A small-sized microchannel-based ferrite heat dissipation system and its preparation method

By machining microchannels on the surface of ferrite and filling them with coolant, the problem of heat accumulation in ferrite is solved, and efficient heat dissipation and miniaturization design are achieved, which is suitable for high integrated circuits.

CN115551321BActive Publication Date: 2025-10-10HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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Patent Information

Application Number
CN202211324291.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2022-02-17
Filing Date
2022-10-27
Publication Date
2025-10-10
Estimated Expiration
2042-10-27

AI Technical Summary

Technical Problem

In the existing technology, the heat accumulation generated by ferrite under the action of high-frequency electromagnetic fields causes a decrease in magnetic permeability, and the traditional passive heat dissipation design is inefficient and increases the volume, limiting its application in highly integrated micro-nano precision fields.

Method used

Microchannels are machined on the surface of the ferrite, and microchannel tubes are formed in the grooves through additive manufacturing technology. These tubes are then filled with coolant to form a small-sized microchannel heat dissipation system, which uses coolant to remove heat.

Benefits of technology

It effectively reduces heat accumulation, improves high-temperature service capability, and reduces the volume of the heat dissipation system by approximately 50%, making it suitable for digital energy circuits with high integration density.

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Abstract

The application provides a small-size micro-channel-based ferrite heat dissipation system, which comprises a ferrite, a groove is arranged on the surface of the ferrite, a micro-channel pipe is arranged on the groove, and cooling liquid is arranged in the micro-channel pipe. The application also provides a preparation method of the small-size micro-channel-based ferrite heat dissipation system. The application has the beneficial effects of: (1) effectively reducing heat accumulation in the working process, and greatly improving high-temperature service capability; (2) the ferrite and the heat dissipation system composite module reduce the volume by about 50%, and are more suitable for focused heating and welding of high-integration-density digital energy circuits.
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Description

TECHNICAL FIELD

[0001] The present application relates to a magnetic conductor heat dissipation system, and particularly relates to a small-size micro-channel-based ferrite heat dissipation system and a preparation method thereof. BACKGROUND

[0002] Ferrite is a kind of metal and its alloy with magnetism. Due to its high resistivity, good insulation performance and high permeability, it is widely used in new energy vehicles, 5G communication, Internet and other fields. However, under the action of high-frequency electromagnetic field, a relatively high temperature is still generated, and the magnetic permeability of ferrite will decrease with the increase of temperature. When the temperature of ferrite is higher than the Curie temperature of the material, the magnetic conductor fails. Therefore, the accumulation of heat during the operation of ferrite will greatly limit the application and promotion of ferrite, and even have a destructive effect on high-power high-integration electronic devices. The existing solution is mainly to install a heat sink on the surface of the ferrite. This passive heat dissipation design not only has low heat dissipation efficiency, but also increases the volume of the ferrite module, which greatly limits the application of ferrite in the field of high-integration micro-nano precision. SUMMARY

[0003] In order to solve the problems in the prior art, the present application provides a small-size micro-channel-based ferrite heat dissipation system and a preparation method thereof.

[0004] The present application provides a small-size micro-channel-based ferrite heat dissipation system, which comprises a ferrite. A groove is arranged on the surface of the ferrite. A micro-channel pipe is arranged on the groove. A cooling liquid is arranged in the micro-channel pipe.

[0005] As a further improvement of the present application, the groove is a U-shaped groove or an arc-shaped groove, and the diameter size is between 1 mu m and 100 mu m.

[0006] As a further improvement of the present application, the pitch of the groove is between 2 mu m and 500 mu m.

[0007] As a further improvement of the present application, the outer surface diameter of the micro-channel pipe is the same as the inner surface diameter of the groove.

[0008] As a further improvement of the present application, the ferrite is a soft magnetic ferrite made of a magnetic material with magnetic conductivity, mainly a magnetic material with magnetic conductivity made of zinc, manganese, magnesium, lithium and the like.

[0009] As a further improvement of the present application, an inlet valve is arranged at the inlet of the micro-channel pipe, and an outlet valve is arranged at the outlet of the micro-channel pipe.

