the motherboard. The power module stops supplying power to the microprocessing component. The battery in the microprocessing component discharges. The microprocessing component operates normally. When the microprocessing component is disassembled, the first connector and the fourth connector are separated. The central processing chip receives a trigger signal and erases the operation critical data stored therein. When the second substrate layer is detached from the first substrate layer, the battery on the first substrate layer stops supplying power to the second substrate layer, and the data in the random access memory on the second substrate layer is lost due to power-off.

[0020] A plurality of long strip-shaped card slots are arranged at intervals and in parallel on the motherboard. The microprocessing component module and the power module are arranged adjacent to each other.

[0021] The present invention also provides an encryption method for a device main control system, which includes:

[0022] The microprocessing component of the device main control system is composed of a first substrate layer, a second substrate layer, and a third substrate layer stacked in sequence. The second substrate layer completely covers the central processing chip on the first substrate layer. The third substrate layer covers the second substrate layer, and the third substrate layer completely shields the second substrate layer and the first substrate layer.

[0023] When the device system starts to run, the microprocessing component of the main control system starts encryption. The central processing chip and the software encryption chip in the microprocessing component dynamically generate synchronization data through an algorithm. The synchronization data is stored in the random access memory of the microprocessing component, and the synchronization data is refreshed in real time in the random access memory.

[0024] The critical data for the central processing chip to perform operations is generated by encrypting in cooperation with the software encryption chip by the central processing chip.

[0025] Further, a clock chip is provided in the microprocessing component. The clock chip provides a clock for the microprocessing component. At a set time interval of the microprocessing component, the microprocessing component compares the synchronization data stored in the random access memory with reference data, and judges the system security according to the comparison result. If the difference between the synchronization data and the reference data obtained by the microprocessing component exceeds the error range, the microprocessing component determines that the system is insecure and erases the critical data.

[0026] Further, when the microprocessing component is forcibly disassembled, the first connector and the fourth connector are split, the central processing chip is triggered, and the central processing chip interrupts the operation and erases the critical operation data.

[0027] Furthermore, when the first substrate layer and the second substrate layer are forcibly split, the second substrate layer loses the power supply of the battery on the first substrate layer, and the data information in the random access memory in the clock chip on the second substrate layer is lost.

[0028] Furthermore, when the split second substrate layer is reinstalled on the first substrate layer and powered on, the data information in the random access memory of the split second substrate layer has been lost due to power-off. The central processing chip and the software encryption chip on the first substrate layer cannot read data from the random access memory on the second substrate layer. The central processing chip erases the content in its storage unit and outputs a fault code to the host computer.

[0029] Furthermore, the host computer records the data erasure record of the microprocessing component according to the fault code.

[0030] Furthermore, after the split microprocessing component is reassembled to obtain a reorganized microprocessing component, the reorganized microprocessing component is inserted into the card slot of the motherboard. The reorganized microprocessing component resets the power control signal of the power module on the motherboard, and the device main control system is not powered on. The third connector on the third substrate layer of the reorganized microprocessing cannot capture external signals.

[0031] Furthermore, when the device main control system is running normally, the microprocessing component is inserted into the card slot of the motherboard. The motherboard is also provided with a power module, and the power module provides electrical energy for the microprocessing component. At this time, the battery provided on the first substrate layer of the microprocessing component does not discharge.

[0032] Furthermore, when the device main control system is powered off, the battery on the first substrate layer discharges, and the microprocessing component obtains power supply from the battery. The data in the random access memory on the second substrate layer of the microprocessing component is prevented from being lost due to power-off.

[0033] Furthermore, when cracking the main control system, the motherboard is powered off, and the microprocessing component inserted into the card slot of the motherboard is pulled out. The microprocessing component is powered by the battery inside the microprocessing component.

[0034] Further, when cracking the microprocessing component, the second substrate layer is disassembled, and the central processing chip on the first substrate layer triggers an abnormal interruption. The central processing chip automatically erases the content in the storage unit. After the second substrate layer is separated from the first substrate layer, the data information in the random access memory on the second substrate layer is lost due to power failure.

[0035] The present invention also provides an encryption device, which includes the above-mentioned encryption device for the device main control system, and the encryption device is used for encrypting the data of the device control system. It further includes a material feeding device, a component feeding device, a component processing device, and a material packaging device. The material feeding device is used for feeding the carrier tape for packaging components. The component feeding device is used for feeding components. The component processing device is used for implanting the components into the receiving grooves of the carrier tape. The material packaging device is used for packaging the carrier tape containing components. The control system is used for controlling the sequential actions of the material feeding device, the component feeding device, the component processing device, and the material packaging device.

[0036] Compared with the prior art, the present invention has one or more of the following beneficial effects:

[0037] 1. The encryption device provided by the present invention is composed of multiple layers of substrates, and forms an auxiliary encryption in the form of physical occlusion through the way of layer-by-layer covering. And it uses the random access memory (RAM) in the clock chip of the microprocessing component to cooperate with the software encryption chip to complete the encryption, without the need to additionally add a random access memory, saving the device cost. The form of layer-by-layer covering cooperates with the characteristic of data loss due to power failure of the random access memory to ensure the data security in the random access memory. And once the microprocessing component is disassembled, the data in the central processing chip is also automatically erased, further ensuring the data security.

[0038] 2. The encryption method of the present invention is completed by using the method of hardware encryption in cooperation with software encryption. Compared with the existing single-layer processor, the encryption method of the present invention assists software encryption through the hardware structure, controls the cost, is suitable for production investment, ensures the system information security while reducing the prevention and control cost.

[0039] 3. In addition to the above-mentioned encryption device, the encryption equipment of the present invention further includes a carrier tape feeding device, a component feeding device, a component processing device, and a material packaging device. The carrier tape feeding device is used for feeding the carrier tape packaging components, the component feeding device is used for feeding components, the component processing device is used for implanting the components into the receiving grooves of the carrier tape, and the material packaging device is used for packaging the carrier tape containing components. The encryption equipment encrypts the data of the equipment control system through the encryption device, thereby ensuring the security of the control system, ensuring the system security of the control system for controlling the sequential actions of the material feeding device, component feeding device, component processing device, and material packaging device, protecting the interests of the manufacturer, and preventing the user from stealing. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0041] Figure 1 It is a top view structural schematic diagram of the motherboard in the encryption device for the equipment main control system according to the present invention in an embodiment;

[0042] Figure 2 It is a structural decomposition schematic diagram of the microprocessing component for the equipment main control system according to the present invention in an embodiment;

[0043] Figure 3 It is a flow schematic diagram of the material processing process of the encryption equipment in an embodiment.

