A CSP component packaging process based on solder paste welding

Abstract

The present invention belongs to the field of CSP packaging technology, and in particular relates to a CSP component packaging process based on solder paste welding. The process comprises a circuit board body, a chip body and a packaging body. The chip body has two groups of symmetrically distributed pins. The top surface of the circuit board body is coated with a solder paste layer. The process also comprises a heat-insulating sheet, an insulating sheet and thermally conductive cotton. The pins are fixed to the top surface of the circuit board body by soldering the solder paste layer. The insulating sheet is adhesively fixed to the top surface of the circuit board body and surrounds the chip body. The CSP component packaging process based on solder paste welding of the present invention is simple and low in cost. The heat-insulating sheet with heat dissipation grooves can prevent heat generated by the circuit board body from being transferred to the chip body, thereby ensuring the safety of the chip body during processing and use and extending the service life of the CSP product. In addition, the product of the present invention has a rubber sealing ring installed by glue, which improves the sealing performance and waterproof capability.

Description

Technical Field

[0001] The invention belongs to the technical field of CSP packaging, and in particular relates to a CSP component packaging process based on solder paste welding. Background Art

[0002] CSP (Chip Scale Package) packaging stands for chip-scale packaging. CSP packaging is the latest generation of memory chip packaging technology, and its technical performance has been further improved. CSP packaging can allow the chip area to package area ratio to exceed 1:1.14, which is very close to the ideal 1:1 situation. The absolute size is only 32 square millimeters, which is about 1 / 3 of the ordinary BGA packaging and only 1 / 6 of the area of ​​TSOP memory chips. Compared with BGA packaging, CSP packaging can triple the storage capacity in the same space.

[0003] Chip is a general term for semiconductor component products, also called integrated circuits, or microcircuits, microchips, wafers / chips. In electronics, it is a way to miniaturize circuits (mainly including semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of semiconductor wafers. Chips are the core components of electronic products such as computers, and there are many CSP component products in computer circuit systems.

[0004] In the packaging of CSP component products, the corresponding chip is usually made into a CSP product and then mounted on the circuit board via SMT.

[0005] Solder paste, also known as tin paste, is a gray paste. A new type of welding material, born with the advent of SMT, it is a paste-like mixture of solder powder, flux, and other surfactants and thixotropic agents. It is primarily used in the SMT industry for soldering electronic components such as resistors, capacitors, and ICs on printed circuit boards (PCBs).

[0006] Currently, Chinese invention patent application number 202210914630.4 discloses a "small-size chip CSP packaging structure and CSP packaging method," wherein the structure includes an insulating layer, a conductive layer, a chip, and a package body. The insulating layer has two windows extending through the first insulating layer; the conductive layer is disposed on the insulating layer and includes two solder pads, one of which is disposed at a corresponding position of each window; the chip is disposed on the two solder pads; and the package body is disposed on the insulating layer and covers the chip and the conductive layer. The present invention forms a double-sided solderable pad module by providing two windows extending through the insulating layer to expose the lower surfaces of the two solder pads disposed on the insulating layer. This increases the solder pad size of small-size LED chips to ensure the verticality and SMT robustness of the CSP package. It also offers greater cost and thickness advantages, making it suitable for widespread promotion and application.

[0007] However, after traditional CSP products are packaged, the heat from the circuit board will be directly transferred to the CSP electronic component products during operation, which will have a very adverse impact on the reliability of the CSP electronic component products. Summary of the Invention

[0008] In order to solve the above problems existing in the prior art, the present invention provides a CSP component packaging process based on solder paste welding, which has the characteristics of simple process, high safety in use and long service life.

[0009] To achieve the above objectives, the present invention provides the following technical solutions: a CSP component packaging process based on solder paste welding, comprising a circuit board body, a chip body and a package body, wherein the chip body has two groups of symmetrically distributed pins, the top surface of the circuit board body is coated with a solder paste layer, and further comprising a thermal insulation sheet, an insulating sheet and thermally conductive cotton, the pins being fixed to the top surface of the circuit board body by soldering with the solder paste layer, the insulating sheet being adhesively fixed to the top surface of the circuit board body and surrounding the chip body, the thermal insulation sheet being distributed between the bottom surface of the chip body and the top surface of the circuit board body, and the bottom surface of the thermal insulation sheet having a plurality of heat dissipation grooves evenly spaced along its length, the thermally conductive cotton being adhesively fixed to the inner top surface of the package body, and the package body being mounted on the insulating sheet; the CSP component packaging process based on solder paste welding specifically comprises the following steps:

