Simulation method and device of multi-physical field coupling resonator, storage medium and terminal

Abstract

The application discloses a simulation method and device of a multi-physical field coupling resonator, a storage medium and a terminal, wherein the method comprises the following steps: acquiring a resonator model to be solved; identifying a plurality of physical fields in the resonator model to be solved; performing cubic grid division on the resonator model to be solved, and dividing the resonator model to be solved after the grid division into a plurality of grid areas; and acquiring system matrices of all the grid areas by using a finite element method; wherein a degree of freedom vector in the system matrices comprises physical field components of the plurality of physical fields in the resonator model to be solved; the system matrices of all the grid areas are sequentially spliced based on a coupling mode of the same physical field components in the matrices, so as to acquire the system matrices of the resonator model to be solved; and the system matrices of the resonator model to be solved are solved, so as to acquire a target solving physical quantity. The application realizes the simulation combination of the plurality of physical fields in the resonator, reduces the solving time, and also reduces the memory required for calculating the matrices.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of resonator simulation, and in particular to a simulation method and device for a multi-physical-field coupled resonator, a storage medium and a terminal. BACKGROUND

[0002] Finite element method (FEM) is a numerical technique for finding approximate solutions to boundary value problems for partial differential equations, which is applied to differential equations describing physical fields and can accurately calculate the characteristics of physical fields. The emergence of finite element technology has brought great convenience to the simulation design of physical fields and increased the reliability of simulation guided design. In order to ensure the solution accuracy, the grid needs to be densely divided in the application of finite element method to physical fields. However, as the volume of the model increases, the number of finite element division grids also increases, and the number of degrees of freedom also increases sharply, greatly prolonging the solution time and increasing the requirement for memory.

[0003] The operation process of existing finite element analysis software on physical fields generally includes: first, dividing the model into grids, then assembling the divided grids into a larger finite element system matrix equation set, and finally directly solving the equation set. However, the solution time of the matrix formed by using this method has a certain relationship with the size of the matrix, and many degrees of freedom in the matrix solution process are not used, so that they can only be "thrown away" after being solved, greatly wasting the calculation time and calculation resources. At the same time, the matrix is too large, and the requirement for the memory of the graphics processing unit is too high, and the memory of the general graphics processing unit is difficult to meet the requirements.

[0004] At present, the simulation of resonators is only limited to the piezoelectric physical field level, which has no effect on general resonators, but for XBAR and other suspended film resonators and resonators carrying microstrip lines, the traditional piezoelectric physical field cannot simply meet the simulation requirements. SUMMARY

[0005] The technical problem to be solved by the present application is that the current simulation of resonators can only be limited to the piezoelectric physical field level, and cannot realize the simulation of multi-physical-field resonators, and the existing simulation of physical fields using finite element analysis method has the problems of great waste of calculation time and calculation resources, and great memory requirement.

[0006] In order to solve the above technical problems, the present application provides a simulation method for a multi-physical-field coupled resonator, comprising:

[0007] obtaining a resonator model to be solved, and identifying a plurality of physical fields in the resonator model to be solved;

[0008] The resonator model to be solved is divided into a cubic grid, and the resonator model to be solved after the grid division is divided into a plurality of grid areas, and a system matrix of all the grid areas is obtained by a finite element method, wherein a degree of freedom vector in the system matrix contains physical field components of a plurality of physical fields in the resonator model to be solved;

[0009] Based on the way of coupling the same physical field components in the matrix, all the grid areas are sequentially spliced to obtain a system matrix of the resonator model to be solved;

[0010] The system matrix of the resonator model to be solved is solved to obtain a target solution physical quantity;

[0011] Preferably, each of the grid areas includes at least two grid blocks, and when a certain physical field does not exist in the grid area, the corresponding physical field component in the degree of freedom vector of the grid area system matrix is zero.

[0012] Preferably, the physical fields of the resonator three-dimensional model include at least two of piezoelectric physical fields, electromagnetic fields and thermal fields.

[0013] Preferably, the matrix of the piezoelectric physical field satisfies the following form:

[0014]

[0015] Wherein, the matrix containing a element is the stiffness matrix of the piezoelectric physical field, the matrix containing x, y, z, V elements is the degree of freedom vector of the piezoelectric physical field, and the matrix containing f component is the load vector;

[0016] The electromagnetic field matrix satisfies the following form:

[0017]

[0018] Wherein, the matrix containing b element is the stiffness matrix of the electromagnetic field, the matrix containing A x , A y , A z , V elements is the degree of freedom vector of the electromagnetic field, and the matrix containing f' component is the load vector of the electromagnetic field;

[0019] The matrix of the thermal physical field satisfies the following form:

[0020]

[0021] Wherein, the matrix containing C element is the stiffness matrix of the thermal physical field, the matrix containing T element is the degree of freedom vector of the thermal physical field, and the matrix containing f" component is the load vector of the thermal physical field.