[0044] Wherein: 100 - microprocessing component;

[0045] 110 - first substrate layer; 111 - central processing chip; 112 - software encryption chip; 113 - first connector; 114 - second connector; 115 - battery; 120 - second substrate layer; 121 - clock chip; 122 - random access memory (RAM);

[0046] 130 - third substrate layer; 131 - third connector; 132 - fourth connector; 133 - high-speed input / output interface;

[0047] 200 - motherboard; 210 - card slot; 220 - communication interface;

[0048] 300 - power module. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0049] To make the above objects, features, and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] The detailed description of the present invention is mainly presented through programs, steps, logic blocks, processes, or other symbolic descriptions, which directly or indirectly simulate the operation of the technical solutions in the present invention. Those skilled in the art use these descriptions and statements here to effectively introduce the essence of their work to other technical personnel in the field.

[0051] As used herein, "one embodiment" or "an embodiment" means that the features, structures, or characteristics related to the embodiment can be included in at least one implementation of the present invention. The phrase "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it have to be a separate or alternative embodiment that is mutually exclusive with other embodiments. In addition, the module order in the method, flowchart, or functional block diagram representing one or more embodiments is not a fixed order and does not refer to any specific order, nor does it constitute a limitation of the present invention.

[0052] Embodiment 1:

[0053] Existing MCU control units generally have the problems of low encryption and low cracking cost. The existing MCU control units are basically single-layer structures, which are easily cracked and have weak security. When a control unit with high security is required, costs must be incurred, and once the costs increase, it is not suitable for large-scale use. To solve the above problems, the present invention combines a hardware architecture and a software algorithm, enabling the control unit itself to have an autonomous data protection function, increasing the cracking difficulty and controlling costs.

[0054] An encryption device for a device main control system provided by the present invention includes a microprocessing component, which is composed of multiple substrate layers laminated. In one case, referring to Figure 2 , the multiple substrate layers constituting the microprocessing component may include:

[0055] The first substrate layer 110, on which a central processing chip 111, a software encryption chip 112, a first connector 113, a second connector 114, and a battery 115 are provided;

[0056] The second substrate layer 120, on which a clock chip 121 is provided. The clock chip 121 provides a clock for the microprocessing component 100, and the random access memory 122 in the clock chip 121 cooperates with the software encryption chip 112 to complete the encryption of the microprocessing component 100.

[0057] The third substrate layer 130 is provided with a third connector 131, a fourth connector 132, and a plurality of high-speed input / output interfaces 133; the signals output by the microprocessing component 100 and the output signals of the external system are coupled through the third connector 131, and the fourth connector 132 is connected to the first connector 113 so that information interaction is formed between the third substrate layer 130 and the first substrate layer 110, and the central processing chip 111 of the first substrate layer 110 and the second substrate layer 120 form information interaction through the second connector 114.

[0058] It can be seen that Figure 2 the first substrate layer 110, the second substrate layer 120, and the third substrate layer 130 are sequentially stacked to form the microprocessing component 100, and the second substrate layer 120 covers the central processing chip 111 of the first substrate layer 110. This physical covering method ensures disassembly before cracking, and the disassembly triggers the autonomous erasure of the central processing chip 111. At the same time of disassembly, the RAM in the clock chip 121 loses data due to power-off, that is, cracking requires disassembly, and disassembly will inevitably lead to data loss. This strong protection can ensure data security. When the manufacturer sells the device to the user, this encryption protection method derived from the device can further ensure the data information security of the manufacturer, prevent it from being stolen, and ensure that the interests of the manufacturer are not infringed.

[0059] In one embodiment, the encryption device further includes:

[0060] A motherboard 200 is provided with a plurality of card slots 210, and each card slot 210 is provided with a plurality of communication interfaces 220. Refer to Figure 1 which is a top view structural schematic diagram of the motherboard 200. It only schematically shows the general structure of the motherboard 200 and can be understood as an integrated circuit board. The card slots 210 on it are the distribution trends determined by the circuit layout on the board, including how many card slots 210 are distributed, and the distribution positions of each card slot 210 are all determined by the functional circuit;

[0061] A power supply module 300 is installed on one of the card slots 210 on the motherboard 200. The power supply module 300 is electrically connected to the motherboard 200 through the communication interfaces 220 in the card slot 210, and the power supply module 300 provides power support for the main control system;

[0062] One or more communication modules. One or more of the card slots 210 on the motherboard 200 are configured to respectively accommodate the corresponding one or more communication modules. The communication modules on the motherboard 200 can assist in the communication between the microprocessing component 100, the power supply module 300, the input / output module, and the external system. For an electrical system, the communication module is the information interaction channel of the entire system;

[0063] One or more input / output modules. One or more card slots 210 on the motherboard 200 are configured to respectively accommodate corresponding one or more input / output modules. The input / output modules can sequentially transmit the command signal lights output by the microprocessing component 100 to the target mechanism to maintain the operation of the system control.

[0064] The microprocessing component 100 is installed on one of the card slots 210 on the motherboard 200. The microprocessing component 100 is connected to the power module 300, the communication module, and the input / output module through the communication interface 220 in the card slot 210. A plurality of high-speed input / output interfaces 133 on the third substrate layer 130 form information interaction between the external system and the microprocessing component 100. A plurality of long strip-shaped card slots 210 are arranged in parallel at intervals on the motherboard 200, and the microprocessing component 100 module and the power module 300 are arranged adjacent to each other.

[0065] In one embodiment, circuit elements are provided on the surface of the second substrate layer 120 facing the central processing chip 111. The shape and size of the second substrate layer 120 respectively match the shape and size of the central processing chip 111, so that the second substrate layer 120 completely covers the central processing chip 111. After complete coverage, it can ensure that there are no key traces or other components that may leak information security outside, realizing the encryption concept that cracking must first demolish and demolition will cause information loss.

[0066] In one embodiment, the operation data of the central processing chip 111 is encrypted by the software encryption chip 112 and then stored in the random access memory 122. The first connector 113 is connected in alignment with the fourth connector 132. When the microprocessing component 100 is pulled out from the motherboard 200, the power module 300 stops supplying power to the microprocessing component 100, the battery 115 in the microprocessing component 100 discharges, and the microprocessing component 100 operates normally. When the microprocessing component 100 is disassembled, the first connector 113 and the fourth connector 132 are separated, and the central processing chip 111 receives a trigger signal and erases the operation key data stored therein; when the second substrate layer 120 is separated from the first substrate layer 110, the battery 115 of the first substrate layer 110 stops supplying power to the second substrate layer 120, and the data in the random access memory 122 on the second substrate layer 120 is lost due to power-off.

[0067] In one embodiment, the shape and size of the third substrate layer 130 are respectively the same as the shape and size of the first substrate layer 110, so that the third substrate layer 130 completely covers the first substrate layer 110.

[0068] The encryption device provided by the present invention is composed of a multi-layer substrate combination, and forms an auxiliary encryption in the form of physical occlusion through the way of layer-by-layer coverage. Moreover, the random access memory 122 (RAM) in the clock chip 121 of the microprocessing component 100 is used in cooperation with the software encryption chip 112 to complete the encryption, without the need to additionally add a random access memory 122, saving the device cost. The layer-by-layer coverage form, combined with the characteristic that the data in the random access memory 122 is lost when the power is off, ensures the security of the data in the random access memory 122. And once the microprocessing component 100 is disassembled, the data in the central processing chip 111 is automatically erased, further ensuring the data security.

