A method for interconnecting and transporting adhesive panels

Abstract

The present invention proposes an interconnected transportation method for board-bonding parts, the steps of which include: receiving board-bonding parts unloaded from a board-bonding machine and monitoring the model of the board-bonding parts; classifying the board-bonding parts according to their models and sending them to a buffer area for caching; when the board-bonding parts in the buffer area match the silicon rod model required in an online stick-bonding machine, the matched board-bonding parts are taken out of the buffer area and transported to the working area of ​​the stick-bonding machine through an interconnected channel connecting the buffer area and the stick-bonding machine. The present invention can automatically identify board-bonding parts of different lengths, and accurately and efficiently transport board-bonding parts of different lengths to a cache layer for caching, and then accurately and quickly take out the board-bonding parts of the required length in the production line and transport them through an interconnected mechanism to meet the demand instructions of different production lines, replacing the existing manual identification and transmission, with high work efficiency and high accuracy.

Description

Technical Field

[0001] The invention belongs to the technical field of silicon rod bonding and transportation, and in particular relates to an interconnected transportation method for bonding plate parts. Background Art

[0002] The existing silicon wafer cutting systems are all automatic production lines, but since the production process is to produce silicon wafers of multiple specifications at the same time, this requires that all production equipment and upstream and downstream processes be more closely and accurately connected. Before bonding the silicon rods, the material plate needs to be pre-bonded to the material holder to form an integrated bonding plate part, and then the bonding plate part is sent to the bonding rod integrated machine for bonding the silicon rods. In production, since the silicon rods have non-standard lengths when they are cut, there will be silicon rods of different splicing lengths, and bonding plate parts of different lengths need to be prepared.

[0003] In the actual production process, different board gluing machines produce board gluing pieces of different lengths. For silicon rods of the same diameter, rods of different lengths will be formed, and then board gluing pieces of different lengths will be needed, so it is necessary to gather the board gluing pieces of different lengths into a separate area for aggregation. In the existing production workshop, different processes are set in different production areas. The board gluing machines and rod gluing machines of adjacent processes that are directly connected can be connected and transported in a straight line without the need for direct human involvement in the operation. For the board gluing machines and rod gluing machines in different remote areas, they need to be identified by personnel and manually transferred and transported, which not only has low work efficiency but is also prone to mixing, resulting in a high production error rate and unstable quality. Therefore, it is urgent to design a remote interconnection conveying device to connect the board gluing machine with the rod gluing machine, and can automatically, accurately and efficiently identify the length of the board gluing piece to meet the requirements of different silicon rod lengths. Summary of the invention

[0004] The present invention provides an interconnected transportation method for bonded plate parts, which is particularly suitable for the transportation of workpieces in which a material plate and a material seat are bonded together. It solves the technical problems of high error rate and low production efficiency in the transportation and identification process of bonded plate parts due to connection problems between production lines in the existing production process.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A method for interconnecting and transporting adhesive panels, comprising:

[0007] Receive the glued board parts unloaded from the gluer and monitor the model of the glued board parts;

[0008] Classify the adhesive plate parts according to their types, and send the adhesive plate parts to a buffer area for buffering;

[0009] When the bonding plate piece in the buffer area matches the silicon rod model required by the online stick bonding machine, the matched bonding plate piece is taken out from the buffer area and transported to the working area of ​​the stick bonding machine through the interconnection channel connecting the buffer area and the stick bonding machine.

[0010] Furthermore, before the matched adhesive plate parts are moved out of the buffer area, the method further includes suspending the step of conveying the adhesive plate parts to the buffer area.

[0011] Furthermore, after the matched adhesive plate parts are moved into the interconnected channel, the method further includes resuming the step of conveying the adhesive plate parts to the buffer area.

[0012] Furthermore, the board-bonding pieces unloaded from the board-bonding machine are transferred to the buffer area, and the board-bonding pieces after being matched are taken out from the buffer area and transferred to the interconnecting channel via the same material receiving and transferring position.

[0013] Furthermore, the material receiving device is arranged at one side of the entrance of the buffer area and is connected with the unloading place of the gluing machine.

[0014] Furthermore, the interconnecting channel is placed above the buffer area and is connected to the material receiving device.

[0015] Furthermore, the matched glued board parts are transported to the loading platform of the glued board machine through a material receiving device on the side of the interconnected channel close to the working area of ​​the glued board machine.

[0016] Furthermore, the adhesive plate part models are divided according to the length and / or width of the adhesive plate part.

[0017] Furthermore, the silicon rod matched with the adhesive plate member is a silicon square rod or a silicon round rod.

