Systems for connecting electronic components

Abstract

The present invention relates to a system (10) for connecting electronic components (12), and more particularly to a welding or sintering system (10a) comprising a transport device for transporting the electronic components (12) through the system (10), and a plurality of modules (16) for interconnecting the electronic components (12), the modules being hermetically separated, wherein at least one module (16) is a welding and / or sintering module (18), and one module (16) is a cooling module (20). The invention is characterized by an additional module (16), which is a soft cooling module (22), provided between the welding or sintering module (18) and the cooling module (20), for cooling between the process temperature and intermediate temperature of the welding or sintering module (18), and more particularly for cooling below the solder solidification temperature. In a second aspect, it is proposed that in a module (16), more particularly in a welding or sintering module (18), and more particularly in a soft cooling module (22), at least one heat source (50) and at least one cold trap (46) for heating the electronic component (12) are provided in a process chamber (52) that may be hermetically sealed, the heat source being in contact with the electronic component (12) and the cold trap having a surface temperature lower than the operating temperature of the heat source (50) during operation.

Description

Technical Field

[0001] The present invention relates to a system for connecting electronic components, and more particularly to a welding or sintering system having a transport device for conveying electronic components through the system, the system comprising a plurality of hermetically separable modules for interconnecting the electronic components, wherein at least one module is designed as a welding or sintering module and one module is designed as a cooling module. Background Technology

[0002] The system described at the beginning for temperature treatment of components having an airtight sealable chamber or module is known from the prior art.

[0003] This type of system can be designed, for example, as a soldering apparatus for soldering connections between several components, particularly electronic components. This can be achieved by heating and melting solder material disposed between the components to be joined and / or by coating the components with solder material for subsequent joining processes. Generally, the components and solder material, such as solder in the form of solder chips, as solder paste or solder powder, are temporarily joined together to form a stack before being introduced into the process chamber.

[0004] This type of soldering apparatus is particularly suitable for large-area connections, where semiconductor components, microelectronic components, or power semiconductor chips (e.g., transistors or diodes on printed circuit boards, IGBTs, MOSFETs, or diodes on metallized ceramic substrates or other circuit carriers) are soldered or soldered together, or where metallized ceramic substrates are soldered to metal substrates and / or heat sinks. Printed circuit boards intended for connection to heat sinks can also be soldered in general-purpose soldering apparatus.

[0005] To achieve optimal soldering results, efforts are made to heat the molten solder and the components to be joined in a controlled manner above the solder's melting point, and then cool them in a controlled manner below the solder's solidification point, so as to join the components together without gaps. The solder can be soft solder or hard solder, especially tin solder, but it can also be silver solder, brass solder or phosphorus solder.

[0006] Welding connections are typically made in a process chamber that is sealed relative to its surrounding environment, and is particularly evacuable, where, for example, a substrate and a pressure plate can be arranged, with a solder assembly comprising multiple components and solder material contained between the substrate and the pressure plate. The substrate and pressure plate can be adjusted relative to each other regarding the distance used to apply pressure to the solder assembly. Simultaneously, the pressure plate and / or the substrate can heat and / or cool the components and solder material. For this purpose, the plates can be thermally coupled to a suitable heat source and / or heat sink.

[0007] This type of system can also be designed as a sintering apparatus for manufacturing workpieces from at least one component by pressure sintering (particularly by low-temperature pressure sintering). Such a sintering apparatus may include: an upper tool and a lower tool, with at least one component held between the upper and lower tools, wherein the upper and lower tools are adjustable relative to each other for applying pressure to the workpiece to be sintered; and at least one heating device for heating the workpiece to be sintered.

[0008] In this type of sintering apparatus, solid workpieces can be produced under heat and pressure from so-called green blanks, which consist of fine-grained or coarse-grained materials or mixtures thereof. In addition to compressing and compacting the sintering material, the contacted surfaces of the mating parts are connected mechanically, thermally, and, if applicable, electrically. The intended applications are particularly for the mechanical, electrical, and / or thermal conductive connections between two components (especially electrical semiconductor components such as high-performance switching elements or semiconductor assemblies) and a substrate (typically a PCB, especially a DCB (Direct Copper Bonded) / AMB (Active Metal Braze) lead frame on a metal lead carrier or connecting frame, heat sink, etc.).

[0009] Furthermore, in variations of pressure sintering and low-temperature pressure sintering, two or more components (particularly electronic components and substrates) can be connected to each other by a connecting material (particularly in a conductive and / or thermally conductive manner), wherein the connecting material is sintered. A corresponding apparatus and method are known, for example, from DE 10 2008 009 510 B3.

[0010] Other systems can be designed as automated sintering or welding systems, particularly automated multi-chamber systems with multiple process chambers. The latter includes at least one chamber or module for electrical and / or thermal connections between electrical components and another component group, with an electrical PCB or DCB / AMB lead frame, or with a heat sink.

[0011] The term "component" is generally used to refer to electronic components, circuit carriers, substrates, base carriers, substrates, workpiece carriers, mounting carriers, etc., made of metal, ceramic, plastic or other materials or any desired combination of materials, as well as components (such as power semiconductor chips, (semiconductor) assemblies, etc.) to be mounted thereon.

[0012] Workpiece carriers that can hold several parts or groups of parts at the same time are typically used, which simplifies operation and increases productivity.

[0013] This type of system may have at least one hermetically sealable process chamber in which the components are housed during temperature treatment. Within this process chamber, a specific process atmosphere may be provided to reduce or prevent undesirable chemical reactions (particularly oxidation of the metal surface of the workpiece) and / or to trigger, promote, or catalyze desired chemical reactions. In this process atmosphere, the relative oxygen content may be reduced, for example, to an oxygen content of 0.005% to 0.3%. For this purpose, an inert gas (such as nitrogen (N2)) may be introduced into the process chamber. The process atmosphere may also include a synthesis gas containing a reducing agent, such as formic acid (CH2O2) or nitrogen and hydrogen (N / H).

[0014] The provision of the process atmosphere can also include the influence of pressure conditions, i.e., generating positive or negative pressure.

[0015] This type of system typically includes multiple process chambers in which components can be subjected to different process conditions or atmospheres. For example, the temperature of a component or assembly can be adjusted to a temperature below the melting temperature of the solder material in a first process chamber, heated to the welding temperature in a second process chamber, and controlled cooling in a third process chamber. In each case, the nature of the process atmosphere can vary with the process chamber, or it can vary over time during the residence time in the respective chamber.