[0069] Example 2:

[0070] Based on the above encryption device for the device main control system, refer to Figure 1 、 2 The present invention also provides an encryption method for a device main control system, and the method includes:

[0071] 1. Hardware structure encryption method: The microprocessing component 100 of the device main control system is composed of a first substrate layer 110, a second substrate layer 120, and a third substrate layer 130 stacked in sequence. The second substrate layer 120 completely covers the central processing chip 111 on the first substrate layer 110. The third substrate layer 130 covers the second substrate layer 120, and the third substrate layer 130 completely occludes the second substrate layer 120 and the first substrate layer 110.

[0072] 2. Software program encryption method: When the device system starts to run, the microprocessing component 100 of the main control system starts encryption. The central processing chip 111 and the software encryption chip 112 in the microprocessing component 100 dynamically generate synchronization data through an algorithm. The synchronization data is stored in the random access memory 122 of the microprocessing component 100, and the synchronization data is refreshed in real time in the random access memory 122.

[0073] The key data for the central processing chip 111 to perform operations is generated through the cooperation and encryption of the central processing chip 111 and the software encryption chip 112.

[0074] In one embodiment, a clock chip 121 is provided in the microprocessor component 100, and the clock chip 121 provides a clock for the microprocessor component 100. The random access memory 122 (RAM) attached to the clock chip 121 assists the encryption method of the microprocessor, thereby saving the capital investment in external RAM. Within the set time interval of the microprocessor component 100, the microprocessor component 100 compares the synchronization data stored in the random access memory 122 with the benchmark data, and determines the system security based on the comparison result. If the microprocessor component 100 compares the synchronization data and the benchmark data and the difference exceeds the error range, the microprocessor component 100 determines that the system is unsafe and erases the critical data.

[0075] In one embodiment, when the microprocessor assembly 100 is forcibly disassembled, the central processing chip 111 is triggered, and the central processing chip 111 interrupts the operation and erases the key operation data. This software program encryption method achieves the encryption goal of actively erasing information without leaking it.

[0076] In one embodiment, when the first substrate layer 110 and the second substrate layer 120 are forcibly separated, the second substrate layer 120 loses the power supply of the power supply on the first substrate layer 110, and the data information in the random access memory 122 in the clock chip 121 on the second substrate layer 120 is lost. This software encryption method is completed by utilizing the characteristic of the random access memory 122 (RAM) that the power-off information is lost. As long as the disassembly is carried out, the power is cut off and the power-off information is lost. The RAM described in the present invention uses the RAM built into the clock chip 121, and no external RAM is used, which saves the encryption cost of the device.

[0077] In one embodiment, the split second substrate layer 120 is reinstalled on the first substrate layer 110 and powered on. The data information in the random access memory 122 of the split second substrate layer 120 has been lost due to power failure. The central processing chip 111 and the software encryption chip 112 on the first substrate layer 110 cannot read data from the random access memory 122 on the second substrate layer 120. The central processing chip 111 erases the content in its storage unit and outputs a fault code to the host computer. The host computer enters the data erasure record of the microprocessor component 100 according to the fault code. The user can know the reason for the equipment shutdown through the record of the host computer, and find the corresponding solution according to this reason. After the shutdown reason is specified, the problem is more targeted.

[0078] In one embodiment, the disassembled microprocessing component 100 is reassembled to obtain a reorganized microprocessing component 100. The reorganized microprocessing component 100 is inserted into the card slot 210 of the motherboard 200. The reorganized microprocessing component 100 resets the power control signal of the power module 300 on the motherboard 200, and the device main control system is not powered on. The third connector 131 on the third substrate layer 130 of the reorganized microprocessing cannot capture external signals. When the microprocessing component 100 is disassembled and reorganized, the information in the RAM is lost. The central processing chip 111 cannot read data from the RAM and thus cannot work properly. The control system does not function, and the power supply of the main control system is always in a reset power-off state, which will inevitably cause the system to shut down.

[0079] In one embodiment, when the device main control system is running normally, the microprocessing component 100 is inserted into the card slot 210 of the motherboard 200. The motherboard 200 is also provided with a power module 300. The power module 300 provides electrical energy for the microprocessing component 100. At this time, the battery 115 provided on the first substrate layer 110 of the microprocessing component 100 does not discharge. This battery 115 only serves as a backup power supply. When the system is powered off, the battery 115 discharges to maintain the system data from being lost.

[0080] In one embodiment, when the device main control system is powered off, the battery 115 on the first substrate layer 110 discharges. The microprocessing component 100 obtains power supply from the battery 115. The data in the random access memory 122 on the second substrate layer 120 of the microprocessing component 100 is prevented from being lost due to power-off.

[0081] In one embodiment, when cracking the main control system, the motherboard 200 needs to be powered off, and the microprocessing component 100 inserted into the card slot 210 of the motherboard 200 is pulled out. The microprocessing component 100 is powered by the battery 115 inside the microprocessing component 100.

[0082] Furthermore, when cracking the microprocessing component 100, the second substrate layer 120 is disassembled. The central processing chip 111 on the first substrate layer 110 triggers an abnormal interruption. The central processing chip 111 automatically erases the content in the storage unit. After the second substrate layer 120 is separated from the first substrate layer 110, the data information in the random access memory 122 on the second substrate layer 120 is lost due to power-off.

[0083] The encryption method of the present invention is completed by using a method of combining hardware encryption with software encryption. Compared with the existing single-layer processors, the encryption method of the present invention assists software encryption through a hardware structure, controls the cost, is suitable for production investment, ensures the security of system information, and reduces the prevention and control cost at the same time.

[0084] Embodiment 3:

[0085] Based on the encryption device and encryption method for the device master control system provided above, the present invention further provides an encryption device, which includes the above-mentioned encryption device for the device master control system. The encryption device is used for encrypting the data of the device control system. It further includes a material feeding device, a component feeding device, a component processing device, and a material packaging device. The material feeding device is used for feeding the carrier tape for packaging components. The component feeding device is used for feeding components. The component processing device is used for implanting the components into the receiving grooves of the carrier tape. The material packaging device is used for packaging the carrier tape containing components. The control system is used for controlling the sequential actions of the material feeding device, the component feeding device, the component processing device, and the material packaging device.

