A floating platform, a plate carrier floating positioning device and a plate carrier feeding system

Abstract

The embodiments of the present application provide a floating platform, a carrier floating positioning device, and a carrier loading system, which relate to the technical field of solar cell production. The floating platform includes a pallet and a base plate, which are connected together by a plurality of horizontal tension springs, and the base plate is superimposed and located below the pallet, and the pallet can be directly superimposed and act on the carrier. The carrier floating positioning device includes: the above-mentioned floating platform, the jacking device is located below the floating platform, and can make the floating platform rise and fall; the clamping mechanism is respectively corresponding to the outside of different edges of the carrier, and is configured to move the carrier and fix the corresponding edges. The floating platform, the carrier floating positioning device, and the carrier loading system realize precise positioning of the carrier and leveling of the plane, thereby improving the accuracy of laying pieces on the carrier.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell production, and in particular to a floating platform, a carrier floating positioning device, and a carrier loading system. Background Art

[0002] Every step in solar cell production is crucial to product quality. During the batch production of thin films on silicon wafers, multiple wafers are placed on a single substrate, which is then fed into a coating machine to deposit thin films. To meet the growing demand for mass production capacity, wafer substrates are becoming increasingly larger, reaching lengths of 1700-1800mm and widths of 1600-1700mm. Furthermore, the positioning accuracy of the substrates must be controlled within a range of ≤±0.5mm. The large size of the substrates increases the difficulty of precise positioning.

[0003] Furthermore, currently, after wafer placement is completed in the atmospheric environment outside the equipment, the carrier enters the coating chamber of the coating equipment to complete thin film deposition on the wafers, and then returns to the atmospheric environment for wafer unloading. Large, metal carriers are repeatedly heated to around 200°C in the coating chamber and cooled to room temperature outside the equipment, causing the center of the carrier to typically sag by approximately 2-4mm. This sag complicates accurate wafer placement.

[0004] Therefore, accurately placing silicon wafers into a large carrier often encounters problems with accurate positioning and leveling of the carrier. Summary of the Invention

[0005] The purpose of the embodiments of the present application is to provide a floating platform, a carrier floating positioning device and a carrier loading system to achieve precise positioning and leveling of the carrier, thereby improving the accuracy of laying out pieces on the carrier.

[0006] In the first aspect, an embodiment of the present application provides a floating platform for supporting the carrier under the support plate. The floating platform includes a support plate and a base plate. The support plate and the base plate are connected together by multiple horizontal tension springs. The base plate is superimposed and located under the support plate, and the support plate can be directly superimposed and act on the carrier.

[0007] In the above implementation process, the floating platform is mainly composed of a support plate, a base plate and a tension spring, which is light and flexible. The tension spring is located between the base plate and the support plate and plays a connecting role, so that the overall shape is still plate-shaped and has a certain strength, which can fully support the carrier plate; at the same time, the tension spring has a rebound force after being subjected to force. Each tension spring is arranged horizontally, and the area between the two connecting ends has better elasticity, thereby ensuring that the floating platform as a whole has a better floating effect.

[0008] In one possible implementation, the support plate is divided into multiple sub-areas, each sub-area is connected to the overlapping area on the base plate by at least three tension springs, all of which are arranged radially, with one end of each tension spring connected to the middle of the sub-area and the other end connected to the overlapping area on the base plate;

[0009] And / or, the pallet is composed of multiple sub-plates laid flat.

[0010] In the above implementation process, the floating platform can be divided into small floating platforms according to the area. Each small floating platform is equipped with a separate tension spring, and the tension springs are arranged radially to cover the entire sub-area, thereby achieving a certain floating effect, thereby ensuring that the overall support effect and floating effect of the floating platform are relatively uniform, and realizing the leveling of the carrier plate.

[0011] In a possible implementation, a protrusion is provided in the middle of the bottom surface of each sub-region, a tension spring is connected to the protrusion, and the bottom plate has a plurality of holes for accommodating each protrusion.

[0012] In the above implementation process, the raised portion on the bottom surface of the support plate facilitates the connection and setting of the tension spring, and the holes on the bottom plate provide the raised portion with a certain amount of movable space, thereby avoiding direct contact between the support plate and the bottom plate to generate hard force and affect the floating effect.

[0013] In a possible implementation, a plurality of balls are further provided between the supporting plate and the base plate, and each ball is mounted on the base plate via a ball seat and can roll on the supporting plate.