[0016] In contrast to flow processes that may occur using unsealed modules or process chambers, workpiece carriers, in the case of sealed modules or process chambers, hold components, or multiple components connected to each other simultaneously, within the module during a so-called stationary process. To ensure assembly line production, several components transported in the assembly line can be arranged in a single workpiece carrier (i.e., grouped), passed through the system in a step-fixing process, and then individually released again into another assembly line. This also makes it possible to integrate step-fixing systems into continuous assembly line processes. Grouping and separation can be automated, allowing for convenient quality control and, if needed, the addition of covers, for example, for sintering processes.

[0017] During the heating of solder or joining materials, their components (such as binders or fillers) may escape into the process atmosphere through sublimation or evaporation, which can lead to undesirable scaling or contamination of components, process chambers, system components held therein, or auxiliary equipment (such as pumps, valves, or piping). Other substances (such as flux, binders used to fix the components or parts to be joined, and reaction products of said components and atmosphere) can also contribute to this type of contamination.

[0018] Using automated multi-chamber systems or systems composed of multiple modules in a modular design, these workpiece carriers can be transported between modules or chambers by means of a transport device also known as a running track. Each chamber can be separated from the others by a vacuum-insertable gate valve to provide an individually set process atmosphere. These vacuum-insertable gate valves or airlocks are typically cooled to protect the seals from thermal damage.

[0019] For example, an apparatus and method for reflow soldering are known from EP 2 768 625 B1, which has a heat source for heating solder material and a negative pressure control device. In the negative pressure control device, the solder material is subjected to at least two negative pressures at a temperature corresponding at least to the liquidus temperature. Furthermore, a method or apparatus for generating negative pressure at least before the start of the soldering operation is also indicated.

[0020] DE 102 374 94 B4 discloses a method for welding in the gas phase, wherein a negative pressure is generated around the materials to be welded before, during, and / or after the solder melts on the materials to be welded in the gas phase region. The patent family DE 102374 94 B4 also discloses an apparatus having two chambers (i.e., a first chamber for the gas phase region and a second chamber for the negative pressure), wherein the second chamber is inside or movable into the first chamber.

[0021] DE 10 2007 005 345 B4 discloses a method and apparatus for reflow soldering an assembly coated with solder paste in an indoor chamber under internal heating. Here, the assembly is transported into the chamber using a conveyor, and then the chamber is sealed. Subsequently, the pressure in the chamber is increased relative to atmospheric pressure, and the temperature is raised by convection heating to melt the solder paste. The pressure is then restored to atmospheric pressure while maintaining the temperature.

[0022] In known systems and methods, there is a common problem that impurities (particularly from weld additives and the atmosphere) remain on the component or part and / or in at least one chamber after cooling. These impurities lead to quality loss during the welding operation and, for example, cause cavities.

[0023] Therefore, the object of the present invention is to provide a system that can reduce or prevent the deposition of unwanted substances inside various modules and on solder joints.

[0024] Another object of the present invention is to provide a system in which the formation of undesirable deposits of substances inside the module and on the materials being welded is reduced or prevented. The object of the present invention is to minimize the residence time of undesirable condensates on the walls of the module, particularly during static processes and in enclosed modules under controlled atmospheres.

[0025] This objective is achieved through the system according to the independent claims. Advantageous further developments of the invention constitute the subject matter of the dependent claims. Summary of the Invention

[0026] The subject of this invention is a system for connecting electronic components, particularly a welding or sintering system having a transport device for conveying electronic components through the system, the system comprising a plurality of hermetically separable modules for interconnecting the electronic components, at least one module being designed as a welding or sintering module, and / or one module being designed as a cooling module.

[0027] It is recommended to arrange an additional module, designed as a soft cooling module, between the welding or sintering module and the cooling module for cooling between the process temperature and intermediate temperature of the welding or sintering module, particularly cooling below the solder solidification temperature. Thus, the soft cooling module is located upstream of the cooling module, allowing initial cooling to reach a desired or achieved temperature that is not specifically equal to room temperature. Preferably, the solder material is cooled in the soft cooling chamber to a temperature slightly below the solder solidification temperature. As a result, impurities (especially solder paste residue) caused by the welding operation can be prevented from settling on the welded material or condensing on the electronic components. In particular, the condensation and deposition of solder paste residue and / or atmosphere from the components or assemblies and within the module itself can be at least reduced and especially prevented. This is achieved, for example, by intentionally causing solder paste residue to condense in the area of ​​the soft cooling module and preferably deposit there. Therefore, impurities can be removed directly from the soft cooling module before final cooling and preferably do not reach the downstream cooling module. Adhesion to the components or assemblies can be avoided, thereby allowing for improvements in the quality of the welded joint. In general, a system, particularly a welding system, can be provided that can reduce scaling in the various chambers of the welding process (especially when using solder paste and / or HCOOH).

[0028] The terms "chamber" and "module" may be used synonymously with the invention illustrated. In the soldering module, a temperature of, for example, 250°C may be present. In the cooling module, the electronic components are preferably cooled to room temperature, i.e., 20°C. So-called first soft cooling can be performed due to an intermediate soft cooling module. This is preferably within a range just below the solder solidification temperature. The solder solidification temperature can be, for example, in the range of 150°C to 220°C. The solder can be, in particular, tin or silver solder (AG). In the soft cooling module, cooling is preferably carried out from a liquidus temperature above, for example, 250°C, to below the solid temperature (i.e., the solder solidification temperature), i.e., controlled cooling from above the melting range through the melting range. Additional modules (e.g., preheating modules and / or gas-lock modules) may be arranged in front of the soldering module for bringing the electronic components into the system.

[0029] To keep assembly and design costs as low as possible, it is advantageous if the soft cooling module does not comply with the requirements of the Pressure Equipment Directive 2014 / 68 / EU. For example, according to 2014 / 68 / EU, vessels, piping, and pressure-holding devices, as well as devices with safety features having an internal positive pressure exceeding 0.5 bar, are considered pressure equipment. Therefore, in a soft cooling module, a positive pressure of less than or equal to 0.5 bar is preferred. The chamber volume can be, for example, about 50 liters or more, and other volumes are conceivable. Thus, internal production checks can be eliminated, for example, reducing the required time. In particular, the pressure can be filled to 0.5 barg and then maintained. The value 0.5 barg means a gauge pressure 0.5 bar higher than atmospheric pressure.

[0030] The temperature within the soft cooling module can be maintained or increased until the required positive pressure is established within the module. Heating within the soft cooling chamber can typically be achieved through convection, such as by gas, by contact heating, and / or by radiation, particularly by IR light.

[0031] Preferably, the system may include a higher level of control. This can be used for all modules of the system. In a preferred embodiment, at least one module may have its own main control circuitry and / or safety circuitry. This allows individual modules and / or individual operating steps to be replaced without requiring a complete reprogramming of the higher-level control. In particular, more than one module, especially two or more modules, may have their own control circuitry and / or safety circuitry.