[0010] As a further improvement of the present application, the inlet valve adopts a high-sealing non-metallic fluid valve, and the outlet valve adopts a high-sealing non-metallic fluid valve.

[0011] The present invention also provides a method for preparing a small-sized microchannel-based ferrite heat dissipation system, comprising the following steps:

[0012] S1. Processing grooves on the surface of ferrite;

[0013] S2. A microfluidic tube is formed on the groove through an additive manufacturing process, and then a coolant is introduced into the microfluidic tube.

[0014] As a further improvement of the present invention, the groove is preferably manufactured by laser etching or micromachining.

[0015] As a further improvement of the present invention, the microchannel is manufactured by additive manufacturing, and the material used is a high-temperature resistant and high-thermal conductive material, with ceramic material being preferred.

[0016] As a further improvement of the present invention, in step S1, after the groove is machined, the surface of the groove is micro-machined to provide a high thermal conductivity and smooth interface for additive manufacturing of the microfluidic tube.

[0017] As a further improvement of the present invention, in step S2, the forming process of the microfluidic tube is: firstly filling a part of the microfluidic tube in the groove, and then filling the complete circular tube-shaped microfluidic tube.

[0018] As a further improvement of the present invention, the grooves are evenly distributed on the surface of the ferrite.

[0019] As a further improvement of the present invention, the diameter of the particles produced by additive manufacturing is between 50 nm and 500 μm.

[0020] As a further improvement of the present invention, the coolant is a liquid with high melting point and good flow properties, and a common water-based coolant is preferably used.

[0021] As a further improvement of the present invention, the ferrite is in the shape of various common ferrite shapes. Taking the conical ferrite heated by high-frequency focused induction welding as an example, the top surface diameter is 1-50 mm and the height is 5-75 mm.

[0022] As a further improvement of the present invention, the ferrite is in a high-temperature service working state and can work continuously for a long time.

[0023] As a further improvement of the present invention, the operating frequency of the ferrite is within 10 MHz, and most commonly between 1 KHz and 10 MHz.

[0024] As a further improvement of the present invention, the temperature of the coolant is maintained below 25° C. by circulating refrigeration in a refrigerator, and can continue to work stably for more than 1000 hours.

[0025] The beneficial effects of the present invention are:

[0026] (1) Effectively reduce heat accumulation during the working process and greatly improve high-temperature service capability;

[0027] (2) The ferrite and heat dissipation system composite module reduces the volume by about 50%, making it more suitable for focused heating and welding of high-integration-density digital energy circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other solutions can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 It is a structural diagram of embodiment 1 of the present invention.

[0030] Figure 2 It is a structural diagram of embodiment 2 of the present invention.

[0031] Figure 3 It is a structural diagram of embodiment 3 of the present invention.

[0032] Figure 4 It is a structural diagram of embodiment 4 of the present invention.

[0033] Figure 5 It is a cross-sectional view of the groove manufacturing process of the present invention.

[0034] Figure 6 It is a cross-sectional view of the additive manufacturing process flow of the present invention. DETAILED DESCRIPTION

[0035] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features in the embodiments may be combined with each other.

[0036] In the description of the present application, it is to be understood by those skilled in the art that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second" and the like are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" and the like can be explicitly or implicitly included one or more. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0037] In the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood through specific circumstances.

[0038] The present application is further described below in conjunction with the drawings and specific embodiments.

[0039] Example one

[0040] As shown in Figure 1 , a small size micro-channel based ferrite heat dissipation system, the ferrite heat dissipation system includes ferrite 1, groove 6, micro-channel pipe 3, cooling liquid 5, inlet valve 4, outlet valve 2.

[0041] The groove 6 is on the surface of the ferrite 1, the micro-channel pipe 3 is in the groove 6, the cooling liquid 5 is inside the micro-channel pipe 3, and the inlet valve 4 and the outlet valve 2 are at the two ports of the micro-channel pipe 3.

[0042] The groove 6 is preferably an arc-shaped groove.

