Turnover device

Abstract

The application provides a turnover device, which comprises a support body, a rotating driver and a clamping device. A plurality of partition plates are formed on the inner side of the two side walls of the support body, and a slide groove for placing a wafer is formed between adjacent partition plates. The outer side of the two side walls of the support body is provided with a rotating shaft. The rotating driver is connected with at least one rotating shaft to drive the support body to rotate. The clamping device is arranged on the side wall of the support body and is used for pressing or releasing the wafer placed in the slide groove. In the application, the clamping device is arranged on the support body for holding the wafer, and the wafer is fixed by the clamping device when the support body rotates, so that the wafer can be effectively prevented from shaking in the support body when the posture of the support body is changed, and the wafer can be effectively prevented from being broken or scratched.

Description

Technical Field

[0001] This invention relates to the field of semiconductor equipment, and in particular to a flipping device. Background Technology

[0002] In semiconductor device manufacturing, various processes are involved, each requiring different wafer placement orientations to achieve its respective processing objectives. For example, as semiconductor manufacturing processes continue to shrink, the requirements for wafer surface cleanliness are becoming increasingly stringent. To balance wafer surface cleaning effectiveness and efficiency, engineers have developed tank-type single-wafer combined cleaning machines, integrating tank-type and single-wafer cleaning machines into a single unit. As is well known, in a tank-type cleaning machine, the wafer is vertically immersed in the cleaning tank for cleaning, while in a single-wafer cleaning machine, the wafer is horizontally held on a support platform for cleaning. Since conventional robotic arms only have a gripping function, easily grasping wafers in vertical or horizontal orientations but lacking a flipping function, adding a flipping capability would increase the complexity of their structure and operation. Therefore, flipping mechanisms are typically incorporated into the wafer transfer process in different orientations, serving as intermediate platforms to change the wafer placement orientation to adapt to different processes and facilitate robotic arm transport.

[0003] See Figure 1 After the previous process is completed, robot arm 101 picks up wafer 103 and transfers it to wafer holder 111 in flipping mechanism 110. Flipping mechanism 110 also includes a receiving cavity 113 and a driver 115. Wafer holder 111 is mounted in receiving cavity 113, and driver 115 drives wafer holder 111 to rotate within receiving cavity 113, so that wafer 103 held in wafer holder 111 changes from a vertical to a horizontal orientation. Then, another robot arm 102 extends from loading port 114 in receiving cavity 113, see [link to details]. Figure 2 The wafer 103 is removed from the flipping mechanism 110 in a horizontal orientation and transferred to the next process.

[0004] See Figure 3 The wafer support 111 has one or more sets of wafer slots 112 for accommodating one or more wafers 103. To facilitate the loading and unloading of the wafers 103, the width of the slots 112 on the wafer support 111 is greater than the thickness of the wafers 103. Typically, the slot width is about 4 mm, and the wafer 103 thickness is about 0.7 mm. When the wafer rotates from a vertical to a horizontal position, because the wafer thickness is less than the slot width, it will wobble within the wafer slots 112 under its own gravity during rotation (see [reference]). Figure 3 (In the direction indicated by the middle arrow) This can cause scratches on the wafer surface, or even lead to fragmentation. Summary of the Invention

[0005] The purpose of this invention is to provide a flipping device that can solve the problem of scratches or fragments caused by the shaking of wafers when they change their orientation during transport in a washing machine that combines tank and single-wafer cleaning.

[0006] To achieve the above-mentioned objectives and other related objectives, the present invention provides a flipping device, comprising:

[0007] The support body has multiple partition plates formed on the inner surfaces of its two side walls, and wafer slots for placing wafers are formed between adjacent partition plates. The outer surfaces of the two side walls of the support body have rotation shafts.

[0008] A rotary driver, the rotary driver being connected to at least one rotating shaft to drive the support body to rotate; and

[0009] A clamping device is disposed on the side wall of the support body and is used to clamp or release the wafer placed in the wafer tray.

[0010] Preferably, in the flipping device, the clamping device includes:

[0011] The housing is fixed to the side wall of the support body;

[0012] An air inlet, located at one end of the housing, is used to connect to an air source;

[0013] The piston is slidably disposed within the housing and is driven by an air source;

[0014] The telescopic rod is slidably installed inside the housing, with one end fixedly connected to the piston.