[0032] In a preferred embodiment, the soft cooling module can be configured to provide a positive pressure of 1 bar, particularly up to 4.5 bar or higher, for the process atmosphere. Preferably, in the soft cooling module, the positive pressure can be increased from -1 bar (vacuum) in the front chamber to more than 1 bar, particularly up to 3.5 bar. Other pressures are also conceivable. In general, the pressure range designed for existing systems is reasonable.

[0033] In a preferred embodiment, the soft cooling module can be configured to provide a negative pressure of less than 1 bar, particularly a vacuum of -1 bar. Therefore, the flow through the welding system can proceed, for example, under vacuum, which also results in reduced scaling in the chamber during the welding process (especially in the case of solder paste and / or formic acid HCOOH).

[0034] In a preferred embodiment, the soft cooling module can be designed as a positive pressure chamber and / or a vacuum chamber. A vacuum-insertable gate valve can be used to separate the soft cooling module from an adjacent module to provide a positive pressure chamber or a vacuum chamber. These vacuum-insertable gate valves or airlocks can be cooled to protect the seals disposed thereon from thermal damage.

[0035] In a preferred embodiment, the soft cooling module may include heating and / or cooling devices, specifically designed as heatable and / or coolable contact plates for controlled temperature regulation and cooling of electronic components from temperatures of 500°C or below to temperatures below the solder solidification temperature, particularly from temperatures of 150°C or below to temperatures below the solder solidification temperature. Temperature regulation and cooling of the electronic components may also be performed from another temperature (e.g., 250°C) to temperatures below the solder solidification temperature.

[0036] In a preferred embodiment, the contact plate can be designed as a heating plate, and the cooling device can be designed as a gas cooling device for cooling the contact plate from the side of the heating plate opposite to the electronic component by a gas flow (preferably a nitrogen flow, especially a helium flow). As a result, controlled cooling can be advantageously achieved. In particular, cooling the heating plate with cold nitrogen can be performed after the required pressure has been established. The gas can flow, for example, from below to at least one closed heating plate. In another embodiment, the desired cooling can be achieved at a selected distance between the heating plate and the electronic component. In all cases, the solder is preferably cooled below its solidification point. Subsequently, the electronic component can be transported from the soft cooling module to a subsequent cooling module.

[0037] The at least one heating plate may be made of aluminum and / or copper. Preferably, the heating plate is made of copper.

[0038] In a preferred embodiment, the contact plate is designed as a sandwich structure. Preferably, cooling can be performed using hot oil. In particular, heating can be performed using heating cables. This type of sandwich plate can form a controllable, particularly heatable, contact plate and is also referred to as a soft cooling plate. The contact plate may include heating conductors inserted in a zigzag form (particularly in the form of at least one tube profile). Additionally, thermocouples (particularly base thermocouples) may be included, for example, arranged centrally and / or flexibly designed. The contact plate may be controlled by a lifting unit system having pressure-controlled vacuum liquid feed, particularly controlled by a motor. In exemplary embodiments, an oil thermostat, an expansion tank, at least one safety valve, and / or a magnetically coupled heat pump may also be included. One-time filling using hot oil can be performed. For example, using a cooling plate, oil temperatures below or equal to 185°C can be achieved in the soft cooling module. For example, this can be achieved using an enhanced water-cooled heat exchanger as an oil cooler. For example, a double-sheathed guide can be used to record the oil volume. Specifically, the thermostat can operate self-sufficiently and / or can use a programmable logic controller (PLC) to generate start signals and temperature requirements. In particular, for practical reasons, a water temperature of 16°C at a flow rate of 35 L / min is advantageous.

[0039] In a preferred embodiment, the contact plate may be mechanically movable, particularly capable of contacting and maintaining a distance from electronic components, and / or the contact plate may include a gas support preferably designed in a tortuous manner. The gas support may, for example, be arranged as an N2 gas support for soft cooling beneath at least one heating plate.

[0040] In a preferred embodiment, a gas purification device for purifying electronic components (particularly using cold gas, preferably cold nitrogen) may be included in the soft cooling module. Due to the gas purification device, impurities from soldering additives and / or the atmosphere can advantageously be removed directly from the soft cooling module and thus away from the electronic components.

[0041] In a preferred embodiment, an inlet valve for allowing gas to enter the process chamber of the soft cooling module may be included on the soft cooling module. This allows the desired amount of pure gas to be supplied directly to the soft cooling module. Specifically, an outlet valve may also be arranged on the soft cooling module for extracting the desired amount of (impure) gas from the soft cooling module. Therefore, the pressure inside the soft cooling module can be directly controlled. In particular, the extraction of impurities can be carried out at the soft cooling module by intentionally removing the gas. Therefore, these impurities advantageously do not enter the downstream cooling module and are thus removed from the solder joints as early as possible before the final cooling of the electronic components or solder joints.

[0042] In a preferred embodiment, a gas collection container may be included outside the process chamber of the soft cooling module. This gas collection container is connected to an inlet valve and is designed to contain gas extracted from the process chamber of the soft cooling module. The gas collection container may, for example, serve as a buffer and supply tank for cleaning and / or cooling gases; this is not limiting. Cleaning devices for cleaning the gas extracted from the soft cooling module may be arranged inside, in front of, or behind this gas collection container. Therefore, the gas can be reused, thereby allowing for a sustainable process and a sustainable system.

[0043] In a preferred embodiment, a positive pressure valve and / or a quick-release valve for checking positive pressure may be included on the soft cooling module. The positive pressure safety valve can prevent positive pressure greater than or equal to 0.5 bar. This ensures that a positive pressure of only less than 0.5 bar is always present in the soft cooling module, eliminating the need for designs based on pressure device instructions.

[0044] In a preferred embodiment, a positive pressure of 4 to 6 bar may also be present in the soft cooling module. The positive pressure can be adjusted according to the welding process.

[0045] In a preferred embodiment, cooling can be performed in the cooling module from temperatures below the solder solidification temperature, particularly from temperatures below 150°C to room temperature. Therefore, the cooling module enables final cooling of the electronic components as they pass through it in a clean state.

[0046] In a preferred embodiment, the cooling module can be under normal or negative pressure, particularly a vacuum. The cooling module can be separated from the soft cooling module by a vacuum-insertable gate valve to allow for different pressure conditions in the two adjacent modules.

[0047] In a preferred embodiment, an additional module upstream of the welding or sintering module may be included, which is designed as a preheating module. The preheating module is preferably located in front of the welding module or the sintering module.