[0086] It can be seen that Figures 1-3 , in an embodiment, the processing process of the material by the encryption device of the present invention can be as Figure 3 shown Figure 3 shows a flowchart of a material processing process. The material can include various components. In an embodiment, it can be used as a guiding operation flowchart for the component processing process. The following will explain the flowchart shown in Figure 3 :

[0087] Figure 3 The flowchart shown in

[0088] can be divided into the following processing processes: Process 1: Obtain the carrier tape for packaging components through the carrier tape feeding device; Process 2: Feed the components through the component feeding device; Process 3: Implant the components into the carrier tape through the component processing device; Process 4: Package the carrier tape implanted with components through the material packaging device. The order of Process 1 and Process 2 is not sequential. Generally, for production efficiency, Process 1 and Process 2 are parallel. One or more detection processes can be set as needed in Process 1, Process 2, or Process 3, mainly for detecting the appearance and electrical performance of the components. Of course, it is not that a detection process cannot be set in Process 4. Only detecting before packaging can control defects at the front end of production, reduce the error correction cost, and improve production efficiency.

[0089] In one embodiment, process 2 is for loading materials, and the packaged components need to be loaded to the designated position before feeding (feeding is the previous process of implanting components in process 3, that is, feeding is a preparatory work for implanting components into the carrier). Before and after feeding, the components can be inspected for appearance and electrical performance. If defective products are detected, they will be placed in a defective product box and wait for the staff to confirm whether they are indeed defective.

[0090] In one embodiment, process 3 is to implant the components one by one into the storage slots of the carrier. The components may also be inspected for appearance and electrical performance before or after implantation. If a defect is detected before implantation, the component may be directly discharged. If a defect is detected after implantation, the component may be taken out of the storage slot.

[0091] In one embodiment, process 4 is to package the carrier tape with the implanted components. At this time, an upper tape may be provided, and the carrier tape is packaged by the upper tape. After the packaging is completed, a finished material tape is obtained.

[0092] In order to improve the efficiency of material packaging, we can start from the above four processing processes respectively, and develop encryption automation equipment for each operation step, so as to realize the automation of the operation step. Furthermore, it is also necessary to develop suitable sub-devices or mechanisms for the sub-steps in each step to realize the automation of the sub-step. For example, for process 1, since the process includes three sub-steps such as supplying the mother tape, supplying the lower tape, and sticking the lower tape, it may be necessary to develop three sub-devices or mechanisms for the above three sub-steps. Of course, in order to realize the automation of the whole process of material packaging, these automation devices for each step can also be integrated together. The present invention is proposed based on the above-mentioned inventive concept. The automation devices for each operation step and the whole set of encryption automation equipment of the present invention will be exemplarily introduced in the following with multiple embodiments.

[0093] Material loading device (carrier loading device)

[0094] In one embodiment, the present invention provides a material loading device, which is mainly used to load a carrier tape and can transport the carrier tape to a post-process station to receive post-process operations.

[0095] The material loading device can be called a carrier loading device, which can be used as a loading device for a component processing device to transport an empty carrier to the component processing device to complete the implantation of components. At this time, the above-mentioned back-end station is the material implantation station. Of course, the material loading device described in this embodiment may also be used as a loading device for other material handling devices, and this embodiment is not particularly limited.

[0096] In one embodiment, see Figure 3, the tape loading device of the present invention includes two feeding devices. One feeding device is used to supply the master tape, and the other feeding device is used to supply the lower tape (it should be noted that the master tape is a plastic strip with through holes on it. The shape and size of the through holes are adapted to the shape and size of the components to be packaged. The lower tape is attached to one side of the master tape, and the lower tape seals the through holes on the master tape. Therefore, the master tape with the lower tape attached on one side forms a tape that can package components). After both feeding devices supply materials, the master tape and the lower tape are simultaneously conveyed to the lower pressing and laminating station. At the lower pressing and laminating station, the lower tape is attached to one side surface of the master tape. A lower pressing and laminating device is provided at the lower pressing and laminating station. The lower pressing and laminating device moves up and down reciprocally and cooperates with a certain temperature to complete the lamination of the lower tape and the master tape. After the lamination is completed, the tape is obtained. Among them, the lower pressing and laminating device can include an electric soldering iron that heats up immediately when powered on (abbreviation: "electric iron"). The electric iron is connected to an electromagnet, and the electric iron moves up and down reciprocally under the drive of the electromagnet to complete the pressing action. In actual application, it is also necessary to select a suitable heating temperature of the electric iron and set a suitable pressing time according to the materials and characteristics of the lower tape and the master tape. In order to ensure firm lamination, the electric iron will stay on the lower tape for a certain time during the downward pressing process and apply a certain downward pressure to the tape to ensure the adhesion of the lower tape and the master tape. Thus, the component processing device obtains a tape that can be used to package components from the first front-end processing route, and receiving grooves are formed on the tape.

[0097] In one embodiment, both the master tape and the lower tape are roll-shaped materials. The master tape roll and the lower tape roll are respectively fixed on the reserved workstations on the rack, and both the master tape and the lower tape are conveyed to the lower pressing and laminating station, and then the lower tape is pasted on the master tape through the lower pressing and laminating device. Thus, the tape is obtained.

[0098] In one embodiment, the tape loading device of the present invention further includes a tape driving part, and the tape driving part conveys the obtained tape to the subsequent workstation.

[0099] In one embodiment, if the tape is directly provided and not processed through the master tape and the lower tape, the tape loading device of the present invention can only include a tape driving part, and the tape is loaded to the material implanting workstation through the tape driving part.

[0100] The material loading device provided in this embodiment can be used as a component and integrated with the component loading device, the component processing device, and the material packaging device to form a complete set of encryption equipment. When the material loading device is used as a component of the complete set of encryption equipment, the material loading device loads the tape into the component processing device to receive subsequent loading operations. The specific process can refer to the relevant content of the encryption equipment in the subsequent embodiments.

[0101] Of course, the material loading device can also be used as the loading device of other types of material processing devices.

[0102] Component feeding device

[0103] In one embodiment, the present invention provides a component feeding device, which can store, feed, and load components to sequentially convey the components to the subsequent process station for receiving subsequent operations.

[0104] The component feeding device can be used as a feeding device of a component processing device to convey components into the component processing device. At this time, the above-mentioned subsequent process station is the material implantation station on the component processing device. Refer to Figure 3 . Of course, the component feeding device may also be used as a feeding device of other component operation devices, and this embodiment is not particularly limited.

[0105] The component feeding device in the embodiment of the present invention can be used to decentralize concentrated materials. The decentralized materials can be arranged in a single row in sequence to prepare for feeding the materials into the carrier tape later. After the materials are arranged in a single row in sequence, a detection device can be set to sequentially perform electrical performance detection on each component (the electrical performance detection can include two resistance detections and one capacitance detection). If a defective product is detected, the defective product will be discharged into the corresponding storage box. The implantation of the detection device in the component feeding device can control the quality of the components during the feeding process to control defects before storage and reduce the rework cost. Of course, the detection device may not be implanted in the component feeding device, and only the storage, feeding, and loading of the components are completed during the feeding process, and the electrical performance detection screening process is placed in the subsequent process. Specifically, at which stage the electrical performance detection process is placed can be determined according to the actual integrated structure of the component processing device.