[0010] Step 1: Prepare the circuit board body, chip body, package body, thermal insulation sheet, insulating sheet and thermal conductive cotton;

[0011] Step 2: Applying a layer of solder paste on the top surface of the circuit board body;

[0012] Step 3: Paste and fix the thermal insulation sheet on the bottom surface of the chip body, and then adhere the thermal insulation sheet to the solder paste layer;

[0013] Step 4: placing the circuit board body on a dedicated loading tool and transporting it to a reflow oven to solder the pins of the chip body to the solder paste layer;

[0014] Step 5: Adhere and fix an insulating sheet on the top surface of the circuit board body, and make the insulating sheet surround the chip body;

[0015] Step six: performing CSP packaging on the chip body using a packaging body on the top surface of the insulating sheet.

[0016] As a preferred technical solution of the present invention, the distance between the top surface of the package body and the top surface of the chip body is equal to the thickness of the thermal conductive cotton.

[0017] As a preferred technical solution of the present invention, the length and width of the insulating sheet are equal to the length and width of the packaging body.

[0018] As a preferred technical solution of the present invention, the thickness of the thermal insulation sheet is 0.2 mm-0.6 mm, and the depth of the heat dissipation groove is 0.1 mm-0.3 mm.

[0019] As a preferred technical solution of the present invention, the thermal insulation sheet is made of polyimide material.

[0020] As a preferred technical solution of the present invention, it also includes a sealing cover plate, a support ring, a rubber sealing ring, a No. 1 sealing glue layer and a No. 2 sealing glue layer. The support ring is located in the chip body and is an integrated structure with the chip body. The rubber sealing ring is bonded and fixed to the top surface of the support ring using the No. 1 sealing glue layer, and the sealing cover plate is bonded and fixed to the top surface of the rubber sealing ring using the No. 2 sealing glue layer.

[0021] As a preferred technical solution of the present invention, the distance between the top surface of the rubber sealing ring and the top surface of the chip body is equal to the sum of the thicknesses of the sealing cover plate and the second sealing adhesive layer.

[0022] Compared with the prior art, the present invention has the following advantages: a CSP component packaging process based on solder paste soldering is simple and low-cost. The heat-insulating sheet with heat dissipation grooves prevents heat generated by the circuit board body from being transferred to the chip body, thereby ensuring the safety of the chip body during processing and use and extending the service life of the CSP product. In addition, the product of the present invention has a glued-on rubber sealing ring, which improves the sealing performance and waterproof capability. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0024] Figure 1 It is a structural schematic diagram of the present invention;

[0025] Figure 2 This is a schematic diagram of the axonometric structure of the chip body in the present invention;

[0026] Figure 3 For the present invention Figure 1 A in the figure shows the enlarged structural diagram;

[0027] Figure 4 It is a schematic diagram of the process flow of the present invention;

[0028] In the figure: 10, circuit board body; 101, solder paste layer; 11, chip body; 111, pins; 112, sealing cover; 113, support ring; 114, rubber sealing ring; 115, No. 1 sealing glue layer; 116, No. 2 sealing glue layer; 12, package body; 13, thermal insulation sheet; 131, heat sink; 14, insulation sheet; 15, thermal conductive cotton. DETAILED DESCRIPTION

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0030] Example 1

[0031] See also Figures 1-4The present invention provides the following technical solutions: a CSP component packaging process based on solder paste welding, comprising a circuit board body 10, a chip body 11 and a package body 12, wherein the chip body 11 has two groups of symmetrically distributed pins 111, and the top surface of the circuit board body 10 is coated with a solder paste layer 101. The process also comprises a thermal insulation sheet 13, an insulating sheet 14 and thermal conductive cotton 15, wherein the pins 111 are fixed to the top surface of the circuit board body 10 by soldering with the solder paste layer 101, and the insulating sheet 14 is bonded and fixed to the top surface of the circuit board body 10 and surrounds the chip body 11, the thermal insulation sheet 13 is distributed between the bottom surface of the chip body 11 and the top surface of the circuit board body 10, and the bottom surface of the thermal insulation sheet 13 has a plurality of heat dissipation grooves 131 distributed at equal intervals along its length direction, the thermal conductive cotton 15 is bonded and fixed to the inner top surface of the package body 12, and the package body 12 is mounted on the insulating sheet 14; a CSP component packaging process based on solder paste welding specifically comprises the following steps:

[0032] Step 1: Prepare the circuit board body 10, chip body 11, package body 12, thermal insulation sheet 13, insulating sheet 14 and thermal conductive cotton 15;

[0033] Step 2: Apply a layer of solder paste 101 on the top surface of the circuit board body 10;

[0034] Step 3: Paste and fix the thermal insulation sheet 13 on the bottom surface of the chip body 11, and then attach the thermal insulation sheet 13 to the solder paste layer 101;

[0035] Step 4: Place the circuit board body 10 on a dedicated loading tool and transport it to a reflow oven to solder the pins 111 of the chip body 11 to the solder paste layer 101;

[0036] Step 5: Adhere and fix the insulating sheet 14 on the top surface of the circuit board body 10, and make the insulating sheet 14 surround the chip body 11;

[0037] Step 6: CSP packaging is performed on the chip body 11 using the packaging body 12 on the top surface of the insulating sheet 14 .

[0038] By the attached Figure 1 As shown, as an optional embodiment, in this embodiment, the distance between the top surface of the package body 12 and the top surface of the chip body 11 is equal to the thickness of the thermal conductive cotton 15, so that after the package body 12 is packaged, the bottom surface of the thermal conductive cotton 15 is against the top surface of the chip body 11, which is conducive to dissipating the heat generated by the chip body 11 and ensuring the safety of the CSP product during processing and operation.

[0039] By the attached Figure 1As shown, as an optional embodiment, in this embodiment, the length and width of the insulating sheet 14 are equal to the length and width of the package body 12. The insulating sheet 14 is used to encapsulate the package body 12 and the circuit board body 10, ensuring the safety of the CSP product.

[0040] By the attached Figure 1 and attached Figure 3 As shown, as an optional embodiment, in this embodiment, the thickness of the thermal insulation sheet 13 is 0.2 mm, and the groove depth of the heat dissipation groove 131 is 0.1 mm, wherein the thermal insulation sheet 13 is a polyimide material. The setting of the thermal insulation sheet 13 can prevent the heat generated by the circuit board body 10 from being conducted to the chip body 11, thereby ensuring the safety of the chip body 11 during processing and use, and extending the service life of the CSP product. In the later stage, the CSP product can be directly mounted using the SMT process.

[0041] By the attached Figure 1 and attached Figure 2 As shown, as an optional embodiment, this embodiment further includes a sealing cover plate 112, a support ring 113, a rubber sealing ring 114, a first sealing adhesive layer 115, and a second sealing adhesive layer 116. The support ring 113 is located in the chip body 11 and is an integrated structure with the chip body 11. The rubber sealing ring 114 is bonded and fixed to the top surface of the support ring 113 by the first sealing adhesive layer 115. The sealing cover plate 112 is bonded and fixed to the top surface of the rubber sealing ring 114 by the second sealing adhesive layer 116. The cooperation of the rubber sealing ring 114, the first sealing adhesive layer 115, and the second sealing adhesive layer 116 improves the sealing performance and waterproof capability of the CSP product. The specific steps are as follows:

[0042] Step 1: Use a dispensing machine to evenly apply a first sealant layer 115 on the top surface of the support ring 113, and use the first sealant layer 115 to glue and fix the rubber sealing ring 114 to the top surface of the support ring 113;

[0043] Step 2: Use a dispensing machine to evenly apply a second sealant layer 116 on the top surface of the rubber sealing ring 114 , and adhere the sealing cover 112 to the top surface of the rubber sealing ring 114 using the second sealant layer 116 .

[0044] By the attached Figure 1 and attached Figure 2 As shown, as an optional embodiment, in this embodiment, the distance between the top surface of the rubber sealing ring 114 and the top surface of the chip body 11 is equal to the sum of the thicknesses of the sealing cover plate 112 and the second sealing glue layer 116, so that after the sealing cover plate 112 is glued, the top surface of the sealing cover plate 112 is flush with the top surface of the chip body 11.