[0018] Furthermore, the cache area includes a plurality of cache layers, and each of the cache layers includes a plurality of cache positions for placing the adhesive plate parts of the same specification.

[0019] An interconnected transportation method for sticky board parts designed by the present invention can automatically identify sticky board parts of different length specifications, and accurately and efficiently transport the sticky board parts of different lengths to a cache layer for caching, and then accurately and quickly take out the sticky board parts of the required length in the production line and transport them through an interconnected mechanism to meet the demand instructions of different production lines, replacing the existing manual identification and transmission, with high work efficiency and high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of an interconnected transportation device for adhesive plate parts according to the first embodiment of the present invention;

[0021] Figure 2 is a schematic top view of an interconnected transport device for adhesive plate parts according to the first embodiment of the present invention;

[0022] Figure 3 This is a schematic structural diagram of an interconnected transportation device for adhesive plate parts according to a second embodiment of the present invention;

[0023] Figure 4 It is a schematic top view of an interconnected transportation device for adhesive plate parts according to the second embodiment of the present invention.

[0024] In the figure:

[0025] 10. Buffer area 20. Material receiving area 30. Interconnection channel

[0026] 40, receiving material lifting platform 50, unloading platform 60, loading platform DETAILED DESCRIPTION

[0027] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0028] This embodiment provides an interconnected transportation device for adhesive plate parts, such as Figure 1 and Figure 2 As shown, it includes: a buffer area 10 for temporarily storing glued board parts, a material receiving lift 20 for connecting the unloading platform 50 of the glued board machine and the buffer area 10, an interconnecting channel 30 for connecting the loading platform 60 of the stick glued machine and the buffer area 10, and a material receiving lift 40 arranged at one end of the interconnecting channel 30 close to the stick glued machine and connected to the loading platform 60 of the stick glued machine and transporting the loading platform 60 placed from the interconnecting channel 30 to the upper and lower parts. Among them, the material receiving hoist 20 is configured on one side of the buffer area 10. The material receiving hoist 20 receives and identifies the specifications of the bonding board parts from the unloading platform 50, including identifying the length, or width, or length and width of the bonding board parts, which can be determined according to actual conditions, so that the bonding board parts can be transported to the buffer area 10 for caching; when the bonding board parts in the buffer area 10 that are compatible with the silicon rod model produced in the stick bonding machine are identified, they are taken out from the buffer area 10 by the material receiving hoist 20, and then transported through the interconnecting channel 30 connecting the stick bonding machine and the buffer area 10, and finally transferred to the loading platform 60 at the stick bonding machine.

[0029] Specifically, the cache area 10 includes several cache layers, each of which includes several cache locations for placing adhesive plate parts of the same specification. Preferably, the number of cache locations in each layer may be the same or different.

[0030] Furthermore, each cache position is equipped with a cache monitoring component for monitoring the external dimensions of the adhesive plate. The cache monitoring component is an infrared sensor, which is arranged in the length direction and width direction of the adhesive plate. According to the requirements of the model, the length, width, or length and width of the adhesive plate are monitored, and the signal is sent to the central processor of the centralized control center (this is a common control method, and the attached figure is omitted), and it is determined that the adhesive plate to be connected is transported to the entrance of the cache layer with the same model. And it moves along the length of the cache layer away from the side of the material receiving device 20 via the conveyor belt, so that the adhesive plate enters the cache layer first. The setting of this structure can quickly and accurately store the adhesive plate parts by type, and can monitor the number of adhesive plate parts and the number of free positions on the cache position in each cache layer in real time, so that the system can allocate tasks for placement and retrieval. The number of cache layers can be determined according to actual needs and is not specifically limited here.

[0031] Furthermore, the cache positions of each layer are arranged in the same direction, and the length of the cache positions is arranged in the same direction as the length of the sticking plate parts, that is, they are arranged perpendicular to the moving direction of the sticking plate parts along the conveyor belt of each layer, and also perpendicular to the direction of unloading from the material receiving device 20.

[0032] After the current glued board piece is transferred to the corresponding buffer layer by the receiving lifting device 20, the receiving lifting device 20 returns to its initial position, that is, the position at the same height as the unloading platform 50, to prepare for receiving the next group of glued board pieces.

[0033] Furthermore, the receiving lift 20 is equipped with a placing table for placing the sticky board pieces, a chain for controlling the up and down movement of the placing table, and a motor for driving the placing table to move. The receiving lift 20 is vertically placed at the connection between the unloading table 50 and the entrance of the buffer area 10. The placing table moves up and down along the height of the receiving lift 20 and sends the sticky board pieces from the unloading table 50 to the buffer layer, or receives the sticky stick plates sent from the buffer layer and sends them into the interconnecting channel 30.