[0106] In one embodiment, the component feeding device of the present invention may include a hopper, a material vibrating disk, and a material transmission track. One end of the hopper is communicated with the feeding port of the material vibrating disk, the discharge port of the material vibrating disk is connected to the material transmission track, and a sensor is further arranged on the material vibrating disk. The sensor can monitor the amount of materials in the material vibrating disk. If it detects that the amount of materials is insufficient, it controls the hopper to add materials to the material vibrating disk, and stops adding materials after adding materials to the set amount of materials. The material vibrating disk can arrange the materials in a single row on the material transmission track through mechanical vibration. Among them, the hopper is used to store components, the material vibrating disk can sort materials through vibration, and the material transmission track can convey the materials in a single row for convenient feeding.

[0107] In one embodiment, if the detection process is implanted in the component feeding device, the detection device can be inverted under the material transmission track (the installation position is related to the detection method. In this embodiment, the detection device is inverted mainly because during the electrical performance test, probes will be extended from bottom to top to detect whether the resistance and capacitance performance are qualified. Therefore, the detection device is inverted under the material transmission track). When the material is conveyed to the detection station (in this embodiment, the detection station coincides with the feeding station of the material transmission track), the detection device performs electrical performance detection on the material.

[0108] In one embodiment, the detection device described in this embodiment may include three detection processes, two of which may be resistance detection and the other may be capacitance detection (of course, they may also be reallocated, and this embodiment only provides an example to illustrate the problem and is not intended to limit the present invention).

[0109] In one embodiment, the detection device is described, which may include three detection components, each detection component corresponding to a detection process. For example, the first detection component and the second detection component for resistance detection respectively include two detection probes. When it is detected that there are components in the detection station, the detection probe extends and pierces the target detection part of the component, and obtains the resistance value of the resistor from the target detection part to judge whether the electrical properties of the detected component are qualified. If qualified, enter the next detection process, and if unqualified, the component is placed in the corresponding defective storage box. The third detection component for capacitance detection includes two detection probes, which are the same as resistance detection. The detection probe is required to pierce the target capacitance detection part of the component, and obtain the capacitance value from the target detection part to judge whether the electrical properties of the detected component are qualified. If qualified, enter the next detection process, and if unqualified, the component is placed in the corresponding defective storage box. The components that pass the three detection processes are transmitted to the material implantation station on the material transmission track. Through this layer-by-layer screening method, the defective control is at the front end of the storage to ensure the quality of the finished product.

[0110] The component loading device provided in this embodiment can be used as a component, integrated with the carrier loading device, the component processing device and the material packaging device to form a complete set of encryption equipment. When the component loading device is used as a component of the complete set of encryption equipment, the component loading device loads the components into the component processing device to accept subsequent loading operations. For the specific process, please refer to the relevant content of the encryption device in the subsequent embodiments.

[0111] Of course, the component loading device can also be used as a loading device for other types of material processing devices, such as a loading device for other materials.

[0112] Component processing device

[0113] The present invention provides a component processing device, which can pick up, transfer, detect and implant components, and convey the carrier tape with implanted components to the subsequent process station to receive subsequent operations.

[0114] This component processing device can be used as a loading device for a material packaging device, so as to convey the carrier tape with implanted components to be packaged into the material packaging device. At this time, the above-mentioned subsequent process station is the upper pressing station of the material packaging device. Of course, this component processing device may also be used as a loading device for other component operation devices, and this embodiment is not particularly limited.

[0115] A component processing device provided by the present invention adopts a vacuum management solution, which can provide very effective help for the use, maintenance and repair of the component processing device, and realize the intelligent management of the machine. It should be noted that in this embodiment, the term "processing" in the component processing device has a broad meaning. Picking up, transferring, detecting, excluding, unloading, placing, and mounting components can all be called processing of components. The components in this embodiment may include small components such as chips, resistors, and capacitors.

[0116] There are many types of the component processing device. Some component processing devices can use the principle of vacuum adsorption to package components into the storage slots in the carrier tape, which involves feeding of components (i.e., picking up of components), transfer of components, detection of components, exclusion of components with abnormal detection, and implantation of components with normal detection (i.e., placement of components). Many of these actions need to be completed through vacuum adsorption. In addition, there are also some component processing devices whose purpose is not to package the components into the carrier tape, but to select the components that pass the detection, and the selected components can be directly loaded into relevant containers, which involves feeding of components (i.e., picking up of components), transfer of components, detection of components, exclusion of components with abnormal detection, and unloading of components with normal detection (directly loading the selected components into relevant containers), etc. Many of these actions need to be completed through vacuum adsorption. In addition, there are also some component processing devices used to mount components on a carrier board such as a circuit board, which involves feeding of components (i.e., picking up of components), transfer of components, and mounting of components, etc. Many of these actions need to be completed through vacuum adsorption.

[0117] See Figure 3, the general working process of the component processing device of the present invention will be described with reference to the accompanying drawings. The component processing device provided in this embodiment receives the carrier tape loaded by the carrier tape loading device and also receives the components loaded by the component loading device. The main function of the component processing device is to implant the components into the carrier tape. However, in order to ensure product quality, a detection function is also added to the component processing device, and the purpose is to control defects at the front end of production and reduce rework costs.

[0118] A material implantation station is provided in the component processing device, and the loaded components are implanted into the carrier tape at the material implantation station. The electrical performance detection process can also be completed together at the material implantation station. Of course, in order to ensure quality, electrical performance detection can also be carried out during the component loading process and at the material implantation station, so as to greatly reduce the probability of implanting defective materials.

[0119] The process of packing components into the receiving grooves in the carrier tape will be briefly described below.

[0120] The component processing device can pack components into the receiving grooves in the carrier tape. The components can be small passive components such as chips.

[0121] A material implantation station is provided in the component processing device. The component processing device includes a machine table, and a turntable, a feeding part, a discharging part, an implanting part, and a material detection device provided on the machine table.

[0122] The turntable is driven to rotate during operation. The turntable includes a plurality of grooves provided on the edge. In fact, grooves are evenly provided on all edge parts of the turntable.

[0123] The feeding part of the component processing device includes a feeding vacuum suction nozzle provided on the machine table, a feeding track provided on the machine table, a separating needle, and a positioning detector. The implanting vacuum suction nozzle is connected to a vacuum pump through a pipeline. The separating needle is controlled to move between a blocking position and an open position. When the separating needle is in the blocking position, it blocks the components on the feeding track. As shown in the figure, at this time, the separating needle is in the blocking position. When the separating needle is in the open position, the top end of the separating needle is lower than or equal to the track surface of the feeding track. The feeding vacuum suction nozzle sucks the components on the feeding track into the groove located at the feeding vacuum suction nozzle through vacuum suction, and then the separating needle returns from the normally open position to the blocking position. The positioning detector is configured to detect whether the components enter the groove located at the feeding vacuum suction nozzle. When the turntable rotates, the grooves of the turntable sequentially pass by the feeding vacuum suction nozzle, and in cooperation with the reciprocating movement of the separating needle between the blocking position and the open position, the components are individually adsorbed into the grooves of the turntable.