[0014] In the above implementation process, the ball bearings can support the support plate to avoid direct contact with the base plate, and the deformation and floating between the support plate and the base plate will not affect each other. In particular, the support plate can maintain a certain flatness under the action of the ball bearings, and the adverse effects of the tension spring between the support plate and the base plate are reduced, so that the tension spring can be deformed and stretched, thereby allowing the support plate and the base plate to move relative to each other, thereby leveling the plane.

[0015] In a second aspect, an embodiment of the present application provides a carrier floating positioning device, comprising:

[0016] The floating platform provided in the first aspect is located below the carrier plate and is capable of supporting the carrier plate;

[0017] A jacking device is located below the floating platform and is capable of lifting and moving the floating platform;

[0018] The clamping mechanisms are located outside different edges of the carrier plate and are configured to move the carrier plate and fix the corresponding edges.

[0019] In this implementation, when the carrier plate moves to the desired loading position, it lies just above the floating platform. The jacking device then pushes the floating platform up to support the carrier plate. The floating platform directly acts on the carrier plate, and upon receiving the push from the side clamping device, it develops a resilient force, converting the rigid force of the jacking device on the carrier plate into a flexible force, thus preventing damage from directly acting on the floating platform. Finally, the carrier plate, supported by the floating platform, is leveled, resolving the problem of a sagging center portion.

[0020] Different clamping mechanisms are set on the outside of different edges of the carrier. After the carrier is leveled, multiple sets of clamping mechanisms are used to move the carrier to the target position and fix it, so as to achieve precise positioning of the carrier.

[0021] In a possible implementation, a plurality of silicon wafer slots for placing silicon wafers are provided in a central region of the carrier, and the floating platform can directly support the central region of the carrier where the silicon wafer slots are provided.

[0022] In the above implementation process, the floating platform corresponds to the cloth area of ​​the carrier plate, ensuring the effect on the concave area of ​​the carrier plate and realizing the unified leveling of the carrier plate.

[0023] In a possible implementation, it further includes two parallel conveyor belts for conveying the carrier plate, the two side edges of the carrier plate are respectively located on different conveyor belts, and the two end edges of the carrier plate are respectively straddled on the two conveyor belts.

[0024] In the above implementation process, the carrier plate can be automatically transported to the loading position for positioning processing via the conveyor belt, without affecting the effect of the jacking device and the floating platform on the carrier plate, and it is also convenient to set up a clamping mechanism and play a positioning role. Specifically, the carrier plate is transported to the loading position via the conveyor belt, and the jacking device and the floating platform lift the carrier plate off the conveyor belt, and the carrier plate is leveled; on this basis, it is convenient for the clamping mechanism to move the carrier plate to complete the deviation correction and fix it. When the fabric is placed on the carrier plate, the clamping mechanism releases the carrier plate, and the carrier plate can quickly return to the conveyor belt under the action of the floating platform and the jacking device, facilitating automatic transportation to the next node.

[0025] In one possible implementation, it includes two groups of first clamping mechanisms respectively located on both side edges of the carrier plate, and two groups of second clamping mechanisms respectively located on both end edges of the carrier plate. The two groups of first clamping mechanisms can be raised and lowered, and can be moved relative to each other to clamp the two side edges of the carrier plate. The two groups of second clamping mechanisms can be raised and lowered, and can be moved relative to each other to clamp the two end edges of the carrier plate.

[0026] In the above implementation process, the carrier plate is moved by the first clamping mechanism and the second clamping mechanism, and the carrier plate is fixed after the edge of the carrier plate is clamped.

[0027] In one possible implementation, each set of first clamping mechanisms includes a push plate capable of accommodating a corresponding edge of the carrier plate and a lifting drive mechanism for driving the push plate to move upward and downward, and at least one set of the first clamping mechanisms further includes a translation drive mechanism for pushing the push plate toward another push plate;

[0028] And / or, a rubber wheel is provided at the position where the first clamping mechanism and / or the second clamping mechanism contacts the carrier plate.

[0029] In the above implementation process, the carrier is fixed by driving the push plate to move the carrier so that the edge of the carrier enters the corresponding push plate. The carrier is precisely positioned by adjusting the position of the push plate. The rubber wheel reduces friction on the carrier and facilitates the movement of the carrier.

[0030] In the third aspect, an embodiment of the present application provides a carrier loading system, which includes a carrier with a side length greater than 1500 mm, a robot and a carrier floating positioning device provided in the second aspect. The carrier can be moved to a floating platform of the carrier floating positioning device, and the robot is located next to the floating platform for placing pieces onto the carrier.