[0022] Preferably, the system matrix of the grid region is obtained by a finite element method, and the system matrix of the grid region comprises:

[0023] The stiffness matrix, the mass matrix and the load vector of the grid region are obtained, and the stiffness matrix, the mass matrix and the load vector satisfy:

[0024] [A]=[K-ω 2 M],[A]·[x]=[F]

[0025] wherein K is the stiffness matrix of the grid region, ω=2πf is an angular frequency, M is the mass matrix of the grid region, x is the degree of freedom vector of the grid region, F is the load vector of the grid region, and A is the system matrix of the grid region.

[0026] Preferably, the splicing process of the grid region comprises:

[0027] The system matrix of a target grid region and the system matrix of a grid region to be spliced are expanded;

[0028] The expanded system matrix of the target grid region and the system matrix of the grid region to be spliced are spliced based on a splicing surface to obtain a splicing matrix of a spliced region;

[0029] Irrelevant degrees of freedom in the splicing matrix of the spliced region are eliminated to obtain a system matrix of the spliced region;

[0030] wherein the system matrix of the target grid region is a system matrix of a spliced region obtained by previous splicing, the system matrix of the grid region to be spliced only comprises degrees of freedom of the splicing surface and degrees of freedom to be solved, and a shared surface of the target grid region and the grid region to be spliced is taken as the splicing surface.

[0031] Preferably, if two grid unit structures are completely identical, the system matrices of the two grid unit structures are also identical.

[0032] Preferably, the simulation method of the multi-physical field coupling resonator is realized by a central processing unit or a graphic processing unit, or the simulation method of the multi-physical field coupling resonator is realized by the central processing unit and the graphic processing unit together.

[0033] To solve the above technical problems, the application further provides a simulation device of a multi-physical field coupling resonator, comprising a model acquisition module, a grid region acquisition module, a splicing module and a solving module.

[0034] The model acquisition module is used to acquire a resonator model to be solved and identify a plurality of physical fields in the resonator model to be solved.

[0035] The grid region acquisition module is configured to perform cubic grid division on the to-be-solved resonator model, divide the to-be-solved resonator model after the grid division into a plurality of grid regions, and acquire system matrices of all the grid regions by using the finite element method, wherein a degree of freedom vector in the system matrix contains physical field components of a plurality of physical fields in the to-be-solved resonator model.

[0036] The splicing module is configured to sequentially splice all the grid regions based on a coupling manner of the same physical field components in the matrix, so as to acquire the system matrix of the to-be-solved resonator model.

[0037] The solving module is configured to solve the system matrix of the to-be-solved resonator model, so as to acquire a target solving physical quantity.

[0038] Each of the grid regions contains at least two grid blocks, and when a certain physical field does not exist in the grid region, the corresponding physical field component in the degree of freedom vector of the grid region system matrix is zero.

[0039] To solve the above technical problem, the application further provides a storage medium having a computer program stored thereon, and the program is executed by a processor to implement the simulation method of the multi-physical field coupled resonator.

[0040] To solve the above technical problem, the application further provides a terminal, which comprises a processor and a memory in communication connection with the processor.

[0041] The memory is configured to store a computer program, and the processor is configured to execute the computer program stored in the memory, so that the terminal executes the simulation method of the multi-physical field coupled resonator.

[0042] Compared with the prior art, one or more embodiments of the above scheme can have the following advantages or beneficial effects:

[0043] The simulation method of the multi-physical field coupled resonator provided by the application embodiment can realize the simulation combination of the multi-physical field in the resonator by embodying the multi-physical field components in the degree of freedom of the system matrix and processing the multi-physical field according to the matrix coupling manner in the grid region splicing process. Further, the to-be-solved resonator model is divided into a plurality of grid regions by using the finite element method, all the grid regions are spliced into a whole matrix according to the matrix operation, and the degrees of freedom that do not need to be solved are eliminated multiple times in the assembling and splicing process, thereby reducing the solving time and also reducing the memory for calculating the matrix.

