A heat dissipation device for microelectronic components

Abstract

The present invention discloses a heat dissipation device for microelectronic components, which includes a device main body. A base is provided at the bottom end of the device main body. Heat sinks are provided inside the base. A heat dissipation bracket is installed at the top end of the base. Notch openings are provided on the surfaces at both ends of the heat dissipation bracket. An air outlet is provided in the middle of the top end of the heat dissipation bracket. A heat exchange box is installed inside the heat dissipation bracket. A liquid storage box is provided on the top surface of the heat dissipation bracket. A fan is provided in the middle of the top end of the liquid storage box. Hole grooves are equidistantly provided on the side surface of the fan. Through the combination of liquid cooling and air cooling, the heat dissipation method of the components can be diversified, and the overall structure can form a specific heat dissipation method according to the specific structure of the target. Moreover, the flow channels provided inside can perform self-circulating operations in cooperation with the air cooling effect, achieving the actual effects of higher heat exchange effect and stronger heat exchange efficiency.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic components, and particularly to a heat dissipation device for microelectronic components. Background Art

[0002] Microelectronic components are miniaturized electronic system chips and devices realized by microelectronic process technologies, and usually involve components such as CPU components, as well as resistors, capacitors, inductors, potentiometers, transformers, etc. arranged on a PCB board, and infrared ray generators for monitoring and ranging, etc. A relatively conventional heat dissipation method is to accelerate the circulation of the ambient temperature through a fan for cooling.

[0003] However, the existing cooling methods are usually of low efficiency. Especially in the case of a high integration density of electronic components, simply using a fan to accelerate air circulation cannot achieve the heat dissipation effect at the overall integration part. Especially in the case of multiple chips and high-heat-generation integrated components such as CPU or GPU, even with the cooperation of water cooling to form a heat dissipation effect, leakage and other phenomena will occur due to the aging of pipelines and the complexity of wiring. Especially, structures such as water pumps or fans themselves will generate a certain amount of heat, which will also affect the heat dissipation effect. Therefore, their practicability and heat dissipation effect cannot meet the actual use requirements. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the defects of the prior art and provide a heat dissipation device for microelectronic components.

[0005] To solve the above technical problems, the present invention provides the following technical solutions:

[0006] A heat dissipation device for microelectronic components of the present invention includes a device main body. A base is provided at the bottom end of the device main body. Heat dissipation fins are provided inside the base. A heat dissipation bracket is installed at the top end of the base. Notch openings are provided on the surfaces at both ends of the heat dissipation bracket. An air outlet is provided in the middle of the top end of the heat dissipation bracket. A heat exchange box is installed inside the heat dissipation bracket. A liquid storage box is provided on the top surface of the heat dissipation bracket. A fan is provided in the middle of the top end of the liquid storage box. Hole grooves are equidistantly provided on the side surface of the fan;

[0007] A heat exchange layer is provided at the bottom end of the heat exchange box. Connecting pipes are installed at both ends of the heat exchange box. A partition is provided inside the liquid storage box. The partition is arranged in an L-shaped structure and is used to separate the internal space of the liquid storage box. A communicating pipe is provided inside the top end of the liquid storage box, and the communicating pipe is in a U-shaped structure and penetrates through the hole groove at the top.

[0008] As a preferred technical solution of the present invention, limiting plates are provided at the top and bottom ends of the surface of the communicating pipe. The limiting plates are arranged in an arc structure and correspond to the inner wall structure of the hole groove, facing the middle of the communicating pipe. The distance between the limiting plate and the liquid storage box is the same as the thickness of the hole groove. Driving rings are provided on both sides of the middle of the communicating pipe. A fan blade structure is provided on the surface of the driving ring. A rotating cylinder is installed inside the driving ring. A hose is provided inside the rotating cylinder, and holes are provided on the surface of the rotating cylinder.

[0009] As a preferred technical solution of the present invention, the top end of the heat exchange layer is a thin film layer, and the thin film layer is made of fluoroplastics. A rubber layer is provided at the bottom end of the thin film layer.

[0010] As a preferred technical solution of the present invention, the driving rings are symmetrically arranged up and down, and the fan blade structures on the surfaces of the driving rings rotate in the same direction up and down, and are also opposite to the rotation direction of the fan. The driving ring and the communicating pipe are rotationally connected in a bearing manner.