[0031] In the implementation described above, for large-area substrate loading, the floating platform and robotic arm of the substrate floating positioning device are both located at the substrate loading area. The floating positioning device first levels and precisely positions the substrate, and then the robotic arm loads and positions the substrate. The floating positioning device solves the problem of uneven height in the center of the substrate, facilitating robotic arm placement and improving wafer placement accuracy, ultimately ensuring precise wafer loading. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0033] Figure 1 This is a schematic diagram of the structure of a carrier plate floating positioning device provided in an embodiment of this application;

[0034] Figure 2 for Figure 1 A top view of

[0035] Figure 3 for Figure 1 Side view of;

[0036] Figure 4 for Figure 3 Schematic diagram of the structure of the floating platform;

[0037] Figure 5 for Figure 4 Schematic diagram of the decomposed structure;

[0038] Figure 6 for Figure 4 Schematic diagram of the structure from another perspective.

[0039] Icons: 01-carrier; 02-silicon wafer slot; 100-carrier floating positioning device; 110-conveyor belt; 120-floating platform; 121-support plate; 122-hollow hole; 123-bottom plate; 124-tension spring; 125-ball; 126-protrusion; 127-hole; 130-lifting device; 141-left clamping mechanism; 142-right clamping mechanism; 143-push plate; 151-front clamping mechanism; 152-rear clamping mechanism; 153-rubber wheel. DETAILED DESCRIPTION

[0040] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0041] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0042] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments derived by persons of ordinary skill in the art based on the embodiments in this application without creative effort are also within the scope of protection of this application.

[0043] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0044] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of this application is typically placed when in use. These terms are intended solely to facilitate the description of this application and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0045] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0046] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," and "connected" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0047] Please see Figures 1 to 3 , this embodiment provides a carrier floating positioning device 100, which is used to lift and position a carrier 01 for loading silicon wafers. The carrier 01 in the embodiment of the present application mainly refers to a large-sized carrier 01. Each carrier 01 is rectangular with a side length greater than 1500mm. The central area is provided with multiple silicon wafer slots 02 for placing silicon wafers. The bottom surface of the silicon wafer slots 02 is hollow. Normally, the central area occupies 1 / 2-2 / 3 of the area size of the entire carrier 01; each carrier 01 is composed of different sub-carriers arranged side by side. In this embodiment, each carrier 01 is composed of 4 long strip sub-carriers laid side by side. Each sub-carrier is neatly provided with two rows of silicon wafer slots 02 arranged along the length direction. Each row of silicon wafer slots 02 has a total of 8 silicon wafer slots 02, and a total of 8×8 silicon wafer slots 02 are arranged on each carrier 01.

[0048] From the overall structural point of view, the main part of the carrier floating positioning device 100 is located at the loading position, which refers to the position where the carrier 01 stops and is loaded. The carrier floating positioning device 100 includes: two parallel conveyor belts 110 for conveying the carrier 01, a horizontally arranged floating platform 120, a lifting device 130 and multiple sets of clamping mechanisms. The floating platform 120 and the lifting device 130 are located between the two conveyor belts 110. The floating platform 120 can support the carrier 01 from below and has a rebound force after being subjected to force. The lifting device 130 is located below the floating platform 120 and can make the floating platform 120 move up and down; the clamping mechanisms are respectively located on the outside of different edges of the carrier 01 in the loading position and are configured to move the carrier 01 and fix the corresponding edges.

[0049] From the perspective of each part:

[0050] 1. Conveyor belt 110

[0051] The conveyor belt 110 carries the carrier plate 01 from the rear end to the front end. The two sides (left side and right side) of the carrier plate 01 are located on different conveyor belts 110, and the two ends (front end and rear end) of the carrier plate 01 are respectively straddling the two conveyor belts 110.

[0052] 2. Floating Platform 120

[0053] Please see Figure 4-Figure 6 The floating platform 120 can directly support the carrier 01 to set the middle area of ​​the silicon wafer groove 02.