[0015] A return spring is located at the other end of the housing and connected to the other end of the telescopic rod, used to reset the piston and telescopic rod.

[0016] Multiple limiting grooves are provided on one side of the housing and are arranged at equal intervals along the length of the telescopic rod;

[0017] Multiple limiting rods, one end of which is fixed to a telescopic rod, and the other end passes through their respective limiting grooves. The limiting rods slide within the limiting grooves driven by the telescopic rods, pressing or releasing the wafers placed in the wafer carrier grooves.

[0018] Preferably, in the flipping device, the clamping device further includes a drain chamber for collecting and draining liquid accumulated inside the housing.

[0019] Preferably, in the flipping device, the clamping device is further provided with a displacement sensor for measuring the displacement of the telescopic rod.

[0020] Preferably, in the flipping device, the partition plate of the support body is provided with a receiving groove for accommodating the limiting rod.

[0021] Preferably, in the flipping device, the bottom of the slide groove of the support body is provided with a plurality of drainage holes.

[0022] Preferably, the flipping device further includes a housing with a loading port.

[0023] Preferably, the flipping device further includes an exhaust device disposed on the rear wall of the housing. The exhaust device includes a first exhaust plate, a second exhaust plate, a liquid collection chamber, and an exhaust port arranged sequentially along the airflow direction. The first exhaust plate has a plurality of first vent holes, and the second exhaust plate has a plurality of second vent holes. A gap is reserved between the first exhaust plate and the second exhaust plate. The first vent holes and the second vent holes are staggered. The exhaust port is used to connect to a fan.

[0024] Preferably, in the flipping device, both the second vent and the exhaust port are arranged obliquely upwards.

[0025] Preferably, in the flipping device, the first exhaust plate is inclined relative to the second exhaust plate.

[0026] Preferably, in the flipping device, a drain port is provided at the bottom of the liquid collection chamber.

[0027] Preferably, the flipping device further includes a lifting mechanism, which includes a lifting rod and a support fixed to the lifting rod. The support is driven up and down by the lifting rod to assist the wafer in being transferred from the transfer robot to the support body.

[0028] Preferably, the flipping device also includes a plurality of nozzles disposed around the support body for spraying liquid onto the wafer held within the support body.

[0029] As described above, the flipping device proposed in this invention has the following beneficial effects:

[0030] This invention provides a clamping device on the support body used to hold the wafer. When the support body rotates, the clamping device fixes the wafer, which can effectively prevent the wafer from shaking inside the support body when the wafer changes its posture, thus avoiding fragmentation or surface scratches. Attached Figure Description

[0031] Figure 1 and Figure 2 This illustrates the wafer flipping and transfer process within the flipping mechanism described in the background art.

[0032] Figure 3 The diagram shown is a structural diagram of a wafer support in the background art.

[0033] Figure 4 The diagram shown is a structural diagram of the flip-up bracket of the present invention.

[0034] Figure 5 The diagram shown is a structural diagram of the support body of the present invention;

[0035] Figure 6 The diagram shown is a structural diagram of the clamping device of the present invention.

[0036] Figure 7 The diagram shown is a cross-sectional view of the clamping device of the present invention.

[0037] Figure 8 Shown is a cross-sectional view of the flip-up bracket of the present invention;

[0038] Figure 9 Displayed as Figure 8 Enlarged view of a portion of point A in the middle;

[0039] Figure 10 Another cross-sectional view of the flip-up bracket of the present invention is shown;

[0040] Figure 11 Displayed as Figure 10 Enlarged view of a section at point B in the middle;

[0041] Figure 12 The diagram shows the change of the flip-up bracket of the present invention from a vertical posture to a horizontal posture.

[0042] Figure 13 The diagram shown is a structural diagram of the flipping device of the present invention.

[0043] Figure 14 The diagram shown illustrates the structure of the wafer transfer to the flipping device of the present invention.

[0044] Figure 15 Displayed as Figure 14 Cross-sectional view of the inverting device;

[0045] Figures 16 to 18 This illustrates the process of transferring a wafer to a flip-over support according to the present invention.