[0044] Additional features and advantages of the present application will be set forth in the description that follows, and in part will be apparent from the description, or can be learned by practice of the application. The objectives and other advantages of the present application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0045] The accompanying drawings are included to provide a further understanding of the present application and are incorporated in and constitute a part of this specification, illustrate embodiments of the present application and together with the description serve to explain the present application. In the drawings:

[0046] Figure 1 A flow chart of a simulation method of a multi-physical field coupled resonator according to an embodiment of the present application is shown;

[0047] Figure 2 A diagram of multiple physical fields in an XBAR resonator model according to an embodiment of the present application is shown;

[0048] Figure 3 A diagram of grid region splicing of a resonator model according to an embodiment of the present application is shown;

[0049] Figure 4 A diagram of a resonator model according to an embodiment of the present application is shown; Figure 3 A diagram of time spent by the resonator model shown in selecting different grid regions is shown;

[0050] Figure 5 A diagram of fitting curve of time and degrees of freedom of matrix solution of a resonator model according to an embodiment of the present application is shown;

[0051] Figure 6 A diagram of comparison of time used by a resonator simulation using a traditional finite element method, a simulation method according to an embodiment of the present application using a central processing unit and a simulation method according to an embodiment of the present application using a graphic processing unit is shown;

[0052] Figure 7 A diagram of structure of a simulation device of a multi-physical field coupled resonator according to an embodiment of the present application is shown;

[0053] Figure 8 A diagram of structure of a terminal according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0054] Embodiments of the present application will be described in detail below with reference to the drawings and embodiments, by which the process of how the present application applies technical means to solve technical problems and achieves technical effects can be fully understood and implemented. It should be noted that, as long as there is no conflict, each embodiment in the present application and each feature in each embodiment can be combined with each other, and the technical solutions formed thereby are within the protection scope of the present application.

[0055] The operation process of the existing finite element analysis software on the physical field generally includes: firstly, meshing the model, then assembling the meshed grid into a larger finite element system matrix equation set, and finally directly solving the equation set. However, the solving time of the matrix formed by using this method has a certain relationship with the size of the matrix, and many degrees of freedom in the matrix solving process are not used, so that they can only be "thrown away" after being solved, which greatly wastes the calculation time and calculation resources. At the same time, the matrix is too large, and the memory requirement of the graphics processor is too high, so the memory of the general graphics processor is difficult to meet the requirements.

[0056] At present, the simulation of the resonator is only at the level of the piezoelectric physical field. This processing method has no influence on general resonators, but for XBAR and other suspended film resonators and resonators carrying microstrip lines, the traditional piezoelectric physical field cannot simply meet the simulation requirements.

[0057] Example One

[0058] To solve the technical problems in the prior art, an embodiment of the present application provides a simulation method of a multi-physical field coupled resonator.

[0059] Figure 1 A flowchart of a simulation method of a multi-physical field coupled resonator according to an embodiment of the present application is shown. As shown in Figure 1 The simulation method of the multi-physical field coupled resonator according to the embodiment of the present application includes the following steps.

[0060] Step S101, obtaining a resonator model to be solved, and identifying a plurality of physical fields in the resonator model to be solved.

[0061] Specifically, a three-dimensional model of the resonator to be solved is obtained by downloading or software generation, and a plurality of physical fields in the resonator model to be solved are identified. Preferably, the identifiable physical fields in the resonator include at least one of a piezoelectric physical field, an electromagnetic field and a thermal field. The piezoelectric physical field satisfies the following equation: Motion equation Elastic constitutive equation Wherein, τ is a relaxation matrix, μ is a displacement vector, S is a strain, T is a stress, c is a stiffness tensor, η is a viscosity tensor, and v represents a velocity.

[0062] The electromagnetic field satisfies the following equation: J = σE + J e , Wherein, E is an electric field intensity, H is a magnetic field intensity, μ is a magnetic permeability, ε is a dielectric constant, σ is an electrical conductivity, and J swhere D is the electric displacement vector, B is the magnetic induction, and A is the magnetic vector potential.

[0063] The thermal field satisfies the following equation: where p represents density, C p represents specific heat capacity, m represents displacement, T represents temperature, Q represents heat, q represents heat flux, Q ted represents represents thermal-elastic damping, and q represents heat conduction flux.

[0064] Figure 2 A schematic diagram of multiple physical fields in an XBAR resonator model in an embodiment of the present application is shown. As shown in the figure, the XBAR resonator model includes a piezoelectric physical field, an electromagnetic field, and a thermal field. The region surrounded by the 1-line is the piezoelectric physical field region, the region surrounded by the 2-line is the electromagnetic field region, and the region outside the 3-line is the thermal physical field region. As can be seen, there can be an overlapping part between the three physical fields, and therefore, physical field coupling needs to be performed in the subsequent grid region splicing process. Figure 2

[0065] In step S102, cubic grid division is performed on the resonator model to be solved, and the resonator model to be solved after grid division is divided into multiple grid regions, and the system matrix of all grid regions is obtained by using the finite element method.