[0034] Furthermore, the input port and the output port of the placement table are arranged to communicate with each other along the width center line of the material receiving platform 20, and are consistent with the moving direction of the cache position, that is, they are arranged in the same direction as the placement position of the sticky board parts in the unloading table 50. This structure not only saves the time for adjusting the direction of the sticky board parts, but also saves the transportation distance. The sticky board parts can be quickly and accurately delivered to any cache layer of the cache area 10, and the sticky board parts can also be taken out from any cache layer of the cache area 10 and raised to the entrance of the interconnection channel 30.

[0035] Furthermore, in order to save ground space and leave more ground for placing floor equipment, a suspended interconnection channel 30 is used, that is, the interconnection channel 30 is placed above the buffer area 10, and is connected to the output port of the material receiving boom 20, and the other end is connected to the input port of the material receiving boom 40.

[0036] Furthermore, the interconnected channel 30 includes a plurality of horizontal or longitudinal conveying branches arranged in a same layer, each conveying branch adopts a belt transmission setting, a roller setting or a chain setting, as long as it can ensure that the sticking plate parts can be transported and moved smoothly and safely, so that the sticking plate parts can be connected to the loading platform 60 of the stick sticking machine along the transmission line of the interconnected channel 30. The setting of the interconnected channel 30 is not limited by the installation of ground equipment and space, and can cross different workshops or floors or heights, so that two independently set production lines can be interconnected, which can meet the mobile transportation of sticking plate parts required for production, and can automatically design the transportation route safely, quickly and smoothly. Preferably, all conveying branches are connected in a straight line, and the conveying direction can be adjusted at the corner, which is convenient for controlling the direction and saving the conveying displacement length.

[0037] Furthermore, since the interconnection channel 30 is set at high altitude, and the loading platform 60 of the stick gluing machine is set on the ground, it is necessary to set a second material receiving lift 40 at the output end of the interconnection channel 30. The second material receiving lift 40 can lower the glued board pieces output from the interconnection channel 30 to the loading platform 60 of the stick gluing machine to complete the material dropping process of the glued board pieces. The structure of the second material receiving lift 40 is the same as that of the first material receiving lift 20, and its input port and output port are both set in parallel with the output end of the interconnection channel 30 and the inlet end of the loading platform 60.

[0038] The loading platform 60 can be coaxially arranged with the material receiving platform 40 and the interconnecting channel 30, such as Figure 2 shown.

[0039] Of course, the loading platform 60 can be arranged on the side of the receiving platform 40, such as Figure 4 As shown, accordingly, its structural diagram is as follows Figure 3 As shown. Among them, Figure 3 and Figure 1 The other structures are the same and are omitted here.

[0040] In this embodiment, the silicon rod may be a silicon square rod or a silicon round rod.

[0041] A method for transporting adhesive sheet parts, using the interconnected transport device as described above, comprises the following steps:

[0042] S1: First receive the glued board parts from the unloading table 50 of the glued board machine, and monitor the model of the glued board parts;

[0043] Specifically, the glued board pieces from each gluer are moved to the unloading table 50 one by one, and then moved to the receiving elevating 20 through the unloading table 50. A sensor for monitoring the specifications of the glued board pieces is provided on the placing table in the receiving elevating 20, and is matched with the model in the system to determine which model the glued board pieces should be classified into.

[0044] S2: Classify the adhesive board parts according to their types and send them to the corresponding cache layers in the cache area 10 for cache.

[0045] Specifically, after the system determines the model of the adhesive plate parts, it notifies the material receiving hoist 20 to drive the adhesive plate parts to stop at the entrance of the cache layer where the corresponding model is located. The material receiving hoist 20 releases the adhesive plate parts and pushes them to the entrance of the cache layer corresponding to the cache area 10. The conveyor belt of the cache layer then drives the adhesive plate parts to move away from the material receiving hoist 20, so that the cache position close to the material receiving hoist 20 is reserved and idle, waiting for the next group of adhesive plate parts of the same model to be placed.

[0046] After the material receiving device 20 delivers the glued board part, it withdraws to its initial position, waits for the transportation of the next glued board part, and repeats steps S1 and S2.

[0047] S3: When the stick gluing machine needs to glue the board parts, it takes out the glued board parts from the buffer area and sends them to the loading platform 60.

[0048] When the system receives a signal that the stick gluing machine needs to glue the board parts, the system notifies the material receiving hoist 20 to stop receiving the glued board parts from the unloading platform 50 and conveying them to the buffer area 10. At the same time, when the glued board parts in the buffer layer match the silicon rod model used by the online stick gluing machine, the glued board parts closest to the material receiving hoist 20 are first removed from the corresponding buffer layer and moved to the placement platform of the material receiving hoist 20 waiting for the glued board parts.