[0048] In a preferred embodiment, the cold trap may be contained within a process chamber, preferably within the process chamber of a soft cooling module, particularly as a gas cooler in the gas outlet path of the process chamber. The cold trap may have a finned structure to expand the cooling surface and allow condensate to flow out. Additionally, the cold trap may have a drip tray configured to collect condensate. The liquid condensate collected in the drip tray can be discharged into a collection container via the drip tray. The removal of condensate can be enhanced by continuous venting via a vacuum pump line. In embodiments, the vacuum pump may also be used to extract cooling and cleaning gases. By intentionally evacuating the vacuum chamber, the remaining solvent can evaporate and condense at the cold trap, and thus be intentionally collected. The cold trap may also function as a gas cooler to protect downstream valves and downstream pump systems.

[0049] Specifically, the cold trap can be designed as described below.

[0050] In a preferred embodiment, the separation of the hermetically separable module or process chamber can be achieved using a vacuum-insertable gate valve, wherein the sealing performance of the vacuum-insertable gate valve increases with increasing pressure, and / or pressure equalization is performed when the pressure is too high. Therefore, the vacuum-insertable gate valve can be designed as a sealing element. As the positive pressure increases, these valves close more and more tightly, making opening under positive pressure impossible. This can be particularly achieved because the maximum force of the actuation unit cannot open it. Alternatively or additionally, the vacuum-insertable gate valve can be arranged such that gas can be released when the internal pressure or positive pressure is too high. This can occur, for example, in such a way that the valve plate is appropriately deformed to allow gas to flow out to the atmosphere. Advantageously, no ambient air can infiltrate into the module, particularly into the soft cooling chamber. Advantageously, at least one electronic component can therefore pass through the system without being damaged by oxygen.

[0051] In an advantageous embodiment, the vacuum insertable gate valve can be operated via flow control. Specifically, flow control ensures that no air or oxygen can enter the module at any time, particularly the welding module and the soft cooling module. This allows for the avoidance of energy-intensive gas purification processes. Due to the constant oxygen-free process atmosphere, combustion or impurities caused by oxygen from residues from the welding process can be avoided.

[0052] Advantageously, the method for welding can be carried out using the following steps: evacuating the liquefied solder material inside the module, especially the welding module, and transporting the electronic components to the soft cooling module under vacuum, wherein at least one electronic component does not experience any temperature loss during transport.

[0053] Furthermore, the subject of this invention is a system for connecting electronic components, particularly a welding and / or sintering system, preferably the previously described system with a soft cooling module. This system has a transport device for conveying electronic components through the system, which includes multiple hermetically separable modules for interconnecting the electronic components, wherein at least one module is designed as a welding or sintering module and / or one module is designed as a cooling module. The modules are preferably designed as drying modules for drying sintering paste.

[0054] A module is proposed that, in a welding or sintering module specifically designed as an hermetically sealed process chamber, is arranged at least one heat source that can contact electronic components for heating the electronic components, and at least one cold trap that has a surface temperature lower than the operating temperature of the heat source during operation.

[0055] This system may specifically include at least one soft cooling chamber, and the cold trap may be advantageously arranged within the soft cooling chamber. Optionally, one or more cold traps may be arranged in one or more modules, particularly in welding or sintering modules, preheating modules, and / or cooling modules.

[0056] Undesirable substances condense or sublimate in the cold trap, particularly components of solder paste and their reaction products used as solder materials (these components and reaction products evaporate or sublimate into the process atmosphere during co-heating of the components, especially the solder materials, or originate from their reaction products in the process).

[0057] In particular, this allows the use of solder paste in the welding system without the need for additional flux. Preventing oxidation of the surfaces of the materials being welded and removing existing oxide layers can be achieved by introducing a reduction device into the process atmosphere. Thus, the air in the process chamber can be purified by evacuating and filling it with N2, and consequently, O2, achieving an oxygen-free environment. The reduction device removes O2 from the surfaces of the components.

[0058] The cold trap can be bolted to the rear wall of the cold chamber, i.e., inside the process chamber. Other installation methods and locations are also conceivable.

[0059] In a preferred embodiment, a specific process atmosphere can be provided in the process chamber, wherein the cold trap and heat source are arranged relative to each other such that, at least during a specific operational phase, flow exists in the process atmosphere solely due to convection generated by the temperature difference between the cold trap and the heat source. In another embodiment, a cooling jacket, i.e., the outer wall of the process chamber, can be provided. For example, a high-capacity thin infrared carbon heating foil can be attached to the outer surface above one or more deep boreholes. This will heat the jacket of the process chamber. For maintenance work, the heater can be shut off, and the chamber or module can be cooled.

[0060] In a preferred embodiment, the surface temperature of the cold trap can range from -196°C (77K) to as high as 150°C, particularly from 16°C to 25°C, and the cascadeable surface temperature of the cold trap is preferably available. For cascaded cold traps, a decrease in the temperature of the cold trap can be provided to the cascade so as not, for example, the amount of condensate is not concentrated too intensely. As the temperature of the cold trap decreases, the cascade can have a first stage of the cascade with a temperature lower than that of the second stage to facilitate convection of process gases inside the process chamber.

[0061] In a preferred embodiment, at least one additional heat source can be provided for heating the process chamber. Advantageously, heating the cold trap can be used to remove condensate therein during the process. To this end, the cold trap can be heated at an appropriate stage of the connection process to liquefy the condensate collected there or improve its flow characteristics. The cold trap can then be cooled again, allowing this to be repeated cyclically to clean the cold trap. Heating the cold trap can be achieved, for example, by reducing the flow rate of cooling water to 0 m / s.

[0062] In a preferred embodiment, the operating temperature of the heat source and / or auxiliary heat source can be between 150°C and 400°C, or preferably between 200°C and 300°C. The desired effect of the cold trap's operating temperature and the heat source generally depends on the process used and the materials used, and possibly on the desired effect.

[0063] In a preferred embodiment, at least one, and particularly multiple, electronic components can be arranged on the workpiece carrier, and preferably at least sometimes at a distance from the workpiece carrier in the direction of the cold trap, specifically such that the distance from the components to the cold trap is less than the distance from the workpiece carrier to the cold trap. Advantageously, multiple components can be arranged on the workpiece carrier. Here, the components can be spatially exposed on the workpiece carrier and have a distance in the direction of the cold trap, for example, mounted at a high position in the workpiece carrier or mounted in a height-adjustable manner. As a result, a reduced spatial distance from the components to the cold trap can be achieved to improve the convection effect of impurities toward the cold trap. The cold trap can also have raised portions in the component region on the surface facing the components in order to reduce the spatial distance to the components. These raised portions on the workpiece carrier and / or the cold trap can be variable, for example, by means of spring loading or actuators, such that the distance reduction is selectively provided only during active operation of the cold trap.