[0066] Specifically, cubic grid division is performed on the resonator model to be solved, so as to divide the resonator model to be solved into multiple grid blocks. It should be noted that, compared with other tetrahedral grids, the use of cubic grid division can reduce the volume of the unit grid, increase the grid division density, and will not cause loss of accuracy. Figure 3 A cubic grid division result is shown in the figure. As shown in the figure, Figure 3 As shown in the figure, the resonator model to be solved after grid division needs to be divided into multiple grid regions, and each grid region needs to include at least two grid blocks, and the grid region is taken as the smallest analysis region of the resonator model to be solved.

[0067] It should be noted that the grid region can be selected based on the actual situation of the resonator model to be solved, and preferably, a region formed by single-layer grid blocks in the resonator model to be solved can be selected as the grid region; meanwhile, a region formed by multiple-layer grid blocks can also be selected as the grid region, but if the grid region is a multiple-layer grid, although the splicing times are reduced, the corresponding sub-matrix to be processed is larger, and the total time spent is also more.

[0068] Then, the finite element method is used to analyze all grid regions respectively, so as to obtain the system matrix of all grid regions. Further, the obtaining process of the system matrix of a single grid region is as follows: the finite element method is used to analyze the grid region, so as to derive the stiffness matrix, the mass matrix, and the load vector of the grid region, and make them satisfy:​

[0069] [A] = [K - ω 2 M]

[0070] [A] · [x] = [F]

[0071] Where K is the stiffness matrix of the grid region, ω = 2πf is the angular frequency, M is the mass matrix, x is the degree of freedom vector, F is the load vector of the grid region, and A is the system matrix of the grid region. The system matrix is related to the shape of the grid region, the field equation of the control region, and the grid, i.e., changing or applying boundary conditions does not change the system matrix.

[0072] It should be noted that the degree of freedom vector x in the system matrix contains different components according to different physical fields. When the physical field is a piezoelectric physical field, the corresponding degree of freedom vector x contains 3 displacement degrees of freedom x, y, z and 1 electric potential degree of freedom V, and the degree of freedom is embodied as follows: the matrix of the piezoelectric physical field satisfies the following form:

[0073]

[0074] Where the matrix containing the a element is the stiffness matrix of the piezoelectric physical field, the matrix containing the x, y, z, V element is the degree of freedom vector of the piezoelectric physical field, and the matrix containing the f component is the load vector.

[0075] When the physical field is an electromagnetic field, the corresponding degree of freedom vector x contains three components of magnetic vector potential Ax, Ay, Az and one electric potential degree of freedom V, and the degree of freedom is embodied as follows: the matrix of the electromagnetic field satisfies the following form:

[0076]

[0077] In this formula, the matrix containing the b element is the stiffness matrix of the electromagnetic field, the matrix containing the A x , A y , A z , V element is the degree of freedom vector of the electromagnetic field, and the matrix containing the f' component is the load vector of the electromagnetic field.

[0078] When the physical field is a thermal physical field, the degree of freedom vector x contains one temperature T, and the degree of freedom is embodied as follows: the matrix of the thermal physical field satisfies the following form:

[0079]

[0080] In this formula, the matrix containing the C element is the stiffness matrix of the thermal physical field, the matrix containing the T element is the degree of freedom vector of the thermal physical field, and the matrix containing the f" component is the load vector of the thermal physical field.

[0081] In order to realize the coupling of the physical fields in the grid region splicing process, the degree of freedom vector in the system matrix is designed to contain the physical field components of multiple physical fields in the resonator model to be solved, and when a certain physical field does not exist in the grid region, the corresponding physical field component in the degree of freedom vector of the system matrix of the grid region is set to zero.

[0082] In step S103, all grid regions are spliced in turn based on the coupling mode of the same physical field components in the matrix, so as to obtain the system matrix of the resonator model to be solved.

[0083] Figure 3 A grid region splicing schematic diagram of a resonator model in the embodiment of the application is shown. Figure 3 As shown, all grid regions are spliced in turn according to the position order of the grid regions in the resonator model to be solved, so as to obtain the system matrix of the resonator model to be solved. It should be noted that the system matrix of the grid region has been subjected to matrix transformation, so as to contain only the degrees of freedom of the splicing surface and the target degrees of freedom, that is, to form the system matrix corresponding to the interface; wherein the degrees of freedom of the splicing surface are the degrees of freedom of the common grid points when splicing with other regions, Figure 3 the grid region in the above formula is spliced with the grid region in the following formula in a front-back splicing relationship, so as to divide it into front degrees of freedom and back degrees of freedom. The shared surface of the target grid region and the grid region to be spliced is the splicing surface. The representation of the system matrix of the grid region is as follows:

[0084]