[0011] As a preferred technical solution of the present invention, the rotating cylinder and the hose are arranged in an inner and outer embedded manner. The upper and lower communicating pipes are connected by the hose, and the diameter of the rotating cylinder is smaller than that of the hose. The holes on the surface of the rotating cylinder are arranged spirally up and down.

[0012] As a preferred technical solution of the present invention, the base and the heat sink are fixedly connected, the base and the heat dissipation bracket are detachably connected, and threaded holes are provided at the four corners of the top surface of the heat dissipation bracket.

[0013] As a preferred technical solution of the present invention, a gap is provided between the top end of the heat exchange box and the heat dissipation bracket. The fan and the notch are correspondingly arranged. The connecting pipe is a corrugated pipe and is arranged at the notch.

[0014] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0015] 1: By combining liquid cooling and air cooling, the present invention enables the heat dissipation method of the components to be diversified, and the overall structure can form a specific heat dissipation method according to the specific structure of the target. The flow channels provided inside can cooperate with the air cooling effect to perform self-circulating operations, achieving the actual effects of higher heat exchange efficiency and stronger heat exchange efficiency.

[0016] 2: The present invention can also drive the up and down flow rate of the embedded liquid based on its own air cooling rotation, that is, control the flow rate of the liquid in the cavity by the rotation speed of the fan. While further increasing the flow rate, the liquid can continuously exchange heat with the external temperature and the heat dissipation effect of the air cooling. Description of the Drawings

[0017] The accompanying drawings are used to provide a further understanding of the present invention and form a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation to the present invention. In the drawings:

[0018] Figure 1 is a schematic diagram of the overall structure of the present invention;

[0019] Figure 2 is a schematic diagram of the heat dissipation bracket structure of the present invention;

[0020] Figure 3 is a schematic diagram of the fan structure of the present invention;

[0021] Figure 4 is a sectional view of the liquid storage box structure of the present invention;

[0022] Figure 5 is a schematic diagram of the partial structure of the present invention;

[0023] Figure 6 is a schematic diagram of the heat exchange layer structure of the present invention;

[0024] In the figure: 1, device main body; 2, base; 201, heat sink; 3, heat dissipation bracket; 301, notch; 302, air outlet; 4, heat exchange box; 401, heat exchange layer; 402, connecting pipe; 403, film layer; 404, rubber layer; 5, liquid storage box; 501, partition; 6, fan; 601, hole groove; 7, communicating pipe; 701, limiting plate; 702, transmission ring; 703, rotating cylinder; 704, hose. Detailed Embodiments

[0025] The following describes the preferred embodiments of the present invention with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0026] Embodiment 1

[0027] As Figure 1-6 shown, the present invention provides a heat dissipation device for microelectronic components, including a device main body 1. A base 2 is provided at the bottom end of the device main body 1. Heat sinks 201 are provided inside the base 2. A heat dissipation bracket 3 is installed at the top end of the base 2. Notches 301 are provided on the surfaces at both ends of the heat dissipation bracket 3. An air outlet 302 is provided in the middle of the top end of the heat dissipation bracket 3. A heat exchange box 4 is installed inside the heat dissipation bracket 3. A liquid storage box 5 is provided on the top surface of the heat dissipation bracket 3. A fan 6 is provided in the middle of the top end of the liquid storage box 5. Hole grooves 601 are equidistantly provided on the side surface of the fan 6;

[0028] The bottom end of the heat exchange box 4 is provided with a heat exchange layer 401. Connecting pipes 402 are installed at both ends of the heat exchange box 4. A partition 501 is arranged inside the liquid storage box 5. The partition 501 is arranged in an L-shaped structure to separate the internal space of the liquid storage box 5. A communicating pipe 7 is arranged inside the top end of the liquid storage box 5, and the communicating pipe 7 is in a U-shaped structure and penetrates through the hole groove 601 at the top.