[0064] In a preferred embodiment, at least a portion of the process chamber, particularly at least one wall surface of the process chamber and / or the surface of a transport device disposed within the process chamber and configured for inserting and / or removing components, may be designed as a temperature-regulating zone. This temperature-regulating zone has a temperature during operation between the surface temperature of the cold trap and the operating temperature of the heat source, preferably between 50°C and 150°C, and particularly between 80°C and 120°C. The temperature-regulating zone is preferably located in an area on the outer side of the process chamber.

[0065] In a preferred embodiment, the process chamber can be connected to or may be connected to a venting device via piping, wherein the outlet of the piping into the process chamber is located adjacent to the cold trap. Condensed residue can be intentionally discharged via piping.

[0066] In a preferred embodiment, the cold trap may have a plurality of heat sinks, preferably extending in a vertical direction. This significantly increases the surface area of ​​the cold trap, thereby improving efficiency. Additionally, the heat sinks can simultaneously be used to extract condensate from the cold trap. Therefore, the heat sinks are preferably vertically aligned so that the condensate can be guided vertically downward along the fins solely by gravity and thus via the shortest possible path.

[0067] In a preferred embodiment, a collection device may be disposed below the cold trap to collect condensate generated at the cold trap. The collection device is preferably arranged over the entire width or length of the heat sink to reliably collect condensate flowing through the heat sink. The collection device may be designed, for example, as a deflector plate. Specifically, the collection device is designed at an angle to create a gradient that intentionally guides the condensate in one direction. At the end of the gradient, that is, on one side of the collection device, an opening, such as a slot or a separate hole, may be provided to guide the condensate out of the collection device.

[0068] In an advantageous embodiment, the distance between the heat source and / or the workpiece carrier with components relative to each other in the direction of the cold trap is adjustable. This allows for spatial convergence of the components or removal of the workpiece carrier during condensate extraction by the cold trap.

[0069] In an advantageous embodiment, the workpiece carrier can be heated individually, thereby preventing the deposition of condensate thereon and maintaining or even increasing the temperature gradient of the cold trap. Therefore, the removal of impurities can be intentionally controlled.

[0070] In an advantageous embodiment, a speed-controlled vacuum pump with a liquid separator is provided to generate negative pressure in the process chamber. The liquid separator allows for the possibility of combining condensate and cleaning the extracted condensate atmosphere in a manner similar to water pipes. The outlet of the vacuum pump in the process chamber can here advantageously be arranged in the area of ​​the cold trap to extract the condensate collected there.

[0071] In an advantageous embodiment, at least one vacuum insertable gate valve may be provided, particularly two heated vacuum insertable gate valves located on two opposite sides of the process chamber, for insertion and / or removal of components. The possibility of heating the vacuum insertable gate valves prevents the deposition of condensate on the valves, thus avoiding the formation of undesirable cold traps.

[0072] Advantageously, the outer walls of the process chamber and / or the vacuum gate valve can be additionally electrically heated, enabling defined temperature differences and convection to the cold trap, and ensuring that the inner walls of the outer chamber and the inner surfaces of the vacuum gate, i.e., the gate valve, are not coated with condensate. For this purpose, PTFE mesh heating pads up to 250°C or heating pads made of textile glass fiber are ideal, while simultaneously achieving heating temperatures up to 450°C. Infrared heating pads, such as those made of rubber or carbon heating foil, can also be used, which can effortlessly reach temperatures such as 60°C, but can be modified for higher radiation capabilities and higher temperature ranges. This allows the inner walls of the outer chamber and / or the vacuum insertable gate valve to be at least partially coated. Attached Figure Description

[0073] Further advantages are revealed by the accompanying drawings and description thereof. The drawings illustrate exemplary embodiments of the invention. The drawings, description, and claims contain a number of features in combination. Those skilled in the art will also readily consider these features individually and combine them into other meaningful combinations.

[0074] In the diagram:

[0075] Figure 1 This is an embodiment of the system according to the present invention presented in the form of a three-dimensional diagram;

[0076] Figure 2This is a cross-sectional view of another embodiment of the system according to the present invention;

[0077] Figure 3 This is a circuit diagram of an embodiment of the system according to the present invention;

[0078] Figure 4 This is an embodiment of a cold trap;

[0079] Figure 5 This is a circuit diagram of another embodiment of the system according to the present invention;

[0080] Figure 6 This is a floor plan of the process room;

[0081] Figure 7 yes Figure 6 Cross-sectional view of the process chamber;

[0082] Figure 8 yes Figure 6 Another view of the process room;

[0083] Figure 9 It is a cold trap with heat sinks;

[0084] Figure 10 This is another embodiment of a cold trap with heat sinks;

[0085] Figure 11 This is a side view of another cold trap;

[0086] Figure 12 These are possible cooling loops in a cold trap;

[0087] Figure 13 It is used for Figure 12 The housing element of the cold trap;

[0088] Figure 14 It is the collection device for the cold trap;

[0089] Figure 15 This is a plan view of a module of a welding system equipped with a robot;

[0090] Figure 16 This is an example of a workpiece carrier;

[0091] Figure 17 This is another embodiment of the cold trap;

[0092] Figure 18 It is used for Figure 17 An embodiment of the housing element of the cold trap;

[0093] Figure 19 It is with Figure 17 and Figure 18 Side view of the housing element of the cold trap;

[0094] Figure 20 yes Figure 19 Another view of the embodiment;

[0095] Figure 21 yes Figure 19 Cross-sectional view of an embodiment;

[0096] Figure 22 yes Figure 20 Detailed views of the embodiments;

[0097] Figure 23 It is an isometric view of a receiving element with an opening element;

[0098] Figure 24 It is a cross-sectional representation passing through the process chamber;

[0099] Figure 25 This is another embodiment of the workpiece carrier;

[0100] Figure 26 yes Figure 25 Another view of an embodiment.

[0101] In the accompanying drawings, the same or similar parts are given the same reference numerals. Detailed Implementation

[0102] Figure 1 An embodiment of the system 10 according to the present invention is illustrated in perspective. The system 10 can be designed as a welding system 10a and includes multiple modules 16. In this embodiment, the system 10 includes at least five modules 16, wherein the first and last modules 16 can each be further subdivided. The three middle modules 16 form a preheating module 14, a welding or sintering module 18, and a soft cooling module 22. The soft cooling module is arranged between the welding or sintering module 18 and the cooling module 20. In the illustrated embodiment, the cooling module 20 forms the last module 16 of the system 10. Additionally, in an embodiment not shown, an unloading module may be located downstream of the cooling module 20. Therefore, the module 16 on the upper left of the figure can be designed as a loading module.