[0046] Figure 19 The diagram shown is a cross-sectional view of the wafer flipping device of the present invention when the wafer is in a tilted position.

[0047] Figure 20 The diagram shown is a cross-sectional view of the wafer flipping device of the present invention when the wafer is in a horizontal orientation.

[0048] Figure 21 The diagram shown is a cross-sectional view of the flipping device for horizontal wafer removal by the robotic arm according to the present invention.

[0049] Figure 22 The diagram shown is a structural diagram of the housing of the flipping device of the present invention.

[0050] Figure 23The diagram shown is a cross-sectional view of the housing of the flipping device of the present invention.

[0051] Figure 24 The diagram shown is an exploded view of the housing of the flipping device of the present invention. Detailed Implementation

[0052] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0053] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. The illustrations only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the shape, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0054] See Figure 4 The overall structure of the flip-over bracket 200 of the present invention is shown. The flip-over bracket 200 mainly consists of two parts: a bracket body 210 and a clamping device 220. The clamping device 220 is fixed to the bracket body 210 by fasteners and is used to clamp or release the wafer 201 held in the bracket body 210.

[0055] See Figure 5 The support body 210 has a first sidewall 211 and a second sidewall 212. Multiple partition plates 213 are formed on the opposing inner surfaces of the first sidewall 211 and the second sidewall 212. A wafer slot 215 is formed between adjacent partition plates 213. The width of the wafer slot 215 is greater than the thickness of the wafer 201, facilitating the placement and removal of the wafer 201. A rotating shaft 217 is formed on the opposite outer surfaces of the first sidewall 211 and the second sidewall 212. At least one rotating shaft 217 is connected to a rotating actuator (not shown). The rotating actuator drives the flipping support 200 to change the placement orientation of the wafer 201 held within the support body 210.

[0056] Each wafer carrier 215 has a hollow bottom. Specifically, the bottom of the carrier has multiple drainage holes 216. For processes that require spraying chemical reagents during wafer flipping, the drainage holes 216 in the wafer carrier 215 help to quickly drain residual liquid from the wafer carrier 215, preventing liquid accumulation in the wafer carrier 215 and the adsorption of particles and other contaminants, which would cause surface contamination of the wafer 201.

[0057] Figure 6 and Figure 7The structure of the clamping device 220 of the present invention is shown. One end of the housing 221 has an air inlet 222, the air inlet of which is connected to an air source. An air outlet 222 is provided with a piston 223, which can slide within the housing 221 under the action of the gas thrust provided by the air source. One end of the telescopic rod 224 is fixedly connected to the piston 223 and can slide within the housing 221 driven by the piston 223. A return spring 225 is disposed between the other end of the telescopic rod 224 and the housing 221. When the air source is cut off, the telescopic rod 224 and the piston 223 are reset under the action of the return spring 225. Multiple limiting grooves 226 are provided on one side of the housing 221, and the multiple limiting grooves 226 are arranged at equal intervals along the length direction of the telescopic rod 224. Corresponding to multiple limiting slots 226, a plurality of limiting rods 227 are provided on one side of the telescopic rod 224. The free ends of the limiting rods 227 pass through their respective limiting slots 226 and extend into the support body 210. The partition plate 213 of the support body 210 has a receiving slot 214 for accommodating the limiting rods 227. The movement of the telescopic rod 224 drives the multiple limiting rods 227 to move within the limiting slots 226, so that the limiting rods 227 press or release the wafer 201.

[0058] Figure 8 and Figure 9 A schematic diagram of the clamping device 220 of the present invention pressing the wafer 201 is shown. When the air source is turned on, the piston 223 pushes the telescopic rod 224 to slide toward the wafer 201. The limiting rod 227 provided on the telescopic rod 224 moves out from the receiving groove 214 and gradually approaches the surface of the wafer 201, pressing multiple wafers 201 simultaneously against the same side of the separator plate 213. This fixes the wafers 201 in the wafer carrier groove 215 and keeps multiple wafers 201 at the same distance, facilitating the subsequent robotic arm wafer picking operation. Figure 10 and Figure 11 A schematic diagram of the clamping device 220 of the present invention releasing the wafer 201 is shown. When the gas supply is cut off, the piston 223 and the telescopic rod 224 slide away from the wafer 201 under the return spring 225, and the limiting rod 227 provided on the telescopic rod 224 gradually detaches from the surface of the wafer 201 and returns to its initial position. When the limiting rod 227 returns to its initial position, the limiting rod 227 is completely received in the receiving groove 214 opened on the partition plate 213. This can prevent the limiting rod 227 from protruding into the wafer slot 215, interfering with the limiting rod 227 when the wafer 201 is placed or removed, and causing scratches or fragments due to collision.