[0085] wherein the matrix of the B element is the stiffness matrix of the grid region, X F is the front degree of freedom, X B is the back degree of freedom, X g is the target degree of freedom to be solved, and the matrix of the f element is the load vector of the grid region. And since the degree of freedom vector contains the physical field components of multiple physical fields in the resonator model to be solved, when the resonator model to be solved contains piezoelectric physical fields, electromagnetic fields and thermal physical fields, the degree of freedom component representation is as follows:

[0086]

[0087] Further in the grid region splicing process, the process of splicing two grid regions into a larger grid region is as follows: one grid region is taken as a target grid region, and the other grid region is taken as a grid region to be spliced; first, the system matrix of the target grid region and the system matrix of the grid region to be spliced need to be expanded respectively; the expanded matrix is as follows:

[0088]

[0089]

[0090] wherein X FB = X BF = X I (because the grid points at the interface of two grid regions are the same), X I is the degree of freedom at the interface; and then the expanded system matrix of the target grid region and the system matrix of the grid region to be spliced are spliced based on the splicing surface, so that the splicing matrix of the spliced region is obtained, and the splicing process of the two grid regions is actually a process of reusing the physical field degrees of freedom of the same grid points on the splicing surface and expanding the degrees of freedom on the non-splicing surface; the splicing matrix of the spliced region is as follows:

[0091]

[0092] X I may be further divided into target degrees of freedom or irrelevant degrees of freedom according to the solution target, and after the division, the matrix is further sorted according to elementary row transformation and column transformation, combined with the degrees of freedom before, to form X g , X o , f g and f o , while X FF , X BB , f F ' F , f B ' B , f BB are regarded as new X F , X B , f F , f B of the spliced matrix, and the splicing matrix of the spliced region is simplified as follows:

[0093]

[0094] Finally, the irrelevant degrees of freedom of the above matrix are eliminated, and the system matrix of the spliced region is obtained, which is as follows:

[0095]

[0096] In the above splicing process, the system matrix of the target grid region can also be set as the system matrix of the spliced region obtained by the previous splicing, so that the above splicing process is repeatedly performed, and the system matrix of the resonator model to be solved is obtained. In the above process, if the structures of the two grid cells are completely the same, the system matrices of the two grid cells are also the same.

[0097] The elimination method of the irrelevant degrees of freedom adopts the elimination method of the traditional equation set, and the specific operation of the elimination method is as follows:

[0098] For example, a matrix

[0099] It can be written as

[0100] From expression ①, we can obtain X2 = B -1 (M-AX1),

[0101] Substituting into ②, we get (C+DB) -1 A) X1 = N - DB -1 M, thus eliminating X2.

[0102] Specifically, by substituting the matrix into blocks, we can divide the matrix as follows and perform the elimination process described above to eliminate X. o

[0103]

[0104] Step S104: Solve the system matrix of the resonator model to be solved to obtain the target physical quantity.

[0105] Specifically, by stitching together all the grid regions, the system matrix of the resonator model to be solved can be obtained; the system matrix of the resonator model to be solved is as follows:

[0106]

[0107] in, Let be the objective degrees of freedom to be solved. Solving this system of equations yields...

[0108]

[0109] Extract X from it g_all This will give us the desired physical quantity to be solved, i.e., the target degree of freedom.

[0110] To illustrate the impact of different grid region selections on solution time, this embodiment uses... Figure 3 Based on this, one, two, and four layers of mesh blocks were selected as mesh regions and the simulation method of this embodiment was implemented. Because... Figure 3 The resonator model to be solved shown contains 128 mesh layers, according to 2 7 If the grid size is 128, then using a 1-layer grid requires 7 stitches, a 2-layer grid requires 6 stitches, and a 3-layer grid requires 5 stitches. Although the number of stitches is reduced, the matrix processing time for the smallest unit increases. Figure 4 The first embodiment of the present invention is shown. Figure 3 The diagram shows the processing time for different grid regions of the resonator model; see reference. Figure 4 It can be seen that selecting a single-layer grid takes the least amount of time.

[0111] Further assuming the number of rows and columns (degrees of freedom) of the matrix to be solved is m×n, and dividing it into m assembly steps (each grid element has n degrees of freedom) and continuously eliminating irrelevant degrees of freedom, the final solution time of the simulation method for the multiphysics coupled resonator in this embodiment is:

[0112] t1=t 网格单元 +t 单元之间组装 =n R +(m-1)×n R =m×n R

[0113] The time required to solve the problem using the ordinary FEM method is:

[0114] t2=t 全部组装 =(mn) R =m R n R

[0115] R depends on the number of degrees of freedom in the computation and the computing hardware configuration. Using a personal PC (CPU: Intel Core i7-10870H, 16GB RAM, GPU: Nvidia GeForce GTX 1660Ti, 6GB VRAM), the fitted R is around 2.18, which matches the theoretical expectation of 2-3 (the relationship between matrix solution time and degrees of freedom is as follows). Figure 5 As shown, by Figure 5 It can be seen that the computation time is related to the degree of freedom of computation by a power of 2 to 3, thus proving that the method of the present invention has great acceleration potential.