[0045] Example 2

[0046] See also Figures 1-4 The present invention provides the following technical solutions: a CSP component packaging process based on solder paste welding, comprising a circuit board body 10, a chip body 11 and a package body 12, wherein the chip body 11 has two groups of symmetrically distributed pins 111, and the top surface of the circuit board body 10 is coated with a solder paste layer 101. The process also comprises a thermal insulation sheet 13, an insulating sheet 14 and thermal conductive cotton 15, wherein the pins 111 are fixed to the top surface of the circuit board body 10 by soldering with the solder paste layer 101, and the insulating sheet 14 is bonded and fixed to the top surface of the circuit board body 10 and surrounds the chip body 11, the thermal insulation sheet 13 is distributed between the bottom surface of the chip body 11 and the top surface of the circuit board body 10, and the bottom surface of the thermal insulation sheet 13 has a plurality of heat dissipation grooves 131 distributed at equal intervals along its length direction, the thermal conductive cotton 15 is bonded and fixed to the inner top surface of the package body 12, and the package body 12 is mounted on the insulating sheet 14; a CSP component packaging process based on solder paste welding specifically comprises the following steps:

[0047] Step 1: Prepare the circuit board body 10, chip body 11, package body 12, thermal insulation sheet 13, insulating sheet 14 and thermal conductive cotton 15;

[0048] Step 2: Apply a layer of solder paste 101 on the top surface of the circuit board body 10;

[0049] Step 3: Paste and fix the thermal insulation sheet 13 on the bottom surface of the chip body 11, and then attach the thermal insulation sheet 13 to the solder paste layer 101;

[0050] Step 4: Place the circuit board body 10 on a dedicated loading tool and transport it to a reflow oven to solder the pins 111 of the chip body 11 to the solder paste layer 101;

[0051] Step 5: Adhere and fix the insulating sheet 14 on the top surface of the circuit board body 10, and make the insulating sheet 14 surround the chip body 11;

[0052] Step 6: CSP packaging is performed on the chip body 11 using the packaging body 12 on the top surface of the insulating sheet 14 .

[0053] By the attached Figure 1 As shown, as an optional embodiment, in this embodiment, the distance between the top surface of the package body 12 and the top surface of the chip body 11 is equal to the thickness of the thermal conductive cotton 15, so that after the package body 12 is packaged, the bottom surface of the thermal conductive cotton 15 is against the top surface of the chip body 11, which is conducive to dissipating the heat generated by the chip body 11 and ensuring the safety of the CSP product during processing and operation.

[0054] By the attached Figure 1As shown, as an optional embodiment, in this embodiment, the length and width of the insulating sheet 14 are equal to the length and width of the package body 12. The insulating sheet 14 is used to encapsulate the package body 12 and the circuit board body 10, ensuring the safety of the CSP product.

[0055] By the attached Figure 1 and attached Figure 3 As shown, as an optional embodiment, in this embodiment, the thickness of the thermal insulation sheet 13 is 0.4 mm, and the groove depth of the heat dissipation groove 131 is 0.2 mm, wherein the thermal insulation sheet 13 is made of polyimide material. The setting of the thermal insulation sheet 13 can prevent the heat generated by the circuit board body 10 from being conducted to the chip body 11, thereby ensuring the safety of the chip body 11 during processing and use, and extending the service life of the CSP product. In the later stage, the CSP product can be directly mounted using the SMT process.

[0056] By the attached Figure 1 and attached Figure 2 As shown, as an optional embodiment, this embodiment further includes a sealing cover plate 112, a support ring 113, a rubber sealing ring 114, a first sealing adhesive layer 115, and a second sealing adhesive layer 116. The support ring 113 is located in the chip body 11 and is an integrated structure with the chip body 11. The rubber sealing ring 114 is bonded and fixed to the top surface of the support ring 113 by the first sealing adhesive layer 115. The sealing cover plate 112 is bonded and fixed to the top surface of the rubber sealing ring 114 by the second sealing adhesive layer 116. The cooperation of the rubber sealing ring 114, the first sealing adhesive layer 115, and the second sealing adhesive layer 116 improves the sealing performance and waterproof capability of the CSP product. The specific steps are as follows:

[0057] Step 1: Use a dispensing machine to evenly apply a first sealant layer 115 on the top surface of the support ring 113, and use the first sealant layer 115 to glue and fix the rubber sealing ring 114 to the top surface of the support ring 113;

[0058] Step 2: Use a dispensing machine to evenly apply a second sealant layer 116 on the top surface of the rubber sealing ring 114 , and adhere the sealing cover 112 to the top surface of the rubber sealing ring 114 using the second sealant layer 116 .

[0059] By the attached Figure 1 and attached Figure 2 As shown, as an optional embodiment, in this embodiment, the distance between the top surface of the rubber sealing ring 114 and the top surface of the chip body 11 is equal to the sum of the thicknesses of the sealing cover plate 112 and the second sealing glue layer 116, so that after the sealing cover plate 112 is glued, the top surface of the sealing cover plate 112 is flush with the top surface of the chip body 11.