[0103] Figure 2 A cross-sectional view of another embodiment of the system 10 according to the invention is shown. The vacuum-insertable gate valve 44 between the various modules 16 is identifiable here. Figure 1Unlike other embodiments, the housing is not shown. This embodiment shows four modules 16: a preheating module 14, a welding or sintering module 18, a soft cooling module 22, and a cooling module 20. Modules 16 are arranged one after another in the described order. In each case, the soft cooling module 16 is spatially separated from the welding or sintering module 18 and the cooling module 20 by a vacuum-insertable gate valve 44. A heating plate may be arranged in the soft cooling module 16, wherein the heating plate can be cooled from below using cold gas, particularly nitrogen. This allows the electronic components to be cooled just below the solder solidification temperature.

[0104] Figure 3 A circuit diagram of an embodiment of the system 10 according to the invention is shown. The soft cooling module 22 can be designed as a positive pressure chamber 24 or a vacuum chamber 26. A positive pressure valve 30 is arranged on the soft cooling module 22. Additionally, the soft cooling module 22 is connected to a forepump 38 via a vent valve 36. For cleaning electronic components, a gas collection container 32 connected to the soft cooling module 22 via an inlet valve 28 is provided in this embodiment. The gas collection container can collect, for example, gases, particularly nitrogen, which are used to purify the electronic components in the soft cooling module 22. Advantageously, the gas is cleaned before, after, or inside the gas collection container 22 so that it can then be supplied back to the soft cooling module 22 via a supply line. Therefore, the gas can be reused. Additionally, the soft cooling module 22 includes a quick-release valve 34. Using the described structure, the positive pressure, negative pressure, or vacuum inside the soft cooling module 22 can be controlled.

[0105] Figure 4 An embodiment of cold trap 46 is shown. Cold trap 46 can be arranged inside the process chamber of soft cooling module 22. In this embodiment, cold trap 46 has fins 48 for expanding the cooling surface and allowing condensate to flow out. Additionally, cold trap 46 may have a drip tray (not shown) configured to collect condensate. Cold trap 46 can also act as a gas cooler to protect downstream valves and downstream pump systems.

[0106] Figure 5 A circuit diagram of another embodiment of the system 10 according to the present invention is shown. (Compared to...) Figure 3 Unlike other embodiments, an additional pressure control valve 42 is arranged on the soft cooling module 22. Like the positive pressure safety valve 30, it may have a connection to the exhaust gas.

[0107] In all the embodiments shown, a positive pressure can be generated in the soft cooling module 22, which may be, for example, less than 0.5 bar, to avoid the need for certification according to pressure equipment directives. The soft cooling module 22 may also be designed according to pressure equipment directives and have a positive pressure of, for example, 3 bar or greater. The controlled temperature can be adjusted to just below the solder solidification temperature using heating and / or cooling devices in the soft cooling module 22. This allows impurities in the solder to be prevented from accumulating in the soft cooling module 22 before they are fully cooled to room temperature in the downstream cooling module 20, and therefore cannot accumulate on the electronic components. Therefore, it is advantageous to use a purifying gas in the soft cooling module 22 to remove or purify impurities directly from or away from the soft cooling module 22.

[0108] Figure 6 A plan view of the process chamber 52 is shown. The process chamber 52 is preferably designed as an airtight, sealable process chamber and is arranged inside module 16, which is designed as welding module 18. Within the process chamber 52, multiple electronic components are arranged on the workpiece carrier 56. Additionally, a heat source 50 ( Figure 7 (As shown in the diagram) and cold trap 46 are arranged in process chamber 52. This allows the formation of cold region 72 and hot region 74. Process chamber 52 is preferably a vacuum process chamber. A specific process atmosphere can be provided in process chamber 52 using heat source 50 and cold trap 46. Due to the arrangement of cold trap 46 and heat source 50 relative to each other, the flow in the process atmosphere is therefore generated solely by convection, which is generated by the temperature difference between cold trap 46 and heat source 50.

[0109] Figure 7 It shows Figure 6A cross-sectional view of the process chamber 52. In this view, the heat source 50 is shown on the lower side of the process chamber 52. Therefore, the heat source 50 is preferably below the workpiece carrier 56. An additional heat source (not shown) can be arranged for additional heating of the process chamber 52. For optimal effect, it is advantageous for the cold region 72 to protrude as far as possible into the process chamber 52. Due to the cold trap 46, less fouling occurs in the module 16 during the soldering process. This is achieved by collecting condensate from the solder paste and intentionally transferring it out of the system. Preferably, a pressure of less than or equal to 950 bar plays a dominant role in the process chamber 52. This can be achieved, for example, by N2, N2H2, or HCOOH, or by a gas mixture. In particular, there is a stationary gas without forced guidance. This leads to the evaporation of organic components, while the hot gas rises upward with the organic components in the process chamber 52. However, the temperature gradient between the hot and cold surfaces leads to convection of gases inside the process chamber 52, especially inside the vacuum process chamber. Volatile components thus condense on the cold surface and are therefore transferred into the cold trap 46 and collected there. Additional advantages include the resulting condensate residue evaporating on the surface at approximately 100°C and ultimately being intentionally disposed of by evacuation of the vacuum process chamber, for example by vacuum pump 66 and / or liquid separator 68.

[0110] Figure 8 It shows Figure 6 Another view of process chamber 52. The surface on which the residue of condensate evaporates is shown by temperature control zone 76. In this type of embodiment, the intentional use of the vapor pressure of the solvent can be specifically utilized. Some solvent condenses on temperature control zone 76 because the vapor pressure of 950 bar is higher than 100°C. By intentionally evacuating process chamber 52, especially a vacuum process chamber, the residue of the solvent evaporates and also condenses on the cold surface of cold trap 46, i.e., in cold zone 72, and is therefore intentionally collected. Thus, in the region of cold trap 46, the temperature range of 2°C to 30°C, preferably 16°C to 25°C, plays a dominant role. In temperature control zone 76, the temperature can be 100°C. In the region of heat source 50 and on the upper side of process chamber 52, for example due to additional heat source 54, the temperature can be 150°C to 300°C.

[0111] Figure 9 A cold trap 46 with heat sink 48 is shown. The heat sink 48 can be arranged on the inner wall of the process chamber 52 and is used to expand the cooling surface. In addition, the heat sink 48 can improve the outflow of condensate. The figure shows a view taken from inside the process chamber 52, in which the workpiece carrier 56 is arranged on the bottom plate of the process chamber 52.

[0112] Figure 10Another embodiment of a cold trap 46 with heat sink 48 is shown. Below the heat sink 48, a collection device 64 is identifiable, which is designed to collect condensate generated at the cold trap 46.