[0116] The simulation method for the multiphysics coupled resonator in this embodiment is implemented using a central processing unit (CPU) or a graphics processing unit (GPU), or it can be implemented using both a CPU and a GPU. Furthermore, the finite element method acceleration for the simulation method of the multiphysics coupled resonator in this embodiment mainly focuses on two aspects: firstly, decomposing the solution of a large matrix into the solution of multiple smaller matrices; secondly, smaller matrices consume less memory, allowing for further acceleration using a GPU. For the first acceleration, the relationship between the matrix solution time and degrees of freedom is as follows: Figure 5 As shown, by Figure 5 It can be seen that the computation time is related to the quadratic to cubic power of the computational degrees of freedom. Therefore, splitting a large matrix into smaller matrices for solution can significantly reduce the time required. There is a difference in computational performance between a graphics processing unit (GPU) and a central processing unit (CPU). When the degrees of freedom are few, the CPU uses less time due to its fast cache data transfer capabilities; however, as the degrees of freedom increase, the GPU, with its larger number of computational units, begins to show a time advantage. Therefore, the method in this embodiment can be implemented using a GPU.

[0117] For example, a personal PC (CPU: intel core i7-10870H, 16GB RAM, GPU: Nvidia GeForce GTX 1660Ti, 6GB video memory) is used to solve a 128-unit grid surface composed of 5536 degrees of freedom. The CPU has 8 cores, so it can run 8 frequency points in parallel at the same time. Assuming that the resonator model is composed of 3 cuboids, the physical field applied is the solid mechanics field and the electrostatic field, and the target solving degree of freedom is the terminal current. First, compare the time spent by the traditional FEM and the simulation method of the multi-physical field coupled resonator of the embodiment. It can be seen that the time spent by the traditional FEM is the longest, the time spent by the central processing unit is shorter, and the time spent after using the graphics processing unit is the shortest.

[0118] An advantageous effect of the method of the embodiment of the application is that the operation time can be saved: the time consumption of the traditional finite element mainly lies in the solving process of the final large matrix equation, and the number of rows and columns of the matrix can reach hundreds of thousands, and the solving speed will be very slow. The method of the embodiment of the application divides the super-large (hundreds of thousands) matrix into smaller (thousands of rows and columns) sub-matrices, and finally obtains the large matrix by continuously solving and eliminating the sub-matrices. If the degrees of freedom to be solved are less, the total matrix assembled at the end will also be greatly reduced. Another advantageous effect of the method of the embodiment of the application is that it is more compatible with GPU operation: the large matrix assembled at the end of the traditional finite element can be calculated through multiple instructions in the CPU, but it will occupy a large amount of video memory when transplanted to the GPU. The current general performance level of GPU video memory on the market is about 6-12G, and it is difficult to ensure that a large model can be completely transplanted in it. The method of the embodiment of the application divides the super-large (hundreds of thousands) matrix into smaller (thousands of rows and columns) sub-matrices, and the elimination of the sub-matrices and the solving of the final matrix can be realized in the GPU, greatly accelerating the operation while not worrying about the overflow of GPU video memory occupation. The third advantageous effect of the method of the embodiment of the application is stronger universality. The current technology mainly focuses on the simulation of a single physical field, but the method of the embodiment of the application can be applied to the simulation of a resonator with multiple physical fields.

[0119] The simulation method of the multi-physical field coupled resonator provided by the embodiment of the application realizes the simulation combination of multiple physical fields in the resonator by embodying the multiple physical field components in the degrees of freedom of the system matrix and processing the multiple physical fields in the matrix coupling manner during the grid region splicing process. Further, the resonator model to be solved is divided into multiple grid regions by the finite element method, all the grid regions are spliced into a whole matrix according to the matrix operation, and the degrees of freedom that do not need to be solved are eliminated multiple times during the assembly and splicing process, thereby reducing the solving time and also reducing the internal memory of the matrix to be calculated.

[0120] Example Two

[0121] To solve the above technical problems in the prior art, the embodiment of the present application further provides a simulation device of a multi-physical field coupling resonator.