[0060] Example 3

[0061] See also Figures 1-4 The present invention provides the following technical solutions: a CSP component packaging process based on solder paste welding, comprising a circuit board body 10, a chip body 11 and a package body 12, wherein the chip body 11 has two groups of symmetrically distributed pins 111, and the top surface of the circuit board body 10 is coated with a solder paste layer 101. The process also comprises a thermal insulation sheet 13, an insulating sheet 14 and thermal conductive cotton 15, wherein the pins 111 are fixed to the top surface of the circuit board body 10 by soldering with the solder paste layer 101, and the insulating sheet 14 is bonded and fixed to the top surface of the circuit board body 10 and surrounds the chip body 11, the thermal insulation sheet 13 is distributed between the bottom surface of the chip body 11 and the top surface of the circuit board body 10, and the bottom surface of the thermal insulation sheet 13 has a plurality of heat dissipation grooves 131 distributed at equal intervals along its length direction, the thermal conductive cotton 15 is bonded and fixed to the inner top surface of the package body 12, and the package body 12 is mounted on the insulating sheet 14; a CSP component packaging process based on solder paste welding specifically comprises the following steps:

[0062] Step 1: Prepare the circuit board body 10, chip body 11, package body 12, thermal insulation sheet 13, insulating sheet 14 and thermal conductive cotton 15;

[0063] Step 2: Apply a layer of solder paste 101 on the top surface of the circuit board body 10;

[0064] Step 3: Paste and fix the thermal insulation sheet 13 on the bottom surface of the chip body 11, and then attach the thermal insulation sheet 13 to the solder paste layer 101;

[0065] Step 4: Place the circuit board body 10 on a dedicated loading tool and transport it to a reflow oven to solder the pins 111 of the chip body 11 to the solder paste layer 101;

[0066] Step 5: Adhere and fix the insulating sheet 14 on the top surface of the circuit board body 10, and make the insulating sheet 14 surround the chip body 11;

[0067] Step 6: CSP packaging is performed on the chip body 11 using the packaging body 12 on the top surface of the insulating sheet 14 .

[0068] By the attached Figure 1 As shown, as an optional embodiment, in this embodiment, the distance between the top surface of the package body 12 and the top surface of the chip body 11 is equal to the thickness of the thermal conductive cotton 15, so that after the package body 12 is packaged, the bottom surface of the thermal conductive cotton 15 is against the top surface of the chip body 11, which is conducive to dissipating the heat generated by the chip body 11 and ensuring the safety of the CSP product during processing and operation.

[0069] By the attached Figure 1As shown, as an optional embodiment, in this embodiment, the length and width of the insulating sheet 14 are equal to the length and width of the package body 12. The insulating sheet 14 is used to encapsulate the package body 12 and the circuit board body 10, ensuring the safety of the CSP product.

[0070] By the attached Figure 1 and attached Figure 3 As shown, as an optional embodiment, in this embodiment, the thickness of the thermal insulation sheet 13 is 0.6 mm, and the groove depth of the heat dissipation groove 131 is 0.3 mm, wherein the thermal insulation sheet 13 is a polyimide material. The setting of the thermal insulation sheet 13 can prevent the heat generated by the circuit board body 10 from being conducted to the chip body 11, thereby ensuring the safety of the chip body 11 during processing and use, and extending the service life of the CSP product. In the later stage, the CSP product can be directly mounted using the SMT process.

[0071] By the attached Figure 1 and attached Figure 2 As shown, as an optional embodiment, this embodiment further includes a sealing cover plate 112, a support ring 113, a rubber sealing ring 114, a first sealing adhesive layer 115, and a second sealing adhesive layer 116. The support ring 113 is located in the chip body 11 and is an integrated structure with the chip body 11. The rubber sealing ring 114 is bonded and fixed to the top surface of the support ring 113 by the first sealing adhesive layer 115. The sealing cover plate 112 is bonded and fixed to the top surface of the rubber sealing ring 114 by the second sealing adhesive layer 116. The cooperation of the rubber sealing ring 114, the first sealing adhesive layer 115, and the second sealing adhesive layer 116 improves the sealing performance and waterproof capability of the CSP product. The specific steps are as follows:

[0072] Step 1: Use a dispensing machine to evenly apply a first sealant layer 115 on the top surface of the support ring 113, and use the first sealant layer 115 to glue and fix the rubber sealing ring 114 to the top surface of the support ring 113;

[0073] Step 2: Use a dispensing machine to evenly apply a second sealant layer 116 on the top surface of the rubber sealing ring 114 , and adhere the sealing cover 112 to the top surface of the rubber sealing ring 114 using the second sealant layer 116 .