[0059] To detect the accuracy of the movement position of the telescopic rod 224, the clamping device 220 is also equipped with a displacement sensor 228, which is used to measure the displacement of the telescopic rod 224, so as to further ensure the normal operation of the clamping device 220.

[0060] Figure 12This diagram illustrates the rotation of wafer 201 from a vertical to a horizontal orientation in this embodiment. After the flip-up support 200 receives the vertically oriented wafer 201, an air supply is connected before rotation, as shown below. Figure 9 As shown, multiple wafers 201 are simultaneously pressed against the same side of the separator plate 213 by the limiting rod 227. Then, the rotary driver drives the flipping bracket 200 to rotate to a horizontal position, thereby avoiding the swaying and collision of the wafers 201 in the wafer tray 215 during rotation. After the wafers 201 are flipped to a horizontal position, the gas supply is cut off. Figure 11 As shown, after the limit rod 227 resets and releases the wafer 201, the robotic arm takes the wafer 201 out from the flipping bracket 200.

[0061] As an example, the clamping device 220 is also equipped with a drain chamber 230, which has a discharge port 231, mainly used to collect and drain the liquid accumulated inside the housing 221, especially the liquid remaining at the mounting location of the return spring 225. See again Figure 6 and Figure 7 The drain chamber 230 is disposed on the housing 221. An internal through-hole 232 connects the mounting portion of the return spring 225 to the drain chamber 230, allowing liquid that has seeped into the clamping device 220 to be discharged promptly through the drain chamber 230. In some processes, when the wafer 201 is flipped, a chemical solution needs to be sprayed onto its surface to treat it. For example, in the cleaning process, deionized water needs to be sprayed when the wafer 201 is flipped to maintain a water film of a predetermined thickness on its surface, thus reducing particulate contamination. In this embodiment, the limiting groove 226 on the housing 221 of the clamping device 220 and the receiving groove 214 on the support body 210 for the limiting rod 227 form an interconnecting channel between the support body 210 and the clamping device 220. Although the chemical liquid is sprayed onto the wafer 201 held on the support body 210, it is unavoidable that some of the chemical liquid will enter the clamping device 220 through the interconnecting channel. If the liquid seeping into the mounting part of the return spring 225 cannot be discharged, the liquid will accumulate to a certain extent and generate a large water pressure, which will cause the clamping device 220 to fail. After the air source is turned on, the limiting rod 227 cannot press the wafer 201.

[0062] Figure 13A structural diagram of the flipping device 300 of the present invention is shown. The flipping device 300 includes a flipping support 310, the structure of which is the same as that of the flipping support 200, both including a support body 311 and a clamping device 312, which will not be described in detail here. In this embodiment, the flipping device 300 also includes a housing 320, the top opening of which is used to receive a wafer 301, and the front wall of the housing 320 is provided with a loading port 321 for removing the wafer 301. The loading port 321 can be configured with a door plate 322, which is driven by a cylinder 323 to open or close the loading port 321. The flipping support 310 is mounted in the housing 320 via a support arm 302, and the side wall of the housing 320 integrates a rotary driver 313 for driving the flipping support 310 to rotate. The top of the housing 320 is provided with a plurality of nozzles 324 around the flipping support 310, which are used to spray a mist of liquid onto the wafer 301 held in the flipping support 310.