[0049] S4: After the matching, the bonded board parts are transported to the loading platform 60 of the stick bonding machine through the interconnection channel 30.

[0050] The material receiving hoist 20 is controlled to drive the matched adhesive plate parts to rise vertically to the entrance of the interconnecting channel 30, and the matched adhesive plate parts are moved from the placement table to the conveyor belt of the interconnecting channel 30. With the movement of the interconnecting channel 30, the matched adhesive plate parts are driven to flow to the entrance of the material receiving hoist 2 40, and then driven by the material receiving hoist 2 40 to descend to the loading table 60. At this point, the transfer of the adhesive plate parts is completed.

[0051] In this process, the sticky plate parts are sent to the buffer area 10 and taken out from the buffer area 10 and moved to the interconnection channel 30 through the same material receiving device 20, which can not only save equipment turnover, but also save manpower, reduce labor intensity, realize automated interconnection, and improve the industrialization standard of the enterprise.

[0052] When the matched adhesive plate parts are moved into the interconnected channel 30 , the receiving platform 20 quickly returns to the initial position, that is, it resumes receiving the adhesive plate parts from the unloading platform 50 and transporting them to the buffer area 10 .

[0053] Repeat steps S1 to S4 to continue the cycle of delivering the bonded board pieces to the buffer area 10 or taking the bonded board pieces out of the buffer area and delivering them to the loading platform 60 .

[0054] An interconnected transportation device and transportation method for sticky board parts designed by the present invention can automatically identify sticky board parts of different length specifications, and accurately and efficiently transport the sticky board parts of different lengths to a cache layer for caching, and then accurately and quickly take out the sticky board parts of the required length in the production line and transport them through an interconnected mechanism to meet the demand instructions of different production lines, replacing the existing manual identification and transmission, with high work efficiency and high accuracy.

[0055] The above embodiments of the present invention are described in detail, and the contents are only preferred embodiments of the present invention, and cannot be considered to limit the scope of implementation of the present invention. All equivalent changes and improvements made according to the scope of application of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A method for interconnecting and transporting adhesive sheet parts, characterized in that the steps include: Receive the glued board parts unloaded from the gluer and monitor the model of the glued board parts; Classify the adhesive plate parts according to their types, and send the adhesive plate parts to a buffer area for buffering; When the bonding plate piece in the buffer area matches the silicon rod model required by the online stick bonding machine, the matched bonding plate piece is taken out from the buffer area and transported to the working area of ​​the stick bonding machine through the interconnection channel connecting the buffer area and the stick bonding machine; Before the matched adhesive plate parts are moved out of the buffer area, the step of suspending the conveyance of the adhesive plate parts to the buffer area is also included; When the matched adhesive plate pieces are moved into the interconnected channel, the step of resuming the conveying of the adhesive plate pieces to the buffer area is also included; The board-bonding pieces unloaded from the board-bonding machine are transferred to the buffer area, and the board-bonding pieces after being matched are taken out from the buffer area and transferred to the interconnected channel through the same material receiving position; The adhesive plate part model is divided according to the length and / or width of the adhesive plate part; After the system determines the model of the adhesive plate parts, it notifies the material receiving lift to drive the adhesive plate parts to stop at the entrance of the cache layer where the corresponding model is located. The material receiving lift releases the adhesive plate parts and pushes them to the entrance of the cache layer corresponding to the cache area. The conveyor belt of the cache layer then drives the adhesive plate parts to move away from the material receiving lift, so that the cache position close to the material receiving lift is reserved and idle, waiting for the next group of adhesive plate parts of the same model to be placed; After the receiving and lifting equipment has delivered the glued board part, it will retreat to its initial position and wait for the transportation of the next glued board part; The material receiving device is arranged at one side of the entrance of the buffer area and is connected with the unloading place of the board gluing machine; The interconnection channel is placed above the buffer area and is connected to the material receiving device; The cache area includes a plurality of cache layers, and each of the cache layers includes a plurality of cache locations for placing adhesive plate parts of the same specification.

2. A method for interconnecting and transporting adhesive sheet parts according to claim 1, characterized in that: The matched glued board parts are transported to the loading platform of the glued board machine through a material receiving device at a side of the interconnected channel close to the working area of ​​the glued board machine.

3. A method for interconnecting and transporting adhesive sheet parts according to claim 1, characterized in that: The silicon rod matched with the adhesive plate member is a silicon square rod or a silicon round rod.

Images