[0074] By the attached Figure 1 and attached Figure 2 As shown, as an optional embodiment, in this embodiment, the distance between the top surface of the rubber sealing ring 114 and the top surface of the chip body 11 is equal to the sum of the thicknesses of the sealing cover plate 112 and the second sealing glue layer 116, so that after the sealing cover plate 112 is glued, the top surface of the sealing cover plate 112 is flush with the top surface of the chip body 11.

[0075] In all examples shown and described herein, any specific values ​​should be interpreted as merely exemplary and not limiting, and thus other examples of the exemplary embodiments may have different values.

[0076] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0077] In addition, in the description of the embodiments of the present invention, unless otherwise clearly stipulated and limited, the terms "installed", "connected", "connected", "set", "provided with", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be a connection between the internal parts of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0078] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or substitute equivalents for some of the technical features. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A CSP component packaging process based on solder paste welding, comprising a circuit board body (10), a chip body (11) and a packaging body (12), wherein the chip body (11) has two groups of symmetrically distributed pins (111), characterized in that: The top surface of the circuit board body (10) is coated with a solder paste layer (101), and further comprises a heat-insulating sheet (13), an insulating sheet (14) and a heat-conducting cotton (15); the pin (111) is fixed to the top surface of the circuit board body (10) by soldering with the solder paste layer (101); the insulating sheet (14) is bonded and fixed to the top surface of the circuit board body (10) and surrounds the chip body (11); the heat-insulating sheet (13) is distributed between the bottom surface of the chip body (11) and the top surface of the circuit board body (10); and the bottom surface of the heat-insulating sheet (13) has a plurality of heat-dissipating grooves (131) distributed at equal intervals along its length direction; the heat-conducting cotton (15) is bonded and fixed to the inner top surface of the package body (12), and the package body (12) is mounted on the insulating sheet (14); the CSP component packaging process based on solder paste soldering specifically comprises the following steps: Step 1: Prepare the circuit board body (10), the chip body (11), the package body (12), the thermal insulation sheet (13), the insulating sheet (14) and the thermal conductive cotton (15); Step 2: coating a layer of solder paste (101) on the top surface of the circuit board body (10); Step 3: Paste and fix the heat-insulating sheet (13) on the bottom surface of the chip body (11), and then attach the heat-insulating sheet (13) to the solder paste layer (101); Step 4: placing the circuit board body (10) on a dedicated loading tool and transporting it to a reflow oven, so that the pins (111) of the chip body (11) are soldered to the solder paste layer (101); Step 5: Adhere and fix an insulating sheet (14) on the top surface of the circuit board body (10), and make the insulating sheet (14) surround the chip body (11); Step six: CSP packaging of the chip body (11) is performed on the top surface of the insulating sheet (14) using a packaging body (12).

2. The CSP component packaging process based on solder paste welding according to claim 1, characterized in that: The distance between the inner top surface of the package body (12) and the top surface of the chip body (11) is equal to the thickness of the thermal conductive cotton (15).

3. The CSP component packaging process based on solder paste welding according to claim 1, characterized in that: The length and width of the insulating sheet (14) are equal to the length and width of the packaging body (12).

4. The CSP component packaging process based on solder paste welding according to claim 1, characterized in that: The thickness of the heat-insulating sheet (13) is 0.2 mm to 0.6 mm, and the depth of the heat dissipation groove (131) is 0.1 mm to 0.3 mm.

5. The CSP component packaging process based on solder paste welding according to claim 1, characterized in that: The heat insulation sheet (13) is made of polyimide material.

6. The CSP component packaging process based on solder paste welding according to claim 1, characterized in that: The chip body (11) further comprises a sealing cover plate (112), a support ring (113), a rubber sealing ring (114), a first sealing adhesive layer (115) and a second sealing adhesive layer (116); the support ring (113) is located in the chip body (11) and is an integrated structure with the chip body (11); the rubber sealing ring (114) is fixed to the top surface of the support ring (113) by means of the first sealing adhesive layer (115); and the sealing cover plate (112) is fixed to the top surface of the rubber sealing ring (114) by means of the second sealing adhesive layer (116).

7. The CSP component packaging process based on solder paste welding according to claim 6, characterized in that: The distance between the top surface of the rubber sealing ring (114) and the top surface of the chip body (11) is equal to the sum of the thicknesses of the sealing cover plate (112) and the second sealing glue layer (116).

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