[0063] As an example, the flipping device 300 also includes a lifting mechanism 330 for transferring the wafer 301. See also Figure 14 and Figure 15 The lifting mechanism 330 has a lifting rod 331 and a support base 332 fixed to the lower end of the lifting rod 331. The bottom surface of the support base 332 is provided with a slot 333 for supporting the wafer 301. See again Figure 14 The first robotic arm 303 picks up several wafers 301 from the cleaning tank and moves them above the flipping device 300. At this time, the support body 311 is in a vertical position, and the lifting rod 331 drives the support base 332 to rise. The slots 333 on the support base 332 correspond one-to-one with the wafer slots on the support body 311. Figures 16 to 18 The process of transferring wafer 301 from support 332 to flipping bracket 310 is illustrated. First, the first robot arm 303 places wafer 301 on support 332. After the first robot arm 303 moves away, wafer 301 is gradually placed into the wafer slot of bracket body 311 as support 332 descends. After wafer 301 is located in flipping bracket 310, support 332 continues to move down and separates from wafer 301, completing the transfer of wafer 301 from support 332 to flipping bracket 310.

[0064] After wafer 301 is transferred to the flip-over holder 310, the clamping device 312 presses wafer 301 against the partition plate on one side of the wafer tray. This ensures that wafer 301 is neatly and evenly spaced on the flip-over holder 310, and also secures wafer 301 within the wafer tray, preventing it from wobbling during the subsequent rotation of the flip-over holder 310. Subsequently, the rotation driver 313 drives the flip-over holder 310 to rotate, changing wafer 301 from a vertical to a horizontal orientation. Figure 20As shown, nozzle 324 continuously sprays a mist of liquid during the rotation of the flipping bracket 310 to form a liquid film of predetermined thickness on the surface of wafer 301, protecting the surface of wafer 301 from contamination. After wafer 301 rotates to a horizontal position, clamping device 312 releases the wafer, loading port 321 opens, and second robotic arm 305 extends horizontally into housing 320 to remove the horizontally positioned wafer 301. Figure 21 As shown. Before rotating wafer 301 to a horizontal position, wafer 301 will pause slightly at an angle, as... Figure 19 As shown, the thickness of the liquid film formed on the surface of wafer 301 is adjusted by adjusting the tilt angle, and the front side of wafer 301 is fully wetted.

[0065] See you again Figure 13 The enclosure 320 is also equipped with an exhaust device 340 to maintain the cleanliness and humidity of the process atmosphere. All exhaust devices 340 must be connected to the plant's exhaust system, and it is generally necessary to prevent liquid from being drawn into the exhaust system, otherwise it will cause corrosion and damage to the exhaust ducts or fans. Because the nozzles 324 in the tilting device 300 continuously spray atomized liquid, the process gas in and around the enclosure 320 has high humidity and high liquid content. Therefore, in this embodiment, the exhaust device 340 installed on the enclosure 320 has a gas-liquid separation function to prevent excess liquid from being drawn into the exhaust system.

[0066] Figure 22 A structural diagram of the housing 320 of the present invention is shown. An exhaust device 340 is installed on the rear wall of the housing 320. See also... Figure 23 and 24The exhaust device 340 is provided with a first exhaust plate 341, a second exhaust plate 342, a liquid collection chamber 343, and an exhaust port 344 in sequence along the airflow direction. The exhaust port 344 is used to connect to the fan of the plant's exhaust system. In this embodiment, the second exhaust plate 342 and the rear wall of the housing 320 are integrally formed. It can be understood that in other embodiments, the second exhaust plate 342 can be an independent component. The first exhaust plate 341 has multiple first vent holes 341a, and the second exhaust plate 342 has multiple second vent holes 342a. There is a gap between the first exhaust plate 341 and the second exhaust plate 342. Specifically, the first exhaust plate 341 is inclined relative to the second exhaust plate 342, and the first vent holes 341a and the second vent holes 342a are staggered, that is, the first vent holes 341a and the second vent holes 342a do not overlap. The airflow flowing out of the first vent hole 341a will not flow directly through the second vent hole 342a, but will first flow to the non-porous area of ​​the second exhaust plate 342. The collision between the airflow and the non-porous area will reduce the air velocity and cause some of the liquid entrained in the airflow to flow away along the second exhaust plate 342 and separate from the gas. Then the airflow flows into the second vent hole 342a. Therefore, the staggered arrangement of the first vent 341a and the second vent 342a not only reduces the airflow speed and changes the airflow path, preventing the airflow carrying a large amount of liquid from being directly drawn into the plant's exhaust system and corroding or damaging the fan or exhaust pipe, but also prolongs the time for the airflow to pass through the exhaust device 340, thereby prolonging the gas-liquid separation time and reducing the liquid content entering the exhaust system.