[0124] As the turntable rotates, the material detection device can sequentially perform electrical performance detection and appearance detection on the components adsorbed into the grooves of the turntable, such as resistance value detection or capacitance value detection, appearance color detection, and component placement detection. Components with abnormal detection need to be excluded from the turntable, and the discharging part can be configured to perform the exclusion work on the components with abnormal detection. Of course, for components with normal detection, the discharging part does not perform the exclusion action and needs to adsorb the components with normal detection.

[0125] The discharging part of the component processing device includes a discharging vacuum suction nozzle, a receiving cavity, and a solenoid valve arranged on the machine table. The first port of the solenoid valve is communicated with the discharging vacuum suction nozzle, the second port of the solenoid valve is communicated with the vacuum pump, and the third port of the solenoid valve is communicated with the air outlet pump. The solenoid valve is controlled to selectively communicate the first port with one of the second port and the third port. The discharging vacuum suction nozzle is controlled by the solenoid valve to selectively communicate with one of the vacuum pump and the air outlet pump.

[0126] For components with normal detection, the solenoid valve makes the discharging vacuum suction nozzle communicate with the vacuum pump, and the discharging vacuum suction nozzle adsorbs the components with normal detection in the groove located at the discharging vacuum suction nozzle through vacuum suction. For components with abnormal detection, the solenoid valve makes the discharging vacuum suction nozzle communicate with the air outlet pump, and the discharging vacuum suction nozzle blows out the components with abnormal detection from the groove located at the discharging vacuum suction nozzle through blowing thrust, and the blown-out components fall into the receiving cavity. As the turntable rotates, the grooves on the edge of the turntable will sequentially pass through the discharging vacuum suction nozzle of the discharging part, and by cooperating with the action control of the solenoid valve, the components with normal detection can be retained, and the components with abnormal detection can be excluded.

[0127] The implanting part of the component processing device includes an implanting vacuum suction nozzle and an implanting driving part. The implanting vacuum suction nozzle is communicated with the vacuum pump through a pipeline. The implanting vacuum suction nozzle sucks the component in the groove located at the implanting vacuum suction nozzle through vacuum suction and implants it into the receiving groove of the carrier tape. The implanting driving part drives the implanting vacuum suction nozzle to reciprocate between the material taking position and the implanting position. When the implanting vacuum suction nozzle is at the material taking position, it sucks the component in the groove located at the implanting vacuum suction nozzle, and when at the implanting position, it implants the sucked component into the receiving groove of the carrier tape.

[0128] As the turntable rotates, the grooves on the edge of the turntable will successively pass by the feeding vacuum nozzle, the discharging vacuum nozzle, and the implanting vacuum nozzle. In coordination with the reciprocating movement of the separating needle between the blocking position and the open position, the components are individually adsorbed into the grooves of the turntable. By coordinating the action control of the solenoid valve, the components with normal detection can be retained, and the components with abnormal detection can be excluded. In coordination with the reciprocating movement of the implanting vacuum nozzle and the forward movement of the carrier tape, the implanting vacuum nozzle can successively place the components in the grooves on the edge of the turntable into the receiving grooves of the carrier tape. Thus, the component processing device completes the work of implanting components into the mother tape (carrier tape).

[0129] In one embodiment, the component processing device of the present invention further includes a carrier tape driving part. The carrier tape driving part drives the carrier tape to pass through the implanting part. The carrier tape includes a plurality of receiving grooves arranged in columns and carrier tape holes arranged in columns. The carrier tape driving part drives the receiving grooves of the carrier tape to successively pass by the implanting vacuum nozzle through the carrier tape holes on the carrier tape.

[0130] In one embodiment, the carrier tape driving part drives the carrier tape to pass through the implanting part, and after the components are implanted into the carrier tape, it drives the carrier tape to continue moving forward to the appearance inspection station on the machine table. The appearance inspection station is provided with a detection window, and an image detection device is arranged directly above the detection window. The detection window has a magnifying lens, which can magnify the components in the receiving grooves to facilitate the image recognition of the components by the image detection device. Through the image detection device, the appearance and placement of the components are inspected to determine that the appearance of the components is qualified and they are correctly received face up in the receiving grooves. If it is detected that the appearance of the components is unqualified or the placement is incorrect, the carrier tape is allowed to continue moving forward to the screening station. A push-pull plate is arranged at the screening station. When the unqualified components move to the screening station, the push-pull plate is opened to take out the unqualified components. If no defects of the components are detected, the carrier tape passes through the screening station and continues to move to the next station.

[0131] The component processing device provided in this embodiment can be used as a component and integrated with a carrier tape loading device, a component loading device, and a material packaging device to form a complete set of encryption equipment. When the component processing device is used as a part of the complete set of encryption equipment, the component processing device feeds the carrier tape containing components to the material packaging device for subsequent packaging operations. The specific process can refer to the relevant content of the encryption equipment in the subsequent embodiments.

[0132] Of course, the component processing device can also be used as a loading device for other types of material processing devices, or can be used alone as a component processing equipment for production, which is not particularly limited here.

[0133] Material Encapsulation Device

[0134] In one embodiment, the present invention provides a material encapsulation device, which is mainly used to package a carrier tape containing components. The packaged carrier tape is made into a reel of tape.

[0135] This material encapsulation device can be used as the next packaging device of a component processing device, which encapsulates, reels, finishes, and labels the carrier tape processed by the component processing device to finally obtain a finished reel of tape. Of course, the material encapsulation device described in this embodiment may also be used as a packaging device for other material operation devices, and this embodiment is not particularly limited.

[0136] In one embodiment, as can be seen in Figure 3 , the material encapsulation device of the present invention needs to first encapsulate the carrier tape containing components, that is, a feeding device is also required to supply an upper tape (the upper tape is used to encapsulate the carrier tape, that is, to paste the tape on the other side of the master tape to complete the component encapsulation). The material encapsulation device pastes the upper tape on one side surface of the carrier tape to form an encapsulation for the components.

[0137] In one embodiment, the material encapsulation device includes an upper pressing device, which is arranged at the upper pressing station. The upper tape supplied by the feeding device and the carrier tape supplied by the component processing device are both conveyed to the upper pressing station, and the encapsulation of the carrier tape (the upper tape is pasted on the carrier tape) is completed at the upper pressing station.

[0138] In one embodiment, the next station of the screening station in the component processing device can be connected to the upper pressing station, and the carrier tape supplied from the component processing device is conveyed from the screening station to the upper pressing station. The upper pressing device arranged at the upper pressing station can include an instant-on soldering iron (abbreviation: "soldering iron"), and the soldering iron is connected to an electromagnet. The soldering iron moves up and down reciprocally under the drive of the electromagnet to bond the upper tape to the carrier tape. After the pressing action is completed, the upper tape encapsulates the carrier tape to obtain a finished tape, and the carrier tape driving part drives the finished tape to continue moving to the next station.