[0029] Furthermore, limit plates 701 are arranged at the top and bottom ends of the surface of the communicating pipe 7. The limit plates 701 are arranged in an arc-shaped structure and correspond to the inner wall structure of the hole groove 601, facing the middle of the communicating pipe 7. The distance between the limit plates 701 and the liquid storage box 5 is the same as the thickness of the hole groove 601. Transmission rings 702 are arranged on both sides of the middle of the communicating pipe 7. A fan blade structure is arranged on the surface of the transmission rings 702. A rotating cylinder 703 is installed inside the transmission rings 702. A flexible hose 704 is arranged inside the rotating cylinder 703, and holes are arranged on the surface of the rotating cylinder 703.

[0030] The top end of the heat exchange layer 401 is a thin film layer 403. The thin film layer 403 is made of fluoroplastics material. A rubber layer 404 is arranged at the bottom end of the thin film layer 403.

[0031] The transmission rings 702 are arranged symmetrically up and down, and the fan blade structures on the surface of the transmission rings 702 rotate in the same direction up and down, and are also opposite to the rotation direction of the fan 6. The transmission rings 702 and the communicating pipe 7 are rotationally connected in a bearing manner.

[0032] The rotating cylinder 703 and the flexible hose 704 are arranged in an inner and outer embedded manner. The upper and lower communicating pipes are connected by the flexible hose 704, and the diameter of the rotating cylinder 703 is smaller than that of the flexible hose 704. The holes on the surface of the rotating cylinder 703 are arranged spirally up and down.

[0033] The base 2 and the heat sink 201 are fixedly connected. The base 2 and the heat dissipation bracket 3 are detachably connected. Threaded holes are arranged at the four corners of the top surface of the heat dissipation bracket 3.

[0034] A gap is arranged between the top end of the heat exchange box 4 and the heat dissipation bracket 3. The fan 6 and the notch 301 are correspondingly arranged. The connecting pipe 402 is a corrugated pipe, and the connecting pipe 402 is arranged at the notch 301.

[0035] Specifically, the device main body 1 is mainly composed of the base 2 and the heat dissipation bracket 3. The base 2 is provided with a copper sheet material in the shape of the heat sink 201, and a conventional rectangular structure is arranged at the center of the bottom of the heat sink 201, which can be used for heat exchange of a conventional GPU or CPU. That is, heat exchange is carried out between the heat exchange layer 401 at the heat exchange box 4 and the heat sink 201, and the flow of ambient air is accelerated by the fan 6. At this time, the connecting pipes 402 at both ends of the heat exchange box 4 are in a sealed state, and the rubber layer 404 arranged on the heat exchange layer 401 is in an embedded heat exchange state with the heat sink 201 due to its low hardness.

[0036] After installing the liquid storage box 5, the partition 501 provided inside the liquid storage box 5 divides the connecting pipe 402 in the middle and extends into the heat exchange box 4. The partition is made of ceramic material and can isolate the internal and external temperatures. At this time, since the relatively hot liquid inside the heat exchange layer 401 will move upward, that is, it enters from the bottom of the communicating pipe 7 from the inner side of the partition 501. Since the communicating pipe 7 is directly located at the inner wall of the fan 6, it can be directly cooled by the air-cooling of the fan 6, and then circulates from the top of the partition 501 to the bottom side and enters the heat exchange box 4 again, forming the function of a conventional circulating heat exchange channel.

[0037] A limiting plate 701 is provided at the communicating pipe 7 to prevent the transmission rings 702 on the top and bottom sides of the communicating pipe 7 from contacting the inner wall of the fan 6. Subsequently, since the blade directions of the transmission ring 702 and the fan 6 are opposite, and the spiral of the holes is mainly upward, when the fan 6 rotates, it will drive the transmission ring 702 to rotate, and the rotating cylinder 703 will also rotate synchronously. At this time, the hose 704 squeezed inside will be squeezed by the holes to form a spiral upward movement of the liquid inside the hose 704. In this way, the air-cooling of the fan 6 can be used to achieve the liquid-cooling circulation effect in the miniaturized device body 1. Also, since the liquid storage box 5 is made of materials that can exchange heat with the external environment in large quantities, it can greatly increase the heat exchange effect of the temperature. When the environmental temperature is low, the heat exchange can be further enhanced.

[0038] At the same time, if it is needed to be directly used at the components highly integrated at the PCB board, the base 2 can be directly disassembled by the buckle structure, and the relatively soft rubber layer 404 can be directly contacted with multiple components within the area range. Since the rubber layer 404 is used and the top is a thin film layer 403 with higher heat exchange efficiency, the rubber layer 404 will form an insulating effect between multiple electronic components, and then the heat is exchanged into the heat exchange box 4. Subsequently, through the above heat exchange process and heat exchange structure, the heat exchange effect can be formed.