[0067] As an example, both the second vent 342a and the exhaust port 344 are angled upwards to further promote gas-liquid separation and reduce the amount of liquid entering the exhaust system. In addition, drain ports (345a, 345b) are respectively provided at the bottom of the housing 320 and the liquid collection chamber 343 for draining the collected liquid.

[0068] The flipping device provided by the present invention is provided with a flipping bracket, which includes a bracket body and a clamping device. By providing a clamping device on the bracket body that holds the wafer, the wafer is fixed by the clamping device when the flipping bracket rotates, which can effectively prevent the wafer from shaking inside the flipping bracket when the wafer changes its posture, resulting in fragments or surface scratches.

[0069] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A flipping device, characterized in that, include: The support body has multiple partition plates formed on the inner surfaces of its two side walls, and wafer slots for placing wafers are formed between adjacent partition plates. The outer surfaces of the two side walls of the support body have rotation shafts. A rotary driver, the rotary driver being connected to at least one rotating shaft to drive the support body to rotate; and A clamping device is disposed on the side wall of the support body and is used to clamp or release the wafer placed in the wafer tray; The clamping device includes: The housing is fixed to the side wall of the support body; The piston is slidably disposed within the housing and is driven by an air source; The telescopic rod is slidably installed inside the housing, with one end fixedly connected to the piston. A return spring is located at the other end of the housing and connected to the other end of the telescopic rod, used to reset the piston and telescopic rod. Multiple limiting grooves are provided on one side of the housing and arranged along the length of the telescopic rod; Multiple limiting rods, one end of which is fixed to a telescopic rod, and the other end passes through their respective limiting grooves. The limiting rods slide within the limiting grooves driven by the telescopic rods, pressing or releasing the wafers placed in the wafer carrier grooves.

2. The flipping device according to claim 1, characterized in that, The clamping device also includes an air inlet located at one end of the housing for connecting to an air source; The plurality of limiting grooves are arranged at equal intervals along the length of the telescopic rod.

3. The flipping device according to claim 2, characterized in that, The clamping device also includes a drain chamber for collecting and draining liquid accumulated inside the housing.

4. The flipping device according to claim 2, characterized in that, The clamping device is also equipped with a displacement sensor for measuring the displacement of the telescopic rod.

5. The flipping device according to claim 2, characterized in that, The partition plate of the bracket body has a receiving groove for accommodating the limiting rod.

6. The flipping device according to claim 1, characterized in that, The bottom of the slide groove of the support body is provided with multiple drainage holes.

7. The flipping device according to claim 1, characterized in that, Further includes: The container is equipped with a loading port.

8. The flipping device according to claim 7, characterized in that, The device further includes an exhaust system located on the rear wall of the housing. The exhaust system includes a first exhaust plate, a second exhaust plate, a liquid collection chamber, and an exhaust port arranged sequentially along the airflow direction. The first exhaust plate has multiple first vent holes, and the second exhaust plate has multiple second vent holes. A gap is reserved between the first exhaust plate and the second exhaust plate. The first vent holes and the second vent holes are staggered. The exhaust port is used to connect to a fan.

9. The flipping device according to claim 8, characterized in that, The second vent and exhaust port are both angled upwards.

10. The flipping device according to claim 8, characterized in that, The first exhaust panel is inclined relative to the second exhaust panel.

11. The flipping device according to claim 8, characterized in that, The bottom of the liquid collection chamber has a drain port.

12. The flipping device according to claim 1, characterized in that, The system further includes a lifting mechanism, which comprises a lifting rod and a support base fixed to the lifting rod. The support base is driven to move up and down by the lifting rod to assist the wafer in being transferred from the transfer robot to the support body.

13. The flipping device according to claim 1, characterized in that, It further includes multiple nozzles arranged around the support body for spraying liquid onto the wafer held within the support body.

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