[0139] In one embodiment, a winding station is also arranged on the material encapsulation device. The finished tape is moved from the upper pressing station to the winding station. A tail label feeding device and an automatic winding device are arranged at the winding station. The tail label feeding device feeds the tail label to the winding station, and the automatic winding device automatically winds the finished tape around a roller into a roll. When it reaches the set length / thickness, a reel of tape is obtained, and the automatic winding device pastes the tail label on the terminal of the reel of tape to obtain a finished reel of tape with encapsulation completed.

[0140] In one embodiment, a labeling station is further provided on the material encapsulation device. The finished product reel after encapsulation is conveyed to the labeling station. A labeling device and a scanning device are provided at the labeling station. The labeling device attaches a nameplate to the reel of the finished product reel, and the scanning device scans and detects whether the barcode on the nameplate is correct. Of course, the nameplate can be attached manually or by a machine in cooperation with a sensor for identification and attachment.

[0141] The material encapsulation device provided in this embodiment can be used as a component and integrated with a component feeding device, a material feeding device, and a component processing device to form a complete set of encryption equipment. When the material encapsulation device is used as a part of the complete set of encryption equipment, the material encapsulation device receives materials from the component processing device for packaging. Of course, the material feeding device can also be used as other types of material processing devices, which are not particularly limited here according to packaging requirements.

[0142] Encryption equipment

[0143] The present invention provides an encryption automation device, which can continuously and automatically complete operations such as feeding, placement, encapsulation, and winding of components, thereby greatly improving the processing efficiency of materials.

[0144] In one embodiment, the encryption equipment of the present invention includes a frame, and a material feeding device, a component feeding device, a component processing device, and a material encapsulation device integrally installed on the frame. Among them:

[0145] The material feeding device is used to feed the carrier tape to the component processing device;

[0146] The component feeding device feeds components to the component processing device;

[0147] The component processing device places components in the receiving grooves of the carrier tape and conveys the carrier tape containing components to the material encapsulation device;

[0148] The material encapsulation device encapsulates, winds, finishes, and labels the carrier tape containing components, and finally produces a finished product reel that can be sold externally.

[0149] In one embodiment, the encryption equipment of the present invention may further include an encryption device, which is used to encrypt the main control system to ensure information security.

[0150] It should be noted that the material loading device, the component loading device, the component processing device, and the material packaging device are not necessarily completely independent in structure, and some or several structural components may be reused between the devices. Correspondingly, the processing stations in each device are not necessarily completely staggered in spatial position, and some stations may partially overlap, or even completely overlap. This structural reuse and station overlap are also for saving production space and shortening the production transfer route. For example, the feeding station in the component loading device can be reused as a detection station.

[0151] It should be specifically noted that in some embodiments, the present invention only provides one type of transfer component. This transfer component can not only reciprocate between the devices to transfer the carrier tape from one device to another, but also enter the interior of each device to realize the transfer of the carrier tape between the processing stations inside each device. In these embodiments, the carrier tape driving component mentioned in the present invention specifically refers to this transfer component. Of course, in order to improve the processing efficiency of the encryption device, multiple groups of transfer components can be provided, and the multiple groups of transfer components act in parallel, so that the encryption device can simultaneously perform material packaging on multiple carrier tapes. Of course, at the same moment, these carrier tapes are at different stations to receive different operations, ensuring that they do not interfere with each other or be misaligned.

[0152] In some other embodiments, independent internal transfer components are provided inside each device as needed. These internal transfer components only move inside the device to which they belong to realize the transfer of the carrier tape between the processing stations inside the device to which they belong. An external transfer component is additionally provided on the machine table or the frame. This external transfer component can reciprocate between the devices to transfer the carrier tape from one device to another. In these embodiments, the transfer mechanism mentioned in the present invention includes the internal transfer components and the external transfer components inside each device. Of course, in the present invention, the conveyance of the carrier tape is basically completed by the carrier tape driving component.

[0153] The material loading device in the encryption device in the embodiments of the present invention adopts the material loading device in the embodiments of the present invention. Since the specific structure and working process of this material loading device have been described in detail above, they will not be elaborated here. Please refer to the relevant descriptions in the embodiments of the present invention. In addition, it should be noted that when the material loading device is described below, the internal components thereof will not be introduced one by one either. Please directly refer to the relevant descriptions in the above embodiments.

[0154] It should be noted that in some other embodiments, the carrier tape is loaded onto the material implantation station manually. Therefore, in these embodiments, the material loading device is not equipped on the encryption device in the embodiments of the present invention. It only includes a component loading device, a component processing device, and a material packaging device installed on the rack, and can sequentially complete the processing operations of the components.

[0155] The component loading device in the encryption device in the embodiments of the present invention adopts the component loading device in the above embodiments of the present invention. Since the specific structure and working process of this component loading device have been described in detail in the previous text, they will not be repeated here. Please refer to the relevant descriptions in the above embodiments.

[0156] The component processing device in the encryption device in the embodiments of the present invention adopts the component processing device in the above embodiments of the present invention. Since the specific structure and working process of this component processing device have been described in detail in the previous text, they will not be repeated here. Please refer to the relevant descriptions in the above embodiments.

[0157] The material packaging device in the encryption device in the embodiments of the present invention adopts the material packaging device in the above embodiments of the present invention. Since the specific structure and working process of this material packaging device have been described in detail in the previous text, they will not be repeated here. Please refer to the relevant descriptions in the above embodiments.

[0158] Each functional device in the encryption device provided by the present invention can be disassembled, reorganized, replaced, or deleted according to the actual application environment, but it still does not affect its basic function as an encryption device.

[0159] In addition to the encryption device, the encryption device of the present invention also has a carrier tape loading device, a component loading device, a component processing device, and a material packaging device. The carrier tape loading device is used to load the carrier tape for packaging components. The component loading device is used to realize the loading of components. The component processing device is used to implant the components into the storage grooves of the carrier tape. The material packaging device is used to realize the packaging of the carrier tape containing components. Therefore, the encryption device of the present invention can meet the needs of the entire packaging process, realize automatic packaging, reduce labor costs, and improve production efficiency.

[0160] The encryption device of the present invention encrypts the data of the device control system through the encryption device, thereby ensuring the security of the control system, ensuring the system security of the control system for controlling the timing actions of the material loading device, component loading device, component processing device, and material packaging device, protecting the interests of the manufacturer, and preventing the user from stealing.

[0161] In this text, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion. In addition to the elements listed, other elements not expressly listed may also be included.