[0122] Figure 7 The structure of the simulation device of the multi-physical field coupling resonator is shown in the embodiment two of the present application; referring to Figure 7 The simulation device of the multi-physical field coupling resonator in the embodiment of the present application includes a model acquisition module, a grid area acquisition module, a splicing module and a solving module.

[0123] The model acquisition module is used to acquire a resonator model to be solved, and identify a plurality of physical fields in the resonator model to be solved.

[0124] The grid area acquisition module is used to perform cubic grid division on the resonator model to be solved to obtain a plurality of grid blocks, divide the resonator model to be solved after grid division into a plurality of grid areas, and acquire system matrices of all grid areas through a finite element method, wherein a degree of freedom vector in the system matrix contains physical field components of the plurality of physical fields in the resonator model to be solved.

[0125] The splicing module is used to sequentially splice all grid areas based on a coupling manner of the same physical field components in the matrix, so as to acquire the system matrix of the resonator model to be solved.

[0126] The solving module is used to solve the system matrix of the resonator model to be solved, so as to acquire a target solving physical quantity.

[0127] Each grid area includes at least two grids, and when a certain physical field does not exist in the grid area, the corresponding physical field component in the degree of freedom vector of the grid area system matrix is zero.

[0128] The simulation device of the multi-physical field coupling resonator provided by the embodiment of the present application realizes the simulation combination of the plurality of physical fields in the resonator by embodying the plurality of physical field components in the degree of freedom of the system matrix and processing the plurality of physical fields according to the matrix coupling manner in the grid area splicing process; further, the resonator model to be solved is divided into a plurality of grid areas through the finite element method, all grid areas are spliced into an overall matrix according to the matrix operation, and the degrees of freedom which do not need to be solved are eliminated multiple times in the assembling and splicing process, thereby reducing the solving time and also reducing the memory for calculating the matrix.

[0129] Example Three

[0130] To solve the above technical problems in the prior art, the embodiment of the present application further provides a storage medium which stores a computer program, and the computer program can realize all steps in the simulation method of the multi-physical field coupling resonator according to the first embodiment when executed by a processor.

[0131] The specific steps of the simulation method of the multi-physical field coupling resonator and the beneficial effects obtained by using the readable storage medium provided by the embodiment of the present application are the same as those of the first embodiment, and will not be repeated here.

[0132] It should be noted that the storage medium includes ROM, RAM, magnetic disk or optical disk and various storage program codes.

[0133] Example Four

[0134] To solve the above technical problems in the prior art, the embodiment of the present application further provides a terminal.

[0135] Figure 8 The structure of the terminal according to the fourth embodiment of the present application is shown in the schematic diagram, and the terminal according to the fourth embodiment of the present application includes a processor and a memory connected with each other. Figure 8 The computer program stored in the memory is executed by the processor, so that the terminal can realize all steps in the simulation method of the multi-physical field coupling resonator according to the first embodiment.

[0136] The specific steps of the simulation method of the multi-physical field coupling resonator and the beneficial effects obtained by using the terminal provided by the embodiment of the present application are the same as those of the first embodiment, and will not be repeated here.

[0137] It should be noted that the memory can include random access memory (RAM) and can also include non-volatile memory such as at least one disk memory. Similarly, the processor can be a general-purpose processor including a central processing unit (CPU), a network processor (NP), etc., and can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic device, a discrete gate or transistor logic device, a discrete hardware component.

[0138] Although the disclosed embodiments of the present application are as described above, the above description is only for the purpose of facilitating understanding of the present application and is not intended to limit the present application. Any person skilled in the art to which the present application pertains, without departing from the spirit and scope of the present application, can make any modification and change in the form and details of the implementation, but the protection scope of the present application shall be subject to the scope defined by the appended claims.

Claims

1. A simulation method for a multiphysics coupled resonator, comprising: Obtain the resonator model to be solved and identify multiple physical fields in the resonator model to be solved; The resonator model to be solved is divided into cubic meshes, and the meshed resonator model is divided into multiple mesh regions. The system matrix of all mesh regions is obtained by the finite element method. The degree of freedom vector in the system matrix contains the physical field components of multiple physical fields in the resonator model to be solved. Based on the coupling of the same physical field components in the matrix, all the grid regions are sequentially spliced ​​together to obtain the system matrix of the resonator model to be solved; the splicing process of the grid regions is as follows: the system matrix of the target grid region and the system matrix of the grid region to be spliced ​​are expanded; Based on the splicing surface, the expanded target mesh region system matrix and the mesh region to be spliced ​​system matrix are spliced ​​together to obtain the spliced ​​region splicing matrix; irrelevant degrees of freedom in the spliced ​​region splicing matrix are eliminated to obtain the system matrix of the spliced ​​region; wherein, the system matrix of the target mesh region is the system matrix of the spliced ​​region obtained in the previous splicing, and the system matrix of the mesh region to be spliced ​​only contains the degrees of freedom of the splicing surface and the degrees of freedom to be solved, and the shared surface of the target mesh region and the mesh region to be spliced ​​is used as the splicing surface; The system matrix of the resonator model to be solved is obtained to obtain the target physical quantity. Each of the grid regions includes at least two grid blocks. When a physical field does not exist in a grid region, the physical field component corresponding to the degree of freedom vector of the grid region system matrix is ​​zero.