[0054] The floating platform 120 includes a horizontally arranged support plate 121 and a base plate 123. The support plate 121 can directly superimpose on the carrier plate 01 (i.e., directly contact the carrier plate 01), and the base plate 123 is superimposed below the support plate 121. The support plate 121 and the base plate 123 are connected together by multiple tension springs 124. Each tension spring 124 is horizontally arranged (unlike vertically arranged springs), meaning that the projection of the end of the tension spring 124 connected to the support plate 121 onto the base plate 123 is misaligned with the end connected to the base plate 123. Multiple ball bearings 125 are also provided between the support plate 121 and the base plate 123. Each ball bearing 125 is mounted on the base plate 123 through a ball bearing seat and can roll on the support plate 121. The ball bearing 125 is fixed to the base plate by the ball bearing seat, and supports the support plate 121 above it for floating. To ensure the uniformity of the floating effect of the floating platform 120, the floating platform 120 can be divided into segmented areas based on the fabric area of ​​the carrier plate 01. As one implementation method, the support plate 121 is divided into multiple sub-regions. Each sub-region is connected to the overlapping area on the base plate 123 by at least three tension springs 124. All tension springs 124 are arranged radially, with one end of each spring 124 connected to the center of the sub-region and the other end connected to the overlapping area on the base plate 123. The support plate 121 is composed of multiple sub-plates laid flat, with each sub-plate corresponding to a sub-plate of the carrier plate 01. It should be noted that the "overlapping area on the base plate 123" refers to the area on the base plate 123 that completely overlaps with the corresponding sub-region.

[0055] In this embodiment, the support plate 121 is composed of four elongated sub-plates laid side by side, each corresponding to a sub-plate of the carrier plate 01. The support plate 121 is provided with multiple hollow holes 122 corresponding one-to-one with the silicon wafer slots 02. These hollow holes 122 communicate with the hollow holes on the bottom surface of the corresponding silicon wafer slots 02, ensuring that there is no wind resistance as the silicon wafers fall into the silicon wafer slots 02 of the carrier plate 01 during wafer placement. The bottom surface of each sub-area has a raised portion 126 in the middle, to which all tension springs within the sub-area are connected. The bottom plate has multiple holes 127 for accommodating each raised portion 126. Specifically, each sub-plate is neatly arranged with two rows of hollow holes 122 arranged along its length, with each row containing eight hollow holes 122, for a total of 8×8 hollow holes 122 on the support plate 121. All the hollow holes 122 on each sub-plate are grouped into four groups, each group corresponding to a set of tension springs 124. Each group of tension springs 124 consists of four tension springs 124 arranged radially. One end of each tension spring 124 connects to the area between each group of hollow holes 122 on the support plate 121, and the other end connects to the overlapping area on the base plate 123. Each tension spring 124 passes through the area where a corresponding hollow hole 122 is located. Each sub-area is also provided with four ball bearings 125, located between two tension springs 124. The base plate 123 is provided with 4×4 circular holes 127, with one hole 127 corresponding to the overlapping area of ​​each sub-area on the base plate 123. This hole 127 is used to accommodate the raised portion 126 in the center of the sub-area.

[0056] In other embodiments, each sub-area of ​​the support plate 121 corresponds to a group of four tension springs, and each sub-area is also provided with two balls 125. The two balls 125 are located on opposite sides of the circular hole 127 of the sub-area in the overlapping area of ​​the base plate 123, and the area with the two balls 125 and the circular hole 127 is sunken so that a ball seat for mounting the balls 125 can be set in the sunken area; four rectangular strip holes are also provided on the base plate 123 between adjacent rows of circular holes 127 to reduce the overall weight of the base plate 123.

[0057] 3. Lifting device 130

[0058] In this embodiment, the lifting device 130 is a lifting cylinder, whose driving end directly acts on the bottom plate 123 of the floating platform 120. In other embodiments, the lifting device 130 can also be other driving components, or a support plate 121 can be provided at the driving end of the lifting device 130, and the floating platform 120 can be provided on the support plate 121. The lifting device 130 and the support plate 121 form a lifting platform, the area and shape of which also match the fabric area of ​​the carrier plate 01. The height of the lifting platform is adjustable, that is, it can rise and fall synchronously.

[0059] 4. Clamping mechanism

[0060] The clamping mechanism includes two groups of first clamping mechanisms located at both side edges of the carrier 01 (divided into a left clamping mechanism 141 located at the left edge of the carrier 01 and a right clamping mechanism 142 located at the right edge of the carrier 01), and two groups of second clamping mechanisms located at both end edges of the carrier 01 (divided into a front clamping mechanism 151 located at the front end edge of the carrier 01 and a rear clamping mechanism 152 located at the rear end edge of the carrier 01). The two groups of first clamping mechanisms can be lifted and moved, and can be moved relative to each other to clamp the two side edges of the carrier 01. The two groups of second clamping mechanisms can be lifted and moved, and can be moved relative to each other to clamp the two end edges of the carrier 01. Rubber wheels 153 are provided at the positions where the first clamping mechanisms and the second clamping mechanisms contact the carrier 01.