[0039] Its overall structure is simple. When facing small and micro components, it can also be set in a miniaturized manner. The water-cooling and air-cooling are combined to form the heat dissipation function for the corresponding components. When facing a larger area, a larger structure can be designed to cover most of the components on the PCB board. When the heat exchange box 4 is directly used, it can also directly wrap the relatively hot components through the flexible layer at the bottom, and the usage method is simple and conforms to the conventional heat dissipation function, with strong versatility and pertinence.

[0040] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements on some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A heat dissipation device for microelectronic components, comprising a device main body (1), characterized in that, A base (2) is provided at the bottom end of the device main body (1), a heat sink (201) is provided inside the base (2), a heat dissipation bracket (3) is installed at the top end of the base (2), notch openings (301) are provided on the surfaces at both ends of the heat dissipation bracket (3), an air outlet (302) is provided in the middle of the top end of the heat dissipation bracket (3), a heat exchange box (4) is installed inside the heat dissipation bracket (3), a liquid storage box (5) is provided on the top surface of the heat dissipation bracket (3), a fan (6) is provided in the middle of the top end of the liquid storage box (5), and hole grooves (601) are equidistantly provided on the side surface of the fan (6). A heat exchange layer (401) is provided at the bottom end of the heat exchange box (4), connecting pipes (402) are installed at both ends of the heat exchange box (4), a partition plate (501) is provided inside the liquid storage box (5), the partition plate (501) is arranged in an L-shaped structure for separating the internal space of the liquid storage box (5), a communicating pipe (7) is provided inside the top end of the liquid storage box (5), and the communicating pipe (7) is in a U-shaped structure and penetrates through the hole groove (601) at the top. The connecting pipe (402) is arranged at the notch opening (301), and the connecting pipe (402) communicates the heat exchange box (4) and the liquid storage box (5). The partition plate (501) provided inside the liquid storage box (5) separates the connecting pipe (402) from the middle and extends into the heat exchange box (4). Limiting plates (701) are provided at the top and bottom ends of the surface of the communicating pipe (7), the limiting plates (701) are arranged in an arc-shaped structure and correspond to the inner wall structure of the hole groove (601), and face the middle of the communicating pipe (7). The distance between the limiting plate (701) and the liquid storage box (5) is the same as the thickness of the hole groove (601). Transmission rings (702) are provided on both sides of the middle of the communicating pipe (7), fan blade structures are provided on the surface of the transmission rings (702), a rotating cylinder (703) is installed inside the transmission rings (702), a flexible hose (704) is provided inside the rotating cylinder (703), and holes are provided on the surface of the rotating cylinder (703). The transmission rings (702) are symmetrically arranged up and down, and the fan blade structures on the surface of the transmission rings (702) rotate in the same direction up and down, and are also opposite to the rotation direction of the fan (6). The transmission rings (702) and the communicating pipe (7) are in a bearing-type rotational connection. The rotating cylinder (703) and the flexible hose (704) are arranged in an inner and outer embedded manner, the upper and lower communicating pipes (7) are connected by the flexible hose (704), and the diameter of the rotating cylinder (703) is smaller than that of the flexible hose (704). The holes on the surface of the rotating cylinder (703) are arranged in a spiral shape up and down.

2. The heat dissipation device for microelectronic components according to claim 1, wherein, The top end of the heat exchange layer (401) is a thin film layer (403), the thin film layer (403) is made of fluoroplastics material, and a rubber layer (404) is provided at the bottom end of the thin film layer (403).

3. The heat dissipation device for microelectronic components according to claim 1, characterized in that, The base (2) and the heat sink (201) are fixedly connected, the base (2) and the heat dissipation bracket (3) are detachably connected, and threaded holes are provided at the four corners of the top surface of the heat dissipation bracket (3).

4. A heat dissipation device for microelectronic components according to claim 1, characterized in that, A gap is provided between the top end of the heat exchange box (4) and the heat dissipation bracket (3). The fan (6) and the air outlet (302) are correspondingly arranged, and the connecting pipe (402) is a corrugated pipe.

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