2. The simulation method according to claim 1, characterized in that, The physical fields of the three-dimensional model of the resonator to be solved include at least two of the piezoelectric physical fields, electromagnetic fields, and thermal fields.

3. The simulation method according to claim 2, characterized in that, The matrix of the piezoelectric physical field satisfies the following form: ， The matrix containing the element 'a' is the stiffness matrix of the piezoelectric field, and the matrix containing the elements x, y, z, and V is the degree-of-freedom vector of the piezoelectric field. The component matrix is ​​the load vector; The electromagnetic field matrix satisfies the following form: ， The matrix containing the element 'b' is the stiffness matrix of the electromagnetic field, containing... , , The matrix of V elements represents the degree-of-freedom vectors of the electromagnetic field, containing... The matrix of the components is the load vector of the electromagnetic field; The matrix of the thermophysical field satisfies the following form: ， Wherein, the matrix containing the element c is the stiffness matrix of the thermophysical field, and the matrix containing the element T is the degree-of-freedom vector of the thermophysical field. The matrix of the components is the load vector of the thermophysical field.

4. The simulation method according to claim 1, characterized in that, The system matrix of the mesh region obtained by the finite element method includes: Obtain the stiffness matrix, mass matrix, and load vector of the mesh region, and ensure that they satisfy: ， ， Where K is the stiffness matrix of the grid region. Let be the angular frequency, M be the mass matrix of the grid region, x be the degree-of-freedom vector of the grid region, F be the load vector of the grid region, and A be the system matrix of the grid region.

5. The simulation method according to claim 1, characterized in that, If two grid cells have identical structures, then their system matrices are also identical.

6. The simulation method according to any one of claims 1-5, characterized in that, The simulation method of the multi-physics field coupled resonator is implemented by a central processing unit or a graphics processing unit, or the simulation method of the multi-physics field coupled resonator is implemented by both a central processing unit and a graphics processing unit.

7. A simulation device for a multiphysics coupled resonator, characterized in that, It includes a model acquisition module, a mesh region acquisition module, a stitching module, and a solution module; The model acquisition module is used to acquire the resonator model to be solved and identify multiple physical fields in the resonator model to be solved; The mesh region acquisition module is used to divide the resonator model to be solved into a cubic mesh, and divide the resonator model to be solved into multiple mesh regions after mesh division. The system matrix of all mesh regions is obtained by the finite element method, wherein the degree of freedom vector in the system matrix contains the physical field components of multiple physical fields in the resonator model to be solved. The splicing module is used to sequentially splice all the grid regions based on coupling the same physical field components in the matrix to obtain the system matrix of the resonator model to be solved; the splicing process of the grid regions is: expanding the system matrix of the target grid region and the system matrix of the grid region to be spliced. Based on the splicing surface, the expanded target mesh region system matrix and the mesh region to be spliced ​​system matrix are spliced ​​together to obtain the spliced ​​region splicing matrix; irrelevant degrees of freedom in the spliced ​​region splicing matrix are eliminated to obtain the system matrix of the spliced ​​region; wherein, the system matrix of the target mesh region is the system matrix of the spliced ​​region obtained in the previous splicing, and the system matrix of the mesh region to be spliced ​​only contains the degrees of freedom of the splicing surface and the degrees of freedom to be solved, and the shared surface of the target mesh region and the mesh region to be spliced ​​is used as the splicing surface; The solution module is used to solve the system matrix of the resonator model to be solved in order to obtain the target physical quantity. Each of the grid regions includes at least two grid blocks. When a physical field does not exist in a grid region, the physical field component corresponding to the degree of freedom vector of the grid region system matrix is ​​zero.

8. A storage medium having a computer program stored thereon, characterized in that, When executed by a processor, the program implements the simulation method for the multiphysics coupled resonator as described in any one of claims 1 to 6.

9. A terminal, characterized in that, include: A processor and a memory, wherein the memory and the processor are communicatively connected; The memory is used to store computer programs, and the processor is used to execute the computer programs stored in the memory to enable the terminal to perform the simulation method of a multiphysics coupled resonator as described in any one of claims 1 to 6.

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