[0061] Each set of first clamping mechanisms includes a push plate 143 capable of accommodating the corresponding edge of carrier plate 01 and a drive mechanism for driving push plates 143 up and down. Push plates 143 are made of I-shaped steel and are equipped with rubber wheels 153 where they contact carrier plate 01. At least one set of first clamping mechanisms also includes a drive mechanism for pushing push plates 143 toward the other push plates 143. Each set of first clamping mechanisms may contain at least one, and the drive mechanism may be, but is not limited to, a servo mechanism + cylinder combination. In addition to lateral movement of carrier plate 01, the first clamping mechanism can also correct the rotational angle of carrier plate 01.

[0062] One set of second clamping mechanisms (front clamping mechanism 151) includes a hook capable of hooking onto the corresponding edge of carrier plate 01 and a drive mechanism for driving the hook up, down, and in translation. The other set of second clamping mechanisms (rear clamping mechanism 152) includes a blocking portion for blocking the corresponding edge of carrier plate 01 and a drive mechanism for driving the blocking portion up, down, and in translation. Each set of second clamping mechanisms may contain at least one, and the drive mechanism may be, but is not limited to, a servo mechanism + cylinder combination. The second clamping mechanisms are primarily used to move carrier plate 01 in the two-way direction.

[0063] Camera devices (CDD cameras) are also provided at different positions of the floating platform 120, which cooperate with the clamping mechanism to facilitate the clamping mechanism to accurately calculate and correct the position and angle of the carrier 01, and output an alarm function when the value exceeds the range, thereby realizing the light, fast and accurate positioning of the carrier 01.

[0064] The working process of the carrier floating positioning device 100 is as follows:

[0065] The conveyor belt 110 carries the carrier plate 01 to the loading position, and the lifting device 130 cooperates with the floating platform 120 to lift the carrier plate 01 away from the conveyor belt 110, thus completing the leveling of the carrier plate 01, and the carrier plate 01 is fixed at the height Z position.

[0066] The clamping mechanism corrects and positions the carrier plate 01. The first clamping mechanism pushes the push plate 143 to move upwards and backwards, thereby correcting and positioning the two side edges of the carrier plate 01. The second clamping mechanism pushes the hook and the blocking plate to move upwards and backwards, thereby correcting and positioning the two end edges of the carrier plate 01, allowing the carrier plate 01 to move within a range of ±50mm. The position of the carrier plate 01 in the X, Y, and angular directions within the overall plane is adjusted and fixed. After the clamping mechanisms around the carrier plate 01 are released, the carrier plate 01 automatically returns to its original position.

[0067] Specifically, the driving mechanism of the left clamping mechanism 141 is composed of two servo motors, the driving mechanism of the right clamping mechanism 142 is composed of two cylinders, the front clamping mechanism 151 is composed of a rising cylinder + servo hook, and the rear clamping mechanism 152 is composed of a rising cylinder + clamping cylinder. After the carrier plate 01 is lifted by the lifting device 130, the left clamping mechanism 141 and the right clamping mechanism 142 act first, and the servo motor pushes the carrier plate 01 to the standby position. Then the front clamping mechanism 151 and the rear clamping mechanism 152 act: the front clamping mechanism 151 and the rear clamping mechanism 152 perform the lifting action, and the front servo hook and the rear clamping cylinder push the carrier plate 01 to move back and forth through the blocking part. When it reaches a standby position, the cross mark point of the carrier plate 01 is photographed. The PC analyzes the image captured by the camera device and adjusts the servo system again to calculate the offset. The carrier plate 01 is moved and photographed again for comparison. If the value fed back by the photograph is within the set range, the positioning is completed. If it is not within the range, the PC interface will display that repositioning is required, and manual confirmation is required.

[0068] The rubber wheels 153 contact the carrier board 01 on the left clamping mechanism 141 and the right clamping mechanism 142 . Therefore, even after the left clamping mechanism 141 and the right clamping mechanism 142 clamp the carrier board 01 , the carrier board 01 can still move flexibly forward and backward.