[0113] Figure 11 A side view of another cold trap 46 is shown. The arrows indicate the direction of condensate outflow or flow. The condensate travels downward inside the heat sink 48 in the cold trap 46 and falls onto the collection device 64. The collection device 64 can be designed, for example, as a drip tray. The collected condensate flows through the collection device 64 in the direction of the collection container 82. Continuous evacuation can be assisted by a vacuum pump line. The condensate specifically contains solvents, unwanted deposits, and / or impurities.

[0114] Figure 12 The possible cooling circuit of cold trap 46 is shown in the direction of the arrow. Figure 13 It shows the use of Figure 12 The cold trap 46 has a receiving element 69. In this type of embodiment, the cold trap 46 can therefore be installed in a replaceable manner. The cold trap 46 is inserted into the receiving element 69 from the rear, specifically on guides 84 arranged on two opposite sides of the receiving element 69. Thermal insulation is also specifically arranged on the guides 84. The receiving element 69 is directly mounted on the process chamber 52 (not shown). The receiving element 69 itself may also form the process chamber 52, in which the cold trap 46 can be directly mounted on the process chamber 52.

[0115] Figure 14 The collection device 64 of the cold trap 46 is shown. (As shown) Figure 11 As shown in the figure, the collecting device 64 is designed as a drip tray, wherein the collected condensate is discharged rearward into the receiving element 69 via an opening 65 (designed as a slot in this embodiment).

[0116] Figure 15 A plan view of module 16 of a welding system 10a with a robot is shown. Module 16 shown can be specifically represented in... Figure 1 The module 16 shown on the right side of the left hand is particularly designed as a loading station. In the loading station, the workpiece carrier 56 specifically loads the electronic components 12, which in this embodiment can be accomplished using a robotic arm 78.

[0117] Figure 16 An embodiment of the workpiece carrier 56 is shown. This is designed for six electronic components 12. This type of workpiece carrier 56 is specifically used for, for example... Figures 6 to 9 In the process chamber 52 shown.

[0118] Figure 17Another embodiment of the cold trap 46 is shown. Also in this embodiment, the cold trap 46 also has a collection device 64 that extends as an inclined plane on the underside of the cold trap 46. (Compared to...) Figure 14 In contrast, the collection device 64 does not have a slot, but has a separate opening 65 through which condensate is discharged from the cold trap 46 and enters the receiving element 69 (not shown).

[0119] Figure 18 It shows the use of Figure 17 An embodiment of the receiving element 69 of the cold trap 46. On the underside of the receiving element 69, a plurality of inclined surfaces 86 are arranged, through which condensate can be transferred out of the opening 65 of the cold trap 46. The condensate travels through the inclined surfaces 86 to the opening 88 and is discharged from the receiving element 69 through the opening 88. In the illustrated embodiment, the receiving element 69 has two openings 88 of this type, with two inclined surfaces 86 opening to each of these two openings. In other words, the receiving element 69 forms a receiving box for the cold trap.

[0120] Figure 19 It shows having Figure 17 and Figure 18 A side view of the housing element 69 of the cold trap 46. It can be seen that a conduit 60, intended for condensate discharge, is connected to the opening 88. In other words, the process chamber 52 is connected via the conduit 60. The outlet of the conduit 60, connected to the opening 88, is positioned adjacent to the cold trap 46. A heating sleeve 90 may be arranged around the conduit 60.

[0121] This type of structure, having a housing element 69, can also be called a venting device 62. The venting device 62 can, of course, be designed to work with... Figure 19 The venting device shown is different.

[0122] Figure 20 It shows Figure 19 Another view of the embodiment. It can be seen that the receiving element 69 has two openings 88 on its underside, both of which are connected by a conduit 60.

[0123] Figure 21 It shows Figure 19 A cross-sectional view of an embodiment. In this embodiment, it can be seen how the cold trap 46 (particularly in the form of a drip tray) with a collection device 64 is inserted into the receiving element 69 from one side. The cold trap 46 can be held in the receiving element 69 in a guided manner by the guide 84.

[0124] Figure 22 It shows Figure 20Detailed views of the embodiment are shown. Two connectors 47 for the cold trap 46 are disposed on the right-hand side. A heating element 92 is arranged on the underside of the receiving element 69, and its connector 94 is also on the right-hand side of the receiving element 69. This heating element 92 may, for example, form an additional heat source 54.

[0125] Figure 23 An isometric view of a receiving element 69 having an opening element 69a is shown. The opening element 69a is rotatably mounted on the receiving element 69.

[0126] Figure 24 A cross-sectional view through the process chamber 52 is shown. A heating plate 96, equipped with a heating conductor 98, is disposed on the underside of the process chamber 52. To close the process chamber 52, it may have a rotating cover (not shown) that can be bolted to the process chamber 52. This allows the process chamber 52 to be designed to be airtight.

[0127] Figure 25 Another embodiment of the workpiece carrier 56 is shown. Figure 26 It shows Figure 25 Further views of the embodiment are shown. The heating plate 96 is identifiable directly beneath the housing element of the electronic component 12 (not shown). The heating plate 96 can be designed as a contact plate with a sandwich structure. Cooling can be performed using hot oil and / or heating cables. This type of sandwich plate can form a controllable and heatable contact plate and is also referred to as a soft cooling plate. For soft cooling, a heating conductor 98 inserted in a zigzag manner is included within the heating plate 92. Additionally, thermocouples (particularly base thermocouples) can be included, for example, arranged centrally and / or flexibly designed.