[0162] In this text, the directional terms such as front, rear, upper, lower, etc. are defined based on the positions of the components in the drawings and their relative positions to each other, solely for the clarity and convenience of expressing the technical solution. It should be understood that the use of these directional terms should not limit the scope of protection claimed in this application. Without conflict, the above embodiments and the features in the embodiments in this text may be combined with each other. The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An encryption device for a device master control system, characterized in that It includes a microprocessing component, which is composed of multiple substrate layers laminated, and the multiple substrates forming the microprocessing component at least include: A first substrate layer, on which a central processing chip, a software encryption chip, a first connector, a second connector, and a battery are provided; A second substrate layer, on which a clock chip is provided. The clock chip provides a clock for the microprocessing component, and the random access memory in the clock chip cooperates with the software encryption chip to complete the encryption of the microprocessing component; A third substrate layer, on which a third connector, a fourth connector, and several high-speed input / output interfaces are provided; the signal output by the microprocessing component is coupled to the output signal of the external system through the third connector, the fourth connector is connected to the first connector, so that information interaction is formed between the third substrate layer and the first substrate layer, and the central processing chip of the first substrate layer forms information interaction with the second substrate layer through the second connector; The first substrate layer, the second substrate layer, and the third substrate layer are sequentially laminated to form the microprocessing component, and the second substrate layer covers the central processing chip of the first substrate layer.

2. The encryption device for the device master control system according to claim 1, characterized in that It further includes: A motherboard, on which several card slots are provided, and several communication interfaces are provided in each card slot; A power module, which is installed on one of the card slots on the motherboard, and the power module is electrically connected to the motherboard through the communication interface in the card slot; One or more communication modules, and one or more card slots on the motherboard are configured to respectively accommodate the corresponding one or more communication modules; One or more input / output modules, and one or more card slots on the motherboard are configured to respectively accommodate the corresponding one or more input / output modules; The microprocessing component is installed on one of the card slots on the motherboard, and the microprocessing component is connected to the power module, the communication module, and the input / output module through the communication interface in the card slot. The power module provides electrical energy for the microprocessing component, and several high-speed input / output interfaces on the third substrate layer form information interaction between the external system and the microprocessing component.

3. The encryption device for the device master control system according to claim 2, characterized in that, Circuit elements are provided on the surface of the second substrate layer facing the central processing chip, and the shape and size of the second substrate layer are respectively adapted to the shape and size of the central processing chip, so that the second substrate layer completely covers the central processing chip; The shape and size of the third substrate layer are respectively the same as the shape and size of the first substrate layer, so that the third substrate layer completely covers the first substrate layer; The operation data of the central processing chip is encrypted by the software encryption chip and then stored in the random access memory. The first connector is connected in alignment with the fourth connector. The microprocessing component is pulled out from the motherboard. The power module stops supplying power to the microprocessing component. The battery in the microprocessing component discharges. The microprocessing component operates normally. When the microprocessing component is disassembled, the first connector and the fourth connector are separated. The central processing chip receives a trigger signal and erases the operation key data stored therein. When the second substrate layer is separated from the first substrate layer, the battery on the first substrate layer stops supplying power to the second substrate layer, and the data in the random access memory on the second substrate layer is lost due to power-off. Multiple long strip-shaped card slots are arranged in parallel at intervals on the motherboard. The microprocessing component module and the power module are arranged adjacent to each other.

4. An encryption method for a device main control system, characterized in that, It includes: The microprocessing component of the device main control system is composed of a first substrate layer, a second substrate layer, and a third substrate layer stacked in sequence. The second substrate layer completely covers the central processing chip on the first substrate layer. The third substrate layer covers the second substrate layer, and the third substrate layer completely shields the second substrate layer and the first substrate layer. The device system starts to run, and the microprocessing component of the main control system starts encryption. The central processing chip and the software encryption chip in the microprocessing component dynamically generate synchronization data through an algorithm. The synchronization data is stored in the random access memory of the microprocessing component, and the synchronization data is refreshed in real time in the random access memory. The key data for the central processing chip to perform operations is generated by the cooperation of the central processing chip and the software encryption chip for encryption.

5. The encryption method for the device main control system according to claim 4, wherein A clock chip is provided in the microprocessing component. The clock chip provides a clock for the microprocessing component. Within a set time interval of the microprocessing component, the microprocessing component compares the synchronization data stored in the random access memory with the reference data and judges the system security according to the comparison result. If the microprocessing component obtains that the difference between the synchronization data and the reference data exceeds the error range, the microprocessing component determines that the system is insecure and erases the key data.

6. The encryption method for a device main control system according to claim 4, characterized in that, A first connector is provided on the first substrate layer, and a fourth connector is provided on the third substrate layer. When the microprocessing component is forcibly disassembled, the first connector and the fourth connector are separated, the central processing chip is triggered, and the central processing chip interrupts the operation and erases the operation key data. When the first substrate layer and the second substrate layer are forcibly separated, the second substrate layer loses the power supply of the battery on the first substrate layer, and the data information in the random access memory in the clock chip on the second substrate layer is lost.

7. An encryption method for a device main control system according to claim 6, characterized in that, Reassemble the second substrate layer that has been split back onto the first substrate layer and power it on. The data information in the random access memory of the split second substrate layer has been lost due to power-off. The central processing chip and the software encryption chip on the first substrate layer cannot read data from the random access memory on the second substrate layer. The central processing chip erases the content in its storage unit and outputs a fault code to the host computer. The host computer enters the data erasure record of the microprocessing component according to the fault code.

8. An encryption method for a device main control system according to claim 7, characterized in that, After reassembling the split microprocessing component, a recombined microprocessing component is obtained. Insert the recombined microprocessing component into the card slot of the motherboard. The recombined microprocessing component resets the power control signal of the power module on the motherboard. The device main control system is not powered on, and the third connector on the third substrate layer of the recombined microprocessing cannot capture external signals.

9. An encryption method for a device main control system according to claim 4, characterized in that, When the device main control system is running normally, the microprocessing component is inserted into the card slot of the motherboard. The motherboard is also provided with a power module, and the power module provides electrical energy for the microprocessing component. At this time, the battery provided on the first substrate layer of the microprocessing component does not discharge. When the device main control system is powered off, the battery on the first substrate layer discharges, and the microprocessing component obtains power supply from the battery. The data in the random access memory on the second substrate layer of the microprocessing component is prevented from being lost due to power-off. When cracking the main control system, power off the motherboard and pull out the microprocessing component inserted into the card slot of the motherboard. The microprocessing component is powered by the battery inside the microprocessing component. When cracking the microprocessing component, disassemble the second substrate layer. The central processing chip on the first substrate layer triggers an abnormal interruption, and the central processing chip automatically erases the content in the storage unit. After the second substrate layer is separated from the first substrate layer, the data information in the random access memory on the second substrate layer is lost due to power-off.

10. An encryption device, characterized in that, It includes the encryption device for the device main control system according to any one of claims 1-3, and the encryption device is used for encrypting the data of the device control system. It further includes a material feeding device, a component feeding device, a component processing device, and a material packaging device. The material feeding device is used for feeding the carrier tape for packaging components. The component feeding device is used for feeding the components. The component processing device is used for implanting the components into the receiving grooves of the carrier tape. The material packaging device is used for packaging the carrier tape containing components. The control system is used for controlling the timing actions of the material feeding device, the component feeding device, the component processing device, and the material packaging device.

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