[0069] The left clamping mechanism 141 has two servo motors, and the front clamping mechanism 151 has one servo motor. Together, they can fix the corresponding sides of the carrier plate 01 and rotate and adjust its angle, thereby correcting the plane of the carrier plate 01 to make it horizontal.

[0070] This embodiment also provides a carrier loading system, which includes a carrier, a robot and the above-mentioned carrier floating positioning device. The carrier can be moved to the floating platform of the carrier floating positioning device, and the robot is located next to the floating platform for placing pieces on the carrier.

[0071] The working process of the board loading system is as follows:

[0072] After the carrier plate floating positioning device levels the plane and corrects the deviation (X, Y, Z and angle) of the carrier plate, the robot is used to load the cloth onto the carrier plate. After the cloth is loaded, the clamping mechanism releases the clamping of the carrier plate, and then the carrier plate is slowly lowered back to the conveyor belt by the jacking device and the floating platform, and is transported to the deposition equipment by the conveyor belt.

[0073] In summary, the floating platform, the carrier floating positioning device, and the carrier loading system of the embodiments of the present application achieve precise positioning and leveling of the carrier, thereby improving the accuracy of placing pieces on the carrier.

[0074] The above description is merely an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, various modifications and variations of the present application are possible. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A floating platform, used to support the carrier board under the carrier board, characterized in that: The floating platform includes a support plate and a bottom plate, the support plate and the bottom plate are connected together by a plurality of horizontal tension springs, the bottom plate is superimposed and located below the support plate, and the support plate can directly superimpose and act on the carrier plate; The support plate is divided into multiple sub-areas, each of which is connected to the overlapping area on the base plate by at least three tension springs, all of which are arranged radially, with one end of each tension spring connected to the middle of the sub-area and the other end connected to the overlapping area on the base plate.

2. The floating platform according to claim 1, characterized in that: The support plate is composed of a plurality of sub-plates laid flat.

3. The floating platform according to claim 1, characterized in that: A protrusion is provided in the middle of the bottom surface of each sub-area, the tension spring is connected to the protrusion, and the bottom plate has a plurality of holes for accommodating each protrusion.

4. The floating platform according to claim 1, characterized in that: A plurality of balls are also arranged between the support plate and the base plate. Each of the balls is mounted on the base plate through a ball seat and can roll on the support plate.

5. A floating positioning device for a carrier plate, characterized in that: It includes: The floating platform according to any one of claims 1 to 4, wherein the floating platform is located below the carrier plate and is capable of supporting the carrier plate; A lifting device, which is located below the floating platform and can lift and lower the floating platform; The clamping mechanisms are respectively located outside different edges of the carrier plate and are configured to move the carrier plate and fix the corresponding edges.

6. The floating positioning device for a carrier plate according to claim 5, characterized in that: The middle area of ​​the carrier is provided with a plurality of silicon wafer slots for placing silicon wafers, and the floating platform can directly support the middle area of ​​the carrier where the silicon wafer slots are provided.

7. The floating positioning device for a carrier plate according to claim 5, characterized in that: It also includes two parallel conveyor belts for conveying the carrier plate, the two side edges of the carrier plate are respectively located on different conveyor belts, and the two end edges of the carrier plate are respectively straddled on the two conveyor belts.

8. The floating positioning device for a carrier plate according to claim 5 or 7, characterized in that: It includes two groups of first clamping mechanisms respectively located at the two side edges of the carrier plate, and two groups of second clamping mechanisms respectively located at the two end edges of the carrier plate. The two groups of the first clamping mechanisms can be lifted and moved, and can be moved relatively to clamp the two side edges of the carrier plate. The two groups of the second clamping mechanisms can be lifted and moved, and can be moved relatively to clamp the two end edges of the carrier plate.

9. The floating positioning device for a carrier plate according to claim 8, characterized in that: Each set of the first clamping mechanisms includes a push plate capable of accommodating the corresponding edge of the carrier plate and a lifting drive mechanism for driving the push plate to move up and down, and at least one set of the first clamping mechanisms also includes a translation drive mechanism for pushing the push plate to move toward another push plate; And / or, a rubber wheel is provided at the position where the first clamping mechanism and / or the second clamping mechanism contacts the carrier plate.

10. A board loading system, characterized in that: It includes a carrier with a side length greater than 1500mm, a manipulator and a carrier floating positioning device as described in any one of claims 5 to 9, the carrier can be moved to the floating platform of the carrier floating positioning device, and the manipulator is located next to the floating platform for placing pieces on the carrier.

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