[0128] List of reference numerals

[0129] 10 System

[0130] 10a Welding System

[0131] 12 Electronic Components

[0132] 14 Preheating Module

[0133] 16 modules

[0134] 18 Welding or sintering modules

[0135] 20 Cooling Module

[0136] 22 Soft Cooling Module

[0137] 24 Positive pressure chamber

[0138] 26 Vacuum Chamber

[0139] 28 Inlet Valve

[0140] 30 Positive pressure valve

[0141] 32 Gas collection container

[0142] 34 Quick-release valve

[0143] 36. Drain valve

[0144] 38 Backing Pump

[0145] 40 Pressure Monitoring Room

[0146] 42 Pressure control valve

[0147] 44 Vacuum Insertable Gate Valve

[0148] 46 Cold Trap

[0149] 47 Cold trap connectors

[0150] 48 Fins / Heat Discharge Plates

[0151] 50 heat sources

[0152] 52 Process Room

[0153] 54 Additional heat source

[0154] 56. Workpiece carrier

[0155] 58. Transport equipment

[0156] 60 pipes

[0157] 62. Venting device

[0158] 64 Collection device

[0159] 65 Opening

[0160] 66 Vacuum pump

[0161] 68 Liquid Separator

[0162] 69. Retaining element

[0163] 69a Opening element for accommodating components

[0164] 72 Cold Zone

[0165] 74 Hot Zones

[0166] 76 Temperature Control Zone

[0167] 78 robotic arms

[0168] 80 Cooling Element

[0169] 82 Collection Container

[0170] 84 Guide

[0171] 86 Inclined surface

[0172] 88 Opening

[0173] 90 Heating sleeve

[0174] 92 Heating element for housing components

[0175] 94 Connectors for heating elements

[0176] 96 Heating Plate

[0177] 98 Heating conductor

Claims

1. A welding and / or sintering system (10a) for connecting electronic components (12), the system (10a) having a transport device for conveying the electronic components (12) through the system (10a), the system (10a) comprising a plurality of hermetically separable modules (16) for connecting the electronic components (12) to each other, wherein, At least one module (16) is designed as a welding and / or sintering module (18), and one module (16) is designed as a cooling module (20), characterized in that the welding and / or sintering system (10a) includes a higher level of control for controlling the module, wherein an additional module (16) is arranged between the welding or sintering module (18) and the cooling module (20), the additional module (16) being designed as a soft cooling module (22) for cooling the welding or sintering module (18) between a process temperature and an intermediate temperature below the solder solidification temperature, wherein the soft cooling module (22) includes heating and / or cooling devices for controlled temperature regulation and cooling of the electronic component (12) from 500°C or below to the intermediate temperature of the solder solidification temperature in the range of 220°C to 150°C, wherein the soft cooling module (22) includes a gas purification device for purifying the electronic component (12).

2. The welding and / or sintering system (10a) according to claim 1, characterized in that, The soft cooling module (22) is configured to provide a positive pressure of 1 bar for the process atmosphere.

3. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, The soft cooling module (22) is configured to provide a negative pressure of less than 1 bar.

4. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, The soft cooling module (22) is designed as a positive pressure chamber (24) and / or a vacuum chamber (26).

5. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, The heating and / or cooling device is designed as a heatable and / or coolable contact plate.

6. The welding and / or sintering system (10a) according to claim 5, characterized in that, The contact plate is designed as a heating plate, and the cooling device is designed as a gas cooling device for cooling the contact plate by a gas flow from the side of the heating plate opposite to the electronic component (12).

7. The welding and / or sintering system (10a) according to claim 5, characterized in that, The contact plate is mechanically movable, and / or the contact plate includes a gas support.

8. The welding and / or sintering system (10a) according to claim 1, characterized in that, An inlet valve (28) for allowing gas to enter the process chamber (52) of the soft cooling module (22) is included on the soft cooling module (22).

9. The welding and / or sintering system (10a) according to claim 8, characterized in that, A gas collection container (32) is contained outside the process chamber (52) of the soft cooling module (22), the gas collection container is connected to the inlet valve (28) and is designed to contain gas extracted from the process chamber (52) of the soft cooling module (22).

10. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, A positive pressure valve (30) and / or a quick relief valve (34) for checking positive pressure are included on the soft cooling module (22).

11. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, There is a positive pressure of 4 to 6 bar in the soft cooling module (22).

12. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, Cooling from a temperature below the solder solidification temperature to room temperature occurs in the cooling module (20).

13. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, The cooling module (20) is under normal or negative pressure.

14. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, Includes an additional module (16) connected in front of the welding or sintering module (18), which is designed as a preheating module (14).

15. The welding and / or sintering system (10a) according to claim 8, characterized in that, The cold trap (46) is contained in the process chamber (52) of the soft cooling module (22).

16. The welding and / or sintering system (10a) according to claim 1 or 2, characterized in that, The separation of the airtight separable module (16) is achieved using a vacuum insertable gate valve (44), wherein the tightness of the vacuum insertable gate valve (44) increases with increasing pressure, and / or the pressure is balanced using the vacuum insertable gate valve (44) when the pressure is too high.

17. The welding and / or sintering system (10a) according to claim 1, characterized in that, In the hermetically sealable process chamber (52), in the module (16) which is designed as a welding or sintering module (18) or a soft cooling module (22), there is arranged at least one heat source (50) and at least one cold trap (46) that are in contact with the electronic component (12) for heating the electronic component (12), the at least one cold trap (46) having a surface temperature lower than the operating temperature of the heat source (50) during operation.

18. The welding and / or sintering system (10a) according to claim 17, characterized in that, A specific process atmosphere is provided in the process chamber (52), wherein the cold trap (46) and the heat source (50) are arranged relative to each other such that, at least during a specific operating phase, there is flow in the process atmosphere solely due to convection generated by the temperature difference between the cold trap (46) and the heat source (50).

19. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, The surface temperature of the cold trap (46) is between -196°C (77K) and 150°C.

20. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, Provide at least one additional heat source (54) for heating the process chamber (52).

21. The welding and / or sintering system (10a) according to claim 20, characterized in that, The operating temperature of the heat source (50) and / or the auxiliary heat source (54) is between 150°C and 400°C, or between 200°C and 300°C.

22. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, At least one electronic component (12) is arranged on the workpiece carrier (56) and is at least sometimes spaced a certain distance from the workpiece carrier in the direction of the cold trap (46) such that the distance from the electronic component (12) to the cold trap (46) is less than the distance from the workpiece carrier (56) to the cold trap (46).

23. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, At least one local area of ​​the process chamber (52) is designed as a temperature regulation zone, wherein the temperature regulation zone has a temperature between the surface temperature of the cold trap (46) and the operating temperature of the heat source (50) during operation.

24. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, The process chamber (52) is connected to or can be connected to an evacuation device (62) via a pipe (60), wherein the outlet of the pipe (60) into the process chamber (52) is located adjacent to the cold trap (46).

25. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, The cold trap (46) has multiple heat sinks (48).

26. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, A collection device (64) is disposed below the cold trap (46) to collect the condensate generated in the cold trap (46).

27. The welding and / or sintering system (10a) according to claim 22, characterized in that, The distance between the heat source (50) and / or the workpiece carrier (56) with the electronic components (12) relative to each other in the direction of the cold trap (46) is adjustable.

28. The welding and / or sintering system (10a) according to claim 22, characterized in that, The workpiece carrier (56) is capable of being heated independently.

29. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, A speed-controlled vacuum pump (66) with a liquid separator (68) is provided to generate negative pressure in the process chamber (52).

30. The welding and / or sintering system (10a) according to claim 17 or 18, characterized in that, At least one heatable vacuum insertable gate valve is provided for inserting and / or removing the electronic component (12).

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