[0043] The micro-channel system formed by the micro-channel pipe 3 and the flow path, as shown in Figure 1 , is a micro-flow channel composed of a plurality of 6-sided structures.

[0044] In this embodiment, the manufacturing process of the ferrite heat dissipation system is as follows:

[0045] (1) Place the conical ferrite 1 on the processing platform;

[0046] Will Figure 1 The graphic scheme is input into the laser etching equipment to complete the etching path acquisition work;

[0047] (2) The laser etching process steps are as follows:

[0048] Step 1: Place ferrite 1 on a fixed processing platform, such as Figure 5 As shown in (a);

[0049] Step 2: Based on the set parameters, use high-power semiconductor laser or fiber laser to scan and etch the ferrite surface to etch arc-shaped grooves, such as Figure 5 As shown in (b);

[0050] Step 3: Use picosecond laser etching to perform micro-machining on the arc groove to provide a high thermal conductivity smooth interface for the additive manufacturing of the microfluidic tube 3, such as Figure 5 As shown in (c);

[0051] (3) Execute the additive manufacturing process steps:

[0052] Step 1: On the manufactured arc groove, perform additive manufacturing on the surface of the arc groove, first fill part of the micro channel tube 3 in the arc of the arc groove, such as Figure 6 As shown in (a);

[0053] Step 2: Fill the complete circular microfluidic tube 3, such as Figure 6 As shown in (b);

[0054] Step 3: Pass coolant 5 to check the integrity and reliability of the microchannel, such as Figure 6 As shown in (c) in the figure.

[0055] (4) The water inlet is connected to the inlet valve 4;

[0056] (5) The water outlet is connected to the outlet valve 2;

[0057] (6) In actual use of the ferrite heat dissipation system based on small-sized microchannels in Example 1, the heat generated by the ferrite 1 during operation is transferred to the microchannel tube 3, and the heat of the microchannel tube 3 is taken away by the coolant 5 inside the microchannel tube 3, thereby achieving heat dissipation of the ferrite 1.

[0058] Example 2

[0059] like Figure 2 As shown, a small-sized microchannel-based ferrite heat dissipation system includes a ferrite 1, a groove 6, a microchannel tube 3, a coolant 5, an inlet valve 4, and an outlet valve 2.

[0060] The groove 6 is on the surface of the ferrite 1 , the microchannel tube 3 is in the groove 6 , the coolant 5 is inside the microchannel tube 3 , and the inlet valve 4 and the outlet valve 2 are at two ends of the microchannel tube 3 .

[0061] The groove 6 is preferably an arc-shaped groove.

[0062] The microfluidic system and flow path formed by the microfluidic tube 3 are as follows: Figure 2 As shown, it is a microfluidic channel composed of a curved structure.

[0063] In this embodiment, the manufacturing process of the ferrite microchannel heat dissipation system is as follows:

[0064] (1) Place the conical ferrite 1 on the processing platform;

[0065] Will Figure 1 The graphic scheme is input into the laser etching equipment to complete the etching path acquisition work;

[0066] (2) The laser etching process steps are as follows:

[0067] Step 1: Place ferrite 1 on a fixed processing platform, such as Figure 5 As shown in (a);

[0068] Step 2: Based on the set parameters, use high-power semiconductor laser or fiber laser to scan and etch the ferrite surface to etch arc-shaped grooves, such as Figure 5 As shown in (b);

[0069] Step 3: Use picosecond laser etching to perform micro-machining on the arc groove to provide a high thermal conductivity smooth interface for the additive manufacturing of the microfluidic tube 3, such as Figure 5 As shown in (c);

[0070] (3) Execute the additive manufacturing process steps:

[0071] Step 1: On the manufactured arc groove, perform additive manufacturing on the surface of the arc groove, first fill part of the micro channel tube 3 in the arc of the arc groove, such as Figure 6 As shown in (a);

[0072] Step 2: Fill the complete circular microfluidic tube 3, such as Figure 6 As shown in (b);

[0073] Step 3: Pass coolant 5 to check the integrity and reliability of the microchannel, such as Figure 6 As shown in (c) in the figure.

[0074] (4) The water inlet is connected to the inlet valve 4;

[0075] (5) The water outlet is connected to the outlet valve 2;

[0076] (6) In the actual use of the ferrite heat dissipation system based on small-sized microchannels in Example 2, the heat generated by the ferrite 1 during operation is transferred to the microchannel tube 3, and the heat of the microchannel tube 3 is taken away by the coolant 5 inside the microchannel tube 3, thereby achieving heat dissipation for the ferrite 1.

[0077] Example 3

[0078] like Figure 3 As shown, a small-sized microchannel-based ferrite heat dissipation system includes a ferrite 1, a groove 6, a microchannel tube 3, a coolant 5, an inlet valve 4, and an outlet valve 2.

[0079] The groove 6 is on the surface of the ferrite 1 , the microchannel tube 3 is in the groove 6 , the coolant 5 is inside the microchannel tube 3 , and the inlet valve 4 and the outlet valve 2 are at two ends of the microchannel tube 3 .

[0080] The groove 6 is preferably an arc-shaped groove.

[0081] The microfluidic system and flow path formed by the microfluidic tube 3 are as follows: Figure 3 As shown, a microfluidic channel composed of multiple well-shaped structures.

[0082] In this embodiment, the manufacturing process of the ferrite microchannel heat dissipation system is as follows:

[0083] (1) Place the conical ferrite 1 on the processing platform;

[0084] Will Figure 1 The graphic scheme is input into the laser etching equipment to complete the etching path acquisition work;

[0085] (2) The laser etching process steps are as follows:

[0086] Step 1: Place ferrite 1 on a fixed processing platform, such as Figure 5 As shown in (a);

[0087] Step 2: Based on the set parameters, use high-power semiconductor laser or fiber laser to scan and etch the ferrite surface to etch arc-shaped grooves, such as Figure 5 As shown in (b);

[0088] Step 3: Use picosecond laser etching to perform micro-machining on the arc groove to provide a high thermal conductivity smooth interface for the additive manufacturing of the microfluidic tube 3, such as Figure 5 As shown in (c);

[0089] (3) Execute the additive manufacturing process steps:

[0090] Step 1: On the manufactured arc groove, perform additive manufacturing on the surface of the arc groove, first fill part of the micro channel tube 3 in the arc of the arc groove, such as Figure 6 As shown in (a);

[0091] Step 2: Fill the complete circular microfluidic tube 3, such as Figure 6 As shown in (b);

[0092] Step 3: Pass coolant 5 to check the integrity and reliability of the microchannel, such as Figure 6 As shown in (c) in the figure.

[0093] (4) The water inlet is connected to the inlet valve 4;

[0094] (5) The water outlet is connected to the outlet valve 2;

[0095] (6) In the actual use of the ferrite heat dissipation system based on small-sized microchannels in Example 3, the heat generated by the ferrite 1 during operation is transferred to the microchannel tube 3, and the heat of the microchannel tube 3 is taken away by the coolant 5 inside the microchannel tube 3, thereby achieving heat dissipation of the ferrite 1.

[0096] Example 4

[0097] like Figure 4 As shown, a small-sized microchannel-based ferrite heat dissipation system includes a ferrite 1, a groove 6, a microchannel tube 3, a coolant 5, an inlet valve 4, and an outlet valve 2.

[0098] The groove 6 is on the surface of the ferrite 1 , the microchannel tube 3 is in the groove 6 , the coolant 5 is inside the microchannel tube 3 , and the inlet valve 4 and the outlet valve 2 are at two ends of the microchannel tube 3 .

[0099] The groove 6 is preferably an arc-shaped groove.

[0100] The microfluidic system and flow path formed by the microfluidic tube 3 are as follows: Figure 4 As shown, a microfluidic channel composed of multiple rectangular structures.

[0101] In this embodiment, the manufacturing process of the ferrite microchannel heat dissipation system is as follows:

[0102] (1) Place the conical ferrite 1 on the processing platform;

[0103] Will Figure 1 The graphic scheme is input into the laser etching equipment to complete the etching path acquisition work;

[0104] (2) The laser etching process steps are as follows:

[0105] Step 1: Place ferrite 1 on a fixed processing platform, such as Figure 5 As shown in (a);

[0106] Step 2: Based on the set parameters, use high-power semiconductor laser or fiber laser to scan and etch the ferrite surface to etch arc-shaped grooves, such as Figure 5 As shown in (b);

[0107] Step 3: Use picosecond laser etching to perform micro-machining on the arc groove to provide a high thermal conductivity smooth interface for the additive manufacturing of the microfluidic tube 3, such as Figure 5 As shown in (c);

[0108] (3) Execute the additive manufacturing process steps:

[0109] Step 1: On the manufactured arc groove, perform additive manufacturing on the surface of the arc groove, first fill part of the micro channel tube 3 in the arc of the arc groove, such as Figure 6 As shown in (a);

[0110] Step 2: Fill the complete circular microfluidic tube 3, such as Figure 6 As shown in (b);

[0111] Step 3: Pass coolant 5 to check the integrity and reliability of the microchannel, such as Figure 6 As shown in (c) in the figure.

[0112] (4) The water inlet is connected to the inlet valve 4;

[0113] (5) The water outlet is connected to the outlet valve 2;

[0114] (6) In the actual use of the ferrite heat dissipation system based on small-sized microchannels in Example 4, the heat generated by the ferrite 1 during operation is transferred to the microchannel tube 3, and the heat of the microchannel tube 3 is taken away by the coolant 5 inside the microchannel tube 3, thereby achieving heat dissipation of the ferrite 1.

[0115] The present invention provides a small-sized ferrite heat dissipation system based on microfluidic channels, which has the following advantages: compared with the heat dissipation design of installing a heat sink on the ferrite surface, the heat dissipation design of the present invention based on the microfluidic channels on the ferrite surface can (1) effectively reduce heat accumulation during the working process and greatly improve the high-temperature service capability; (2) the volume of the ferrite and heat dissipation system composite module is reduced by about 50%, which is more suitable for focused heating and welding of high-integration-density digital energy circuits.

[0116] The above is a further detailed description of the present invention in conjunction with specific preferred embodiments, and the specific implementation of the present invention should not be considered to be limited to these descriptions. For those skilled in the art of the present invention, without departing from the concept of the present invention, several simple deductions or substitutions can be made, which should be considered to fall within the scope of protection of the present invention.

Claims

1. A method for preparing a ferrite heat dissipation system based on microchannels, characterized in that: A small-sized microchannel-based ferrite heat dissipation system is prepared, comprising a ferrite, a groove provided on the surface of the ferrite, a microchannel tube provided on the groove, a coolant provided in the microchannel tube, the groove being a U-shaped groove or an arc-shaped groove with a diameter between 1 μm and 100 μm, the outer diameter of the microchannel tube being the same as the inner diameter of the groove, the ferrite being a soft magnetic ferrite made of a magnetic material having magnetic conductivity, an inlet valve provided at the inlet of the microchannel tube, and an outlet valve provided at the outlet of the microchannel tube, the inlet valve being a highly sealed non-metallic fluid valve, and the outlet valve being a highly sealed non-metallic fluid valve; The preparation method comprises the following steps: S1. Processing grooves on the surface of ferrite; S2, forming a microfluidic tube on the groove through an additive manufacturing process, and then passing a coolant into the microfluidic tube; In step S1, after the grooves are machined, the surface of the grooves is micro-machined to provide a high thermal conductivity and smooth interface for additive manufacturing of the microchannel tube; the grooves are evenly distributed on the surface of the ferrite; In step S2 , the microfluidic tube is formed by first filling a portion of the microfluidic tube in the groove, and then filling the groove with a complete annular microfluidic tube.

2. The method for preparing a small-sized microchannel-based ferrite heat dissipation system according to claim 1, characterized in that: The pitch of the grooves is between 2 μm and 500 μm.

Citation Information

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